JP2002016040A - Substrate processing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To protect an ultraviolet irradiation window member from reaction products of ultraviolet-rays, in a simple way at low cost in a substrate processing apparatus for processing a substrate in an ultraviolet-ray process. SOLUTION: A stage 76 has a size larger than that of a substrate (G). A heating wire 86, extending in a horizontal direction crossing to the stage reciprocating direction (Y-direction) for heating the ultraviolet-ray irradiation window 62 in a scanning way from the stage 76, is provided at a right end part 76b of an upper stage face located in the front and adjacent to a prescribed central region for mounting the substrate (G) (substrate-mounting region) in the stage- reciprocating direction (Y direction). During the Y-directional movement of the stage, ultraviolet rays from a lamp chamber 66 cans from one end to the other end of the substrate (G), and organic material can be decomposed over the entire surface of the substrate. At the same time, the heat wire 86 on the side of the stage 76 scans from one end to the other end of the ultraviolet-ay irradiation window 62 of the lamp chamber 66 in the Y-direction, and heats at temperatures above a prescribed temperature of (110 deg.C), so that the reaction products of ultraviolet rays or deposition is removed or prevented from the entire window surface of the ultraviolet ray irradiation window 62.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a substrate processing apparatus for performing predetermined processing by irradiating a substrate to be processed with ultraviolet rays.

[0002]

2. Description of the Related Art In the manufacture of LCDs (liquid crystal displays) and semiconductor devices, the surface of a substrate to be processed (LCD substrate, semiconductor wafer, etc.) is removed at a predetermined wavelength (172
In the ultraviolet irradiation apparatus that irradiates ultraviolet rays (excimer light) of ultraviolet (nm), there is a problem that a reaction product due to ultraviolet rays adheres to the outer surface (surface on the substrate side) of the quartz glass constituting the ultraviolet irradiation window. In other words, organic substances and chemicals that adhere or float on or near the surface of the substrate to be processed react with the light energy of ultraviolet rays, and the reaction product adheres to the quartz glass that is in close proximity to the substrate, resulting in a white color. It may become a precipitate, thereby deteriorating the ultraviolet transmission properties of the quartz glass, or peeling off a reaction product or a precipitate from the quartz glass, which may cause particles.

Conventionally, as an effective technique for solving the above problem, a technique of heating quartz glass of an ultraviolet irradiation window to 100 ° C. or more has been known. 1 quartz glass
When heated to more than 00 ° C., the ultraviolet reaction products attached to or floating on the quartz glass are thermally decomposed and removed.

In this type of conventional ultraviolet irradiation apparatus, based on the above findings, in order to heat the quartz glass of the ultraviolet irradiation window, the inner surface (surface on the lamp side) of the quartz glass is made of a conductive heating paste. A quartz heater is heated directly by forming or arranging a linear heater composed of a film heater or a nichrome wire, or a halogen incandescent lamp is arranged beside a dielectric barrier discharge lamp to radiate from the incandescent lamp. The quartz glass is heated by the infrared rays.

[0005]

In the conventional ultraviolet irradiation apparatus, a method in which quartz glass is directly heated by a thick film heater or a linear heater as described above or a method in which infrared light is remotely heated by a halogen incandescent lamp is employed. However, production costs and maintenance costs are high.

In particular, the direct heating method requires an extremely troublesome and careful manufacturing technique since a thick film heater or a linear heater is integrally formed by additional processing on the originally expensive quartz glass, and the equipment cost is greatly increased. Invite. In addition, there is a problem that the ultraviolet light transmission characteristics of the quartz glass deteriorate due to the heater formed on the quartz glass surface.

[0007] In the infrared heating method described above, the interval of juxtaposing a plurality of dielectric barrier discharge lamps in the lamp chamber is widened by the space of the incandescent lamps arranged so as to be interposed therebetween, thereby increasing the lamp density. There is also a problem that the irradiation density or the illuminance of ultraviolet rays is lowered.

SUMMARY OF THE INVENTION The present invention has been made in view of the problems of the prior art, and has been made in consideration of the above problems, and has been made in consideration of the above circumstances. It is intended to provide a device.

[0009]

In order to achieve the above object, a substrate processing apparatus of the present invention irradiates a substrate with ultraviolet light to perform a predetermined processing. A mounting table for mounting and supporting, a lamp that emits the ultraviolet ray when supplied with electric power, and a window member that transmits the ultraviolet ray; and the ultraviolet ray emitted from the lamp is covered by the window member through the window member. Ultraviolet irradiation means for irradiating the processing substrate, so that the ultraviolet light from the ultraviolet irradiation means scans the processing surface of the processing substrate on the mounting table,
Driving means for moving one or both of the mounting table and the ultraviolet irradiation means in a predetermined direction, provided on the mounting table side at a position that does not interfere with the substrate to be processed,
When the mounting table and / or the ultraviolet irradiation unit moves in the predetermined direction by the driving of the driving unit, the heating unit heats the window member to a predetermined temperature or higher while scanning the window member.

In the substrate processing apparatus according to the present invention, in the operation in which one or both of the mounting table and the ultraviolet irradiation means move in the predetermined direction, the ultraviolet light from the ultraviolet irradiation means scans the surface of the substrate to be processed. By doing so, the organic matter is decomposed and removed from the surface to be processed, and the heating means on the mounting table scans the ultraviolet irradiation window member of the ultraviolet irradiation means in the above-mentioned predetermined direction or the opposite direction to heat it to a predetermined temperature or more. Thereby, ultraviolet reaction products or precipitates are removed or avoided from the window member.

In the substrate processing apparatus of the present invention, preferably, the heating means may include a heating element disposed on the mounting table in front of the substrate to be processed in the scanning direction. Such a heating element is, for example,
It can be constituted by a heating wire which is wired in a direction orthogonal to the scanning direction. In order to control the heating value of the heating wire, preferably, the heating means is electrically connected to the heating wire via a switching circuit, and a temperature sensor arranged near the heating wire on the mounting table. A power source connected thereto; and a temperature control unit configured to control an on / off operation of the switching circuit in accordance with an output signal of the temperature sensor so that the window member is heated to the predetermined temperature or higher. May do it.

[0012]

Preferred embodiments of the present invention will be described below with reference to the accompanying drawings.

FIG. 1 shows a coating and developing system as an example of a system into which the substrate processing apparatus of the present invention can be incorporated.
This coating and developing system is installed in a clean room, and performs, for example, cleaning, resist coating, pre-baking, developing and post-baking in a photolithography process in an LCD manufacturing process, for example, using an LCD substrate as a substrate to be processed. is there. The exposure processing is performed by an external exposure apparatus (not shown) installed adjacent to this system.

The coating and developing system is roughly divided into a cassette station (C / S) 10, a process station (P / S) 12, an interface unit (I / O).
/ F) 14.

A cassette station (C / S) 10 installed at one end of the system has a cassette stage 16 on which a predetermined number of, for example, four, cassettes C accommodating a plurality of substrates G can be placed, and a cassette stage 16 on this stage 16. And a transfer mechanism 20 for loading and unloading the substrate G with respect to the cassette C. The transfer mechanism 20 has a unit capable of holding the substrate G, for example, a transfer arm, is operable in four axes of X, Y, Z, and θ, and is a process station (P / S) described later.
The transfer of the substrate G to and from the main transfer device 38 on the 12th side can be performed.

The process station (P / S) 12
The cleaning process unit 22, the coating process unit 24, and the developing process unit 26 are sequentially changed from the cassette station (C / S) 10 side to the substrate relay unit 23, the chemical solution supply unit 25.
And are provided in a horizontal row with (and sandwiching) a space 27 therebetween.

The cleaning process section 22 includes two scrubber cleaning units (SCRs) 28 and two upper and lower ultraviolet irradiation /
It includes a cooling unit (UV / COL) 30, a heating unit (HP) 32, and a cooling unit (COL).

The coating process unit 24 includes a resist coating unit (CT) 40 and a reduced-pressure drying unit (VD) 42
And the edge remover unit (ER) 44 and the upper and lower 2
Stage type adhesion / cooling unit (AD / COL) 4
6, upper and lower two-stage heating / cooling unit (HP / COL)
48 and a heating unit (HP) 50.

The developing process section 26 includes three developing units (DEV) 52, two upper and lower two-stage heating / cooling units (HP / COL) 55, and a heating unit (HP) 5
3 is included.

At the center of each of the process sections 22, 24 and 26, transport paths 36, 52 and 58 are provided in the longitudinal direction, and the main transport devices 38, 54 and 60 move along the respective transport paths and Each unit in the unit is accessed to carry in / out or carry in the substrate G. In this system, in each of the process units 22, 24, and 26, a spinner system unit (SCR, CT, DEV, etc.) is disposed on one side of the transport paths 36, 52, and 58, and heat treatment or heat treatment is performed on the other side. Irradiation treatment system unit (HP, CO
L, UV, etc.).

An interface (I / F) 14 installed at the other end of the system has an extension (substrate transfer section) 57 on the side adjacent to the process station 12.
And a buffer stage 56, and a transport mechanism 59 on the side adjacent to the exposure apparatus.

FIG. 2 shows a processing procedure in this coating and developing system. First, the cassette station (C
/ S) 10, the transport mechanism 20 takes out one substrate G from the predetermined cassette C on the stage 16 and
It is transferred to the main transfer device 38 of the cleaning process section 22 of the process station (P / S) 12 (step S1).

In the cleaning process section 22, the substrate G
First, they are sequentially carried into an ultraviolet irradiation / cooling unit (UV / COL) 30, subjected to dry cleaning by ultraviolet irradiation in the upper ultraviolet irradiation unit (UV), and then cooled to a predetermined temperature in the lower cooling unit (COL). (Step S2). This ultraviolet irradiation cleaning removes organic substances on the substrate surface. This improves the wettability of the substrate G,
The cleaning effect in the scrubbing cleaning in the next step can be enhanced.

Next, the substrate G is placed in a scrubber cleaning unit (S
One of the CRs 28 undergoes a scrubbing cleaning process to remove particulate contamination from the substrate surface (step S3).
After the scrubbing cleaning, the substrate G is heated by a heating unit (H
(P) 32 undergoes dehydration by heating (step S)
4) Then, the substrate is cooled to a certain substrate temperature by the cooling unit (COL) 34 (step S5). Thus, the pre-processing in the cleaning process unit 22 is completed, and the substrate G is transported by the main transport unit 38 to the coating process unit 24 via the substrate transfer unit 23.

In the coating process section 24, the substrate G
First, the adhesion / cooling unit (AD / COL) 4
6 in sequence, and the first adhesion unit (A
In D), a hydrophobizing treatment (HMDS) is performed (step S).
6) Then, the substrate is cooled to a constant substrate temperature in the next cooling unit (COL) (step S7).

Thereafter, the substrate G is coated with a resist solution in a resist coating unit (CT) 40, then subjected to a drying process under reduced pressure in a reduced-pressure drying unit (VD) 42, and then in an edge remover unit (ER) 44. Excess (unnecessary) resist on the periphery is removed (step S
8).

Next, the substrate G is heated / cooled (H
P / COL) 48, and the first heating unit (HP) performs baking (pre-bake) after coating (step S9), and then cools to a constant substrate temperature by the cooling unit (COL) (step S9). Step S10). In addition,
The heating unit (HP) 50 can be used for baking after the application.

After the coating process, the substrate G is transferred to the interface (I / F) 14 by the main transfer device 54 of the coating process unit 24 and the main transfer device 60 of the development process unit 26.
To the exposure apparatus from there (step S
11). The exposure device exposes a resist on the substrate G to a predetermined circuit pattern. Then, the substrate G after the pattern exposure is transferred from the exposure apparatus to the interface unit (I / F) 14.
Is returned to. The transfer mechanism 59 of the interface unit (I / F) 14 transfers the substrate G received from the exposure apparatus via the extension 57 to the process station (P / S) 1.
(Step S11).

In the developing process section 26, the substrate G
One of the developing units (DEV) 52 undergoes a developing process (step S12), and then is sequentially loaded into one of the heating / cooling units (HP / COL) 55, and is post-baked in the first heating unit (HP). Is performed (step S13), and then cooled to a certain substrate temperature by the cooling unit (COL) (step S14). A heating unit (HP) 53 can be used for this post-baking.

The substrate G that has been subjected to a series of processes in the developing process section 26 is returned to the cassette station (C / S) 10 by the transfer devices 60, 54, and 38 in the process station (P / S) 24. Stored in one of the cassettes C by the transport mechanism 20 (step S
1).

In this coating and developing system, the present invention can be applied to the ultraviolet irradiation unit (UV) of the cleaning process section 22. An embodiment in which the present invention is applied to an ultraviolet irradiation unit (UV) will be described below with reference to FIGS.

As shown in FIG. 3, the ultraviolet irradiation unit (UV) of this embodiment has an ultraviolet irradiation window 62 made of synthetic quartz glass on the lower surface, and a plurality of (three in the illustrated example) indoors. Cylindrical ultraviolet lamps 64 (1), 64 (2) ‥‥,
64 (n) are arranged side by side in the horizontal direction perpendicular to the longitudinal direction of the lamp, and include a lamp chamber 66, and a cleaning processing chamber 68 provided adjacent to and below the lamp chamber 66.

In the lamp chamber 66, each of the ultraviolet lamps 64 (1) to 64 (n) may be, for example, a dielectric barrier discharge lamp, and emits light when supplied with commercial AC power from a lamp power supply (108) described later. It emits ultraviolet light (ultraviolet excimer light) having a wavelength of 172 nm, which is suitable for cleaning organic contamination. A concave reflecting mirror 70 having an arc-shaped cross section is disposed behind, that is, above, each of the ultraviolet lamps 64 (1) to 64 (n), and above or to the side of each of the lamps 64 (1) to 64 (n). The emitted ultraviolet light is reflected by the concave surface of the reflector just above and directed to the ultraviolet irradiation window 62 side.

In the lamp chamber 66, an ultraviolet lamp 64 is provided.
A cooling jacket (not shown) for cooling (1) to 64 (n) by, for example, a water-cooling method, or an inert gas for preventing entry of oxygen that absorbs ultraviolet rays (and thus deteriorates lamp luminous efficiency) into the room. A gas distribution mechanism (not shown) for introducing and filling a gas such as N2 gas may be provided. On both sides of the lamp chamber 66, there are provided utility units 74 for accommodating a control unit and a utility supply unit for supplying a required utility or control signal to each unit in the ultraviolet irradiation unit (UV).

A horizontally movable and vertically movable stage 76 for mounting and supporting the substrate G is provided in the cleaning processing chamber 68.
Is provided. In this embodiment, the ball screw 78
Stage 7 on a self-propelled stage drive 80 using
6 is mounted so as to be able to move up and down in the vertical direction (Z direction in the figure), and the stage driving unit 80 is moved in a predetermined horizontal direction (Y direction in the figure) along the ball screw 78 and the guide 82 extending in parallel with the ball screw 78. It is configured to be able to reciprocate at a variable controllable speed so as to cross right below the lamp chamber 66 in parallel with the lamp arrangement direction.

A plurality of (for example, six) lift pins 84 for vertically supporting the substrate G when loading / unloading the substrate G are vertically penetrated through the stage 76. In this embodiment, each of the lift pins 84 is fixed at a predetermined height position for transferring the substrate, and the stage 76 is positioned with respect to these fixed lift pins 84 so that the lower limit height position Hb for evacuation does not hinder the loading / unloading of the substrate G. And stage 76 itself substrate G
Upper limit position Ha indicated by a dashed line for mounting and supporting
Can be moved up and down by an elevating mechanism (not shown).

The stage 76 is formed to have a size slightly larger than the substrate G, and a predetermined area (substrate mounting area) 76a near the center where the substrate G is mounted has a large number of supports for supporting the substrate G. A pin (not shown) and a vacuum chuck suction port (not shown) for sucking and holding the substrate G are provided. In FIG. 3, the right end 76b of the upper surface of the stage located adjacent to the right of the substrate mounting area 76a, more specifically, in front of the substrate mounting area 76a in the stage forward movement direction (Y direction). As a heating means for heating the ultraviolet irradiation window 62 in a scanning manner from the stage 76 side, a heating wire 86 extending in a horizontal direction orthogonal to the stage forward movement direction (Y direction) is provided.

As clearly shown in FIG. 4, the stage right end 76b is spaced at an appropriate interval (for example, almost from end to end of the stage) in the horizontal direction orthogonal to the stage forward direction (Y direction). A pair of columnar or protruding supports 88, 88 made of an insulating material are provided.
A heating wire 86 made of, for example, a molybdenum or tungsten wire is provided between 8, 88 while being separated (floated) from the stage. Both ends of the heating wire 86 are fixed to both support pins 88, 88, and are electrically connected to a heater power supply section (110) to be described later via electric cables 90, 90 covered with insulation. A temperature sensor 92 composed of, for example, a thermocouple is also provided at an appropriate position near the heating wire 86 at the right end 76b of the stage.

Referring again to FIG. 3, a side wall of the cleaning chamber 68 adjacent to the origin position of the stage 76 in the Y direction is provided for loading / unloading the substrate G at a height near the upper end of the fixed lift pins 84. An openable and closable shutter (door) 94 is attached. This shutter 94 is used for the cleaning process unit 2.
The main transfer device 38 faces the second transfer path 36 (FIG. 1), so that the substrate G can be loaded and unloaded from the transfer path 36 into the cleaning processing chamber 68 through the shutter 94 in the open state. Has become.

One or a plurality of exhaust ports 96 are provided in the side wall or bottom surface of the cleaning processing chamber 68.
Reference numeral 6 is connected to an exhaust system (not shown) such as an exhaust duct via an exhaust pipe 98. Further, an outside air suction port (not shown) may be provided at an appropriate position in the cleaning processing chamber 68.

FIG. 5 shows the ultraviolet irradiation unit (UV).
3 shows the configuration of the control system. The control unit 100 may be constituted by a microcomputer, and a built-in memory stores a necessary program for controlling each unit in the unit and the whole unit. It is connected to a main controller (not shown) that controls the overall processing procedure of the system and to various parts of a control system in the ultraviolet irradiation unit (UV).

In this embodiment, a main part in the ultraviolet irradiation unit (UV) related to the control unit 100 is a shutter driving unit 10 for driving the shutter 94.
2. A stage elevating drive unit 104 for driving the stage 76 up and down in the Z direction, a scan driving unit 106 for horizontally or scanning driving the stage 76 in the Y direction, and the ultraviolet lamps 64 (1) to 64 (1) in the lamp chamber 66. 64 (n), a lamp power supply unit 108 for lighting and driving, a heater power supply unit 110 for supplying heating power to the heating wire 86, and sensors 112 for detecting the state or state amount of each unit in the apparatus. And so on. Stage elevation drive unit 104 and scan drive unit 10
Reference numerals 6 each have, for example, a servomotor as a driving source, and are provided in the stage driving unit 80. Sensors 11
2 is the temperature sensor 92 on the right end 76b of the stage.
including.

FIG. 6 shows an example of the configuration of the heater power supply section 110. The heater power supply unit 110 supplies electric power from an AC power supply 114 to a heating wire 86 via a switching circuit for temperature control, for example, an SSR (solid state relay) 116.
And the heating wire 86 detected by the temperature sensor 92
The temperature in the vicinity is fed back by the temperature measurement circuit 120 so that the temperature control circuit 118 controls ON / OFF of the SSR 116.

Since there is a certain correspondence between the temperature at which the ultraviolet irradiation window 62 of the lamp chamber 68 is heated by the heating of the heating wire 86 and the temperature sensed by the temperature sensor 92, the temperature sensor 92 detects the temperature. The effective value of the power supplied to the heating wire 86 may be controlled such that the temperature or the temperature of the ultraviolet irradiation window 62 estimated based on the corresponding relationship becomes equal to or higher than the set value Ts.

In this embodiment, when the heating wire 86 passes (scans) in front of or near the eyes of the ultraviolet irradiation window 62, at least a portion of the ultraviolet irradiation window 62 near the portion closest to the heating wire 86 is 110. The set value Ts may be selected so that the heating is performed to a temperature of ゜ C or more.

FIG. 7 shows this ultraviolet irradiation unit (UV).
The main operation procedure in is shown. First, upon receiving an instruction from the main controller, each unit in the unit including the control unit 100 is initialized (step A1). During this initialization, the stage 76 is positioned at a predetermined origin position close to the shutter 94 in the Y direction, and is lowered to the retreat height position (Hb) in the Z direction. Heater power supply 1
At 10, power supply to the heating wire 86 is started, and the heating temperature of the heating wire 86 is raised to a set value by a feedback method.

When the main transfer device 38 (FIG. 1) transfers the unprocessed substrate G from the cassette station (C / S) 10 to the position before the main ultraviolet irradiation unit (UV), the controller 1
00 controls corresponding parts so as to transfer the substrate G to and from the main transfer device 38 (step A2).

More specifically, first, the shutter driving unit 102
To open the shutter 94. Main transfer device 38
Has a pair of transfer arms, places the substrate G before cleaning on one transfer arm, and leaves the other transfer arm empty (no substrate). Ultraviolet irradiation unit (UV)
If there is no cleaned substrate G in the shutter 9, the transfer arm supporting the substrate G before cleaning is directly opened by the shutter 9.
4, the uncleaned substrate G is transferred onto the fixed lift pins 84. If there is a cleaned substrate G in the ultraviolet irradiation unit (UV),
First, the cleaned substrate G is carried out by the empty transfer arm, and then the uncleaned substrate G is carried in in the same manner as described above.
As described above, when the substrate G to be subjected to the ultraviolet cleaning process by the main ultraviolet irradiation unit (UV) is loaded and mounted on the fixed lift pins 84 by the main transfer device 38, the shutter 94 is closed.

Next, the control section 100 controls the stage up / down drive section 92 to raise the stage 76 to the substrate mounting height position Ha (step A3). At this time, the suction of the vacuum chuck portion may be started while the stage 76 is raised, so that the substrate G can be suction-held at the same time when the stage 76 reaches the substrate mounting height position Ha. When the stage 76 rises to the substrate mounting height position Ha with the substrate G mounted thereon, the heating wire 86 on the right side end 76a of the stage 76 is in contact with the left end of the ultraviolet irradiation window 62 of the lamp chamber 66 at a predetermined position. They face each other at an interval (for example, 2-3 mm). From this point, heating of the ultraviolet irradiation window 62 by the heating wire 86 on the stage 76 side is started.

Next, the control unit 100 controls the lamp power supply unit 10
8, the ultraviolet lamps 64 (1) to 64 (n) are turned on (step A4), and the substrate G is subjected to an ultraviolet irradiation cleaning process (step A5).

To perform this ultraviolet irradiation cleaning process, the control unit 100 moves the stage 76 one way in the Y direction between the origin position and the forward movement position indicated by the dotted line 76 ′ by the scanning drive unit 106 of the stage drive unit 80. Move back and forth. When the stage G moves in the Y direction, the substrate G on the stage crosses directly below the lamp chamber 66 in the Y direction at a predetermined height position Ha, and radiates almost vertically downward from the ultraviolet irradiation window 62 of the lamp chamber 66. While the substrate G is irradiated with ultraviolet rays having a wavelength of 172 nm, the substrate G is scanned from one end to the other end in the direction opposite to the Y direction.

As described above, the wavelength of the substrate G is 172 nm.
Is irradiated, the oxygen existing near the substrate surface is changed into ozone O3 by the ultraviolet light, and the ozone O3 is excited by the ultraviolet light to generate oxygen atom radicals O *. Due to the oxygen radicals, organic substances attached to the surface of the substrate G are decomposed into carbon dioxide and water and removed from the substrate surface. The decomposed and vaporized organic matter is exhausted from an exhaust port 96.

In such a scanning type ultraviolet cleaning process, the irradiation amount or integrated light amount of the ultraviolet ray to the substrate G is inversely proportional to the moving speed (scanning speed) of the stage 76. That is, as the scanning speed F increases, the ultraviolet irradiation time on the substrate G decreases and the amount of ultraviolet irradiation decreases. On the contrary, as the scanning speed decreases, the ultraviolet irradiation time on the substrate G increases and the amount of ultraviolet irradiation increases. . Within a certain limit, the larger the amount of ultraviolet irradiation, the more organic substances are removed from the surface of the substrate G.

In this embodiment, by moving the stage 76 in the Y direction, the above-described scanning type ultraviolet cleaning process is performed, and at the same time, the ultraviolet exit window 62 of the lamp chamber 66 is opened.
Is heated by the heating wire 86 on the stage 76 side.

As schematically shown in FIG.
When the heater passes in the Y direction just below the ultraviolet irradiation window 62 of the lamp chamber 66, the heating wire 86 on the right end 76a of the stage heats the ultraviolet irradiation window 62 at a position ahead of the substrate G on the substrate mounting area 76a. While moving in the Y direction. By the temperature control in the heater power supply unit 110 as described above, when the heating wire 86 passes or scans the ultraviolet irradiation window 62,
The temperature near at least the portion of the ultraviolet irradiation window 62 closest to the heating wire 86 is heated to 110 ° C. or higher.

In this way, the radiant heat from the heating wire 86 moving in the Y direction integrally with the stage 76 causes each part of the synthetic quartz glass constituting the ultraviolet irradiation window 62 to remain for a certain time 110
When heated to above ゜ C, the UV reaction product or white precipitate adhering to or floating near it is thermally decomposed. Then, the UV reaction product or the white precipitate vaporized by the thermal decomposition is discharged to the outside through the exhaust port 96 of the cleaning processing chamber 68.

As described above, just before the surface of the substrate G is irradiated with ultraviolet light, the white precipitate adhering to the ultraviolet light irradiation window 62 is swept away by scanning heating. Irradiating with ultraviolet rays can be performed after the above conditions are satisfied.

Also, before and after the heating wire 86 passes, each part of the ultraviolet irradiation window 62 keeps a temperature of 110 ° C. or more for a while due to heat transfer or residual heat.
The UV reaction product generated in association with the above-described scanning UV cleaning process hardly adheres to the UV irradiation window 62 and is discharged from the exhaust port 96 to the exhaust system.

When the scanning type ultraviolet cleaning process for the substrate G is completed, the control unit 100 controls the lamp power supply unit 108 to turn off the ultraviolet lamps 64 (1) to 64 (n) (step A6). ).

Next, the control section 100 returns the stage 76 to the start position (step A7). In this embodiment, first, the stage 76 is moved or moved backward from the forward movement position (dotted line position 76 'in FIG. 3) to the origin position in the Y direction by the scanning drive unit 106, and then the vacuum chuck is turned off at the origin position in the Y direction. After that, the stage 76 is lowered to the retreat height position (Hb) by the stage raising / lowering drive unit 104, and the substrate G is supported by the fixed lift pins 84. Thus, 1
The whole process in the ultraviolet cleaning unit (UV) for one substrate G is completed, and the main transfer device 38 (FIG. 1) is awaited. During this time, the power supply to the heating wire 86 may be continued or may be cut off once.

As described above, in this embodiment, the heating wire 86 is provided on the stage 76 on which the substrate G is mounted, and the stage 76 is placed on the substrate surface or the stage surface with respect to the lamp chamber 66 fixed and installed above the opposite side. Is moved in a predetermined direction (Y direction) parallel to. In this stage movement,
The ultraviolet rays from the lamp chamber 66 scan the surface of the substrate G from one end of the substrate to the other, whereby organic substances are decomposed and removed from the entire surface of the substrate, and the heating wires 8 on the stage 76 side
6 scans the UV irradiation window 62 of the lamp chamber 66 from end to end in the above-described predetermined direction and heats the UV irradiation window 62 to a predetermined temperature (110 ° C.) or more. Precipitates are not removed or adhered.

As described above, in this embodiment, the heating wire 86 is provided on the stage 76 side as a countermeasure against the UV reaction product for protecting the UV irradiation window 62.
No special specifications (additional work, addition of parts or functions, structural changes, etc.) on the lamp chamber 66 side are required at all. In particular,
In this embodiment, one heating wire 86 is arranged in the horizontal direction orthogonal to the scanning direction on the stage 76 in front of the substrate G in the scanning direction, so that the ultraviolet irradiation is performed immediately before or during the ultraviolet irradiation processing. This is a method in which the window 62 is heated to a predetermined temperature or higher, and the heating means of the present invention can be simply and inexpensively provided on the stage 76 side.

However, in this embodiment, the configuration in which the heating wire 86 is provided on the stage 76 side can be variously modified. For example, as shown in FIG. 9, a configuration in which the heating wire 86 is wired so as to partially or entirely (circle around) the substrate G (substrate mounting area 76 a) on the stage 76 is also possible. In the configuration example of FIG. 9, the heating wire 86 is not wired on the left end portion 76c of the stage 76, but the heating wire 86 can also be wired in this region 76c. In particular, when ultraviolet irradiation (step A5) is performed even when the stage 76 moves backward (moves in the direction opposite to the Y direction), the heating wire 86 on the stage left end 76c is useful. Although not shown, a configuration in which a plurality of heating wires 86 are connected in parallel is also possible.

As a heating means in the present invention, any heating means other than a heating wire may be used as long as it can heat the ultraviolet irradiation window 62 of the lamp chamber 66 from the stage 76 side to the predetermined temperature (110 ° C.) or more. For example, a ceramic heater or an infrared heater can be used. Also,
The heating means in the present invention does not necessarily need to be attached to the upper surface of the stage 76, but can be attached to the side surface of the stage 76 or any member that moves integrally with the stage 76.

In the above-described embodiment, the scanning system in which the lamp chamber 66 side is fixed and the stage 76 and the heating wire 86 side are moved in parallel with the surface of the substrate G is used. However, a scanning method in which the stage 76 and the heating wire 86 are fixed at predetermined positions and the lamp chamber 66 is moved in parallel with the surface of the substrate G is also possible. The scanning drive means is not limited to the ball screw mechanism as described above, but may be a belt type or a roller type. The configuration inside the lamp chamber 66 and the inside of the cleaning processing chamber 68 in the above-described embodiment, in particular, the ultraviolet irradiation window 62, the ultraviolet lamps 64 (1) to 64 (n), the stage 76, the stage driving unit 80, the heater power supply unit 110, and the like The configuration is also an example, and various modifications and changes are possible for each unit.

In the above embodiment, the ultraviolet irradiation cleaning device (U
V). However, the substrate processing apparatus of the present invention is also applicable to a process of irradiating a substrate to be processed with ultraviolet rays for a purpose other than the removal of organic contamination. For example, in the coating and developing system as described above, the same ultraviolet irradiating apparatus as in the above embodiment can be used in the step of irradiating the substrate G with ultraviolet rays for the purpose of curing the resist after the post-baking (step S13). The substrate to be processed in the present invention is not limited to the LCD substrate, but may be a semiconductor wafer, a CD substrate, a glass substrate, a photomask, a printed substrate, or the like.

[0067]

As described above, according to the substrate processing apparatus of the present invention, the window member for ultraviolet irradiation is heated to a predetermined temperature or higher by the scanning means by the heating means provided on the mounting table side on which the substrate is mounted. As a result, the window member can be effectively protected from the ultraviolet reaction product by a simple configuration.

[Brief description of the drawings]

FIG. 1 is a plan view showing a configuration of a coating and developing processing system to which a substrate processing apparatus of the present invention can be applied.

FIG. 2 is a flowchart illustrating a processing procedure in the coating and developing processing system according to the embodiment.

FIG. 3 is a perspective view illustrating a configuration of an ultraviolet irradiation unit according to the embodiment.

FIG. 4 is a perspective view showing a heating wire mounting structure in the ultraviolet irradiation unit of the embodiment.

FIG. 5 is a block diagram illustrating a configuration of a control system of the ultraviolet irradiation unit according to the embodiment.

FIG. 6 is a block diagram illustrating a configuration example of a heater power supply unit in the ultraviolet irradiation unit according to the embodiment.

FIG. 7 is a flowchart showing a main operation procedure in the ultraviolet irradiation unit of the embodiment.

FIG. 8 is a plan view schematically showing an action of heating the ultraviolet irradiation window by scanning in the ultraviolet irradiation unit of the embodiment.

FIG. 9 is a perspective view showing a modification of the heating wire mounting structure in the ultraviolet irradiation unit of the embodiment.

[Explanation of symbols]

 38 Main transfer unit UV UV irradiation unit 62 UV irradiation window (quartz glass window) 64 (1), 64 (2), ‥‥, 64 (n) UV lamp 66 Lamp room 68 Cleaning treatment room 76 Stage 76a Substrate mounting area 76b Stage right end portion 78 Ball screw 80 Stage drive unit 82 Guide 84 Fixed lift pin 86 Heating wire 88 Support pin 92 Temperature sensor 100 Control unit 104 Stage up / down drive unit 106 Scanning drive unit 110 Heater power supply unit

Claims (4)

[Claims] 1. A substrate processing apparatus for performing predetermined processing by irradiating a substrate to be processed with ultraviolet light, comprising: a mounting table for mounting and supporting the substrate to be processed; and a lamp for receiving the supply of electric power and emitting ultraviolet light. A window member that transmits ultraviolet light, an ultraviolet irradiation unit that irradiates the substrate to be processed with ultraviolet light emitted from the lamp through the window member, and the ultraviolet light from the ultraviolet irradiation unit is on the mounting table. Driving means for moving one or both of the mounting table and the ultraviolet irradiation means in a predetermined direction so as to scan the processing surface of the processing substrate, and a driving means for interfering with the processing substrate. The window member is heated to a predetermined temperature or higher while scanning the window member when the mounting table and / or the ultraviolet irradiation unit is moved in the predetermined direction by the driving of the driving unit. A substrate processing apparatus having a heating means that. 2. The substrate processing apparatus according to claim 1, wherein the heating means has a heating element disposed on the mounting table in front of the substrate to be processed in the scanning direction. 3. The substrate processing apparatus according to claim 2, wherein the heating element comprises a heating wire that is wired in a direction orthogonal to the scanning direction. 4. A heating device comprising: a temperature sensor disposed on the mounting table in the vicinity of the heating wire; a power source electrically connected to the heating wire via a switching circuit;
4. A temperature control means for controlling on / off operation of the switching circuit according to an output signal of the temperature sensor so that the window member is heated to the predetermined temperature or higher. Substrate processing equipment.