TWI827832B - Substrate processing device - Google Patents

Abstract

The present invention describes a substrate processing system and a substrate processing device that are capable of efficiently processing both sides of a substrate. The substrate processing system comprises transport devices configured to transport a substrate incorporating a first primary surface and a second primary surface which is the reverse surface from the first primary surface, and a substrate processing device which is configured to receive the substrate between the transport devices. The substrate processing device comprises a holding section configured to hold the substrate transported by the transportation devices, a processing section configured to subject one or other of the first primary surface and the second primary surface to predetermined processing, a driving section which drives at least one of the holding section and the processing section such that the substrate held by the holding section moves relative to the processing section, an inversion section configured to invert the substrate, and a chassis that houses the holding section, the processing section, the drive section, and the inversion section.

Description

Substrate processing equipment

The invention relates to a substrate processing system and a substrate processing device.

Patent Document 1 discloses a substrate cleaning device that irradiates a substrate (for example, a glass substrate) with ultraviolet rays to remove organic foreign matter or residue attached to the surface of the substrate.

[Prior technical literature] [Patent Document]

[Patent Document 1] International Publication No. 2009/022429

The present invention describes a substrate processing system and a substrate processing device that can efficiently process both sides of a substrate.

A substrate processing system according to an aspect of the present invention includes: a transport device for transporting a substrate, the substrate including a first main surface and a second main surface as a back surface of the first main surface; and a substrate processing device configured to transport the substrate. Transferring substrates between devices. The substrate processing device includes: a holding part that holds the substrate conveyed by the conveying device; a processing part that performs predetermined processing on one of the first main surface and the second main surface; and a driving part that drives the holding part and the processing part. At least one of them is used to move the substrate held in the holding part relative to the processing part; the flipping part is used to flip the substrate; and the housing is used to accommodate the holding part, the processing part, the driving part and the flipping part.

According to the substrate processing system and the substrate processing device according to the present invention, both sides of the substrate can be processed efficiently.

1:Substrate processing system

2:Transportation device

2a:Carrying arm

2b: Shell

2c: Gate

3:Substrate processing device

10: Shell

20:Lifting part

21: Actuator

22: Lift pin

30: Holding part

31:Frame

32:Support piece

40:Drive Department

41:Orbit

42:Sliding piece

43:Supporting members

50: Turning part

51:Pedestal

52: Clamping member

53: Clamping drive part

54: Flip drive unit

55:Connection components

56:Protrusion

60:Light irradiation part

61: Shell

62:Light source

70:Brush tools

A1,A2,A3: arrow

Ctr: Controller (Control Department)

W: Wafer (substrate)

Wa: Main side (first main side)

Wb: Main side (second main side)

FIG. 1 is a schematic diagram showing an example of the substrate processing system viewed from the side.

FIG. 2 is a schematic diagram showing an example of the substrate processing system viewed from above.

FIG. 3 is a schematic diagram showing an example of the substrate processing apparatus viewed from diagonally above.

FIG. 4 is a diagram for explaining a substrate processing method performed by the substrate processing system of FIG. 1 .

FIG. 5 is a diagram for explaining a substrate processing method performed by the substrate processing system of FIG. 1 .

FIG. 6 is a diagram for explaining a substrate processing method performed by the substrate processing system of FIG. 1 .

FIG. 7 is a diagram for explaining a substrate processing method performed by the substrate processing system of FIG. 1 .

FIG. 8 is a diagram for explaining a substrate processing method performed by the substrate processing system of FIG. 1 .

FIG. 9 is a diagram for explaining a substrate processing method performed by the substrate processing system of FIG. 1 .

FIG. 10 is a diagram for explaining a substrate processing method performed by the substrate processing system of FIG. 1 .

FIG. 11 is a diagram for explaining a substrate processing method performed by the substrate processing system of FIG. 1 .

FIG. 12 is a diagram for explaining a substrate processing method performed by the substrate processing system of FIG. 1 .

FIG. 13 is a schematic diagram showing another example of the substrate processing system viewed from the side.

Hereinafter, an example of an embodiment of the present invention will be described in more detail with reference to the drawings. In the following description, the same symbols are used for elements with the same elements or the same functions, and repeated explanations are omitted.

[Substrate processing system]

First, the structure of the substrate processing system 1 will be described with reference to FIGS. 1 to 3 . The substrate processing system 1 includes a transport device 2, a substrate processing device 3, and a controller Ctr (control unit).

As shown in FIGS. 1 and 2 , the transport device 2 carries the wafer W (substrate) into the substrate processing device 3 . The transport device 2 carries out the wafer W processed by the substrate processing device 3 from the substrate processing device 3 . The transport device 2 includes a transport arm 2 a used to transport the wafer W into and out of the substrate processing apparatus 3 , and a casing 2 b that accommodates the transport arm 2 a.

The transfer arm 2 a holds the wafer W based on the control signal from the controller Ctr, and can move between the substrate processing device 3 and other positions of the substrate processing system 1 . Other positions of the substrate processing system 1 include, for example, a carrier (not shown) that accommodates the wafer W in a sealed state, a heat treatment device (not shown) that performs heat treatment of the wafer W, and various coating liquids or It is a liquid processing device (not shown) etc. which supplies the processing liquid to the wafer W. Hereinafter, it is assumed that "the transfer arm 2a is in a state where one of the main surfaces Wa (first main surface) of the wafer W is facing the top surface, and the other main surface Wb (the second main surface) of the wafer W is facing downward. "Transporting wafer W" will be explained as an example. However, the posture of the wafer W during transportation by the transportation arm 2a is not particularly limited.

The casing 2b functions as a passage (conveyance path) for the conveyance arm 2a. The casing 2b is adjacent to the substrate processing apparatus 3 and communicates with the casing 10 (described later) of the substrate processing apparatus 3 via the gate 2c. The gate part 2c opens and closes based on the control signal from the controller Ctr. In the state where the gate part 2c is opened, the conveying arm 2a can move between the housing 2b and the housing 10.

The wafer W processed in the substrate processing system 1 may be in the shape of a disc, may have a notch formed on a part of the circle, or may be in a shape other than a circle, such as a rectangle or a polygon. In the following description, the wafer W is rectangular in shape. The wafer W may be, for example, a semiconductor substrate, a glass substrate, a mask substrate, an FPD (Flat Panel Display) substrate, or other various substrates.

The substrate processing apparatus 3 performs predetermined processing on each of the main surfaces Wa and Wb of the wafer W. As shown in FIGS. 1 to 3 , the substrate processing apparatus 3 includes a housing 10 , a lifting part 20 , a holding part 30 , a driving part 40 , a turning part 50 , and a light irradiation part 60 (processing part).

The housing 10 houses the lifting part 20, the holding part 30, the driving part 40, the turning part 50 and the light irradiation part 60 in the same storage space. That is, although the details will be described later, the processing of the wafer W by the turning unit 50 and the processing of the wafer W by the light irradiation unit 60 are both performed within the casing 10 .

The lifting part 20 includes an actuator 21 and a plurality of lifting pins 22 . The actuator 21 operates based on the control signal from the controller Ctr, and moves the plurality of lifting pins 22 up and down (see arrow A1 in FIGS. 1 and 3 ). When the plurality of lifting pins 22 rises (for example, when located at the top dead center), the wafer W can be placed on the front end of the plurality of lifting pins 22 . The wafer W placed on the front end of the lift pins 22 moves up and down as the lift pins 22 move up and down.

Especially as shown in FIGS. 2 and 3 , the holding part 30 includes a frame 31 and four support pieces 32 . The side of the frame 31 facing the gate part 2c has an open C shape. The wafer W can be arranged in the space inside the frame 31 . The frame 31 may be formed of a metal material such as stainless steel.

The four support pieces 32 are respectively installed at the four corners of the inner edge of the frame 31 . Each support piece 32 is roughly L-shaped and can support the bottom side of the wafer W. Each corner of the rectangular wafer W is placed on the corresponding support piece 32 , whereby the wafer W is aligned. The four support pieces 32 may be formed of a resin material such as PEEK (polyetheretherketone).

Especially as shown in FIG. 3 , the driving part 40 includes a track 41 , a slider 42 and a support member 43 . The rail 41 is extended on the bottom surface of the casing 10 from one end side (the gate part 2c side) of the casing 10 to the other end side (the side opposite to the gate part 2c). The slider 42 can move along the track 41 based on the action signal from the controller Ctr. The moving speed of the slider 42 may be about 40 mm/sec, for example. The support member 43 extends along the vertical direction to connect the slider 42 and the frame 31 . Therefore, if the slider 42 moves on the rail 41 while the wafer W is held in the holding part 30, the wafer W will also move horizontally along the rail 41 (see arrow A2 in FIGS. 1 to 3).

The flipping unit 50 operates based on the control signal from the controller Ctr, and clamps and flips the wafer W. Especially as shown in FIGS. 2 and 3 , the flip part 50 includes a base 51 , a pair of clamping members 52 , a clamp driving part 53 and a flip driving part 54 .

The base 51 extends along the vertical direction in a stationary state. The pair of clamping members 52 are respectively connected to the base 51 via the connecting member 55 . The pair of clamping members 52 are respectively movable relative to the base 51 in the extending direction thereof. The clamping member 52 has a substantially cross shape in the examples shown in FIGS. 2 and 3 , but the shape of the clamping member 52 is not particularly limited as long as the wafer W can be clamped.

In each corner of the clamping member 52, a protrusion 56 protruding toward the other clamping member 52 is provided. As shown in FIG. 1 , the protruding portion 56 may have a shape that is a combination of a cylinder and a truncated cone. The wafer W is supported on the inclined surface of the truncated cone of the protrusion 56 . The protruding portion 56 can be formed of a resin material such as PEEK (polyetheretherketone).

The clamp driving part 53 operates based on the control signal from the controller Ctr to move the pair of clamp members 52 relative to the base 51 (see arrow A3 in FIGS. 1 and 3 ). For example, the clamping drive unit 53 can space the pair of clamping members 52 to change between a "clamping position where the wafer W is clamped" and a "release position where the wafer W is not clamped." The clamp driving part 53 may be a linear motion cylinder or the like, for example.

The flip driving unit 54 operates based on a control signal from the controller Ctr to flip the base 51 around a rotation axis that intersects the extension direction of the base 51 (see arrow A4 in FIGS. 2 and 3 ). When the flip driving unit 54 is operated while the wafer W is clamped by the pair of clamping members 52 , the wafer W is flipped up and down. That is, when the main surface Wa is the top surface and the main surface Wb is the bottom surface, the main surface Wa is the bottom surface and the main surface Wb is the top surface. The flip driving unit 54 may be a motor or the like, for example.

As shown in FIGS. 1 to 3 , the light irradiation part 60 is located inside the housing 10 (opposite to the shutter part 2 c). The light irradiation unit 60 includes a housing 61 and a light source 62 . The housing 61 houses the light source 62 inside.

The light source 62 irradiates the main surfaces Wa and Wb with processing light for ashing the organic matter adhering to the main surfaces Wa and Wb of the wafer W. The processing light may be ultraviolet light with a wavelength of about 10 nm to 300 nm, for example. The light source 62 is, for example, a straight tube type, and can extend within the housing 61 in a manner parallel to the main surfaces Wa and Wb of the wafer W.

The controller Ctr generates instruction signals for operating each part of the substrate processing system 1 based on, for example, a program recorded on a recording medium (not shown) or an operation input from an operator, and transmits the instruction signals to Each part of the substrate processing system 1.

[Substrate processing method]

Next, the processing method of the wafer W will be described with reference to FIGS. 4 to 12 . In addition, when the wafer W does not exist in the housing 10 , the holding portion 30 is located on the side of the light irradiation portion 60 and does not overlap with the lifting portion 20 , and the light source 62 of the light irradiation portion 60 is not turned on.

First, the controller Ctr controls the gate part 2c to open the gate part 2c and bring the housings 2b and 10 into a state of communication. Next, the controller Ctr controls the transfer arm 2 a to move the transfer arm 2 a holding the wafer W in the housing 10 so that the wafer W is located above the lifting part 20 .

Next, the controller Ctr controls the actuator 21 to raise the lifting pin 22 . At this time, the lift pin 22 rises while avoiding the transfer arm 2 a, and the wafer W is placed on the front end of the lift pin 22 with the main surface Wa of the wafer W being the top surface (see FIG. 4 ).

Next, the controller Ctr controls the transfer arm 2a to move the transfer arm 2a to the casing 2b. Next, the controller Ctr controls the shutter portion 2c to close the shutter portion 2c so that the housing 2b and the housing 10 are in a non-communicative state (see FIG. 5 ).

Next, the controller Ctr controls the actuator 21 to lower the lifting pin 22 . Thereby, the wafer W is lowered together with the lifting pin 22, and the wafer W is supported by the protruding portion 56 of the clamping member 52 located on the lower side (see FIG. 5).

Next, the controller Ctr controls the clamping drive unit 53 to move the pair of clamping members 52 to the clamping position. Thereby, the wafer W is clamped by the pair of clamping members 52 in a state where the main surface Wa is the top surface and the main surface Wb is the bottom surface (see FIG. 6 ).

Next, the controller Ctr controls the flip driving unit 54 to flip the base 51 and the pair of clamping members 52 together, that is, to rotate them 180° (see FIG. 7 ). Thereby, the main surface Wa of the wafer W is the bottom surface and the main surface Wb is the top surface.

Next, the controller Ctr controls the clamp driving part 53 to move the pair of clamp members 52 to the release position. At this time, the wafer W is supported by the protruding portion 56 of the clamping member 52 located on the lower side with the main surface Wb being the top surface (see FIG. 8 ).

Next, the controller Ctr controls the actuator 21 to raise the lifting pin 22 . At this time, with the main surface Wb of the wafer W being the top surface, the wafer W is placed on the front end of the lift pin 22 (see FIG. 8 ).

Next, the controller Ctr controls the slider 42 to move the holding portion 30 to one end side of the rail 41 (the gate portion 2c side). At this time, since the frame 31 has a C-shape, the frame 31 can avoid the rising lift pin 22 and be located at a position overlapping the wafer W (see FIG. 8 ).

Next, the controller Ctr controls the actuator 21 to lower the lifting pin 22 . Thereby, the wafer W will be lowered together with the lifting pin 22, and the wafer W will be supported by the supporting piece 32 of the holding part 30 located on the lower side (see FIG. 9).

Next, the controller Ctr controls the slider 42 to move the holding part 30 so that the wafer W is located in the standby position near the light irradiation part 60 and does not overlap with the light source 62 . Next, the controller Ctr controls the light source 62 to light the light source 62 . At this time, since the wafer W is in the standby position, the ultraviolet rays irradiated from the light source 62 do not irradiate the wafer W (see FIG. 9 ).

After the preparation of the light source 62 is completed, the controller Ctr controls the slider 42 to move the holding part 30 to the other end side of the rail 41 (the side opposite to the gate part 2c). At this time, since the wafer W passes directly under the light source 62 , ultraviolet rays are irradiated to the main surface Wb of the wafer W. Thereby, organic substances adhering to the main surface Wb are removed (UV cleaning) (see FIG. 10 ).

Next, the controller Ctr controls the light source 62 to turn off the light source 62 . In this state, the controller Ctr controls the slider 42 to move the holding portion 30 to one end side of the rail 41 (the gate portion 2c side). Next, the controller Ctr raises the lifting pin 22 . At this time, with the main surface Wb of the wafer W being the top surface, the wafer W is placed on the front end of the lift pin 22 (see FIG. 11 ).

Next, the controller Ctr controls the slider 42 to move the holding part 30 to a position where the holding part 30 does not overlap the lifting part 20 (see FIG. 12 ). Next, the controller Ctr controls the actuator 21 to lower the lifting pin 22 . Thereby, the wafer W will be lowered together with the lifting pin 22 , and the wafer W will be supported by the protruding portion 56 of the clamping member 52 located on the lower side.

Next, the controller Ctr controls the clamping drive unit 53 to move the pair of clamping members 52 to the clamping position. Thereby, the wafer W is clamped by the pair of clamping members 52 in a state where the main surface Wa is the bottom surface and the main surface Wb is the top surface.

Next, the controller Ctr controls the flip driving unit 54 to flip the base 51 together with the pair of clamping members 52, that is, to rotate them 180° (see FIG. 12). Thereby, the main surface Wa of the wafer W is the top surface and the main surface Wb is the bottom surface.

Thereafter, the controller Ctr controls each part of the substrate processing system 1 and repeatedly executes the same process as shown in FIGS. 8 to 11 . That is, when the wafer W passes directly under the light source 62, the main surface Wa of the wafer W is irradiated with ultraviolet rays to remove organic matter adhering to the main surface Wa (UV cleaning). Thereafter, the gate 2c is opened, and the wafer W is transferred to the transfer arm 2a in a state where the main surface Wa is the top surface and the main surface Wb is the bottom surface. The transport arm 2a transports the wafer W processed in the substrate processing apparatus 3 to a subsequent process.

[effect]

In addition, as a method for UV cleaning both sides of the wafer W, it is generally considered that the substrate is passed between a pair of ultraviolet lamps. In this case, it is necessary to have an ultraviolet lamp for irradiating the surface of the wafer W and an ultraviolet lamp for irradiating the back surface of the wafer W. This complicates the device and increases the frequency of maintenance of the expensive ultraviolet lamp. Therefore, the cost for processing the wafer W increases.

As another method for processing both sides of the wafer W, it is generally considered that after processing one of the main surfaces of the wafer W, the wafer W is turned over, and then the other main surface of the wafer W is processed. In this case, the crystal The circle W sequentially passes through a unit for processing one of the main surfaces of the wafer W, a unit for flipping the wafer W, and a unit for processing the other main surface of the wafer W, constituting substrate cleaning. device. In a substrate cleaning apparatus that processes a plurality of wafers W at the same time, if the substrate processing apparatus is configured so that the wafers W pass through the same unit multiple times, the transport path of the wafers W will be complicated, or the control of the apparatus will be complicated. change. For this purpose, a plurality of units and two ultraviolet lamps must be provided, which will also increase the cost of processing the wafer W.

On the other hand, according to the substrate processing apparatus 3 according to the above example, the processing of the main surfaces Wa and Wb of the wafer W and the turning over of the wafer W are performed in the same casing 10 . Therefore, there is no need to transport the wafer W to other units in order to process the main surfaces Wa and Wb of the wafer W. Therefore, both sides of the wafer W can be efficiently processed. In addition, since each surface of the wafer W can be processed by one processing unit, it is possible to reduce the size and cost of the substrate processing apparatus 3 and simplify the maintenance of the light irradiation unit 60 .

According to the above example, after the wafer W is turned over once to process the main surface Wb, the wafer W is turned over again to process the main surface Wa. Therefore, when the wafer W is loaded into the substrate processing apparatus 3 with the main surface Wa as the top surface, after both sides of the wafer W are processed, the wafer W may be loaded with the main surface Wa as the top surface. In this state, the wafer W is unloaded from the substrate processing apparatus 3 . Therefore, it is easier for the wafer W to perform subsequent processing.

According to the above example, the wafer W is placed in the standby position until the preparation of the light source 62 is completed. Therefore, irradiation with light from the light irradiation part 60 is performed only after the wafer W is brought as close as possible to the light irradiation part 60 . Therefore, the energy consumed in the light irradiation part 60 can be reduced.

According to the above example, the standby position of the wafer W is different from the position where the wafer W is turned over by the turning part 50 . Therefore, it is possible to achieve energy saving in the light irradiation part 60 while avoiding contact between the flipping part 50 and the wafer W and the light irradiation part 60 .

According to the above example, the flipping unit 50 flips the wafer W at the transfer position where the wafer W is transferred from the transfer arm 2 a to the holding unit 30 via the lifting unit 20 . Therefore, there is no need to move the wafer W from the transfer position to the flip position. Therefore, the substrate processing apparatus 3 can be further miniaturized.

According to the above example, the bottom surface side of the wafer W is supported by the supporting piece 32 to hold the wafer W in the holding part 30 . Therefore, the top side of the wafer W is not covered by the holding portion 30 . Therefore, when the wafer W is processed by the light irradiation unit 60, an unprocessed area (an area not irradiated with light) is less likely to occur on the wafer W. As a result, the entire main surfaces Wa and Wb of the wafer W can be processed. On the other hand, the portion of the support piece 32 that supports the wafer W is covered by the wafer W. Therefore, when the wafer W is processed by the light irradiation part 60 , the light from the light irradiation part 60 does not irradiate this part of the support sheet 32 . Therefore, the deterioration of the support sheet 32 caused by light irradiation can be suppressed.

[Modification]

The embodiments according to the present invention have been described in detail above. However, various modifications may be made to the embodiments described above as long as they do not deviate from the scope of the patent application and its gist.

(1) In the above example, after the wafer W is turned over once to process the main surface Wb, the wafer W is turned over again to process the main surface Wa. However, the wafer W can also be turned over first without turning over the wafer W. The main surface Wa is processed, and after the wafer W is turned over, the main surface Wb is processed. In this case, the wafer W processed in the substrate processing apparatus 3 is transferred to the transfer arm 2 a with the main surface Wa as the bottom surface and the main surface Wb as the top surface. In this way, both sides of the wafer W can be processed by flipping the wafer W only once by the flipping unit 50 . Therefore, the time required to process both sides of the wafer W can be shortened.

(2) In the substrate processing apparatus 3, only one side of the wafer W may be selectively processed.

(3) In the above example, the turning unit 50 turns the wafer W while holding the wafer W. However, the turning unit 50 may turn the wafer W while adsorbing the wafer W.

(4) In the above example, the entire top surface of the wafer W is irradiated with light by moving the wafer W relative to the light irradiation part 60 , but the light irradiation part 60 may be moved relative to the wafer W The movement may also be performed by moving both the light irradiation part 60 and the holding part 30 .

(5) In the above example, the process of irradiating the wafer W with light to remove the organic matter on the main surfaces Wa and Wb of the wafer W has been explained. However, as shown in FIG. 13 , the brush 70 etc. may also be directly contacted. On the main surfaces Wa and Wb of the wafer W, the organic matter on the main surfaces Wa and Wb of the wafer W is removed.

(6) When the light irradiation part 60 processes the main surface Wa, the controller Ctr may also control the driving part 40 to cause the wafer W to move relatively to the light irradiation part 60 at the first speed, and process the main surface Wb in the light irradiation part 60 When, control drive The wafer W moves relative to the light irradiation part 60 at a second speed that is different from the first speed. For example, the controller Ctr may also control the drive unit 40 to move the slider 42 at the first speed when the light irradiation unit 60 processes the main surface Wa, and control the drive unit 40 when the light irradiation unit 60 processes the main surface Wb. Therefore, the above-mentioned slider 42 moves at the second speed. For example, when the main surface Wa is the surface (circuit formation surface) of the wafer W and the main surface Wb is the back surface of the wafer W, the foreign matter (such as organic matter, residue, etc.) to be removed from the main surface Wb is sometimes less than the amount that should be removed from the main surface Wb. Main surface area to remove foreign matter. In this case, the second speed may also be lower than the first speed. Thereby, the processing time of the main surface Wb can be shortened. In addition, the lighting time of the light source 62 during processing of the main surface Wb can be shortened, and the deterioration of the light source 62 can be suppressed. Thereby, the replacement frequency of the light source 62 can be reduced.

[Example]

Example 1. A substrate processing system according to an example of the present invention includes: a transport device for transporting a substrate, the substrate including a first main surface and a second main surface serving as the back surface of the first main surface; and a substrate processing device in which Transfer the substrate to and from the transport device. The substrate processing device includes: a holding part that holds the substrate conveyed by the conveying device; a processing part that performs predetermined processing on one of the first main surface and the second main surface; and a driving part that drives the holding part and the processing part. At least one of them is used to move the substrate held in the holding part relative to the processing part; the turning part is used to turn the substrate over; and the housing is used to house the holding part, the processing part, the driving part and the turning part. In this case, the main surfaces of the substrate are processed and the substrate is turned over in the same housing. Therefore, there is no need to transport the substrate to other units in order to process each side of the substrate. Therefore, both sides of the substrate can be processed efficiently. In addition, since each surface of the substrate can be processed by one processing unit, it is possible to reduce the size and cost of the substrate processing apparatus and simplify the maintenance of the processing unit.

Example 2. A substrate processing device according to another example of the present invention includes: a holding part that holds a substrate transported by an external transportation device; and a processing part that handles the first main surface of the substrate and the back surface of the first main surface. One of the second main surfaces of the substrate performs a predetermined process; the driving part drives at least one of the holding part and the processing part so that the substrate held in the holding part moves relative to the processing part; the turning part is used to move the substrate Flip; and a housing to store the holding part, the processing part, the driving part and the flipping part. According to the device of Example 2, the same effect as that of Example 1 can also be exerted.

Example 3. The device of Example 2 further includes a control part for controlling the processing part, the driving part and the flipping part; the control part may also perform the following steps in sequence: controlling the processing part and the driving part to process the first main subject through the processing part. surface; control the flipping part to exchange the orientations of the first main surface and the second main surface through the flipping of the substrate; and control the processing part and the driving part to process the second main surface through the processing part. In this case, both sides of the substrate can be processed by flipping the substrate only once by the flipping unit. Therefore, the time required to process both sides of the substrate can be shortened.

Example 4. The device of Example 2 further includes a control part for controlling the processing part, the driving part and the flipping part; the control part can also perform the following steps in sequence: control the flipping part to exchange the first main surface by flipping the substrate and the orientation of the second main surface; control the processing part and the driving part to process the second main surface through the processing part; control the flipping part to exchange the orientations of the first main surface and the second main surface through flipping of the substrate; The processing part and the driving part are controlled so that the first main surface is processed by the processing part. In this case, after the substrate is turned over once to process the second main surface, the substrate is turned over again to process the first main surface. Therefore, for example, when a substrate is loaded into a substrate processing apparatus with the first main surface serving as the top surface, after both sides of the substrate are processed, the first main surface is processed in the same manner as when the substrate was loaded in. With one main surface being the top surface, the substrate is carried out from the substrate processing apparatus. Therefore, it is easier to perform subsequent processing on the substrate.

Example 5. Any device in Examples 2 to 4 further includes a control part for controlling the processing part, the driving part and the turning part; the processing part is a light irradiation part that irradiates the first or second main surface of the substrate with light, The control unit may further perform the following steps: control the driving unit so that the substrate is in a standby position where light from the light irradiation unit does not irradiate the substrate, and control the light irradiation unit to start with the substrate in the standby position. Illumination of light. In this case, the light irradiation from the light irradiation part is performed only after the substrate is brought as close as possible to the light irradiation part. Therefore, the energy consumed in the light irradiation part can be reduced.

Example 6. In the device of Example 5, the standby position may also be different from the position where the substrate is turned over by the turning part. In this case, it is possible to avoid the contact between the flipping part and the substrate and the light irradiation part, and at the same time, energy saving in the light irradiation part is achieved.

Example 7. In the apparatus of Example 5 or Example 6, the processing unit may be a light irradiation unit that irradiates ultraviolet rays to the first or second main surface of the substrate. In this case, organic foreign matters, residues, etc. attached to each surface of the substrate can be removed by ultraviolet irradiation.

Example 8. The control unit may also control the driving unit when the processing unit processes the first main surface so that the substrate moves relative to the processing unit at a first speed, and when the processing unit processes the second main surface, control the driving unit to cause the substrate to move relative to the processing unit at a first speed. The substrate is relatively moved toward the processing unit at a second speed that is different from the first speed. In this case, the first speed and the second speed are different according to the difference between the processing time required for the first main surface and the processing time required for the second main surface. This optimizes processing time for each facet. In addition, by optimizing the processing time of each main surface, the total time of the processing time of the first main surface and the processing time of the second main surface can also be shortened, and the burden on the processing unit can be reduced.

Example 9. In any of the devices in Examples 2 to 8, the turning unit may turn the substrate over at a transfer position where the substrate is transferred from the conveying device to the holding unit. In this case, it is not necessary to move the substrate from the transfer position to the turning position. Therefore, the substrate processing apparatus can be further miniaturized.

Example 10. In any of the devices in Examples 2 to 9, the turning portion can also clamp or adsorb the substrate and turn the substrate over.

Example 11. In any of the devices in Examples 2 to 10, the holding part may hold the substrate without covering the surface processed by the processing part among the first and second main surfaces. In this case, when the substrate is processed by the processing unit, it is less likely to produce an unprocessed area on the substrate. Therefore, the entire surface of each surface of the substrate can be processed.

1:Substrate processing system

2:Transportation device

2a:Carrying arm

2b: Shell

2c: Gate

3:Substrate processing device

10: Shell

20:Lifting part

21: Actuator

22: Lift pin

30: Holding part

32:Support piece

50: Turning part

52: Clamping member

56:Protrusion

60:Light irradiation part

61: Shell

62:Light source

A1,A2,A3: arrow

Ctr: Controller (Control Department)

W: Wafer (substrate)

Wa: Main side (first main side)

Wb: Main side (second main side)

Claims (9)

A substrate processing device includes: a holding part that holds a substrate transported by an external transportation device; and a processing part that is a first main surface of the substrate and a second main surface of the substrate that is the back surface of the first main surface. One of the surfaces performs a predetermined process; the driving part drives the holding part to move the substrate held in the holding part with respect to the processing part; the turning part is used to turn the substrate over; the housing moves the holding part , the processing part, the driving part and the flipping part are stored in the same storage space; and the control part controls the processing part, the driving part and the flipping part; the processing part is the first or the first for the substrate A light irradiation part that irradiates light on the second main surface; the control part executes the following program: controls the driving part so that the substrate is located near the light irradiation part and the light from the light irradiation part does not irradiate the substrate The light irradiation part is in a standby position, and the light irradiation part is controlled to start irradiation of light when the substrate is in a standby state in the standby position. The substrate processing device as claimed in claim 1, wherein the control part executes the following procedures in sequence: controlling the processing part and the driving part to process the first main surface through the processing part; controlling the turning part, To exchange the orientations of the first main surface and the second main surface by flipping the substrate; and The processing part and the driving part are controlled to process the second main surface by the processing part. The substrate processing device of claim 1, wherein the control unit sequentially executes the following procedures: controlling the flipping unit to exchange the orientations of the first main surface and the second main surface by flipping the substrate. ; Control the processing part and the driving part to process the second main surface by the processing part; Control the flipping part to exchange the orientations of the first main surface and the second main surface by flipping the substrate ; And control the processing part and the driving part to process the first main surface by the processing part. The substrate processing apparatus according to claim 2 or 3, wherein when the processing unit processes the first main surface, the control unit controls the driving unit to move the substrate to the processing unit at a first speed, and When the processing unit processes the second main surface, the driving unit is controlled to move the substrate to the processing unit at a second speed that is different from the first speed. The substrate processing apparatus according to any one of claims 1 to 3, wherein the standby position is different from the position where the substrate is turned over by the turning part. The substrate processing apparatus according to any one of claims 1 to 3, wherein the processing section is a light irradiation section that irradiates ultraviolet rays to the first or second main surface of the substrate. The substrate processing device as claimed in any one of claims 1 to 3, wherein the flipping part is in a transfer position for transferring the substrate from the conveying device to the holding part to flip the substrate. The substrate processing device as claimed in any one of claims 1 to 3, wherein the turning portion clamps or adsorbs the substrate and turns the substrate over. The substrate processing device according to any one of claims 1 to 3, wherein the holding part holds the substrate without covering the surface processed by the processing part among the first and second main surfaces. .

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