TWI468875B - Exposure unit and substrate exposure method - Google Patents

Description

Exposure unit and substrate exposure method

The present invention relates to an exposure unit including a plurality of exposure apparatus bodies and an exposure method of a substrate.

Conventionally, various types of exposure devices for manufacturing a color filter substrate or a TFT (Thin Film Transistor) substrate of a flat panel display device such as a liquid crystal display device or a plasma display device have been proposed. The exposure device holds the photomask by the mask holding portion and holds the substrate by the substrate holding portion, and the two are disposed adjacent to each other. Further, the reticle pattern drawn on the reticle is exposed and transferred to the substrate by illuminating the pattern exposure light from the mask side. Further, for example, in the case of manufacturing a color filter substrate, three BM (black matrix) layers, R (red), G (green), and B (blue) are sequentially used using four exposure apparatus main bodies. The colored layer is exposed to the substrate.

In the exposure apparatus described in Patent Documents 1 and 2, the substrate holding portion has a plurality of protrusions (embossing) on the adsorption surface that adsorbs and holds the substrate, and has a plurality of adsorption regions to be adjacent to each other. The isolation wall that isolates the adsorption zone. Further, the interval between the projections in the predetermined direction and the partition wall and the interval between the adjacent projections are set to a predetermined width, whereby the amount of deflection of the substrate is substantially equal, and the flatness of the substrate is improved to suppress the exposure. Uneven. Further, the substrate holding portion described in Patent Document 3 includes a peripheral portion surrounding the suction space, a plurality of projections provided in the suction space, and a support portion extending from the peripheral edge portion toward the projection, and the substrate is held at a preferable flatness.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] JP-A-2009-212344

[Patent Document 2] JP-A-2009-198641

[Patent Document 3] WO2006/025341

However, in the inside of the substrate holding portion, a cooling medium flows in order to cool the substrate, and when the substrate is held and held by the substrate holding portion, temperature changes occur on the substrate in a portion where the plurality of protrusions or the partition wall are in contact and the portion not in contact with the substrate. . In particular, in the portion of the substrate which is in contact with the continuous partition wall, there is a possibility that the temperature change of the portion which is not in contact with the portion becomes large, and a slight deformation occurs in the vicinity of the substrate which is in contact with the partition wall. Therefore, when a plurality of exposures are performed using a plurality of exposure device bodies, if the position of the portion in contact with the partition wall is uniform on the body of each exposure device, uneven exposure or exposure occurs at a corresponding position of the product that has been subjected to the plurality of exposures. The problem of deviation in distribution. Further, in the substrate holding portion described in Patent Documents 1 to 3, the above problems are not considered.

The present invention has been made in view of the above problems, and an object of the present invention is to provide an exposure unit and a substrate which can suppress occurrence of variations in exposure unevenness or exposure distribution caused by a partition wall even for products which have been subjected to a plurality of exposures. method.

According to an embodiment of the present invention, the exposure unit of the present invention sequentially exposes a plurality of patterns of the reticle to the substrate, and the exposure unit includes a plurality of exposure device bodies, and the plurality of exposure device bodies include a mask holding portion for holding the mask having the pattern, a substrate holding portion for adsorbing and holding the adsorption surface of the substrate, and an irradiation portion for irradiating the exposure light, wherein the plurality of exposure device bodies are irradiated with the exposure Exposing and transferring the pattern of the mask to the substrate by light; and providing a partition wall formed on the adsorption surface of the substrate holding portion for isolating the adjacent adsorption regions and abutting against the back surface of the substrate And a plurality of protrusions that can abut against the back surface of the substrate in each of the adsorption regions, wherein the adsorption surfaces of the substrate holding portions of the plurality of exposure device bodies have substantially the same outer shape, and the isolation of the substrate holding portions The wall is formed at a different position depending on the body of each of the above exposure devices.

According to an embodiment of the present invention, the exposure method of the present invention uses a plurality of exposure device bodies to sequentially expose the patterns of the reticle to the substrate, and the plurality of exposure device bodies include a reticle holding to maintain the reticle having the pattern. a portion having a substrate holding portion that adsorbs and holds the adsorption surface of the substrate, and an irradiation portion that irradiates the exposure light, and irradiates the pattern of the mask onto the substrate by irradiating the exposure light, and The exposure method includes the steps of: abutting the partition wall separating the adjacent adsorption regions of the adsorption surface from the back surface of the substrate at different positions of each of the exposure device bodies, by the plurality of The exposure device body sequentially exposes the substrate.

According to the exposure unit of the present invention, the partition walls formed on the respective adsorption faces of the plurality of exposure device bodies are formed in different bodies of each exposure device. Since the position is such that the product having been subjected to the plurality of exposures can suppress the unevenness of the exposure due to the partition wall or the deviation of the exposure distribution.

Moreover, according to the exposure method of the substrate of the present invention, since the partition walls of the substrate are in contact with the back surface of the substrate at different positions in the body of each exposure device, and are sequentially exposed by the plurality of exposure device bodies, even if The product which completes the plurality of exposures can also suppress the occurrence of variations in exposure unevenness or exposure distribution caused by the partition walls.

[First Embodiment]

Hereinafter, the exposure unit and the exposure method of the substrate according to the first embodiment of the present invention will be described in detail based on the drawings.

As shown in FIG. 1, the exposure unit 1 of the present invention comprises: a first adjacent exposure device body 2 for exposing the first layer; a second adjacent exposure device body 3 for exposing the second layer; and a third adjacent exposure The apparatus body 4 exposes the third layer; and the fourth adjacent exposure apparatus body 5 exposes the fourth layer. Further, the apparatus used in the pre-processing and post-processing steps such as the coater, the pre-alignment, and the development, and the transport apparatus for transporting the substrate are omitted. In addition, the first to fourth proximity exposure apparatus main bodies 2, 3, 4, and 5 may be configured such that the adsorption surfaces of the substrate holding portions described below are different. Therefore, only the first adjacent exposure apparatus main body 2 will be described in detail below. .

As shown in FIG. 2, the first proximity exposure apparatus body 2 includes a mask holding portion 10 that holds a mask M, a substrate holding portion 20 that holds a glass substrate (exposed material) W, and an illumination optical system 30 that functions as Irradiation mechanism for pattern exposure; substrate holding portion moving mechanism 40 that moves substrate holding portion 20 in the X-axis, Y-axis, and Z-axis directions, and performs tilt adjustment of substrate holding portion 20; and device substrate 50 that supports light The cover holding portion 10 and the substrate holding portion moving mechanism 40.

Further, the glass substrate W (hereinafter simply referred to as "substrate W") is disposed to face the mask M, and is used for exposure transfer of the mask pattern drawn on the mask M to the surface (mask M) The facing side is coated with a photosensitizer. Further, the photomask M contains fused silica and is formed in a rectangular shape.

For convenience of explanation, the illumination optical system 30 includes, for example, a high pressure mercury lamp 31 which is a light source for ultraviolet irradiation, and a concave mirror 32 which condenses light irradiated from the high pressure mercury lamp 31; The optical integrator 33 is rotatably disposed near the focus of the concave mirror 32; the plane mirrors 35, 36 and the spherical mirror 37 are used to change the direction of the optical path; and the exposure control shutter 34 is disposed on the plane mirror 36. The optical path is controlled between the optical integrator 33 and the optical path.

Further, in the illumination optical system 30, if the exposure control shutter 34 is subjected to the opening control at the time of exposure, the light irradiated from the high pressure mercury lamp 31 is vertically irradiated to the surfaces of the mask M and the substrate W through the optical path L shown in FIG. Therefore, it is used as parallel light for pattern exposure. Thereby, the mask pattern of the mask M is exposed and transferred onto the substrate W.

As shown in FIGS. 2 to 4, the mask holding portion 10 includes a mask holding portion base 11 having a rectangular opening portion 11a formed at a central portion thereof, and a mask holding frame 12 which is slidable on the X-axis and the Y-axis. The θ direction is movably attached to the opening 11a of the reticle holder base 11; the chuck portion 14 is attached to the reticle holding frame 12, and the reticle M is sucked and held; and the reticle position adjusting mechanism 16 The mask holding frame 12 and the chuck portion are moved in the X-axis, the Y-axis, and the θ direction, and the position of the mask M held by the mask holding frame 12 is adjusted.

The mask holding base 11 is supported by the support 51 that is erected on the apparatus base 50 and the Z-axis moving device 52 provided at the upper end of the support 51 in the Z-axis direction, and is disposed on the substrate. Above the department 20. The Z-axis moving device 52 includes, for example, an electric actuator including a motor and a ball screw, or an air compressor cylinder, and performs a simple upper and lower operation to raise and lower the mask holding portion 10 to a predetermined position. Further, the Z-axis moving device 52 is used when the photomask M is replaced or the workpiece chuck 21 is cleaned or the like.

The reticle position adjusting mechanism 16 includes: one Y-axis direction driving device 16y mounted on one side in the X-axis direction of the reticle holding frame 12; and two X-axis direction driving devices 16x, which are mounted on the reticle One side of the frame 12 in the Y-axis direction is maintained.

In the reticle position adjustment mechanism 16, the reticle holding frame 12 is moved in the Y-axis direction by driving one Y-axis direction driving device 16y, and the two X-axis direction driving devices 16x are driven in the same manner. The reticle holding frame 12 is moved in the X-axis direction. Further, the shutter holding frame 12 is moved in the θ direction (rotation around the Z axis) by driving either of the two X-axis direction driving devices 16x.

Further, as shown in FIG. 4, a gap sensor 17 for measuring a gap between the opposing faces of the mask M and the substrate W is provided on the upper surface of the mask holding base 11 and for confirming the holding on the chuck portion 14. The reticle of the mounting position of the reticle M is aligned with the camera 18. The gap sensor 17 and the aligning alignment camera 18 for the reticle are held in the X-axis and Y-axis directions via the moving mechanism 19, and are placed in the reticle holding frame 12.

Further, as shown in FIG. 4, on the upper surface of the base portion 11 of the mask holding portion 11, two ends of the mask M are provided on both ends of the opening portion 11a of the mask holding portion base 11 in the X-axis direction as needed. The end is shielded by a shadow aperture 38. The shielding aperture 38 is movable in the X-axis direction by a shield aperture driving mechanism 39 including a motor, a ball screw, and a linear guide, and adjusts the shielding area of both ends of the mask M. Further, the shielding hole 38 may be provided not only at both end portions of the opening portion 11a in the X-axis direction but also at both end portions of the opening portion 11a in the Y-axis direction.

As shown in FIGS. 2 and 3, the substrate holding portion 20 is disposed on the substrate holding portion moving mechanism 40, and includes a workpiece chuck 21 having a surface on the upper surface of the workpiece chuck 21 for holding the substrate W on the substrate. The adsorption surface 22 of the portion 20. Further, the workpiece chuck 21 holds the substrate W by vacuum suction.

As shown in FIGS. 2 and 3, the substrate holding portion moving mechanism 40 includes a Y-axis feeding mechanism 41 that moves the substrate holding portion 20 in the Y-axis direction, and an X-axis feeding mechanism 42 that causes the substrate holding portion 20 to The X-axis direction is moved; and the Z-tilt adjustment mechanism 43 performs the tilt adjustment of the substrate holding portion 20, and the substrate holding portion 20 is slightly moved in the Z-axis direction.

The Y-axis feed mechanism 41 includes a pair of linear guides 44 that are disposed on the upper surface of the apparatus base 50 in the Y-axis direction, and a Y-axis stage 45 that is movable in the Y-axis direction by the linear guides 44. Supported; and a Y-axis feed drive 46 that moves the Y-axis stage 45 in the Y-axis direction. By driving the motor 46c of the Y-axis feed driving device 46 and rotating the ball screw shaft 46b, the Y-axis table 45 is moved along with the ball screw nut 46a along the guide rail 44a of the linear guide 44, thereby The substrate holding portion 20 moves in the Y-axis direction.

Further, the X-axis feed mechanism 42 includes a pair of linear guides 47 which are disposed on the upper surface of the Y-axis stage 45 in the X-axis direction, and an X-axis table 48 which is available in the X-axis direction by the linear guide 47. Mobilely supported; and an X-axis feed drive 49 that moves the X-axis table 48 in the X-axis direction. By driving the motor 49c of the X-axis feed driving device 49 and rotating the ball screw shaft 49b, the X-axis table 48 is moved along the guide rail 47a of the linear guide 47 together with a ball screw nut (not shown). The substrate holding portion 20 is moved in the X-axis direction.

The Z-tilt adjustment mechanism 43 includes a motor 43a that is disposed on the X-axis stage 48, a ball screw shaft 43b that is rotationally driven by a motor 43a, and a wedge nut 43c that is formed in a wedge shape and screwed to the ball The screw shaft 43b and the wedge portion 43d are protruded from the lower surface of the substrate holding portion 20 in a wedge shape, and are engaged with the inclined surface of the wedge nut 43c. Further, in the present embodiment, the Z-tilt adjustment mechanism 43 is provided on one side of the X-axis direction of the X-axis stage 48 (the front side of FIG. 1), and one on the other end side (the back side of FIG. 2). Referring to FIG. 3), three units are provided in total, and each is independently driven and controlled. Furthermore, the number of Z-tilt adjustment mechanisms 43 is arbitrary.

Further, the Z-tilt adjustment mechanism 43 rotationally drives the ball screw shaft 43b by the motor 43a, thereby horizontally moving the wedge nut 43c in the X-axis direction, and the horizontal movement movement is performed by the wedge nut 43c and the wedge portion 43d. The bevel is switched to a high-precision upper and lower fretting motion, so that the wedge portion 43d is slightly moved in the Z direction. Therefore, by driving the three Z-tilt adjustment mechanisms 43 by only the same amount, the substrate holding portion 20 can be slightly moved in the Z-axis direction, and the three Z-tilt adjustment mechanisms 43 can be independently driven. The tilt adjustment of the substrate holding portion 20 is performed. Thereby, the position of the Z-axis and the oblique direction of the substrate holding portion 20 can be finely adjusted, and the mask M and the substrate W can be opposed to each other at a predetermined interval in parallel.

Further, as shown in FIG. 2 and FIG. 3, the first proximity exposure apparatus main body 2 is provided with a laser distance measuring device 60 which is a position measuring device for detecting the position of the substrate holding portion 20. The laser distance measuring device 60 measures the moving distance of the substrate holding portion 20 which is generated when the substrate holding portion moving mechanism 40 is driven.

The laser distance measuring device 60 includes an X-axis mirror 64 that is fixed to a stay (not shown) and disposed along a side surface of the substrate holding portion 20 in the X-axis direction; and a Y-axis mirror 65 for fixing The strut 71 is disposed along the side surface of the substrate holding portion 20 in the Y-axis direction; the X-axis distance measuring device (rangometer) 61 and the deflection measuring device (counter) 62 are disposed on the device substrate 50. The X-axis direction end portion irradiates the X-axis mirror 64 with the laser light (measuring light), and receives the laser light reflected by the X-axis mirror 64, thereby measuring the position of the substrate holding portion 20; and 1 Y A shaft range finder (range finder) 63 is disposed at an end portion of the apparatus base 50 in the Y-axis direction, irradiates the laser light to the Y-axis mirror 65, and receives the laser light reflected by the Y-axis mirror 65. Thereby, the position of the substrate holding portion 20 is measured.

Further, the laser ranging device 60 is irradiated to the X-axis mirror 64 and the Y-axis mirror 65 from the X-axis range finder 61, the deflection finder 62, and the Y-axis range finder 63 by X. The shaft mirror 64 and the Y-axis mirror 65 reflect the position of the substrate holding portion 20 in the X-axis and Y-axis directions with high precision. Further, the positional data in the X-axis direction is measured by the X-axis range finder 61, and the position in the θ direction is measured by the deflection measuring device 62. Further, the position of the substrate holding portion 20 is calculated by referring to the position in the X-axis direction, the position in the Y-axis direction, and the position in the θ direction measured by the laser distance measuring device 60, and is appropriately corrected.

Fig. 5(a) is a plan view schematically showing an adsorption surface of the workpiece chuck 21 of the first proximity exposure apparatus main body 2, and Fig. 5(b) is an enlarged view of a V portion of Fig. 5(a). On the adsorption surface 22 of the workpiece chuck 21, seven independent adsorption regions, that is, first to seventh adsorption regions 80a, ..., 80g are formed. The first adsorption region 80a in the center and the second adsorption region 80b on the outer side are separated by the first partition wall 81a having a rectangular shape, and the second adsorption region 80b and the third adsorption region 80c on the outer side are separated by the second shape of the quadrilateral shape. Wall 82a is isolated. Further, the third adsorption region 80c and the fourth to seventh adsorption regions 80d, 80e, 80f, and 80g of the four portions formed on the outer side are separated by the third partition wall 83a having a rectangular shape.

Therefore, the first adsorption region 80a is divided by the first partition wall 81a, the second adsorption region 80b is divided between the first and second partition walls 81a and 82a, and the third adsorption region 80c is divided into the second and second partition regions 80c. Between the third partition walls 82a and 83a. Further, the fourth to seventh adsorption regions 80d, ..., 80g are divided by the third partition wall 83a and the peripheral wall 84a which is the outer periphery of the adsorption surface 22. Further, the shape of the peripheral portion 84a corresponds to the size of the rectangular substrate W, and the adsorption of the fourth to seventh adsorption regions 80d to 80g is performed in accordance with the direction of the substrate W.

Further, a plurality of protrusions 85 having heights equivalent to the heights of the partition walls 81a, 82a, and 83a are formed in the respective adsorption regions 80a, ..., 80g, and the partition walls 81a, 82a, 83a and the protrusions 85 are It abuts against the back surface of the substrate W. Further, portions excluding the partition walls 81a, 82a, and 83a and the projections 85 are formed as the lower portions 86 of the respective adsorption regions 80a, ..., 80g. Further, the processing of the partition walls 81a, 82a, 83a and the protrusions 85 may be cutting of an end mill or the like, or may be shot peening.

Further, a plurality of positive and negative pressure holes 87a, ..., 87g are opened on the surfaces of the respective lower portions 86 in the respective adsorption regions 80a, ..., 80g. Further, when the substrate W is adsorbed, vacuum suction is performed from the positive and negative pressure holes 87a, ..., 87g, whereby the lower portions 86 of the respective adsorption regions 80a, ..., 80g, the partition walls 81a, The spaces surrounded by the 82a, 83a, the peripheral wall portion 84a, and the back surface of the substrate W are negative pressures. When the substrate W is unloaded, the substrate W is released from the atmosphere, and the atmosphere is released in the space or positive pressure is introduced from the positive and negative pressure holes 87a, ..., 87g. Further, when the substrate W is adsorbed, the deflection can be reduced by gradually proceeding outward from the first adsorption region 80a on the inner side. Further, when the substrate W is exposed, the vacuum suction may be performed by the positive and negative pressure holes 87a, ..., 87g, or the vacuum suction of each adsorption region may be released locally or collectively. In the state.

Further, a plurality of pin holes (not shown) are formed in the adsorption surface 22, and the pin holes are used to transfer the substrate W to the processing chuck 21 by a workpiece carrier (not shown) to cause the self-adsorption surface 22 A plurality of pins (not shown) that enter and exit can advance and retreat.

Furthermore, since the adsorption surface 22 has substantially the same outer dimensions in each of the adjacent exposure apparatus bodies 2, 3, 4, 5, as shown in Fig. 1, the outermost peripheral walls 84a, ..., 84d are located at The same is true in each of the adjacent exposure device bodies 2 to 5.

Here, as shown in FIG. 1, the first partition walls 81a, ..., 81d, the second partition walls 82a, ..., 82d, and the third partition of the first to fourth adjacent exposure apparatus bodies 2 to 5 are provided. The walls 83a, ..., 83d are formed at positions different from each other, respectively.

Therefore, when the first to fourth adjacent exposure apparatus main bodies 2 to 5 are used, the partition walls 81a, ..., ~81d, 82a which are in contact with the back surface of the substrate W are subjected to the exposure transfer of the first to fourth layers. The positions of ..., 82d, 83a, ..., 83d are different. 6 is a second portion of the VId portion of FIG. 1 and the first to third adjacent exposure device bodies 2 to 4 when the substrate W is placed on the adsorption surface 22 of the processing chuck 21 of the fourth proximity exposure device main body 5. The portions VIa to VId of Fig. 1 in which the third partition walls 82a, ..., 82c, 83a, ..., 83c are in contact with the substrate W are indicated by a single chain line overlap.

When the first to fourth proximity exposure apparatus main bodies 2, ..., 5 configured as described above are subjected to the exposure transfer of the first to fourth layers to the substrate W, the temperature is placed at the position of the partition wall by the temperature. The substrate is slightly deformed by the influence of the change, but the positions of the partition walls 81a, ..., -81d, 82a, ... 82d, 83a, ..., 83d are in the four exposure device bodies 2, ... Since the difference between the five and the fifth is not present on the substrate W, it is visually confirmed that the exposure is uneven, and the occurrence of variations in the exposure distribution can be suppressed. Further, the position of the substrate W which is in contact with the peripheral walls 84a, ..., 84d is transferred to the outside of the pattern region of the substrate W by pattern exposure, so that even the peripheral walls of the respective exposure device bodies 2, 3, 4, 5 The same position will not affect the exposure accuracy.

The present invention is not limited to the embodiments described above, and may be appropriately modified without departing from the spirit and scope of the invention.

In the above embodiment, the partition wall is formed by a continuous portion of a linear shape, and the projections are formed by a square shape, but may be changed into various shapes as shown in Figs. 7 and 8 .

For example, as shown in Figs. 7(a) to (h), the partition wall 90 may be constituted by a continuous portion 90a and an extending portion 90b extending in a direction orthogonal to the continuous portion 90a on both sides of the continuous portion 90a. . Thereby, the deflection of the non-contact portion of the substrate W in the vicinity of the partition wall 90 can be made small, and the gap amount between the mask M and the substrate W can be made more uniform, so that variations in exposure unevenness or exposure distribution can be suppressed.

Specifically, as shown in FIGS. 7(a), (d) to (h), the partition wall 90 may also be constituted by a continuous portion 90a and an extending portion 90b extending toward the protrusion 91 on both sides of the continuous portion 90a. As shown in Fig. 7(b), the extending portion 90b of the partition wall 90 may also be formed to extend to an intermediate position between the adjacent projections 91 in the direction in which the continuous portion 90a of the partition wall 90 extends. Further, as shown in Fig. 7(c), the extending portion 90b on one side of the continuous portion 90a may be extended to the projection 91, and the extending portion 90b on the other side may extend toward the intermediate position between the projections 91.

Further, as shown in Fig. 7 (d), Fig. 7 (f), and Fig. 7 (g), the continuous portion 90a between the adjacent extending portions 90b in the direction in which the continuous portion 90a extends may be formed according to the shape of the end mill In order to bend the shape, as shown in Fig. 7 (f), the continuous portion 90a may be connected in a zigzag shape instead of a straight line. Further, as shown in FIGS. 7(c), 7(d), and 7(e), the extending portion 90b may be formed on both sides of the continuous portion 90a in such a manner as to extend from each other, or in the drawing. In 7(e), the front end of the extended portion 90b is extended to constitute the projection 91.

Further, as shown in FIGS. 7(a) to 7(c), the interval between the projections 91 located in the vicinity of the partition wall 90 is made shorter than the interval between the projections 91 located at a portion separated from the partition wall 90. When the interval between the partition wall 90 and the adjacent protrusion 91 is large, there is a possibility that the deflection of the non-contact portion becomes large to cause uneven exposure, but as shown in FIGS. 7(a) to 7(c). As shown, by shortening the interval between the projections 91 located in the vicinity of the partition wall 90, the deflection of the non-contact portion can be reduced, and uneven exposure can be suppressed.

Further, as shown in Fig. 8(a), the partition wall 90 may be formed by a continuous portion 90a and a rectangular portion 90c which is separated from the continuous portion 90a and extends in a direction orthogonal to the continuous portion 90a on both sides of the continuous portion 90a. The configuration may be constituted by two or three continuous portions 90a as shown in Figs. 8(b) and 8(c). As described above, by forming the partition wall by the plurality of continuous portions 90a to disperse the contact portion with the substrate W, it is difficult to be affected by the temperature, whereby the deflection of the non-contact portion can be reduced.

Further, as shown in Figs. 8(d) to 8(g), the partition wall 90 may have a rectangular shape extending discontinuously along the continuous portion 90a by the continuous portion 90a, and on one side of the continuous portion 90a or both sides. The portion 90d, 90e or the wavy line portion 90f is constructed. That is, the partition wall 90 may be symmetrical with respect to the continuous portion 90a or may be asymmetrical.

Further, as shown in FIG. 8(h), the partition wall 90 may also arrange a plurality of rows such as a circular or square projection 90g so as to be buried in a gap between the adjacent projections 90g in the direction in which the partition wall 90 is formed, or as As shown in Fig. 8(i), the interval between the projections 90i is narrowed to concentrate the discontinuous projections 90g, 90i, thereby isolating the adjacent adsorption regions.

Further, the partition walls of the respective exposure apparatus main bodies may be in contact with each other without being completely overlapped with the back surface of the substrate, but may be partially overlapped and contacted. Further, the shape of the partition wall 90 described above can be used in combination as appropriate.

Further, in the present embodiment, the adsorption surface of each of the adjacent exposure apparatus bodies is different. However, the width of the peripheral edge portion on the outer side of the pattern region may be wide and the adsorption surfaces may be the same. And bonding the bonding position of the substrate to the plurality of adjacent exposure device bodies to be slightly offset. Thereby, the partition wall abuts against the back surface of the substrate at different positions in each of the exposure apparatus bodies, so that occurrence of variations in exposure unevenness or exposure distribution can be suppressed. Furthermore, the width of the peripheral portion is designed to be wider than the maximum offset between the plurality of adjacent exposure device bodies.

[Second Embodiment]

Next, an exposure method of an exposure unit and a substrate according to a second embodiment of the present invention will be described in detail with reference to FIGS. 9 to 17.

As shown in FIG. 9, the exposure unit 1 of the present invention comprises: a first adjacent exposure device body 2 for exposing the first layer; a second adjacent exposure device body 3 for exposing the second layer; and a third adjacent exposure The apparatus body 4 exposes the third layer; and the fourth adjacent exposure apparatus body 5 exposes the fourth layer. Further, the apparatus used in the pre-processing and post-processing steps such as the coater, the pre-alignment, and the development, and the transport apparatus for transporting the substrate are omitted. In addition, the first to fourth proximity exposure apparatus main bodies 2, 3, 4, and 5 may have different configurations in which the adsorption surfaces of the substrate holding portions are different. Therefore, only the first adjacent exposure apparatus main body 2 will be described in detail below. .

As shown in FIG. 10, the first proximity exposure apparatus main body 2 includes a mask holding portion 10 that holds a mask M, a substrate holding portion (substrate stage) 20 that holds a glass substrate (exposed material) W, and an illumination optical system. 30. Exposure light for exposure pattern exposure; substrate holding portion moving mechanism 40 for moving substrate holding portion 20 in X-axis, Y-axis, and Z-axis directions, and performing tilt adjustment of substrate holding portion 20; and device base 50, which supports the mask holding portion 10 and the substrate holding portion moving mechanism 40.

Further, the glass substrate W (hereinafter simply referred to as "substrate W") is disposed to face the mask M, and the surface of the mask M is oriented in order to perform exposure transfer on the mask pattern drawn on the mask M. The face side) is coated with a photosensitizer. Further, the photomask M contains fused silica and is formed in a rectangular shape.

For convenience of explanation, the illumination optical system 30 includes, for example, a high pressure mercury lamp 31 as a light source for ultraviolet irradiation, and a concave mirror 32 that condenses light irradiated from the high pressure mercury lamp 31; The optical integrator 33 is rotatably disposed near the focus of the concave mirror 32; the plane mirrors 35, 36 and the spherical mirror 37 are used to change the direction of the optical path; and the exposure control shutter 34 is disposed on the plane mirror 36. The optical integrator 33 is controlled to open and close with respect to the illumination optical path.

Further, in the illumination optical system 30, when the exposure control shutter 34 is subjected to the opening control at the time of exposure, the light irradiated from the high pressure mercury lamp 31 passes through the optical path L shown in FIG. 10, and is held in the light as a parallel light for pattern exposure. The mask M of the cover holding portion 10 and the surface of the substrate W held by the substrate holding portion 20 are vertically irradiated. Thereby, the mask pattern of the mask M is exposed and transferred onto the substrate W.

As shown in FIGS. 10 to 12, the mask holding portion 10 includes a mask holding portion base 11 having a rectangular opening portion 11a formed at a central portion thereof, and a mask holding frame 12 which is slidable on the X-axis and the Y-axis. And the opening portion 11a of the mask holding portion base 11 is movably moved in the θ direction; the chuck portion 14 is attached to the reticle holding frame 12, and the reticle holder absorbing and holding the reticle M; and the reticle position adjusting mechanism 16 for making light The cover holding frame 12 and the chuck portion are moved in the X-axis, the Y-axis, and the θ direction, and the position of the reticle M held by the reticle holding frame 12 is adjusted.

The mask holding portion base 11 is supported by the support 51 that is erected on the apparatus base 50 and the Z-axis moving device 52 provided at the upper end of the support 51, and is movably supported in the Z-axis direction. Above the department 20. The Z-axis moving device 52 includes, for example, an electric actuator including a motor and a ball screw, or an air compressor cylinder, and performs a simple upper and lower operation to raise and lower the mask holding portion 10 to a predetermined position. Further, the Z-axis moving device 52 is used when the mask M is replaced or the workpiece chuck 21 is cleaned or the like.

The reticle position adjusting mechanism 16 includes: one Y-axis direction driving device 16y mounted on one side in the X-axis direction of the reticle holding frame 12; and two X-axis direction driving devices 16x, which are mounted on the reticle One side of the frame 12 in the Y-axis direction is maintained.

In the reticle position adjustment mechanism 16, the reticle holding frame 12 is moved in the Y-axis direction by driving one Y-axis direction driving device 16y, and the two X-axis direction driving devices 16x are driven in the same manner. The reticle holding frame 12 is moved in the X-axis direction. Further, the shutter holding frame 12 is moved in the θ direction (rotation around the Z axis) by driving either of the two X-axis direction driving devices 16x.

Further, as shown in FIG. 12, a gap sensor 17 for measuring a gap between the opposing faces of the mask M and the substrate W is provided on the upper surface of the mask holding base 11 and for confirming the holding on the chuck portion 14. The reticle of the mounting position of the reticle M is aligned with the camera 18. The gap sensor 17 and the aligning alignment camera 18 for the reticle are held in the X-axis and Y-axis directions via the moving mechanism 19, and are placed in the reticle holding frame 12.

Further, as shown in FIG. 12, on the upper surface of the mask holding base 11, two ends of the mask M are provided on both ends of the opening portion 11a of the mask holding base 11 in the X-axis direction as needed. The end is shielded by a shadow aperture 38. The shielding aperture 38 is movable in the X-axis direction by a shield aperture driving mechanism 39 including a motor, a ball screw, and a linear guide, and adjusts the shielding area of both ends of the mask M. Further, the shielding hole 38 may be provided not only at both end portions of the opening portion 11a in the X-axis direction but also at both end portions of the opening portion 11a in the Y-axis direction.

As shown in FIGS. 10 and 11, the substrate holding portion 20 is provided on the substrate holding portion moving mechanism 40, and includes a workpiece chuck 21 having an upper surface on which the substrate W is held in the substrate holding portion. 20 adsorption surface 22. Further, the workpiece chuck 21 holds the substrate W by vacuum suction.

As shown in FIGS. 10 and 11, the substrate holding portion moving mechanism 40 includes a Y-axis feeding mechanism 41 that moves the substrate holding portion 20 in the Y-axis direction, and an X-axis feeding mechanism 42 that causes the substrate holding portion 20 to The X-axis direction is moved; and the Z-tilt adjustment mechanism 43 performs the tilt adjustment of the substrate holding portion 20, and the substrate holding portion 20 is slightly moved in the Z-axis direction.

The Y-axis feed mechanism 41 includes a pair of linear guides 44 which are disposed on the upper surface of the apparatus base 50 in the Y-axis direction, and a Y-axis stage 45 which is movable in the Y-axis direction by the linear guides 44. Supported; and a Y-axis feed drive 46 that moves the Y-axis stage 45 in the Y-axis direction. Further, the motor 46c of the Y-axis feed driving device 46 is driven, and the ball screw shaft 46b is rotated, whereby the Y-axis table 45 is moved along with the ball screw nut 46a along the guide rail 44a of the linear guide 44, and the substrate is moved. The holding portion 20 moves in the Y-axis direction.

Further, the X-axis feed mechanism 42 includes a pair of linear guides 47 which are disposed on the upper surface of the Y-axis stage 45 in the X-axis direction, and an X-axis table 48 which is available in the X-axis direction by the linear guide 47. Mobilely supported; and an X-axis feed drive 49 that moves the X-axis table 48 in the X-axis direction. Further, the motor 49c of the X-axis feed driving device 49 is driven to rotate the ball screw shaft 49b, whereby the X-axis table 48 is moved along the guide rail 47a of the linear guide 47 together with a ball screw nut (not shown). The substrate holding portion 20 is moved in the X-axis direction.

The Z-tilt adjustment mechanism 43 includes a motor 43a that is disposed on the X-axis stage 48, a ball screw shaft 43b that is rotationally driven by a motor 43a, and a wedge nut 43c that is formed in a wedge shape and screwed to the ball screw The shaft 43b and the wedge portion 43d are protruded from the lower surface of the substrate holding portion 20 in a wedge shape, and are engaged with the inclined surface of the wedge nut 43c. Further, in the present embodiment, the Z-tilt adjustment mechanism 43 is provided on one side of the X-axis direction of the X-axis stage 48 (the front side of FIG. 9), and one on the other side (the back side of FIG. 10). Referring to Fig. 11), three units are collectively provided, and each is independently driven and controlled. Furthermore, the number of Z-tilt adjustment mechanisms 43 is arbitrary.

Further, the Z-tilt adjustment mechanism 43 rotationally drives the ball screw shaft 43b by the motor 43a, whereby the wedge nut 43c is horizontally moved in the X-axis direction, and the horizontal movement movement is performed by the wedge nut 43c and the wedge portion 43d. The bevel acts to switch to the high-precision upper and lower fretting motion, so that the wedge portion 43d is slightly moved in the Z direction. Therefore, by driving the three Z-tilt adjustment mechanisms 43 by only the same amount, the substrate holding portion 20 can be slightly moved in the Z-axis direction, and the three Z-tilt adjustment mechanisms 43 can be independently driven. The tilt adjustment of the substrate holding portion 20 is performed. Thereby, the position of the Z-axis and the oblique direction of the substrate holding portion 20 can be finely adjusted, and the mask M and the substrate W can be opposed to each other at a predetermined interval in parallel.

Further, as shown in FIG. 10 and FIG. 11, the first proximity exposure apparatus main body 2 is provided with a laser distance measuring device 60 which is a position measuring device that detects the position of the substrate holding portion 20. The laser distance measuring device 60 measures the moving distance of the substrate holding portion 20 which is generated when the substrate holding portion moving mechanism 40 is driven.

The laser distance measuring device 60 includes an X-axis mirror 64 that is fixed to a side surface of the substrate holding portion 20 in the X-axis direction by being fixed to a stay (not shown), and a Y-axis mirror 65 for fixing The support 71 is disposed along the side surface of the substrate holding portion 20 in the Y-axis direction; the X-axis range finder (rangometer) 61 and the deflection measuring device (rangometer) 62 are disposed on the device substrate 50. The X-axis direction end portion irradiates the X-axis mirror 64 with the laser light (measuring light), and receives the laser light reflected by the X-axis mirror 64, thereby measuring the position of the substrate holding portion 20; and 1 Y A shaft range finder (range finder) 63 is disposed at an end portion of the apparatus base 50 in the Y-axis direction, irradiates the laser light to the Y-axis mirror 65, and receives the laser light reflected by the Y-axis mirror 65. Thereby, the position of the substrate holding portion 20 is measured.

Further, the laser ranging device 60 is irradiated to the X-axis mirror 64 and the Y-axis mirror 65 from the X-axis by the X-axis range finder 61, the deflection finder 62, and the Y-axis range finder 63. The mirror 64 and the Y-axis are reflected by the mirror 65, and the positions of the substrate holding portion 20 in the X-axis and Y-axis directions are measured with high precision. Further, the positional data in the X-axis direction is measured by the X-axis range finder 61, and the position in the θ direction is measured by the deflection measuring device 62. Further, the position of the substrate holding portion 20 is calculated by referring to the position in the X-axis direction, the position in the Y-axis direction, and the position in the θ direction measured by the laser distance measuring device 60, and is appropriately corrected.

Fig. 13 is a plan view schematically showing an adsorption surface of the workpiece chuck 21 of the first proximity exposure apparatus main body 2. On the adsorption surface 22 of the workpiece chuck 21, 13 separate adsorption regions, that is, first to thirteenth adsorption regions 800a, ..., 800m are formed. The first adsorption region 800a is isolated by the first partition wall 810a having a quadrangular shape, and the second to ninth adsorption regions 800b to 800i are sequentially adjacent to the first adsorption region 800a and separated by the partition walls 810b to 810i, and are disposed. In a matrix. The partition wall 810b of the second adsorption region 800b adjacent to the partition wall 810a of the first adsorption region 800a is a wall in which the adjacent portions are common. Further, the partition wall 810d of the fourth adsorption region 800d adjacent to the partition wall 810a of the first adsorption region 800a is also a wall in which the adjacent portions are common. Further, the other adsorption regions are also provided in the same manner.

Around the first adsorption region 800a to the ninth adsorption region 800i, the tenth surrounding adsorption region 800j to the thirteenth surrounding adsorption region 800m are isolated by the partition walls 810j to 810m, and are formed in a rectangular shape. The partition wall 810g of the seventh adsorption region 800g adjacent to the partition wall 810j of the tenth surrounding adsorption region 800j, the partition wall 810h of the eighth adsorption region 800h, and the partition wall 810i of the ninth adsorption region 800i are common to the adjacent portions thereof. The wall. The same applies to other surrounding adsorption areas. Further, the tenth surrounding adsorption region 800j to the thirteenth surrounding adsorption region 800m correspond to the size of the rectangular substrate W, and are used depending on the direction of the substrate W.

14(A) to 14(D) are enlarged views of respective portions of the A portion, the B portion, the C portion, and the D portion of Fig. 13. A plurality of protrusions 85 having heights equivalent to the heights of the partition walls 810a, ..., 810m are formed in each of the adsorption regions 800a, ..., 800m, and the partition walls 810a, ..., 810m and protrusions are formed. 85 can abut on the back surface of the substrate W. Further, the portions excluding the partition walls 810a, ..., 810m and the projections 85 are the lower portions 86 of the respective adsorption regions 800a, ..., 800g. Furthermore, the processing of the partition walls 810a, ..., 810m and the protrusions 85 may be cutting of an end mill or the like, or may be shot peening.

Further, a plurality of positive and negative pressure holes 87 are formed on the surfaces of the respective lower portions 86 in the respective adsorption regions 800a, ..., 800m. Further, when the substrate W is adsorbed, vacuum suction is performed from the positive and negative pressure holes 87, whereby the lower portions 86 of the respective adsorption regions 800a, ..., 800m, the partition walls 810a, ..., 810m, and The space surrounded by the surrounding adsorption regions 800j, ..., 800m, and the back surface of the substrate W becomes a negative pressure. When the substrate W is unloaded, in order to facilitate the detachment of the substrate W, the atmosphere is released in the space or a positive pressure is introduced from the positive and negative pressure holes 87.

Fig. 15(B) shows a substrate W (solid line) placed on the adsorption surface 22 (slight chain line) of the workpiece chuck 21 of the first proximity exposure apparatus main body 2 shown in Fig. 15(A). Moreover, the oblique line portion of the substrate W of Fig. 15(B) indicates the sections Se1 to Se4 of exposure. In this case, the substrate W is used in a so-called vertical position, and the first adsorption region 800a to the ninth adsorption region 800i, the tenth surrounding adsorption region 800j, and the twelfth peripheral adsorption region 8001 are used as the adsorption region.

These adsorption zones are controlled by the adsorption control unit 70a (see FIG. 10) provided in the control unit 70 (see FIG. 10). The adsorption control unit 70a controls the adsorption region corresponding to the irradiation region of the exposure light independently of the other adsorption regions. For example, the adsorption region corresponding to the exposure light irradiation region can be controlled to be non-adsorbed, and the adsorption region corresponding to the exposure light irradiation region can be further subjected to pressure reduction control than the other adsorption regions.

The adsorption control of the substrate W when the sections Se1 to Se4 of the substrate W are exposed will be described with reference to FIGS. 16(A) to 16(D).

First, as shown in FIG. 16(A), the exposure light is irradiated to the section Se1, whereby the section Se1 is exposed, but the first adsorption zone 800a and the second adsorption immediately below the section Se1 (exposure light irradiation zone) are formed. The region 800b, the fourth adsorption region 800d, and the fifth adsorption region 800e are controlled to be in a non-adsorbed state. On the other hand, the third adsorption region 800c, the sixth adsorption region 800f, the seventh adsorption region 800g, the eighth adsorption region 800h, and the ninth adsorption region 800i of the L-line portion Q1 other than the interval Se1 (exposure light irradiation region) are shown. Controlled to an adsorption state. In this case, the 10th surrounding adsorption zone 800j and the 12th surrounding adsorption zone 800l may or may not be adsorbed. As described above, since the adsorption of the adsorption region directly under the irradiation light irradiation region is not performed, the deformation of the substrate due to the adsorption can be avoided.

Then, the substrate holding portion 20 is stepwise moved in the X-axis direction by the substrate holding portion moving mechanism 40, and as shown in FIG. 16(B), the exposure light is irradiated to the interval Se2, whereby the interval Se2 is exposed, but this is The third adsorption region 800c, the second adsorption region 800b, the sixth adsorption region 800f, and the fifth adsorption region 800e directly below the time interval Se2 (exposure light irradiation region) are controlled to be in a non-adsorption state. On the other hand, the first adsorption region 800a, the fourth adsorption region 800d, the seventh adsorption region 800g, the eighth adsorption region 800h, and the ninth adsorption region 800i of the L-line portion Q2 other than the interval Se2 (exposure light irradiation region) are shown. Controlled to an adsorption state.

Further, the switching of the adsorption region is performed after the end of the exposure of the section Se1 and before the stepwise movement to the section Se2. In this way, it is possible to prevent the substrate W from being shifted during stepping.

Then, the substrate holding portion 20 is stepwise moved in the Y-axis direction by the substrate holding portion moving mechanism 40, and as shown in FIG. 16(C), the exposure light is irradiated to the interval Se3, whereby the interval Se3 is exposed, but this is The ninth adsorption region 800i, the eighth adsorption region 800h, the sixth adsorption region 800f, and the fifth adsorption region 800e immediately below the time interval Se3 (exposure light irradiation region) are controlled to be in a non-adsorption state. On the other hand, the seventh adsorption region 800g, the fourth adsorption region 800d, the first adsorption region 800a, the second adsorption region 800b, and the twelfth adsorption region 8001 of the L-line portion Q3 other than the interval Se3 (exposure light irradiation region) are shown. Controlled to an adsorption state.

Then, the substrate holding portion 20 is stepwise moved in the X-axis direction by the substrate holding portion moving mechanism 40, and as shown in FIG. 16(D), the exposure light is irradiated to the section Se4, whereby the section Se4 is exposed. The seventh adsorption region 800g, the eighth adsorption region 800h, the fourth adsorption region 800d, and the fifth adsorption region 800e immediately below the time interval Se4 (exposure light irradiation region) are controlled to be in a non-adsorption state. On the other hand, the first adsorption region 800a, the second adsorption region 800b, the third adsorption region 800c, the sixth adsorption region 800f, and the ninth adsorption region of the L-line portion Q4 other than the interval Se4 (exposure light irradiation region) are shown. The 800i is controlled to the adsorption state.

Further, in the above embodiment, the adsorption region has been switched before the stepping, but the adsorption region may be switched during the stepping. The reason for this is that it is sufficient to have an adsorption region that is always in an adsorption state during the stepping, and further, it is sufficient to adsorb any of the adsorption regions other than the exposure light irradiation region.

For example, when stepping from the interval Se1 to the interval Se2, the seventh adsorption region 800g, the eighth adsorption region 800h, and the ninth adsorption region 800i are always in an adsorption state, so that the third adsorption region 800c and the sixth adsorption region are obtained. The region 800f switches the adsorption control to the first adsorption region 800a and the fourth adsorption region 800d.

Further, in FIGS. 17(A) and 17(B), one substrate W is exposed to four sections (so-called four faces), but the present invention is not limited thereto, and can be applied to all incidental surfaces. For example, Fig. 16(A) is a case where the substrate W (the substrate which is long in the lateral direction) with six faces is placed horizontally, and the adsorption system at the time of exposure is performed in the same manner as in the above embodiment. In this case, the eleventh surrounding adsorption region 800k and the thirteenth surrounding adsorption region 800m are used. Further, Fig. 17(B) shows that the substrate W (the substrate having a long length in the longitudinal direction) with six faces is placed vertically, and the adsorption system at the time of exposure is performed in the same manner as in the above embodiment. In this case, the tenth surrounding adsorption region 800j and the twelfth surrounding adsorption region 800l are used.

Further, a plurality of pin holes (not shown) are formed in the adsorption surface 22, and the pin holes are formed on the self-adsorption surface 22 when the substrate W is transported to the workpiece chuck 21 by a workpiece carrier (not shown). A plurality of pins (not shown) that enter and exit can advance and retreat.

When the first to fourth adjacent exposure apparatus bodies 2, ..., 5 configured as described above are subjected to the exposure transfer of the first to fourth layers to the substrate W, the position of the partition wall is affected by the temperature change. Further, the substrate is slightly deformed, but there is no deformation of the substrate due to the adsorption of the substrate. Therefore, it is not visually recognized as uneven exposure on the substrate W, and variation in exposure distribution can be suppressed. It is to be noted that the present invention is not limited to the above-described embodiments, and may be appropriately modified without departing from the spirit and scope of the invention.

In the above embodiment, the partition walls 810a to 810i of the first to ninth adsorption regions 800a to 800i are formed in a non-linear wave shape, and the surrounding partition walls 810j, around the surrounding adsorption regions 800j, ..., 800m. . . . , 810m is formed by a continuous portion of a straight line shape, but the partition walls 810a to 810i of the first to ninth adsorption regions 800a to 800i may also be formed in a straight line, and the surrounding adsorption regions 800j, ..., 800m The surrounding partition walls 810j, ~, 810m may also be formed by a continuous portion that is not a straight line, that is, a wave shape. Further, the protrusions are each formed by a circular shape, but may be formed in a square shape, and a variety of shapes can be used.

The present application is based on a Japanese patent application filed on November 25, 2009 (Japanese Patent Application No. 2009-267918), and Japanese Patent Application No. 2010-016087, filed on Jan. The content is incorporated herein by reference.

1. . . Exposure unit

2. . . First proximity exposure device body

3. . . Second proximity exposure device body

4. . . Third proximity exposure device body

5. . . 4th proximity exposure device body

10. . . Mask holder

11. . . Photomask holder base

11a. . . Opening

12. . . Mask retaining frame

12b. . . Opening

14. . . Chuck section

16. . . Mask position adjustment mechanism

16x. . . X-axis direction drive

16y. . . Y-axis direction drive

17. . . Gap sensor

18. . . Photomask with alignment camera

19. . . Mobile agency

20. . . Substrate holding unit

twenty one. . . Workpiece chuck

twenty two. . . Adsorption surface

30. . . Lighting optical system

31. . . High pressure mercury lamp

32. . . concave mirror

33. . . Optical integrator

34. . . Exposure control shutter

35, 36. . . Plane mirror

37. . . Spherical mirror

38. . . Shadow aperture

39. . . Shielding aperture drive mechanism

40. . . Substrate holding portion moving mechanism

41. . . Y-axis feed mechanism

42. . . X-axis feed mechanism

43. . . Z-tilt adjustment mechanism

43a, 46c, 49c. . . motor

43b, 46b, 49b. . . Ball screw shaft

43c. . . Wedge nut

43d. . . Wedge

44, 47. . . Linear guide

44a, 47a. . . Guide track

45. . . Y-axis platform

46. . . Y-axis feed drive

46a. . . Ball screw nut

48. . . X-axis platform

49. . . X-axis feed drive

50. . . Device base

51. . . pillar

52. . . Z-axis mobile device

60. . . Laser distance measuring device

61. . . X-axis range finder

62. . . Deflection tester

63. . . Y-axis range finder

64. . . X-axis mirror

65. . . Y-axis mirror

70. . . Control department

70a. . . Adsorption control unit

71. . . Pole

80a. . . First adsorption zone

80b. . . Second adsorption zone

80c. . . Third adsorption zone

80d. . . 4th adsorption zone

80e. . . Fifth adsorption zone

80f. . . 6th adsorption zone

80g. . . 7th adsorption zone

81a, 81b, 81c, 81d. . . First partition

82a, 82b, 82c, 82d. . . Second partition

83a, 83b, 83c, 83d. . . Third partition wall

84a, 84b, 84c, 84d. . . Peripheral wall

85, 90g, 90i, 91. . . Protrusion

86. . . Lower part

87, 87a, 87b, 87c, 87d, 87e, 87f, 87g. . . Positive and negative pressure hole

90. . . Off the wall

90a. . . Continued section

90b. . . Stretching part

90c, 90d, 90e. . . Rectangular part

90f. . . Wavy line section

800a. . . First adsorption zone

800b. . . Second adsorption zone

800c. . . Third adsorption zone

800d. . . 4th adsorption zone

800e. . . Fifth adsorption zone

800f. . . 6th adsorption zone

800g. . . 7th adsorption zone

800h. . . 8th adsorption zone

800i. . . Ninth adsorption zone

800j. . . 10th adsorption zone

800k. . . 11th adsorption zone

800l. . . 12th adsorption zone

800m. . . 13th adsorption zone

810a. . . First partition

810b. . . Second partition

810c. . . Third partition wall

810d. . . 4th partition wall

810e. . . Fifth partition wall

810f. . . 6th partition wall

810g. . . 7th partition wall

810h. . . 8th partition wall

810i. . . 9th partition wall

810j. . . 10th surrounding wall

810k. . . 11th surrounding wall

810l. . . 12th surrounding wall

810m. . . 13th surrounding wall

L. . . Light path

M. . . Mask

Q1, Q2, Q3, Q4. . . L word line

Se1, Se2, Se3, Se4. . . Interval

V, VIa, VIb, VIc, VId. . . section

W. . . Glass substrate (exposed material)

X, Y, Z. . . direction

1 is a schematic view showing an exposure unit of a first embodiment of the present invention;

Figure 2 is a partially exploded perspective view showing the proximity exposure device body applied to the exposure unit of Figure 1;

Figure 3 is a front elevational view of the body of the proximity exposure device shown in Figure 2;

Figure 4 is an enlarged perspective view of the reticle holding portion shown in Figure 2;

Figure 5 (a) is a front view of the substrate holding portion shown in Figure 1, and (b) is an enlarged view of a portion V of (a);

6 is an enlarged view showing a portion VIa to VId of the substrate holding portion of each of the adjacent exposure device bodies of FIG. 7;

7(a) to 7(h) are views showing various modifications of the projections and the partition walls;

8(a) to (i) are views showing various modifications of the partition wall;

Figure 9 is a schematic view showing an exposure unit of a second embodiment of the present invention;

Figure 10 is a partially exploded perspective view showing the proximity exposure device applied to the exposure unit of Figure 9;

Figure 11 is a front elevational view of the proximity exposure device shown in Figure 10;

Figure 12 is an enlarged perspective view of the reticle holding portion shown in Figure 10;

Figure 13 is a front elevational view of the substrate holding portion shown in Figure 9;

14(A) is an enlarged view of a portion A of FIG. 13, (B) is an enlarged view of a portion B of FIG. 13, (C) is an enlarged view of a portion C of FIG. 13, and (D) is an enlarged view of a portion D of FIG. 13;

15(A) to 15(B) are views showing a substrate in a front view of the substrate holding portion shown in FIG. 9;

16(A) to (D) are diagrams showing the state of adsorption of the substrate when the substrate has been stepped; and

17(A) to 17(B) are views showing a state in which substrates of different types are arranged in the front view of the substrate holding portion shown in Fig. 9.

82a, 82b, 82c, 82d. . . Second partition

83a, 83b, 83c, 83d. . . Third partition wall

Claims (6)

An exposure unit, characterized in that a pattern of a plurality of reticle is sequentially exposed and transferred to a substrate, and the exposure unit includes exposing a pattern of the reticle to the substrate by irradiating the exposure light. a plurality of exposure apparatus bodies, the plurality of exposure apparatus bodies including: a mask holding portion that holds the photomask having the pattern; a substrate holding portion having an adsorption surface that adsorbs and holds the substrate; and an irradiation portion Irradiating the exposure light; providing a separation wall formed by isolating adjacent adsorption regions and abutting against a back surface of the substrate on the adsorption surface of the substrate holding portion, and being capable of abutting in each of the adsorption regions a plurality of protrusions connected to the back surface of the substrate, the adsorption surfaces of the substrate holding portions of the plurality of exposure device bodies have substantially the same outer dimensions, and the partition walls of the substrate holding portions are formed in each of the exposure devices a position different from the body; the height of the plurality of protrusions is equal to the height of the partition wall; the substrate is held in the atmosphere The exposure unit according to claim 1, wherein the adsorption surface of the substrate holding portion is provided with an adsorption control unit that controls adsorption or non-adsorption of each of the adsorption regions, and the adsorption control unit irradiates the exposure light. The adsorption zone corresponding to the zone is controlled independently of the other adsorption zones. The exposure unit of claim 2, wherein The adsorption control unit controls the adsorption region corresponding to the irradiation region to be non-adsorbed. The exposure unit of claim 2, wherein the adsorption control unit controls the adsorption region corresponding to the irradiation region of the exposure light to be decompressed from the other adsorption regions. An exposure method, characterized in that it is a method for exposing a pattern of each mask to a substrate of a substrate by using a plurality of exposure device bodies, the plurality of exposure device bodies comprising a mask for holding the mask of the pattern a holding portion, a substrate holding portion that adsorbs and holds the adsorption surface of the substrate, and an irradiation portion that irradiates the exposure light, and irradiates the pattern of the mask onto the substrate by irradiating the exposure light, and The exposure method includes the steps of: abutting a partition wall that separates adjacent adsorption regions of the adsorption surface from a back surface of the substrate at a position different from each of the exposure device bodies by the plurality of The exposure apparatus body sequentially exposes the substrate; wherein a plurality of protrusions are formed in each of the adsorption regions, and the heights of the plurality of protrusions are equal to the height of the partition wall; and the substrate is held in the atmosphere. The exposure method of claim 5, wherein the adsorption region corresponding to the irradiation region of the exposure light is controlled independently of the other adsorption regions.