TWI436173B - Exposure device - Google Patents

Exposure device Download PDF

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Publication number
TWI436173B
TWI436173B TW100121322A TW100121322A TWI436173B TW I436173 B TWI436173 B TW I436173B TW 100121322 A TW100121322 A TW 100121322A TW 100121322 A TW100121322 A TW 100121322A TW I436173 B TWI436173 B TW I436173B
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reticle
mask
holder
exposure apparatus
holders
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TW100121322A
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Chinese (zh)
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TW201207574A (en
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Shinichiro Hayashi
Yasutaka Kiriu
Satoru Togawa
Masaaki Matsuzaka
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Nsk Technology Co Ltd
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70716Stages
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70783Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Description

曝光裝置Exposure device

本發明係關於一種曝光裝置,更詳細而言,係關於一種可應對大小及吸附裕度不同之複數個光罩之曝光裝置。The present invention relates to an exposure apparatus, and more particularly to an exposure apparatus that can cope with a plurality of reticles having different sizes and adsorption margins.

液晶顯示裝置之TFT(thin film transistor,薄膜電晶體)基板或彩色濾光片基板、電漿顯示面板用基板等係藉由使用曝光裝置對塗佈有光阻劑之基板經由光罩照射曝光光而將光罩之圖案轉印至基板上而製造。曝光裝置之光罩固持器中設置有吸附槽,將光罩之緣部真空吸附於該吸附槽而保持光罩。A TFT (thin film transistor) substrate, a color filter substrate, a plasma display panel substrate, or the like of a liquid crystal display device is irradiated with a photoresist through a photomask by using an exposure device. The pattern of the photomask is transferred onto the substrate to be manufactured. The reticle holder of the exposure device is provided with an adsorption groove, and the edge of the reticle is vacuum-adsorbed to the adsorption groove to hold the reticle.

先前,尺寸不同之基板之曝光係根據光罩之大小更換曝光裝置之光罩固持器而進行,但光罩固持器之更換花費時間,作業效率上存在問題。對此,已知有由1個光罩固持器應對複數尺寸之光罩之曝光裝置(例如參照專利文獻1~3)。Previously, exposure of substrates having different sizes was performed by replacing the mask holder of the exposure apparatus according to the size of the mask, but replacement of the mask holder took time and there was a problem in work efficiency. In this regard, an exposure apparatus for a photomask having a plurality of sizes by a single mask holder has been known (for example, refer to Patent Documents 1 to 3).

專利文獻1中所記載之曝光裝置係藉由將光罩固持器分割成保持光罩之周邊部之複數個獨立之固持器部而形成,並根據光罩之大小使固持器部移動,從而可於短時間內應對尺寸不同之光罩。又,專利文獻2中所記載之掃描投影曝光裝置包含使光罩移動之光罩台、僅吸附保持光罩之2邊之吸附保持組件、及可選擇性地進出於光罩台上之複數個光罩定位用碰觸銷,且應對尺寸不同之複數個光罩。The exposure apparatus described in Patent Document 1 is formed by dividing a mask holder into a plurality of independent holder portions that hold the peripheral portion of the mask, and moving the holder portion according to the size of the mask. Respond to different sizes of reticle in a short time. Further, the scanning projection exposure apparatus described in Patent Document 2 includes a photomask stage for moving the photomask, an adsorption holding unit for adsorbing only two sides of the photomask, and a plurality of selectively movable in the mask stage. The mask is positioned with a touch pin, and a plurality of masks of different sizes are required.

又,專利文獻3中所記載之曝光裝置之光罩保持機構係藉由以特定間距設置於光罩之各長邊側之3處、合計6處夾頭部而保持光罩之長邊側,抑制光罩之固有振動數之下降,並且應對尺寸不同之複數個光罩。In the mask holding mechanism of the exposure apparatus described in Patent Document 3, the long side of the mask is held by a total of six clips at three positions on the long sides of the mask at a predetermined pitch. The reduction in the number of natural vibrations of the mask is suppressed, and a plurality of masks having different sizes are dealt with.

另一方面,周邊部真空吸附於光罩固持器而保持之光罩由於其自身重量,中央部分下垂而產生彎曲,因此光罩之平坦度未得到維持,結果存在光罩與基板間之間隙發生變化,對曝光精度造成較大影響之虞。為應付該問題,揭示有如下之曝光裝置:對隔著墊片安裝於光罩台之下表面之光罩固持器藉由外力賦予機構賦予外力而使光罩固持器變形為凸狀,藉此賦予光罩歪斜角、即相對於光罩固持器之水平方向之傾斜角而校正光罩之平坦度(例如參照專利文獻4)。On the other hand, the visor that is vacuum-adsorbed to the reticle holder by the peripheral portion is bent due to its own weight, and the flatness of the reticle is not maintained. As a result, the gap between the reticle and the substrate occurs. Changes, which have a greater impact on exposure accuracy. In order to cope with this problem, there is disclosed an exposure apparatus that deforms a mask holder into a convex shape by applying an external force to an external force applying mechanism to a mask holder attached to a lower surface of a mask table via a spacer. The slant angle of the reticle, that is, the inclination angle with respect to the horizontal direction of the reticle holder is given, and the flatness of the reticle is corrected (for example, refer to Patent Document 4).

先前技術文獻Prior technical literature 專利文獻Patent literature

專利文獻1:日本專利特開2009-210920號公報Patent Document 1: Japanese Patent Laid-Open Publication No. 2009-210920

專利文獻2:日本專利特開2006-5139號公報Patent Document 2: Japanese Patent Laid-Open No. 2006-5139

專利文獻3:日本專利特開2008-58789號公報Patent Document 3: Japanese Patent Laid-Open Publication No. 2008-58789

專利文獻4:日本專利特開2006-178318號公報Patent Document 4: Japanese Patent Laid-Open No. 2006-178318

專利文獻1中所揭示之曝光裝置無需更換光罩固持器便可應對尺寸不同之複數個光罩,但由於不包括校正平坦度之機構,因此無法高精度曝光轉印光罩之圖案,又,於使用尺寸不同之光罩之情形時,光罩與基板間之間隙亦因光罩之更換而發生變化,有可能對曝光精度造成不良影響。又,專利文獻4所揭示之曝光裝置藉由賦予光罩歪斜角而實現光罩之平坦度之改善,但無針對不同尺寸之光罩之記載,存在無法應對複數尺寸之光罩之問題,有改善餘地。The exposure apparatus disclosed in Patent Document 1 can cope with a plurality of reticles having different sizes without replacing the reticle holder, but since the mechanism for correcting the flatness is not included, the pattern of the transfer reticle cannot be exposed with high precision, and When a reticle of a different size is used, the gap between the reticle and the substrate is also changed by the replacement of the reticle, which may adversely affect the exposure accuracy. Further, the exposure apparatus disclosed in Patent Document 4 achieves an improvement in the flatness of the reticle by imparting a slant angle of the reticle. However, there is no description of the reticle of different sizes, and there is a problem that the reticle of a plurality of sizes cannot be handled. Improve room for improvement.

又,一般而言,對於形成光罩圖案之光罩用玻璃基板,使用複數種大小者,又,光罩圖案之大小藉由製品之大小或圖案化而決定,存在尺寸不同之複數個圖案。因此,選擇使用對將所期望之光罩圖案圖案化之最佳尺寸之光罩用玻璃基板。因此,藉由圖案化而有圖案以外之部分、即可作為光罩之吸附裕度使用之區域不同之情形。另一方面,由於光罩價格較高,因此強烈要求確實吸附保持於光罩固持器而防止因下落等所致之損傷。Further, in general, a plurality of sizes are used for the glass substrate for a photomask which forms a mask pattern, and the size of the mask pattern is determined by the size or pattern of the product, and a plurality of patterns having different sizes are present. Therefore, it is selected to use a glass substrate for a photomask which is an optimum size for patterning a desired mask pattern. Therefore, a portion other than the pattern by patterning can be used as a region in which the adsorption margin of the mask is used. On the other hand, since the price of the photomask is high, it is strongly required to be surely adsorbed and held by the photomask holder to prevent damage due to dropping or the like.

專利文獻1中所揭示之曝光裝置藉由使獨立分割形成之固持器部根據光罩之大小移動,而無需更換光罩固持器便可應對尺寸不同之複數個光罩,但即便用於吸附保持設置於固持器部之光罩之吸附槽之大小固定,例如,可於光罩上設定較大面積之吸附裕度,亦可僅由設置於固持器部之大小之吸附槽吸附保持,自確實保持光罩防止因光罩下落所致之破損之觀點而言,有改善餘地。又,專利文獻2所揭示之掃描投影曝光裝置僅可吸附保持光罩之長邊側之2邊,存在與專利文獻1相同之問題。The exposure apparatus disclosed in Patent Document 1 can move a plurality of masks of different sizes by moving the holder portion formed by independent division according to the size of the mask, but it is used for adsorption retention even without replacing the mask holder. The size of the adsorption groove of the photomask provided in the holder portion is fixed. For example, the adsorption margin of a large area can be set on the photomask, or it can be adsorbed and held only by the adsorption groove provided in the size of the holder portion. There is room for improvement in terms of maintaining the mask to prevent damage due to the falling of the mask. Further, the scanning projection exposure apparatus disclosed in Patent Document 2 can adsorb and hold only the two sides of the long side of the mask, and has the same problem as that of Patent Document 1.

進而,如圖35(a)所示,專利文獻1所揭示之曝光裝置藉由以獨立之4個固持器部Ha、Hb、Hc、Hd(其中Hc、Hd可移動)吸附保持光罩M之4邊,而無需更換光罩固持器便應對尺寸不同之複數個光罩M。如圖35(b)及(c)所示,對於周緣部被吸附保持之光罩M,產生因自身重量所致之自重彎曲,於4邊被保持之光罩M之情形時,該彎曲量於X方向、Y方向上均為光罩M之中央部最大,成為隨著接近周緣而逐漸變小之複雜之形狀之三維彎曲。又,大、小之尺寸不同之光罩M之彎曲形狀由於保持短邊側之兩緣部之固持器部Hc、Hd間之跨距S不同,因此X方向彎曲形狀根據光罩M之大小而不同。該光罩M之彎曲為光罩M與基板間之間隙不均之主要原因,且存在對曝光精度造成不良影響之虞。但是,在專利文獻1之曝光裝置中,存在無法消除由尺寸不同之光罩之更換而產生之平坦度(彎曲)變化之問題。Further, as shown in FIG. 35(a), the exposure apparatus disclosed in Patent Document 1 adsorbs and holds the mask M by the independent four holder portions Ha, Hb, Hc, Hd (where Hc, Hd are movable). 4 sides, without the need to replace the reticle holder, it is necessary to deal with a plurality of reticle M of different sizes. As shown in FIGS. 35(b) and (c), in the case where the mask M that is adsorbed and held by the peripheral portion is bent by its own weight and is held by the mask M held on the four sides, the amount of bending is obtained. In the X direction and the Y direction, the center portion of the mask M is the largest, and the three-dimensional bending is a complicated shape that gradually becomes smaller as it approaches the circumference. Further, since the curved shape of the mask M having different sizes of large and small is different because the span S between the holder portions Hc and Hd of the both edges of the short side is kept different, the curved shape in the X direction is according to the size of the mask M. different. The curvature of the mask M is a factor that causes unevenness in the gap between the mask M and the substrate, and has an adverse effect on the exposure accuracy. However, in the exposure apparatus of Patent Document 1, there is a problem that the change in flatness (bending) caused by the replacement of the reticle having different sizes cannot be eliminated.

又,專利文獻3中所揭示之曝光裝置之光罩保持機構將設置於光罩之長邊側之夾頭部之間距相對於長邊長度之1/2而設為0.65~0.80倍,從而抑制安裝於光罩固持器之光罩之固有振動數之下降,無法使因尺寸不同之光罩之自重彎曲所致之平坦度無關於尺寸而為固定,有改善餘地。Further, in the mask holding mechanism of the exposure apparatus disclosed in Patent Document 3, the distance between the chuck portions provided on the long side of the mask is set to 0.65 to 0.80 times with respect to 1/2 of the length of the long side, thereby suppressing The decrease in the number of natural vibrations of the reticle mounted on the reticle holder makes it impossible to fix the flatness due to the self-weight bending of the reticle of different sizes without being fixed in size, and there is room for improvement.

本發明係鑒於上述課題而完成者,其第1目的在於提供一種於固定地維持平坦度之狀態下,可應對尺寸不同之複數個光罩之曝光裝置。又,第2目的在於提供一種應對大小及可吸附區域不同之複數個光罩,可確實吸附保持光罩而防止因下落等所致之損傷之曝光裝置。第3目的在於提供一種可應對尺寸不同之複數個光罩,且可容易校正光罩之彎曲之曝光裝置。The present invention has been made in view of the above problems, and a first object thereof is to provide an exposure apparatus capable of coping with a plurality of masks having different sizes while maintaining flatness in a fixed manner. Further, a second object of the invention is to provide an exposure apparatus that can prevent a damage caused by dropping or the like by reliably holding a plurality of masks different in size and adsorbable area. A third object is to provide an exposure apparatus which can cope with a plurality of reticle sizes different in size and which can easily correct the curvature of the reticle.

本發明之上述目的係藉由下述構成而達成。The above object of the present invention is achieved by the following constitution.

(1)一種曝光裝置,其特徵在於包括:基板台,其載置作為被曝光材之基板;光罩台,其配置於上述基板台之上方且保持大致矩形狀之光罩;及照射組件,其將圖案曝光用之光經由上述光罩照射至上述基板上;且上述光罩台包括:光罩台基底側構件;4個光罩固持器,其可吸附保持上述光罩之各邊;複數個導引機構,其分別設置於上述光罩台基底側構件與吸附保持上述光罩之短邊側之至少2個上述光罩固持器之間,且相對於上述光罩台基底側構件可於長邊方向上移動地導引上述短邊側之光罩固持器;驅動機構,其使上述短邊側之光罩固持器相對於上述光罩台基底側構件於長邊方向上移動;及歪斜角調整機構,其分別設置於上述光罩台基底側構件與上述各導引機構之間、及上述各導引機構與上述短邊側之光罩固持器之間之至少一者,且可調整上述光罩之歪斜角。(1) An exposure apparatus comprising: a substrate stage on which a substrate as an exposure material is placed; a mask stage disposed above the substrate stage and holding a substantially rectangular mask; and an illumination unit; The light for pattern exposure is irradiated onto the substrate via the reticle; and the reticle stage comprises: a reticle base side member; and four reticle holders capable of adsorbing and holding the sides of the reticle; And a guiding mechanism respectively disposed between the reticle base side member and at least two of the reticle holders that adsorb and hold the short side of the reticle, and is detachable with respect to the reticle base side member a photomask holder for guiding the short side side in a longitudinal direction; a driving mechanism for moving the mask holder on the short side side in a longitudinal direction with respect to the base member side of the mask base; and skewing An angle adjusting mechanism respectively provided between the reticle base side member and each of the guiding mechanisms, and at least one of the guiding mechanisms and the short side reticle holder, and adjustable The above mask Bevel.

(2)如(1)之曝光裝置,其中上述歪斜角調整機構分別設置於上述光罩台基底側構件與上述各導引機構之間、及上述各導引機構與上述短邊側之光罩固持器之間之兩者。(2) The exposure apparatus according to (1), wherein the skew angle adjusting mechanism is provided between the mask base side member and each of the guide mechanisms, and each of the guide mechanisms and the short side mask Both between the holders.

(3)如(1)或(2)之曝光裝置,其中上述各導引機構分別包含安裝於上述光罩台基底側之導件及安裝於上述光罩固持器側之滑件構件,且上述歪斜角調整機構分別設置於上述光罩台基底側構件與上述各導件之間、及上述各滑件構件與上述短邊側之光罩固持器之間之至少一者。(3) The exposure apparatus according to (1) or (2), wherein each of the guiding means includes a guide attached to the base side of the mask stage and a slider member attached to the side of the mask holder, and the above The skew angle adjusting mechanism is provided between at least one of the mask base side member and the guides, and between each of the slider members and the short side mask holder.

(4)如(1)至(3)中任一項之曝光裝置,其中上述歪斜角調整機構為高度彼此不同之可更換之一對墊片。(4) The exposure apparatus according to any one of (1) to (3), wherein the skew angle adjusting mechanism is a replaceable pair of spacers having different heights from each other.

(5)如(1)至(3)中任一項之曝光裝置,其中上述歪斜角調整機構包括:墊片,其具有特定高度;及楔形機構,其設置於該墊片之外側,且包含具有傾斜面之固定側錐形構件、及具有與該傾斜面滑動自如地接觸之傾斜面之可動側錐形構件,並且可藉由改變上述傾斜面之滑動接觸位置而變更高度。(5) The exposure apparatus of any one of (1) to (3), wherein the skew angle adjustment mechanism includes: a spacer having a specific height; and a wedge mechanism disposed on an outer side of the spacer and including The fixed-side tapered member having the inclined surface and the movable-side tapered member having the inclined surface that is slidably contacted with the inclined surface, and the height can be changed by changing the sliding contact position of the inclined surface.

(6)如(5)之曝光裝置,其中上述楔形機構藉由使用電動致動器驅動上述可動側錐形構件而調整上述歪斜角。(6) The exposure apparatus according to (5), wherein the wedge mechanism adjusts the skew angle by driving the movable side tapered member using an electric actuator.

(7)如(1)至(3)中任一項之曝光裝置,其中上述歪斜角調整機構為藉由通電控制而可變更高度之壓電元件。(7) The exposure apparatus according to any one of (1) to (3), wherein the skew angle adjustment mechanism is a piezoelectric element that can be changed in height by energization control.

(8)如(1)至(7)中任一項之曝光裝置,其中上述驅動機構為氣缸本體固定於上述光罩台基底側構件,活塞之前端固定於上述光罩固持器之氣缸裝置。(8) The exposure apparatus according to any one of (1) to (7) wherein the driving mechanism is a cylinder body fixed to the reticle base side member, and a front end of the piston is fixed to the cylinder device of the reticle holder.

(9)如(8)之曝光裝置,其中上述氣缸裝置包括包含可移動地安裝於上述光罩台基底側構件之減振器之止動部,使上述活塞抵接於該止動部而將上述光罩固持器定位於特定位置。(9) The exposure apparatus according to (8), wherein the cylinder device includes a stopper including a damper movably attached to the base member of the reticle base, and the piston abuts against the stopper The reticle holder is positioned at a specific location.

(10)如(1)至(7)中任一項之曝光裝置,其中上述驅動機構為電動馬達。(10) The exposure apparatus according to any one of (1) to (7) wherein the drive mechanism is an electric motor.

(11)如(10)之曝光裝置,其中上述電動馬達使上述光罩固持器於至少3處停止位置停止。(11) The exposure apparatus of (10), wherein the electric motor stops the reticle holder at at least three stop positions.

(12)如(1)至(11)中任一項之曝光裝置,其中吸附保持上述光罩之短邊側之上述光罩固持器及吸附保持上述光罩之長邊側之上述光罩固持器至少於彼此近接之側緣部包含形成為較剩餘部分更薄壁之薄壁部。(12) The exposure apparatus according to any one of (1) to (11), wherein the reticle holder that adsorbs and holds the short side of the reticle and the reticle holding that adsorbs and holds the long side of the reticle are held The side edges at least adjacent to each other include a thin wall portion formed to be thinner than the remaining portion.

(13)如(1)至(11)中任一項之曝光裝置,其中吸附保持上述光罩之短邊側之上述光罩固持器及吸附保持上述光罩之長邊側之上述光罩固持器於彼此近接之角部包含倒角部。(13) The exposure apparatus according to any one of (1) to (11), wherein the reticle holder that adsorbs and holds the short side of the reticle and the reticle holding that adsorbs and holds the long side of the reticle are held The corners of the devices that are adjacent to each other include chamfered portions.

(14)如(1)至(11)中任一項之曝光裝置,其中吸附保持上述光罩之短邊側之上述光罩固持器與吸附保持上述光罩之長邊側之上述光罩固持器中之任一者至少於彼此近接之側緣部包含自下表面延伸出之階部,並且上述另一個光罩固持器包含自上表面延伸出之階部,上述短邊側及長邊側之光罩固持器於使上述階部彼此相互疊合之狀態下吸附保持上述光罩。(14) The exposure apparatus according to any one of (1) to (11), wherein the reticle holder that adsorbs and holds the short side of the reticle and the reticle holding the long side of the reticle is adsorbed and held Any one of the side edges that are adjacent to each other includes a step extending from the lower surface, and the other photomask holder includes a step extending from the upper surface, the short side and the long side The photomask holder adsorbs and holds the photomask in a state where the steps are superposed on each other.

(15)如(1)至(14)中任一項之曝光裝置,其包括與上述光罩之一面相對之處理室,更包括負壓校正機構,該負壓校正機構對上述處理室內之氣壓及作用於上述光罩之另一面之氣壓賦予壓力差,且校正上述光罩之上述歪斜角。(15) The exposure apparatus according to any one of (1) to (14) comprising a processing chamber opposite to a face of the reticle, further comprising a negative pressure correcting mechanism for the air pressure in the processing chamber And the air pressure acting on the other surface of the reticle imparts a pressure difference, and corrects the skew angle of the reticle.

(16)一種曝光裝置,其特徵在於包括:基板台,且載置作為被曝光材之基板;光罩台,其配置於上述基板台之上方且保持大致矩形狀之光罩;及照射組件,其將圖案曝光用之光經由上述光罩照射至上述基板上;且上述光罩台包括:一對第1光罩固持器,其可吸附保持沿特定方向延伸之上述光罩之相對向之2邊;一對第2光罩固持器,其可吸附保持沿與上述特定方向正交之方向延伸之上述光罩之相對向之另外2邊,且可於上述光罩之上述特定方向移動;及一對驅動機構,其使上述各第2光罩固持器分別於上述光罩之上述特定方向上移動;上述各第2光罩固持器包括複數排吸附槽,該複數排吸附槽藉由所供給之負壓而吸附保持上述光罩之另外2邊側,且於上述特定方向上排列。(16) An exposure apparatus comprising: a substrate stage on which a substrate as an exposure material is placed; a mask stage disposed above the substrate stage and holding a substantially rectangular mask; and an illumination unit; The light for pattern exposure is irradiated onto the substrate via the reticle; and the reticle stage includes: a pair of first reticle holders that are capable of adsorbing and holding the opposite sides of the reticle extending in a specific direction a pair of second photomask holders capable of adsorbing and holding the other two sides of the photomask extending in a direction orthogonal to the specific direction and movable in the specific direction of the photomask; and a pair of driving mechanisms for moving the respective second photomask holders in the specific direction of the photomask; each of the second photomask holders includes a plurality of rows of adsorption grooves, and the plurality of rows of adsorption grooves are supplied The other two sides of the photomask are adsorbed and held by the negative pressure, and are arranged in the specific direction.

(17)如(16)之曝光裝置,其中上述第2光罩固持器之上述吸附槽藉由電磁閥而切換負壓之供給與停止。(17) The exposure apparatus according to (16), wherein the adsorption tank of the second photomask holder switches the supply and the stop of the negative pressure by the electromagnetic valve.

(18)如(16)或(17)之曝光裝置,其中上述各第1光罩固持器包括複數個其他吸附槽,該複數個其他吸附槽根據所供給之負壓而吸附保持上述光罩之2邊側,且分割設置於上述特定方向上,上述第1光罩固持器之上述其他吸附槽及上述第2光罩固持器之吸附槽藉由針對每個上述其他吸附槽及上述吸附槽逐個設置之電磁閥而切換負壓之供給與停止,且控制負壓之大小。(18) The exposure apparatus of (16) or (17), wherein each of the first photomask holders includes a plurality of other adsorption tanks, and the plurality of other adsorption tanks adsorb and hold the photomask according to the supplied negative pressure a side of the second side, and the plurality of adsorption grooves of the first photomask holder and the adsorption groove of the second photomask holder are respectively provided for each of the other adsorption grooves and the adsorption grooves. The solenoid valve is set to switch the supply and stop of the negative pressure, and the magnitude of the negative pressure is controlled.

(19)如(16)至(18)中任一項之曝光裝置,其包括與上述光罩之一面相對之處理室,更包括負壓校正機構,該負壓校正機構對上述處理室內之氣壓及作用於上述光罩之另一面之氣壓賦予壓力差,並校正上述光罩之彎曲。(19) The exposure apparatus according to any one of (16) to (18), comprising a processing chamber opposite to a face of the reticle, further comprising a negative pressure correcting mechanism for the air pressure in the processing chamber And the air pressure acting on the other side of the reticle imparts a pressure difference and corrects the curvature of the reticle.

(20)一種曝光裝置,其特徵在於包括:基板台,其載置作為被曝光材之基板;光罩台,其配置於上述基板台之上方且保持大致矩形狀之光罩;及照射組件,其將圖案曝光用之光經由上述光罩照射至上述基板上;且上述光罩台包括:一對光罩固持器,其分別包括複數個吸附槽,該複數個吸附槽藉由所供給之負壓而吸附保持上述光罩之相對向之2邊且分割形成於該2邊之方向上;及負壓校正機構,其包括與上述光罩之一面相對之處理室,且對上述處理室內之氣壓及作用於上述光罩之另一面之氣壓賦予壓力差,校正上述光罩之彎曲。(20) An exposure apparatus comprising: a substrate stage on which a substrate as an exposure material is placed; a mask stage disposed above the substrate stage and holding a substantially rectangular mask; and an illumination unit; The light for pattern exposure is irradiated onto the substrate via the reticle; and the reticle stage comprises: a pair of reticle holders respectively comprising a plurality of adsorption grooves, wherein the plurality of adsorption grooves are supplied by the negative Pressing and holding the opposite sides of the reticle and dividing into the direction of the two sides; and a negative pressure correcting mechanism including a processing chamber opposite to one of the reticle, and the air pressure in the processing chamber And the air pressure acting on the other surface of the reticle imparts a pressure difference to correct the curvature of the reticle.

(21)如(20)之曝光裝置,其中上述一對光罩固持器之上述複數個吸附槽藉由針對每個上述吸附槽逐個設置之電磁閥而切換負壓之供給與停止,且控制負壓之大小。(21) The exposure apparatus of (20), wherein the plurality of adsorption tanks of the pair of mask holders switch supply and stop of the negative pressure by a solenoid valve provided one by one for each of the adsorption tanks, and the control is negative The size of the pressure.

(22)一種曝光裝置,其特徵在於包括:基板台,其載置作為被曝光材之基板;光罩台,其配置於上述基板台之上方且保持大致矩形狀之光罩;及照射組件,其將圖案曝光用之光經由上述光罩照射至上述基板上;且上述光罩台包括:光罩台基底側構件;一對光罩固持器,其分別包括複數各吸附槽,該複數各吸附槽藉由所供給之負壓而吸附保持上述光罩之相對向之2邊,且分割形成於沿該2邊之方向;及歪斜角調整機構,其分別設置於上述光罩台基底側構件與上述各光罩固持器之間,且使上述各光罩固持器傾斜而可調整上述光罩之歪斜角。(22) An exposure apparatus comprising: a substrate stage on which a substrate as an exposure material is placed; a mask stage disposed above the substrate stage and holding a substantially rectangular mask; and an illumination unit; The light for pattern exposure is irradiated onto the substrate via the reticle; and the reticle stage comprises: a reticle base side member; and a pair of reticle holders respectively comprising a plurality of adsorption grooves, the plurality of adsorptions The groove adsorbs and holds the opposite sides of the reticle by the supplied negative pressure, and is divided and formed along the two sides; and the skew angle adjusting mechanism is respectively disposed on the reticle base side member and The skew angle of the reticle can be adjusted between the reticle holders and by tilting the reticle holders.

(23)如(22)之曝光裝置,其中上述一對光罩固持器之上述複數個吸附槽藉由針對每個上述吸附槽逐個設置之電磁閥而切換負壓之供給與停止,且控制負壓之大小。(23) The exposure apparatus of (22), wherein the plurality of adsorption tanks of the pair of mask holders switch supply and stop of the negative pressure by a solenoid valve provided one by one for each of the adsorption tanks, and the control is negative The size of the pressure.

根據本發明之曝光裝置,光罩台包括:光罩台基底;4個光罩固持器,其吸附保持光罩之各邊;複數個導引機構,其相對於光罩台基底側構件可於長邊方向上移動地導引短邊側之光罩固持器;及驅動機構,其使短邊側之光罩固持器於光罩之長邊方向上移動;因此藉由使短邊側之光罩固持器根據光罩之大小移動,而無需更換光罩固持器便可對應不同尺寸之複數個光罩而吸附保持。又,於光罩台基底側構件與各導引機構之間、及各導引機構與短邊側之光罩固持器之間之至少一者包含歪斜角調整機構,因此無關於光罩之大小,校正所安裝之光罩之平坦度,固定地維持光罩與基板間之間隙而可提高曝光精度。According to the exposure apparatus of the present invention, the reticle stage comprises: a reticle stage base; four reticle holders for absorbing and holding the sides of the reticle; and a plurality of guiding mechanisms which are configurable with respect to the reticle stage base side member a reticle holder that movably guides the short side in the longitudinal direction; and a driving mechanism that moves the reticle holder on the short side in the longitudinal direction of the reticle; thus, by making the short side light The cover holder moves according to the size of the reticle, and can be adsorbed and held corresponding to a plurality of reticle of different sizes without replacing the reticle holder. Further, at least one of the reticle base side member and each of the guiding mechanisms, and between the guiding mechanism and the short side reticle holder includes a skew angle adjusting mechanism, so that the size of the reticle is not relevant The flatness of the mounted photomask is corrected, and the gap between the photomask and the substrate is fixedly maintained to improve the exposure accuracy.

又,根據本發明之曝光裝置,光罩台包括:一對第1光罩固持器,其可吸附保持沿特定方向延伸之光罩之相對向之2邊;一對第2光罩固持器,其可吸附保持與沿特定方向正交之方向延伸之光罩之相對向之另外2邊,且可於光罩之特定方向移動;及一對驅動機構,其使各第2光罩固持器分別於光罩之特定方向上移動;因此無需更換光罩固持器便可應對尺寸不同之複數個光罩而吸附保持。又,於各第2光罩固持器中,設置有於特定方向上排列之複數排吸附槽,因此對於可吸附區域不同之光罩,亦有效使用該可吸附區域,從而可確實地保吸附持光罩。Further, according to the exposure apparatus of the present invention, the mask stage includes: a pair of first mask holders that can adsorb and hold two opposite sides of the mask extending in a specific direction; and a pair of second mask holders, It can adsorb and hold the opposite two sides of the photomask extending in a direction orthogonal to a specific direction, and can move in a specific direction of the photomask; and a pair of driving mechanisms for respectively causing each of the second photomask holders It moves in a specific direction of the reticle; therefore, it is possible to cope with a plurality of reticles of different sizes without being replaced by the reticle holder. Further, since each of the second photomask holders is provided with a plurality of rows of adsorption grooves arranged in a specific direction, the photoreceptor regions can be effectively used for the photomasks having different adsorption regions, so that the adsorption can be surely maintained. Photomask.

又,根據本發明之曝光裝置,光罩台包括藉由複數個分割形成之吸附槽而吸附保持光罩之相對向之2邊之一對光罩固持器,因此無需更換光罩固持器便可應對該2邊之長度不同之複數大小之光罩而吸附保持。又,光罩固持器由於僅該2邊保持光罩,因此即便更換為尺寸不同之光罩,光罩之彎曲形狀亦不變化。進而,由於包含對與光罩之一面相對之處理室內之氣壓及作用於光罩之另一面之氣壓賦予壓力差且校正光罩之彎曲之負壓校正機構,因此藉由負壓校正機構校正光罩之彎曲,固定地維持光罩與基板間之間隙而可維持較高之曝光精度。Moreover, according to the exposure apparatus of the present invention, the mask stage includes one of the opposite sides of the mask that is adsorbed and held by the plurality of divided adsorption grooves, so that the mask holder can be replaced without replacing the mask holder. The reticle of a plurality of sizes having different lengths of the two sides should be adsorbed and held. Further, since the photomask holder holds the photomask only on the two sides, the curved shape of the photomask does not change even if the mask is replaced with a different size. Further, since the negative pressure correction mechanism that applies a pressure difference to the air pressure in the processing chamber opposite to one side of the mask and the air pressure acting on the other surface of the mask and corrects the curvature of the mask, the light is corrected by the negative pressure correcting mechanism The curvature of the cover maintains a high gap between the reticle and the substrate while maintaining a high exposure accuracy.

又,於包含配設於光罩台基底側構件與各光罩固持器之間之歪斜角調整機構之情形時,亦可藉由歪斜角調整機構校正光罩之彎曲,使光罩與基板間之間隙固定而提高曝光精度。Moreover, when the skew angle adjusting mechanism disposed between the base member of the reticle base and the reticle holder is included, the bending of the reticle can be corrected by the skew angle adjusting mechanism to make the reticle and the substrate The gap is fixed to improve the exposure accuracy.

以下,基於圖式對本發明之曝光裝置之各實施形態進行詳細說明。Hereinafter, each embodiment of the exposure apparatus of the present invention will be described in detail based on the drawings.

(第1實施形態)(First embodiment)

圖1係本發明之第1實施形態之曝光裝置之主要部立體圖,圖2係前視圖,圖3係光罩台附近之放大圖,圖4係光罩台之俯視圖。1 is a perspective view of a main part of an exposure apparatus according to a first embodiment of the present invention, FIG. 2 is a front view, FIG. 3 is an enlarged view of the vicinity of the mask stage, and FIG. 4 is a plan view of the mask stage.

如圖1所示,本實施形態之曝光裝置1包括:保持光罩M之光罩台10;基板台20,其保持玻璃基板(被曝光材)W;照明光學系統30,其作為圖案曝光用之照射組件;基板台移動機構40,其將基板台20於X軸、Y軸、Z軸方向上移動且進行基板台20之傾斜調整;及裝置基底50,其支持光罩台10及基板台移動機構40。As shown in Fig. 1, the exposure apparatus 1 of the present embodiment includes a mask stage 10 for holding a mask M, a substrate stage 20 for holding a glass substrate (exposed material) W, and an illumination optical system 30 for pattern exposure. The substrate assembly moving mechanism 40 moves the substrate stage 20 in the X-axis, Y-axis, and Z-axis directions and performs tilt adjustment of the substrate stage 20; and the device substrate 50 supports the mask stage 10 and the substrate stage Movement mechanism 40.

再者,玻璃基板W(以下僅稱為「基板W」)與光罩M對向配置,在用於將描繪於該光罩M上之光罩圖案曝光轉印之表面(光罩M之相對面側)上塗佈有光敏劑。Further, the glass substrate W (hereinafter simply referred to as "substrate W") is disposed opposite to the mask M, and is used for exposing and transferring the mask pattern drawn on the mask M (the opposite of the mask M) The surface side) is coated with a photosensitizer.

首先自照明光學系統30進行說明。照明光學系統30包括:紫外線照射用之光源即例如高壓水銀燈31;凹面鏡32,其將自該高壓水銀燈31照射之光聚光;兩種光學積分器33,其切換自如地配置於該凹面鏡32之焦點附近;平面鏡35、36及球面鏡37,其用於改變光路之朝向;及曝光控制用快門34,其配置於該平面鏡35與光學積分器33之間且開關控制照射光路。First, the illumination optical system 30 will be described. The illumination optical system 30 includes, for example, a high-pressure mercury lamp 31, which is a light source for ultraviolet irradiation, a concave mirror 32 that condenses light irradiated from the high-pressure mercury lamp 31, and two optical integrators 33 that are arbitrarily disposed in the concave mirror 32. The focus mirrors 35, 36 and the spherical mirror 37 are used to change the orientation of the optical path; and the exposure control shutter 34 is disposed between the plane mirror 35 and the optical integrator 33 and switches to control the illumination optical path.

並且,於照明光學系統30中,若於曝光時將曝光控制用快門34開控制,則自高壓水銀燈31照射之光經由圖1所示之光路L,以相對於保持於光罩台10上之光罩M,進而相對於保持於基板台20上之基板W之表面垂直地圖案曝光用之平行光照射。藉此,光罩M之光罩圖案曝光轉印至基板W上。Further, in the illumination optical system 30, when the exposure control shutter 34 is controlled to be opened during exposure, the light irradiated from the high pressure mercury lamp 31 passes through the optical path L shown in FIG. 1 to be held on the photomask stage 10. The mask M is further irradiated with parallel light for pattern exposure perpendicularly to the surface of the substrate W held on the substrate stage 20. Thereby, the mask pattern of the mask M is exposed and transferred onto the substrate W.

如圖1~圖3所示,光罩台10包括:光罩台基底11,其於中央部形成矩形形狀之開口11a;及光罩保持框(光罩台基底側構件)12,其於X軸、Y軸、θ方向上可移動地安裝於光罩台基底11之開口11a處。As shown in FIGS. 1 to 3, the mask stage 10 includes a mask stage base 11 which is formed with a rectangular opening 11a at a central portion thereof, and a mask holding frame (a mask stage base side member) 12 which is X. The shaft, the Y-axis, and the θ direction are movably mounted at the opening 11a of the mask stage base 11.

光罩台基底11藉由垂直設置於裝置基底50上之支柱51、及設置於支柱51之上端部之Z軸移動裝置52而可於Z軸方向上移動地支持(參照圖2),並且配置於基板台20之上方。Z軸移動裝置52例如包括包含馬達及滾珠螺桿等之電動致動器或空壓氣缸等,並藉由單純之上下動作而使光罩台10升降至特定位置為止。再者,Z軸移動裝置52於光罩M之更換或Z平台21之清掃等時使用。The mask stage base 11 is movably supported in the Z-axis direction by the support 51 vertically disposed on the apparatus base 50 and the Z-axis moving device 52 provided at the upper end of the support 51 (refer to FIG. 2), and is configured Above the substrate stage 20. The Z-axis moving device 52 includes, for example, an electric actuator including a motor and a ball screw, a pneumatic cylinder, or the like, and raises and lowers the mask table 10 to a specific position by simply moving up and down. Further, the Z-axis moving device 52 is used when the photomask M is replaced or the Z-platform 21 is cleaned or the like.

如圖4所示,於光罩台基底11之開口11a之周緣部之上表面,平面軸承13配置複數個部位,光罩保持框12將設置於其上端外周緣部之凸緣12a載置於平面軸承13上。藉此,光罩保持框12隔著特定空隙插入至光罩台基底11之開口11a,因此於X軸、Y軸、θ方向上僅可移動該空隙量。光罩保持框12於中央部形成用於使圖案曝光光穿透之矩形形狀之開口12b。As shown in Fig. 4, on the upper surface of the peripheral edge portion of the opening 11a of the mask stage base 11, the plane bearing 13 is provided with a plurality of portions, and the mask holding frame 12 is placed on the flange 12a provided at the outer peripheral edge portion of the upper end thereof. On the plane bearing 13. Thereby, the mask holding frame 12 is inserted into the opening 11a of the mask stage base 11 via a specific gap, so that the gap amount can be moved only in the X-axis, Y-axis, and θ directions. The mask holding frame 12 forms a rectangular opening 12b for penetrating the pattern exposure light at the center portion.

亦參照圖5,於光罩保持側構件之一例即光罩保持框12之下表面側包括:一對固定光罩固持器71,其配置於開口12b之長邊側;一對可動光罩固持器72,其配置於開口12b之短邊側;複數條線性導件(導引機構)73,其設置於光罩保持框12與各可動光罩固持器72之間;及氣缸裝置74(參照圖7),其係使可動光罩固持器72沿開口12b之長邊移動之驅動機構。又,於線性導件73與可動光罩固持器72之間配設有歪斜角調整機構80。Referring also to FIG. 5, the lower surface side of the reticle holding frame 12, which is an example of the reticle holding side member, includes a pair of fixed reticle holders 71 disposed on the long side of the opening 12b; a pair of movable reticle holders The device 72 is disposed on the short side of the opening 12b; a plurality of linear guides (guide means) 73 are disposed between the reticle holding frame 12 and each of the movable reticle holders 72; and the cylinder device 74 (refer to Figure 7) is a drive mechanism for moving the movable reticle holder 72 along the long side of the opening 12b. Further, a skew angle adjustment mechanism 80 is disposed between the linear guide 73 and the movable mask holder 72.

如圖5所示,於隔著墊片等固定於光罩保持框12之下表面之一對固定光罩固持器71之下表面(基板W側),設置有主吸附槽71a,其形成於長度方向中央;及輔助吸附槽71b,其於該主吸附槽71a之左右與主吸附槽71a獨立而形成。又,於可移動地配設於光罩保持框12下方之可動光罩固持器72之下表面,環繞大致全長而形成有吸附槽72a。固定光罩固持器71及可動光罩固持器72之主吸附槽71a、輔助吸附槽71b、及吸附槽72a係用於吸附光罩M之未描繪光罩圖案之周緣部之槽,藉由未圖示之真空式吸附裝置分別吸附光罩M之4邊而裝卸自如地保持光罩M。As shown in FIG. 5, a main adsorption groove 71a is formed on the lower surface (the substrate W side) of the fixed photomask holder 71, which is fixed to the lower surface of the mask holding frame 12 via a spacer or the like, and is formed in the main adsorption groove 71a. The center in the longitudinal direction and the auxiliary adsorption tank 71b are formed independently of the main adsorption tank 71a on the left and right of the main adsorption tank 71a. Further, the lower surface of the movable mask holder 72, which is movably disposed below the mask holding frame 12, is formed with an adsorption groove 72a around substantially the entire length. The main absorbing groove 71a, the auxiliary absorbing groove 71b, and the absorbing groove 72a of the fixed reticle holder 71 and the movable reticle holder 72 are used for absorbing the groove of the mask M which is not depicted in the peripheral portion of the reticle pattern. The vacuum suction device shown in the drawing adsorbs the four sides of the mask M and detachably holds the mask M.

主吸附槽71a、輔助吸附槽71b、及吸附槽72a分別經由未圖示之切換閥而與真空式吸附裝置連接,藉由適當地對切換閥進行切換而可使任意吸附槽為動作狀態。此處,光罩M之尺寸於多倒角時因描繪於有效曝光區域中之圖案之配置等而有稍微(例如10~20 mm左右)不同之情形,但固定光罩固持器71及可動光罩固持器72可應對此種尺寸不同之光罩M而吸附保持。具體而言,主吸附槽71a、輔助吸附槽71b、及吸附槽72a協動吸附較大尺寸之光罩M,主吸附槽71a及吸附槽72a協動吸附較小尺寸之光罩M而保持。Each of the main adsorption tank 71a, the auxiliary adsorption tank 71b, and the adsorption tank 72a is connected to a vacuum adsorption device via a switching valve (not shown), and any adsorption tank can be operated by appropriately switching the switching valve. Here, the size of the mask M is slightly different (for example, about 10 to 20 mm) due to the arrangement of the patterns drawn in the effective exposure area, etc., but the fixed mask holder 71 and the movable light are fixed. The cover holder 72 can be sucked and held in response to the mask M of such a different size. Specifically, the main adsorption tank 71a, the auxiliary adsorption tank 71b, and the adsorption tank 72a cooperatively adsorb the mask M of a large size, and the main adsorption tank 71a and the adsorption tank 72a cooperatively adsorb and hold the mask M of a small size.

如圖4及圖6所示,線性導件73係由安裝於光罩台基底11側(光罩保持框12)之導件73a、及安裝於可動光罩固持器72側且導引至導件73a內於Y方向(開口12b之長邊方向)上可移動之滑件構件73b(於圖中所示之實施形態中,相對於1條導件73a分別有2個滑件構件73bi、73bo)而構成。As shown in FIGS. 4 and 6, the linear guide 73 is attached to the movable shutter holder 72 side and guided to the guide 73a attached to the mask base 11 side (the mask holding frame 12). The slider member 73b movable in the Y direction (the longitudinal direction of the opening 12b) in the member 73a (in the embodiment shown in the drawing, there are two slider members 73bi, 73bo with respect to one guide 73a, respectively) ) constitutes.

可動光罩固持器72之驅動機構即一對氣缸裝置74對應於各可動光罩固持器72而配置於其長度方向大致中央,換言之配置於光罩保持框12之短邊之大致中央,且延設至長度方向上。如圖7所示,各氣缸裝置74中,氣缸本體74a固定於光罩保持框12之下表面,活塞74b旋轉自如地嵌合於自可動光罩固持器72向上方突出設置之突起部72b之支持軸75上。藉此,可消除下述可動光罩固持器72之歪斜角調整時之氣缸裝置74與可動光罩固持器72之角度變化而使其平滑地動作。The pair of cylinder devices 74, which are driving mechanisms of the movable mask holder 72, are disposed substantially at the center in the longitudinal direction thereof corresponding to the respective movable mask holders 72, in other words, are disposed substantially at the center of the short side of the mask holding frame 12, and are extended. Set to the length direction. As shown in Fig. 7, in each of the cylinder devices 74, the cylinder main body 74a is fixed to the lower surface of the reticle holding frame 12, and the piston 74b is rotatably fitted to the projection 72b projecting upward from the movable reticle holder 72. Support on the shaft 75. Thereby, it is possible to eliminate the change in the angle between the cylinder device 74 and the movable mask holder 72 when the skew angle of the movable mask holder 72 is adjusted to be smoothly operated.

又,於活塞74b之動作方向前方之光罩保持框12之下表面,固定包括減振器76之止動部77,當氣缸裝置74動作而活塞74b延伸時,經由減振器76使突起部72b(可動光罩固持器72)與止動部77抵接,從而不施加衝擊地將可動光罩固持器72定位於特定位置上。Further, a stopper portion 77 including a damper 76 is fixed to the lower surface of the reticle holding frame 12 in the forward direction of the piston 74b, and when the cylinder device 74 is operated and the piston 74b is extended, the projection is made via the damper 76. The 72b (movable reticle holder 72) abuts against the stopper portion 77, thereby positioning the movable reticle holder 72 at a specific position without applying an impact.

止動部77之位置係對安裝較大尺寸之光罩M時之可動光罩固持器72之位置進行限制者,氣缸裝置74之活塞74b進入至氣缸本體74a內時之可動光罩固持器72之位置為安裝較小尺寸之光罩M時之可動光罩固持器72之位置。The position of the stopper portion 77 is a position for restricting the position of the movable reticle holder 72 when the reticle M of a larger size is mounted, and the movable reticle holder 72 when the piston 74b of the cylinder device 74 enters the cylinder body 74a The position is the position of the movable reticle holder 72 when the reticle M of a smaller size is mounted.

如上所述,固定光罩固持器71、可動光罩固持器72、線性導件73、及氣缸裝置74安裝於光罩保持框12內,因此與光罩保持框12一起可相對於光罩台基底11在X軸、Y軸、θ方向上移動。As described above, the fixed reticle holder 71, the movable reticle holder 72, the linear guide 73, and the cylinder device 74 are mounted in the reticle holding frame 12, and thus, together with the reticle holding frame 12, can be opposed to the reticle stage The substrate 11 moves in the X-axis, Y-axis, and θ directions.

並且,如圖6所示,使氣缸裝置74動作,當安裝較大尺寸之光罩M時,使一對可動光罩固持器72同時朝彼此相隔之方向(外方)移動而擴大間隔(圖6(a)),當安裝較小尺寸之光罩M時,使一對可動光罩固持器72同時朝彼此接近之方向(內方)移動而縮短間隔(圖6(b)),藉此可容易應對尺寸不同之複數個光罩M。Further, as shown in FIG. 6, the cylinder device 74 is operated, and when the mask M of a large size is attached, the pair of movable mask holders 72 are simultaneously moved in the direction in which they are spaced apart (outside) to enlarge the interval (Fig. 6(a)), when the mask M of a smaller size is mounted, the pair of movable mask holders 72 are simultaneously moved toward the direction in which they approach each other (inner side) to shorten the interval (Fig. 6(b)), whereby It is easy to cope with a plurality of masks M of different sizes.

根據可定位2個位置之本實施形態之氣缸裝置74,可應對大小、2種尺寸之光罩M。此時,使一對氣缸裝置74同時動作,使一對可動光罩固持器72始終位於左右對稱位置,藉此不使兩可動光罩固持器72之中央位置、即光罩M之中心移動便可更換光罩M。According to the cylinder device 74 of the present embodiment in which two positions can be positioned, it is possible to cope with the size and the size of the mask M. At this time, the pair of cylinder devices 74 are simultaneously operated, so that the pair of movable mask holders 72 are always positioned at the left-right symmetry position, thereby preventing the central position of the two movable mask holders 72, that is, the center of the mask M from being moved. The mask M can be replaced.

圖8係變形例之驅動裝置之側面圖,包括減振器76之止動部77例如藉由電動致動器78而可於活塞74b之移動方向上移動。藉此,可將藉由氣缸裝置74之可動光罩固持器72之停止位置定位於3處以上之複數個位置,進而可定位於任意位置,並且可應對尺寸不同之3個以上之光罩M,或尺寸之微小變化。Fig. 8 is a side view of the driving device according to the modification, and the stopper portion 77 including the damper 76 is movable in the moving direction of the piston 74b by, for example, the electric actuator 78. Thereby, the stop position of the movable mask holder 72 of the cylinder device 74 can be positioned at a plurality of positions of three or more positions, and can be positioned at any position, and three or more masks M having different sizes can be handled. , or a small change in size.

又,驅動裝置亦可由電動馬達(未圖示)構成以代替氣缸裝置74,藉由電動馬達,容易將複數個停止位置設定為任意位置,並且可使可動光罩固持器72停止於該停止位置上。Further, the driving device may be constituted by an electric motor (not shown) instead of the cylinder device 74, and the electric motor may easily set a plurality of stop positions to an arbitrary position, and the movable shutter holder 72 may be stopped at the stop position. on.

歪斜角調整機構80係可調整一對可動光罩固持器72之角度、即歪斜角之機構,於本實施形態中,高度彼此不同之可更換之一對墊片80a、80b配置於各滑件構件73b與短邊側之光罩固持器72之間。藉此,藉由一對可動光罩固持器72而對兩端吸附保持之光罩M相對於長度方向中心C左右對稱地賦予歪斜角,並且可進行校正以降低光罩M之彎曲,從而使光罩M之平坦度提高。由此,可儘可能使光罩M之有效曝光區域中之光罩M與基板W之間隙均勻化。The skew angle adjusting mechanism 80 is a mechanism for adjusting the angle of the pair of movable mask holders 72, that is, the skew angle. In the present embodiment, the replaceable ones of the spacers 80a and 80b having different heights are disposed in the respective sliders. The member 73b is interposed between the mask holder 72 on the short side. Thereby, the mask M that is adsorbed and held at both ends by the pair of movable mask holders 72 is given a skew angle with respect to the center C in the longitudinal direction, and can be corrected to reduce the curvature of the mask M, thereby The flatness of the mask M is increased. Thereby, the gap between the mask M and the substrate W in the effective exposure region of the mask M can be made uniform as much as possible.

又,由於尺寸較大之光罩M中光罩M之彎曲變大,因此歪斜角相對於彎曲較大之光罩M設定較大之角度。因此,於變更進行更換之光罩M之大小時,可藉由更換一對墊片80a、80b而調整歪斜角。Further, since the curvature of the mask M in the mask M having a large size becomes large, the skew angle is set at a large angle with respect to the mask M which is largely curved. Therefore, when the size of the mask M to be replaced is changed, the skew angle can be adjusted by replacing the pair of spacers 80a and 80b.

又,如圖3及圖4所示,於光罩台基底11之上表面設置光罩位置調整機構16,該光罩位置調整機構16使光罩保持框12於X軸、Y軸、θ方向上移動,並對保持於該光罩保持框12內之光罩M之位置進行調整。Further, as shown in FIGS. 3 and 4, a mask position adjusting mechanism 16 is provided on the upper surface of the mask stage base 11, and the mask position adjusting mechanism 16 causes the mask holding frame 12 to be in the X-axis, the Y-axis, and the θ direction. Moving upwards and adjusting the position of the mask M held in the mask holding frame 12.

光罩位置調整機構16包括:1台Y軸方向驅動裝置16y,其安裝於光罩保持框12之沿X軸方向之一邊;及2台X軸方向驅動裝置16x,其安裝於光罩保持框12之沿Y軸方向之一邊。The reticle position adjusting mechanism 16 includes: one Y-axis direction driving device 16y mounted on one side of the reticle holding frame 12 in the X-axis direction; and two X-axis direction driving devices 16x mounted on the reticle holding frame 12 along one side of the Y-axis direction.

Y軸方向驅動裝置16y包括:驅動用致動器(例如電動致動器等)55,其設置於光罩台基底11上,且包含沿Y軸方向伸縮之桿56;滑件58,其經由銷支持機構57與桿56之前端連結;及導件59,其安裝於光罩保持框12之沿X軸方向之邊部,且可移動地安裝滑件58。The Y-axis direction driving device 16y includes a driving actuator (for example, an electric actuator or the like) 55 that is disposed on the reticle base 11 and includes a rod 56 that expands and contracts in the Y-axis direction, and a slider 58 that passes through The pin supporting mechanism 57 is coupled to the front end of the rod 56; and a guide member 59 is attached to the side of the reticle holding frame 12 in the X-axis direction, and the slider 58 is movably mounted.

另一方面,X軸方向驅動裝置16x亦為與Y軸方向驅動裝置16y相同之構成,包括:驅動用致動器55,其設置於光罩台基底11上且包含沿X軸方向伸縮之桿56;滑件58,其經由銷支持機構57與桿56之前端連結;及導件59,其安裝於光罩保持框12之沿Y軸方向之邊部,且可移動地安裝滑件58。On the other hand, the X-axis direction driving device 16x is also configured similarly to the Y-axis direction driving device 16y, and includes a driving actuator 55 which is provided on the mask stage base 11 and includes a rod that expands and contracts in the X-axis direction. 56; a slider 58 coupled to the front end of the rod 56 via a pin supporting mechanism 57; and a guide member 59 attached to a side of the reticle holding frame 12 in the Y-axis direction and movably mounting the slider 58.

並且,在光罩位置調整機構16中,藉由使1台Y軸方向驅動裝置16y驅動而使光罩保持框12於Y軸方向上移動,藉由使2台X軸方向驅動裝置16x同等驅動而使光罩保持框12於X軸方向上移動。又,藉由驅動2台X軸方向驅動裝置16x中之任一者而使光罩保持框12於θ方向上移動(環繞Z軸之旋轉)。Further, in the mask position adjusting mechanism 16, by driving one Y-axis direction driving device 16y, the mask holding frame 12 is moved in the Y-axis direction, and the two X-axis direction driving devices 16x are driven equally. The mask holding frame 12 is moved in the X-axis direction. Further, the shutter holding frame 12 is moved in the θ direction (rotation around the Z axis) by driving either of the two X-axis direction driving devices 16x.

進而,如圖3所示,於光罩台基底11之上表面設置間隙感測器17,其測定光罩M與基板W之相對面間之間隙;及對準排列相機18,其用於確認光罩M之安裝位置。該等間隙感測器17及對準排列相機18經由移動機構19可於X軸、Y軸方向上移動地保持,並且配置於光罩保持框12內。Further, as shown in FIG. 3, a gap sensor 17 is provided on the upper surface of the mask stage base 11, which measures the gap between the opposite faces of the mask M and the substrate W; and an alignment camera 18 for confirming The mounting position of the mask M. The gap sensor 17 and the alignment camera 18 are movably held in the X-axis and Y-axis directions via the moving mechanism 19, and are disposed in the reticle holding frame 12.

移動機構19包括:保持架台25,其分別配置於光罩保持框12之Y軸方向上彼此對向之兩邊,且保持間隙感測器17及對準排列相機18;線性導件26、27,其於X軸、Y軸方向上可移動地支持保持架台25;及驅動用致動器28、29,其使保持架台25於X軸、Y軸方向上移動。The moving mechanism 19 includes: a holding frame 25 which is respectively disposed on opposite sides of the reticle holding frame 12 in the Y-axis direction, and holds the gap sensor 17 and the alignment camera 18; the linear guides 26, 27, The holder base 25 is movably supported in the X-axis and Y-axis directions, and the drive actuators 28 and 29 move the holder stage 25 in the X-axis and Y-axis directions.

並且,於移動機構19中,藉由線性導件26及驅動用致動器28使保持架台25於X軸方向上移動,藉由線性導件27及驅動用致動器29使保持架台25於Y軸方向上移動。再者,移動機構19使用線性導件及驅動用致動器使保持架台於X軸、Y軸方向上移動,但亦可使用線型馬達等。Further, in the moving mechanism 19, the holder 26 is moved in the X-axis direction by the linear guide 26 and the drive actuator 28, and the holder 25 is held by the linear guide 27 and the drive actuator 29. Move in the Y-axis direction. Further, the moving mechanism 19 moves the holder table in the X-axis and Y-axis directions using the linear guide and the driving actuator, but a linear motor or the like may be used.

對準排列相機18自光罩背面側光學檢測光罩M表面之光罩側對準標記(未圖示),且藉由焦點調整機構相對於光罩M接近相隔移動而進行焦點調整。The alignment camera 18 optically detects the mask side alignment mark (not shown) on the surface of the mask M from the back side of the mask, and performs focus adjustment by the focus adjustment mechanism moving closer to the mask M.

再者,如圖3所示,於光罩台基底11之上表面,在光罩台基底11之開口11a之X軸方向之兩端部,設置視需要遮蔽光罩M之兩端部之遮光板38。該遮光板38藉由包含馬達、滾珠螺桿、及線性導件等之遮光板驅動機構39而可於X軸方向上移動,從而調整光罩M之兩端部之遮蔽面積。再者,遮光板38並非僅設置於開口11a之X軸方向之兩端部,亦同樣地設置於開口11a之Y軸方向之兩端部。Further, as shown in FIG. 3, on the upper surface of the mask stage base 11, at both end portions of the opening 11a of the mask stage base 11 in the X-axis direction, it is provided to shield the both ends of the mask M as needed. Board 38. The light shielding plate 38 is movable in the X-axis direction by a light shielding plate driving mechanism 39 including a motor, a ball screw, and a linear guide to adjust the shielding area of both end portions of the mask M. Further, the light shielding plate 38 is not provided only at both end portions of the opening 11a in the X-axis direction, and is similarly provided at both end portions of the opening 11a in the Y-axis direction.

如圖1及圖2所示,基板台20於上表面包括配置有工件夾頭22之Z平台21,且設置於基板台移動機構40上。再者,工件夾頭22藉由真空吸附而保持基板W。As shown in FIGS. 1 and 2, the substrate stage 20 includes a Z stage 21 on which the workpiece chuck 22 is disposed on the upper surface, and is disposed on the substrate stage moving mechanism 40. Further, the workpiece chuck 22 holds the substrate W by vacuum suction.

基板台移動機構40包括:Y軸輸送機構41,其使基板台20於Y軸方向上移動;X軸輸送機構42,其使基板台20於X軸方向上移動;及Z-傾斜調整機構43,其進行基板台20之傾斜調整,並且使基板台20於Z軸方向上微動。The substrate stage moving mechanism 40 includes a Y-axis conveying mechanism 41 that moves the substrate stage 20 in the Y-axis direction, an X-axis conveying mechanism 42 that moves the substrate stage 20 in the X-axis direction, and a Z-tilt adjustment mechanism 43. This performs tilt adjustment of the substrate stage 20 and causes the substrate stage 20 to be slightly moved in the Z-axis direction.

Y軸輸送機構41包括:一對線性導件44,其沿Y軸方向設置於裝置基底50之上表面;Y軸平台45,其藉由線性導件44而可於Y軸方向上移動地支持;及Y軸輸送驅動裝置46,其使Y軸平台45於Y軸方向移動。線性導件44包括:導件44a,其沿Y軸方向設置於裝置基底50上;一對滑件44b,其固定於Y軸平台45之下表面,且可移動地安裝於導件44a上;及未圖示之滾動體,其介設於導件44a與滑件44b之間。Y軸輸送驅動裝置46包括:滾珠螺桿螺帽46a,其固定於Y軸平台45之下表面;滾珠螺桿軸46b,其螺合於滾珠螺桿螺帽46a上;及馬達46c,其設置於裝置基底50上,且使滾珠螺桿軸46b旋轉驅動。The Y-axis conveying mechanism 41 includes a pair of linear guides 44 which are disposed on the upper surface of the apparatus base 50 in the Y-axis direction, and a Y-axis stage 45 which is supported by the linear guide 44 so as to be movable in the Y-axis direction. And a Y-axis transport drive 46 that moves the Y-axis stage 45 in the Y-axis direction. The linear guide 44 includes: a guide 44a disposed on the device base 50 in the Y-axis direction; a pair of sliders 44b fixed to the lower surface of the Y-axis platform 45 and movably mounted on the guide 44a; And a rolling element (not shown) interposed between the guide 44a and the slider 44b. The Y-axis conveying drive unit 46 includes: a ball screw nut 46a fixed to a lower surface of the Y-axis table 45; a ball screw shaft 46b screwed to the ball screw nut 46a; and a motor 46c disposed on the device base 50, and the ball screw shaft 46b is rotationally driven.

並且,在Y軸輸送機構41中,藉由使Y軸輸送驅動裝置46之馬達46c驅動,使滾珠螺桿軸46b旋轉,從而使Y軸平台45與滾珠螺桿螺帽46a一起沿線性導件44之導件44a移動,並且使基板台20於Y軸方向上移動。Further, in the Y-axis conveying mechanism 41, the ball screw shaft 46b is rotated by driving the motor 46c of the Y-axis conveying drive unit 46, so that the Y-axis stage 45 and the ball screw nut 46a are along the linear guide 44. The guide 44a moves and moves the substrate stage 20 in the Y-axis direction.

X軸輸送機構42包括:一對線性導件47,其沿X軸方向設置於Y軸平台45之上表面;X軸平台48,其藉由線性導件47於X軸方向可移動地支持;及X軸輸送驅動裝置49,其使X軸平台48於X軸方向上移動。線性導件47包括:導件47a,其沿X軸方向設置於Y軸平台45上;一對滑件47b,其固定於X軸平台48之下表面,且可移動地安裝於導件47a上;及未圖示之滾動體,其介設於導件47a與滑件47b之間。X軸輸送驅動裝置49包括:未圖示之滾珠螺桿螺帽,其固定於X軸平台48之下表面;滾珠螺桿軸49b,其螺合於該滾珠螺桿螺帽上;及馬達49c,其設置於Y軸平台45上且使滾珠螺桿軸49b旋轉驅動。The X-axis conveying mechanism 42 includes: a pair of linear guides 47 disposed on the upper surface of the Y-axis platform 45 in the X-axis direction; and an X-axis platform 48 movably supported by the linear guides 47 in the X-axis direction; And an X-axis transport drive 49 that moves the X-axis stage 48 in the X-axis direction. The linear guide 47 includes a guide 47a disposed on the Y-axis stage 45 in the X-axis direction, and a pair of sliders 47b fixed to the lower surface of the X-axis stage 48 and movably mounted on the guide 47a. And a rolling element (not shown) interposed between the guide 47a and the slider 47b. The X-axis conveying drive device 49 includes: a ball screw nut (not shown) fixed to a lower surface of the X-axis table 48; a ball screw shaft 49b screwed to the ball screw nut; and a motor 49c, which is disposed The Y-axis stage 45 is rotated and the ball screw shaft 49b is rotationally driven.

並且,在X軸輸送機構42中,藉由使X軸輸送驅動裝置49之馬達49c驅動,使滾珠螺桿軸49b旋轉,從而使X軸平台48與未圖示之滾珠螺桿螺帽一起沿線性導件47之導件47a移動,並且使基板台20於X軸方向上移動。Further, in the X-axis conveying mechanism 42, the ball screw shaft 49b is rotated by the motor 49c of the X-axis conveying drive unit 49, whereby the X-axis table 48 is linearly guided together with the ball screw nut (not shown). The guide 47a of the member 47 moves and moves the substrate stage 20 in the X-axis direction.

Z-傾斜調整機構43包括:馬達43a,其設置於X軸平台48上;滾珠螺桿軸43b,其藉由馬達43a旋轉驅動;楔狀螺帽43c,其形成為楔狀且螺合於滾珠螺桿軸43b上;楔狀部43d,其以楔狀突設於基板台20之下表面,且卡合於楔狀螺帽43c之傾斜面。並且,於本實施形態中,Z-傾斜調整機構43於X軸平台48之X軸方向之一端側(圖1之近前側)設置2台,於另一端側設置1台(圖1之裏面側,參照圖2),總計設置3台,且分別獨立驅動控制。再者,Z-傾斜調整機構43之設置數量為任意。The Z-tilt adjustment mechanism 43 includes a motor 43a that is disposed on the X-axis stage 48, a ball screw shaft 43b that is rotationally driven by the motor 43a, and a wedge nut 43c that is formed in a wedge shape and screwed to the ball screw The shaft 43b has a wedge-shaped portion 43d which is protruded from the lower surface of the substrate stage 20 in a wedge shape and is engaged with the inclined surface of the wedge nut 43c. In the present embodiment, the Z-tilt adjustment mechanism 43 is provided on one side of the X-axis direction of the X-axis stage 48 (near the front side in FIG. 1), and one on the other end side (the back side of FIG. 1). Referring to FIG. 2), a total of three sets are set, and the control is independently driven. Furthermore, the number of Z-tilt adjustment mechanisms 43 is arbitrary.

並且,於Z-傾斜調整機構43中,藉由馬達43a使滾珠螺桿軸43b旋轉驅動,藉此楔狀螺帽43c於X軸方向上水平移動,該水平移動運動藉由楔狀螺帽43c及楔狀部43d之斜面作用而轉換為高精度之上下微動運動,楔狀部43d於Z方向上微動。因此,藉由使3台Z-傾斜調整機構43僅驅動相同量,而可使基板台20於Z軸方向上微動,又,藉由使3台Z-傾斜調整機構43獨立驅動,而可進行基板台20之傾斜調整。藉此,對基板台20之Z軸、傾斜方向之位置進行微調整,可使光罩M與基板W保持特定間隔而平行對向。Further, in the Z-tilt adjustment mechanism 43, the ball screw shaft 43b is rotationally driven by the motor 43a, whereby the wedge nut 43c is horizontally moved in the X-axis direction by the wedge nut 43c and The bevel of the wedge portion 43d is converted into a high-precision upper and lower fine motion, and the wedge portion 43d is slightly moved in the Z direction. Therefore, by causing the three Z-tilt adjustment mechanisms 43 to drive only the same amount, the substrate stage 20 can be slightly moved in the Z-axis direction, and the three Z-tilt adjustment mechanisms 43 can be independently driven. The tilt adjustment of the substrate stage 20. Thereby, the position of the Z-axis and the oblique direction of the substrate stage 20 is finely adjusted, and the mask M and the substrate W can be aligned in parallel at a predetermined interval.

再者,構成Y軸輸送機構41、X軸輸送機構42、及Z-傾斜調整機構43之滾珠螺桿軸機構與馬達之組合亦可由線型馬達而取代。Further, the combination of the ball screw shaft mechanism and the motor constituting the Y-axis conveying mechanism 41, the X-axis conveying mechanism 42, and the Z-tilt adjusting mechanism 43 may be replaced by a linear motor.

又,在本實施形態之曝光裝置1中,如圖1及圖2所示,設置檢測基板台20之位置之位置測定裝置即雷射測距裝置60。該雷射測距裝置60係對基板台移動機構40之驅動時所產生之基板台20之移動距離進行測定者。Further, in the exposure apparatus 1 of the present embodiment, as shown in FIGS. 1 and 2, a laser distance measuring device 60 which is a position measuring device for detecting the position of the substrate stage 20 is provided. The laser distance measuring device 60 measures the moving distance of the substrate stage 20 generated when the substrate stage moving mechanism 40 is driven.

雷射測距裝置60包括:X軸用鏡64及Y軸用鏡65,其配設於基板台20上;X軸測距器(測距器)61及平擺測定器(測距器)62,其配設於裝置基底50且對X軸用鏡64照射雷射光(測量光),接收藉由X軸用鏡64而反射之雷射光,並且測量基板台20之位置;及1台Y軸測距器(測距器)63,其對Y軸用鏡65照射雷射光,接收藉由Y軸用鏡65反射之雷射光,並測量基板台20之位置。並且,將基板台20之XY方向之位置檢測信號輸入至控制裝置。The laser ranging device 60 includes an X-axis mirror 64 and a Y-axis mirror 65 disposed on the substrate stage 20; an X-axis range finder (rangometer) 61 and a sway measuring device (a range finder) 62, which is disposed on the device substrate 50 and irradiates the X-axis mirror 64 with laser light (measurement light), receives the laser light reflected by the X-axis mirror 64, and measures the position of the substrate stage 20; and 1 Y A shaft range finder (rangometer) 63 that irradiates the laser light to the Y-axis mirror 65, receives the laser light reflected by the Y-axis mirror 65, and measures the position of the substrate stage 20. Further, a position detection signal in the XY direction of the substrate stage 20 is input to the control device.

於以上述方式構成之曝光裝置1中,可藉由歪斜角調整機構80對光罩M相對於長度方向中心C左右對稱地賦予歪斜角,並進行校正以降低光罩M之彎曲,使光罩M之平坦度提高。由此,可儘可能使光罩M之有效曝光區域中之光罩M與基板W之間隙均勻化。又,於相對於圖6(a)所示之較大尺寸之光罩M而使用圖6(b)所示之較小尺寸之光罩M之情形時,使氣缸裝置74動作,使一對可動光罩固持器72於彼此相隔或接近之方向上移動,從而可應對尺寸不同之複數個光罩M而吸附保持。進而,可應對尺寸不同之光罩M,藉由歪斜角調整機構80調整歪斜角,校正所安裝之光罩M之彎曲量之變化。藉此,可無關於光罩M之大小而固定地維持光罩M與基板W之間的間隙,維持較高之曝光精度。In the exposure apparatus 1 configured as described above, the skew angle adjustment mechanism 80 can impart a skew angle to the center of the longitudinal direction C of the mask M, and correct it to reduce the curvature of the mask M to make the mask The flatness of M is improved. Thereby, the gap between the mask M and the substrate W in the effective exposure region of the mask M can be made uniform as much as possible. Further, when the mask M of a smaller size shown in FIG. 6(b) is used with respect to the mask M of a larger size shown in FIG. 6(a), the cylinder device 74 is operated to make a pair The movable reticle holders 72 are moved in a direction apart from or close to each other, so that a plurality of reticle M having different sizes can be handled and adsorbed and held. Further, it is possible to cope with the mask M having different sizes, and the skew angle adjusting mechanism 80 adjusts the skew angle to correct the change in the amount of bending of the mounted mask M. Thereby, the gap between the mask M and the substrate W can be fixedly maintained regardless of the size of the mask M, and high exposure precision can be maintained.

繼而,參照自圖9至圖11對歪斜角調整機構之變形例進行詳細說明。圖9係歪斜角調整機構之一例即楔形機構之部分剖視側面圖,圖10係楔形機構之固定側錐形構件之部分剖視側面圖,圖11係楔形機構之可動側錐形構件之側面圖及剖面圖。Next, a modification of the skew angle adjusting mechanism will be described in detail with reference to FIGS. 9 to 11 . Figure 9 is a partial cross-sectional side view showing a wedge-shaped mechanism, which is an example of a skew-angle adjusting mechanism, Figure 10 is a partial cross-sectional side view of the fixed-side tapered member of the wedge-shaped mechanism, and Figure 11 is a side view of the movable-side tapered member of the wedge-shaped mechanism Figure and section view.

歪斜角調整機構80係由水平位準調整用之墊片81及楔形機構83構成。墊片81配置於位於內側(光罩保持框12之中心側)之滑件構件73bi之下表面與可動光罩固持器72之間,可動光罩固持器72藉由光罩固持器固定用螺栓82安裝於滑件構件73bi之下表面。於位於較墊片81更外側之滑件構件73bo與可動光罩固持器72之間,在可動光罩固持器72之上表面設置有施加向下之外力之楔形機構83。The skew angle adjustment mechanism 80 is composed of a spacer 81 for horizontal level adjustment and a wedge mechanism 83. The spacer 81 is disposed between the lower surface of the slider member 73bi located on the inner side (the center side of the reticle holding frame 12) and the movable reticle holder 72, and the movable reticle holder 72 is fixed by the reticle retainer 82 is mounted to the lower surface of the slider member 73bi. A wedge mechanism 83 for applying a downward external force is provided on the upper surface of the movable reticle holder 72 between the slider member 73bo located outside the spacer 81 and the movable reticle holder 72.

該楔形機構83包括:固定側錐形構件84,其具有自可動光罩固持器72之外方(圖9中為左側)朝向內方傾斜之傾斜面84a;可動側錐形構件85,其具有滑動自如地與固定側錐形構件84之傾斜面84a接觸之傾斜面85a;及輸送螺桿86,其作為使可動側錐形構件85於與墊片81相接或離開之方向上移動之可動側錐形構件輸送組件。輸送螺桿86保持於朝固定側錐形構件84之外方突出設置之托架87上。可動側錐形構件85中形成有具有與固定側錐形構件84之傾斜面84a相同之傾斜角且與傾斜面84a滑動接觸之傾斜面85a及長孔85b。The wedge mechanism 83 includes a fixed-side tapered member 84 having an inclined surface 84a that is inclined inward from the outside of the movable mask holder 72 (left side in FIG. 9); and a movable-side tapered member 85 having An inclined surface 85a slidably contacting the inclined surface 84a of the fixed-side tapered member 84; and a conveying screw 86 as a movable side for moving the movable-side tapered member 85 in a direction in which the movable-side tapered member 85 is in contact with or away from the spacer 81 Conical member conveying assembly. The conveying screw 86 is held on a bracket 87 that protrudes outward from the fixed-side tapered member 84. The movable side tapered member 85 is formed with an inclined surface 85a and a long hole 85b having the same inclination angle as the inclined surface 84a of the fixed side tapered member 84 and in sliding contact with the inclined surface 84a.

插通至可動光罩固持器72之螺栓孔72c中之固定側錐形構件固定用螺栓88貫通固定側錐形構件84之貫通孔84b、可動側錐形構件85之長孔85b且固定於滑件構件73bo之下表面。The fixed-side tapered member fixing bolt 88 inserted into the bolt hole 72c of the movable reticle holder 72 penetrates the through hole 84b of the fixed-side tapered member 84, the long hole 85b of the movable-side tapered member 85, and is fixed to the slide The lower surface of the member 73bo.

於此種構成中,藉由操作楔形機構83之輸送螺桿86使可動側錐形構件85於圖9中左右方向上移動且改變傾斜面84a、85a之滑動接觸位置而變更楔形機構83之高度。藉此,調整施加於較可動光罩固持器72之墊片81更外側(圖9中為左側)之向下之外力,以墊片81位置為中心變更可動光罩固持器72之傾斜度。In such a configuration, the height of the wedge mechanism 83 is changed by operating the conveying screw 86 of the wedge mechanism 83 to move the movable-side tapered member 85 in the left-right direction in FIG. 9 and changing the sliding contact position of the inclined surfaces 84a and 85a. Thereby, the downward external force applied to the outer side (the left side in FIG. 9) of the spacer 81 of the movable mask holder 72 is adjusted, and the inclination of the movable mask holder 72 is changed centering on the position of the spacer 81.

藉此,可藉由一對可動光罩固持器72賦予兩端吸附保持之光罩M歪斜角,並且可進行校正以降低光罩M之彎曲,從而可使光罩M之平坦度提高。再者,亦可藉由未圖示之電動致動器驅動可動側錐形構件85以代替輸送螺桿86而調整歪斜角。Thereby, the reticle angle of the reticle M which is adsorbed and held at both ends can be imparted by the pair of movable reticle holders 72, and correction can be performed to reduce the curvature of the reticle M, whereby the flatness of the reticle M can be improved. Further, the movable side tapered member 85 may be driven by an electric actuator (not shown) to adjust the skew angle instead of the conveying screw 86.

又,歪斜角調整機構80只要為可調整一對可動光罩固持器72之角度之機構,則並無特別限定,除上述所說明之墊片80a、80b或楔形機構83以外,亦可由藉由通電控制而可變更高度之壓電元件(未圖示)構成。Further, the skew angle adjusting mechanism 80 is not particularly limited as long as it can adjust the angle of the pair of movable mask holders 72, and may be used in addition to the spacers 80a and 80b or the wedge mechanism 83 described above. A piezoelectric element (not shown) whose height can be changed by energization control.

(第2實施形態)(Second embodiment)

圖12係表示歪斜角調整機構與第1實施形態不同之第2實施形態之曝光裝置之圖。於本實施形態之曝光裝置1中,歪斜角調整機構80配置於光罩保持框12與導件73a之間。Fig. 12 is a view showing an exposure apparatus of a second embodiment in which the skew angle adjusting mechanism is different from that of the first embodiment. In the exposure apparatus 1 of the present embodiment, the skew angle adjustment mechanism 80 is disposed between the mask holding frame 12 and the guide 73a.

藉由此種曝光裝置1,亦可與第1實施形態相同,無需更換光罩固持器便可應對不同尺寸之複數個光罩而吸附保持。又,可無關於光罩M之大小,藉由歪斜角調整機構80調整歪斜角並校正所安裝之光罩M之平坦度,從而固定地維持光罩M與基板W間之間隙且提高曝光精度。再者,於本實施形態之情形時,短邊側之可動光罩固持器72之吸附位置之高度隨著光罩M之大小變更而變化,因此必需於光罩台側或基板台側進行間隙調整。According to the exposure apparatus 1, as in the first embodiment, a plurality of masks of different sizes can be adsorbed and held without replacing the mask holder. Further, regardless of the size of the mask M, the skew angle adjustment mechanism 80 adjusts the skew angle and corrects the flatness of the mounted mask M, thereby maintaining the gap between the mask M and the substrate W and improving the exposure accuracy. . Further, in the case of the present embodiment, the height of the suction position of the movable mask holder 72 on the short side changes depending on the size of the mask M. Therefore, it is necessary to perform a gap on the mask stage side or the substrate stage side. Adjustment.

(變形例)(Modification)

圖13係表示第2實施形態之變形例之曝光裝置1之圖,於光罩保持框12與導件73a之間配置有第1歪斜角調整機構80A,於滑件構件73b與可動光罩固持器72之間配置有第2歪斜角調整機構80B。根據此種曝光裝置1,即便光罩保持框12之水平度稍微傾斜,亦可藉由第1歪斜角調整機構80A校正導件73a之傾斜度而使其水平。並且,藉由第2歪斜角調整機構80B調整可動光罩固持器72之歪斜角,校正伴隨光罩M之安裝之光罩M之彎曲量之變化,固定地維持光罩M與工件W之間的間隙,從而能夠以較高之曝光精度進行轉印曝光。Fig. 13 is a view showing an exposure apparatus 1 according to a modification of the second embodiment, in which a first skew angle adjustment mechanism 80A is disposed between the mask holding frame 12 and the guide 73a, and is held by the slider member 73b and the movable mask. A second skew angle adjustment mechanism 80B is disposed between the units 72. According to the exposure apparatus 1, even if the level of the mask holding frame 12 is slightly inclined, the inclination of the guide 73a can be corrected by the first skew angle adjusting mechanism 80A to be horizontal. Further, the second skew angle adjusting mechanism 80B adjusts the skew angle of the movable mask holder 72, corrects the change in the amount of bending of the mask M attached to the mask M, and maintains the gap between the mask M and the workpiece W fixedly. The gap enables the transfer exposure to be performed with higher exposure accuracy.

(第3實施形態)(Third embodiment)

圖14係表示作為第3實施形態之曝光裝置,藉由歪斜角調整機構對可動光罩固持器傾斜時於固定光罩固持器與可動光罩固持器之間所產生之階差進行調整之組件。Fig. 14 is a view showing a component for adjusting the step difference between the fixed mask holder and the movable mask holder when the movable mask holder is tilted by the skew angle adjusting mechanism as the exposure apparatus according to the third embodiment; .

例如,如圖15所示,若調整可動光罩固持器72之歪斜角,則有於固定光罩固持器71與可動光罩固持器72之間產生高度之差(階差)之情形,若該階差較大,則固持器71、72之剛性較高,因此有於可動光罩固持器72與光罩M之間出現間隙C而對曝光精度造成不良影響之虞。For example, as shown in FIG. 15, if the skew angle of the movable reticle holder 72 is adjusted, there is a case where a difference (step difference) in height is generated between the fixed reticle holder 71 and the movable reticle holder 72. When the step is large, the rigidity of the holders 71 and 72 is high, so that a gap C occurs between the movable mask holder 72 and the mask M, which adversely affects the exposure accuracy.

因此,如圖14所示,固定光罩固持器71及可動光罩固持器72分別切下近接之側緣部71d、72d之上表面側,從而形成有較剩餘部分更薄壁之薄壁部71e、72e。剛性變弱之薄壁部72e於吸附有保持光罩M時,自以圖14(b)中虛線所示之位置至以實線所示之位置於光罩固持器72之板厚方向產生彈性變形,於光罩固持器71、72與光罩M之間不產生間隙C地吸附保持光罩M。Therefore, as shown in FIG. 14, the fixed mask holder 71 and the movable mask holder 72 cut off the upper surface sides of the adjacent side edge portions 71d, 72d, respectively, thereby forming a thinner portion having a thinner wall than the remaining portion. 71e, 72e. When the thin portion 72e having the reduced rigidity absorbs the holding mask M, the elasticity is generated in the direction of the thickness of the mask holder 72 from the position shown by the broken line in Fig. 14 (b) to the position shown by the solid line. In the deformation, the mask M is sucked and held without generating a gap C between the mask holders 71 and 72 and the mask M.

薄壁部71e、72e之厚度t於將光罩固持器71、72之板厚設為h時,較佳為1/2h≦t≦2/3h。其原因在於,若薄壁部71e、72e之厚度t為1/2h以下,則有剛性過低光罩固持器71、72破損之虞,又,若為2/3h以上,則有剛性過高而於光罩固持器71、72與光罩M之間產生間隙C之虞。The thickness t of the thin portions 71e and 72e is preferably 1/2 h ≦ t ≦ 2 / 3 h when the thickness of the mask holders 71 and 72 is h. The reason for this is that if the thickness t of the thin portions 71e and 72e is 1/2 h or less, the mask holders 71 and 72 are too weak to be damaged, and if the thickness is less than 2/3 h, the rigidity is too high. A gap C is created between the mask holders 71, 72 and the mask M.

再者,如圖14(c)、圖14(d)所示,薄壁部71e、72e之前端亦可形成為剖面三角形狀或曲面形狀,從而可防止於光罩固持器71、72與光罩M之間產生間隙C。又,如圖14(e)、圖4(f)所示,薄壁部71e、72e亦可藉由不設置階差地將側緣部71d、72d設為剖面三角形狀或曲面形狀而形成,由於降低側緣部71d、72d之剛性,因此可防止於光罩固持器71、72與光罩M之間產生間隙C。Further, as shown in FIGS. 14(c) and 14(d), the front ends of the thin portions 71e and 72e may be formed in a triangular or curved shape in cross section, thereby preventing the reticle holders 71 and 72 from being light. A gap C is created between the covers M. Further, as shown in FIGS. 14(e) and 4(f), the thin portions 71e and 72e may be formed by forming the side edge portions 71d and 72d into a cross-sectional triangular shape or a curved shape without providing a step. Since the rigidity of the side edge portions 71d, 72d is lowered, the gap C between the mask holders 71, 72 and the mask M can be prevented from occurring.

又,作為調整固定光罩固持器71與可動光罩固持器72之階差之另一組件,於圖16(a)所示之光罩固持器71、72中,在近接之角部設置有倒角部71f、72f。藉此,光罩固持器71、72之角部間之跨距變長,光罩M之變形變得容易,因此可於光罩M與光罩固持器71、72之間不產生間隙地吸附保持。再者,較理想為於光罩固持器71、72之側面與倒角部71f、72f接合之脊線部,以曲面狀實施倒角而防止產生集中應力。又,如圖16(b)所示,只要使倒角部71f、72f之形狀為曲面形狀,則可進一步降低集中應力之產生,故而更佳。Further, as another component for adjusting the step difference between the fixed mask holder 71 and the movable mask holder 72, in the mask holders 71 and 72 shown in Fig. 16 (a), the near corner portion is provided. Chamfered portions 71f, 72f. Thereby, the span between the corner portions of the mask holders 71 and 72 becomes long, and the deformation of the mask M is facilitated, so that the gap between the mask M and the mask holders 71 and 72 can be adsorbed without a gap. maintain. Further, it is preferable that the ridge portions joined to the side faces of the mask holders 71 and 72 and the chamfered portions 71f and 72f are chamfered in a curved shape to prevent concentrated stress. Further, as shown in FIG. 16(b), if the shapes of the chamfered portions 71f and 72f are curved, the concentration stress can be further reduced, which is preferable.

圖17(a)係調整固定光罩固持器71與可動光罩固持器72之階差之又一組件,固定光罩固持器71包含自近接之側緣部71d之下表面延伸出之階部71g,可動光罩固持器72具有自側緣部72d之上表面延伸出之階部72g。光罩固持器71、72藉由將階部71g、72g彼此疊合,而可增強按壓光罩M之力,從而將光罩M確實無間隙地吸附保持。Fig. 17 (a) is another assembly for adjusting the step of the fixed reticle holder 71 and the movable reticle holder 72. The fixed reticle holder 71 includes a step extending from the lower surface of the side edge portion 71d of the proximal portion. 71g, the movable reticle holder 72 has a step portion 72g extending from the upper surface of the side edge portion 72d. The photomask holders 71 and 72 can increase the force of pressing the mask M by superimposing the step portions 71g and 72g on each other, thereby absorbing and holding the mask M without gaps.

進而,如圖17(b)所示,於固定光罩固持器71及可動光罩固持器72之疊合之階部72g設置調整螺栓79,並且調整固定光罩固持器71與可動光罩固持器72之高度以使固定光罩固持器71與可動光罩固持器72之下表面(光罩保持面)之階差不存在。於此情形時,於調整螺栓79之螺桿之前端部分設置Teflon(註冊商標)等滑移材料79a,從而防止固定光罩固持器71之階部71g之上表面71g1因調整螺栓79而磨損。Further, as shown in FIG. 17(b), the adjusting bolts 79 are provided on the overlapping portions 72g of the fixed mask holder 71 and the movable mask holder 72, and the fixed mask holder 71 and the movable mask are fixed. The height of the device 72 is such that the step difference between the fixed reticle holder 71 and the lower surface of the movable reticle holder 72 (the reticle holding surface) does not exist. In this case, a sliding material 79a such as Teflon (registered trademark) is provided at the front end portion of the screw of the adjusting bolt 79, thereby preventing the upper surface 71g1 of the step portion 71g of the fixed mask holder 71 from being worn by the adjusting bolt 79.

再者,設置薄壁部71f、72f或階部71g、72g之位置並不限定於側緣部71d、72d,亦可圍繞光罩固持器71、72之周圍而形成。Further, the positions at which the thin portions 71f and 72f or the step portions 71g and 72g are provided are not limited to the side edge portions 71d and 72d, and may be formed around the periphery of the mask holders 71 and 72.

(第4實施形態)(Fourth embodiment)

圖18係表示第4實施形態之曝光裝置之構成之側面圖。如圖18所示,本實施形態之曝光裝置1採用負壓校正機構90作為光罩M之歪斜角調整機構。光罩台10及基板台20之周圍藉由熱處理室91遮蔽。熱處理室91之側壁上設置有用於搬送基板W之開口91a。又,光罩台10之上方藉由光學系統處理室92遮蔽,並且與光學系統處理室92鄰接配置有光源處理室93。於光學系統處理室92與光源處理室93之間,配置透明板94,自光源處理室93內之高壓水銀燈31照射且穿透透明板94之曝光光經由光路L導入至光罩M上。Fig. 18 is a side view showing the configuration of an exposure apparatus according to a fourth embodiment. As shown in FIG. 18, the exposure apparatus 1 of this embodiment employs the negative pressure correction mechanism 90 as the skew angle adjustment mechanism of the mask M. The periphery of the mask stage 10 and the substrate stage 20 is shielded by the heat treatment chamber 91. An opening 91a for conveying the substrate W is provided on the side wall of the heat treatment chamber 91. Further, the upper side of the mask stage 10 is shielded by the optical system processing chamber 92, and the light source processing chamber 93 is disposed adjacent to the optical system processing chamber 92. Between the optical system processing chamber 92 and the light source processing chamber 93, a transparent plate 94 is disposed, and the exposure light that is irradiated from the high-pressure mercury lamp 31 in the light source processing chamber 93 and penetrates the transparent plate 94 is introduced into the mask M via the optical path L.

熱處理室91經由供氣通路95連接有正壓泵96,光學系統處理室92經由排氣通路97連接有負壓泵98。CPU(Central Processing Unit,中央處理單元)101分別由感測器102測定熱處理室91與光學系統處理室92之壓力,並且適當驅動控制正壓泵96及負壓泵98。The heat treatment chamber 91 is connected to the positive pressure pump 96 via the air supply passage 95, and the optical system processing chamber 92 is connected to the negative pressure pump 98 via the exhaust passage 97. The CPU (Central Processing Unit) 101 measures the pressure of the heat treatment chamber 91 and the optical system processing chamber 92 by the sensor 102, and appropriately controls the positive pressure pump 96 and the negative pressure pump 98.

根據本實施形態之曝光裝置1,將來自間隙感測器17(參照圖3)之信號與來自感測器102之信號建立關聯,預先求出可校正光罩M之彎曲之壓力差並記憶於CPU101中,由此使負壓泵98及正壓泵96動作,對熱處理室91內加壓並且對光學系統處理室92內減壓,並且於熱處理室91與光學系統處理室92之間施加壓力差,藉此可校正光罩M之彎曲。According to the exposure apparatus 1 of the present embodiment, the signal from the gap sensor 17 (see FIG. 3) is correlated with the signal from the sensor 102, and the pressure difference of the curvature of the correctable mask M is obtained in advance and memorized. In the CPU 101, the negative pressure pump 98 and the positive pressure pump 96 are thereby operated to pressurize the inside of the heat treatment chamber 91 and decompress the inside of the optical system processing chamber 92, and apply pressure between the heat treatment chamber 91 and the optical system processing chamber 92. Poor, whereby the curvature of the mask M can be corrected.

根據本實施形態之曝光裝置1,藉由壓力差校正光罩M之彎曲,因此對整體校正較大之光罩M之彎曲較佳。又,較理想為於熱處理室91及光學系統處理室92中配設未圖示之溫度調節裝置,以熱處理室91與光學系統處理室92之室內溫度差成為最小之方式進行溫度控制。其原因在於,光罩M之上表面側,於相對較大之空間(光學系統處理室92)內有氣體流動,因此光罩M之上表面容易冷卻,但成為光罩M之下表面側之熱處理室91內氣體之流動較少而難以冷卻,因此防止由光罩M之上下表面之溫度差所致之光罩M之熱變形(膨脹‧收縮)對光罩M之平坦度造成之影響。進而,由於成為熱源之高壓水銀燈31由透明板94間隔,因此具有由高壓水銀燈31產生之熱難以傳導至光罩M及基板W之優點,從而可高精度進行曝光轉印。According to the exposure apparatus 1 of the present embodiment, since the curvature of the mask M is corrected by the pressure difference, it is preferable to bend the mask M which is largely corrected as a whole. Moreover, it is preferable to arrange a temperature adjustment device (not shown) in the heat treatment chamber 91 and the optical system processing chamber 92, and to perform temperature control so that the indoor temperature difference between the heat treatment chamber 91 and the optical system processing chamber 92 is minimized. The reason for this is that gas flows in a relatively large space (optical system processing chamber 92) on the upper surface side of the mask M, so that the upper surface of the mask M is easily cooled, but becomes the lower surface side of the mask M. Since the flow of the gas in the heat treatment chamber 91 is small and it is difficult to cool, the thermal deformation (expansion/contraction) of the mask M due to the temperature difference between the upper and lower surfaces of the mask M is prevented from affecting the flatness of the mask M. Further, since the high-pressure mercury lamp 31 serving as a heat source is partitioned by the transparent plate 94, it is advantageous in that heat generated by the high-pressure mercury lamp 31 is hardly conducted to the mask M and the substrate W, and exposure transfer can be performed with high precision.

再者,於上述實施形態中,例如,亦可併設歪斜角調整機構。Furthermore, in the above embodiment, for example, a skew angle adjustment mechanism may be provided in combination.

又,於上述實施形態中,係將光罩保持框12作為光罩台基底側構件,但亦可根據光罩台之構成將光罩台基底11作為光罩台基底側構件,固定光罩固持器71、可動光罩固持器72、線性導件73、氣缸裝置74、及歪斜角調整機構80配置於光罩台基底11之下表面側。Further, in the above-described embodiment, the mask holding frame 12 is used as the mask base side member. However, the mask base 11 can be used as the mask base side member according to the configuration of the mask holder, and the mask can be fixed. The movable unit 71, the movable guide holder 72, the linear guide 73, the cylinder device 74, and the skew angle adjusting mechanism 80 are disposed on the lower surface side of the mask stage base 11.

(第5實施形態)(Fifth Embodiment)

以下,基於圖式對本發明之曝光裝置之第5實施形態進行詳細說明。再者,本實施形態於光罩台之構成上與第1實施形態不同,對與第1實施形態相同或同等部分附加相同符號並省略或簡化說明。Hereinafter, a fifth embodiment of the exposure apparatus of the present invention will be described in detail based on the drawings. In the present embodiment, the configuration of the reticle stage is different from that of the first embodiment, and the same or equivalent portions as those of the first embodiment are denoted by the same reference numerals, and their description is omitted or simplified.

於本實施形態之光罩台10中,如圖19、圖20及圖22所示,於光罩保持框12之下表面側包括:一對固定光罩固持器171,其係配置於開口12b之長邊側之第1光罩固持器;一對可動光罩固持器172,其係配置於開口12b之短邊側之第2光罩固持器;複數條線性導件(導引機構)73,其設置於光罩保持框12與各可動光罩固持器172之間;及氣缸裝置74,其係使可動光罩固持器172沿開口12b之長邊移動之驅動機構。In the mask stage 10 of the present embodiment, as shown in FIG. 19, FIG. 20 and FIG. 22, on the lower surface side of the mask holding frame 12, a pair of fixed mask holders 171 are disposed on the opening 12b. a first photomask holder on the long side; a pair of movable mask holders 172 disposed on the short side of the opening 12b; a plurality of linear guides (guide means) 73 It is disposed between the reticle holding frame 12 and each of the movable reticle holders 172; and the cylinder device 74 is a driving mechanism for moving the movable reticle holder 172 along the long side of the opening 12b.

如圖20所示,於隔著墊片等固定於光罩保持框12之下表面之一對固定光罩固持器171之下表面(基板W側),形成於長度方向中央之主吸附槽171a與於該主吸附槽171a之左右與主吸附槽171a獨立而形成之輔助吸附槽171b於特定方向(X方向)上分割設置。又,於可移動地配設於光罩保持框12之下方之可動光罩固持器172之下表面,長邊方向上排列成2行之主吸附槽172a、輔助吸附槽172b環繞短邊方向之大致全長而形成。As shown in FIG. 20, one of the lower surfaces of the mask holding frame 12 is fixed to the lower surface (the substrate W side) of the mask holder 171 via a spacer or the like, and the main adsorption groove 171a formed at the center in the longitudinal direction is formed. The auxiliary adsorption grooves 171b formed independently of the main adsorption grooves 171a on the left and right sides of the main adsorption tank 171a are divided in a specific direction (X direction). Further, the lower surface of the movable mask holder 172 movably disposed below the mask holding frame 12 is arranged in two rows of the main adsorption grooves 172a and the auxiliary adsorption grooves 172b in the longitudinal direction. It is formed over substantially the entire length.

固定光罩固持器171及可動光罩固持器172之各吸附槽171a、171b、172a、172b分別為用於吸附光罩M之未描繪光罩圖案之周緣部之槽,與真空式吸附裝置110連接(參照圖21),且分別吸附光罩M之4邊而裝卸自如地保持。即,固定光罩固持器171吸附保持沿特定方向(X方向)延伸之光罩M之相對向之2邊(長邊),可動光罩固持器172吸附保持沿與特定方向正交之方向(Y方向)延伸之光罩M之相對向之2邊(短邊)。Each of the adsorption grooves 171a, 171b, 172a, and 172b of the fixed mask holder 171 and the movable mask holder 172 is a groove for adsorbing the peripheral portion of the mask M where the mask pattern is not drawn, and the vacuum type adsorption device 110 The connection (see FIG. 21) is carried out, and the four sides of the mask M are respectively adsorbed and detachably held. That is, the fixed mask holder 171 adsorbs and maintains the opposite sides (long sides) of the mask M extending in a specific direction (X direction), and the movable mask holder 172 is adsorbed and held in a direction orthogonal to a specific direction ( The opposite direction of the mask M extending in the Y direction is the two sides (short side).

如圖21所示,固定光罩固持器171及可動光罩固持器172之各自之主吸附槽171a、172a經由配管111與真空式吸附裝置110連接。又,固定光罩固持器171之各輔助吸附槽171b經由配管112及可切換接通/斷開之電磁閥113與真空式吸附裝置110連接,可動光罩固持器172之各輔助吸附槽172b經由配管114及可切換接通/斷開之電磁閥115與真空式吸附裝置110連接。作為電磁閥113、115,使用直動式或導引式者。As shown in FIG. 21, the main adsorption grooves 171a and 172a of the fixed mask holder 171 and the movable mask holder 172 are connected to the vacuum adsorption device 110 via a pipe 111. Further, each of the auxiliary adsorption tanks 171b of the fixed mask holder 171 is connected to the vacuum type adsorption device 110 via a pipe 112 and a switchable on/off solenoid valve 113, and each of the auxiliary adsorption grooves 172b of the movable mask holder 172 is via The piping 114 and the switchable on/off solenoid valve 115 are connected to the vacuum adsorption device 110. As the solenoid valves 113 and 115, a direct-acting or guided type is used.

藉此,於光罩M之吸附保持時,於固定光罩固持器171及可動光罩固持器172之主吸附槽171a、172a中經由配管111始終連接真空式吸附裝置110並供給真空,並且藉由電磁閥113、115之切換,選擇性地對固定光罩固持器171及可動光罩固持器172之各輔助吸附槽171b、172b供給真空,可使任意之吸附槽為動作狀態。此處,存在光罩M之大小或圖案之尺寸藉由多倒角時描繪於有效曝光區域中之圖案之配置等而稍微(例如10~20 mm左右)不同,但固定光罩固持器171及可動光罩固持器172可應對此種尺寸不同之光罩M而吸附保持。In the main suction tanks 171a and 172a of the fixed mask holder 171 and the movable mask holder 172, the vacuum adsorption apparatus 110 is always connected via the piping 111 and supplied with vacuum, and the vacuum is supplied. By switching between the solenoid valves 113 and 115, vacuum is selectively supplied to each of the auxiliary adsorption grooves 171b and 172b of the fixed mask holder 171 and the movable mask holder 172, and any of the adsorption grooves can be operated. Here, the size of the mask M or the size of the pattern is slightly different (for example, about 10 to 20 mm) by the arrangement of the pattern drawn in the effective exposure region at the time of multi-chamfering, but the fixed mask holder 171 and The movable reticle holder 172 can be sucked and held in response to the reticle M of such a different size.

於圖20所示之實施例中,將電磁閥113切換為接通狀態,將電磁閥115切換為斷開狀態,固定光罩固持器171之主吸附槽171a及輔助吸附槽171b與可動光罩固持器172之主吸附槽172a成為動作狀態。藉此,較大尺寸之光罩M藉由主吸附槽171a、172a及輔助吸附槽171b而吸附保持。In the embodiment shown in FIG. 20, the solenoid valve 113 is switched to the ON state, the solenoid valve 115 is switched to the OFF state, and the main adsorption tank 171a and the auxiliary adsorption tank 171b of the reticle holder 171 are fixed to the movable hood. The main adsorption tank 172a of the holder 172 is in an operating state. Thereby, the mask M of a larger size is adsorbed and held by the main adsorption grooves 171a and 172a and the auxiliary adsorption groove 171b.

如圖19所示,線性導件73係由安裝於光罩保持框12之下表面之導件73a、及安裝於可動光罩固持器172且導引至導件73a於X方向(開口12b之長邊方向)上可移動之滑件構件73b而構成。As shown in FIG. 19, the linear guide 73 is guided by the guide 73a attached to the lower surface of the reticle holding frame 12, and attached to the movable reticle holder 172 and guided to the guide 73a in the X direction (the opening 12b) The slider member 73b is movable in the longitudinal direction.

又,如圖22所示,可動光罩固持器172之驅動機構即一對氣缸裝置74對應於各可動光罩固持器172配置於其長度方向大致中央,換言之配置於光罩保持框12之短邊之大致中央,且延設至長度方向上。各氣缸裝置74中,氣缸本體74a固定於光罩保持框12之下表面,活塞74b旋轉自如地嵌合於自可動光罩固持器172向上方突出設置之突起部172c之支持軸75上。Further, as shown in FIG. 22, the pair of cylinder devices 74, which are driving means of the movable mask holder 172, are disposed substantially at the center in the longitudinal direction of each of the movable mask holders 172, in other words, in the mask holding frame 12. The side is roughly central and extends to the length direction. In each of the cylinder devices 74, the cylinder main body 74a is fixed to the lower surface of the reticle holding frame 12, and the piston 74b is rotatably fitted to the support shaft 75 of the projection 172c projecting upward from the movable reticle holder 172.

又,於活塞74b之動作方向前方之光罩保持框12之下表面,固定包括減振器76之止動部77,氣缸裝置74動作活塞74b延伸時,使突起部172c(可動光罩固持器172)經由減振器76與止動部77抵接,不施加衝擊地將可動光罩固持器172定位於特定位置。Further, a stopper portion 77 including a damper 76 is fixed to the lower surface of the reticle holding frame 12 in the forward direction of the movement of the piston 74b. When the cylinder device 74 moves the piston 74b to extend, the projection portion 172c (movable reticle holder) is provided. 172) Abutting against the stopper portion 77 via the damper 76, the movable mask holder 172 is positioned at a specific position without applying an impact.

止動部77之位置係限制安裝較大尺寸之光罩M時之可動光罩固持器172之位置者,氣缸裝置74之活塞74b進入至氣缸本體74a內時之可動光罩固持器172之位置係安裝較小尺寸之光罩M時之可動光罩固持器172之位置。The position of the stopper portion 77 limits the position of the movable reticle holder 172 when the reticle M of a larger size is mounted, and the position of the movable reticle holder 172 when the piston 74b of the cylinder device 74 enters the cylinder body 74a The position of the movable reticle holder 172 when the reticle M of a smaller size is mounted.

如上所述,固定光罩固持器171、可動光罩固持器172、線性導件73、及氣缸裝置74安裝於光罩保持框12,因此與光罩保持框12一起相對於光罩台基底11在X軸、Y軸、θ方向上可移動。As described above, the fixed reticle holder 171, the movable reticle holder 172, the linear guide 73, and the cylinder device 74 are attached to the reticle holding frame 12, and thus, together with the reticle holding frame 12, with respect to the reticle base 11 It is movable in the X-axis, Y-axis, and θ directions.

並且,使氣缸裝置74動作,安裝較大尺寸之光罩M時,使一對可動光罩固持器172同時向彼此相隔之方向(外方)移動而擴大間隔,當安裝較小尺寸之光罩M時,使一對可動光罩固持器172同時向彼此接近之方向(內方)移動而縮短間隔,藉此可容易應對尺寸不同之複數個光罩M。Further, when the cylinder device 74 is operated to mount the mask M of a large size, the pair of movable mask holders 172 are simultaneously moved in the direction in which they are spaced apart (outside) to increase the interval, and when the mask of a smaller size is mounted In the case of M, the pair of movable mask holders 172 are simultaneously moved in the direction in which they approach each other (inner side) to shorten the interval, whereby a plurality of masks M having different sizes can be easily handled.

根據可定位於2處之本實施形態之氣缸裝置74,可應對大小、2種尺寸之光罩M。此時,使一對氣缸裝置74同時動作,使一對可動光罩固持器172始終位於左右對稱位置,藉此不使兩可動光罩固持器172之中央位置、即光罩M之中心移動便可更換光罩M。According to the cylinder device 74 of the present embodiment which can be positioned at two locations, it is possible to cope with the size and the size of the mask M. At this time, the pair of cylinder devices 74 are simultaneously operated, so that the pair of movable mask holders 172 are always positioned at the left-right symmetry position, thereby preventing the central position of the two movable mask holders 172, that is, the center of the mask M from being moved. The mask M can be replaced.

圖23係變形例之驅動裝置之側面圖,包括減振器76之止動部77例如藉由電動致動器78而可於活塞74b之移動方向上移動。藉此,可將藉由氣缸裝置74之可動光罩固持器172之停止位置定位於3處以上之複數位置,進而可定位於任意位置,並且可應對尺寸不同之3個以上之光罩M或大小之微小變化。23 is a side view of the driving device according to the modification, and the stopper portion 77 including the damper 76 is movable in the moving direction of the piston 74b by, for example, the electric actuator 78. Thereby, the stop position of the movable mask holder 172 of the cylinder device 74 can be positioned at a plurality of positions of three or more positions, and can be positioned at any position, and can handle three or more masks M of different sizes or Minor changes in size.

又,驅動裝置亦可由電動馬達(未圖示)構成以代替氣缸裝置74,根據電動馬達,容易將複數個停止位置設定為任意位置,並且可使可動光罩固持器172停止於該停止位置。Further, the drive device may be constituted by an electric motor (not shown) instead of the cylinder device 74. Depending on the electric motor, it is easy to set a plurality of stop positions to an arbitrary position, and the movable shutter holder 172 can be stopped at the stop position.

光罩M之素材即玻璃基板使用短邊側之2邊之長度大致相同,長邊側之2邊之長度不同之複數片玻璃基板,並且於該玻璃基板上描繪光罩圖案。因此,藉由形成於特定大小之玻璃基板上之光罩圖案或圖案佈局,殘留於4邊之周緣部之非圖案區域、即藉由光罩固持器171、172之可吸附區域之大小不同。The material of the mask M is a glass substrate in which a length of two sides on the short side is substantially the same, and a plurality of glass substrates having different lengths on both sides of the long side are used, and a mask pattern is drawn on the glass substrate. Therefore, the size of the non-pattern area remaining in the peripheral portion of the four sides, that is, the size of the adsorbable regions by the photomask holders 171, 172, is different by the mask pattern or the pattern layout formed on the glass substrate of a specific size.

圖20係保持光罩尺寸較大,短邊側之可吸附區域較小(光罩圖案較大)之光罩M之情形之例,藉由使活塞74b延伸直至與止動部77抵接,並使一對可動光罩固持器172較寬地相隔,而使輔助吸附槽172b位於光罩M之外方而擴大圖案區域。並且,將電磁閥113設為接通狀態,將電磁閥115設為斷開狀態並停止輔助吸附槽172b之吸附(參照圖21)。藉此,光罩M藉由固定光罩固持器171之吸附槽171a、171b及可動光罩固持器172之輔助吸附槽172b而吸附保持。20 is an example of a case where the mask M having a large size of the mask and a small adsorbable area on the short side (the mask pattern is large) is held, and the piston 74b is extended until it abuts against the stopper portion 77. The pair of movable mask holders 172 are spaced apart from each other, and the auxiliary adsorption grooves 172b are positioned outside the mask M to enlarge the pattern area. Then, the electromagnetic valve 113 is turned on, and the electromagnetic valve 115 is turned off, and the adsorption of the auxiliary adsorption tank 172b is stopped (see FIG. 21). Thereby, the photomask M is adsorbed and held by the adsorption grooves 171a and 171b of the fixed photomask holder 171 and the auxiliary adsorption grooves 172b of the movable photomask holder 172.

圖24係保持光罩尺寸較大,短邊側之可吸附區域較大之光罩M之情形之例,引入活塞74b而縮短一對可動光罩固持器172之間隔,並使可動光罩固持器172之主吸附槽172a、輔助吸附槽172b位於光罩M之內側。並且,將電磁閥113、115均設為接通狀態,並藉由固定光罩固持器171之吸附槽171a、171b及可動光罩固持器172之吸附槽172a、172b而吸附光罩M,從而確實保持。於此情形時,光罩M之短邊側有效利用較大之可吸附區域並藉由2個吸附槽172a、172b吸附,因此保持力提高。Fig. 24 is an example of a case where the reticle M having a large reticle size and a large adsorbable area on the short side is held, and the piston 74b is introduced to shorten the interval between the pair of movable reticle holders 172, and the movable reticle is held. The main adsorption tank 172a and the auxiliary adsorption tank 172b of the vessel 172 are located inside the mask M. Further, all of the solenoid valves 113 and 115 are set to the ON state, and the reticle M is adsorbed by the adsorption grooves 171a and 171b of the reticle holder 171 and the adsorption grooves 172a and 172b of the movable reticle holder 172. Really keep it. In this case, the short side of the mask M is effectively utilized by the larger adsorbable region and adsorbed by the two adsorption grooves 172a and 172b, so that the holding force is improved.

圖25係光罩尺寸較小,短邊側之可吸附區域較大之情形之例,由於固定光罩固持器171之輔助吸附槽171b與光罩M偏離,因此將電磁閥83切換為斷開狀態而停止輔助吸附槽171b之吸附,並且將電磁閥85設為接通狀態,藉由固定光罩固持器171之主吸附槽171a與可動光罩固持器172之主吸附槽172a及輔助吸附槽172b而吸附保持光罩M。於此情形時,光罩M之短邊側亦藉由2個吸附槽172a、172b吸附保持。Fig. 25 shows an example in which the size of the mask is small and the adsorbable area on the short side is large. Since the auxiliary adsorption groove 171b of the fixed mask holder 171 is deviated from the mask M, the solenoid valve 83 is switched off. The state stops the adsorption of the auxiliary adsorption tank 171b, and the solenoid valve 85 is set to the ON state, by fixing the main adsorption tank 171a of the mask holder 171 and the main adsorption tank 172a and the auxiliary adsorption tank of the movable mask holder 172. The reticle M is adsorbed and held by 172b. In this case, the short side of the mask M is also adsorbed and held by the two adsorption grooves 172a and 172b.

圖26係光罩尺寸較小,短邊側之可吸附區域較小之情形之例,固定光罩固持器171之輔助吸附槽171b、及可動光罩固持器172之輔助吸附槽172b與光罩M偏離,將電磁閥113、115均切換為斷開狀態,並停止輔助吸附槽171b、172b之吸附。藉此,藉由固定光罩固持器171之主吸附槽171a與可動光罩固持器172之主吸附槽172a而吸附保持光罩M,從而應對較小之光罩M。26 is an example of a case where the size of the mask is small and the adsorbable area on the short side is small, the auxiliary adsorption groove 171b of the fixed mask holder 171, and the auxiliary adsorption groove 172b and the mask of the movable mask holder 172. When M is deviated, the solenoid valves 113 and 115 are both switched to the off state, and the adsorption of the auxiliary adsorption grooves 171b and 172b is stopped. Thereby, the mask M is sucked and held by fixing the main adsorption groove 171a of the mask holder 171 and the main adsorption groove 172a of the movable mask holder 172, thereby coping with the small mask M.

於以上述方式構成之曝光裝置1中,無需更換光罩固持器便可應對不同尺寸之複數個光罩,進而應對可吸附區域不同之複數個光罩,從而有效利用可吸附區域且可確實吸附保持。In the exposure apparatus 1 configured as described above, it is possible to cope with a plurality of masks of different sizes without replacing the mask holder, and to cope with a plurality of masks having different adsorption regions, thereby effectively utilizing the adsorbable region and reliably adsorbing maintain.

再者,與第1及第2光罩固持器171、172之各吸附槽171a、171b、172a、172b連接之空壓電路並不限定於上述實施形態者,亦可由圖27所示之變形例而構成。具體而言,各固定光罩固持器171之主吸附槽171a與可切換接通/斷開之各電磁閥116連接,各可動光罩固持器172之主吸附槽172a與可切換接通/斷開之各電磁閥117連接。並且,該等各電磁閥116、117經由配管111與真空式吸附裝置110連接。又,各固定光罩固持器171之輔助吸附槽171b與可切換接通/斷開之各電磁閥113連接,各電磁閥113經由配管112與真空式吸附裝置110連接。進而,各可動光罩固持器172之輔助吸附槽172b與可切換接通/斷開之各電磁閥115連接,各電磁閥115經由配管114與真空式吸附裝置110連接。Further, the air compressor circuit connected to each of the adsorption grooves 171a, 171b, 172a, and 172b of the first and second mask holders 171 and 172 is not limited to the above embodiment, and may be deformed as shown in FIG. Formed as an example. Specifically, the main adsorption slots 171a of the fixed photomask holders 171 are connected to the solenoid valves 116 that can be switched on/off, and the main adsorption slots 172a of the movable mask holders 172 are switchable on/off. The respective solenoid valves 117 are connected. Further, the electromagnetic valves 116 and 117 are connected to the vacuum adsorption device 110 via a pipe 111. Further, the auxiliary adsorption grooves 171b of the fixed mask holders 171 are connected to the respective solenoid valves 113 that can be switched on/off, and the electromagnetic valves 113 are connected to the vacuum type adsorption device 110 via the pipes 112. Further, the auxiliary adsorption tank 172b of each of the movable mask holders 172 is connected to each of the solenoid valves 115 that can be switched on/off, and each of the electromagnetic valves 115 is connected to the vacuum type adsorption device 110 via a pipe 114.

即,如該變形例般,空壓電路可設置最大且與吸附槽之數量對應之數量之電磁閥。如此,針對每個吸附槽171a、171b、172a、172b逐個設置電磁閥113、115、116、117,藉此容易控制各吸附槽171a、171b、172a、172b之流量,從而可實現最佳之吸附。特別是以各吸附槽171a、171b、172a、172b之負壓變得相同之方式逐個控制各電磁閥113、115、116、117之負壓,而可穩定吸附光罩M。That is, as in this modification, the air compressor circuit can be provided with the largest number of solenoid valves corresponding to the number of adsorption grooves. In this manner, the electromagnetic valves 113, 115, 116, and 117 are provided one by one for each of the adsorption tanks 171a, 171b, 172a, and 172b, whereby the flow rates of the adsorption tanks 171a, 171b, 172a, and 172b can be easily controlled, thereby achieving optimum adsorption. . In particular, the negative pressure of each of the electromagnetic valves 113, 115, 116, and 117 is controlled one by one in such a manner that the negative pressures of the respective adsorption grooves 171a, 171b, 172a, and 172b are the same, and the absorbing mask M can be stably adsorbed.

再者,於第5實施形態之包含光罩台之曝光裝置中,亦可採用圖18所示之可校正光罩M之彎曲之負壓校正機構90。又,光罩M之彎曲之校正機構並不限定於藉由壓力差校正彎曲之負壓校正機構,亦可與上述實施形態相同,高度不同之一對墊片等調整光罩固持器之安裝角度而可調整光罩之歪斜角之歪斜角調整機構。進而,亦可併設負壓校正機構與歪斜角調整機構。Further, in the exposure apparatus including the mask stage of the fifth embodiment, the negative pressure correction mechanism 90 for correcting the curvature of the mask M shown in Fig. 18 can be used. Further, the correction mechanism of the curvature of the mask M is not limited to the negative pressure correction mechanism for correcting the bending by the pressure difference, and may be the same as the above-described embodiment, and the height of the difference may be adjusted to the mounting angle of the mask holder for the spacer or the like. The skew angle adjustment mechanism of the skew angle of the reticle can be adjusted. Further, a negative pressure correction mechanism and a skew angle adjustment mechanism may be provided in combination.

又,於第5實施形態中,作為尺寸不同之光罩,使用短邊側之2邊之長度大致相同,長邊側之2邊之長度不同之大小之光罩進行了說明,但亦可為長邊側之2邊之長度大致相同,短邊側之2邊之長度不同之光罩。Further, in the fifth embodiment, the photomasks having different sizes are used, and the masks having the same length on both sides of the short side and the lengths of the two sides on the long side are different. The length of the two sides of the long side is substantially the same, and the length of the two sides of the short side is different.

(第6實施形態)(Sixth embodiment)

以下,基於圖式對本發明之曝光裝置之第6實施形態進行詳細說明。再者,本實施形態於光罩台之構成上與第1實施形態不同,對與第1實施形態相同或同等部分附加相同符號並省略或簡化說明。Hereinafter, a sixth embodiment of the exposure apparatus of the present invention will be described in detail based on the drawings. In the present embodiment, the configuration of the reticle stage is different from that of the first embodiment, and the same or equivalent portions as those of the first embodiment are denoted by the same reference numerals, and their description is omitted or simplified.

於本實施形態之光罩台中,如圖28所示,於光罩保持框12之下表面,隔著墊片15固定有保持光罩M之一對光罩固持器14。光罩固持器14與光罩保持框12一起可相對於光罩台基底11於X軸、Y軸、θ方向上移動。再者,光罩固持器14亦可為不分割為2部分而兩端與矩形框狀連接之一體型光罩固持器。In the mask stage of the present embodiment, as shown in FIG. 28, one of the holding masks M and the mask holder 14 are fixed to the lower surface of the mask holding frame 12 via the spacer 15. The mask holder 14 is movable with the mask holding frame 12 in the X-axis, Y-axis, and θ directions with respect to the mask stage base 11. Furthermore, the photomask holder 14 may be a one-piece type photomask holder that is not divided into two parts and that is connected to the rectangular frame at both ends.

如圖29所示,於一對光罩固持器14之下表面(基板W側),設置有主吸附槽14a,其形成於長度方向中央;及一對輔助吸附槽14b,其於該主吸附槽14a之左右與主吸附槽14a獨立而形成。光罩固持器14之主吸附槽14a、及輔助吸附槽14b係用於吸附光罩M之未描繪光罩圖案之長邊側之2邊之周緣之槽。As shown in FIG. 29, on the lower surface (the substrate W side) of the pair of mask holders 14, a main adsorption groove 14a is formed, which is formed at the center in the longitudinal direction, and a pair of auxiliary adsorption grooves 14b for the main adsorption. The left and right sides of the groove 14a are formed independently of the main adsorption groove 14a. The main adsorption tank 14a of the mask holder 14 and the auxiliary adsorption tank 14b are used to adsorb the grooves of the periphery of the two sides of the long side of the mask M which are not drawn.

主吸附槽14a、及輔助吸附槽14b分別經由可切換接通/斷開之電磁閥113、115而與真空式吸附裝置110連接。具體而言,各主吸附槽14a與可切換接通/斷開之各電磁閥113連接,各電磁閥113經由配管111與真空式吸附裝置110連接。又,各輔助吸附槽14b與可切換接通/斷開之各電磁閥115連接,各電磁閥115經由配管112與真空式吸附裝置110連接。因此,適當切換電磁閥113、115,並藉由供給至任意吸附槽之真空而分別吸附光罩M之2邊並裝卸自如地保持。作為電磁閥113、115,使用線性運動式或導引式者。The main adsorption tank 14a and the auxiliary adsorption tank 14b are respectively connected to the vacuum adsorption device 110 via the solenoid valves 113 and 115 that can be switched on/off. Specifically, each of the main adsorption tanks 14a is connected to each of the solenoid valves 113 that can be switched on/off, and each of the solenoid valves 113 is connected to the vacuum adsorption device 110 via a pipe 111. Further, each of the auxiliary adsorption tanks 14b is connected to each of the solenoid valves 115 that can be switched on/off, and each of the electromagnetic valves 115 is connected to the vacuum type adsorption device 110 via a pipe 112. Therefore, the solenoid valves 113 and 115 are appropriately switched, and the two sides of the mask M are respectively sucked by the vacuum supplied to any of the adsorption grooves, and are detachably held. As the solenoid valves 113, 115, a linear motion type or a guide type is used.

如圖29所示,該空壓電路設置最大且與吸附槽之數量相對應之數量之電磁閥。如此,針對每個吸附槽14a、14b逐個設置電磁閥113、115,藉此容易控制各吸附槽14a、14b之流量,從而可實現最佳吸附。特別是藉由以各吸附槽14a、14b之負壓變得相同之方式逐個控制各電磁閥113、115之負壓,而可穩定吸附光罩M。再者,可考慮零件件數(數目),主吸附槽14a不設置電磁閥而是經由配管111與真空式吸附裝置110連接,複數個輔助吸附槽14b設置共用之電磁閥115,並經由配管112與真空式吸附裝置110連接。As shown in Fig. 29, the air compressor circuit is provided with a solenoid valve which is the largest and corresponds to the number of adsorption grooves. In this way, the electromagnetic valves 113 and 115 are provided one by one for each of the adsorption tanks 14a and 14b, whereby the flow rate of each of the adsorption tanks 14a and 14b can be easily controlled, and optimum adsorption can be achieved. In particular, the negative pressure of each of the electromagnetic valves 113 and 115 is controlled one by one in such a manner that the negative pressure of each of the adsorption tanks 14a and 14b becomes the same, whereby the absorbing mask M can be stably adsorbed. Further, the number of parts (number) may be considered, and the main adsorption tank 14a is connected to the vacuum type adsorption device 110 via the pipe 111 without the electromagnetic valve, and the plurality of auxiliary adsorption grooves 14b are provided with the common electromagnetic valve 115, and the pipe 112 is provided via the pipe 112. It is connected to the vacuum adsorption device 110.

此處,存在光罩M之尺寸藉由多倒角時描繪於有效曝光區域之圖案之配置等(例如10~20 mm左右)而不同,但光罩固持器14可應對此種尺寸(長邊側之長度)不同之光罩M而吸附保持。具體而言,如圖30(a)所示,藉由使主吸附槽14a及輔助吸附槽14b同時動作而吸附保持較大尺寸之光罩ML ,如圖30(b)所示,藉由僅使主吸附槽14a動作而吸附保持較小尺寸之光罩MsHere, the size of the mask M differs depending on the arrangement of the pattern drawn on the effective exposure area at the time of multi-chamfering (for example, about 10 to 20 mm), but the mask holder 14 can cope with such a size (long side) The length of the side is different from the mask M and is adsorbed and held. Specifically, as shown in FIG. 30(a), the main adsorption tank 14a and the auxiliary adsorption tank 14b are simultaneously operated to adsorb and hold the mask M L of a large size, as shown in FIG. 30(b). Only the main adsorption tank 14a is operated to adsorb and hold the mask M s of a smaller size.

又,於本實施形態之曝光裝置中,亦採用圖18所示之可校正光罩M之彎曲之負壓校正機構90。Further, in the exposure apparatus of the present embodiment, the negative pressure correction mechanism 90 for correcting the curvature of the mask M shown in Fig. 18 is also employed.

於以上述方式構成之曝光裝置1中,在圖31(a)所示之長邊側之2邊藉由一對光罩固持器14吸附保持之光罩M中,X方向彎曲量成為固定(參照圖31(b)),Y方向彎曲量於中央部最大,成為隨著向光罩M之長邊側周緣部接近逐漸變小之抛物線狀之彎曲(參照圖31(c))。換言之,光罩M之彎曲成為2維形狀之相對單純之彎曲形狀。In the exposure apparatus 1 configured as described above, the amount of bending in the X direction is fixed in the mask M which is held by the pair of mask holders 14 on the long sides of the side shown in Fig. 31 (a). Referring to Fig. 31 (b), the amount of bending in the Y direction is the largest at the center portion, and is a parabolic curve that gradually decreases toward the peripheral edge portion of the long side of the mask M (see Fig. 31 (c)). In other words, the curvature of the mask M is a relatively simple curved shape of a two-dimensional shape.

因此,2邊吸附保持之本實施形態之光罩M之彎曲與4邊保持之光罩M之彎曲相比,彎曲之絕對值變大,但相對於4邊保持之情形之複雜之3維彎曲(參照圖35),成為X方向彎曲量固定之單純之彎曲形狀。因此,(X方向彎曲無需校正),藉由負壓校正機構90對光罩M之兩面賦予壓力差,藉此可容易且高精度地校正Y方向彎曲,從而使光罩M之平坦度提高。藉此,可儘可能使光罩M之有效曝光區域中之光罩M與基板W之間隙均與化,並且可獲得較高之曝光精度。Therefore, the bending of the mask M of the present embodiment in which the two sides are adsorbed and held is larger than the bending of the mask M held by the four sides, but the three-dimensional bending is complicated with respect to the four sides. (Refer to Fig. 35), it is a simple curved shape in which the amount of bending in the X direction is fixed. Therefore, (the correction in the X direction does not require correction), the pressure difference is applied to both surfaces of the mask M by the negative pressure correcting mechanism 90, whereby the Y-direction bending can be easily and accurately corrected, and the flatness of the mask M can be improved. Thereby, the gap between the mask M and the substrate W in the effective exposure region of the mask M can be made as uniform as possible, and high exposure precision can be obtained.

又,藉由切換輔助吸附槽14b之吸附,而可吸附保持圖31(a)所示之較大尺寸之光罩ML 及圖31(b)所示之較小尺寸之光罩Ms 之兩者,並且可應對長邊側之尺寸不同之複數個光罩M。進而,即便光罩M之長邊側之尺寸不同,於X方向彎曲量為固定之狀態下,Y方向之彎曲形狀亦不改變,因此無需實質調整負壓校正機構90便可容易校正伴隨光罩M之更換之各光罩M之彎曲量。Further, by switching the adsorption of the auxiliary adsorption tank 14b, it is possible to adsorb and hold the mask M L of the larger size shown in Fig. 31 (a) and the mask M s of the smaller size shown in Fig. 31 (b). Both of them can cope with a plurality of masks M having different sizes on the long sides. Further, even if the size of the long side of the mask M is different, the bending shape in the Y direction is not changed in a state where the amount of bending in the X direction is fixed, so that it is easy to correct the accompanying mask without substantially adjusting the negative pressure correcting mechanism 90. The amount of bending of each mask M that is replaced by M.

(第7實施形態)(Seventh embodiment)

繼而,關於包括歪斜角調整機構之本發明之第7實施形態之曝光裝置,參照圖32對光罩台之縱剖面圖進行詳細說明。Next, a longitudinal sectional view of a reticle stage will be described in detail with reference to FIG. 32 with respect to an exposure apparatus according to a seventh embodiment of the present invention including a skew angle adjusting mechanism.

如圖32所示,於光罩保持框12中,在開口12b之兩長邊側之下表面,經由歪斜角調整機構80安裝有一對光罩固持器14。As shown in FIG. 32, in the reticle holding frame 12, a pair of reticle holders 14 are attached via the skew angle adjusting mechanism 80 to the lower surfaces of the long sides of the openings 12b.

歪斜角調整機構80係可調整一對光罩固持器14之角度、即歪斜角之機構,於本實施形態中,高度彼此不同之可更換之一對墊片80a、80b配置於光罩保持框12與光罩固持器14之間。藉此,使一對光罩固持器14相對於水平方向傾斜,相對於長度方向中心C左右對稱地賦予兩端藉由一對光罩固持器14吸附保持之光罩M歪斜角,並且可進行校正以降低光罩M之彎曲,從而使光罩M之平坦度提高。由此,可儘可能使光罩M之有效曝光區域中之光罩M與基板W之間隙均勻化。The skew angle adjusting mechanism 80 is a mechanism for adjusting the angle of the pair of mask holders 14, that is, the skew angle. In the present embodiment, the replaceable ones of the spacers 80a and 80b having different heights are disposed in the mask holding frame. 12 is between the photomask holder 14. Thereby, the pair of reticle holders 14 are inclined with respect to the horizontal direction, and the reticle angles of the reticle M which are adsorbed and held by the pair of reticle holders 14 are both provided symmetrically with respect to the center C in the longitudinal direction, and can be performed. Correction to reduce the curvature of the mask M, thereby improving the flatness of the mask M. Thereby, the gap between the mask M and the substrate W in the effective exposure region of the mask M can be made uniform as much as possible.

藉由此種曝光裝置1,亦與第6實施形態相同,即便光罩M之長邊側之尺寸不同,於X方向彎曲量為固定之狀態下,Y方向之彎曲形狀亦不改變,因此無需實質調整歪斜角調整機構80便可容易校正伴隨光罩M之更換之各光罩M之彎曲量。According to the exposure apparatus 1, as in the sixth embodiment, even if the dimension of the long side of the mask M is different, the bending shape in the Y direction is not changed in the state where the amount of bending in the X direction is fixed, and thus it is not necessary. The substantial adjustment of the skew angle adjustment mechanism 80 makes it easy to correct the amount of bending of each of the masks M accompanying the replacement of the mask M.

再者,如圖33所示,作為本實施形態之歪斜角調整機構,可應用圖9~圖11所示之歪斜角調整機構之變形例。Further, as shown in Fig. 33, a modified example of the skew angle adjusting mechanism shown in Figs. 9 to 11 can be applied as the skew angle adjusting mechanism of the present embodiment.

再者,於上述實施形態中,例如,歪斜角調整機構亦可併設。Furthermore, in the above embodiment, for example, the skew angle adjusting mechanism may be provided in parallel.

又,以光罩之短邊側之2邊之長度大致相同且長邊側之2邊之長度不同之尺寸之光罩進行了說明,但亦可為長邊側之2邊之長度大致相同且短邊側之2邊之長度不同之光罩,於此情形時,光罩固持器係以包括在短邊方向上排列之複數排吸附槽之方式構成。Further, although the mask having the same length on both sides of the short side of the mask and the lengths of the two sides on the long side are different, the lengths of the two sides on the long side may be substantially the same. A mask having a length of two sides on the short side is different. In this case, the mask holder is configured to include a plurality of rows of adsorption grooves arranged in the short side direction.

又,於本實施形態中,將光罩保持框12作為光罩台基底側構件,但藉由光罩台之構成,亦可將光罩台基底11作為光罩台基底側構件,於此情形時,光罩固持器14及歪斜角調整機構80配置於光罩台基底11之下表面側。Further, in the present embodiment, the mask holding frame 12 is used as the mask base side member. However, the mask base 11 can be used as the mask base side member by the configuration of the mask stage. At this time, the mask holder 14 and the skew angle adjusting mechanism 80 are disposed on the lower surface side of the mask stage base 11.

再者,本發明並不限定於上述各實施形態,亦可適當進行變形、改良等。又,本發明於可實施之範圍內,可組合應用各實施形態。Furthermore, the present invention is not limited to the above embodiments, and modifications, improvements, and the like may be appropriately performed. Further, the present invention can be applied in combination to various embodiments within the scope of the invention.

所謂本發明之大致矩形狀之光罩,只要為包含4個光罩固持器、或一對光罩固持器可吸附之4邊之構造,則如圖14或圖16所示,光罩並不限定於使角部相鄰之2邊以90°±1°交叉者,例如,如圖34(a)~(c)所示,亦包含切下角部者。The substantially rectangular reticle of the present invention is not limited to a configuration in which four reticle holders or a pair of reticle holders can be adsorbed, as shown in FIG. 14 or FIG. It is limited to the case where the two sides adjacent to the corner are crossed by 90°±1°. For example, as shown in FIGS. 34( a ) to ( c ), the cut corners are also included.

本發明係基於2010年6月17日提出申請之日本專利申請案(日本專利特願2010-138505)、2010年6月17日提出申請之日本專利申請案(日本專利特願2010-138506)、2010年6月23日提出申請之日本專利申請案(日本專利特願2010-142856)、2011年5月31日提出申請之日本專利申請案(日本專利特願2011-122231)、2011年5月31日提出申請之日本專利申請案(日本專利特願2011-122232)、2011年5月31日提出申請之日本專利申請案(日本專利特願2011-122233),其內容以參照之形式併入本文中。The present invention is based on a Japanese patent application filed on June 17, 2010 (Japanese Patent Application No. 2010-138505), and a Japanese patent application filed on Jun. 17, 2010 (Japanese Patent Application No. 2010-138506), Japanese patent application filed on June 23, 2010 (Japanese Patent Application No. 2010-142856), Japanese Patent Application filed on May 31, 2011 (Japanese Patent Application No. 2011-122231), May 2011 Japanese Patent Application (Japanese Patent Application No. 2011-122232) filed on Sep. 31, and Japanese Patent Application No. 2011-122233 filed on May 31, 2011, the content of which is incorporated by reference. In this article.

1...曝光裝置1. . . Exposure device

10...光罩台10. . . Mask table

11...光罩台基底(光罩台基底側構件)11. . . Photomask base (mask base side member)

11a...開口11a. . . Opening

12...光罩保持框(光罩台基底側構件)12. . . Photomask holding frame (mask base side member)

12a...凸緣12a. . . Flange

12b...開口12b. . . Opening

13...平面軸承13. . . Plane bearing

14...光罩固持器14. . . Photomask holder

14a...主吸附槽(吸附槽)14a. . . Main adsorption tank

14b...輔助吸附槽(吸附槽)14b. . . Auxiliary adsorption tank (adsorption tank)

15...墊片15. . . Gasket

16...光罩位置調整機構16. . . Mask position adjustment mechanism

16x...X軸方向驅動裝置16x. . . X-axis direction drive

16y...Y軸方向驅動裝置16y. . . Y-axis direction drive

17...間隙感測器17. . . Gap sensor

18...對準排列相機18. . . Align the camera

19...移動機構19. . . Mobile agency

20...基板台20. . . Substrate table

21...Z平台twenty one. . . Z platform

22...工件夾頭twenty two. . . Workpiece chuck

25...保持架台25. . . Hold stand

26...線性導件26. . . Linear guide

27...線性導件27. . . Linear guide

28...驅動用致動器28. . . Drive actuator

29...驅動用致動器29. . . Drive actuator

30...照明光學系統(照射組件)30. . . Illumination optical system (irradiation component)

31...高壓水銀燈31. . . High pressure mercury lamp

32...凹面鏡32. . . concave mirror

33...光學積分器33. . . Optical integrator

34...曝光控制用快門34. . . Exposure control shutter

35...平面鏡35. . . Plane mirror

36...平面鏡36. . . Plane mirror

37...球面鏡37. . . Spherical mirror

38...遮光板38. . . Shading

39...遮光板驅動機構39. . . Shading drive mechanism

40...基板台移動機構40. . . Substrate table moving mechanism

41...Y軸輸送機構41. . . Y-axis conveying mechanism

42...X軸輸送機構42. . . X-axis conveying mechanism

43...Z-傾斜調整機構43. . . Z-tilt adjustment mechanism

43a...馬達43a. . . motor

43b...滾珠螺桿軸43b. . . Ball screw shaft

43c...楔狀螺帽43c. . . Wedge nut

43d...楔狀部43d. . . Wedge

44...線性導件44. . . Linear guide

44a...導件44a. . . Guide

44b...滑件44b. . . Slider

45...Y軸平台45. . . Y-axis platform

46...Y軸輸送驅動裝置46. . . Y-axis conveying drive

46a...滾珠螺桿螺帽46a. . . Ball screw nut

46b...滾珠螺桿軸46b. . . Ball screw shaft

46c...馬達46c. . . motor

47...線性導件47. . . Linear guide

47a...導件47a. . . Guide

47b...滑件47b. . . Slider

48...X軸平台48. . . X-axis platform

49...X軸輸送驅動裝置49. . . X-axis conveying drive

49b...滾珠螺桿軸49b. . . Ball screw shaft

49c...馬達49c. . . motor

50...裝置基底50. . . Device base

51...支柱51. . . pillar

52...Z軸移動裝置52. . . Z-axis mobile device

55...驅動用致動器55. . . Drive actuator

56...桿56. . . Rod

57...銷支持機構57. . . Sales support agency

58...滑件58. . . Slider

59...導件59. . . Guide

60...雷射測距裝置60. . . Laser distance measuring device

61...X軸測距器61. . . X-axis range finder

62...平擺測定器62. . . Flat pendulum tester

63...Y軸測距器63. . . Y-axis range finder

64...X軸用鏡64. . . X-axis mirror

65...Y軸用鏡65. . . Y-axis mirror

71...固定光罩固持器(光罩固持器)71. . . Fixed reticle holder (mask holder)

71a...主吸附槽71a. . . Main adsorption tank

71b...輔助吸附槽71b. . . Auxiliary adsorption tank

71d...側緣部71d. . . Side edge

71e...薄壁部71e. . . Thin wall

71f...倒角部71f. . . Chamfer

71g...階部71g. . . Step

71g1...上表面71g1. . . Upper surface

72...可動光罩固持器(短邊側之光罩固持器、光罩固持器)72. . . Movable reticle holder (short-side reticle holder, reticle holder)

72a...吸附槽72a. . . Adsorption tank

72b...突起部72b. . . Protrusion

72d...側緣部72d. . . Side edge

72e...薄壁部72e. . . Thin wall

72f...倒角部72f. . . Chamfer

72g...階部72g. . . Step

73...線性導件73. . . Linear guide

73a...導件73a. . . Guide

73b...滑件構件73b. . . Sliding member

73bi...滑件構件73bi. . . Sliding member

73bo...滑件構件73bo. . . Sliding member

74...氣缸裝置(驅動機構)74. . . Cylinder unit (drive mechanism)

74a...氣缸本體74a. . . Cylinder body

74b...活塞74b. . . piston

75...支持軸75. . . Support shaft

76...減振器76. . . Shock absorber

77...止動部77. . . Stop

78...電動致動器78. . . Electric actuator

79...調整螺栓79. . . Adjustment bolt

79a...滑移材料79a. . . Slip material

80...歪斜角調整機構80. . . Skew angle adjustment mechanism

80A...歪斜角調整機構80A. . . Skew angle adjustment mechanism

80B...歪斜角調整機構80B. . . Skew angle adjustment mechanism

80a...墊片80a. . . Gasket

80b...墊片80b. . . Gasket

81...墊片81. . . Gasket

82...光罩固持器固定用螺栓82. . . Photoreceptor fixing bolt

83...楔形機構83. . . Wedge mechanism

84...固定側錐形構件84. . . Fixed side tapered member

84a...固定側錐形構件之傾斜面84a. . . Inclined surface of fixed side tapered member

84b貫通孔84b through hole

85...可動側錐形構件85. . . Movable side tapered member

85a...可動側錐形構件之傾斜面85a. . . Inclined surface of movable side tapered member

85b...長孔85b. . . Long hole

86...輸送螺桿86. . . Conveyor screw

87...托架87. . . bracket

88...固定側錐形構件固定用螺栓88. . . Fixed side tapered member fixing bolt

90...負壓校正機構90. . . Negative pressure correction mechanism

91...熱處理室(處理室)91. . . Heat treatment room (treatment room)

91a...開口91a. . . Opening

92...光學系統處理室(處理室)92. . . Optical system processing room (processing room)

93...光源處理室93. . . Light source processing room

94...透明板94. . . cant see thing

95...供氣通路95. . . Gas supply path

96...正壓泵96. . . Positive pressure pump

97...排氣通路97. . . Exhaust passage

98...負壓泵98. . . Negative pressure pump

101...CPU101. . . CPU

102...感測器102. . . Sensor

110...真空式吸附裝置110. . . Vacuum adsorption device

111...配管111. . . Piping

112...配管112. . . Piping

113...電磁閥113. . . The electromagnetic valve

114...配管114. . . Piping

115...電磁閥115. . . The electromagnetic valve

116...電磁閥116. . . The electromagnetic valve

117...電磁閥117. . . The electromagnetic valve

171...固定光罩固持器(第1光罩固持器)171. . . Fixed reticle holder (1st reticle holder)

171a...主吸附槽(其他吸附槽)171a. . . Main adsorption tank (other adsorption tank)

171b...輔助吸附槽(其他吸附槽)171b. . . Auxiliary adsorption tank (other adsorption tank)

172...可動光罩固持器(第2光罩固持器)172. . . Movable reticle holder (2nd reticle holder)

172a...主吸附槽(吸附槽)172a. . . Main adsorption tank

172b...輔助吸附槽(吸附槽)172b. . . Auxiliary adsorption tank (adsorption tank)

C...長度方向中心C. . . Length direction center

Ha...固持器部Ha. . . Holder unit

Hb...固持器部Hb. . . Holder unit

Hc...固持器部Hc. . . Holder unit

Hd...固持器部Hd. . . Holder unit

L...光路L. . . Light path

M...光罩M. . . Mask

ML ...光罩M L . . . Mask

Ms ...光罩M s . . . Mask

S...跨距S. . . Span

W...基板W. . . Substrate

圖1係本發明之第1實施形態之曝光裝置之主要部立體圖;1 is a perspective view of a main part of an exposure apparatus according to a first embodiment of the present invention;

圖2係圖1所示之曝光裝置之前視圖;Figure 2 is a front view of the exposure apparatus shown in Figure 1;

圖3係將光罩台附近放大表示之立體圖;Figure 3 is a perspective view showing the vicinity of the mask table in an enlarged manner;

圖4係圖3之A-A線前視剖面圖;Figure 4 is a front cross-sectional view taken along line A-A of Figure 3;

圖5係自下方觀察光罩台之仰視圖;Figure 5 is a bottom view of the reticle stage viewed from below;

圖6(a)、(b)係表示藉由歪斜角調整機構校正尺寸不同之光罩之平坦度之狀態的圖;6(a) and 6(b) are views showing a state in which the flatness of the reticle having different sizes is corrected by the skew angle adjusting mechanism;

圖7係使短邊側之光罩固持器移動之驅動機構之側面圖;Figure 7 is a side elevational view of the drive mechanism for moving the mask holder on the short side;

圖8係變形例之驅動機構之側面圖;Figure 8 is a side elevational view of the drive mechanism of the modification;

圖9係變形例之歪斜角調整機構之部分剖視側面圖;Figure 9 is a partial cross-sectional side view showing a skew angle adjusting mechanism of a modification;

圖10係圖9所示之楔形機構之固定側錐形構件之部分剖視側面圖;Figure 10 is a partial cross-sectional side view showing the fixed-side tapered member of the wedge mechanism shown in Figure 9;

圖11(a)係圖9所示之楔形機構之可動側錐形構件之側面圖,圖11(b)係B-B線前視剖面圖;Figure 11 (a) is a side view of the movable side tapered member of the wedge mechanism shown in Figure 9, and Figure 11 (b) is a front cross-sectional view taken along line B-B;

圖12(a)、(b)係表示藉由第2實施形態之曝光裝置之歪斜角調整機構校正尺寸不同的光罩之平坦度之狀態之圖;12(a) and 12(b) are views showing a state in which the flatness of the reticle having different sizes is corrected by the skew angle adjusting mechanism of the exposure apparatus according to the second embodiment;

圖13係表示藉由第2實施形態之變形例之歪斜角調整機構校正尺寸不同的光罩之平坦度之狀態之圖;FIG. 13 is a view showing a state in which the flatness of the reticle having different sizes is corrected by the skew angle adjusting mechanism according to the modification of the second embodiment;

圖14(a)係表示作為第3實施形態之調整固定光罩固持器與可動光罩固持器之階差之組件,藉由側緣部形成有薄壁部之光罩固持器而吸附保持光罩之狀態之立體圖,圖14(b)係沿(a)之XIV-XIV線之剖面圖,圖14(c)係表示形成於側緣部之薄壁部之第1變形例之與(b)相對應之剖面圖,圖14(d)係表示形成於側緣部之薄壁部之第2變形例之與(b)相對應之剖面圖,圖14(e)係表示形成於側緣部之薄壁部之第3變形例之與(b)相對應之剖面圖,圖14(f)係表示形成於側緣部之薄壁部之第4變形例之與(b)相對應之剖面圖;Fig. 14 (a) is a view showing a step of adjusting the step difference between the fixed photomask holder and the movable photomask holder in the third embodiment, and the photoreceptor holder having a thin portion at the side edge portion is used to adsorb and hold the light. FIG. 14(b) is a cross-sectional view taken along line XIV-XIV of (a), and FIG. 14(c) is a view showing a first modification of the thin portion formed at the side edge portion and (b) FIG. 14(d) is a cross-sectional view corresponding to (b) of the second modification of the thin portion formed at the side edge portion, and FIG. 14(e) is formed on the side edge. FIG. 14(f) shows a cross-sectional view corresponding to (b) of the third modification of the thin portion of the portion, and FIG. 14(f) shows a fourth modification of the thin portion formed at the side edge portion corresponding to (b). Sectional view

圖15係用於對產生固定光罩固持器與可動光罩固持器之階差之情形進行說明之剖面圖;Figure 15 is a cross-sectional view for explaining a situation in which a step difference between a fixed reticle holder and a movable reticle holder is generated;

圖16(a)及(b)係表示作為第3實施形態之變形例之調整固定光罩固持器與可動光罩固持器之階差之組件,藉由在角部設置有倒角部之光罩固持器而吸附保持光罩之狀態之立體圖;16(a) and 16(b) are diagrams showing a step of adjusting a step of a fixed photomask holder and a movable mask holder as a modification of the third embodiment, by providing a chamfered portion at a corner portion. a perspective view of a state in which the hood holder is attached to hold the reticle;

圖17(a)表示作為第3實施形態之另一變形例之調整固定光罩固持器與可動光罩固持器之階差之組件,藉由包括自側緣部之上表面及下表面延伸出之階部之光罩固持器而吸附保持光罩之狀態的立體圖,圖17(b)係更包括調整螺栓之沿(a)之XVII-XVII線之光罩固持器之剖面圖;Fig. 17 (a) is a view showing an assembly for adjusting a step of a fixed photomask holder and a movable mask holder as another modification of the third embodiment, which comprises an upper surface and a lower surface extending from the side edge portion. FIG. 17(b) is a cross-sectional view of the reticle holder of the XVII-XVII line along the (a) of the adjustment bolt; FIG. 17(b) is a perspective view of the reticle holder of the step portion;

圖18係表示第4實施形態之曝光裝置之構成之側面圖;Figure 18 is a side view showing the configuration of an exposure apparatus according to a fourth embodiment;

圖19係第5實施形態之曝光裝置之與圖4對應之剖面圖;Figure 19 is a cross-sectional view corresponding to Figure 4 of the exposure apparatus of the fifth embodiment;

圖20係表示第1及第2光罩固持器之吸附槽佈局與吸附保持於該吸附槽之大光罩之位置關係之一例的俯視圖;20 is a plan view showing an example of a positional relationship between a suction groove layout of the first and second photomask holders and a large photomask that is adsorbed and held by the adsorption grooves;

圖21係與第1及第2光罩固持器之各吸附槽連接之空壓電路圖;Figure 21 is a diagram showing a pneumatic circuit connected to each of the adsorption grooves of the first and second photomask holders;

圖22係使短邊側之第2光罩固持器移動之驅動機構之側面圖;Figure 22 is a side view showing a drive mechanism for moving the second mask holder on the short side;

圖23係變形例之驅動機構之側面圖;Figure 23 is a side elevational view of the drive mechanism of the modification;

圖24係表示第1及第2光罩固持器與大光罩之位置關係之另一例之俯視圖;Figure 24 is a plan view showing another example of the positional relationship between the first and second mask holders and the large mask;

圖25係表示第1及第2光罩固持器與小光罩之位置關係之一例之俯視圖;25 is a plan view showing an example of a positional relationship between the first and second mask holders and the small mask;

圖26係表示第1及第2光罩固持器與小光罩之位置關係之另一例之俯視圖;Figure 26 is a plan view showing another example of the positional relationship between the first and second mask holders and the small mask;

圖27係與第1及第2光罩固持器之各吸附槽連接之變形例之空壓電路圖;Figure 27 is a pneumatic circuit diagram showing a modification of the connection to each of the adsorption grooves of the first and second photomask holders;

圖28係第6實施形態之曝光裝置之與圖4對應之剖面圖;Figure 28 is a cross-sectional view corresponding to Figure 4 of the exposure apparatus of the sixth embodiment;

圖29係與光罩固持器之各吸附槽連接之空壓電路圖;Figure 29 is a diagram showing a pneumatic circuit connected to each of the adsorption grooves of the reticle holder;

圖30(a)、(b)係表示尺寸不同之大小光罩與光罩固持器之位置關係的俯視圖;30(a) and (b) are plan views showing the positional relationship between the reticle and the reticle holder of different sizes;

圖31(a)係長邊側之2邊由光罩固持器保持之光罩之俯視圖,圖31(b)係表示光罩之X方向之彎曲狀態之剖面圖,圖31(c)係表示光罩之Y方向之彎曲狀態之剖面圖;Fig. 31 (a) is a plan view showing a reticle held by a reticle holder on two sides of the long side, Fig. 31 (b) is a cross-sectional view showing a curved state of the reticle in the X direction, and Fig. 31 (c) is a view showing light. a cross-sectional view of the curved state of the cover in the Y direction;

圖32係本發明之第7實施形態之相當於圖28之剖面圖;Figure 32 is a cross-sectional view corresponding to Figure 28 of the seventh embodiment of the present invention;

圖33係變形例之歪斜角調整機構之部分剖視側面圖;Figure 33 is a partial cross-sectional side view showing a skew angle adjusting mechanism of a modification;

圖34(a)~(c)係表示光罩之角部之形狀之圖;及34(a) to (c) are views showing the shape of the corner portion of the reticle; and

圖35(a)係4邊由光罩固持器保持之光罩之俯視圖,圖35(b)係表示光罩之X方向之彎曲狀態之剖面圖,圖35(c)係表示光罩之Y方向之彎曲狀態之剖面圖。Figure 35 (a) is a plan view of a photomask held by a photomask holder on four sides, Figure 35 (b) is a cross-sectional view showing a curved state of the photomask in the X direction, and Figure 35 (c) is a Y of the photomask. A cross-sectional view of the curved state of the direction.

12...光罩保持框(光罩台基底側構件)12. . . Photomask holding frame (mask base side member)

12b...開口12b. . . Opening

71...固定光罩固持器(光罩固持器)71. . . Fixed reticle holder (mask holder)

71a...主吸附槽71a. . . Main adsorption tank

71b...輔助吸附槽71b. . . Auxiliary adsorption tank

72...可動光罩固持器(短邊側之光罩固持器、光罩固持器)72. . . Movable reticle holder (short-side reticle holder, reticle holder)

72a...吸附槽72a. . . Adsorption tank

73...線性導件73. . . Linear guide

73a...導件73a. . . Guide

73b...滑件構件73b. . . Sliding member

74...氣缸裝置(驅動機構)74. . . Cylinder unit (drive mechanism)

M...光罩M. . . Mask

Claims (21)

一種曝光裝置,其特徵在於包括:基板台,其載置作為被曝光材之基板;光罩台,其配置於上述基板台之上方且保持大致矩形狀之光罩;及照射組件,其將圖案曝光用之光經由上述光罩而照射至上述基板上;且上述光罩台包括:光罩台基底側構件;4個光罩固持器,其可分別吸附保持上述光罩之各邊;複數個導引機構,其分別設置於上述光罩台基底側構件與吸附保持上述光罩之短邊側之至少2個上述光罩固持器之間,且相對於上述光罩台基底側構件可於長邊方向上移動地導引上述短邊側之光罩固持器;驅動機構,其使上述短邊側之光罩固持器相對於上述光罩台基底側構件於長邊方向上移動;及歪斜角調整機構,其設置於上述光罩台基底側構件與上述各導引機構之間、及上述各導引機構與上述短邊側之光罩固持器之間之至少一者,且可調整上述光罩之歪斜角;且上述驅動機構為氣缸本體固定於上述光罩台基底側構件,且活塞之前端固定於上述光罩固持器之氣缸裝置;上述氣缸裝置包括可移動地安裝於上述光罩台基底側構件之包含減振器之止動部,且使上述活塞與該止動 部抵接而將上述光罩固持器定位於特定位置。 An exposure apparatus comprising: a substrate stage on which a substrate as an exposure material is placed; a mask stage disposed above the substrate stage and holding a substantially rectangular mask; and an illumination unit that patterns The light for exposure is irradiated onto the substrate via the reticle; and the reticle stage comprises: a reticle base side member; and four reticle holders respectively absorbing and holding the sides of the reticle; The guiding mechanism is respectively disposed between the reticle base side member and at least two of the reticle holders that adsorb and hold the short side of the reticle, and is long with respect to the reticle base side member a reticle holder that is movably guided in the lateral direction, and a driving mechanism that moves the reticle holder on the short side in a longitudinal direction with respect to the base side member of the reticle; and a skew angle An adjustment mechanism provided between the reticle base side member and each of the guiding mechanisms, and at least one of the guiding mechanism and the short side reticle holder, and the light can be adjusted Cover And the driving mechanism is a cylinder device fixed to the base unit side of the reticle base, and the front end of the piston is fixed to the cylinder device of the reticle holder; the cylinder device includes a movably mounted side of the reticle base The component includes a stopper of the damper, and the piston is stopped The reticle holder is positioned at a specific position while abutting. 如請求項1之曝光裝置,其中上述歪斜角調整機構分別設置於上述光罩台基底側構件與上述各導引機構之間、及上述各導引機構與上述短邊側之光罩固持器之間之兩者。 The exposure apparatus of claim 1, wherein the skew angle adjusting mechanism is disposed between the mask base side member and each of the guiding mechanisms, and each of the guiding mechanism and the short side mask holder Both. 如請求項1或2之曝光裝置,其中上述各導引機構分別包含安裝於上述光罩台基底側之導件、及安裝於上述光罩固持器側之滑件構件;上述歪斜角調整機構分別設置於上述光罩台基底側構件與上述各導件之間、及上述各滑件構件與上述短邊側之光罩固持器之間之至少一者。 The exposure apparatus of claim 1 or 2, wherein each of the guiding means comprises a guide attached to the base side of the mask base, and a slider member attached to the mask holder side; the skew angle adjusting mechanism respectively It is provided between at least one of the mask base side member and the guides, and between the slider members and the short side mask holder. 如請求項1或2之曝光裝置,其中上述歪斜角調整機構為高度彼此不同之可更換之一對墊片。 The exposure apparatus of claim 1 or 2, wherein the skew angle adjusting mechanism is a replaceable one pair of spacers having different heights from each other. 如請求項1或2之曝光裝置,其中上述歪斜角調整機構包括:墊片,其具有特定高度;及楔形機構,其包含設置於該墊片之外側且具有傾斜面之固定側錐形構件及具有滑動自如地與該傾斜面接觸之傾斜面之可動側錐形構件,且藉由改變上述傾斜面之滑動接觸位置而可變更高度。 The exposure apparatus of claim 1 or 2, wherein the skew angle adjusting mechanism comprises: a spacer having a specific height; and a wedge mechanism including a fixed side tapered member disposed on an outer side of the spacer and having an inclined surface The movable side tapered member having the inclined surface that is slidably contacted with the inclined surface can be changed in height by changing the sliding contact position of the inclined surface. 如請求項5之曝光裝置,其中上述楔形機構藉由使用電動致動器驅動上述可動側錐形構件而調整上述歪斜角。 The exposure apparatus of claim 5, wherein the wedge mechanism adjusts the skew angle by driving the movable side tapered member using an electric actuator. 如請求項1或2之曝光裝置,其中上述歪斜角調整機構係可藉由通電控制而變更高度之壓電元件。 The exposure apparatus of claim 1 or 2, wherein the skew angle adjustment mechanism is a piezoelectric element that can be changed in height by energization control. 如請求項1或2之曝光裝置,其中上述驅動機構為電動馬達。 The exposure apparatus of claim 1 or 2, wherein the drive mechanism is an electric motor. 如請求項8之曝光裝置,其中上述電動馬達使上述光罩固持器於至少3處停止位置停止。 The exposure apparatus of claim 8, wherein the electric motor stops the reticle holder at at least three stop positions. 如請求項1或2之曝光裝置,其中吸附保持上述光罩之短邊側之上述光罩固持器及吸附保持上述光罩之長邊側之上述光罩固持器至少於彼此近接之側緣部包含形成為較剩餘部分更薄壁之薄壁部。 The exposure apparatus of claim 1 or 2, wherein the reticle holder that adsorbs and holds the short side of the reticle and the reticle holder that adsorbs and holds the long side of the reticle are at least close to each other A thin wall portion formed to be thinner than the remaining portion is included. 如請求項1或2之曝光裝置,其中吸附保持上述光罩之短邊側之上述光罩固持器及吸附保持上述光罩之長邊側之上述光罩固持器於彼此近接之角部包含倒角部。 The exposure apparatus of claim 1 or 2, wherein the reticle holder that adsorbs and holds the short side of the reticle and the reticle holder that adsorbs and holds the long side of the reticle are included in a corner portion adjacent to each other Corner. 如請求項1或2之曝光裝置,其中吸附保持上述光罩之短邊側之上述光罩固持器及吸附保持上述光罩之長邊側之上述光罩固持器中之任一者至少於彼此近接之側緣部包含自下表面延伸出之階部;並且上述另一個光罩固持器包含自上表面延伸出之階部;上述短邊側及長邊側之光罩固持器於使上述階部彼此相互疊合之狀態下吸附保持上述光罩。 The exposure apparatus of claim 1 or 2, wherein the reticle holder that adsorbs and holds the short side of the reticle and the reticle holder that adsorbs and holds the long side of the reticle are at least mutually The proximal side edge portion includes a step extending from the lower surface; and the other photomask holder includes a step extending from the upper surface; the short side and the long side photomask holder are configured to make the step The portions are adsorbed and held in a state in which they overlap each other. 如請求項1或2之曝光裝置,其包括與上述光罩之一面相對之處理室,更包括負壓校正機構,該負壓校正機構對上述處理室內之氣壓與作用於上述光罩之另一面之氣壓賦予壓力差,並校正上述光罩之上述歪斜角。 The exposure apparatus of claim 1 or 2, comprising a processing chamber opposite to one of the masks, further comprising a negative pressure correcting mechanism for the air pressure in the processing chamber and acting on the other side of the mask The air pressure imparts a pressure difference and corrects the above-described skew angle of the reticle. 一種曝光裝置,其特徵在於包括:基板台,其載置作為被曝光材之基板;光罩台,其配置於上述基板台之上方 且保持大致矩形狀之光罩;及照射組件,其將圖案曝光用之光經由上述光罩照射至上述基板上;且上述光罩台包括:光罩台基底側構件;一對第1光罩固持器,其可吸附保持沿特定方向延伸之上述光罩之相對向之2邊;一對第2光罩固持器,其可吸附保持沿與上述特定方向正交之方向延伸之上述光罩之相對向之另2邊,且可於上述光罩之上述特定方向上移動;複數個導引機構,其分別設置於上述光罩台基底側構件與上述一對第2光罩固持器之間,且相對於上述光罩台基底側構件可於上述光罩的上述特定方向上移動地導引上述一對第2光罩固持器;一對驅動機構,其分別使上述各第2光罩固持器於上述光罩之上述特定方向上移動;第1歪斜角調整機構,其設於上述光罩台基底側構件與上述導引機構之間,可修正上述導引機構之傾斜度而使其水平;及第2歪斜角調整機構,其設於上述各導引機構與上述一對第2光罩固持器之間,可調整上述一對第2光罩固持器之歪斜角;上述各第2光罩固持器包括藉由所供給之負壓而吸附保持上述光罩之另外2邊側之於上述特定方向上排列之複數排吸附槽。 An exposure apparatus comprising: a substrate stage on which a substrate as an exposed material is placed; and a mask stage disposed above the substrate stage And maintaining a substantially rectangular reticle; and illuminating the component, wherein the light for pattern exposure is irradiated onto the substrate via the reticle; and the reticle stage comprises: a reticle base side member; and a pair of first reticle a holder capable of adsorbing and holding two opposite sides of the reticle extending in a specific direction; a pair of second reticle holders capable of adsorbing and holding the reticle extending in a direction orthogonal to the specific direction The other two sides are movable in the specific direction of the photomask, and a plurality of guiding mechanisms are respectively disposed between the mask base side member and the pair of second mask holders. And the pair of second photomask holders are movably movable in the specific direction of the mask relative to the mask base side member; and the pair of driving mechanisms respectively enable the second mask holders Moving in the specific direction of the reticle; the first slanting angle adjusting mechanism is disposed between the reticle base side member and the guiding mechanism, and can correct the inclination of the guiding mechanism to be horizontal; And the second bevel a mechanism for adjusting a skew angle between the pair of second photomask holders between the respective guiding mechanisms and the pair of second mask holders; wherein each of the second mask holders comprises The negative pressure of the supply is used to adsorb and hold the plurality of rows of adsorption grooves arranged on the other two sides of the mask in the specific direction. 如請求項14之曝光裝置,其中上述第2光罩固持器之上述吸附槽係藉由電磁閥而切換負壓之供給與停止。 The exposure apparatus of claim 14, wherein the adsorption tank of the second photomask holder switches the supply and the stop of the negative pressure by the electromagnetic valve. 如請求項14或15之曝光裝置,其中上述各第1光罩固持器包括複數個其他吸附槽,該複數個其他吸附槽藉由所供給之負壓而吸附保持上述光罩之2邊側,並於上述特定方向上分割設置;上述第1光罩固持器之上述其他吸附槽及上述第2光罩固持器之吸附槽藉由針對每個上述其他吸附槽及上述吸附槽逐個設置之電磁閥而切換負壓之供給與停止,且控制負壓之大小。 The exposure apparatus of claim 14 or 15, wherein each of the first photomask holders includes a plurality of other adsorption tanks, and the plurality of other adsorption tanks adsorb and hold the two sides of the photomask by the supplied negative pressure, And being disposed in the specific direction; the other adsorption tank of the first mask holder and the adsorption tank of the second mask holder are provided one by one for each of the other adsorption tanks and the adsorption tank The switching of the supply and stop of the negative pressure is performed, and the magnitude of the negative pressure is controlled. 如請求項14或15之曝光裝置,其包括與上述光罩之一面相對之處理室,更包括負壓校正機構,該負壓校正機構對上述處理室內之氣壓與作用於上述光罩之另一面之氣壓賦予壓力差,且校正上述光罩之彎曲。 The exposure apparatus of claim 14 or 15, comprising a processing chamber opposite to a face of the reticle, further comprising a negative pressure correcting mechanism for the air pressure in the processing chamber and acting on the other side of the reticle The air pressure imparts a pressure difference and corrects the curvature of the reticle. 如請求項14之曝光裝置,其特徵在於包括:基板台,其載置作為被曝光材之基板;光罩台,其配置於上述基板台之上方且保持大致矩形狀之光罩;及照射組件,其將圖案曝光用之光經由上述光罩照射至上述基板上;且上述光罩台包括:一對光罩固持器,其分別包括複數個吸附槽,該複數個吸附槽藉由所供給之負壓而吸附保持上述光罩之相對向之2邊,且分割形成於沿該2邊之方向上;及負壓校正機構,其包括與上述光罩之一面相對之處理室,且對上述處理室內之氣壓與作用於上述光罩之另 一面之氣壓賦予壓力差,校正上述光罩之彎曲。 The exposure apparatus of claim 14, comprising: a substrate stage on which a substrate as an exposed material is placed; a mask stage disposed above the substrate stage and holding a substantially rectangular mask; and an illumination unit And irradiating the light for pattern exposure onto the substrate through the reticle; and the reticle stage comprises: a pair of reticle holders respectively comprising a plurality of adsorption grooves, wherein the plurality of adsorption grooves are supplied by Negatively adsorbing and holding two opposite sides of the reticle, and dividing is formed in a direction along the two sides; and a negative pressure correcting mechanism including a processing chamber opposite to one of the reticle, and the above processing The air pressure in the room and the other effect on the reticle The pressure on one side imparts a pressure difference to correct the curvature of the mask. 如請求項18之曝光裝置,其中上述一對光罩固持器之上述複數個吸附槽藉由針對每個上述吸附槽逐個設置之電磁閥而切換負壓之供給與停止,且控制負壓之大小。 The exposure apparatus of claim 18, wherein the plurality of adsorption tanks of the pair of reticle holders switch supply and stop of the negative pressure by a solenoid valve disposed one by one for each of the adsorption tanks, and control the magnitude of the negative pressure . 一種曝光裝置,其特徵在於包括:基板台,其載置作為被曝光材之基板;光罩台,其配置於上述基板台之上方且保持大致矩形狀之光罩;及照射組件,其將圖案曝光用之光經由上述光罩照射至上述基板上;且上述光罩台包括:光罩台基底側構件;一對光罩固持器,其分別包括複數個吸附槽,該複數個吸附槽藉由所供給之負壓而吸附保持上述光罩之相對向之2邊,且分割形成於沿該2邊之方向上;及歪斜角調整機構,其分別設置於上述光罩台基底側構件與上述各光罩固持器之間,且使上述各光罩固持器傾斜而可調整上述光罩之歪斜角;上述歪斜角調整機構包含配置於上述光罩台基底側構件與上述一對光罩固持器之間,且高度彼此不同之可更換之一對墊片。 An exposure apparatus comprising: a substrate stage on which a substrate as an exposure material is placed; a mask stage disposed above the substrate stage and holding a substantially rectangular mask; and an illumination unit that patterns The light for exposure is irradiated onto the substrate via the reticle; and the reticle stage comprises: a reticle base side member; and a pair of reticle holders respectively comprising a plurality of adsorption grooves, wherein the plurality of adsorption grooves are a negative pressure supplied to adsorb and hold two opposite sides of the mask, and is divided and formed in a direction along the two sides; and a skew angle adjusting mechanism respectively provided on the mask base side member and each of the above Adjusting the slant angle of the reticle between the reticle holders and tilting the reticle holders; the skew angle adjusting mechanism includes the reticle base side member and the pair of reticle holders One pair of gaskets that can be replaced with different heights. 如請求項20之曝光裝置,其中上述一對光罩固持器之上述複數個吸附槽藉由針對每個上述吸附槽逐個設置之電磁閥而切換負壓之供給與停止,且控制負壓之大小。The exposure apparatus of claim 20, wherein the plurality of adsorption tanks of the pair of reticle holders switch supply and stop of the negative pressure by a solenoid valve disposed one by one for each of the adsorption tanks, and control the magnitude of the negative pressure .
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