CN102203677A - Exposure unit and method for exposing substrate - Google Patents

Exposure unit and method for exposing substrate Download PDF

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Publication number
CN102203677A
CN102203677A CN2010800023874A CN201080002387A CN102203677A CN 102203677 A CN102203677 A CN 102203677A CN 2010800023874 A CN2010800023874 A CN 2010800023874A CN 201080002387 A CN201080002387 A CN 201080002387A CN 102203677 A CN102203677 A CN 102203677A
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China
Prior art keywords
substrate
binding domain
exposure
mask
maintaining part
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Granted
Application number
CN2010800023874A
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Chinese (zh)
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CN102203677B (en
Inventor
池渊宏
户川悟
永井新一郎
桐生恭孝
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Vn Systems Ltd
V Technology Co Ltd
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NSK Ltd
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

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  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Each of the suction surfaces (22) of work chucks (21) has: partitioning walls (81a-81d, 82a-82d, 83a-83d), which are formed so as to partition adjacent suction regions (80a-80g), and which can abut on the rear surface of a substrate (W); and a plurality of protruding sections (85), which can abut on the rear surface of the substrate (W) in the suction regions (80a-80g), respectively. The suction surfaces (22) of the work chucks (21) of a plurality of exposure apparatus main bodies (2-5) have substantially the same outer dimension, and the partitioning walls (81a-81d, 82a-82d, 83a-83d) of the work chucks (21) are formed at positions that differ by each of the exposure apparatus main bodies (2-5).

Description

The exposure method of exposure device and substrate
Technical field
The present invention relates to a kind of the possess exposure device of a plurality of exposure device main bodys and the exposure method of substrate.
Background technology
In the past, multiple filter substrate or the TFT (thin film transistor (TFT): the exposure device of substrate Thin Film Transistor) that is used to make panel display apparatus such as liquid crystal indicator or plasma display system proposed.Exposure device passes through to keep mask with the mask maintaining part, and keeps substrate to make both closely arranged opposite with the substrate maintaining part.Then, by light, the mask pattern that is depicted on the mask is exposed transfer printing on substrate from mask side irradiation pattern exposure usefulness.In addition, for example, under the situation of making filter substrate, use 4 exposure device main bodys, BM (black matrix) layer, R (red), G (green), these 3 dyed layers of B (indigo plant) in turn expose on substrate.
In patent documentation 1,2 described exposure devices, the substrate maintaining part keeps having a plurality of projections (embossing) on the adsorption plane of substrate in absorption, and divides separated partition for delimiting the binding domain that a plurality of binding domains have adjacency.And by being set at the width of regulation at the interval between the projection of the interval of the projection of prescribed direction and partition and institute's adjacency, the deflection that makes substrate improve the flatness of substrate, thereby it is uneven to suppress exposure about equally.In addition, in patent documentation 3 described substrate maintaining parts, possess the edge part that surrounds the attraction space, the support that is located at a plurality of projections in the attraction space and extends, so that keep substrate with good flatness from edge part towards projection.
Patent documentation 1:JP-A-2009-212344
Patent documentation 2:JP-A-2009-198641
Patent documentation 3:WO2006/025341 number
, for cooling base has cooling medium at the internal circulation of substrate maintaining part, when absorption kept substrate in the substrate maintaining part, on a plurality of projections or part that partition contacted and the part that does not contact, substrate produced temperature variation.Particularly, substrate with the part that contacts of continuous partition, big with respect to the temperature variation of contact portion not, might with substrate that partition contacts near produce microdeformation.Therefore, when using a plurality of exposure device main bodys to carry out a plurality of exposure,, then exist in the problem that the uneven or profile variation of exposing of exposure takes place on this positions of goods of a plurality of exposures if the position of the part that partition contacted is consistent in each exposure device main body.In addition, in patent documentation 1～3 described substrate maintaining part, the problems referred to above are not considered fully.
Summary of the invention
The present invention finishes for addressing the above problem, even its purpose is to provide a kind of goods that carry out multiexposure, multiple exposure, also can suppress the exposure inequality and the exposure device of the generation of exposure profile (profile) deviation and the exposure method of substrate that cause by partition.
According to the embodiment of the present invention, a kind of pattern with a plurality of described each mask exposure device of transfer printing on described substrate that expose successively can be provided, wherein, described exposure device possesses by shining pattern exposure transfer printing a plurality of exposure device main bodys on described substrate of described exposure light with described mask, and described exposure device main body possesses: keep having the mask of described pattern the mask maintaining part, have by absorption and keep the substrate maintaining part of adsorption plane of described substrate and the irradiation portion of irradiation exposure light; On the adsorption plane of described substrate maintaining part, a plurality of projections that are provided with the partition that forms for the binding domain of separating adjacency and can connect, can connect with the back side of described substrate at described binding domain with the back side of described substrate; The adsorption plane of each substrate maintaining part of described a plurality of exposure device main bodys has roughly the same physical dimension, and the partition of described each substrate maintaining part is formed on the different positions in each described exposure device main body.
According to the embodiment of the present invention, can provide a kind of employing by pattern exposure transfer printing a plurality of exposure device main bodys on described substrate of the described exposure light of irradiation with described each mask, with expose the successively exposure method of the substrate of transfer printing on described substrate of the pattern of described each mask, described exposure device main body possesses the mask maintaining part that is used to keep have the mask of pattern, have the substrate maintaining part and the irradiation portion of shining exposure light that keep the adsorption plane of described substrate by absorption, described exposure method comprises following operation: so that with the separated partition of binding domain of described adsorption plane institute adjacency in described each exposure device main body on different positions with the back side of the described substrate mode that connects, by described a plurality of exposure device main bodys described substrate is exposed successively.
The invention effect
According to exposure device of the present invention, owing to the partition on each adsorption plane that is formed at a plurality of exposure device main bodys, in each exposure device main body, be formed on the different positions, therefore, also can suppress the generation of the uneven or exposure profile variation of exposure that partition causes even carried out the goods of multiexposure, multiple exposure.
In addition, exposure method according to substrate of the present invention, substrate since each partition in each exposure device main body, on different positions, connect with the back side of substrate, exposed successively by a plurality of exposure main bodys simultaneously, even therefore finished the goods of multiexposure, multiple exposure, also can suppress to take place the uneven or exposure profile variation of exposure that partition causes.
Description of drawings
Fig. 1 is the synoptic diagram of the exposure device of the expression first embodiment of the present invention.
Fig. 2 is the exploded stereographic map near (formula) exposure main body that is used for illustrating the exposure device that is applied to Fig. 1.
Fig. 3 is the front view near (formula) exposure device main body shown in Figure 2.
Fig. 4 is the amplification stereogram of mask maintaining part shown in Figure 2.
(a) of Fig. 5 is the front view of substrate maintaining part shown in Figure 1, (b) is the V portion enlarged drawing of (a).
Fig. 6 is with each enlarged drawing that illustrates overlappingly near the substrate maintaining part VIa-VId portion of (formula) exposure device main body among Fig. 1.
Fig. 7 (a)～(h) is the figure of the various variation of expression projection and partition.
Fig. 8 (a)～(i) is the figure of the various variation of partition.
Fig. 9 is the synoptic diagram of the exposure device of the expression second embodiment of the present invention.
Figure 10 is the exploded stereographic map near the exposure main body that is used for illustrating the exposure device that is applied to Fig. 9.
Figure 11 is the front view near the exposure device main body shown in Figure 10.
Figure 12 is the amplification stereogram of mask maintaining part shown in Figure 10.
Figure 13 is the front view of substrate maintaining part shown in Figure 9.
(A) of Figure 14 is the A portion enlarged drawing of Figure 13, (B) is the B portion enlarged drawing of Figure 13, (C) is the C portion enlarged drawing of Figure 13, (D) is the D portion enlarged drawing of Figure 13.
Figure 15 is the figure that disposes substrate in the front view of substrate maintaining part shown in Figure 9.
Figure 16 (A)～(D) is the figure of the adsorbed state of the substrate of expression substrate step when moving.
Figure 17 (A)～(B) is illustrated in the figure that disposes the state of diverse substrate in the front view of substrate maintaining part shown in Figure 9.
Description of reference numerals
The 1-exposure device, 2-first is near (formula) exposure device main body, 3-second is near the exposure device main body, 4-the 3rd is near the exposure device main body, 5-the 4th is near the exposure device main body, 10-mask maintaining part, 12b-opening, the 14-chuck segment, 20-substrate maintaining part, 21-workpiece chuck, 22-adsorption plane, 80a-first binding domain, 80b-second binding domain, 80c-the 3rd binding domain, 80d-the 4th binding domain, 80e-the 5th binding domain, 80f-the 6th binding domain, 80g-the 7th binding domain, 81a, 81b, 81c, 81d-first partition, 82a, 82b, 82c, 82d-second partition, 83a, 83b, 83c, 83d-the 3rd partition, 800a-first binding domain, 800b-second binding domain, 800c-the 3rd binding domain, 800d-the 4th binding domain, 800e-the 5th binding domain, 800f-the 6th binding domain, 800g-the 7th binding domain, 800h-the 8th binding domain, 800i-the 9th binding domain, 800j-the tenth binding domain, 800k-the 11 binding domain, 800l-the 12 binding domain, 800m-the 13 binding domain, 810a-first partition, 810b-second partition, 810c-the 3rd partition, 810d-the 4th partition, 810e-the 5th partition, 810f-the 6th partition, 810g-the 7th partition, 810h-the 8th partition, 810i-the 9th partition, partition around the 810j-the tenth, partition around the 810k-the 11, partition around the 810l-the 12, partition around the 810m-the 13, the M-mask, W-glass substrate (being exposed material).
Embodiment
[first embodiment]
Below, based on accompanying drawing the exposure device of the first embodiment of the present invention and the exposure method of substrate are elaborated.
As shown in Figure 1, exposure device 1 of the present invention possesses: to ground floor expose first near (formula) exposure device main body 2, to the second layer expose second near exposure main body 3, to the 3rd layer expose the 3rd near exposure device main body 4 and to the 4th layer expose the 4th near exposure device main body 5.In addition, the diagram of the device that uses in pre-service such as coating, preset adjustment, development and the postprocessing working procedures and Handling device of carrying substrate etc. has been omitted.In addition since first～the 4th near exposure device main body 2,3,4,5 so long as the different formation of the adsorption plane of substrate maintaining part described later get final product, therefore below in describe in detail near exposure device main body 2 first.
As shown in Figure 2, first possesses near exposure device main body 2: the mask maintaining part 10 that is used to keep mask M; Be used to keep the substrate maintaining part 20 of glass substrate (being exposed material) W; The lamp optical system 30 of the irradiation means of using as pattern exposure; Substrate maintaining part 20 is moved to X-axis, Y-axis, Z-direction, and the substrate holding portion moving mechanism 40 that the gradient (tilt) of substrate maintaining part 20 is adjusted; And the device pedestal 50 of supporting mask maintaining part 10 and substrate holding portion moving mechanism 40.
In addition, glass substrate W (being designated hereinafter simply as " substrate W ") and mask M dispose opposed to each other, will be depicted in mask pattern on this mask M at need and expose and be coated with emulsion on the surface (with the opposed faces side of mask M) of transfer printing.In addition, mask M is made of fused quartz, forms oblong-shaped.
For convenience of description, if begin explanation from lamp optical system 30, then lamp optical system 30 possesses: as for example high-pressure mercury-vapor lamp 31 of light source for ultraviolet ray irradiation; The concave mirror 32 of the light optically focused that will irradiate from this high-pressure mercury 31; Near two kinds of optical integrators 33 that the focus of this concave mirror 32, freely dispose with switching; Be used to change the plane mirror 35,36 and the spherical reflector 37 of optical path direction; And be configured between this plane mirror 36 and the optical integrator 33 and the shutter 34 of the exposure control usefulness of switch control illumination path.
In addition, in lamp optical system 30, if the time open exposure control with shutter 34 in exposure, then the light that penetrates from high-pressure mercury electric light 31 vertically is radiated on the surface of mask M and substrate W, with the directional light of using as pattern exposure through light path L shown in Figure 2.Thus, the mask pattern of mask M is exposed transfer printing on substrate M.
As Fig. 2～shown in Figure 4, mask maintaining part 10 possesses: the mask maintaining part pedestal 11 that is formed with the peristome 11a of rectangular shape at central portion; Keep frame 12 with the mask on the peristome 11a that can be installed in mask maintaining part pedestal 11 to the mode that X-axis, Y-axis, θ direction move; Be installed in the chuck segment 14 that mask keeps on the frame 12 and adsorbs maintenance mask M; And make mask keep frame 12 and chuck (chuck) portion to move, and to remaining on the mask position adjusting mechanism 16 that this mask keeps the position of the mask M on the frame 12 to adjust to X-axis, Y-axis, θ direction.
Mask maintaining part pedestal 11 is supported to and utilizes upright establishing (the upright setting) can move to Z-direction at pillar 51 on the device pedestal 50 and the Z shaft moving device 52 that is located on the upper end of pillar 51, and is configured in the top of substrate maintaining part 20.Z shaft moving device 52 for example possesses the electric actuator that is made of motor and ball screw etc. or pneumatics cylinder etc., by carrying out simple knee-action, makes mask maintaining part 10 be elevated to the position of regulation.In addition, when the cleaning of the replacing of carrying out mask M or workpiece chuck 21 etc., use Z shaft moving device 52.
Mask position adjusting mechanism 16 possesses: be installed in along mask and keep 1 Y direction drive unit 16y on one side of X-direction of frame 12; Keep 2 X-direction drive unit 16x on one side of Y direction of frame 12 with being installed in along mask.
And, in mask position adjusting mechanism 16, make mask keep frame 12 to move to Y direction by driving 1 Y direction drive unit 16y, by driving 2 X-direction drive unit 16x comparably, make mask keep frame 12 to move to X-direction.In addition, make mask keep frame 12 to move (around the rotation of Z axle axle) by driving 2 arbitrary drive units among the X-direction drive unit 16x to the θ direction.
In addition, as shown in Figure 4,, be provided with the gap sensor 17 in the gap between the opposed faces that is used to measure mask M and substrate W at the upper surface of mask maintaining part pedestal 11; With the mask alignment of the installation site that is used to confirm to remain on the mask M on the chuck segment 14 with camera 18.These gap sensors 17 and mask alignment are retained with camera 18 and utilize travel mechanism 19 to move to X-axis, Y direction, and are configured in the mask maintenance frame 12.
In addition, at the upper surface of mask maintaining part pedestal 11, as shown in Figure 4, at the both ends of the X-direction of the peristome 11a of mask maintaining part pedestal 11, what be provided with the both ends of coming shadowing mask M as required covers opening 38.This covers the peristome driving mechanism 39 that covers that opening (aperture) 38 utilization is made of motor, ball screw and straight line guidance etc. and can move to X-direction, with the dead area at the both ends of adjusting mask M.In addition, cover opening 38 and not only can be located on the both ends of X-direction of peristome 11a, equally also can be located on the both ends of Y direction of peristome 11a.
As shown in Figures 2 and 3, substrate maintaining part 20 is set on the substrate holding portion moving mechanism 40, and has workpiece chuck 21, and this workpiece chuck 21 has at upper surface and is used for substrate W is remained on adsorption plane 22 on the substrate maintaining part 20.In addition, work chuck 21 keeps substrate W by vacuum suction.
As shown in Figures 2 and 3, substrate maintaining part moving part 40 possesses: the Y-axis feed mechanism 41 that substrate maintaining part 20 is moved to Y direction; The X-axis feed mechanism 42 that substrate maintaining part 20 is moved to X-direction; Gradient with adjusting substrate maintaining part 20 makes substrate maintaining part 20 to the Z-of Z-direction fine motion gradient adjusting mechanism 43 simultaneously.
Y-axis feed mechanism 41 possesses: a pair of straight line guidance 44 that is located at the upper surface of device pedestal 50 along Y direction; The Y-axis worktable 45 that can be supported movably to Y direction by straight line guidance 44; The Y-axis that Y-axis worktable 45 is moved to Y direction feeds drive unit 46.In addition,, ball screw 46b is rotated, can Y-axis worktable 45 be moved along the guide rail 44a of straight line guidance 44, substrate maintaining part 20 is moved to Y direction with ball screw 46a by driving the motor 46c that Y-axis feeds drive unit 46.
In addition, X-axis feed mechanism 42 possesses: at a pair of straight line guidance 47 of Y-axis worktable 45 upper surfaces along the X-direction setting; The X-axis worktable 48 that can be supported movably to X-direction by straight line guidance 47; The X-axis that X-axis worktable 48 is moved to X-direction feeds drive unit 49.And, by driving the motor 49c that X-axis feeds drive unit 49, ball screw 49b is rotated, with not shown ball screw nut X-axis worktable 48 is moved along the guide rail 47a of straight line guidance 47, substrate maintaining part 20 is moved to X-direction.
Z-gradient adjusting mechanism 43 possesses: be located at the motor 43a on the X-axis worktable 48; By the ball screw axle 43b of motor 43a rotation driving; The wedge-like nut 43c that forms wedge-like and screw togather with ball screw axle 43b: be wedge-like outstanding be arranged on substrate maintaining part 20 below, and be sticked in wedge-shaped part 43d in the dip plane of wedge-like nut 43c.And in the present embodiment, Z-gradient adjusting mechanism 43 is provided with 2 in one distolateral (the positive front side of Fig. 1) of the X-direction of X-axis worktable 48, another distolateral have establish 1 (expert's side of Fig. 2, with reference to Fig. 3), be provided with 3 altogether, separately by drive controlling independently.In addition, Z-gradient adjusting mechanism 43 number is set is arbitrarily.
And, in Z-gradient adjusting mechanism 43, by driving ball screw axle 43b by motor 43a rotation, wedge nut 43c is moved horizontally to X-direction, this moves horizontally the ramp effect that moves through wedge nut 43c and wedge-shaped part 43d and is transformed into high-precision fine motion campaign up and down, and wedge-shaped part 43d is to the fine motion of Z direction.So, by driving 3 Z-gradient adjusting mechanisms 43, can make substrate maintaining part 20 to the Z-direction fine motion with same amount, in addition,, can adjust the gradient of substrate maintaining part 20 by driving 3 Z-gradient adjusting mechanisms 43 independently.Thus, the position of the vergence direction of the Z axle by fine setting substrate maintaining part 20 can make mask M and substrate W maintenance predetermined distance ground parallel opposed.
In addition, as shown in Figures 2 and 3, first near exposure device main body 2 in, the position detecting device that is provided with the position of detecting substrate maintaining part 20 is a laser length measurement device 60.This laser length measurement device 60 is devices that the displacement of the substrate maintaining part 20 that takes place during to driving substrate maintaining part travel mechanism 40 is measured.
Laser length measurement device 60 possesses: X-axis is with catoptron 64, and it is fixed on that strut (not diagrammatic sketch) is gone up and sets along the X-direction side of substrate maintaining part 20; Y-axis is with catoptron 65, and it is fixed on the strut 71 and sets along the Y direction side of substrate maintaining part 20; X-axis length meter (length meter) 61 and beat analyzer (length meter) 62, it is provided on the X-direction end of device pedestal 50, by to Z axle catoptron 64 irradiating lasers (instrumentation light), be subjected to light by X-axis catoptron 64 laser light reflected, the position of instrumentation substrate maintaining part 20; 1 Y-axis length meter (length meter) 63, it is provided on the Y direction end of device pedestal 50, by to Y-axis catoptron 65 irradiating lasers, is subjected to light by Y-axis catoptron 65 laser light reflected, and the position of instrumentation substrate maintaining part 20.
And, in laser length measurement device 60, from X-axis length meter 61, beat analyzer 62 and Y-axis length meter 63 be radiated at X-axis with catoptron 64 and Y-axis with the laser on the catoptron 65, reflected with catoptron 65 with catoptron 64 and Y-axis by X-axis, thereby measure the X-axis of substrate maintaining part 20, the position of Y direction accurately.In addition, the position data of X-direction is measured by X-axis length meter 61, and the position of θ direction is measured by beat analyzer 62.In addition, the position of substrate maintaining part 20 can suit to append to revise and calculate by adding the position of X-direction position, Y direction position and the θ direction of utilizing laser length measurement device 60 mensuration.
Fig. 5 (a) schematically shows first vertical view near the adsorption plane of the work chuck 21 of exposure device main body 2, and Fig. 5 (b) is the V portion enlarged drawing among Fig. 5 (a).On the adsorption plane 22 of work chuck 21, be formed with independently 7 binding domains, i.e. the first binding domain 80a～the 7th binding domain 80g.The second binding domain 80b in the first binding domain 80a of central authorities and its outside is separated by the first partition 81a of square shape, and the 3rd binding domain 80c in the second binding domain 80b and its outside is separated by the dimetric second partition 82a.Moreover the 3rd binding domain 80c and 4 the 4th～the 7th binding domain 80d, 80e, 80f, 80g in the localities that are formed at its outside are separated by dimetric the 3rd partition 83a.
So the first binding domain 80a delimited by the first partition 81a, the second binding domain 80b delimited between the first partition 81a and the second partition 82a, and the 3rd binding domain 80c delimited between second partition 82a and the 3rd dividing plate 83a.Moreover the 4th binding domain 80d～the 7th binding domain 80g delimited by the peripheral wall 84a of the 3rd partition 83a and the neighboring that becomes adsorption plane 22.In addition, the shape of periphery 84a is corresponding with the size of rectangular substrate W, carries out the absorption of the 4th binding domain 80d～the 7th binding domain 80g according to the direction of substrate W.
In addition, each binding domain 80a ..., in the 80g, be formed with a plurality of projections 85 that height equates with the height of each partition 81a, 82a, 83a, each partition 81a, 82a, 83a and projection 85 can connect with the back side of substrate W.In addition, the part of removing each partition 81a, 82a, 83a and projection 85 for each binding domain 80a ..., 80g lower curtate 86.In addition, the processing of each partition 81a, 82a, 83a and projection 85 can be the cutting of end mill etc., also can be shot blast.
In addition, each binding domain 80a ..., each lower curtate 86 in the 80g the surface, opening have a plurality of positive negative pressure hole 87a ..., 87g.And, when absorption substrate W, by from these positive negative pressure hole 87a ..., 87g carries out vacuum attraction, make by each binding domain 80a ..., the space that surrounds, the back side of each lower curtate 86, each partition 81a, 82a, 83a and surrounding wall portion 84a and substrate W of 80g becomes negative pressure.When unloading infrabasal plate W, in order to be easy to separating base plate W, with interior volume to atmosphere open wide or from positive negative pressure hole 87a ..., 87g imports malleation.In addition, when absorption substrate W, carry out lentamente laterally, can reduce deflection by the first binding domain 80a from the inboard.In addition, when substrate W is exposed, also can with by positive negative pressure hole 87a ..., 87g undertaken by the state of vacuum attraction, but also can carry out with the state of the vacuum attraction of part or all of each binding domain of releasing.
In addition, on adsorption plane 22, be formed with a plurality of pin-and-holes (not shown), above-mentioned pin-and-hole be used for by workpiece loading device (not shown) with substrate W conveyance on workpiece chuck 21 time for advancing and retreat from a plurality of pins (not shown) of adsorption plane 22 turnover.
In addition, adsorption plane 22 has roughly the same profile cun method near exposure device main body 2,3,4,5 at each, therefore as shown in Figure 1, outermost peripheral wall 84a ..., 84d the position identical near exposure device main body 2～5 at each.
Here, shown in Figure 1 first near exposure device main body 2～4th near the first partition 81a of exposure device main body 5 ..., 81d, the second partition 82a ..., 82d, and the 3rd partition 83a ..., 83d is respectively formed on the mutually different positions.
Therefore, adopt first near exposure device main body 2～4th near exposure device main body 5, when carrying out the first～four layer exposure transfer printing, each the partition 81a that contacts with the back side of substrate W ..., 81d, 82a ..., 82d, 83a ..., 83d the position respectively different.With overlapping the illustrating of dot-and-dash line substrate W is positioned in the 4th the V1d portion of Fig. 1 near on the adsorption plane 22 of the workpiece chuck 21 of exposure device main body 5 time among Fig. 6, and first near exposure device main body 2～3rd near second and third partition 82a of exposure device main body 4 ..., 82c, 83a ..., 83c and substrate W position contacting Fig. 1 in VIa～VId portion.
If adopt so constitute first near exposure device main body 2～4th near exposure device main body 5, on substrate W, carry out the first～four layer exposure transfer printing, then in the position of partition, because of influence of temperature variation produces some distortion at substrate, but because partition 81a ..., 81d; 82a ..., 82d; 83a ..., 83d the position 4 exposure device main bodys 2 ..., different respectively in 5, therefore can on substrate W, not find the exposure inequality, and the generation of the profile variation that can suppress to expose.In addition, peripheral wall 84a ..., substrate W that 84d contacted the position for the outside, even so identical exposure accuracy that also do not influence in the position of the peripheral wall of each exposure device main body 2,3,4,5 with the area of the pattern of pattern exposure transfer printing on substrate W.
In addition, the present invention is not limited to described each embodiment, can suit to change in not breaking away from the zone of main idea of the present invention.
In the above-described embodiment, partition is formed by the continuous part of rectilinear form, and projection is formed by square shape, but also can change to multiple shape as shown in Figures 7 and 8.
For example, shown in Fig. 7 (a)～(h), partition 90 also can be made of continuous part 90a and the extension 90b that stretches out in the direction of two side direction of this continuous part 90a and continuous part 90a and orthogonal.Thus, can reduce near the deflection of the noncontact part of the substrate W the partition 90, the gap value that can make mask M and substrate W is homogenising more, can suppress the uneven and profile variation of exposing of exposure.
Particularly, shown in Fig. 7 (a), (d)～(h), partition 90 also can be made of continuous part 90a and the extension 90b that stretches out to projection 91 that is positioned at the both sides of this continuous part 90a, shown in Fig. 7 (b), the direction that the extension 90b of partition 90 also can stretch out at the continuous part 90a of partition 90 is stretched out towards the centre position of 91 of the projections of adjacency.In addition, shown in Fig. 7 (c), the prolonging of a side that also can continuous part 90a part 90b and stretches out towards projection 91, and the extension 90b of opposite side stretches out towards the centre position of 91 of projections.
In addition, shown in Fig. 7 (d), Fig. 7 (f), Fig. 7 (g), continuous part 90a between the adjacent extension 90b of direction that continuous part 90a stretches out also can form curved shape according to the shape of end mill, in addition, shown in Fig. 7 (f), continuous part 90a can not be a linearity also, and with staggered connection.Moreover shown in Fig. 7 (c), Fig. 7 (d), Fig. 7 (e), extension 90b forms in the different mode of mutual extended position in the both sides of continuous part 90a, in Fig. 7 (e), prolongs the top that part 90b and stretches out to constitute projection 91.
In addition, shown in Fig. 7 (a)～7 (c), make the interval that is positioned near the projection 91 the partition 90 less than the interval that is positioned at the projection 91 on partition 90 separated portions.Under the big situation in the interval between partition 90 and the projection nearby 91, the deflection of noncontact part increases, have the uneven possibility of exposure takes place, but shown in Fig. 7 (a)～Fig. 7 (c), by reducing to be positioned near the interval of the projection 91 the partition 90, can reduce the deflection of noncontact part, it is uneven to suppress exposure.
In addition, shown in Fig. 8 (a), partition 90 also can be made of continuous part 90a and rectangular segment 90c, this rectangular segment 90c is in the both sides of this continuous part 90a, from continuous part 90a discretely to stretching out with the direction of continuous part 90a and orthogonal, or shown in Fig. 8 (b) and Fig. 8 (c), also can constitute by 2 or 3 continuous part 90a.Like this by constituting partition 90, and make and disperse with the contact portion of substrate W and be not vulnerable to Temperature Influence, thereby can reduce the deflection of noncontact part by a plurality of continuous part 90a.
In addition, shown in Fig. 8 (d)～8 (g), partition 90 also can constitute along rectangular segment 90d, 90e or the swash part 90f that continuous part 90a stretches out discontinuously by continuous part 90a with in the one or both sides of this continuous part 90a.That is to say that partition 90 can be symmetrical with respect to continuous part 90a, also can be asymmetric.
In addition, shown in Fig. 8 (h), as partition 90, also can form the circular or foursquare projection 90g of direction multiple row ground configuration of partition 90 for the gap between the projection 90g that buries adjacency, or shown in Fig. 8 (i), by reducing the interval of projection 90i, discontinuous projection 90g, 90i are concentrated, separate adjacent binding domain.
In addition, the partition of each exposure device main body can not overlapping fully contact in the position identical with the back side of substrate, the contact of also can overlapping.In addition, the shape of above-mentioned partition 90 can suit to make up and adopt.
In addition, in the present embodiment, each adsorption plane near the exposure device main body is configured to different structures, but also can make each adsorption plane form identical formation respectively, also can mount on a plurality of ground, position that mount that stagger substrate near the exposure device main body a little by the width of widening as the periphery in the area of the pattern outside.Thus, a wall energy contacts with the back side of substrate in different positions in each exposure device main body, can suppress to take place the uneven and exposure profile variation of exposure.In addition, can be designed to the width of periphery wideer between near the exposure device main body a plurality of than maximum offset.
[second embodiment]
Then, based on Fig. 9～Figure 17, the exposure device of the second embodiment of the present invention and the exposure method of substrate are elaborated.
As shown in Figure 9, exposure device 1 of the present invention possesses: to ground floor expose first near exposure device main body 2, to the second layer expose second near exposure main body 3, to the 3rd layer expose the 3rd near exposure device main body 4 and to the 4th layer expose the 4th near exposure device main body 5.In addition, with the device that uses in pre-service such as coating, pre-determined bit, development and the postprocessing working procedures, and the diagram of the Handling device of carrying substrate etc. omitted.In addition and since first～the 4th near exposure device main body 2,3,4,5 so long as the different formation of the adsorption plane of substrate maintaining part described later get final product, therefore describe in detail near exposure device main body 2 hereinafter first.
As shown in figure 10, first possesses the mask maintaining part 10 that is used to keep mask M near exposure device main body 2; Be used to keep the substrate maintaining part (substrate platform) 20 of glass substrate (being exposed material) W; The lamp optical system 30 of the exposure light of irradiation pattern exposure usefulness; Substrate maintaining part 20 is moved to X-axis, Y-axis, Z-direction, and the substrate holding portion moving mechanism 40 that the gradient of substrate maintaining part 20 is adjusted; The device pedestal 50 of supporting mask maintaining part 10 and substrate holding portion moving mechanism 40.
In addition, glass substrate W (being designated hereinafter simply as " substrate W ") and mask M dispose opposed to each other, be coated with emulsion with being depicted on the surface (with the opposed faces side of mask M) of the mask pattern exposure transfer printing on this mask M.In addition, mask M is made of fused quartz, and forms oblong-shaped.
For convenience of description, if begin explanation from lamp optical system 30, then lamp optical system 30 possesses: the light source of ultraviolet ray irradiation usefulness is high-pressure mercury-vapor lamp 31 for example; The concave mirror 32 of the light optically focused that will irradiate from this high-pressure mercury 31; Near two kinds of optical integrators 33 that the focus of this concave mirror 32, freely dispose with switching; Be used to change the plane mirror 35,36 and the spherical reflector 37 of the direction of light path; And being configured between this plane mirror 36 and the optical integrator 33, and the shutter 34 of the exposure control usefulness of switch control illumination path.
And, in lamp optical system 30, if when exposure, open exposure control shutter 34, then the light that penetrates from high-pressure mercury electric light 31 is through light path L shown in Figure 10, as the directional light that pattern exposure is used, vertically be radiated at the mask M that remains on the mask maintaining part 10 and remain on the surface of the substrate W on the substrate maintaining part 20.Thus, the mask pattern with mask M exposes transfer printing on substrate W.
As Figure 10～shown in Figure 12, mask maintaining part 10 possesses: the mask maintaining part pedestal 11 that is formed with the peristome 11a of rectangular shape at central portion; Keep frame 12 with the mask on the peristome 11a that can be installed in mask maintaining part pedestal 11 to the mode that X-axis, Y-axis, θ direction move; Be installed in the chuck segment 14 that mask keeps on the frame 12 and adsorbs maintenance mask M; And make mask keep frame 12 and chuck segment to move, and to remaining on the mask position adjusting mechanism 16 that this mask keeps the position of the mask M on the frame 12 to adjust to X-axis, Y-axis, θ direction.
Mask maintaining part pedestal 11 is supported to and utilizes the upright Z shaft moving device 52 that is located at the pillar 51 on the device pedestal 50 and is located on the upper end of pillar 51 to move to Z-direction, and it is configured in the top of substrate maintaining part 20.Z shaft moving device 52 for example possesses the electric actuator that is made of motor and ball screw etc. or pneumatics cylinder etc., by carrying out simple knee-action, makes mask maintaining part 10 be elevated to the position of regulation.In addition, when the cleaning of the exchange of carrying out mask M and workpiece chuck 21 etc., use Z shaft moving device 52.
Mask position adjusting mechanism 16 possesses: be installed in along mask and keep 1 Y direction drive unit 16y on one side of X-direction of frame 12; Keep 2 X-direction drive unit 16x on one side of Y direction of frame 12 with being installed in along mask.
And, in mask position adjusting mechanism 16, make mask keep frame 12 to move to Y direction by driving 1 Y direction drive unit 16y, make mask keep frame 12 to move by driving 2 X-direction drive unit 16x comparably to X-direction.In addition, make mask keep frame 12 to move (around the rotation of Z axle) by driving 2 arbitrary drive units among the X-direction drive unit 16x to the θ direction.
In addition, as shown in figure 12, be provided with: the gap sensor 17 that is used to measure the gap between the opposed faces of mask M and substrate W at the upper surface of mask maintaining part pedestal 11; With the mask alignment of the installation site that is used to confirm to remain on the mask M on the chuck segment 14 with camera 18.These gap sensors 17 and mask alignment are retained with camera 18 and utilize travel mechanism 19 to move to X-axis, Y direction, and are configured in the mask maintenance frame 12.
In addition, at the upper surface of mask maintaining part pedestal 11, as shown in figure 12, at the both ends of the X-direction of the peristome 11a of mask maintaining part pedestal 11, what be provided with the both ends of coming shadowing mask M as required covers opening 38.This covers opening 38 and can move to X-direction by the peristome driving mechanism 39 that covers that is made of motor, ball screw and straight line guidance etc., adjusts the dead area at the both ends of mask M.In addition, cover the both ends that peristome 38 not only is located at the X-direction of peristome 11a, equally also can be located at the both ends of the Y direction of peristome 11a.
As Figure 10 and shown in Figure 11, substrate maintaining part 20 is set on the substrate holding portion moving mechanism 40, has workpiece chuck 21, this workpiece chuck 21 and has at upper surface and be used for substrate W is remained on adsorption plane 22 on the substrate maintaining part 20.In addition, work chuck 21 keeps substrate W by vacuum suction.
As Figure 10 and shown in Figure 11, substrate keeps moving part 40 to possess: the Y-axis feed mechanism 41 that substrate maintaining part 20 is moved to Y direction; The X-axis feed mechanism 42 that substrate maintaining part 20 is moved to X-direction; Gradient with adjusting substrate maintaining part 20 makes substrate maintaining part 20 to the Z-of Z-direction fine motion gradient adjusting mechanism 43 simultaneously.
Y-axis feed mechanism 41 possesses: a pair of straight line guidance 44 that is located at the upper surface of device pedestal 50 along Y direction; Be supported to the Y-axis worktable 45 that utilizes straight line guidance 44 to move to Y direction; The Y-axis that Y-axis worktable 45 is moved to Y direction feeds drive unit 46.In addition,, make ball screw 46b rotation, Y-axis worktable 45 and ball screw 46a are together moved along the guide rail 44a of straight line guidance 44, substrate maintaining part 20 is moved to Y direction by driving the motor 46c that Y-axis feeds drive unit 46.
In addition, X-axis feed mechanism 42 possesses: a pair of straight line guidance 47 that is provided with along X-direction at Y-axis worktable 45 upper surfaces; Be supported the X-axis worktable 48 that utilizes straight line guidance 47 to move to X-direction; The X-axis that X-axis worktable 48 is moved to X-direction feeds drive unit 49.And, by driving the motor 49c that X-axis feeds drive unit 49, ball screw 49b is rotated, X-axis worktable 48 and not shown ball screw nut are together moved along the guide rail 47a of straight line guidance 47, thereby substrate maintaining part 20 is moved to X-direction.
Z-gradient adjusting mechanism 43 possesses: be located at the motor 43a on the X-axis worktable 48; The ball screw axle 43b that is driven in rotation by motor 43a; The wedge-like nut 43c that forms wedge-like and screw togather with ball screw axle 43b; Be wedge-like outstanding be arranged on substrate maintaining part 20 below, and the wedge-shaped part 43d that engages with the dip plane of wedge-like nut 43c.In addition, in the present embodiment, Z-gradient adjusting mechanism 43 is provided with 2 in one distolateral (the positive front side of Fig. 9) of the X-direction of X-axis worktable 48, distolaterally be provided with 1 (expert's side of Fig. 2 at another, with reference to Figure 11), be provided with 3 altogether, separately by drive controlling independently.In addition, Z-gradient adjusting mechanism 43 number is set is arbitrarily.
And, in Z-gradient adjusting mechanism 43, by utilizing motor 43a rotation to drive ball screw axle 43b, wedge nut 43c is moved horizontally to X-direction, this moves horizontally motion and utilizes the ramp effect of wedge nut 43c and wedge-shaped part 43d to be transformed into high-precision fine motion campaign up and down, and wedge-shaped part 43d is to the fine motion of Z direction.So, by driving 3 Z-gradient adjusting mechanisms 43, can make substrate maintaining part 20 to the Z-direction fine motion with same amount, in addition,, can adjust the gradient of substrate maintaining part 20 by driving 3 Z-gradient adjusting mechanisms 43 independently.Thus, the position of the vergence direction of the Z axle by fine setting substrate maintaining part 20 can make mask M and substrate W keep predetermined distance ground parallel opposed.
In addition, first near exposure device main body 21 in, as Figure 10 and shown in Figure 11, the position detecting device that is provided with the position of detecting substrate maintaining part 20 is a laser length measurement device 60.This laser length measurement device 60 is the equipment that the displacement of the substrate maintaining part 20 that takes place when the driving substrate maintaining part travel mechanism 40 is measured.
Laser length measurement device 60 possesses: Y-axis is with catoptron 65, its be fixed on that strut (not diagrammatic sketch) is gone up and the X-axis that sets along the side of the X-direction of substrate maintaining part 20 with catoptron 64; Be fixed on the strut 71 and along the side of the Y direction of substrate maintaining part 20 and set; X-axis length meter (length meter) 61 and beat analyzer (length meter) 62, it is provided on the X-direction end of device pedestal 50, by to Z axle catoptron 64 irradiating lasers (instrumentation light), be subjected to light by X-axis catoptron 64 laser light reflected, with the position of instrumentation substrate maintaining part 20; And 1 Y-axis length meter (length meter) 63, be provided on the Y direction end of device pedestal 50, by to Y-axis catoptron 65 irradiating lasers, be subjected to light by Y-axis catoptron 65 laser light reflected, with the position of instrumentation substrate maintaining part 20.
And, in laser length measurement device 60, from X-axis length meter 61, beat analyzer 62 and Y-axis length meter 63 be radiated at X-axis with catoptron 64 and Y-axis with the laser on the catoptron 65, by X-axis with catoptron 64 and Y-axis with catoptron 65 reflections, thereby but the X-axis of high precision instrumentation substrate maintaining part 20, the position of Y direction.In addition, the position data of X-direction is measured by X-axis length meter 61, and the position of θ direction is measured by beat analyzer 62.In addition, the position of substrate maintaining part 20 can suit to append to revise and calculate by adding the position of X-direction position, Y direction position and the θ direction of utilizing laser length measurement device 60 mensuration.
Figure 13 schematically shows first vertical view near the adsorption plane of the workpiece chuck 21 of exposure device main body 2.On the adsorption plane 22 of work chuck 21, be formed with independently 13 binding domains, that is to say, be formed with the first binding domain 800a～the 11 binding domain 800m.The first binding domain 800a is separated by the first partition 810a of square shape, and separates the second binding domain 800b～the 9th binding domain 800i and the first binding domain 800a is adjacent to be configured to rectangular successively by partition 810b～810i.Become general wall with the partition 810b of the second binding domain 800b of the partition 810a adjacency of the first binding domain 800a in its adjacency section.In addition, the partition 810d with the 4th binding domain 800d of the partition 810a adjacency of the first binding domain 800a becomes general wall in its adjacency section too.In addition, about other binding domain too.
Around the first binding domain 800a～the 9th binding domain 800i, around the tenth around binding domain 800j～13 binding domain 810m separated by partition 810j～810m, form oblong-shaped.With the tenth around the partition 810h of partition 810g, the 8th binding domain 800h of the 7th binding domain 800g of partition 810j adjacency of binding domain 800j and the partition 810i of the 9th binding domain 80i become general wall in its adjacency section.For binding domain around other too.In addition, around the tenth around binding domain 800j～13 binding domain 800m corresponding with the size of OBL substrate W, with substrate W towards use as one man.
Figure 14 (A)～(D) is A portion, B portion, the C portion among Figure 13, the enlarged drawing of each one of D portion.Each binding domain 800a ..., in the 800m, be formed with height and each partition 810a ..., 810m a plurality of projections 85 of equating of height, each partition 810a ..., 810m and projection 85 can connect with the back side of substrate W.In addition, remove each partition 810a ..., 810m and projection 85 part be each binding domain 800a ..., 800g lower curtate 86.In addition, each partition 810a ..., 810m and projection 85 processing can be the cutting of end mill etc., also can be shot blast.
In addition, each binding domain 800a ..., each lower curtate 86 in the 800m the surface, opening has a plurality of positive negative pressure holes 87.And, when absorption substrate W, by carrying out vacuum attraction from these positive negative pressure holes 87, make by each binding domain 800a ..., each lower curtate 86 of 800m and each partition 810a ..., 810m and around binding domain 800j ..., the space that surrounds of 800m, the back side of substrate W becomes negative pressure.When unloading infrabasal plate W, in order to be easy to separating base plate W, interior volume is opened wide or imported malleations from positive negative pressure hole 87 to atmosphere.
Shown in Figure 15 (A), first near the adsorption plane 22 (dot-and-dash line) of the workpiece chuck 21 of exposure device main body 2 go up mounting substrate W (solid line) be Figure 15 (B).In addition, the oblique line portion of the substrate W among Figure 15 (B) represents cell S e1～Se4 of being exposed.In this case, basal disc W vertically disposes use with what is called, but as binding domain, can use around the first binding domain 800a～the 9th binding domain 800i, the tenth binding domain 800l around the binding domain 800j and the 12.
These binding domains can be controlled by the absorption control part 70a (with reference to Figure 10) that is located in the control part 70 (with reference to Figure 10).Absorption control part 70a and other binding domain are independently to controlling with the corresponding binding domain of the irradiated area of exposure light.For example, can be non-the control binding domain corresponding in absorption ground with the exposure light irradiated area, in addition, also can be with respect to the control of reducing pressure of other binding domain pair binding domain corresponding with the exposure light irradiated area.
The absorption control of substrate W when adopting Figure 16 (A)～(D) to the exposure of cell S e1～Se4 of carrying out substrate W describes.
At first, shown in Figure 16 (A), by shining exposure light to cell S e1, with cell S e1 exposure, but the first binding domain 800a, the second binding domain 800b, the 4th binding domain 800d and the 5th binding domain 800e of (exposure light irradiated area) are controlled as non-adsorbed state under this moment cell S e1.Corresponding, the 3rd binding domain 800c, the 6th binding domain 800f, the 7th binding domain 800g, the 8th binding domain 800h and the 9th binding domain 800i of the L word line bar Q1 of portion of (exposure light irradiated area) are controlled as adsorbed state beyond the expression cell S e1.In this case, around the tenth around the binding domain 800j and the 12 binding domain 800l can adsorb, can not adsorb yet.Like this, by not carrying out the absorption of the binding domain under the exposure light irradiated area, can avoid the base plate deformation that causes by absorption.
Then, by substrate holding portion moving mechanism 40 substrate maintaining part 20 is moved to the X-direction step, shown in Figure 16 (B), by shining exposure light to cell S e2, with cell S e2 exposure, but the 3rd binding domain 800c, the second binding domain 800b, the 6th binding domain 800f and the 5th binding domain 800e of (exposure light irradiated area) are controlled as non-adsorbed state under this moment cell S e2.Corresponding, the first binding domain 800a, the 4th binding domain 800d, the 7th binding domain 800g, the 8th binding domain 800h and the 9th binding domain 800i of the L word line bar Q2 of portion of (exposure light irradiated area) are controlled as adsorbed state beyond the expression cell S e2.
In addition, the exposure that switches in cell S e1 of this binding domain ends afterwards, carries out before the step of cell S e2 moves.Thus, can prevent that when step substrate W from moving.
Then, by substrate holding portion moving mechanism 40 substrate maintaining part 20 is moved to the Y direction step, shown in Figure 16 (C), by shining exposure light to cell S e3, with cell S e3 exposure, but the 9th binding domain 800i, the 8th binding domain 800h, the 6th binding domain 800f and the 5th binding domain 800e of (exposure light irradiated area) are controlled as non-adsorbed state under this moment cell S e3.Corresponding, the 7th binding domain 800g, the 4th binding domain 800d, the first binding domain 800a, the second binding domain 800b and the 12 binding domain 800l of the L word line bar Q3 of portion of part (exposure light irradiated area) are controlled as adsorbed state beyond the expression cell S e3.
Then, by substrate holding portion moving mechanism 40 substrate maintaining part 20 is moved to the X-direction step, shown in Figure 16 (D), by shining exposure light to cell S e4, with cell S e4 exposure, but the 7th binding domain 800g, the 8th binding domain 800h, the 4th binding domain 800d and the 5th binding domain 800e of (exposure light irradiated area) are controlled as non-adsorbed state under this moment cell S e4.Corresponding, the first binding domain 800a, the second binding domain 800b, the 3rd binding domain 800c, the 6th binding domain 800f and the 9th binding domain 800i of the L word line bar Q4 of portion of part (exposure light irradiated area) are controlled as adsorbed state beyond the expression cell S e4.
In addition, in the above-described embodiment, before step, switch binding domain, but also can when step, switch binding domain.Need only the binding domain that when step, has adsorbed state often like this, and as long as any binding domain beyond the exposure rayed area is adsorbed.
For example, from cell S e1 during to the step of cell S e2, for the 7th binding domain 800g, the 8th binding domain 800h and the 9th binding domain 800i, often be the adsorbed state original state, therefore absorption control can be switched to the first binding domain 800a, the 4th binding domain 800d from the 3rd binding domain 800c, the 6th binding domain 800d.
In addition, in Figure 17 (A) and 17 (8), 4 unit (so-called 4 connect face) exposed, but also be not limited to this, all are connect face all be suitable for respect to 1 substrate W.For example, Figure 16 (A) is the diagram of the landscape configuration 6 substrate W that connects face (laterally long substrate), and absorption during exposure and above-mentioned embodiment carry out in the same manner.In this case, use around the 11 binding domain 800m around the binding domain 800k and the 13.In addition, Figure 17 (B) is the diagram of the vertically configuration 6 substrate W (vertically long substrate) that connects face, and absorption during exposure and above-mentioned embodiment carry out in the same manner.In this case, use around the tenth binding domain 800l around the binding domain 800j and the 12.
In addition, on adsorption plane 22, be formed with a plurality of pin-and-holes (not shown), by workpiece loading device (not shown) with substrate W conveyance on workpiece chuck 21 time, can be from a plurality of pins (not shown) of adsorption plane 22 turnover from these pin-and-holes advance and retreat.
If adopt so constitute first near exposure device main body 2～4th near exposure device main body 5, on substrate W, carry out the first～four layer exposure transfer printing, then in the position of partition, because of influence of temperature variation produces some distortion at substrate, but can eliminate the substrate deformation that produces because of the absorption substrate, therefore can not see on substrate W that exposure is uneven, in addition, can suppress to take place the exposure profile variation.In addition, the present invention is not limited to each above-mentioned embodiment, can suit to change in not breaking away from the zone of main idea of the present invention.
In the above-described embodiment, the first binding domain 800a～the 9th binding domain 800i is as the ground formation of non-directional wave with partition 810a～810i, on every side binding domain 800j ..., binding domain 810j around the 800m partition ..., 810m forms by the continuous part of rectilinear form, but the first binding domain 800a～the 9th binding domain 800i is formed by straight lines partition 810a～810i, on every side binding domain 800j ..., binding domain 810j around the 800m partition ..., 810m also can form by the continuous part as non-directional wave.In addition, projection is round shape respectively and forms, but also can form square shape, can adopt multiple shape.
The application has quoted its content here as a reference based on the Japanese patent application 2009-267918 communique of application on November 25th, 2009 and the Japanese patent application 2010-016087 communique of application on January 28th, 2010.

Claims (6)

1. exposure device, this exposure device exposes a plurality of mask patterns to transfer printing on substrate successively, it is characterized in that,
Described exposure device possesses by shining described exposure light a plurality of exposure device main bodys of pattern exposure transfer printing on described substrate of described mask, and described exposure device main body has:
Keep having the mask of described pattern the mask maintaining part,
Have absorption keep described substrate adsorption plane the substrate maintaining part and
The irradiation portion of irradiation exposure light,
On the adsorption plane of described substrate maintaining part, be provided with:
For separating the binding domain of adjacency form and the partition that can connect with the back side of described substrate and
A plurality of projections that can connect with the back side of described substrate at described binding domain,
The adsorption plane of each substrate maintaining part of described a plurality of exposure device main bodys has roughly the same physical dimension, and the partition of described each substrate maintaining part is formed on the different positions in each described exposure device main body.
2. exposure device according to claim 1 wherein, is provided with the absorption control part on the adsorption plane of described substrate maintaining part, be used for described each binding domain is controlled to be absorption or non-absorption;
Described absorption control part is controlled the binding domain corresponding with the irradiated area of described exposure light independently with other binding domain.
3. exposure device according to claim 2, wherein, described absorption control part is controlled, and making the described binding domain corresponding with described irradiated area is non-absorption.
4. exposure device according to claim 2, wherein, described absorption control part is controlled, so that the binding domain corresponding with the irradiated area of described exposure light and other binding domain are in a ratio of decompression state.
5. exposure method, this exposure method uses by shining described exposure light with the pattern of described each mask a plurality of exposure device main bodys of transfer printing on described substrate of exposing successively, with the pattern of described each mask substrate of transfer printing on described substrate that expose successively, described exposure device main body possesses: be used to keep have the mask of pattern the mask maintaining part, have by absorption and keep the substrate maintaining part of adsorption plane of described substrate and the irradiation portion of irradiation exposure light, it is characterized in that:
Described exposure method comprises following operation: so that with the separated partition of binding domain of described adsorption plane institute adjacency diverse location and the mode that connects of the back side of described substrate in described each exposure device main body, by described a plurality of exposure device main bodys described substrate is exposed successively.
6. exposure method according to claim 5 wherein, is controlled the binding domain corresponding with the irradiated area of described exposure light independently with other binding domain.
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