TWI663681B - 靜電夾具以及製造其之方法 - Google Patents

靜電夾具以及製造其之方法 Download PDF

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Publication number
TWI663681B
TWI663681B TW104104028A TW104104028A TWI663681B TW I663681 B TWI663681 B TW I663681B TW 104104028 A TW104104028 A TW 104104028A TW 104104028 A TW104104028 A TW 104104028A TW I663681 B TWI663681 B TW I663681B
Authority
TW
Taiwan
Prior art keywords
dielectric layer
electrode
layer
electrostatic fixture
electrostatic
Prior art date
Application number
TW104104028A
Other languages
English (en)
Chinese (zh)
Other versions
TW201545268A (zh
Inventor
Richard A. Cooke
理查Ａ 庫克
Wolfram Neff
沃弗蘭 內夫
Carlo Waldfried
卡羅 沃弗萊德
Jakub Rybczynski
雅各 萊辛斯基
Michael Hanagan
麥克 漢那根
Wade Krull
偉德 羅歐
Original Assignee
Entegris, Inc.
美商恩特葛瑞斯股份有限公司
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Filing date
Publication date
Application filed by Entegris, Inc., 美商恩特葛瑞斯股份有限公司 filed Critical Entegris, Inc.
Publication of TW201545268A publication Critical patent/TW201545268A/zh
Application granted granted Critical
Publication of TWI663681B publication Critical patent/TWI663681B/zh

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Classifications

    • H10P72/722—
    • H10P14/6326—
    • H10P72/0602—
    • H10P72/72—
    • H10W20/071—
    • H10W20/075—
    • H10W70/05—

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Ceramic Engineering (AREA)
TW104104028A 2014-02-07 2015-02-06 靜電夾具以及製造其之方法 TWI663681B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201461937135P 2014-02-07 2014-02-07
US61/937,135 2014-02-07

Publications (2)

Publication Number Publication Date
TW201545268A TW201545268A (zh) 2015-12-01
TWI663681B true TWI663681B (zh) 2019-06-21

Family

ID=52544589

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104104028A TWI663681B (zh) 2014-02-07 2015-02-06 靜電夾具以及製造其之方法

Country Status (8)

Country Link
US (1) US10497598B2 (enExample)
EP (1) EP3103136B1 (enExample)
JP (1) JP6527524B2 (enExample)
KR (1) KR102369706B1 (enExample)
CN (1) CN107078086B (enExample)
SG (1) SG10201806706VA (enExample)
TW (1) TWI663681B (enExample)
WO (1) WO2015120265A1 (enExample)

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TWI915119B (zh) 2024-12-10 2026-02-11 鈦昇科技股份有限公司 夾具裝置

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JP7572569B2 (ja) * 2021-08-31 2024-10-23 京セラ株式会社 耐プラズマ積層体、その製造方法、ならびにプラズマ処理装置
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WO2025004883A1 (ja) * 2023-06-29 2025-01-02 東京エレクトロン株式会社 プラズマ処理装置
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TWI915119B (zh) 2024-12-10 2026-02-11 鈦昇科技股份有限公司 夾具裝置

Also Published As

Publication number Publication date
JP2017507484A (ja) 2017-03-16
CN107078086A (zh) 2017-08-18
US20160336210A1 (en) 2016-11-17
EP3103136A1 (en) 2016-12-14
JP6527524B2 (ja) 2019-06-05
CN107078086B (zh) 2021-01-26
KR20160118259A (ko) 2016-10-11
EP3103136B1 (en) 2021-06-23
KR102369706B1 (ko) 2022-03-04
SG10201806706VA (en) 2018-09-27
TW201545268A (zh) 2015-12-01
WO2015120265A1 (en) 2015-08-13
US10497598B2 (en) 2019-12-03

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