TWI662115B - 具有陽離子界面活性劑之硏光漿料 - Google Patents
具有陽離子界面活性劑之硏光漿料 Download PDFInfo
- Publication number
- TWI662115B TWI662115B TW103126727A TW103126727A TWI662115B TW I662115 B TWI662115 B TW I662115B TW 103126727 A TW103126727 A TW 103126727A TW 103126727 A TW103126727 A TW 103126727A TW I662115 B TWI662115 B TW I662115B
- Authority
- TW
- Taiwan
- Prior art keywords
- chloride
- quaternary ammonium
- salt
- cationic surfactant
- ammonium salt
- Prior art date
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- 239000002002 slurry Substances 0.000 title claims abstract description 29
- 239000003093 cationic surfactant Substances 0.000 title claims description 24
- 239000002245 particle Substances 0.000 claims abstract description 47
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims abstract description 41
- 238000005498 polishing Methods 0.000 claims abstract description 28
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000010432 diamond Substances 0.000 claims description 49
- 229910003460 diamond Inorganic materials 0.000 claims description 45
- -1 cinnamylamine chloride Trimethylammonium Chemical compound 0.000 claims description 23
- 239000000203 mixture Substances 0.000 claims description 22
- 150000003242 quaternary ammonium salts Chemical class 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 20
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 13
- 229920006317 cationic polymer Polymers 0.000 claims description 11
- 150000003841 chloride salts Chemical class 0.000 claims description 9
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 claims description 8
- 239000002518 antifoaming agent Substances 0.000 claims description 6
- 229910052582 BN Inorganic materials 0.000 claims description 5
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 5
- 150000003973 alkyl amines Chemical class 0.000 claims description 5
- ZCPCLAPUXMZUCD-UHFFFAOYSA-M dihexadecyl(dimethyl)azanium;chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCC[N+](C)(C)CCCCCCCCCCCCCCCC ZCPCLAPUXMZUCD-UHFFFAOYSA-M 0.000 claims description 5
- UKHVLWKBNNSRRR-TYYBGVCCSA-M quaternium-15 Chemical compound [Cl-].C1N(C2)CN3CN2C[N+]1(C/C=C/Cl)C3 UKHVLWKBNNSRRR-TYYBGVCCSA-M 0.000 claims description 5
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 claims description 4
- YSJGOMATDFSEED-UHFFFAOYSA-M behentrimonium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCCCCCCCC[N+](C)(C)C YSJGOMATDFSEED-UHFFFAOYSA-M 0.000 claims description 4
- 239000002131 composite material Substances 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 4
- 229940096792 quaternium-15 Drugs 0.000 claims description 4
- 229920000867 polyelectrolyte Polymers 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 125000001453 quaternary ammonium group Chemical group 0.000 claims description 3
- SFVFIFLLYFPGHH-UHFFFAOYSA-M stearalkonium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCCCC[N+](C)(C)CC1=CC=CC=C1 SFVFIFLLYFPGHH-UHFFFAOYSA-M 0.000 claims description 3
- 229940057981 stearalkonium chloride Drugs 0.000 claims description 3
- 239000010497 wheat germ oil Substances 0.000 claims description 3
- MPNXSZJPSVBLHP-UHFFFAOYSA-N 2-chloro-n-phenylpyridine-3-carboxamide Chemical compound ClC1=NC=CC=C1C(=O)NC1=CC=CC=C1 MPNXSZJPSVBLHP-UHFFFAOYSA-N 0.000 claims description 2
- BPYOHXGXWREPOW-UHFFFAOYSA-N N-[3-(dimethylamino)propyl]octadecanamide propanoic acid Chemical compound C(CC)(=O)O.C(CCCCCCCCCCCCCCCCC)(=O)NCCCN(C)C BPYOHXGXWREPOW-UHFFFAOYSA-N 0.000 claims description 2
- JZMJDSHXVKJFKW-UHFFFAOYSA-N methyl sulfate Chemical class COS(O)(=O)=O JZMJDSHXVKJFKW-UHFFFAOYSA-N 0.000 claims description 2
- JZMJDSHXVKJFKW-UHFFFAOYSA-M methyl sulfate(1-) Chemical compound COS([O-])(=O)=O JZMJDSHXVKJFKW-UHFFFAOYSA-M 0.000 claims 3
- GZDMWDFUDNJSIH-UHFFFAOYSA-N 1-chlorooctadecane N,N-dimethyl-1-phenylmethanamine Chemical compound CN(C)CC1=CC=CC=C1.CCCCCCCCCCCCCCCCCCCl GZDMWDFUDNJSIH-UHFFFAOYSA-N 0.000 claims 2
- NJAKAIFYVMOVKY-UHFFFAOYSA-N C(CC(O)(C(=O)O)CC(=O)O)(=O)O.C(CC)N(C)C.C(CCCCCCCCCCCCCCCCC)N Chemical compound C(CC(O)(C(=O)O)CC(=O)O)(=O)O.C(CC)N(C)C.C(CCCCCCCCCCCCCCCCC)N NJAKAIFYVMOVKY-UHFFFAOYSA-N 0.000 claims 2
- STTQIRMNKUDXJQ-UHFFFAOYSA-N C(CC)(=O)O.C(CC)N(C)C.C(CCCCCCCCCCCCCCCCC)N Chemical compound C(CC)(=O)O.C(CC)N(C)C.C(CCCCCCCCCCCCCCCCC)N STTQIRMNKUDXJQ-UHFFFAOYSA-N 0.000 claims 2
- NUOADXFOULDPJQ-BBVRLYRLSA-N (3r,4s,5s)-4-amino-3-hydroxy-5-methylheptanoic acid Chemical compound CC[C@H](C)[C@H](N)[C@H](O)CC(O)=O NUOADXFOULDPJQ-BBVRLYRLSA-N 0.000 claims 1
- KIGKLPUFLPCHLT-UHFFFAOYSA-N C(CC)N(C)C.C(CCCCCCCCCCCCCCC(C)C)N Chemical compound C(CC)N(C)C.C(CCCCCCCCCCCCCCC(C)C)N KIGKLPUFLPCHLT-UHFFFAOYSA-N 0.000 claims 1
- CFPYFFMHYKEGPE-UHFFFAOYSA-N CC(C)CCCCCCCCCCCCCCCNCCCN1CCOCC1 Chemical compound CC(C)CCCCCCCCCCCCCCCNCCCN1CCOCC1 CFPYFFMHYKEGPE-UHFFFAOYSA-N 0.000 claims 1
- UXNAAWCGLKESOR-UHFFFAOYSA-N N-methyl-N-propyltricosan-1-amine Chemical compound C(CCCCCCCCCCCCCCCCCCCCC)CN(C)CCC UXNAAWCGLKESOR-UHFFFAOYSA-N 0.000 claims 1
- 150000001412 amines Chemical class 0.000 claims 1
- 229940075506 behentrimonium chloride Drugs 0.000 claims 1
- 235000019864 coconut oil Nutrition 0.000 claims 1
- 239000003240 coconut oil Substances 0.000 claims 1
- NTLIJZACUWTZFB-UHFFFAOYSA-N dimethyl-[3-(octadecanoylamino)propyl]azanium;2-hydroxypropanoate Chemical compound CC(O)C(O)=O.CCCCCCCCCCCCCCCCCC(=O)NCCCN(C)C NTLIJZACUWTZFB-UHFFFAOYSA-N 0.000 claims 1
- SORARJZLMNRBAQ-UHFFFAOYSA-N n,n',n'-trimethylpropane-1,3-diamine Chemical compound CNCCCN(C)C SORARJZLMNRBAQ-UHFFFAOYSA-N 0.000 claims 1
- PLXZCQQLUFNTPF-UHFFFAOYSA-N n,n-dimethylpentacosan-1-amine Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCN(C)C PLXZCQQLUFNTPF-UHFFFAOYSA-N 0.000 claims 1
- ZUHZZVMEUAUWHY-UHFFFAOYSA-N n,n-dimethylpropan-1-amine Chemical compound CCCN(C)C ZUHZZVMEUAUWHY-UHFFFAOYSA-N 0.000 claims 1
- NZXVYLJKFYSEPO-UHFFFAOYSA-N n-[3-(dimethylamino)propyl]-16-methylheptadecanamide Chemical compound CC(C)CCCCCCCCCCCCCCC(=O)NCCCN(C)C NZXVYLJKFYSEPO-UHFFFAOYSA-N 0.000 claims 1
- SZYJELPVAFJOGJ-UHFFFAOYSA-N trimethylamine hydrochloride Chemical compound Cl.CN(C)C SZYJELPVAFJOGJ-UHFFFAOYSA-N 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 12
- 239000004094 surface-active agent Substances 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000006061 abrasive grain Substances 0.000 abstract description 2
- 238000009472 formulation Methods 0.000 description 15
- 235000012431 wafers Nutrition 0.000 description 14
- 229910052594 sapphire Inorganic materials 0.000 description 11
- 239000010980 sapphire Substances 0.000 description 11
- 239000013078 crystal Substances 0.000 description 5
- 238000007517 polishing process Methods 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000003082 abrasive agent Substances 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 238000007373 indentation Methods 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- KMUONIBRACKNSN-UHFFFAOYSA-N potassium dichromate Chemical compound [K+].[K+].[O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O KMUONIBRACKNSN-UHFFFAOYSA-N 0.000 description 2
- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical compound [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 description 2
- 239000004576 sand Substances 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- FVEWVVDBRQZLSJ-QTWKXRMISA-N 2-hydroxyethyl-dimethyl-[3-[[(2r,3s,4r,5r)-2,3,4,5,6-pentahydroxyhexanoyl]amino]propyl]azanium;chloride Chemical compound [Cl-].OCC[N+](C)(C)CCCNC(=O)[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FVEWVVDBRQZLSJ-QTWKXRMISA-N 0.000 description 1
- CPSCNTYWVQYNOQ-UHFFFAOYSA-M 2-hydroxyethyl-dimethyl-propylazanium;chloride Chemical compound [Cl-].CCC[N+](C)(C)CCO CPSCNTYWVQYNOQ-UHFFFAOYSA-M 0.000 description 1
- LJINUHNXFYXJSU-UHFFFAOYSA-N 2-hydroxypropanoic acid;n-methylmethanamine Chemical compound C[NH2+]C.CC(O)C([O-])=O LJINUHNXFYXJSU-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- MPVJPALMMIGWEV-UHFFFAOYSA-N C(CCCCCCCCCCCCCCC(C)C)(=O)NCCCN(C)C.C(CCCCCCCCCCCCCCC(C)C)(=O)NCCCN(C)C Chemical compound C(CCCCCCCCCCCCCCC(C)C)(=O)NCCCN(C)C.C(CCCCCCCCCCCCCCC(C)C)(=O)NCCCN(C)C MPVJPALMMIGWEV-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 241001391944 Commicarpus scandens Species 0.000 description 1
- AEMRFAOFKBGASW-UHFFFAOYSA-M Glycolate Chemical compound OCC([O-])=O AEMRFAOFKBGASW-UHFFFAOYSA-M 0.000 description 1
- 206010028896 Needle track marks Diseases 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 150000003842 bromide salts Chemical class 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 235000013339 cereals Nutrition 0.000 description 1
- 229960002788 cetrimonium chloride Drugs 0.000 description 1
- WOWHHFRSBJGXCM-UHFFFAOYSA-M cetyltrimethylammonium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCC[N+](C)(C)C WOWHHFRSBJGXCM-UHFFFAOYSA-M 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 239000010431 corundum Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 229910001651 emery Inorganic materials 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- PASCYLAFGHJSHW-UHFFFAOYSA-N ethyl 2-[(4-methoxyphenyl)methyl]-3-(methylamino)propanoate Chemical compound CCOC(=O)C(CNC)CC1=CC=C(OC)C=C1 PASCYLAFGHJSHW-UHFFFAOYSA-N 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000010191 image analysis Methods 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000013081 microcrystal Substances 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- TWMXKKYDRGAISU-UHFFFAOYSA-N n-[3-(dimethylamino)propyl]octadecanamide;2-hydroxypropane-1,2,3-tricarboxylic acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O.CCCCCCCCCCCCCCCCCC(=O)NCCCN(C)C TWMXKKYDRGAISU-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 235000010333 potassium nitrate Nutrition 0.000 description 1
- 239000004323 potassium nitrate Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000008262 pumice Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- PFUVRDFDKPNGAV-UHFFFAOYSA-N sodium peroxide Chemical compound [Na+].[Na+].[O-][O-] PFUVRDFDKPNGAV-UHFFFAOYSA-N 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 239000010455 vermiculite Substances 0.000 description 1
- 229910052902 vermiculite Inorganic materials 0.000 description 1
- 235000019354 vermiculite Nutrition 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1436—Composite particles, e.g. coated particles
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1472—Non-aqueous liquid suspensions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Composite Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/974,588 US9388328B2 (en) | 2013-08-23 | 2013-08-23 | Lapping slurry having a cationic surfactant |
| US13/974,588 | 2013-08-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201510201A TW201510201A (zh) | 2015-03-16 |
| TWI662115B true TWI662115B (zh) | 2019-06-11 |
Family
ID=51352791
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103126727A TWI662115B (zh) | 2013-08-23 | 2014-08-05 | 具有陽離子界面活性劑之硏光漿料 |
Country Status (13)
| Country | Link |
|---|---|
| US (1) | US9388328B2 (enExample) |
| EP (2) | EP3653683A1 (enExample) |
| JP (1) | JP6491208B2 (enExample) |
| KR (1) | KR102262967B1 (enExample) |
| CN (1) | CN105579548A (enExample) |
| BR (1) | BR112016003781B1 (enExample) |
| CA (1) | CA2920837C (enExample) |
| DK (1) | DK3036299T3 (enExample) |
| ES (1) | ES2874899T3 (enExample) |
| MY (1) | MY179920A (enExample) |
| SG (1) | SG11201601038WA (enExample) |
| TW (1) | TWI662115B (enExample) |
| WO (1) | WO2015026477A1 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9633831B2 (en) * | 2013-08-26 | 2017-04-25 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing composition for polishing a sapphire surface and methods of using same |
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| MY179920A (en) | 2020-11-19 |
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| CA2920837C (en) | 2021-07-27 |
| EP3036299B1 (en) | 2021-04-21 |
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| DK3036299T3 (da) | 2021-06-28 |
| EP3653683A1 (en) | 2020-05-20 |
| TW201510201A (zh) | 2015-03-16 |
| US20150052822A1 (en) | 2015-02-26 |
| EP3036299A1 (en) | 2016-06-29 |
| KR102262967B1 (ko) | 2021-06-08 |
| BR112016003781B1 (pt) | 2022-05-17 |
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