TWI653913B - Resin structure and method of manufacturing same - Google Patents

Resin structure and method of manufacturing same Download PDF

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Publication number
TWI653913B
TWI653913B TW106136095A TW106136095A TWI653913B TW I653913 B TWI653913 B TW I653913B TW 106136095 A TW106136095 A TW 106136095A TW 106136095 A TW106136095 A TW 106136095A TW I653913 B TWI653913 B TW I653913B
Authority
TW
Taiwan
Prior art keywords
molded body
resin molded
resin
electronic component
region
Prior art date
Application number
TW106136095A
Other languages
English (en)
Chinese (zh)
Other versions
TW201828786A (zh
Inventor
川井若浩
Original Assignee
日商歐姆龍股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商歐姆龍股份有限公司 filed Critical 日商歐姆龍股份有限公司
Publication of TW201828786A publication Critical patent/TW201828786A/zh
Application granted granted Critical
Publication of TWI653913B publication Critical patent/TWI653913B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9413—Dispositions of bond pads on encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/10—Configurations of laterally-adjacent chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
TW106136095A 2017-01-26 2017-10-20 Resin structure and method of manufacturing same TWI653913B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017012256A JP6720885B2 (ja) 2017-01-26 2017-01-26 ウェアラブル携帯機器およびその製造方法
JP2017-012256 2017-01-26

Publications (2)

Publication Number Publication Date
TW201828786A TW201828786A (zh) 2018-08-01
TWI653913B true TWI653913B (zh) 2019-03-11

Family

ID=62979233

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106136095A TWI653913B (zh) 2017-01-26 2017-10-20 Resin structure and method of manufacturing same

Country Status (3)

Country Link
JP (1) JP6720885B2 (https=)
TW (1) TWI653913B (https=)
WO (1) WO2018138979A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019093069A1 (ja) * 2017-11-07 2019-05-16 大日本印刷株式会社 伸縮性回路基板および物品
JP7249514B2 (ja) * 2019-02-04 2023-03-31 大日本印刷株式会社 配線基板及び配線基板の製造方法
JP7320186B2 (ja) * 2019-02-12 2023-08-03 大日本印刷株式会社 配線基板及び配線基板の製造方法
JP7216912B2 (ja) * 2019-02-14 2023-02-02 大日本印刷株式会社 配線基板及び配線基板の製造方法
JP7486042B2 (ja) * 2019-02-14 2024-05-17 大日本印刷株式会社 配線基板及び配線基板の製造方法
JP7216911B2 (ja) * 2019-02-14 2023-02-02 大日本印刷株式会社 配線基板及び配線基板の製造方法
JP7312367B2 (ja) * 2019-03-11 2023-07-21 大日本印刷株式会社 配線基板及び配線基板の製造方法
JP7389958B2 (ja) * 2019-03-20 2023-12-01 大日本印刷株式会社 配線基板及び配線基板の製造方法
JP7236052B2 (ja) * 2019-03-29 2023-03-09 大日本印刷株式会社 配線基板及び配線基板の製造方法
JP2021061370A (ja) * 2019-10-09 2021-04-15 大日本印刷株式会社 伸縮性デバイス

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3138987C2 (de) * 1981-09-30 1984-03-29 Siemens AG, 1000 Berlin und 8000 München Einrichtung zum Verhindern von Beschädigungen von Bausteinen bzw. Leiterbahnen auf einer Leiterplatte
JPS61188957A (ja) * 1985-02-18 1986-08-22 Toshiba Corp 回路モジユ−ルの製造方法
KR20140100299A (ko) * 2013-02-06 2014-08-14 한국전자통신연구원 전자회로 및 그 제조방법
US20140299362A1 (en) * 2013-04-04 2014-10-09 Electronics And Telecommunications Research Institute Stretchable electric device and manufacturing method thereof
US9380697B2 (en) * 2014-01-28 2016-06-28 Panasonic Intellectual Property Management Co., Ltd. Electronic device and manufacturing method for same

Also Published As

Publication number Publication date
JP6720885B2 (ja) 2020-07-08
TW201828786A (zh) 2018-08-01
JP2018120989A (ja) 2018-08-02
WO2018138979A1 (ja) 2018-08-02

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