JP6720885B2 - ウェアラブル携帯機器およびその製造方法 - Google Patents

ウェアラブル携帯機器およびその製造方法 Download PDF

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Publication number
JP6720885B2
JP6720885B2 JP2017012256A JP2017012256A JP6720885B2 JP 6720885 B2 JP6720885 B2 JP 6720885B2 JP 2017012256 A JP2017012256 A JP 2017012256A JP 2017012256 A JP2017012256 A JP 2017012256A JP 6720885 B2 JP6720885 B2 JP 6720885B2
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JP
Japan
Prior art keywords
molded body
resin molded
region
electronic component
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2017012256A
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English (en)
Japanese (ja)
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JP2018120989A (ja
JP2018120989A5 (https=
Inventor
若浩 川井
若浩 川井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Corp filed Critical Omron Corp
Priority to JP2017012256A priority Critical patent/JP6720885B2/ja
Priority to PCT/JP2017/037326 priority patent/WO2018138979A1/ja
Priority to TW106136095A priority patent/TWI653913B/zh
Publication of JP2018120989A publication Critical patent/JP2018120989A/ja
Publication of JP2018120989A5 publication Critical patent/JP2018120989A5/ja
Application granted granted Critical
Publication of JP6720885B2 publication Critical patent/JP6720885B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9413—Dispositions of bond pads on encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/10—Configurations of laterally-adjacent chips

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP2017012256A 2017-01-26 2017-01-26 ウェアラブル携帯機器およびその製造方法 Expired - Fee Related JP6720885B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2017012256A JP6720885B2 (ja) 2017-01-26 2017-01-26 ウェアラブル携帯機器およびその製造方法
PCT/JP2017/037326 WO2018138979A1 (ja) 2017-01-26 2017-10-16 樹脂構造体およびその製造方法
TW106136095A TWI653913B (zh) 2017-01-26 2017-10-20 Resin structure and method of manufacturing same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017012256A JP6720885B2 (ja) 2017-01-26 2017-01-26 ウェアラブル携帯機器およびその製造方法

Publications (3)

Publication Number Publication Date
JP2018120989A JP2018120989A (ja) 2018-08-02
JP2018120989A5 JP2018120989A5 (https=) 2019-04-18
JP6720885B2 true JP6720885B2 (ja) 2020-07-08

Family

ID=62979233

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017012256A Expired - Fee Related JP6720885B2 (ja) 2017-01-26 2017-01-26 ウェアラブル携帯機器およびその製造方法

Country Status (3)

Country Link
JP (1) JP6720885B2 (https=)
TW (1) TWI653913B (https=)
WO (1) WO2018138979A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019093069A1 (ja) * 2017-11-07 2019-05-16 大日本印刷株式会社 伸縮性回路基板および物品
JP7249514B2 (ja) * 2019-02-04 2023-03-31 大日本印刷株式会社 配線基板及び配線基板の製造方法
JP7320186B2 (ja) * 2019-02-12 2023-08-03 大日本印刷株式会社 配線基板及び配線基板の製造方法
JP7216912B2 (ja) * 2019-02-14 2023-02-02 大日本印刷株式会社 配線基板及び配線基板の製造方法
JP7486042B2 (ja) * 2019-02-14 2024-05-17 大日本印刷株式会社 配線基板及び配線基板の製造方法
JP7216911B2 (ja) * 2019-02-14 2023-02-02 大日本印刷株式会社 配線基板及び配線基板の製造方法
JP7312367B2 (ja) * 2019-03-11 2023-07-21 大日本印刷株式会社 配線基板及び配線基板の製造方法
JP7389958B2 (ja) * 2019-03-20 2023-12-01 大日本印刷株式会社 配線基板及び配線基板の製造方法
JP7236052B2 (ja) * 2019-03-29 2023-03-09 大日本印刷株式会社 配線基板及び配線基板の製造方法
JP2021061370A (ja) * 2019-10-09 2021-04-15 大日本印刷株式会社 伸縮性デバイス

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3138987C2 (de) * 1981-09-30 1984-03-29 Siemens AG, 1000 Berlin und 8000 München Einrichtung zum Verhindern von Beschädigungen von Bausteinen bzw. Leiterbahnen auf einer Leiterplatte
JPS61188957A (ja) * 1985-02-18 1986-08-22 Toshiba Corp 回路モジユ−ルの製造方法
KR20140100299A (ko) * 2013-02-06 2014-08-14 한국전자통신연구원 전자회로 및 그 제조방법
US20140299362A1 (en) * 2013-04-04 2014-10-09 Electronics And Telecommunications Research Institute Stretchable electric device and manufacturing method thereof
US9380697B2 (en) * 2014-01-28 2016-06-28 Panasonic Intellectual Property Management Co., Ltd. Electronic device and manufacturing method for same

Also Published As

Publication number Publication date
TWI653913B (zh) 2019-03-11
TW201828786A (zh) 2018-08-01
JP2018120989A (ja) 2018-08-02
WO2018138979A1 (ja) 2018-08-02

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