WO2018138979A1 - 樹脂構造体およびその製造方法 - Google Patents

樹脂構造体およびその製造方法 Download PDF

Info

Publication number
WO2018138979A1
WO2018138979A1 PCT/JP2017/037326 JP2017037326W WO2018138979A1 WO 2018138979 A1 WO2018138979 A1 WO 2018138979A1 JP 2017037326 W JP2017037326 W JP 2017037326W WO 2018138979 A1 WO2018138979 A1 WO 2018138979A1
Authority
WO
WIPO (PCT)
Prior art keywords
molded body
resin molded
region
resin
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2017/037326
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
若浩 川井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Corp
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Corp, Omron Tateisi Electronics Co filed Critical Omron Corp
Publication of WO2018138979A1 publication Critical patent/WO2018138979A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9413—Dispositions of bond pads on encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/10—Configurations of laterally-adjacent chips

Definitions

  • the present technology relates to an extensible resin structure provided with a wiring circuit and a manufacturing method thereof.
  • flexible wiring circuit boards that can be bent are frequently used due to the increasing demand for miniaturization in portable devices and the like.
  • a wearable device such as a medical device to be attached to the body surface requires a printed circuit board that expands following the movement of the body.
  • a flexible substrate that can be bent is usually formed by laminating a 18 ⁇ m or 35 ⁇ m thick copper foil serving as a wiring circuit on a substrate surface made of polyimide (PI) having a thickness of 25 ⁇ m.
  • PI polyimide
  • the elongation of the copper foil laminated on the surface is small, and for the purpose of sticking to the body surface, etc., if the base material is made of PE (polyethylene) with high expansion / contraction performance, elastomer resin, rubber, etc., the movement of the body There is a possibility that the wiring circuit of the copper foil breaks due to the expansion and contraction of the substrate that has been followed.
  • PE polyethylene
  • Patent Document 1 discloses a flexible substrate bent into a corrugated shape.
  • Patent Document 2 discloses a technique for forming a copper foil wiring circuit in a bellows-fold shape.
  • Japanese Patent Application Laid-Open No. 2004-345322 Patent Document 3
  • Japanese Patent Application Laid-Open No. 2006-270118 Patent Document 4
  • Patent Document 5 discloses an ink composition excellent in followability even with respect to a flexible printing substrate. By forming a wiring circuit using such an ink composition having excellent followability, the wiring circuit is less likely to break even if the substrate is elongated.
  • the flexible substrate is bent into a corrugated shape, so that the flexible substrate is increased in size.
  • the area on the base material surface required for the bellows-folded wiring circuit is increased, leading to an increase in the size of the substrate. That is, with these technologies, it is difficult to reduce the size of the flexible substrate.
  • the substrate can be reduced in size, but the followability to the base material is improved. For this reason, the amount of the additive in the ink composition increases, and the electrical resistance of the wiring circuit increases.
  • the present invention has been made paying attention to the above-described problems, and an object thereof is to provide a resin structure that can be reduced in size and can suppress an increase in electrical resistance of a wiring circuit, and a method for manufacturing the same. It is said.
  • the resin structure includes a resin molded body that can be extended and deformed, and a wiring circuit.
  • the surface of the resin molded body includes an uneven region having an uneven shape.
  • the wiring circuit is formed on the uneven area.
  • the resin molding is a plate having a rectangular shape in plan view.
  • the concavo-convex region has a wave shape in which the ridge portions and the groove portions are alternately continuous.
  • the protrusion and the groove extend along the short direction of the resin molded body.
  • the resin molding is a plate having a rectangular shape in plan view.
  • a plurality of concave or convex portions having a long axis parallel to the longitudinal direction of the resin molded body and having an elliptical shape in plan view are formed.
  • the difference in height between the uppermost point and the lowermost point in the concavo-convex region is 50 ⁇ m or more and 200 ⁇ m or less.
  • the elongation at break of the resin molded body is 1% or more.
  • the resin structure further includes an electronic component.
  • the resin molded body is embedded and fixed so that the electrodes of the electronic component are exposed.
  • the wiring circuit is connected to the electrode.
  • the surface of the resin molded body is positioned around the exposed surface from the resin molded body in the electronic component, and further includes a continuous region continuous to the exposed surface.
  • the uneven area is located around the continuous area and continues to the continuous area.
  • the above-described method for manufacturing a resin structure includes filling a resin material into an inner space of a molding die in which at least a part of the inner surface is processed into a concavo-convex shape, thereby at least a part of the region.
  • the method includes a step of forming a resin molded body having an opposing portion as an uneven region, and a step of forming a wiring circuit on the uneven region of the resin molded body.
  • the method for producing a resin structure described above is such that at least a part of one surface of the sheet is processed into a concavo-convex shape on the one surface, and the electrode faces the one surface.
  • the step of attaching the electronic component and the sheet is placed in the mold, and the resin is filled in the mold so that the electronic component is embedded and the portion facing the at least a part of the region is formed.
  • At least a part of the region of the sheet is embossed into an uneven shape.
  • at least a part of the region of the sheet is processed into a concavo-convex shape by applying an adhesive with different application amounts depending on the position.
  • the electronic component is attached to the sheet using an adhesive.
  • FIG. 3 is a plan view showing a schematic configuration of a resin structure according to Embodiment 1.
  • FIG. FIG. 2 is a cross-sectional view taken along line XX in FIG. It is a figure explaining the manufacturing method of the resin structure which concerns on Embodiment 1.
  • FIG. It is a top view which shows the modification of the lower mold
  • FIG. 5B is a cross-sectional view taken along line XX in FIG. 5A.
  • FIG. 5B is a cross-sectional view taken along the line XI-XI in FIG. 5A.
  • FIG. 6 is a plan view showing a schematic configuration of a resin structure according to Embodiment 2.
  • FIG. 7 is a cross-sectional view taken along line XX in FIG. 6. It is a figure explaining the manufacturing method of the resin structure which concerns on Embodiment 3.
  • FIG. 7 is a plan view showing a schematic configuration of a resin structure according to Embodiment 2.
  • FIG. 7 is a cross-sectional view taken along line XX in FIG. 6. It is a figure explaining the manufacturing method of the resin structure which concerns on Embodiment 3.
  • FIG. 1 is a plan view showing a schematic configuration of a resin structure 100 according to Embodiment 1.
  • FIG. 2 is a cross-sectional view taken along the line XX of FIG.
  • the resin structure 100 is a device that is incorporated in an electronic device such as a wearable portable device and has a main or auxiliary function of the electronic device.
  • Wearable portable devices include, for example, measuring devices that are worn on clothes and measure body surface temperature, and measuring devices that are wrapped around an arm and measure pulse, blood pressure, and the like.
  • the resin structure 100 includes an electronic component 110, a resin molded body 120, and a wiring circuit 130.
  • the electronic component 110 is a passive component such as a chip capacitor or a chip resistor, a semiconductor component such as an IC (Integrated Circuit), an LSI (Large-Scale Integration), or a power transistor, or an electronic component such as a sensor. Although four electronic components 110 are shown in FIG. 1, the number of electronic components 110 is not particularly limited.
  • the resin molded body 120 is made of a stretchable and deformable resin material (for example, an elastomer that is an elastic rubber-like polymer material such as a polyester elastomer, a styrene elastomer, and an olefin elastomer).
  • the elongation percentage at break of the resin molded body 120 is 1% or more, preferably 10% or more.
  • the elongation at break indicates the elongation of the test piece at break relative to the test piece before the test when a tensile test is performed according to JIS K 7162. Since the resin molded body 120 can be extended and deformed, the resin molded body 120 can be extended in accordance with the movement of the human body when the resin structure 100 is incorporated into a wearable portable device.
  • the upper surface 121 includes an uneven region 122 that is an uneven shape.
  • the uneven region 122 is a region in which concave and convex shapes are alternately continued. Specifically, in the cross section of the resin molded body 120 when cut by a plane parallel to the longitudinal direction of the upper surface 121 and parallel to the normal direction of the upper surface 121, the uneven region 122 has a waveform.
  • the uneven region 122 includes a protrusion 123 and a groove 124 extending along the short side direction (short side direction) of the upper surface 121.
  • the protrusions 123 and the grooves 124 are formed alternately and continuously along the longitudinal direction (long side direction) of the upper surface 121.
  • the resin molded body 120 fixes the electronic component 110 by embedding the electronic component 110 therein.
  • the resin molded body 120 has the electronic component 110 embedded so that the electronic component 110 is exposed from the uneven region 122.
  • the resin molded body 120 embeds the electronic component 110 so that the electrode 111 of the electronic component 110 is exposed from the resin molded body 120. That is, the electrode 111 is formed on the exposed surface 112 from the resin molded body 120 in the electronic component 110.
  • the uneven area 122 on the upper surface 121 is continuous with the exposed surface 112 of the electronic component 110.
  • continuous indicates a state where there is no step between the two surfaces.
  • the wiring circuit 130 is formed on the uneven region 122 on the upper surface 121 of the resin molded body 120 and is connected to the electrode 111 of the electronic component 110. Thereby, the electrode 111 of one electronic component 110 and the electrode 111 of another electronic component 110 are connected.
  • the wiring circuit 130 includes a conductive substance (for example, silver (Ag)) and an additive for imparting extensibility.
  • the wiring circuit 130 can be extended and deformed by containing an additive. However, since the electrical resistance of the wiring circuit 130 increases as the amount of the additive increases, the amount of the additive is minimized.
  • the wiring circuit 130 is easily formed by ejecting conductive ink containing silver (Ag) fine particles and an additive using, for example, an ink jet printing method.
  • the ink jet printing method is a printing method in which conductive ink is ejected from nozzles and particulate ink is deposited on the ejection target surface.
  • the wiring circuit 130 may be formed by a method using aerosol or a method using a dispenser.
  • the uneven region 122 has a waveform.
  • the wiring circuit 130 also has the same shape as that of the uneven region 122.
  • the cross section of the wiring circuit 130 when it is cut along a plane parallel to the longitudinal direction (long side direction) of the upper surface 121 and parallel to the normal direction of the uneven region 122 is a waveform.
  • FIG. 3 is a diagram illustrating a method for manufacturing the resin structure 100.
  • FIGS. 3A to 3D are views for explaining first to fourth steps for manufacturing the resin structure 100, respectively.
  • the upper side shows a plan view and the lower side shows a side view.
  • FIG. 3B shows a cross-sectional view.
  • FIG. 3C shows a plan view.
  • the upper side shows a plan view, and the lower side shows a cross-sectional view taken along line XX in the plan view.
  • the electronic component 110 is temporarily fixed by being attached to a temporarily fixed sheet 200 having a rectangular shape in plan view with an adhesive (not shown). At this time, the electronic component 110 is affixed to the temporarily fixed sheet 200 so that the surface on which the electrode 111 is formed is in contact with the temporarily fixed sheet 200.
  • the temporary fixing sheet 200 for example, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyphenylene sulfide (PPS), or the like can be used.
  • PET polyethylene terephthalate
  • PEN polyethylene naphthalate
  • PPS polyphenylene sulfide
  • the temporary fixing sheet 200 is preferably made of a material that transmits ultraviolet rays and has flexibility for reasons described later.
  • Temporary fixing can be performed using, for example, an ultraviolet curable adhesive (not shown) applied to one surface of the temporary fixing sheet 200.
  • an ultraviolet curable adhesive is applied to a temporary fixing sheet 200 made of PET having a thickness of 50 ⁇ m to a thickness of 2 to 3 ⁇ m. This application may be performed using a method such as an ink jet printing method.
  • the electronic component 110 is placed at a predetermined position.
  • the adhesive is cured by irradiating UV light having an intensity of, for example, 3000 mJ / cm 2 from the surface of the temporarily fixed sheet 200 where the electronic component 110 is not disposed, and the electronic component 110 is temporarily attached to the temporarily fixed sheet 200. Fix it.
  • the temporarily fixing sheet 200 on which the electronic component 110 is temporarily fixed is installed inside the mold 300.
  • the mold 300 is composed of a lower mold 31 and an upper mold 32. By bringing the lower mold 31 and the upper mold 32 into close contact with each other, a sealed internal space is formed.
  • the rectangular region 310 on the inner surface of the molding die 300 (here, the surface of the lower die 31) is processed into an uneven shape throughout.
  • the rectangular region 310 has a wave shape in which the ridge portions 311 and the groove portions 312 are alternately continuous.
  • the temporarily fixed sheet 200 is installed on the rectangular region 310 in the mold 300 such that the short side of the temporarily fixed sheet 200 having a rectangular shape in plan view and the extending direction of the protrusion 311 (or the groove 312) are parallel to each other. .
  • the temporarily fixing sheet 200 is installed in the mold 300 such that the surface on which the electronic component 110 is not temporarily fixed is in contact with the inner surface of the mold 300.
  • ⁇ A resin material is injected into the internal space of the mold 300 to perform resin injection molding.
  • the conditions for performing the injection molding may be appropriately selected according to the resin. For example, when a polyester elastomer is used, the injection resin temperature is 240 ° C. and the injection pressure is 100 MPa.
  • the temporary fixing sheet 200 When the resin material is filled in the inner space of the mold 300, the temporary fixing sheet 200 is pushed to the inner surface side of the mold 300 by the pressure from the resin material, and changes into a shape along the inner surface of the mold 300. As described above, the temporarily fixing sheet 200 is placed on the rectangular region 310 having an uneven shape. The surface of the temporarily fixed sheet 200 on which the electronic component 110 is affixed becomes a plane along the surface of the electronic component 110 at the portion where the electronic component 110 is affixed, and as the distance from the end of the electronic component 110 increases. It gradually changes to a shape that matches the uneven shape of the rectangular region 310 of the mold 300.
  • the resin material filled in the internal space of the molding die 300 is molded in a state of surrounding the electronic component 110 in the second step. Therefore, the resin molded body 120 embeds the electronic component 110 therein.
  • the surface of the electronic component 110 that is in contact with the temporarily fixed sheet 200 is exposed from the resin molded body 120.
  • the electronic component 110 is temporarily fixed to the temporary fixing sheet 200 so that the electrode 111 is in contact with the temporary fixing sheet 200, so that the electrode 111 of the electronic component 110 is exposed from the resin molded body 120.
  • the portion of the temporary fixing sheet 200 where the electronic component 110 is not attached is deformed into the same uneven shape as the rectangular region 310 of the mold 300. Therefore, an uneven shape is formed on the surface of the resin molded body 120 that is in contact with the temporarily fixed sheet 200. That is, the uneven shape of the rectangular region 310 of the mold 300 is transferred to the surface of the resin molded body 120 via the temporarily fixed sheet 200. Thereby, as shown in FIG. 3C, an uneven region 122 is formed on the upper surface 121 of the resin molded body 120.
  • the wiring circuit 130 having a predetermined pattern is connected to the electrode 111 of the electronic component 110 on the uneven region 122 of the upper surface 121 of the resin molded body 120. It is formed.
  • the wiring circuit 130 is formed using a conductive material (for example, silver ink) containing an additive for imparting extensibility.
  • the formation method of the wiring circuit 130 is an ink jet printing method, a method using aerosol, a method using a dispenser, or the like. As a result, the wiring circuit 130 can be easily formed, and the degree of freedom in circuit design is increased.
  • the surface of the temporarily fixing sheet 200 on which the electronic component 110 is temporarily fixed becomes a plane along the surface of the electronic component 110 in a portion where the electronic component 110 exists, and gradually increases as the distance from the end of the electronic component 110 increases. Then, the shape changes to the shape corresponding to the uneven shape of the rectangular region 310 of the mold 300. Therefore, the uneven area 122 on the upper surface 121 of the resin molded body 120 is continuous with the exposed surface 112 of the electronic component 110. Thereby, the wiring circuit 130 is formed without disconnection even at the boundary portion between the uneven region 122 and the electronic component 110.
  • the electronic component 110 is easily electrically connected to the wiring circuit 130 without soldering or the like. Since the wiring circuit 130 is connected to the electronic component 110 after the position of the electronic component 110 is determined, the electronic component 110 and the wiring circuit 130 can be more accurately and easily connected than when the electronic component is aligned with a printed circuit board, for example. Can be electrically connected.
  • the resin structure 100 includes the resin molded body 120 that can be extended and deformed and the wiring circuit 130.
  • the surface of the resin molded body 120 includes an uneven region 122 having an uneven shape.
  • the wiring circuit 130 is formed on the uneven region 122.
  • the resin molded body 120 has a rectangular plate shape in plan view.
  • the concavo-convex region 122 has a wave shape in which the ridges 123 and the grooves 124 are alternately continuous.
  • the protrusion 123 and the groove 124 extend along the short direction of the resin molded body 120.
  • the resin molded body 120 When the resin molded body 120 has a rectangular plate shape in plan view, the resin molded body 120 extends the longest when a tensile force is applied along the longitudinal direction (the direction of arrow A in FIG. 2).
  • the uneven region 122 When the resin molded body 120 is elongated and deformed in the longitudinal direction, the uneven region 122 is deformed so that a difference in height between the upper end of the ridge 123 and the lower end of the groove 124 becomes small. That is, as shown by the arrow B shown in the enlarged view of FIG. 2, the uneven region 122 is deformed so that the upper end of the ridge 123 becomes lower and the lower end of the groove 124 becomes higher.
  • the wiring circuit 130 Since the wiring circuit 130 is deformed in accordance with the shape of the uneven region 122, the wiring circuit 130 is similarly deformed so that the height difference of the waveform is reduced. Therefore, the wiring circuit 130 can follow the expansion deformation of the resin molded body 120 in the arrow A direction with only a small deformation amount compared to the expansion amount of the resin molded body 120 in the arrow A direction. Thereby, the breakage of the wiring circuit 130 can be prevented. Furthermore, the amount of the additive for imparting extensibility in the wiring circuit 130 can be reduced, and an increase in electrical resistance of the wiring circuit 130 can be suppressed.
  • the wiring circuit 130 is formed on the uneven region 122 and has a shape along the uneven shape of the uneven region 122.
  • the uneven region 122 in the resin molded body 120 has a wave shape in which the height in the thickness direction of the resin molded body 120 is changed. Therefore, the space required for the wiring circuit 130 is smaller than that of a bellows-folded wiring circuit along a direction parallel to the substrate surface as described in JP2013-187380A. Thereby, the resin structure 100 can be reduced in size.
  • the resin structure 100 further includes an electronic component 110.
  • the resin molded body 120 embeds and fixes the electronic component 110 so that the electrode 111 of the electronic component 110 is exposed.
  • the wiring circuit 130 is connected to the electrode 111. Thereby, an electronic circuit can be comprised by the wiring circuit 130 and the electronic component 110.
  • the concavo-convex shape in the concavo-convex region 122 is a size that can absorb the extension deformation of the resin molded body 120.
  • the concavo-convex shape having a size capable of absorbing the extension deformation of the resin molded body 120 means the following. That is, the surface from the upper end of the protruding portion 123 to the upper end of the adjacent protruding portion 123 in a cross section when the resin molded body 120 is cut in a plane parallel to the longitudinal direction and parallel to the normal direction of the upper surface 121. Is a value obtained by dividing the distance along the pitch by the pitch of the ridge 123 (the linear distance between the upper end of one ridge 123 and the upper end of the adjacent ridge 123). Greater than the maximum value.
  • the assumed elongation rate is set according to the application to which the resin structure 100 is applied.
  • the height difference ⁇ H between the upper end of the ridge 123 (the highest point of the uneven region 122) and the lower end of the groove 124 (the lowest point of the uneven region) is preferably 50 ⁇ m or more and 200 ⁇ m or less.
  • the wiring circuit 130 follows the expansion deformation of the resin molded body 120 in the arrow A direction with only a smaller deformation amount than the expansion amount of the resin molded body 120 in the arrow A direction. can do.
  • the height difference ⁇ H is 200 ⁇ m or less, the uneven region 122 can be easily formed on the surface of the resin molded body 120.
  • the resin structure 100 fills the internal space of the mold 300 in which the rectangular region 310 on the inner surface is processed into a concavo-convex shape with a resin material so that a portion facing the rectangular region 310 via the temporarily fixed sheet 200 is formed in the concavo-convex region.
  • the second step of molding the resin molded body 120 to be 122 and the fourth step of forming the wiring circuit 130 on the uneven region 122 of the resin molded body 120 are provided.
  • the uneven area 122 of the resin molded body 120 is formed when the resin molded body 120 is molded. That is, it is not necessary to separately form the uneven region 122 after the resin molded body 120 is formed, or a separate member for forming the uneven region 122. Thereby, the manufacturing cost of the resin structure 100 can be suppressed low.
  • FIG. 4 is a plan view showing a modification of the rectangular region 310 of the lower mold 31 constituting the mold 300.
  • the rectangular area 310 includes, for example, a first area 316 that overlaps the electronic component 110, a second area 317 having a predetermined width around the first area 316, and the remaining third area 318. Composed.
  • the first region 316 is flat, and the third region 318 has a wave shape in which the protrusions 311 and the groove portions 312 are alternately continuous.
  • the second region 317 is a surface that smoothly connects the flat first region 316 and the wave-shaped third region 318.
  • FIG. 5A is a plan view showing a schematic configuration of a resin molded body 120 molded using the molding die 300 shown in FIG.
  • FIG. 5B is a cross-sectional view taken along line XX in FIG. 5A.
  • FIG. 5C is a cross-sectional view taken along the line XI-XI in FIG. 5A.
  • the XI-XI line overlaps with the protrusion 123.
  • the region facing the second region 317 of the mold 300 in the resin molded body 120 is located around the exposed surface 112 of the electronic component 110 and is continuous with the exposed surface 112. Region 125 is formed.
  • a region of the resin molded body 120 that faces the third region 318 of the mold 300 is an uneven region 122 that is continuous with the continuous region 125.
  • the exposed surface 112 of the electronic component 110 and the uneven area 122 of the resin molded body 120 are formed by the continuous region 125. Smoothly continuous. Therefore, disconnection of the wiring circuit 130 at the boundary between the electronic component 110 and the resin molded body 120 can be more reliably prevented.
  • the wiring circuit 130 is formed in the corrugated uneven region 122 on the upper surface 121 of the resin molded body 120. As a result, when the resin molded body 120 is stretched and deformed, the wiring circuit 130 can follow the stretch deformation of the resin molded body 120 with a deformation amount smaller than the stretch amount of the resin molded body 120.
  • the breakage of the wiring circuit 130 can be suppressed.
  • a resin molded body having a flat surface is stretched, the flat surface does not always stretch uniformly.
  • a partially weak part is a part where chipping has occurred due to, for example, a collision with another part, and is thinner than the other part.
  • the amount of deformation in the part is significantly larger than in other parts, and the wiring circuit formed on the part may be broken. For this reason, it is conceivable to increase the amount of the additive that imparts extensibility in the wiring circuit 130 so that the fracture does not occur even when the deformation concentrates in one weak location. In this case, the electrical resistance of the wiring circuit 130 is increased.
  • the resin structure according to Embodiment 2 has a configuration using this point.
  • FIG. 6 is a plan view showing a schematic configuration of a resin structure 400 according to the second embodiment.
  • FIG. 7 is a cross-sectional view taken along the line XX in FIG.
  • the resin structure 400 is different from the resin structure 100 of the first embodiment in that a resin molded body 420 is provided instead of the resin molded body 120.
  • the resin molded body 420 is plate-shaped and has an upper surface 421 that is rectangular in plan view.
  • the upper surface 421 of the resin molded body 420 includes an uneven region 422 having an uneven shape.
  • the concavo-convex region 422 includes a plurality of planar-view elliptical (that is, elliptical when viewed from the normal direction of the upper surface 421) recesses 423 formed in a matrix and a plane portion 424 between the plurality of recesses 423. Composed.
  • the planar portion 424 between the plurality of recesses 423 is convex when viewed from the recesses 423. Therefore, the uneven region 422 is a region in which concave and convex shapes are alternately continued.
  • the oval concave portion 423 is formed on the upper surface 421 so that the long axis is parallel to the longitudinal direction (long side direction) of the upper surface 421.
  • the depth of the recessed part 423 is 50 micrometers or more and 200 micrometers or less.
  • the electronic component 110 and the wiring circuit 130 have the same configuration as in the first embodiment.
  • the electronic component 110 is embedded in the resin molded body 420 and exposed from the uneven area 422 of the resin molded body 420.
  • An electrode 111 is formed on the exposed surface 112 of the electronic component 110 from the resin molded body 420.
  • the wiring circuit 130 is formed on the uneven region 422 on the upper surface 421 of the resin molded body 420 so as to be connected to the electrode 111 of the electronic component 110.
  • Resin structure 400 is manufactured by the same method as the manufacturing method described in the first embodiment. However, instead of the mold 300 in which a part of the rectangular area 310 on the inner surface is processed into a wave shape, a mold in which elliptical convex portions are formed in a matrix on a part of the rectangular area on the inner surface is used. . As a result, the resin molded body 420 having the uneven surface 422 formed with a plurality of oval concave portions 423 on the upper surface 421, the electronic component 110 embedded in the resin molded body 420, and the uneven region 422 of the resin molded body 420 are formed. A resin structure 400 including the formed wiring circuit 130 can be manufactured.
  • the concave portion 423 is easier to deform than the flat portion 424 because the thickness of the resin molded body 120 is thin.
  • the amount of deformation in each of the plurality of recesses 423 can be made smaller than the amount of deformation at the location where the deformation of the surface of the resin molded body 420 is concentrated at one location. Thereby, the breakage of the wiring circuit 130 can be suppressed, and the amount of the additive for imparting extensibility to the wiring circuit 130 can be reduced, and the increase in the electrical resistance of the wiring circuit 130 can be suppressed.
  • the major axis of the concave portion 423 having an elliptical shape in plan view is parallel to the longitudinal direction of the resin molded body 420. Therefore, the recess 423 is more easily deformed along the longitudinal direction of the resin molded body 420.
  • the amount of elongation deformation of the resin molded body 420 is greatest when a tensile force along the longitudinal direction is applied. Even when a tensile force is applied in the longitudinal direction of the resin molded body 420, each of the plurality of recesses 423 is more easily deformed, so that the deformation of the surface of the resin molded body 420 can be dispersed without being concentrated in one place. it can.
  • the concave portion 423 is easier to deform than the flat portion 424. Therefore, the wiring circuit 130 is preferably formed on the flat portion 424 while avoiding the recess 423. Thereby, the deformation amount of the wiring circuit 130 can be further reduced. As a result, the amount of the additive for imparting extensibility to the wiring circuit 130 can be further reduced, and an increase in electrical resistance of the wiring circuit 130 can be suppressed.
  • the uneven region 422 is composed of a plurality of oval concave portions 423 in plan view and a plane portion 424 between the plurality of concave portions 423, but a matrix is used instead of the plurality of concave portions 423.
  • You may be comprised by the some convex part formed in the shape.
  • the flat portion 424 is easily deformed because the resin molded body 120 is thinner than the convex portion.
  • the flat portion 424 that is easier to deform than the convex portion between the convex portions, when the resin molded body 420 is stretched and deformed, the deformation of the surface of the resin molded body 420 is not concentrated in one place, Distributed. Thereby, the breakage of the wiring circuit 130 can be suppressed, and the amount of the additive for improving the extensibility of the wiring circuit 130 can be reduced, thereby suppressing the increase in the electrical resistance of the wiring circuit 130. .
  • the uneven shape is transferred to the surface of the resin molded body 120 via the temporary fixing sheet 200 using a molding die 300 in which a part of the rectangular region 310 on the inner surface is processed into an uneven shape.
  • the uneven region 122 was formed on the upper surface 121 of the resin molded body 120.
  • region 122 is formed in the upper surface 121 of a resin molding by forming uneven
  • the manufacturing method according to the third embodiment can also be applied to a method for manufacturing the resin molded body 420 shown in the second embodiment.
  • FIG. 8 is a diagram illustrating a method for manufacturing the resin structure 100 according to the third embodiment.
  • FIGS. 8A and 8B show a first step and a second step for manufacturing the resin structure 100, respectively.
  • the upper side shows a plan view and the lower side shows a side view.
  • FIG. 8B shows a cross-sectional view.
  • the electronic component 110 is attached and temporarily fixed to the temporarily fixed sheet 500 having a rectangular shape in plan view with an adhesive (not shown).
  • the electronic component 110 is affixed to the temporarily fixed sheet 500 so that the surface on which the electrode 111 is formed is in contact with the temporarily fixed sheet 500.
  • the temporary fixing sheet 500 for example, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyphenylene sulfide (PPS), or the like can be used.
  • PET polyethylene terephthalate
  • PEN polyethylene naphthalate
  • PPS polyphenylene sulfide
  • the surface on the side where the electronic component 110 is pasted in the temporarily fixed sheet 500 includes a region 510 processed into a concavo-convex shape.
  • the region 510 of the temporarily fixed sheet 500 is processed into an uneven shape by, for example, embossing.
  • embossing either a method of lifting the back surface to float and a method of forming a convex portion by attaching ink or the like to the surface may be used.
  • a temporary fixing sheet 500 having a thickness that prevents the convex portions from being crushed during the injection molding of a resin material described later is used.
  • the uneven shape formed by embossing is the same as the wave shape formed in the mold 300 of the first embodiment.
  • an ultraviolet curable adhesive (not shown) is applied to the temporary fixing sheet 500.
  • an ultraviolet curable adhesive is applied to a thickness of 5 ⁇ m on a temporary fixing sheet 500 made of PET having a thickness of 100 ⁇ m having an embossed region 510. This application may be performed using a method such as an ink jet printing method.
  • the electronic component 110 is installed at a set position.
  • the adhesive is cured by irradiating UV light having an intensity of, for example, 3000 mJ / cm 2 from the surface of the temporarily fixed sheet 500 on which the electronic component 110 is not temporarily fixed, so that the electronic component 110 is attached to the temporarily fixed sheet 500.
  • the temporary fixing sheet 500 is installed in the mold 600 such that the surface on which the electronic component 110 is not temporarily fixed is in contact with the inner surface of the mold 600.
  • the mold 600 includes a lower mold 61 and an upper mold 62. By bringing the lower mold 61 and the upper mold 62 into close contact with each other, a sealed internal space is formed. The inner surface of the mold 600 is flat.
  • ⁇ A resin material is injected into the internal space of the mold 600 to perform resin injection molding.
  • the conditions for performing the injection molding may be appropriately selected according to the resin. For example, when a polyester elastomer is used, the injection molding is performed at an injection resin temperature of 240 ° C. and an injection pressure of 100 MPa.
  • the surface of the temporary fixing sheet 500 is processed into a concavo-convex shape as described above. Therefore, an uneven shape is also formed on the surface of the resin molded body 120 that is in contact with the temporarily fixed sheet 500. That is, the uneven shape formed in the region 510 of the temporarily fixed sheet 500 is transferred to the upper surface 121 of the resin molded body 120, and the uneven region 122 is formed on the upper surface 121.
  • the resin structure 100 in which the wiring circuit 130 is formed on the uneven region 122 of the resin molded body 120 is manufactured. be able to.
  • a temporary fixing sheet having flat surfaces may be used without using the temporary fixing sheet 500 having one surface processed into an uneven shape by embossing.
  • an ultraviolet curable adhesive used for adhering the electronic component 110 is applied to one surface of the temporarily fixed sheet at different application amounts depending on the position. Due to the difference in the amount of coating, the surface of the adhesive becomes uneven. Thereby, the temporarily fixed sheet
  • the step of attaching the electronic component 110 to the temporary fixing sheet and the step of processing the surface of the temporarily fixing sheet into a concavo-convex shape are performed simultaneously. You may do it.
  • An adhesive is applied to a portion where the electronic component 110 is attached to one surface of the temporarily fixing sheet with a uniform thickness, and an adhesive is applied to a portion where the electronic component 110 is not attached depending on the position. Apply.
  • an adhesive agent is hardened by irradiating an ultraviolet-ray from the surface on the side which has not apply
  • one surface of the temporary fixing sheet 500 is divided into a first region where the electronic component 110 is pasted, a second region having a predetermined width around the first region, and the remaining third region.
  • the shape of the surface may be different.
  • the first region is flat, and the third region has a wave shape in which protrusions and grooves are alternately continuous.
  • the second region is a surface that smoothly connects the flat first region and the wavy third region.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
PCT/JP2017/037326 2017-01-26 2017-10-16 樹脂構造体およびその製造方法 Ceased WO2018138979A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017012256A JP6720885B2 (ja) 2017-01-26 2017-01-26 ウェアラブル携帯機器およびその製造方法
JP2017-012256 2017-01-26

Publications (1)

Publication Number Publication Date
WO2018138979A1 true WO2018138979A1 (ja) 2018-08-02

Family

ID=62979233

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2017/037326 Ceased WO2018138979A1 (ja) 2017-01-26 2017-10-16 樹脂構造体およびその製造方法

Country Status (3)

Country Link
JP (1) JP6720885B2 (https=)
TW (1) TWI653913B (https=)
WO (1) WO2018138979A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020155605A (ja) * 2019-03-20 2020-09-24 大日本印刷株式会社 配線基板及び配線基板の製造方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019093069A1 (ja) * 2017-11-07 2019-05-16 大日本印刷株式会社 伸縮性回路基板および物品
JP7249514B2 (ja) * 2019-02-04 2023-03-31 大日本印刷株式会社 配線基板及び配線基板の製造方法
JP7320186B2 (ja) * 2019-02-12 2023-08-03 大日本印刷株式会社 配線基板及び配線基板の製造方法
JP7216912B2 (ja) * 2019-02-14 2023-02-02 大日本印刷株式会社 配線基板及び配線基板の製造方法
JP7486042B2 (ja) * 2019-02-14 2024-05-17 大日本印刷株式会社 配線基板及び配線基板の製造方法
JP7216911B2 (ja) * 2019-02-14 2023-02-02 大日本印刷株式会社 配線基板及び配線基板の製造方法
JP7312367B2 (ja) * 2019-03-11 2023-07-21 大日本印刷株式会社 配線基板及び配線基板の製造方法
JP7236052B2 (ja) * 2019-03-29 2023-03-09 大日本印刷株式会社 配線基板及び配線基板の製造方法
JP2021061370A (ja) * 2019-10-09 2021-04-15 大日本印刷株式会社 伸縮性デバイス

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61188957A (ja) * 1985-02-18 1986-08-22 Toshiba Corp 回路モジユ−ルの製造方法
US20140218872A1 (en) * 2013-02-06 2014-08-07 Electronics And Telecommunications Research Institute Electronic circuit and method of fabricating the same
US20140299362A1 (en) * 2013-04-04 2014-10-09 Electronics And Telecommunications Research Institute Stretchable electric device and manufacturing method thereof
JP2015164177A (ja) * 2014-01-28 2015-09-10 パナソニックＩｐマネジメント株式会社 電子デバイスおよびその製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3138987C2 (de) * 1981-09-30 1984-03-29 Siemens AG, 1000 Berlin und 8000 München Einrichtung zum Verhindern von Beschädigungen von Bausteinen bzw. Leiterbahnen auf einer Leiterplatte

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61188957A (ja) * 1985-02-18 1986-08-22 Toshiba Corp 回路モジユ−ルの製造方法
US20140218872A1 (en) * 2013-02-06 2014-08-07 Electronics And Telecommunications Research Institute Electronic circuit and method of fabricating the same
US20140299362A1 (en) * 2013-04-04 2014-10-09 Electronics And Telecommunications Research Institute Stretchable electric device and manufacturing method thereof
JP2015164177A (ja) * 2014-01-28 2015-09-10 パナソニックＩｐマネジメント株式会社 電子デバイスおよびその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020155605A (ja) * 2019-03-20 2020-09-24 大日本印刷株式会社 配線基板及び配線基板の製造方法
JP7389958B2 (ja) 2019-03-20 2023-12-01 大日本印刷株式会社 配線基板及び配線基板の製造方法

Also Published As

Publication number Publication date
TWI653913B (zh) 2019-03-11
JP6720885B2 (ja) 2020-07-08
TW201828786A (zh) 2018-08-01
JP2018120989A (ja) 2018-08-02

Similar Documents

Publication Publication Date Title
JP6720885B2 (ja) ウェアラブル携帯機器およびその製造方法
EP2519083A1 (en) Flexible circuit board and manufacturing method thereof
KR102077258B1 (ko) 입체 회로 구조체
WO2015163082A1 (ja) 電子部品を埋設した樹脂構造体およびその製造方法
JP2006128435A (ja) フレキシブル配線基板とそれを用いた電子機器およびその製造方法
CN109792836B (zh) 电子装置及其制造方法
KR20170029920A (ko) 더미를 이용하여 강성 조절되는 연성 반도체 기판, 및 연성 반도체 패키지
KR102163907B1 (ko) 회로 구조체
JP6406235B2 (ja) 電子装置及びその製造方法
TWI649177B (zh) 樹脂構造體的製造方法以及樹脂構造體
US20250081335A1 (en) Electronic device
JP6658935B2 (ja) 回路構造体
CN110024493B (zh) 电子装置及其制造方法
CN113168790A (zh) 柔性面板及柔性面板制作方法
WO2018163516A1 (ja) 電子装置およびその製造方法
WO2018092408A1 (ja) 電子装置およびその製造方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17893579

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 17893579

Country of ref document: EP

Kind code of ref document: A1