JP2018120989A5 - - Google Patents

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Publication number
JP2018120989A5
JP2018120989A5 JP2017012256A JP2017012256A JP2018120989A5 JP 2018120989 A5 JP2018120989 A5 JP 2018120989A5 JP 2017012256 A JP2017012256 A JP 2017012256A JP 2017012256 A JP2017012256 A JP 2017012256A JP 2018120989 A5 JP2018120989 A5 JP 2018120989A5
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JP
Japan
Prior art keywords
molded body
resin
resin molded
structure according
uneven
Prior art date
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Application number
JP2017012256A
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English (en)
Japanese (ja)
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JP6720885B2 (ja
JP2018120989A (ja
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Priority to JP2017012256A priority Critical patent/JP6720885B2/ja
Priority claimed from JP2017012256A external-priority patent/JP6720885B2/ja
Priority to PCT/JP2017/037326 priority patent/WO2018138979A1/ja
Priority to TW106136095A priority patent/TWI653913B/zh
Publication of JP2018120989A publication Critical patent/JP2018120989A/ja
Publication of JP2018120989A5 publication Critical patent/JP2018120989A5/ja
Application granted granted Critical
Publication of JP6720885B2 publication Critical patent/JP6720885B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2017012256A 2017-01-26 2017-01-26 ウェアラブル携帯機器およびその製造方法 Expired - Fee Related JP6720885B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2017012256A JP6720885B2 (ja) 2017-01-26 2017-01-26 ウェアラブル携帯機器およびその製造方法
PCT/JP2017/037326 WO2018138979A1 (ja) 2017-01-26 2017-10-16 樹脂構造体およびその製造方法
TW106136095A TWI653913B (zh) 2017-01-26 2017-10-20 Resin structure and method of manufacturing same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017012256A JP6720885B2 (ja) 2017-01-26 2017-01-26 ウェアラブル携帯機器およびその製造方法

Publications (3)

Publication Number Publication Date
JP2018120989A JP2018120989A (ja) 2018-08-02
JP2018120989A5 true JP2018120989A5 (https=) 2019-04-18
JP6720885B2 JP6720885B2 (ja) 2020-07-08

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ID=62979233

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JP2017012256A Expired - Fee Related JP6720885B2 (ja) 2017-01-26 2017-01-26 ウェアラブル携帯機器およびその製造方法

Country Status (3)

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JP (1) JP6720885B2 (https=)
TW (1) TWI653913B (https=)
WO (1) WO2018138979A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019093069A1 (ja) * 2017-11-07 2019-05-16 大日本印刷株式会社 伸縮性回路基板および物品
JP7249514B2 (ja) * 2019-02-04 2023-03-31 大日本印刷株式会社 配線基板及び配線基板の製造方法
JP7320186B2 (ja) * 2019-02-12 2023-08-03 大日本印刷株式会社 配線基板及び配線基板の製造方法
JP7216912B2 (ja) * 2019-02-14 2023-02-02 大日本印刷株式会社 配線基板及び配線基板の製造方法
JP7486042B2 (ja) * 2019-02-14 2024-05-17 大日本印刷株式会社 配線基板及び配線基板の製造方法
JP7216911B2 (ja) * 2019-02-14 2023-02-02 大日本印刷株式会社 配線基板及び配線基板の製造方法
JP7312367B2 (ja) * 2019-03-11 2023-07-21 大日本印刷株式会社 配線基板及び配線基板の製造方法
JP7389958B2 (ja) * 2019-03-20 2023-12-01 大日本印刷株式会社 配線基板及び配線基板の製造方法
JP7236052B2 (ja) * 2019-03-29 2023-03-09 大日本印刷株式会社 配線基板及び配線基板の製造方法
JP2021061370A (ja) * 2019-10-09 2021-04-15 大日本印刷株式会社 伸縮性デバイス

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3138987C2 (de) * 1981-09-30 1984-03-29 Siemens AG, 1000 Berlin und 8000 München Einrichtung zum Verhindern von Beschädigungen von Bausteinen bzw. Leiterbahnen auf einer Leiterplatte
JPS61188957A (ja) * 1985-02-18 1986-08-22 Toshiba Corp 回路モジユ−ルの製造方法
KR20140100299A (ko) * 2013-02-06 2014-08-14 한국전자통신연구원 전자회로 및 그 제조방법
US20140299362A1 (en) * 2013-04-04 2014-10-09 Electronics And Telecommunications Research Institute Stretchable electric device and manufacturing method thereof
US9380697B2 (en) * 2014-01-28 2016-06-28 Panasonic Intellectual Property Management Co., Ltd. Electronic device and manufacturing method for same

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