TWI653913B - Resin structure and method of manufacturing same - Google Patents

Abstract

The resin structure (100) includes an electronic component (110), a stretchable resin molded body (120), and a wiring circuit (130). The resin molded body (120) is embedded with the electronic component (110) so that the electrode (111) of the electronic component (110) is exposed. The surface of the resin molded body (120) includes a concavo-convex region (122) having a concavo-convex shape. The wiring circuit (130) is formed on the uneven region (122) so as to be connected to the electrode (111). Thereby, the resin structure (100) can be miniaturized, and the increase in the electric resistance of the wiring circuit (130) can be suppressed.

Description

Resin structure and method of manufacturing same

The present technology relates to an extensible resin structure having a wiring circuit and a method of manufacturing the same.

In recent years, due to the improvement in the miniaturization requirements of mobile devices and the like, a flexible flexible printed circuit board (hereinafter referred to as a flexible substrate) has been used in a large amount. Further, in a wearable device such as a medical device attached to a body surface, a printed circuit board that extends in accordance with the movement of the body is required.

Previously, a flexible flexible substrate was generally constructed by a 25 μm thick substrate surface layer comprising a polyimide (PI) as a 18 μm thick or 35 μm thick copper foil of a wiring circuit. By thinning the PI substrate, a certain degree of free bending can be achieved, and the substrate can be placed in a narrow space of an electronic device, attached to a curved surface, or applied to a joint portion of a machine arm having a reverse bending. In addition, the elongation of the copper foil laminated on the surface is small, and it is possible to follow the body by using a polyethylene (PE), an elastomer resin, or a rubber which has high stretchability in order to adhere to the surface of the body. The shrinkage of the substrate of the action causes the wiring circuit of the copper foil to break.

A flexible substrate that is bent into a wave shape is disclosed in Japanese Laid-Open Patent Publication No. 2011-134884 (Patent Document 1). In addition, Japanese Laid-Open Patent Publication No. 2013-187380 (Patent Document 2) discloses a technique in which a wiring circuit of a copper foil is formed into a bellows shape.

As a technique for forming a wiring circuit without using a copper foil, it is disclosed in Japanese Patent Laid-Open Publication No. 2004-345322 (Patent Document 3) and Japanese Patent Laid-Open No. Hei. No. 2006-270118 (Patent Document 4) A method of forming a wiring circuit by an inkjet printer of a conductive ink of conductive fine particles such as silver. An ink composition excellent in followability to a substrate to be printed having flexibility is disclosed in Japanese Laid-Open Patent Publication No. 2013-142151 (Patent Document 5). By using the ink composition having excellent followability, a wiring circuit is formed, and even if the substrate is elongated, the wiring circuit is less likely to be broken. [Prior Art Document] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. JP-A No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. Japanese Patent Publication No. 2013-142118 (Patent Document 5)

[Technical Problem] In the technique of Japanese Laid-Open Patent Publication No. 2011-134884, the flexible substrate is increased in size in order to bend the flexible substrate into a wave shape. In the technique described in Japanese Laid-Open Patent Publication No. 2013-187380, the area on the surface of the substrate required for the wiring circuit of the bellows shape is increased, and the size of the substrate is increased. That is, in these techniques, it is difficult to reduce the size of the flexible substrate.

In the case of the technique of Japanese Laid-Open Patent Publication No. 2004-345322, or the technique of JP-A-2006-270118, the size of the substrate can be reduced. In order to improve the followability to the substrate, the amount of the additive in the ink composition increases, and the electric resistance of the wiring circuit becomes high.

The present invention has been made in view of the above problems, and it is an object of the invention to provide a resin structure which can be reduced in size and which can suppress an increase in resistance of a wiring circuit, and a method of manufacturing the same. [Means for solving the problem]

According to one aspect, the resin structure includes a resin molded body that is stretchable and deformable, and a wiring circuit. The surface of the resin molded body includes a concavo-convex region having a concavo-convex shape. The wiring circuit is formed on the uneven region.

Preferably, the resin molded body has a rectangular plate shape in plan view. The uneven region is a wave shape in which the protruding portion and the groove portion are alternately continuous. The protruding portion and the groove portion extend in the width direction of the resin molded body.

Preferably, the resin molded body has a rectangular plate shape in plan view. A plurality of concave portions or convex portions having an elliptical shape in a plan view having a long axis parallel to the longitudinal direction of the resin molded body are formed in the uneven portion.

It is preferable that the difference between the highest point and the lowest point in the uneven region is 50 μm or more and 200 μm or less. The elongation at break of the resin molded body is preferably 1% or more.

Preferably, the resin structure further includes an electronic component. The resin molded body is embedded with an electronic component so that the electrode of the electronic component is exposed. The wiring circuit is connected to the electrode.

It is preferred that the surface of the resin molded body further includes a continuous region. The continuous region is located around the exposed surface of the electronic component from the resin molded body and is continuous with the exposed surface. The concavo-convex region is located around the continuous region and is continuous with the continuous region.

According to another aspect, the method for producing a resin structure includes the step of molding a resin molded body by filling a resin material into an inner space of a molding die processed into a concave-convex shape by at least a part of an inner surface, wherein the resin molded body A portion facing the at least a portion of the region is a concave-convex region; and a step of forming a wiring circuit on the uneven portion of the resin molded body.

According to still another aspect, the method of manufacturing a resin structure includes: adhering an electron to the one surface of a sheet having a concave-convex shape on at least a portion of a surface, and attaching the electrode to the one surface a step of forming a resin molded body by arranging a sheet in a molding die and filling the resin in a molding die, wherein the resin molded body embeds an electronic component and a portion facing the at least a portion of the region A step of forming a wiring circuit on the uneven portion of the resin molded body by peeling off the sheet from the resin molded body.

Preferably, at least a portion of the area of the sheet is embossed into a concave-convex shape. It is preferable that at least a part of the sheet is processed into a concavo-convex shape by applying an adhesive to the coating amount depending on the position.

Preferably, in the step of attaching the electronic component, the electronic component is adhered to the sheet using an adhesive. [Effects of the Invention]

According to the present disclosure, it is possible to realize a resin structure that can be reduced in size and that can suppress an increase in resistance of a wiring circuit.

Embodiments of the present invention will be described in detail with reference to the drawings. In addition, the same or the same portions in the drawings are denoted by the same reference numerals and the description is not repeated. Further, each of the embodiments and modifications described below can be selectively combined selectively.

(Embodiment 1) (Configuration of Resin Structure) A schematic configuration of the resin structure 100 of the first embodiment will be described with reference to Figs. 1 and 2 . FIG. 1 is a plan view showing a schematic configuration of a resin structure 100 according to the first embodiment. Fig. 2 is a cross-sectional view taken along the line X-X of Fig. 1.

The resin structure 100 is a device that is mounted in an electronic device such as a portable mobile machine and that is responsible for the main or auxiliary functions of the electronic device. As the portable mobile machine, for example, there is a measuring machine that measures the surface temperature of the body in clothes or a measuring machine that is wrapped around the wrist to measure pulse or blood pressure, and the like.

As shown in FIGS. 1 and 2 , the resin structure 100 includes an electronic component 110 , a resin molded body 120 , and a wiring circuit 130 .

The electronic component 110 is a passive component such as a chip capacitor or a wafer type resistor, an integrated circuit (IC), a large-scale integrated circuit (LSI), a semiconductor device such as a power transistor, and the like. Components. Although four electronic components 110 are shown in FIG. 1, the number of electronic components 110 is not specifically limited.

The resin molded body 120 includes an elastically deformable resin material (for example, an elastomer such as a polyester elastomer, a styrene elastomer, or an olefin elastomer which is an elastic rubbery polymer material). The elongation at break of the resin molded body 120 is 1% or more, preferably 10% or more. In addition, the elongation at break is a tensile test at the Japan Industrial Standard (JIS) K 7162, and indicates the elongation of the test piece at the time of the fracture with respect to the test piece before the test. The resin molded body 120 is stretchable and deformable, and when the resin structure 100 is mounted in a portable mobile machine, the resin molded body 120 can be elongated in accordance with the action of the human body.

The resin molded body 120 has a plate shape having a predetermined thickness (for example, t1 = 3 mm), and has an upper surface 121 which is rectangular in plan view. The upper surface 121 includes a concavo-convex region 122 having a concavo-convex shape. The uneven region 122 is a region in which a concave shape and a convex shape are alternately continuous. Specifically, in the cross section of the resin molded body 120 when cut in a plane parallel to the longitudinal direction of the upper surface 121 and parallel to the normal direction of the upper surface 121, the uneven region 122 has a wave shape. The uneven portion 122 includes a protrusion portion 123 and a groove portion 124 that extend in the width direction (short side direction) of the upper surface 121. The protruding portion 123 and the groove portion 124 are formed alternately in the longitudinal direction (longitudinal direction) of the upper surface 121.

In the resin molded body 120, the electronic component 110 is fixed by embedding the electronic component 110 therein. The resin molded body 120 embeds the electronic component 110 such that the electronic component 110 is exposed from the uneven region 122. At this time, in the resin molded body 120, the electronic component 110 is buried such that the electrode 111 of the electronic component 110 is exposed from the resin molded body 120. That is, the electrode 111 is formed on the exposed surface 112 of the resin molded body 120 in the electronic component 110.

The uneven region 122 of the upper surface 121 is continuous with the exposed surface 112 of the electronic component 110. Here, the two faces "continuous" mean a state in which there is no step difference between the two faces.

The wiring circuit 130 is formed on the uneven region 122 of the upper surface 121 of the resin molded body 120 and is connected to the electrode 111 of the electronic component 110. Thereby, the electrode 111 of one electronic component 110 is wired to the electrode 111 of the other electronic component 110.

The wiring circuit 130 includes a conductive material (for example, silver (Ag)) and an additive for imparting elongation. The wiring circuit 130 is stretchable and deformable by including an additive. However, when the amount of the additive increases, the electric resistance of the wiring circuit 130 increases, so the amount of the additive is suppressed to a minimum.

The wiring circuit 130 is easily formed by ejecting a conductive ink containing silver (Ag) fine particles and an additive using, for example, an inkjet printing method. The inkjet printing method is a printing method in which a conductive ink is ejected from a nozzle and a particulate ink is deposited on a surface to be ejected. The wiring circuit 130 can also be formed by a method using an aerosol or a method using a dispenser.

As described above, the uneven region 122 is a waveform. Therefore, the wiring circuit 130 also has the same shape as that of the uneven region 122. In other words, the cross section in the wiring circuit 130 when cut in a plane parallel to the longitudinal direction (longitudinal direction) of the upper surface 121 and parallel to the normal direction of the uneven portion 122 is a waveform.

(Manufacturing Method of Resin Structure) Next, an example of a method of manufacturing the resin structure 100 of the first embodiment will be described with reference to FIGS. 3(a) to 3(d). (a) to (d) of FIG. 3 are views for explaining a method of manufacturing the resin structure 100. (a) to (d) of FIG. 3 each show a first step to a fourth step for manufacturing the resin structure 100. In the upper side of Fig. 3 (a), a top view is shown, and the lower side is a side view. A cross-sectional view is shown in (b) of Fig. 3 . A top view is shown in (c) of Fig. 3 . In FIG. 3(d), the upper side shows a plan view, and the lower side shows an arrow cross-sectional view along the X-X line in plan view.

(First Step) As shown in FIG. 3( a ), first, the electronic component 110 is adhered to the temporary fixing sheet 200 having a rectangular shape in a plan view by an adhesive (not shown), and temporarily fixed. At this time, the electronic component 110 is adhered to the temporary fixing sheet 200 such that the surface on which the electrode 111 is formed is in contact with the temporary fixing sheet 200.

As a material of the temporary fixing sheet 200, for example, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyphenylene sulfide (PPS), polyphenylene sulfide (PPS) can be used. )Wait. The temporary fixing sheet 200 preferably contains a material that transmits ultraviolet rays and has flexibility because it will be described later.

Temporary fixation can be performed using, for example, an ultraviolet curable adhesive (not shown) applied to one surface of the temporary fixing sheet 200. For example, an ultraviolet curable adhesive is applied to a PET temporary fixing sheet 200 having a thickness of 50 μm at a thickness of 2 μm to 3 μm. The coating may be carried out by a method such as an inkjet printing method. Thereafter, the electronic component 110 is placed at a predetermined position. Moreover, the adhesive is hardened by temporarily irradiating the surface of the temporary fixing sheet 200 on which the electronic component 110 is not disposed, for example, ultraviolet rays having a strength of, for example, 3000 mJ/cm ² , and the electronic component 110 is temporarily fixed to the temporary fixing sheet 200.

(Second Step) Next, as shown in FIG. 3(b), the temporary fixing sheet 200 to which the electronic component 110 is temporarily fixed is placed inside the molding die 300. The forming die 300 includes a lower die 31 and an upper die 32. The sealed inner space is formed by bringing the lower mold 31 into close contact with the upper mold 32.

The entire area of the rectangular region 310 in the inner surface of the forming mold 300 (here, the surface of the lower mold 31) is processed into a concavo-convex shape. The rectangular region 310 is a wave shape in which the protruding portion 311 and the groove portion 312 are alternately continuous. The temporary fixing sheet 200 is provided on the rectangular region 310 in the molding die 300 such that the short side of the temporary fixing sheet 200 having a rectangular shape in plan view is parallel to the extending direction of the protruding portion 311 (or the groove portion 312). The temporary fixing sheet 200 is placed in the molding die 300 so that the surface of the molding die 300 is not in contact with the surface of the molding die 300.

The resin material is injected into the internal space of the molding die 300 to perform injection molding of the resin. The conditions for the injection molding may be appropriately selected depending on the resin. For example, when a polyester elastomer is used, the injection resin temperature is 240 ° C and the injection pressure is 100 MPa.

When the resin material is filled in the internal space of the molding die 300, the temporary fixing sheet 200 is pressed to the inner surface side of the molding die 300 by the pressure from the resin material, and is changed to the shape along the inner surface of the molding die 300. As described above, the temporary fixing sheet 200 is placed on the rectangular region 310 of the uneven shape. The surface of the temporary fixing sheet 200 to which the electronic component 110 is adhered is a plane along the surface of the electronic component 110 in the portion to which the electronic component 110 is pasted, and gradually moves away from the end of the electronic component 110. The shape is changed to conform to the concavo-convex shape of the rectangular region 310 of the molding die 300.

(3rd step) Next, the resin molded body 120 obtained by the injection molding in the second step is taken out from the molding die 300, and the temporary fixing sheet 200 is peeled off from the resin molded body 120.

Since the electronic component 110 is temporarily fixed to the temporary fixing sheet 200, the resin material filled in the internal space of the molding die 300 in the second step is formed in a state in which the electronic component 110 is surrounded. Therefore, the resin molded body 120 embeds the electronic component 110. The surface of the electronic component 110 that is in contact with the temporary fixing sheet 200 is exposed from the resin molded body 120. In the first step, the electronic component 110 is temporarily fixed to the temporary fixing sheet 200 so that the electrode 111 is in contact with the temporary fixing sheet 200. Therefore, the electrode 111 of the electronic component 110 is exposed from the resin molded body 120.

The portion of the temporary fixing sheet 200 to which the electronic component 110 is not pasted is deformed into the same uneven shape as the rectangular region 310 of the molding die 300. Therefore, the surface of the resin molded body 120 that is in contact with the temporary fixing sheet 200 is formed with a concavo-convex shape. That is, the uneven shape of the rectangular region 310 of the molding die 300 is transferred to the surface of the resin molded body 120 via the temporary fixing sheet 200. Thereby, as shown in FIG. 3(c), the uneven surface 122 is formed on the upper surface 121 of the resin molded body 120.

(Step 4) As shown in (d) of FIG. 3, after the third step, a regulation is formed on the uneven portion 122 of the upper surface 121 of the resin molded body 120 so as to be connected to the electrode 111 of the electronic component 110. Patterned wiring circuit 130.

The wiring circuit 130 is formed using a conductive material (for example, silver ink or the like) containing an additive for imparting elongation. The method of forming the wiring circuit 130 is an inkjet printing method, a method using an aerosol, a method using a dispenser, or the like. Thereby, the wiring circuit 130 can be easily formed, and the degree of freedom in circuit design becomes high.

In the second step, the surface of the temporary fixing sheet 200 to which the electronic component 110 is temporarily fixed is a plane along the surface of the electronic component 110 in the portion where the electronic component 110 is present, and is slowed away from the end of the electronic component 110. The shape is changed to match the concavo-convex shape of the rectangular region 310 of the molding die 300. Therefore, the uneven portion 122 of the upper surface 121 of the resin molded body 120 is continuous with the exposed surface 112 of the electronic component 110. Thereby, the wiring circuit 130 is formed without being broken at the boundary portion between the uneven portion 122 and the electronic component 110.

The electronic component 110 is simply electrically connected to the wiring circuit 130 without soldering or the like. After the position of the electronic component 110 is determined, the wiring circuit 130 is connected to the electronic component 110. Therefore, the electronic component 110 and the wiring circuit 130 can be accurately and easily compared with, for example, the positioning of the electronic component on the printed substrate. Electrical connection.

(Advantages) As described above, the resin structure 100 includes the resin molded body 120 and the wiring circuit 130 that are stretchable and deformable. The surface of the resin molded body 120 includes a concavo-convex region 122 having a concavo-convex shape. The wiring circuit 130 is formed on the uneven region 122.

Specifically, the resin molded body 120 has a rectangular plate shape in plan view. The uneven region 122 is a wave shape in which the protruding portion 123 and the groove portion 124 are alternately continuous. The protruding portion 123 and the groove portion 124 extend in the width direction of the resin molded body 120.

When the resin molded body 120 has a rectangular plate shape in a plan view, the resin molded body 120 is elongated the longest when a tensile force in the longitudinal direction (the direction of the arrow A in FIG. 2) is applied. When the resin molded body 120 is elongated and deformed in the longitudinal direction, the uneven portion 122 is deformed such that the difference between the upper end of the protruding portion 123 and the lower end of the groove portion 124 is small. That is, as shown by the arrow B shown in the enlarged view of FIG. 2, the uneven region 122 is deformed such that the upper end of the protrusion 123 becomes lower and the lower end of the groove portion 124 becomes higher. Since the wiring circuit 130 is deformed in accordance with the shape of the uneven region 122, the wiring circuit 130 is deformed in such a manner that the height difference of the waveform becomes small. Therefore, the wiring circuit 130 can follow the elongation deformation of the resin molded body 120 in the direction of the arrow A in a smaller amount than the amount of deformation of the resin molded body 120 in the direction of the arrow A direction. Thereby, breakage of the wiring circuit 130 can be prevented. Further, the amount of the additive for imparting elongation in the wiring circuit 130 can be made small, and the increase in the electric resistance of the wiring circuit 130 can be suppressed.

The wiring circuit 130 is formed on the uneven region 122 and has a shape of a concavo-convex shape along the uneven region 122. The uneven region 122 in the resin molded body 120 is a wave shape in which the height of the resin molded body 120 in the thickness direction changes. Therefore, the space required for the wiring circuit 130 is smaller than that of the wiring circuit of the bellows shape in the direction parallel to the surface of the substrate as described in Japanese Laid-Open Patent Publication No. 2013-187380. Thereby, the resin structure 100 can be miniaturized.

The resin structure 100 further includes an electronic component 110. The resin molded body 120 is embedded with the electronic component 110 so that the electrode 111 of the electronic component 110 is exposed. The wiring circuit 130 is connected to the electrode 111. Thereby, the electronic circuit can be configured by the wiring circuit 130 and the electronic component 110.

The uneven shape of the uneven portion 122 is a size that can absorb the elongation deformation of the resin molded body 120. Here, the uneven shape of the magnitude of the elongation deformation of the absorbable resin molded body 120 is as follows. In other words, in the cross section when the resin molded body 120 is cut by a plane parallel to the longitudinal direction and parallel to the normal direction of the upper surface 121, the surface from the upper end of the protrusion 123 to the upper end of the adjacent protrusion 123 is formed. The distance divided by the pitch of the protrusions 123 (the linear distance between the upper end of a certain protrusion 123 and the upper end of the adjacent protrusion 123) is larger than the maximum value of the assumed elongation of the resin molded body 120. Here, the assumed elongation is set in accordance with the application to which the resin structure 100 is applied.

The height difference ΔH between the upper end of the protrusion 123 (the highest point of the uneven portion 122) and the lower end of the groove portion 124 (the lowest point of the uneven portion) is preferably 50 μm or more and 200 μm or less. When the height difference ΔH is 50 μm or more, the wiring circuit 130 can follow the elongation deformation of the resin molded body 120 in the direction of the arrow A in a smaller amount than the amount of elongation of the resin molded body 120 in the direction of the arrow A. When the height difference ΔH is 200 μm or less, the uneven region 122 can be easily formed on the surface of the resin molded body 120.

The resin structure 100 includes a second step of molding the resin molded body 120 by the resin material in which the inner space of the molding die 300 in which the rectangular portion 310 of the inner surface is processed into a concave-convex shape is filled, wherein the resin molded body 120 is temporarily fixed. The portion of the sheet 200 facing the rectangular region 310 is the uneven portion 122; and in the fourth step, the wiring circuit 130 is formed on the uneven portion 122 of the resin molded body 120. The uneven region 122 of the resin molded body 120 is formed when the resin molded body 120 is molded. That is, after the resin molded body 120 is formed, a step of separately forming the uneven portion 122 or another member for forming the uneven portion 122 is not required. Thereby, the manufacturing cost of the resin structure 100 can be suppressed low.

(Modification) FIG. 4 is a plan view showing a modification of the rectangular region 310 of the lower mold 31 constituting the molding die 300. As shown in FIG. 4, the rectangular region 310 includes, for example, a first region 316 overlapping the electronic component 110, a second region 317 having a predetermined width around the first region 316, and a remaining third region 318. The first region 316 is flat, and the third region 318 is a wave shape in which the protruding portion 311 and the groove portion 312 are alternately continuous. The second region 317 is a surface in which the flat first region 316 and the wave-shaped third region 318 are smoothly continuous.

FIG. 5A is a plan view showing a schematic configuration of a resin molded body 120 molded by using the molding die 300 shown in FIG. 4 . Fig. 5B is an arrow sectional view taken along line X-X of Fig. 5A. Fig. 5C is an arrow sectional view taken along line XI-XI of Fig. 5A. The XI-XI line overlaps with the protrusion 123.

As shown in FIG. 5A to FIG. 5C, the region facing the second region 317 of the molding die 300 in the resin molded body 120 is a continuous region 125 which is located around the exposed surface 112 of the electronic component 110 and which is continuous with the exposed surface 112. A region of the resin molded body 120 that faces the third region 318 of the molding die 300 is a concavo-convex region 122 and is continuous with the continuous region 125.

According to the resin molded body 120 shown in FIG. 5A to FIG. 5C, the exposed surface 112 of the electronic component 110 and the uneven region 122 of the resin molded body 120 are smoothly continuous by the continuous region 125 at the boundary between the electronic component 110 and the resin molded body 120. . Therefore, the disconnection of the wiring circuit 130 in the boundary between the electronic component 110 and the resin molded body 120 can be more reliably prevented.

<Embodiment 2> In the first embodiment, the wiring circuit 130 is formed on the wave-shaped uneven region 122 of the upper surface 121 of the resin molded body 120. Thereby, when the resin molded body 120 is stretched and deformed, the wiring circuit 130 can follow the elongation deformation of the resin molded body 120 by a deformation amount smaller than the elongation of the resin molded body 120.

However, even if the uneven region has a concavo-convex shape different from the wave shape, the breakage of the wiring circuit 130 can be suppressed. When the resin molded body having a flat surface is elongated, the flat surface is not always elongated in the same manner. If there is a partially weak portion in the resin molded body, the amount of deformation of the portion is larger than the other portions. The partially weak portion is a portion that is defective by, for example, impact with other parts, and is thinner than the other portions. In the case where the weak portion is only one, the deformation amount of the portion is significantly larger than that of the other portion, and the wiring circuit formed on the portion is broken. Therefore, in order to prevent the occurrence of breakage even when the deformation is concentrated on a partially weak portion, it is considered to increase the amount of the additive for imparting elongation in the wiring circuit 130. In this case, the electric resistance of the wiring circuit 130 becomes high.

As a result of intensive studies, the present inventors have found that the deformation of the surface of the resin molded body is prevented from being concentrated on one portion by intentionally forming a plurality of weak portions, thereby suppressing formation on the surface of the resin molded body. The breakage of the wiring circuit 130. The resin structure of the second embodiment has a configuration using this aspect.

The configuration of the resin structure 400 of the second embodiment will be described with reference to Figs. 6 and 7 . FIG. 6 is a plan view showing a schematic configuration of a resin structure 400 according to the second embodiment. Fig. 7 is a cross-sectional view taken along the line X-X of Fig. 6.

The resin structure 400 is different from the resin structure 100 of the first embodiment in that the resin molded body 420 is provided instead of the resin molded body 120. The resin molded body 420 has a plate shape and has an upper surface 421 which is rectangular in plan view. The upper surface 421 of the resin molded body 420 includes a concavo-convex region 422 having a concavo-convex shape. The uneven portion 422 includes a plurality of concave portions 423 which are formed in a matrix shape and have an elliptical shape in plan view (that is, an elliptical shape when viewed from the normal direction of the upper surface 421), and a flat portion 424 between the plurality of concave portions 423. The flat portion 424 between the plurality of concave portions 423 is convex as viewed from the concave portion 423. Therefore, the uneven region 422 is a region in which the concave and convex shapes are alternately continuous.

The elliptical concave portion 423 is formed on the upper surface 421 such that the long axis is parallel to the longitudinal direction (longitudinal direction) of the upper surface 421. Further, the depth of the concave portion 423 is preferably 50 μm or more and 200 μm or less.

The electronic component 110 and the wiring circuit 130 have the same configuration as that of the first embodiment. The electronic component 110 is embedded in the resin molded body 420 and exposed from the uneven region 422 of the resin molded body 420. An electrode 111 is formed on the exposed surface 112 of the resin molded body 420 in the electronic component 110. The wiring circuit 130 is formed on the uneven portion 422 of the upper surface 421 of the resin molded body 420 so as to be connected to the electrode 111 of the electronic component 110.

The resin structure 400 is produced by the same method as the production method described in the first embodiment. Among them, a molding die which is formed in a matrix shape in a part of a rectangular region of the inner surface is formed in a matrix shape instead of a part of the rectangular region 310 of the inner surface, and is processed into a wave-shaped molding die 300. In this way, the resin structure 400 having the resin molded body 420 having the uneven surface 422 in which the plurality of concave portions 423 having an elliptical shape are formed on the upper surface 421, and the electronic component 110 embedded in the resin molded body 420; The wiring circuit 130 formed in the uneven region 422 of the resin molded body 420.

In the resin structure 400 of the second embodiment, the concave portion 423 is thinner than the flat portion 424 and is easily deformed. When the resin molded body 420 is elongated and deformed by forming the plurality of concave portions 423 which are easily deformed compared to the flat portion 424, the deformation of the surface of the resin molded body 420 is not concentrated in one portion and is dispersed. Therefore, the amount of deformation of the plurality of concave portions 423 can be made smaller than the amount of deformation of the portion when the deformation of the surface of the resin molded body 420 is concentrated on one portion. Thereby, the breakage of the wiring circuit 130 can be suppressed, and the amount of the additive for imparting elongation to the wiring circuit 130 can be reduced, and the increase in the resistance of the wiring circuit 130 can be suppressed.

Further, the long axis of the concave portion 423 having an elliptical shape in plan view is parallel to the longitudinal direction of the resin molded body 420. Therefore, the concave portion 423 is more likely to be deformed along the longitudinal direction of the resin molded body 420. The amount of elongation deformation of the resin molded body 420 becomes maximum when a tensile force in the longitudinal direction is applied. In other words, when the tensile force is applied in the longitudinal direction of the resin molded body 420, the plurality of concave portions 423 are more likely to be deformed. Therefore, the deformation of the surface of the resin molded body 420 can be dispersed without being concentrated on one portion.

The concave portion 423 is more likely to be deformed than the flat portion 424. Therefore, the wiring circuit 130 is preferably formed on the planar portion 424 so as to avoid the concave portion 423. Thereby, the amount of deformation of the wiring circuit 130 can be made smaller. As a result, the amount of the additive for imparting elongation to the wiring circuit 130 can be further reduced, and the increase in the resistance of the wiring circuit 130 can be suppressed.

In the above description, the uneven portion 422 includes a plurality of concave portions 423 having an elliptical shape in a plan view and a flat portion 424 between the plurality of concave portions 423. However, a plurality of convex portions formed in a matrix may be included. Instead of the plurality of recesses 423. In this case, the flat portion 424 has a thin thickness of the resin molded body 120 with respect to the convex portion, and is easily deformed. When the resin molded body 420 is stretched and deformed by the flat portion 424 in which the convex portion is easily deformed, the deformation of the surface of the resin molded body 420 is not concentrated in one portion and dispersed. Thereby, the breakage of the wiring circuit 130 can be suppressed, and the amount of the additive for improving the elongation of the wiring circuit 130 can be reduced, and the increase in the resistance of the wiring circuit 130 can be suppressed.

(Embodiment 3) In the first embodiment, the rectangular mold 310 in which a part of the inner surface is used is processed into a concave-convex mold 300, and the uneven shape is transferred to the resin molded body 120 via the temporary fixing sheet 200. The surface is thereby formed with the uneven portion 122 on the upper surface 121 of the resin molded body 120. On the other hand, in the third embodiment, the uneven surface 122 is formed on the upper surface 121 of the resin molded body by forming the uneven shape on the surface of the temporarily fixed sheet. Further, the production method of the third embodiment can also be applied to a method of producing the resin molded body 420 shown in the second embodiment.

(a) to (b) of FIG. 8 are views for explaining a method of manufacturing the resin structure 100 of the third embodiment. The first step and the second step for manufacturing the resin structure 100 are shown in (a) and (b) of Fig. 8, respectively. In the upper side of Fig. 8 (a), a top view is shown, and the lower side is a side view. A cross-sectional view is shown in (b) of Fig. 8 .

(First Step) As shown in FIG. 8( a ), first, the electronic component 110 is adhered to the temporary fixing sheet 500 having a rectangular shape in a plan view by an adhesive (not shown), and temporarily fixed. The electronic component 110 is adhered to the temporary fixing sheet 500 such that the surface on which the electrode 111 is formed is in contact with the temporary fixing sheet 500.

As a material of the temporary fixing sheet 500, for example, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyphenylene sulfide (PPS), or the like can be used.

The surface of the temporary fixing sheet 500 to which the electronic component 110 is adhered includes a region 510 which is processed into a concavo-convex shape. The region 510 of the temporary fixing sheet 500 is processed into a concavo-convex shape by, for example, embossing. As the embossing, any of a method in which the back surface is topped up to float and a method in which a convex portion is formed by adhering ink or the like to the surface can be used. In the case where the back surface is topped up and floated, the temporarily fixed sheet 500 having a thickness such that the convex portion is not crushed is used in the injection molding of the resin material to be described later. The uneven shape formed by the embossing is the same as the wave shape formed in the molding die 300 of the first embodiment.

For example, an ultraviolet curable adhesive (not shown) is applied to the temporary fixing sheet 500. For example, an ultraviolet curable adhesive is applied to a PET temporary fixing sheet 500 having a thickness of 100 μm in a region 510 which is embossed into a concavo-convex shape, and has a thickness of 5 μm. The coating may be carried out by a method such as an inkjet printing method. Thereafter, the electronic component 110 is placed at the set position. Moreover, the adhesive is hardened and the electronic component 110 is temporarily fixed to the temporary fixing sheet 500 by irradiating ultraviolet rays having a strength of, for example, 3000 mJ/cm ² from the surface of the temporary fixing sheet 500 to which the electronic component 110 is not temporarily fixed. .

(Second Step) Next, as shown in FIG. 8(b), the temporary fixing sheet 500 to which the electronic component 110 is temporarily fixed is placed inside the molding die 600.

The temporary fixing sheet 500 is placed in the molding die 600 so that the surface on which the electronic component 110 is not temporarily fixed is in contact with the inner surface of the molding die 600. The forming die 600 includes a lower die 61 and an upper die 62. The sealed inner space is formed by bringing the lower mold 61 into close contact with the upper mold 62. The inner surface of the forming mold 600 is flat.

The resin material is injected into the internal space of the molding die 600 to perform injection molding of the resin. The conditions for the injection molding may be appropriately selected depending on the resin. For example, when a polyester elastomer is used, injection molding is carried out at an injection resin temperature of 240 ° C and an injection pressure of 100 MPa. The surface of the temporary fixing sheet 500 is processed into a concavo-convex shape as described above. Therefore, in the resin molded body 120, a concave-convex shape is also formed on the surface in contact with the temporary fixing sheet 500. That is, the uneven shape formed in the region 510 of the temporary fixing sheet 500 is transferred to the upper surface 121 of the resin molded body 120, and the uneven surface 122 is formed on the upper surface 121.

After the second step, the resin structure 100 in which the wiring circuit 130 is formed on the uneven region 122 of the resin molded body 120 can be manufactured by performing the third step and the fourth step described in the first embodiment.

Further, in the first step, a temporary fixing sheet having a flat surface on both sides can be used without using the temporary fixing sheet 500 in which one surface is processed into an uneven shape by embossing. In this case, an ultraviolet curable adhesive for adhering the electronic component 110 is applied to one surface of the temporary fixing sheet depending on the position, and the coating amount is different. The surface of the adhesive has an uneven shape depending on the amount of coating. Thereby, a temporary fixing sheet whose surface is processed into a concavo-convex shape can be produced.

When the surface of the temporary fixing sheet is processed into a concave-convex shape using an ultraviolet curing type adhesive, the step of adhering the electronic component 110 to the temporary fixing sheet and the surface of the temporary fixing sheet can be simultaneously processed into irregularities. The steps of the shape. On one surface of the temporary fixing sheet, an adhesive is applied to a portion where the electronic component 110 is pasted with a uniform thickness, and an adhesive is applied to a portion where the electronic component 110 is not attached, depending on the position. Thereafter, the adhesive is cured by irradiating ultraviolet rays from the surface of the temporary fixing sheet on the side where the adhesive is not applied. Thereby, the electronic component 110 can be temporarily fixed to the temporary fixing sheet, and the portion of the temporary fixing sheet in which the electronic component 110 is not present can be processed into a concave-convex shape.

Further, one surface of the temporary fixing sheet 500 may be divided into a first region to which the electronic component 110 is adhered, a second region having a predetermined width around the first region, and the remaining third region, and the surface of each region may be formed. The shape is different. Specifically, the first region is made flat, and the third region is a wave shape in which the protruding portion and the groove portion are alternately continuous. The second region is a surface in which the flat first region and the third region of the wave shape are smoothly continuous. Thereby, as shown in FIGS. 5A to 5C, the upper surface 121 may have a continuous region 125 continuous with the exposed surface 112 of the electronic component 110, and a concave-convex region 122 located around the continuous region 125 and continuous with the continuous region 125. The resin molded body 120 is formed.

The embodiments disclosed herein are to be considered in all respects as illustrative and not restrictive. The scope of the present invention is defined by the scope of the claims and not the description of the claims

31, 61‧‧‧ lower mold

32, 62‧‧‧Upper mold

100, 400‧‧‧ resin structure

110‧‧‧Electronic parts

111‧‧‧Electrode

112‧‧‧ exposed face

120, 420‧‧‧ resin molded body

121, 421‧‧‧ upper surface

122, 422‧‧‧ concave and convex areas

123, 311‧‧ ‧ protrusion

124, 312‧‧‧ slot

125‧‧‧Connected area

130‧‧‧Wiring circuit

200, 500‧‧‧ Temporary fixed sheets

300, 600‧‧‧ forming mould

310‧‧‧Rectangular area

316‧‧‧1st area

317‧‧‧2nd area

318‧‧‧3rd area

423‧‧‧ recess

424‧‧‧Flat Department

510‧‧‧Area

T1‧‧‧ thickness

ΔH‧‧‧ height difference

A, B‧‧ arrows

Fig. 1 is a plan view showing a schematic configuration of a resin structure according to a first embodiment. Fig. 2 is a cross-sectional view taken along the line X-X of Fig. 1. (a) to (d) of FIG. 3 are views for explaining a method of producing the resin structure of the first embodiment. 4 is a plan view showing a modified example of a lower mold constituting a molding die. FIG. 5A is a plan view showing a schematic configuration of a resin molded body formed by using the molding die shown in FIG. 4 . Fig. 5B is an arrow sectional view taken along line X-X of Fig. 5A. Fig. 5C is an arrow sectional view taken along line XI-XI of Fig. 5A. Fig. 6 is a plan view showing a schematic configuration of a resin structure of a second embodiment. Fig. 7 is a cross-sectional view taken along the line X-X of Fig. 6. (a) to (b) of FIG. 8 are views for explaining a method of producing the resin structure of the third embodiment.

Claims (11)

A resin structure comprising: an extensible deformable resin molded body, the surface of the resin molded body comprising a concavo-convex region having a concavo-convex shape, wherein a difference between a highest point and a lowest point in the concavo-convex region is 50 μm or more and 200 μm And a wiring circuit, the wiring circuit being formed on the uneven region. The resin structure according to the first aspect of the invention, wherein the resin molded body has a rectangular plate shape in a plan view, and the uneven portion is a wave shape in which a projection portion and a groove portion are alternately continuous, the protrusion The groove and the groove portion extend in the width direction of the resin molded body. The resin structure according to the first aspect of the invention, wherein the resin molded body has a rectangular plate shape in a plan view, and a long axis parallel to a longitudinal direction of the resin molded body is formed in the uneven portion. A plurality of concave portions or convex portions having an elliptical shape in plan view. The resin structure according to any one of claims 1 to 3, wherein the resin molded body has an elongation at break of 1% or more. The resin structure according to any one of claims 1 to 3, further comprising an electronic component, wherein the resin molded body embeds and fixes the electronic component such that an electrode of the electronic component is exposed; The wiring circuit is connected to the electrode. The resin structure according to claim 5, wherein The surface of the resin molded body further includes a continuous region located around the exposed surface of the electronic component from the exposed surface of the resin molded body and continuous with the exposed surface, the concave and convex region being located in the continuous region Surrounding and continuous with the continuous area. A method of producing a resin structure, which is a method of producing a resin structure according to claim 1, and comprising: filling an internal space of a molding die processed into a concave-convex shape by at least a part of an inner surface a step of molding the resin molded body, wherein the resin molded body has a portion facing the at least a portion of the region as the uneven portion; and a portion formed on the uneven portion of the resin molded body The steps of the wiring circuit are described. A method of producing a resin structure, which is a method of producing a resin structure according to claim 5, and comprising: the one of the sheets processed into a concave-convex shape in at least a portion of one surface a step of adhering the electronic component to the surface in such a manner that the electrode faces the one surface; forming the resin by disposing the sheet in a molding die and filling a resin into the molding die a step of forming a body in which the resin molded body embeds the electronic component and a portion facing the at least a portion of the region as the uneven portion; The step of forming the wiring circuit on the uneven portion of the resin molded body by peeling the sheet from the resin molded body. The method for producing a resin structure according to claim 8, wherein at least a part of the region of the sheet is embossed into a concavo-convex shape. The method for producing a resin structure according to claim 8, wherein the at least a part of the sheet is processed into a bump by applying an adhesive according to a difference in coating amount depending on a position. shape. The method for producing a resin structure according to claim 10, wherein in the step of adhering the electronic component, the electronic component is adhered to the sheet using the adhesive.