KR101716882B1 - Flexible semiconductor package with stress relief structure at interconnects using adhesive, and manufacturing method thereof - Google Patents

Flexible semiconductor package with stress relief structure at interconnects using adhesive, and manufacturing method thereof Download PDF

Info

Publication number
KR101716882B1
KR101716882B1 KR1020150127098A KR20150127098A KR101716882B1 KR 101716882 B1 KR101716882 B1 KR 101716882B1 KR 1020150127098 A KR1020150127098 A KR 1020150127098A KR 20150127098 A KR20150127098 A KR 20150127098A KR 101716882 B1 KR101716882 B1 KR 101716882B1
Authority
KR
South Korea
Prior art keywords
flexible
strip substrate
flexible strip
package
semiconductor die
Prior art date
Application number
KR1020150127098A
Other languages
Korean (ko)
Inventor
이혁
정준희
류민구
김태원
Original Assignee
(주)플렉스컴
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)플렉스컴 filed Critical (주)플렉스컴
Priority to KR1020150127098A priority Critical patent/KR101716882B1/en
Application granted granted Critical
Publication of KR101716882B1 publication Critical patent/KR101716882B1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3142—Sealing arrangements between parts, e.g. adhesion promotors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/4827—Materials
    • H01L23/4828—Conductive organic material or pastes, e.g. conductive adhesives, inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

According to another aspect of the present invention, there is provided a method of manufacturing a flexible package, including: preparing a flexible strip substrate; forming a plurality of connection grooves in a package region where unit packages are formed on an upper surface of the flexible strip substrate; A die bonding step in which a soft semiconductor die is bonded to an upper surface of the flexible strip substrate, and a die mold step covering a mold protecting the soft semiconductor die. According to the structure of the present invention as described above, the fastening force is strengthened in the connection region where stress is concentrated, thereby preventing cracks.

Description

TECHNICAL FIELD [0001] The present invention relates to a flexible package in which a stress in a connection region is dispersed, and a manufacturing method thereof.

The present invention relates to a flexible package in which the stress of interconnects is dispersed using a rigid adhesive and a method of manufacturing the same. More particularly, the present invention relates to a flexible package, such as a smart band, A new type of flexible semiconductor package has been developed so that stress is concentrated in a certain area (for example, a connection area) in proportion to flexibility. Thus, stress on the connection area that is locally concentrated is effectively dispersed For this purpose, a connection groove is formed on a substrate to enlarge the connection area, and a strong adhesive is formed on the edge of the element to be in contact with the substrate to firmly hold the element. A fastening hole is formed in the substrate, A flexible package which is fastened to the back side thereof and a manufacturing thereof It relates to the law.

Currently, the semiconductor industry is broadening its application range. Accordingly, packaging technology for integrated circuit devices such as semiconductor memories is increasingly demanded for high capacity, thinning, miniaturization and the like, and various solutions for solving the problems are being developed.

In particular, in recent years, flexible integrated circuit devices capable of bending are developed, and flexible integrated circuit packages capable of flexing with the above-mentioned integrated circuit devices are being developed.

However, conventional flexible integrated circuit packages have the following two problems.

First, flexible PCBs, which are essentially included in flexible integrated circuit packages, enhance the radius of curvature and have no proper means to adjust in both directions.

For example, when mounting a flexible integrated circuit package on a band, the band must be able to bend freely, and be able to bend on both sides, regardless of direction.

Secondly, even when some flexible integrated circuit packages are flexibly bent, the stress is concentrated at the edge of the flexible integrated circuit device connected to the flexible PCB, so that the connection member of the connection area is cracked or separated .

For example, when a flexible substrate, a flexible integrated circuit element, a conductive connecting member optimized for flexibility, an insulating member and a flexible mold are processed to manufacture a flexible integrated circuit package, There is a problem that cracks are generated at the same time as the warp of the flexible substrate in the solder ball disposed at the longest distance and the electrical function is lost.

KR publication number 10-2015-0010209

SUMMARY OF THE INVENTION Accordingly, the present invention has been made keeping in mind the above problems occurring in the prior art, and it is an object of the present invention to provide a flexible package that minimizes the thickness of a package to optimize a radius of curvature.

It is another object of the present invention to provide a flexible package that distributes stress using a particularly rigid adhesive in a region where stress is localized locally in a flexible package that is flexed freely with optimized radius of curvature.

It is still another object of the present invention to provide a flexible package that provides a connecting member that allows the flexible substrate and the flexible mold to be physically connected as well as chemically and to firmly couple the mold to the substrate.

According to an aspect of the present invention, there is provided a unit package including two or more flexible packages spaced apart from each other at regular intervals on a flexible strip substrate bent in both directions, Comprising a flexible semiconductor die on the flexible strip substrate, a plurality of connecting members for coupling the flexible strip substrate and the flexible semiconductor die, and a flexible mold for protecting the flexible semiconductor die, wherein the flexible flexible strip substrate comprises: A plurality of connection grooves are formed on the upper surface corresponding to the member.

According to another aspect of the present invention, there is provided a method of manufacturing a flexible package, comprising: preparing a flexible strip substrate; forming a plurality of connection grooves in a package region in which a unit package is formed on an upper surface of the flexible strip substrate; A step of applying a solder paste to the groove, a die bonding step in which a soft semiconductor die is bonded to an upper surface of the flexible strip substrate, and a die mold step covering a mold protecting the soft semiconductor die.

As described above, according to the configuration of the present invention, the following effects can be expected.

First, the distance between the flexible semiconductor die and the flexible strip substrate is shortened due to the connection groove, the thickness of the entire package is reduced, and the neutral plane is lowered, thereby increasing the radius of curvature.

Secondly, because the solder ball and other connecting members are inserted into the connecting groove, the contact area between the connecting member and the flexible strip substrate is enlarged, so that the fastening force is increased and the stress is alleviated.

Third, since the rigid adhesive is formed on the edge of the flexible semiconductor die coupled with the flexible strip substrate, stress is dispersed in the stomach-bonding region where stress is concentrated when the flexible semiconductor die is bent or curved, thereby significantly reducing defects.

Fourth, the mold is filled with the through hole of the flexible strip substrate during the molding process, and the filled mold performs a function of firmly coupling the flexible strip substrate and the soft semiconductor die, so that cracks and cracks in the corresponding portions, . ≪ / RTI >

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A and FIG. 1B are side cross-sectional views showing the structure of a flexible package in which stress of a connecting member is relieved by using a connecting groove according to the present invention.
2A and 2B are side cross-sectional views showing the structure of a flexible package in which the stress of the connecting member is relieved by using a rigid adhesive according to the present invention.
FIGS. 3A and 3B are side cross-sectional views showing the configuration of a flexible package in which the stress of the connecting member is relieved by using the fastening member according to the present invention. FIG.
4A to 4G are cross-sectional side views showing a method of manufacturing a flexible package according to the present invention.
5 is a flowchart showing a method of manufacturing a flexible package according to the present invention.

Brief Description of the Drawings The advantages and features of the present invention, and how to achieve them, will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. The dimensions and relative sizes of layers and regions in the figures may be exaggerated for clarity of illustration. Like reference numerals refer to like elements throughout the specification.

Embodiments described herein will be described with reference to plan views and cross-sectional views, which are ideal schematics of the present invention. Thus, the shape of the illustrations may be modified by manufacturing techniques and / or tolerances. Accordingly, the embodiments of the present invention are not limited to the specific forms shown, but also include changes in the shapes that are produced according to the manufacturing process. Thus, the regions illustrated in the figures have schematic attributes, and the shapes of the regions illustrated in the figures are intended to illustrate specific forms of semiconductor devices or areas of semiconductor packages and are not intended to limit the scope of the invention.

Hereinafter, preferred embodiments of the strip-type bidirectional flexible package according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1A is a side sectional view showing a configuration of a flexible package in which stress of a connecting member is relieved by using a connecting groove according to the present invention, and FIG.

1A and 1B, a strip type bidirectional flexible package 100 includes a flexible strip substrate 110 which is bent upward and downward, and a plurality of unit packages 110 which are separately molded on a flexible strip substrate 110 at a predetermined distance. (120).

The unit package 120 includes a flexible semiconductor die 122 that is stacked on a flexible strip substrate 110, a connection member 124 that electrically connects the flexible strip substrate 110 and the flexible semiconductor die 122, And a soft mold 126 that protects the semiconductor die 122.

The flexible strip substrate 110 may include an insulated substrate and a penetrating electrode or a rewiring pattern formed in the insulated substrate for electrically connecting connection pads, wiring patterns, connection pads, and the like formed on the insulating substrate, .

The insulating substrate may include an FPCB having flexibility. For example, as flexible semiconductor substrates and flexible semiconductor chips that flex freely, and flexible semiconductor packages that bend up and down including the above-described substrate and semiconductor chips have been developed, the insulating substrate can be constructed using flexible FPCB have. The insulating substrate may be formed of a polymer material that can be bent or bent.

The flexible semiconductor die 122 may be integrated on the flexible strip substrate 110, and may have a thickness of several tens of micrometers to several nanometers to be bent.

The soft mold 126 may be formed of a material that is bent or bent. For example, the flexible mold 126 includes a material capable of providing stress and may include a polymeric material or a rubber. In particular polyimide.

The flexible strip substrate 110 is formed with a plurality of connection grooves 104 on the upper surface corresponding to the connection member 124 so that the connection member 124 is inserted into the connection groove 104 of the connection area. When the solder ball is inserted into the connection groove 104, the contact area of the solder ball with the flexible strip substrate 110 is enlarged from one surface to three surfaces due to the connection groove 104, As the contact area is increased, the fastening force is increased, and the stress concentrated on the connecting member 124 in particular can be alleviated.

By inserting the connecting member 124 into the connecting groove 104, the overall height of the entire flexible package 100 is reduced and the neutral plane of the flexible package 100 is lowered. A solder paste 104a is applied to the connection groove 104 and the connection member 124 can be physically and electrically connected to the connection pad 124 of the flexible strip substrate 110 through the solder paste 104a.

According to the step of die bonding and die molding through the connection groove 104 as described above, the under fill process is omitted and the total number of processes is reduced.

For example, the radius of curvature can be increased by minimizing the height of the package. However, even if the flexible semiconductor die 122 is thinned or the thickness of the soft mold 126 is minimized, a limit is imposed that the thickness of the unit package 120 can no longer be reduced. At this time, the space between the flexible strip substrate 110 and the flexible semiconductor die 122 may be omitted, and as a result, the thickness of the entire flexible package 100 may be reduced.

≪ Embodiment 2 >

FIG. 2A is a side sectional view showing a structure of a flexible package in which the stress of the connecting member is relieved by using a rigid adhesive according to the present invention, and FIG.

2A and 2B, a rigid adhesive 130 connecting the flexible strip substrate 110 and the flexible semiconductor die 122 to the edge of the flexible semiconductor die 122 connected to the flexible strip substrate 110 . The rigid adhesive 130 functions to disperse the stress by providing a strong bonding force to the edge region of the flexible semiconductor die 122, which may be stressed particularly due to warping or flexing.

For such rigid adhesive 130, an epoxy adhesive may be used. The epoxy adhesive may include an epoxy resin, a hardener, a diluent, a solvent, or the like. Other metals may be mixed depending on the conductivity. Polyimide adhesives that are stronger than epoxy adhesives can be used.

The package region P of the present invention is an area which is independently subjected to a mold processing so that a plurality of semiconductor components are separately mounted and mounted, and the radius of curvature of the entire flexible package 100 can be made small or large depending on the interval therebetween. The present invention is characterized in that the gap is optimized and the radius of curvature is enlarged to thereby reduce the stress mainly generated when the flexible package 100 is bent or curved, (122) edge area.

≪ Third Embodiment >

FIG. 3A is a side sectional view showing a configuration of a flexible package in which the stress of the connecting member is relieved by using the fastening member according to the present invention, and FIG.

Referring to FIGS. 3A and 3B, a fastening hole 106 may be formed in the flexible strip substrate 110. A part of the mold to be processed during the die molding process is partially filled in the fastening hole 106 to perform the function of the fastening member 140 for fastening the fastening hole 106 to the soft mold 126 and the flexible strip substrate 110 do.

The coupling hole 106 passing through the flexible strip substrate 110 is drilled on the outer side of the flexible strip substrate 110 on which the rigid adhesive 130 is formed so that the mold is inserted into the coupling hole 106 during the molding process. The fastening member 140 which is filled and protrudes to the back surface of the flexible strip substrate 110 to prevent cracks can be completed.

Hereinafter, a method for manufacturing a flexible package according to the present invention will be described with reference to FIGS. 5 and 4A to 4G.

4A, a flexible strip substrate 110 designed to be suitable for a roll-to-roll continuous process is prepared (S110). At this time, the flexible strip substrate 110 is divided into unit packages (See 120 in FIG. 1) are spaced apart from each other, whereby the package regions P in which the plurality of unit packages 120 are subjected to the molding process can be repeatedly arranged between the non-package regions that are not subjected to the molding process.

4B, a plurality of connection grooves 104 are formed in the package region P on the upper surface of the flexible strip substrate 110. (S120) The plurality of connection grooves 104 are formed by a lithography process or an etching process As shown in FIG. Or may be formed through a laser process.

4C, a step of forming a fastening hole 106 in which the fastening member 140 is to be formed at the outermost inside of the package region P at the same time as or before or after the step of forming the connection groove 104 (S122) It is possible to drill through a laser process.

4D, a solder paste 104a is applied to the connection groove 104 (S130), and a laminator process may be performed.

4E, the flexible semiconductor die 122 is die-bonded to the upper surface of the flexible strip substrate 110 using the connection member 124. (S140) One or more chips may be vertically stacked.

4F, a rigid adhesive 130 for bonding the flexible strip substrate 110 and the flexible semiconductor die 122 to the inside of the connection groove 104 in the package region P described above before die-molding after the die bonding, (S142)

Referring to FIG. 4G, the flexible semiconductor die 122 is die-molded to protect the flexible semiconductor die 122 (S150). The flexible region 126 is covered with the package region P to be molded. At this time, the mold may be provided with a bite member 140 which is filled with the bite hole 106 and connected to the back surface of the flexible strip substrate 110.

As described above, according to the present invention, when stress is concentrated mainly in the edge region, particularly in the connection region between the flexible semiconductor die and the flexible strip substrate when the flexible semiconductor package is bent or curved in the flexible package, It is understood that the technical idea is to construct a structure for strengthening the fastening force such as an adhesive or a fastening means to prevent cracks from occurring. Many other modifications will be possible to those skilled in the art, within the scope of the basic technical idea of the present invention.

100: flexible package 104: connection groove
106: fastening hole 110: flexible strip substrate
120: unit package 122: flexible semiconductor die
124: connecting member 126: soft mold
130: rigid adhesive 140: fastening member

Claims (10)

Wherein at least two unit packages are spaced apart from each other at regular intervals on a flexible strip substrate which is bent in both directions so that the smart device is bent freely when the portable device is mounted on a wearable smart device,
The unit package comprising a flexible semiconductor die on the flexible strip substrate, a plurality of connection members for coupling the flexible strip substrate and the flexible semiconductor die, and a soft mold for protecting the flexible semiconductor die,
The soft mold protects the side surface of the soft semiconductor die but does not exist between the unit packages so that a plurality of the unit packages are repeatedly disposed between the non- A continuous flexible package is constructed,
The flexible flexible strip substrate has a plurality of connection grooves formed on an upper surface thereof corresponding to the connection member, so that even if the continuous flexible package is bent, when the connection member is connected in a state of being inserted into the connection groove, The area of contact of the connecting member with the flexible strip substrate is enlarged to three sides from one side and the total contact area is increased so that the fastening force between the flexible strip substrate and the flexible package is increased and the stress is alleviated,
A rigid adhesive for connecting the flexible strip substrate and the soft semiconductor die is formed on an edge of the soft semiconductor die connected on the flexible strip substrate to prevent stress from concentrating on the edge when the flexible package is bent Features a flexible package. delete delete The method according to claim 1,
Wherein the connection groove is coated with a solder paste, and the connection member is a solder ball which is coupled to the connection pad of the flexible strip substrate through the solder paste. delete The method according to claim 1,
Wherein the rigid adhesive includes a polyimide adhesive. The method according to claim 6,
The mold is filled in the fastening hole at the time of mold processing by forming a fastening hole passing through the flexible strip substrate on the outer periphery of the flexible strip substrate on which the rigid adhesive is formed, So that a fastening member is provided. Preparing a flexible strip substrate;
Forming a plurality of connection grooves in a package region in which a unit package is formed on an upper surface of the flexible strip substrate;
Applying a solder paste to the connection groove;
A die bonding step in which a soft semiconductor die is bonded to an upper surface of the flexible strip substrate;
Forming a rigid adhesive on the edge of the soft semiconductor die connected to the flexible strip substrate; And
And a die mold step covering the soft mold protecting the soft semiconductor die,
Wherein at least two unit packages are spaced apart from each other at regular intervals on the flexible strip substrate which is bent in both directions so that when mounted on a wearable smart device, the smart device flexes freely,
The unit package comprising a flexible semiconductor die on the flexible strip substrate, a plurality of connection members for coupling the flexible strip substrate and the flexible semiconductor die, and the flexible mold for protecting the flexible semiconductor die,
The soft mold protects the side surface of the soft semiconductor die but does not exist between the unit packages so that a plurality of the unit packages are repeatedly disposed between the non- A continuous flexible package is constructed,
The flexible flexible strip substrate has a plurality of connection grooves formed on an upper surface thereof corresponding to the connection member, so that even if the continuous flexible package is bent, when the connection member is connected in a state of being inserted into the connection groove, The area of contact of the connecting member with the flexible strip substrate is enlarged to three sides from one side and the total contact area is increased so that the fastening force between the flexible strip substrate and the flexible package is increased and the stress is alleviated,
The rigid adhesive bonds the flexible strip substrate and the soft semiconductor die to the edge of the soft semiconductor die connected on the flexible strip substrate to prevent stress from concentrating on the edges when the continuous soft package bends Wherein the flexible package is manufactured by the method. delete 9. The method of claim 8,
Further comprising the step of forming a fastening hole passing through the flexible strip substrate at the outermost inner side of the package region before and after the connecting groove forming step.
KR1020150127098A 2015-09-08 2015-09-08 Flexible semiconductor package with stress relief structure at interconnects using adhesive, and manufacturing method thereof KR101716882B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020150127098A KR101716882B1 (en) 2015-09-08 2015-09-08 Flexible semiconductor package with stress relief structure at interconnects using adhesive, and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150127098A KR101716882B1 (en) 2015-09-08 2015-09-08 Flexible semiconductor package with stress relief structure at interconnects using adhesive, and manufacturing method thereof

Publications (1)

Publication Number Publication Date
KR101716882B1 true KR101716882B1 (en) 2017-03-15

Family

ID=58403054

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150127098A KR101716882B1 (en) 2015-09-08 2015-09-08 Flexible semiconductor package with stress relief structure at interconnects using adhesive, and manufacturing method thereof

Country Status (1)

Country Link
KR (1) KR101716882B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11348901B1 (en) 2020-11-30 2022-05-31 Sandisk Technologies Llc Interfacial tilt-resistant bonded assembly and methods for forming the same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07111438A (en) * 1993-10-08 1995-04-25 Hitachi Ltd Surface acoustic wave device and its production
JP2004071857A (en) * 2002-08-07 2004-03-04 Sharp Corp Structure of substrate connection part, electronic component having the structure and liquid crystal display device
KR20040029473A (en) * 2001-09-12 2004-04-06 니기소 가부시키가이샤 Circuit device mounting method and press
KR20040069172A (en) * 2003-01-28 2004-08-04 엘지전자 주식회사 Method for manufacturing flip-chip package
KR20150010209A (en) 2013-07-18 2015-01-28 하나 마이크론(주) Method of manufacturing flexible integrated circuit device package

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07111438A (en) * 1993-10-08 1995-04-25 Hitachi Ltd Surface acoustic wave device and its production
KR20040029473A (en) * 2001-09-12 2004-04-06 니기소 가부시키가이샤 Circuit device mounting method and press
JP2004071857A (en) * 2002-08-07 2004-03-04 Sharp Corp Structure of substrate connection part, electronic component having the structure and liquid crystal display device
KR20040069172A (en) * 2003-01-28 2004-08-04 엘지전자 주식회사 Method for manufacturing flip-chip package
KR20150010209A (en) 2013-07-18 2015-01-28 하나 마이크론(주) Method of manufacturing flexible integrated circuit device package

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11348901B1 (en) 2020-11-30 2022-05-31 Sandisk Technologies Llc Interfacial tilt-resistant bonded assembly and methods for forming the same
WO2022115128A1 (en) * 2020-11-30 2022-06-02 Sandisk Technologies Llc Interfacial tilt-resistant bonded assembly and methods for forming the same

Similar Documents

Publication Publication Date Title
US10431556B2 (en) Semiconductor device including semiconductor chips mounted over both surfaces of substrate
US7361972B2 (en) Chip packaging structure for improving reliability
US6816385B1 (en) Compliant laminate connector
US8106521B2 (en) Semiconductor device mounted structure with an underfill sealing-bonding resin with voids
US8123965B2 (en) Interconnect structure with stress buffering ability and the manufacturing method thereof
CN107978569B (en) Chip packaging structure and manufacturing method thereof
US20090127682A1 (en) Chip package structure and method of fabricating the same
US8811031B2 (en) Multichip module and method for manufacturing the same
JP2009278064A (en) Semiconductor device and method of manufacturing the same
US20170033039A1 (en) Semiconductor package and method of manufacturing the same
KR20140141474A (en) Semiconductor device
JP2016225462A (en) Semiconductor device
JP2002270717A (en) Semiconductor device
US8217517B2 (en) Semiconductor device provided with wire that electrically connects printed wiring board and semiconductor chip each other
US7821139B2 (en) Flip-chip assembly and method of manufacturing the same
KR101716882B1 (en) Flexible semiconductor package with stress relief structure at interconnects using adhesive, and manufacturing method thereof
US20210111093A1 (en) Heterogeneous Lid Seal Band for Structural Stability in Multiple Integrated Circuit (IC) Device Modules
JP2011023709A (en) Semiconductor device and method of manufacturing the same
US8050049B2 (en) Semiconductor device
US7732934B2 (en) Semiconductor device having conductive adhesive layer and method of fabricating the same
JP4942452B2 (en) Circuit equipment
US20190287942A1 (en) Semiconductor package having passive support wafer
CN107492527B (en) Stacked semiconductor packages with compliant corners
JP5078631B2 (en) Semiconductor device
KR101651272B1 (en) Flexible semiconductor package with stress relief structure at interconnects using anisotropic conductive adhesive

Legal Events

Date Code Title Description
GRNT Written decision to grant