TWI644738B - 基板洗淨裝置及基板處理裝置 - Google Patents

基板洗淨裝置及基板處理裝置 Download PDF

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Publication number
TWI644738B
TWI644738B TW103134163A TW103134163A TWI644738B TW I644738 B TWI644738 B TW I644738B TW 103134163 A TW103134163 A TW 103134163A TW 103134163 A TW103134163 A TW 103134163A TW I644738 B TWI644738 B TW I644738B
Authority
TW
Taiwan
Prior art keywords
substrate
arm
roller
cleaning device
drum
Prior art date
Application number
TW103134163A
Other languages
English (en)
Chinese (zh)
Other versions
TW201521888A (zh
Inventor
田中英明
Original Assignee
荏原製作所股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 荏原製作所股份有限公司 filed Critical 荏原製作所股份有限公司
Publication of TW201521888A publication Critical patent/TW201521888A/zh
Application granted granted Critical
Publication of TWI644738B publication Critical patent/TWI644738B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/34—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis parallel to the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW103134163A 2013-10-03 2014-10-01 基板洗淨裝置及基板處理裝置 TWI644738B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013208020A JP6279276B2 (ja) 2013-10-03 2013-10-03 基板洗浄装置及び基板処理装置
JP2013-208020 2013-10-03

Publications (2)

Publication Number Publication Date
TW201521888A TW201521888A (zh) 2015-06-16
TWI644738B true TWI644738B (zh) 2018-12-21

Family

ID=52777316

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103134163A TWI644738B (zh) 2013-10-03 2014-10-01 基板洗淨裝置及基板處理裝置

Country Status (5)

Country Link
US (1) US9773686B2 (enExample)
JP (1) JP6279276B2 (enExample)
KR (1) KR102219604B1 (enExample)
CN (2) CN109037106B (enExample)
TW (1) TWI644738B (enExample)

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JP6328577B2 (ja) * 2015-02-24 2018-05-23 株式会社荏原製作所 荷重測定装置および荷重測定方法
US10269555B2 (en) * 2015-09-30 2019-04-23 Taiwan Semiconductor Manufacturing Company, Ltd. Post-CMP cleaning and apparatus
CN105478428B (zh) * 2015-11-30 2017-12-12 武汉精测电子技术股份有限公司 滚筒式除尘装置
JP6661453B2 (ja) * 2016-04-20 2020-03-11 株式会社ディスコ 洗浄装置
JP6941464B2 (ja) * 2017-04-07 2021-09-29 株式会社荏原製作所 基板洗浄装置及び基板処理装置
JP6974067B2 (ja) * 2017-08-17 2021-12-01 株式会社荏原製作所 基板を研磨する方法および装置
CN108655040A (zh) * 2018-03-15 2018-10-16 金东纸业（江苏）股份有限公司 一种施胶辊的清洁装置及一种造纸机
JP7079164B2 (ja) * 2018-07-06 2022-06-01 株式会社荏原製作所 基板洗浄装置および基板洗浄方法
CN111162201A (zh) * 2018-11-08 2020-05-15 陕西坤同半导体科技有限公司 柔性组件清洁方法及清洁设备
KR102788872B1 (ko) 2020-05-21 2025-03-31 삼성전자주식회사 틸팅 가능한 롤 브러쉬를 갖는 기판 세정 장치
CN113658886B (zh) * 2021-08-13 2023-09-26 长鑫存储技术有限公司 基板清洗装置及其基板清洗方法
CN113467199B (zh) * 2021-09-06 2021-11-12 宁波润华全芯微电子设备有限公司 一种便于拆卸的防止反溅液体污染晶圆的装置
KR20230101187A (ko) * 2021-12-29 2023-07-06 삼성전자주식회사 기판 세정 장치 및 기판 세정 방법
CN114887976B (zh) * 2022-05-25 2024-01-23 宁波芯丰精密科技有限公司 一种清洁装置
JP2024091092A (ja) * 2022-12-23 2024-07-04 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置および基板洗浄方法
CN117443832B (zh) * 2023-11-24 2025-07-29 池州首开新材料有限公司 一种硅片清洗干燥设备及清洗干燥方法

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JPH0969502A (ja) * 1995-08-31 1997-03-11 Shibaura Eng Works Co Ltd 洗浄装置
US6427566B1 (en) * 2000-03-31 2002-08-06 Lam Research Corporation Self-aligning cylindrical mandrel assembly and wafer preparation apparatus including the same
US6546941B1 (en) * 1999-02-05 2003-04-15 Sony Corporation Wafer cleaning device, wafer cleaning method and chemical mechanical polishing machine
US20050183754A1 (en) * 2004-02-13 2005-08-25 Yoshikazu Kago Apparatus for and method of cleaning substrate
CN1835658A (zh) * 2005-03-14 2006-09-20 小松电子株式会社 基板清洗装置及具有基板清洗装置的基板供给装置
TW201335987A (zh) * 2012-02-23 2013-09-01 Ebara Corp 基板洗淨方法

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JP5878441B2 (ja) 2012-08-20 2016-03-08 株式会社荏原製作所 基板洗浄装置及び基板処理装置
JP6140051B2 (ja) * 2013-10-23 2017-05-31 株式会社荏原製作所 研磨方法および研磨装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0969502A (ja) * 1995-08-31 1997-03-11 Shibaura Eng Works Co Ltd 洗浄装置
US6546941B1 (en) * 1999-02-05 2003-04-15 Sony Corporation Wafer cleaning device, wafer cleaning method and chemical mechanical polishing machine
US6427566B1 (en) * 2000-03-31 2002-08-06 Lam Research Corporation Self-aligning cylindrical mandrel assembly and wafer preparation apparatus including the same
US20050183754A1 (en) * 2004-02-13 2005-08-25 Yoshikazu Kago Apparatus for and method of cleaning substrate
CN1835658A (zh) * 2005-03-14 2006-09-20 小松电子株式会社 基板清洗装置及具有基板清洗装置的基板供给装置
TW201335987A (zh) * 2012-02-23 2013-09-01 Ebara Corp 基板洗淨方法

Also Published As

Publication number Publication date
CN104517808A (zh) 2015-04-15
TW201521888A (zh) 2015-06-16
JP2015073016A (ja) 2015-04-16
CN109037106A (zh) 2018-12-18
US20150099433A1 (en) 2015-04-09
KR102219604B1 (ko) 2021-02-25
CN104517808B (zh) 2019-10-11
JP6279276B2 (ja) 2018-02-14
CN109037106B (zh) 2022-03-18
KR20150039681A (ko) 2015-04-13
US9773686B2 (en) 2017-09-26

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