TWI644374B - 用於接合半導體元件的熱壓接合系統及其操作方法 - Google Patents

用於接合半導體元件的熱壓接合系統及其操作方法 Download PDF

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Publication number
TWI644374B
TWI644374B TW104106036A TW104106036A TWI644374B TW I644374 B TWI644374 B TW I644374B TW 104106036 A TW104106036 A TW 104106036A TW 104106036 A TW104106036 A TW 104106036A TW I644374 B TWI644374 B TW I644374B
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TW
Taiwan
Prior art keywords
control valve
cooling fluid
thermocompression bonding
pressurized
fluid
Prior art date
Application number
TW104106036A
Other languages
English (en)
Chinese (zh)
Other versions
TW201533820A (zh
Inventor
Matthew B. Wasserman
馬修Ｂ 沃瑟曼
Original Assignee
Kulicke And Soffa Industries, Inc.
美商庫利克和索夫工業公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Kulicke And Soffa Industries, Inc., 美商庫利克和索夫工業公司 filed Critical Kulicke And Soffa Industries, Inc.
Publication of TW201533820A publication Critical patent/TW201533820A/zh
Application granted granted Critical
Publication of TWI644374B publication Critical patent/TWI644374B/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating processes for reflow soldering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0475—Molten solder just before placing the component
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/016—Manufacture or treatment of strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07152—Means for cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07183—Means for monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07188—Apparatus chuck
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07232—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
TW104106036A 2014-02-28 2015-02-25 用於接合半導體元件的熱壓接合系統及其操作方法 TWI644374B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201461945916P 2014-02-28 2014-02-28
US61/945,916 2014-02-28

Publications (2)

Publication Number Publication Date
TW201533820A TW201533820A (zh) 2015-09-01
TWI644374B true TWI644374B (zh) 2018-12-11

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW104106036A TWI644374B (zh) 2014-02-28 2015-02-25 用於接合半導體元件的熱壓接合系統及其操作方法

Country Status (5)

Country Link
US (2) US9659902B2 (https=)
JP (1) JP6568671B2 (https=)
KR (1) KR102332745B1 (https=)
CN (1) CN104882387B (https=)
TW (1) TWI644374B (https=)

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* Cited by examiner, † Cited by third party
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US10245668B2 (en) * 2016-10-31 2019-04-02 Kulicke And Soffa Industries, Inc Fluxing systems, bonding machines including fluxing systems, and methods of operating the same
EP3340287B1 (en) * 2016-12-23 2020-10-28 Huawei Technologies Co., Ltd. Pattern-based temperature measurement for a bonding device and a bonding system
JP2018147911A (ja) * 2017-03-01 2018-09-20 東レエンジニアリング株式会社 ボンディングヘッド冷却システムおよびこれを備えた実装装置ならびに実装方法
EP3808860B1 (en) * 2018-07-06 2023-11-08 Shanghai Joulead Electric Co., Ltd Inductive hot crimping apparatus
US11784160B2 (en) * 2020-09-23 2023-10-10 International Business Machines Corporation Asymmetric die bonding
CN112462221B (zh) * 2020-11-05 2022-06-17 清华大学 一种用于压接式半导体的高温老化失效的模拟测试装置
US12431404B2 (en) 2020-11-13 2025-09-30 International Business Machines Corporation Fatigue failure resistant electronic package
KR102604789B1 (ko) * 2020-11-30 2023-11-21 세메스 주식회사 히터 조립체 및 이를 포함하는 본딩 헤드
KR20220153723A (ko) * 2021-05-11 2022-11-21 삼성디스플레이 주식회사 표시 장치의 제조장치 및 표시 장치의 제조방법
TWI787036B (zh) * 2022-01-04 2022-12-11 萬潤科技股份有限公司 散熱片壓合方法及裝置
JP7812734B2 (ja) * 2022-05-20 2026-02-10 芝浦メカトロニクス株式会社 実装装置及び実装方法
US12456709B2 (en) * 2022-12-28 2025-10-28 International Business Machines Corporation Structures and processes for void-free hybrid bonding
CN121035013B (zh) * 2025-08-26 2026-03-24 常熟市兆恒众力精密机械有限公司北京分公司 温度控制方法及电子设备

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US20020092887A1 (en) * 2001-01-17 2002-07-18 Naoto Hosotani Bonding head and component mounting apparatus
TW201248750A (en) * 2011-05-27 2012-12-01 Toray Eng Co Ltd Mounting method and mounting device
TW201336606A (zh) * 2012-03-13 2013-09-16 印能科技有限公司 晶片壓合裝置及方法
US20130292455A1 (en) * 2012-05-03 2013-11-07 International Business Machines Corporation Flip chip assembly apparatus employing a warpage-suppressor assembly
TW201405731A (zh) * 2012-07-20 2014-02-01 新川股份有限公司 接合裝置用加熱器及其冷卻方法

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Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020092887A1 (en) * 2001-01-17 2002-07-18 Naoto Hosotani Bonding head and component mounting apparatus
TW201248750A (en) * 2011-05-27 2012-12-01 Toray Eng Co Ltd Mounting method and mounting device
TW201336606A (zh) * 2012-03-13 2013-09-16 印能科技有限公司 晶片壓合裝置及方法
US20130292455A1 (en) * 2012-05-03 2013-11-07 International Business Machines Corporation Flip chip assembly apparatus employing a warpage-suppressor assembly
TW201405731A (zh) * 2012-07-20 2014-02-01 新川股份有限公司 接合裝置用加熱器及其冷卻方法

Also Published As

Publication number Publication date
CN104882387B (zh) 2018-12-11
TW201533820A (zh) 2015-09-01
US20150249027A1 (en) 2015-09-03
US20170221854A1 (en) 2017-08-03
US9659902B2 (en) 2017-05-23
JP6568671B2 (ja) 2019-08-28
KR20150102739A (ko) 2015-09-07
US9780066B2 (en) 2017-10-03
CN104882387A (zh) 2015-09-02
KR102332745B1 (ko) 2021-11-30
JP2015165566A (ja) 2015-09-17

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