JP6862015B2 - 実装装置 - Google Patents
実装装置 Download PDFInfo
- Publication number
- JP6862015B2 JP6862015B2 JP2019544995A JP2019544995A JP6862015B2 JP 6862015 B2 JP6862015 B2 JP 6862015B2 JP 2019544995 A JP2019544995 A JP 2019544995A JP 2019544995 A JP2019544995 A JP 2019544995A JP 6862015 B2 JP6862015 B2 JP 6862015B2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- mounting
- chip component
- temporary placement
- stage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 claims description 71
- 230000032258 transport Effects 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 description 30
- 238000002788 crimping Methods 0.000 description 14
- 238000001514 detection method Methods 0.000 description 13
- 238000001816 cooling Methods 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 6
- 230000004075 alteration Effects 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0417—Feeding with belts or tapes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0478—Simultaneously mounting of different components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/731—Location prior to the connecting process
- H01L2224/73101—Location prior to the connecting process on the same surface
- H01L2224/73103—Bump and layer connectors
- H01L2224/73104—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Wire Bonding (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
Claims (3)
- 基板にチップ部品を実装する実装装置であって、
前記チップ部品が複数載置される仮置きステージと、
前記仮置きステージに前記チップ部品を搬送すると共に、複数の前記チップ部品の相対位置が予め定められた位置になるように前記各チップ部品を前記仮置きステージに載置する搬送ヘッドと、
前記基板を吸着固定する実装ステージと、
前記仮置きステージに載置された複数の前記チップ部品であるチップ部品組を吸着し、前記実装ステージに吸着固定されている前記基板の所定位置に前記相対位置を保って加圧し、固定する実装ヘッドと、
を備え、
前記実装ヘッドが前記基板にチップ部品組を固定している間に、前記搬送ヘッドが、次に前記基板へ固定予定のチップ部品組を構成する複数の前記チップ部品を前記仮置きステージに載置し、
前記実装ヘッドが、前記基板へチップ部品組を固定した後、次に固定予定のチップ部品組を吸着するために前記仮置きステージへ向かう際には、前記搬送ヘッドによる当該チップ部品組の前記仮置きステージへの載置が完了するように、チップ部品組を構成する前記チップ部品の数が決められていること、
を特徴とする実装装置。 - 請求項1に記載の実装装置において、
前記仮置きステージは、前記チップ部品を真空吸着する上面を有し、
前記上面は、第1の多孔質部材によって形成され、
前記第1の多孔質部材は、前記上面に載置される前記チップ部品の各辺の長さよりも短い間隔で吸引孔を有すること、
を特徴とする実装装置。 - 請求項1または2に記載の実装装置において、
前記実装ヘッドは、複数の前記チップ部品を真空吸着する吸着面を有し、
前記吸着面は、第2の多孔質部材によって形成され、
前記第2の多孔質部材は、前記吸着面に吸着される各チップ部品の各辺の長さよりも短い間隔で吸引孔を有すること、
を特徴とする実装装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017190058 | 2017-09-29 | ||
JP2017190058 | 2017-09-29 | ||
PCT/JP2018/034575 WO2019065394A1 (ja) | 2017-09-29 | 2018-09-19 | 実装装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2019065394A1 JPWO2019065394A1 (ja) | 2020-07-30 |
JP6862015B2 true JP6862015B2 (ja) | 2021-04-21 |
Family
ID=65901359
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019544995A Active JP6862015B2 (ja) | 2017-09-29 | 2018-09-19 | 実装装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US11172600B2 (ja) |
JP (1) | JP6862015B2 (ja) |
KR (1) | KR102372519B1 (ja) |
CN (1) | CN111344849B (ja) |
SG (1) | SG11202005070UA (ja) |
TW (1) | TWI746888B (ja) |
WO (1) | WO2019065394A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7349599B2 (ja) * | 2019-10-09 | 2023-09-25 | パナソニックIpマネジメント株式会社 | 仮置きステージ、部品搭載装置および照明装置 |
JP7417808B2 (ja) * | 2019-10-09 | 2024-01-19 | パナソニックIpマネジメント株式会社 | 仮置きステージおよび部品搭載装置 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2968697B2 (ja) * | 1994-11-29 | 1999-10-25 | シーケーディ株式会社 | 軸受け、実装機の真空吸着装置、lcd搬送機の真空吸着装置 |
JP3334505B2 (ja) * | 1996-08-22 | 2002-10-15 | 株式会社村田製作所 | チップ状電子部品の実装方法 |
JP3750433B2 (ja) * | 1999-08-26 | 2006-03-01 | 松下電器産業株式会社 | 電子部品の実装装置および実装方法 |
JP2002093826A (ja) * | 2000-09-18 | 2002-03-29 | Sony Corp | 半導体の製造装置およびその製造方法 |
JP2009200377A (ja) * | 2008-02-25 | 2009-09-03 | Panasonic Corp | ダイボンディング装置 |
JP2010073924A (ja) * | 2008-09-19 | 2010-04-02 | Panasonic Corp | 部品実装装置 |
JP2010245412A (ja) | 2009-04-09 | 2010-10-28 | Renesas Electronics Corp | 半導体集積回路装置の製造方法 |
JP4811499B2 (ja) * | 2009-06-02 | 2011-11-09 | パナソニック株式会社 | 部品実装装置 |
JP5930728B2 (ja) * | 2012-01-19 | 2016-06-08 | 富士機械製造株式会社 | 部品実装装置 |
KR102231293B1 (ko) * | 2014-02-10 | 2021-03-23 | 삼성전자주식회사 | 다이 본딩 장치 |
JP6374189B2 (ja) * | 2014-03-17 | 2018-08-15 | ファスフォードテクノロジ株式会社 | ダイボンダ及びボンディング方法 |
JP6490522B2 (ja) | 2015-07-14 | 2019-03-27 | 東レエンジニアリング株式会社 | 半導体実装装置 |
JP6584234B2 (ja) | 2015-08-31 | 2019-10-02 | ファスフォードテクノロジ株式会社 | ダイボンダ、ボンディング方法および半導体装置の製造方法 |
JP2017059736A (ja) * | 2015-09-18 | 2017-03-23 | 芝浦メカトロニクス株式会社 | 半導体チップの実装装置 |
JP6605946B2 (ja) | 2015-12-24 | 2019-11-13 | 株式会社ディスコ | チップ収容トレイからチップをピックアップする方法 |
TWM543457U (zh) | 2017-01-23 | 2017-06-11 | Mattech International Co Ltd | 多晶粒壓合機 |
-
2018
- 2018-09-19 KR KR1020207011461A patent/KR102372519B1/ko active IP Right Grant
- 2018-09-19 US US16/651,339 patent/US11172600B2/en active Active
- 2018-09-19 SG SG11202005070UA patent/SG11202005070UA/en unknown
- 2018-09-19 JP JP2019544995A patent/JP6862015B2/ja active Active
- 2018-09-19 WO PCT/JP2018/034575 patent/WO2019065394A1/ja active Application Filing
- 2018-09-19 CN CN201880072940.8A patent/CN111344849B/zh active Active
- 2018-09-27 TW TW107133940A patent/TWI746888B/zh active
Also Published As
Publication number | Publication date |
---|---|
TW201921525A (zh) | 2019-06-01 |
JPWO2019065394A1 (ja) | 2020-07-30 |
US11172600B2 (en) | 2021-11-09 |
WO2019065394A1 (ja) | 2019-04-04 |
KR102372519B1 (ko) | 2022-03-10 |
SG11202005070UA (en) | 2020-06-29 |
KR20200057737A (ko) | 2020-05-26 |
TWI746888B (zh) | 2021-11-21 |
CN111344849A (zh) | 2020-06-26 |
US20210251112A1 (en) | 2021-08-12 |
CN111344849B (zh) | 2023-09-08 |
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