SG11202005070UA - Mounting device - Google Patents

Mounting device

Info

Publication number
SG11202005070UA
SG11202005070UA SG11202005070UA SG11202005070UA SG11202005070UA SG 11202005070U A SG11202005070U A SG 11202005070UA SG 11202005070U A SG11202005070U A SG 11202005070UA SG 11202005070U A SG11202005070U A SG 11202005070UA SG 11202005070U A SG11202005070U A SG 11202005070UA
Authority
SG
Singapore
Prior art keywords
mounting device
mounting
Prior art date
Application number
SG11202005070UA
Inventor
Tomonori Nakamura
Toru Maeda
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of SG11202005070UA publication Critical patent/SG11202005070UA/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0478—Simultaneously mounting of different components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/731—Location prior to the connecting process
    • H01L2224/73101—Location prior to the connecting process on the same surface
    • H01L2224/73103—Bump and layer connectors
    • H01L2224/73104—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG11202005070UA 2017-09-29 2018-09-19 Mounting device SG11202005070UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017190058 2017-09-29
PCT/JP2018/034575 WO2019065394A1 (en) 2017-09-29 2018-09-19 Mounting device

Publications (1)

Publication Number Publication Date
SG11202005070UA true SG11202005070UA (en) 2020-06-29

Family

ID=65901359

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202005070UA SG11202005070UA (en) 2017-09-29 2018-09-19 Mounting device

Country Status (7)

Country Link
US (1) US11172600B2 (en)
JP (1) JP6862015B2 (en)
KR (1) KR102372519B1 (en)
CN (1) CN111344849B (en)
SG (1) SG11202005070UA (en)
TW (1) TWI746888B (en)
WO (1) WO2019065394A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7417808B2 (en) * 2019-10-09 2024-01-19 パナソニックＩｐマネジメント株式会社 Temporary storage stage and component mounting device
JP7349599B2 (en) * 2019-10-09 2023-09-25 パナソニックＩｐマネジメント株式会社 Temporary storage stage, component mounting equipment, and lighting equipment

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2968697B2 (en) 1994-11-29 1999-10-25 シーケーディ株式会社 Bearings, vacuum suction devices for mounting machines, vacuum suction devices for LCD transport machines
JP3334505B2 (en) * 1996-08-22 2002-10-15 株式会社村田製作所 Mounting method of chip-shaped electronic components
JP3750433B2 (en) * 1999-08-26 2006-03-01 松下電器産業株式会社 Electronic component mounting apparatus and mounting method
JP2002093826A (en) 2000-09-18 2002-03-29 Sony Corp Apparatus and method for manufacturing semiconductor
JP2009200377A (en) * 2008-02-25 2009-09-03 Panasonic Corp Die bonding device
JP2010073924A (en) * 2008-09-19 2010-04-02 Panasonic Corp Component packaging apparatus
JP2010245412A (en) 2009-04-09 2010-10-28 Renesas Electronics Corp Method of manufacturing semiconductor integrated circuit device
JP4811499B2 (en) * 2009-06-02 2011-11-09 パナソニック株式会社 Component mounting equipment
JP5930728B2 (en) * 2012-01-19 2016-06-08 富士機械製造株式会社 Component mounting equipment
KR102231293B1 (en) * 2014-02-10 2021-03-23 삼성전자주식회사 Die bonding apparatus
JP6374189B2 (en) * 2014-03-17 2018-08-15 ファスフォードテクノロジ株式会社 Die bonder and bonding method
JP6490522B2 (en) 2015-07-14 2019-03-27 東レエンジニアリング株式会社 Semiconductor mounting equipment
JP6584234B2 (en) 2015-08-31 2019-10-02 ファスフォードテクノロジ株式会社 Die bonder, bonding method and semiconductor device manufacturing method
JP2017059736A (en) * 2015-09-18 2017-03-23 芝浦メカトロニクス株式会社 Semiconductor chip mounting device
JP6605946B2 (en) 2015-12-24 2019-11-13 株式会社ディスコ Method for picking up chips from the chip storage tray
TWM543457U (en) 2017-01-23 2017-06-11 Mattech International Co Ltd Multi-grain Pressing machine

Also Published As

Publication number Publication date
KR102372519B1 (en) 2022-03-10
US20210251112A1 (en) 2021-08-12
CN111344849A (en) 2020-06-26
CN111344849B (en) 2023-09-08
KR20200057737A (en) 2020-05-26
TW201921525A (en) 2019-06-01
JP6862015B2 (en) 2021-04-21
US11172600B2 (en) 2021-11-09
WO2019065394A1 (en) 2019-04-04
TWI746888B (en) 2021-11-21
JPWO2019065394A1 (en) 2020-07-30

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