JP2002093826A - Apparatus and method for manufacturing semiconductor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus for manufacturing a semiconductor that can efficiently package the chip of the semiconductor in a module, and to provide a manufacturing method of the semiconductor. SOLUTION: This manufacturing apparatus of the semiconductor for collectively packaging a plurality of chips in a single module has a rotary-type index table, that can load a plurality of wafers containing the chips. In this case, the plurality of chips, selected from among the index tales, can be transferred to the module for collectively joining to the module.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a semiconductor manufacturing apparatus and a semiconductor manufacturing method capable of efficiently mounting a semiconductor chip on a module.

[0002]

2. Description of the Related Art Semiconductor integrated circuits have become larger and larger due to advances in design technology. On the other hand, there is a strong demand for miniaturization and high-speed operation. A so-called MCM (Multichip Module) in which chips are mounted at a high density in a naked state and constitute one functional unit and packaged.
The package is in the spotlight.

As shown in FIG. 5, a schematic assembling process of this MCM package is as follows. First, a semiconductor element is formed on the front side of a semiconductor wafer in a wafer process ST1. After sticking and dicing, the pressure-sensitive adhesive of the pressure-sensitive adhesive sheet remaining on the back surface of the semiconductor element is cleaned with ultraviolet light to make the back surface of the semiconductor element clean.

Thereafter, in a die bonding step ST3, the semiconductor chip divided in the dicing step ST2 is
For example, bonding is performed on the die pad in the center of the lead frame using an adhesive between the bipad and the semiconductor chip.

[0005] Next, in a wire bonding step ST4, a bonding pad provided on the surface of the semiconductor chip and a tip end of an inner lead formed on a lead frame are connected by a wire.

Next, in a resin sealing step ST5, the inner leads, the die pad, the semiconductor chip, and the wires are sealed with a resin to form a package, and then the outer lead portions of the lead frame are formed to form a semiconductor device.

The MCM is formed as described above.
As shown in FIG. 6, in the die bonding step ST3 of the semiconductor assembling step, as shown in FIG. 6, in order to share equipment with a normal single package, a plurality of processings are performed while repeatedly replacing and exchanging wafers. And here, it is mounted on the lead frame.

The die bonding apparatus 10 for performing die bonding in the die bonding step ST3 includes a loader 12 on which a diced wafer 11 is loaded,
A lead frame 14 mounted on a base 13, a vertical movement unit 16 mounted on an XY table 15, and an XY direction drive motor 17 mounted on the vertical movement unit 16.
And a bonding head 19 for attaching the collet 18
And a camera 20 for determining a mounting position.

Next, the operation of the die bonding apparatus 10 will be described. First, a predetermined chip of the wafer 11 previously mounted on the loader 12 is bonded to a bonding head 19.
Is vacuum-adsorbed by the collet 18 attached to the tip of the lead frame, is conveyed onto the lead frame 14, and is fixed at a predetermined position.

In this case, the position of the chip to be detected and mounted is determined by a collet using an XY direction drive motor 17 and a vertical movement unit 16 based on a position determined by an image processing device (not shown) using an image taken by the camera 20. 18 is performed.

In the above operation, the wafer 11 is repeatedly mounted on the loader 12 as many times as the number of chips that need to be integrated into one functional unit as an MCM, and is conveyed onto the lead frame 14 every time the wafer is mounted. It will stick to the position.

[0012]

However, in the semiconductor manufacturing apparatus and the manufacturing method described above, in order to share equipment with an ordinary single package, a chip packaged as one functional unit on a lead frame is used. The same number of wafers as the number of wafers need to be repeatedly set on the loader, transferred to the lead frame, and then unloaded onto the lead frame, which requires a lot of time and productivity when manufacturing semiconductors as modules. There is a problem that it becomes a factor which lowers.

[0013]

SUMMARY OF THE INVENTION The present invention, as a configuration of a semiconductor manufacturing apparatus for solving the above problems, is a semiconductor manufacturing apparatus in which a plurality of chips are collectively mounted on a single module. It has a rotary index table capable of loading a plurality of wafers containing chips, and a plurality of chips selected from the index table can be transferred to the module and joined to the module at once. Things.

According to the present invention, there is provided a semiconductor manufacturing method for mounting in a die bonding step in a semiconductor assembling step, wherein a predetermined functional unit is configured. A plurality of wafers including chips are loaded on a rotary index table, and the chips picked up from the respective wafers are arranged on the intermediate stage as pseudo chips using a pickup unit. The module is unloaded at a predetermined position of the module using a nozzle.

According to the present invention, the number of wafers corresponding to the number of predetermined chips to be collectively mounted on the module can be collectively loaded in the index table by the configuration of the semiconductor manufacturing apparatus described above. Simply rotate the index table to select the required number of chips and mount them on the module.
M can be manufactured.

Further, according to the present invention, the number of wafers corresponding to the number of predetermined chips to be mounted on a module at one time is loaded into an index table and loaded by using the configuration of the semiconductor manufacturing method. Pseudo chips including a predetermined number of chips are arranged in the intermediate stage, and the arranged pseudo chips can be collectively arranged and fixed at predetermined positions of the module, so that loading and unloading are collectively processed. MCM can be manufactured efficiently.

Further, the semiconductor manufacturing apparatus according to the present invention is provided with a pickup unit capable of three-dimensionally moving, adsorbing a chip on an index table by a suction collet, and reversing and transferring the chip; A first camera as an image input device for judging the quality of chips picked up by the pickup unit; a transparent inspection table on which chips on the index table are transferred using the pickup unit; An intermediate stage having a suction nozzle that determines a mounting position on the module from position information obtained by monitoring the outer shape or pattern of the chip with a second camera from below the inspection table and moves by suction; Pseudo chip with multiple chips from each wafer on index table Having an unloader stage on which a module can be mounted and moved in a two-dimensional direction to read position information; and that the module includes at least a wafer, a circuit board, or a lead frame. Including.

In the method of manufacturing a semiconductor according to the present invention, the chip on the index table is sucked by the pick-up unit by the suction collet to invert the chip; the predetermined position is located on the bottom of the transparent inspection table in the intermediate stage. As an additional requirement, determination based on position information of the outer shape or pattern of the pseudo chip obtained by using the provided camera is included.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a semiconductor manufacturing apparatus and a manufacturing method according to the present invention will be described below with reference to the drawings. FIG. 1 is an overall configuration diagram schematically showing one embodiment of the present invention.

In the disk-shaped index table 30,
A rotation hole 32 into which a rotation shaft (not shown) for transmitting power by the rotation motor 31 is inserted at the center thereof,
Between the rotary hole 32 and the peripheral surface of the index table 30, there are provided, in this case, concave and substantially circular wafer placement portions 33 to 36 for loading four wafers.

These wafer placement units 33 to 36 include:
Pre-diced wafers 37A, 37B, 37C, 37D including chips to be finally mounted on one pseudo chip, for example, chips A1, B1, C1, D1, etc., are pre-loaded.

Then, these wafers 37A, 37
In B, 37C and 37D, the thickness is made constant in advance, but the thickness is generally made constant by polishing the back surface, that is, the surface on which no device is formed.

Further, in the inspection process performed in the previous process,
Each chip in the wafer is inspected for pass / fail, and a defective chip is marked with a cross, so that the pass / fail of the chip can be easily determined by image processing in a later process.

Since this case shows a case where four chips are collectively mounted on one module as a pseudo chip, the index table 30 is provided with four wafer placement units 33 to 36. However, this number is arbitrarily changed according to the number mounted on the pseudo chip at one time.

A holding member 38 having a rectangular cross section is disposed above a wafer at a predetermined rotation position of the index table 30, for example, the wafer 37A, and is spaced apart from the wafer 37A. A moving groove 39 is formed along the moving groove 3.
The head 40 which is engaged with and moves is held.

A pickup unit 42 for fixing a suction collet 41 for suctioning a chip with a vacuum pressure on the head 40.
Is mounted so as to be rotatable up and down, and the head 40 rotates the pickup unit 42 so that the suction collet 41 is turned upside down as necessary, so that the device surface of the chip is the lower surface, whereby the chip is face down. It can also correspond to the case of implementation in the form.

The moving member 43 is fixed to the holding member 38 so as to cover the wafer 37A at right angles to the horizontal plane.
The moving member 43 moves with the holding member 38 in the axial direction of the moving member 43 by the rotation of the rotary motor 45 fixed to the base plate 44 that is erected.

Inside the moving member 43, for example, a spiral rod 46 formed in a spiral shape is screwed with the moving member 43 at the center, and is further erected on the base plate 44, and has a diagonal line in the cross section of the moving member 43. Holding rods 43A, 43 arranged in
B is inserted slidably through the moving member 43.

When the rotary motor 45 is rotated, the spiral rod 46 is rotated, and the holding rods 43A, 43B
Is used as a guide to slide the moving member 3 together with the holding member 38.
8 in the axial direction.

Further, the first camera 47 takes an image for judging the quality of the chip sucked by the suction collet 41 based on the presence or absence of the X mark and determining the position of the chip. Opposite to the collet 41, it is fixed to the base plate 44 by a holding member 47A or the like.

The intermediate stage 48 has a transparent inspection table 49 on which the chip sucked by the suction collet 41 is mounted, and determines the position of the chip by imaging the external shape or pattern of the mounted chip from the bottom of the inspection table 49. And a suction nozzle 51.

The suction nozzle 51 is disposed above the inspection table 49 so as to face the inspection table 49. The suction nozzle 51 is positioned via an upper head 52 and an arm 53 bent and extended by the head 52. It is connected to the control unit 54.

Further, the suction nozzle 51 has a flat collet shape, and is provided with two suction nozzles 51A having a function of sucking a wide area and a suction nozzle 51B having a function of sucking a narrow area. For example, one of these is prepared in a stock tray 55 located in front of the position control unit 54.

The suction nozzles 51A and 51A
B is prepared by preparing two systems of pneumatic circuits so that the suction nozzles 51 are retracted and the stock tray 55 is retracted.
In, for example, it can be replaced by controlling the pneumatic circuit from the head section 52.

Alternatively, even if the replacement is not performed using the stock tray 55, the suction nozzles of both the wide range and the narrow range are integrally held, and the two pneumatic circuits are combined with the suction nozzles 51A of the wide range and the suction nozzles of the narrow range. It can also be realized by switching to 51B.

The position control unit 54 includes an XY table 5
6 and an XY-direction drive motor 58 mounted on the vertical movement unit 57. Based on position information captured by the second camera 50,
In cooperation with the control computer 59, the position where the chip is sucked and transferred by the suction nozzle 51 is roughly determined.

The intermediate stage 48 is moved by the pickup unit 42 to the wafers 37A, 37B, 37B.
For example, chip A picked up from C and 37D
In the face-down type, 1, B1, C1, and D1 are inverted by the pickup unit 42, suctioned by the suction nozzle 51B, and transferred one after another onto the inspection table 49, and when face-up is performed, the inspection table is left as it is. 49, and the numbers to be finally incorporated into one module are arranged as one group and arranged as a pseudo chip 60.

The pseudo chips 60 arranged as described above
Is a suction nozzle 51A by which the suction nozzle 51 can be suctioned over a wide range by the stock tray 55 by the position control unit 54.
Or the air circuit is switched to another, and further, the suction nozzle 51A is operated by the position control unit 54 to be positioned on the disk-shaped silicon wafer 62 mounted on the unloader stage 61. As shown, the pseudo chips 60 on which A1 to D1 are arranged are collectively placed.

In the unloader stage 61, a disk-shaped silicon wafer 62 is fixed on a square stage 63, and rectangular moving blocks 64, 65 are fixed on two side surfaces of the stage 63. I have.

The moving blocks 64 and 65 have, for example, helical rods rotated by drive motors 66 and 67 inserted therein, respectively, and the moving blocks 64 and 65 screwed to these helical rods are driven by the drive motor 66. , 67, the two-dimensional movement of the X-axis and the Y-axis is performed, respectively, and these have a length scale (not shown) so that the position can be accurately determined. Can be mounted.

Thus, the silicon wafer 6 can be accurately formed.
After being mounted at the second predetermined position, bonding is performed collectively for each of the pseudo chips 60 in which a plurality of chips are put together, and can be mounted on the silicon wafer 62 as one module.

The control computer 59 controls the rotation of the rotation motor 31, the pickup unit 42, the rotation motor 45, the first camera 47, the second camera 50, the position control unit 54, and the drive motors 66 and 67.
It comprehensively manages position control, image processing, air pressure control for suction, etc., including sequence control.

Next, the operation of the semiconductor manufacturing apparatus 68 having the above-described structure and its operation will be described with reference to the flowchart shown in FIG. 2. In this case, four face-down type chips are used. The case where the pseudo chips 60 arranged collectively are mounted on the unloader stage 61 will be described as an example.

First, as a stage prior to the die bonding step, a wafer 37 including chips A1, B1, C1, D1, etc. arranged as pseudo chips 60 in the intermediate stage 48.
A, 37B, 37C and 37D are diced in advance for each chip.

Then, these wafers 37A to 37D
The device surface, which is the back surface of the wafer, is polished to a certain thickness by polishing. Each chip in the wafer is inspected beforehand for pass / fail, and defective chips are marked with a cross.

In the above state, in step ST6,
A predetermined number, in this case, four wafers 37A, 37B, 37C, and 37D are loaded in the index table 30 into the wafer placement units 33 to 36 with the device surface facing upward.

Next, in step ST7, the index table 30 is rotated by the rotation motor 31 under the control of the control computer 59, so that the wafer 37A having the chip A1 to be mounted first is mounted on the pickup unit 42. It stops at the position where it comes above the member 38.

Thereafter, the process proceeds to step ST8, where the pickup unit 42 fixed to the head 40 is moved above the wafer 37A including the chip A1 under the control of the control computer 59.

In step ST9, under the control of the control computer 59, the suction collet 41 held by the pickup unit 42 is three-dimensionally moved onto the chip A1, and the suction collet 41 sucks the chip A1. Is moved below the first camera 47.

Thereafter, in step ST10, the pickup unit 42 is rotated to invert the suction collet 41 upward to turn the chip A1 upward, so that the device surface of the chip A1 is lower and the back surface is higher. .

Next, in step ST11, the presence or absence of the X mark described on the surface of the chip A1 is inspected by the first camera 47, and the quality of the chip A1 is determined.
The process proceeds to step ST2, and if it is determined in step ST12 that the product is defective (NO), the defective product is discarded, the process returns to step ST7, and the process is repeated by repeating steps ST7 to ST12.

In step ST12, the chip is good (YES).
If it is determined that the suction nozzle 51B for suctioning a narrow area is controlled by the control computer 59 via the position control unit 54 based on the image of the second camera 50, the process proceeds to step ST13. , The Z axis, and the rotation axis, and placed on the inspection table 49 of the intermediate stage 48 from the suction collet 41.

In step ST14, a sufficient number of pseudo chips 60, in this case, four chips
It is determined whether or not it has been placed on top of No. 9, and if this number has not been reached (NO), the process returns to step ST7 and
Steps ST7 to ST14 are repeated by rotating the index table 30 until a predetermined number is reached.

As a result, when a predetermined number is mounted (YE
In step S), since the pseudo chip 60 is formed on the inspection table 49, the process proceeds to step ST15, where the image is taken from below using the second camera 50, and image processing is performed by the control computer 59. A position for determining a place to be transferred to the silicon wafer 62 is also determined in consideration of the position of the pseudo chip 60 already incorporated in the module.

Next, the process proceeds to step ST16 to prepare for the suction of the pseudo chip 60, from the control computer 59 via the position control unit 54 to the suction nozzle 51A capable of sucking a wide area from the suction nozzle 51B. Switch by controlling the pneumatic circuit.

Thereafter, in step ST17, the inspection table 4
Under the control of the position control unit 54, the pseudo chip 60 on the substrate 9 is roughly transferred near a predetermined position of a silicon wafer 62 as a module of the unloader stage 61.

Thereafter, the position of the silicon wafer 62 on which the dummy chip 60 is mounted is determined by a movement block capable of reading the position information by controlling the rotation of the drive motors 66 and 67 under the control of the position control unit 54. X 64,65
Moves in the axis and Y-axis directions for accurate positioning.

Next, the process proceeds to step ST18, where it is determined whether or not the number of pseudo chips 60 to be mounted on the silicon wafer 62 as a module has been transferred, and if the number does not reach the predetermined number (NO). Returns to step ST7 and repeats steps ST7 to ST18.

If the number reaches the predetermined number (YES), the process proceeds to step ST19, where the predetermined number of pseudo chips 60 are collectively die-bonded to the silicon wafer 62 by heating, and the die bonding step is completed.

In addition, for example, die bonding is performed in step S
When the dummy chip 60 is accurately positioned at T17, the dummy chip 60 may be heated by the suction nozzle 51A and the four chips may be collectively die-bonded to the silicon wafer 62.

On the unloader side, in the case shown in FIG. 1, the example of the silicon wafer 62 is shown as a module mounted on the unloader stage 61. However, the present invention is not limited to this, and the lead frame 69 may be used as shown in FIG. The same applies to the case of 1.

In addition, as shown in FIG. 4, on the unloader side, a rectangular circuit board 71 mounted on an unloader unit 70 can be applied similarly to the case of FIG.

[0063]

As described above, according to the semiconductor manufacturing apparatus of the present invention, the number of wafers corresponding to the predetermined number of chips to be collectively mounted on a module is loaded in an index table. Since the required number of chips can be selected and mounted on the module simply by rotating the index table, the MCM can be manufactured efficiently.

Further, according to the method of manufacturing a semiconductor device according to the present invention, the number of wafers corresponding to the number of predetermined chips to be mounted on the module at one time is loaded into the index table and loaded into the intermediate stage. A pseudo chip including a predetermined number of chips is arranged at a time, and the arranged pseudo chips can be collectively arranged and fixed at a predetermined position of the module. And unloading can be processed collectively, and productivity can be increased.

[Brief description of the drawings]

FIG. 1 is an overall configuration diagram schematically showing a semiconductor manufacturing apparatus according to an embodiment of the present invention.

FIG. 2 is a flowchart showing a procedure for manufacturing a semiconductor by the manufacturing apparatus shown in FIG. 1;

FIG. 3 is an overall configuration diagram schematically showing a semiconductor manufacturing apparatus according to a second embodiment of the present invention.

FIG. 4 is an overall configuration diagram schematically showing a semiconductor manufacturing apparatus according to a third embodiment of the present invention.

FIG. 5 is a block diagram showing a process of assembling a conventional MCM package.

FIG. 6 is a configuration diagram showing a specific configuration of a die bonding step shown in FIG. 5;

[Explanation of symbols]

10; die bonding apparatus, 11, 37A, 37B, 37
C, 37D; wafer, 12; loader, 13; base, 14; lead frame, 15, 56; XY table, 16, 57;
Direction drive motor, 18; collet, 19; bonding head, 20; camera, 30; index table, 31, 45; rotary motor, 32;
36: Wafer placement part, 38: Holding member, 39: Moving groove, 40: Head, 41: Suction collet, 42;
Pickup unit, 43; moving member, 43A,
43B; holding rod, 44; base plate, 46; spiral rod,
47; first camera, 48; intermediate stage, 49; inspection table, 50; second camera, 51, 51A, 51B; suction nozzle, 52; head part, 53; arm, 54;
Position control unit, 55; stock tray, 59; control computer, 60; pseudo chip, 61, 70;
Unloader unit, 62; silicon wafer, 6
3; stage, 64, 65; moving block, 66,
67; drive motor, 68; manufacturing apparatus, 69; lead frame, 71; circuit board, A1, B1, C1, D1;
Chips

Claims (10)

[Claims] 1. A semiconductor manufacturing apparatus for mounting a plurality of chips collectively on one module, comprising: a rotary index table capable of loading a plurality of wafers including the chips; A semiconductor manufacturing apparatus wherein a plurality of the selected chips are transferred to the module and can be joined to the module at a time. 2. The semiconductor manufacturing apparatus according to claim 1, further comprising a pickup unit capable of three-dimensionally moving and adsorbing the chip on the index table by a suction collet, inverting and transferring the chip. 3. The semiconductor manufacturing apparatus according to claim 2, further comprising a first camera as an image input device for judging pass / fail of the chip picked up by the pickup unit. 4. A transparent inspection table on which the chips on the index table are transferred using a pickup unit, and a position obtained by monitoring the outer shape or pattern of the chips from below the inspection table with a second camera. 2. The semiconductor manufacturing apparatus according to claim 1, further comprising an intermediate stage having a suction nozzle that determines a mounting position on the module based on information and moves by suction. 3. 5. The semiconductor manufacturing apparatus according to claim 4, wherein said intermediate stage arranges a plurality of chips from each wafer on said index table as a pseudo chip. 6. The semiconductor manufacturing apparatus according to claim 1, further comprising an unloader stage mounted with said module and capable of moving in a two-dimensional direction and reading position information. 7. The semiconductor manufacturing apparatus according to claim 1, wherein the module includes at least a wafer, a circuit board, or a lead frame. 8. A method for manufacturing a semiconductor device, wherein the semiconductor device is mounted in a die bonding step in a semiconductor assembling step, wherein a plurality of wafers each including a chip constituting a predetermined functional unit are loaded on a rotary index table, and each of the wafers is loaded. Manufacturing the semiconductor by arranging the chips picked up from the intermediate stage as a pseudo chip using a pickup unit on an intermediate stage, and then unloading the arranged pseudo chip to a predetermined position of a module using a suction nozzle. Method. 9. The semiconductor manufacturing method according to claim 8, wherein said pickup unit picks up a chip on said index table by a suction collet and inverts said chip. 10. The semiconductor device according to claim 8, wherein the predetermined position is determined based on position information of an outer shape or a pattern of the pseudo chip obtained by using a camera provided on a bottom of a transparent inspection table in the intermediate stage. Production method.