SG11202105735WA - Mounting device - Google Patents

Mounting device

Info

Publication number
SG11202105735WA
SG11202105735WA SG11202105735WA SG11202105735WA SG11202105735WA SG 11202105735W A SG11202105735W A SG 11202105735WA SG 11202105735W A SG11202105735W A SG 11202105735WA SG 11202105735W A SG11202105735W A SG 11202105735WA SG 11202105735W A SG11202105735W A SG 11202105735WA
Authority
SG
Singapore
Prior art keywords
mounting device
mounting
Prior art date
Application number
SG11202105735WA
Inventor
Tomonori Nakamura
Koji Matsushita
Hiroshi Omata
Masahito Tsuji
Keiichi Hiruma
Mitsuteru Sakamoto
Ryo Urahashi
Takaya KINJO
Shota Nakano
Akira Sekikawa
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of SG11202105735WA publication Critical patent/SG11202105735WA/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/083—Quality monitoring using results from monitoring devices, e.g. feedback loops
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0817—Monitoring of soldering processes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
    • G01B2210/56—Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth
SG11202105735WA 2018-12-10 2019-12-09 Mounting device SG11202105735WA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018231104 2018-12-10
PCT/JP2019/048163 WO2020122033A1 (en) 2018-12-10 2019-12-09 Mounting device

Publications (1)

Publication Number Publication Date
SG11202105735WA true SG11202105735WA (en) 2021-06-29

Family

ID=71076460

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202105735WA SG11202105735WA (en) 2018-12-10 2019-12-09 Mounting device

Country Status (7)

Country Link
US (1) US11910534B2 (en)
JP (1) JP7023020B2 (en)
KR (1) KR102454557B1 (en)
CN (1) CN113167570B (en)
SG (1) SG11202105735WA (en)
TW (1) TWI731492B (en)
WO (1) WO2020122033A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7157112B2 (en) * 2020-10-07 2022-10-19 Ckd株式会社 Solder print inspection device

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0548256A (en) * 1991-08-13 1993-02-26 Matsushita Electric Ind Co Ltd Surface mounting method for printed circuit board
JPH05187838A (en) * 1992-01-16 1993-07-27 Hitachi Ltd Device for monitoring applied state of solder paste
JPH082085A (en) * 1994-06-20 1996-01-09 Fujitsu Ltd Paste coating method
JP2000039599A (en) * 1998-07-23 2000-02-08 Hitachi Ltd Method and device for inspecting liquid crystal display substrate and liquid crystal display substrate
JP3832622B2 (en) 2001-03-15 2006-10-11 シャープ株式会社 Die bonding method and die bonding apparatus
JP3858633B2 (en) * 2001-06-25 2006-12-20 松下電器産業株式会社 Bonding state inspection method
JP4450223B2 (en) * 2005-09-14 2010-04-14 オムロン株式会社 Board inspection method
JP4746948B2 (en) * 2005-09-21 2011-08-10 芝浦メカトロニクス株式会社 Electronic component mounting apparatus and mounting method
JP2015025656A (en) * 2011-09-29 2015-02-05 株式会社日立ハイテクノロジーズ Device for measuring shape formed on substrate
JP5874508B2 (en) * 2012-04-17 2016-03-02 オムロン株式会社 Solder wetting state inspection method, automatic visual inspection apparatus and board inspection system using this method
JP5945699B2 (en) * 2012-12-25 2016-07-05 パナソニックＩｐマネジメント株式会社 Electronic component mounting system and electronic component mounting method
CN105164522B (en) * 2013-02-03 2017-05-10 名古屋电机工业株式会社 Inspection method for substrate with mounted parts and substrate manufacturing system employing same inspection method
JP6450923B2 (en) * 2013-12-20 2019-01-16 パナソニックＩｐマネジメント株式会社 Electronic component mounting system, electronic component mounting method, and electronic component mounting apparatus
JP2016070810A (en) * 2014-09-30 2016-05-09 三友工業株式会社 Adhesive agent inspection device, adhesive agent coating device provided with adhesive agent inspection device, and adhesive agent inspection method
JP6436141B2 (en) 2016-09-20 2018-12-12 オムロン株式会社 X-ray inspection apparatus and control method thereof
JP6822864B2 (en) * 2017-01-31 2021-01-27 アルファーデザイン株式会社 Information processing equipment, information processing methods, programs,

Also Published As

Publication number Publication date
KR20210044854A (en) 2021-04-23
JPWO2020122033A1 (en) 2021-09-02
KR102454557B1 (en) 2022-10-14
US20220046838A1 (en) 2022-02-10
CN113167570B (en) 2023-01-24
US11910534B2 (en) 2024-02-20
JP7023020B2 (en) 2022-02-21
TWI731492B (en) 2021-06-21
CN113167570A (en) 2021-07-23
WO2020122033A1 (en) 2020-06-18
TW202037883A (en) 2020-10-16

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