JP6490522B2 - Semiconductor mounting equipment - Google Patents

Description

  The present invention relates to a semiconductor mounting apparatus. Specifically, the present invention relates to a semiconductor mounting apparatus for mounting a chip component or the like, which is a semiconductor element, on a circuit board.

  Conventionally, in order to cope with higher precision and miniaturization of a pattern of a substrate having a circuit made of a conductor such as copper wiring, a temporary provision is made to temporarily fix a chip component made of a semiconductor element to a pad formed on the circuit board with an adhesive. 2. Description of the Related Art A semiconductor mounting apparatus is known that includes a crimping process and a main crimping process for joining a bump and a pad of a chip component temporarily fixed to the pad. For example, it is like patent document 1. In such a semiconductor mounting apparatus, in order to avoid the influence of heat on the adjacent chip parts, a mounting head (pressure heating apparatus) of a main pressure bonding apparatus that simultaneously heats and presses a plurality of chip parts and connects them to a circuit board. Are known. For example, it is like patent document 2.

  The heating and pressurizing head of the pressurizing and heating apparatus described in Patent Document 2 includes a plurality of attachments (heating and pressing) that come into contact with the chip component in order to absorb variations in the position in the pressing direction of the plurality of temporarily fixed chip components. An elastic body is provided between the tool) and the heater block. The heating and pressing head is configured to absorb pressure variation in the pressing direction of a plurality of chip parts and to apply pressure uniformly by bending an elastic body during pressing. In the technique described in Patent Document 2, each elastic body bends independently according to the variation in the position of the chip component in the pressing direction. For this reason, the progress of the change over time due to heating and pressurization of the elastic body varies depending on the number of times each attachment is pressurized. Therefore, in the heat and pressure head, the amount of deflection and the amount of sag vary due to the difference with time of each elastic body, and there is a possibility that defective bonding occurs due to uneven pressing of the chip parts.

JP 2010-232234 A JP 2010-34423 A

  The object of the present invention is to grasp the change with time of the pressure head by fixing the chip component to the circuit board, and to suppress the occurrence of defective bonding of the chip component due to the variation in the pressed state due to the change over time. An object of the present invention is to provide a semiconductor mounting device that can be used.

  The problem to be solved by the present invention is as described above. Next, means for solving the problem will be described.

That is, according to the present invention, in a semiconductor mounting apparatus including a pressure head that pressurizes a chip component and fixes it to a predetermined position on a circuit board, the pressure head simultaneously pressurizes the position from the position of the pressure head relative to the circuit board. The number of chip parts is calculated, the pressure of the pressure head is changed based on the number of chip parts, the pressure head presses the chip parts, and the position at which the chip parts are pressed in the pressure head Each time, the number of times the chip component is pressurized is integrated.

In the present invention, the pressure head includes a plurality of attachments that contact the chip component, and a plurality of elastic bodies that independently support the attachments, and the position of the chip component that contacts each attachment in the pressure direction. The variation is configured to be absorbed by the elastic body, and the number of times the chip component is pressed for each attachment is integrated.

The present invention includes distance detection means for measuring a distance from an arbitrary reference position to each attachment, and the number of times of pressing the chip component of at least one attachment among the number of times of pressing the chip component of each attachment is predetermined. If the number of times is greater than the number of times, the difference between the maximum value and the minimum value of the number of times the chip part of each attachment has been pressed exceeds a predetermined number of times, or the distance to each attachment detected by the distance detection means When the change amount of the distance of at least one attachment among the change amounts becomes equal to or larger than the predetermined change amount, at least one of the notification and the replacement of the pressure head is performed.

  The present invention includes distance detection means for measuring a distance from an arbitrary reference position to each attachment, and the number of times of pressing the chip component of at least one attachment among the number of times of pressing the chip component of each attachment is predetermined. If the number of times is greater than the number of times, the difference between the maximum value and the minimum value of the number of times the chip part of each attachment has been pressed exceeds a predetermined number of times, or the distance to each attachment detected by the distance detection means When the amount of change in the distance of at least one attachment among the amount of change in the amount exceeds a predetermined amount of change, at least one of heat treatment or pressure treatment that makes the state of the elastic body of each attachment the same It is.

  As effects of the present invention, the following effects can be obtained.

In the present invention, the force applied to one chip component is equal regardless of the number of chip components simultaneously pressurized by the pressure head, and the change with time due to the pressure of the pressure head becomes uniform. In addition, the distribution of the number of times the chip component in the pressure head is pressed is considered. As a result, it is possible to grasp the change with time of the pressure head caused by fixing the chip component to the circuit board, and to suppress the occurrence of bonding failure of the chip component due to the variation in the pressed state due to the change with time.

  In the present invention, the usage state of each elastic body that supports each attachment is detected. As a result, it is possible to grasp the change with time of the pressure head caused by fixing the chip component to the circuit board, and to suppress the occurrence of bonding failure of the chip component due to the variation in the pressed state due to the change with time.

  In the present invention, the change over time due to the pressurization of the pressure head is judged based on quantitative evaluation, and the variation in the change over time is suppressed within a certain range. As a result, it is possible to grasp the change with time of the pressure head caused by fixing the chip component to the circuit board, and to suppress the occurrence of bonding failure of the chip component due to the variation in the pressed state due to the change with time.

  In the present invention, the temporal change due to the pressure of the pressure head is determined based on quantitative evaluation, and the variation of the temporal change between attachments is suppressed within a certain range. As a result, it is possible to grasp the change with time of the pressure head caused by fixing the chip component to the circuit board, and to suppress the occurrence of bonding failure of the chip component due to the variation in the pressed state due to the change with time.

Schematic which shows the whole structure of the semiconductor mounting apparatus which concerns on 1st embodiment of this invention. (A) Schematic which shows the structure of the head for temporary crimping | compression-bonding of the semiconductor mounting apparatus which concerns on 1st embodiment of this invention (b) The structure of the head for final crimping | compression-bonding of the semiconductor mounting apparatus which concerns on 1st embodiment of this invention is shown. Schematic. The block diagram showing the control composition of the semiconductor mounting device concerning a first embodiment of the present invention. (A) Schematic which shows the aspect of temporary fixation of the chip component in the temporary crimping process of the semiconductor mounting apparatus which concerns on 1st embodiment of this invention. (B) The schematic diagram which shows the aspect of fixation of the chip component in a final crimping process. The figure which shows the graph showing the temperature state at the time of the pressurization of the semiconductor mounting apparatus which concerns on 1st embodiment of this invention. The figure which shows the relationship between the chip | tip component temporarily crimped | bonded to the circuit board with the semiconductor mounting apparatus which concerns on 1st embodiment of this invention, and the pressurization position of the head for this press-fit. (A) The figure which shows the pressurization state of the chip component by the attachment for main pressurization in one pressurization position in the main pressurization process of the semiconductor mounting apparatus which concerns on 1st embodiment of this invention (b) Other pressurization positions similarly The figure which shows the pressurization state of the chip component by the attachment for this crimping | compression-bonding in FIG. (A) The figure which shows the graph showing the frequency | count of pressurization of each main crimping attachment in the main crimping | compression-bonding process of the semiconductor mounting apparatus which concerns on 1st embodiment of this invention (b) The difference of the frequency | count of pressurization of each main crimping attachment similarly The figure which shows the graph showing (c) The figure which shows the graph showing the variation | change_quantity of the distance from the reference position to each attachment for main crimping | compression-bonding similarly. (A) Side view in the short-side direction of the main pressure bonding head showing a state in which the chip component is being pressed by one main pressure bonding head in the main pressure bonding step of the semiconductor mounting apparatus according to the first embodiment of the present invention (b). Similarly, the short side view of the main pressure bonding head showing a state where the chip component is being pressed by the other main pressure bonding head. The figure which shows the flowchart showing the control aspect of the semiconductor mounting apparatus which concerns on 1st embodiment of this invention. The figure which shows the flowchart showing the control aspect in the temporary crimping | compression-bonding process of the semiconductor mounting apparatus which concerns on 1st embodiment of this invention. The figure which shows the flowchart showing the control aspect in the main crimping | compression-bonding process of the semiconductor mounting apparatus which concerns on 1st embodiment of this invention. The figure showing the flowchart showing the control mode of the head exchange for final press-fit in the final press-fit process of the semiconductor mounting device concerning a first embodiment of the present invention. The figure which shows the state which the time-dependent change has generate | occur | produced in the rubber member of the head for final press-bonding of the semiconductor mounting apparatus which concerns on 2nd embodiment of this invention (b) For main press-bonding of the semiconductor mounting apparatus which concerns on 2nd embodiment of this invention The figure which shows the state which is equalizing the head. The figure which shows the flowchart showing the control aspect of the semiconductor mounting apparatus which concerns on 2nd embodiment of this invention. The figure which shows the flowchart showing the control aspect of the head uniformization process for main press-fit in the main press-fit process of the semiconductor mounting apparatus which concerns on 2nd embodiment of this invention.

  First, the semiconductor mounting apparatus 1 which is 1st embodiment in the semiconductor mounting apparatus based on this invention is demonstrated using FIGS. 1-5. In the following description, the direction in which the circuit board C is conveyed from the temporary crimping apparatus 2 to the final crimping apparatus 12 is the X-axis direction, the Y-axis direction orthogonal thereto, and the circuit boards of the temporary crimping head 7 and the final crimping head 17 described later. In the following description, the direction of movement perpendicular to C is the Z-axis direction, and the direction of rotation about the Z-axis is the θ direction. In addition, in this embodiment, although the temporary crimping | compression-bonding apparatus 2 and the final crimping | compression-bonding apparatus 12 are each comprised as the semiconductor mounting apparatus 1, it is not limited to this. In this embodiment, a non-conductive film (hereinafter simply referred to as “NCF”) made of a thermosetting resin, which is an adhesive for bonding the circuit board C and the chip component D, is preliminarily soldered to the chip component D. However, the present invention is not limited to this, and may be attached to the circuit board C side.

  As shown in FIG. 1, the semiconductor mounting apparatus 1 mounts a chip component D on a circuit board C. The semiconductor mounting apparatus 1 includes a provisional pressure bonding device 2, a main pressure bonding device 12, a transport device 23 (see FIG. 3), and a control device 24 (see FIG. 3).

  A temporary pressure bonding device 2 constituting a part of the semiconductor mounting device 1 temporarily fixes a chip component D to a circuit board C with an NCF as an adhesive. The temporary pressure bonding apparatus 2 includes a temporary pressure bonding base 3, a temporary pressure bonding stage 4, a temporary pressure bonding support frame 5, a temporary pressure bonding unit 6, a pressure bonding head 7 serving as a pressure head, and a temporary pressure bonding heater 8 (see FIG. 2 (see FIG. 2 (a)), provisional crimping attachment 9 (see FIG. 2 (a)), temporary crimping displacement sensor 10 as a distance measuring means, and provisional crimping image recognition device 11 (see FIG. 3). .

  The temporary crimping base 3 is a main structure constituting the temporary crimping apparatus 2. The temporary press-bonding base 3 is configured by combining pipe materials and the like so as to have sufficient rigidity. The temporary pressure bonding base 3 supports a temporary pressure bonding stage 4 and a temporary pressure bonding support frame 5.

  The temporary crimping stage 4 moves the circuit board C to an arbitrary position while holding the circuit board C. The temporary crimping stage 4 is configured by attaching a temporary crimping suction table 4b capable of sucking and holding the circuit board C to the temporary crimping drive unit 4a. The temporary press-bonding stage 4 is attached to the temporary press-bonding base 3 and is configured to be able to move the temporary press-fit suction table 4b in the X-axis direction, the Y-axis direction, and the θ-direction by the temporary press-bonding drive unit 4a. . In other words, the temporary crimping stage 4 is configured to be able to move the circuit board C sucked by the temporary crimping suction table 4b on the temporary crimping base 3 in the X axis direction, the Y axis direction, and the θ direction. . In the present embodiment, the temporary press-bonding stage 4 holds the circuit board C by suction, but is not limited thereto.

  The temporary pressure bonding support frame 5 supports the temporary pressure bonding unit 6. The temporary press-bonding support frame 5 is formed in a plate shape and is configured to extend from the vicinity of the temporary press-bonding stage 4 of the temporary press-bonding base 3 toward the Z-axis direction.

  The temporary pressure bonding unit 6 that is a pressure unit moves the temporary pressure bonding head 7. The temporary crimping unit 6 includes a servo motor and a ball screw (not shown). The temporary crimping unit 6 is configured to generate a driving force in the axial direction of the ball screw by rotating the ball screw by a servo motor. The temporary pressure bonding unit 6 is attached to the temporary pressure bonding support frame 5 so that the moving direction of the temporary pressure bonding head 7 is in the Z-axis direction perpendicular to the circuit board C. That is, the temporary crimping unit 6 is configured to generate a driving force (pressing force) in the Z-axis direction. The temporary crimping unit 6 is configured such that a temporary crimping load Ft, which is a pressure applied in the Z-axis direction, can be arbitrarily set by controlling the output of the servo motor. In the present embodiment, the provisional pressure bonding unit 6 is composed of a servo motor and a ball screw, but is not limited to this, and may be composed of a pneumatic actuator or a hydraulic actuator.

  The temporary crimping head 7 transmits the driving force of the temporary crimping unit 6 to the chip component D. The temporary crimping head 7 is attached to a ball screw nut (not shown) constituting the temporary crimping unit 6. The temporary crimping unit 6 is disposed so as to face the temporary crimping stage 4. That is, the temporary press-bonding head 7 is configured to be close to the temporary press-bonding stage 4 by being moved in the Z-axis direction by the temporary press-bonding unit 6. As shown in FIG. 2A, the temporary pressure bonding head 7 is provided with a temporary pressure bonding heater 8, a temporary pressure bonding attachment 9, and a temporary pressure bonding displacement sensor 10.

  As shown in FIG. 2A, the provisional pressure bonding heater 8 is for heating the chip component D. The temporary pressure bonding heater 8 is constituted by a cartridge heater, and is incorporated in a hole or the like formed in the temporary pressure bonding head 7. In the present embodiment, the provisional pressure bonding heater 8 is composed of a cartridge heater, but is not limited to this, and may be any material that can heat the chip component D, such as a rubber heater. Further, the provisional pressure bonding heater 8 is incorporated in the provisional pressure bonding head 7, but is not limited thereto. The provisional pressure bonding heater 8 is incorporated in the provisional pressure bonding stage 4, and the circuit board C is interposed from the provisional pressure bonding stage 4 side. The NCF may be heated.

  The temporary crimping attachment 9 holds the chip component D. The temporary crimping attachment 9 is provided on the temporary crimping head 7 so as to face the temporary crimping stage 4. The temporary crimping attachment 9 is configured so that the chip component D can be sucked and held while being positioned. The temporary crimping attachment 9 is configured to be heated by the temporary crimping heater 8. That is, the temporary crimping attachment 9 is configured to position and hold the chip component D and to heat the NCF attached to the chip component D by heat transfer from the temporary crimping heater 8.

  The temporary pressing displacement sensor 10 measures the distance in the Z-axis direction of the temporary pressing head 7 from an arbitrary reference position. The temporary pressure-bonding displacement sensor 10 includes a displacement sensor using various laser beams. The temporary pressure bonding displacement sensor 10 is configured to measure a distance Lt (see FIG. 4A) from an arbitrary reference position in the Z-axis direction of the temporary pressure bonding head 7 when the temporary pressure bonding is completed. In the present embodiment, the provisional pressure displacement sensor 10 is configured using a laser beam, but is not limited to this. The ultrasonic sensor, linear scale, servo motor encoder, and the like are not limited thereto. It may consist of what is calculated from

  As shown in FIG. 3, the temporary press-bonding image recognition device 11 acquires position information of the chip component D and the circuit board C from an image. The temporary pressure bonding image recognition device 11 recognizes an image of the alignment mark of the circuit board C held by suction and holding on the temporary pressure bonding stage 4 and the alignment mark of the chip component D held on the temporary pressure bonding attachment 9. Thus, the positional information between the circuit board C and the chip component D is acquired.

  As shown in FIG. 1, the crimping apparatus 12 fixes the chip component D to the circuit board C by welding the solder of the chip component D and curing the NCF. The main pressure bonding device 12 includes a main pressure bonding base 13, a main pressure bonding stage 14, a main pressure bonding support frame 15, a main pressure bonding unit 16, a main pressure bonding head 17 that is a pressure head, and a main pressure bonding heater 18 (FIG. 2 (b)), the main crimping attachment 19 (see FIG. 2 (b)), the main crimping image recognition device 20 (see FIG. 3), the main crimping displacement sensor 21 and the notification means 22 (see FIG. 3). It has.

  The main press bonding base 13 is a main structure constituting the main press bonding device 12. The main base 13 for pressure bonding is configured by combining pipe materials or the like so as to have sufficient rigidity. The main pressure bonding base 13 supports a main pressure bonding stage 14 and a main pressure bonding support frame 15.

  The main crimping stage 14 moves the circuit board C to an arbitrary position while holding the circuit board C. The main pressure bonding stage 14 is configured by attaching a main pressure bonding suction table 14b capable of sucking and holding the circuit board C to the main pressure bonding drive unit 14a. The main press-bonding stage 14 is attached to the main press-bonding base 13 and is configured such that the main press-bonding suction unit 14b can be moved in the X-axis direction, the Y-axis direction, and the θ-direction by the main press-bonding drive unit 14a. . That is, the final crimping stage 14 is configured to be able to move the circuit board C sucked by the final crimping suction table 14b on the final crimping base 13 in the X axis direction, the Y axis direction, and the θ direction. . In the present embodiment, the final press-bonding stage 14 holds the circuit board C by suction, but is not limited thereto.

  The main pressure bonding support frame 15 supports the main pressure bonding unit 16. The main pressure bonding support frame 15 is formed in a substantially plate shape, and is configured to extend from the vicinity of the main pressure bonding stage 14 of the main pressure bonding base 13 toward the Z-axis direction.

  The main pressure bonding unit 16 that is a pressure unit moves the main pressure bonding head 17. The main crimping unit 16 includes a servo motor and a ball screw (not shown). The main crimping unit 16 is configured to generate a driving force in the axial direction of the ball screw by rotating the ball screw by a servo motor. The main pressure bonding unit 16 is attached to the main pressure bonding support frame 15 so that the movement direction of the main pressure bonding head 17 is in the Z-axis direction perpendicular to the circuit board C. That is, the main crimping unit 16 is configured to generate a driving force (pressing force) in the Z-axis direction. The main press-bonding unit 16 is configured such that a main press-fit load Fp, which is a pressure applied in the Z-axis direction, can be arbitrarily set by controlling the output of the servo motor. In the present embodiment, the main crimping unit 16 is composed of a servo motor and a ball screw, but is not limited thereto, and may be composed of a pneumatic actuator or a hydraulic actuator.

  The main pressure bonding head 17, which is a pressure head, transmits the driving force of the main pressure bonding unit 16 to the chip component D. The main pressure bonding head 17 is detachably attached to a ball screw nut (not shown) constituting the main pressure bonding unit 16. Further, the main pressure bonding head 17 is disposed so as to face the main pressure bonding stage 14. That is, the main press-bonding head 17 is configured to be close to the main press-bonding stage 14 by being moved in the Z-axis direction by the main press-bonding unit 16. The main pressure bonding head 17 is provided with a main pressure bonding heater 18 and a plurality of main pressure bonding attachments 19.

  As shown in FIG. 2B, the main crimping heater 18 is for heating the chip component D. The main crimping heater 18 is composed of a cartridge heater and is incorporated in a hole or the like formed in the main crimping head 17. In the present embodiment, the main crimping heater 18 is composed of a cartridge heater, but is not limited to this, and may be any one that can heat the chip component D, such as a rubber heater. Further, the main pressure bonding heater 18 is configured to heat a plurality of main pressure bonding attachments 19 at a time. However, the present invention is not limited to this, and a main pressure bonding heater is provided for each main pressure bonding attachment 19 to be individually provided. You may control.

  The main pressure bonding attachment 19 presses the chip component D. A plurality of main pressure bonding attachments 19 are provided on the main pressure bonding head 17 so as to face the main pressure bonding stage 14. The main press-bonding attachment 19 is supported by the main press-bonding head 17 by a rubber member 19a which is an elastic member for absorbing variations in the Z-axis direction of the chip part D that has been temporarily press-bonded. The rubber members 19a that support the main pressure bonding attachments 19 are configured to be deformed independently of each other. Further, the main pressure bonding attachment 19 is configured to be heated by the main pressure bonding heater 18 through a rubber member 19a. That is, the main crimping attachment 19 heats the chip component D by heat transfer from the main crimping heater 18 and pressurizes the chip component D while the rubber member 19a is deformed according to the main crimping load Fp. It is configured.

  As shown in FIG. 3, the main-compression image recognition device 20 acquires position information on the circuit board C and the chip component D based on an image. The main image-recognition apparatus 20 for image bonding recognizes an image of the alignment mark of the circuit board C and the alignment mark of the chip component D temporarily fixed to the circuit board C, and positions information on the circuit board C and the chip component D. Is configured to get.

  As shown in FIG. 1 to FIG. 3, the main-bonding displacement sensor 21 includes a main-bonding head 17 disposed at a predetermined position from an arbitrary reference position such as the main-bonding base 13 or the main-bonding stage 14. The distance to the crimping attachment 19 is measured. The main-bonding displacement sensor 21 is composed of a displacement sensor using various laser beams. The main-bonding displacement sensor 21 can measure a distance Lp (see FIG. 2B) in the Z-axis direction from an arbitrary reference position to each main-bonding attachment 19 of the main-bonding head 17 disposed at a predetermined position. It is configured as follows. In addition, in this embodiment, although the displacement sensor 21 for this press-fit is comprised from what utilized a laser beam, it is not limited to this.

  As shown in FIG. 3, the notification means 22 notifies the operator of the state of the main crimping device 12. The notification means 22 includes an image display device, a speaker, a warning light, a signal transmission device, and the like. In the present embodiment, the notification means 22 displays an image, issues an alarm, turns on a warning lamp, etc. when it is determined that the rubber member 19a supporting the main crimping attachment 19 has deteriorated due to aging. This is notified to the operator, or a signal to that effect is transmitted to a host control device (not shown).

  The conveying device 23 delivers the circuit board C between the temporary crimping device 2 and the final crimping device 12. The transport device 23 is configured to be able to transport the circuit board C on which the plurality of chip components D are temporarily press-bonded by the temporary press-bonding stage 4 of the temporary press-bonding device 2 to the final press-bonding stage 14 of the main press-bonding device 12.

  The control device 24 controls the temporary pressure bonding device 2, the main pressure bonding device 12, the transport device 23, and the like. The control device 24 may actually be configured such that a CPU, ROM, RAM, HDD, or the like is connected by a bus, or may be configured by a one-chip LSI or the like. The control device 24 is connected to a host control device (not shown), and stores various programs and data for controlling the temporary crimping device 2, the main crimping device 12, the transport device 23, and the like.

  The control device 24 is connected to the temporary crimping stage 4 and the final crimping stage 14 and controls the movement amounts of the temporary crimping stage 4 and the final crimping stage 14 in the X axis direction, the Y axis direction, and the θ direction, respectively. can do.

  The control device 24 is connected to the temporary pressure bonding heater 8 and the main pressure bonding heater 18, and can control the temperatures of the temporary pressure bonding heater 8 and the main pressure bonding heater 18, respectively. In particular, the control device 24 can maintain the average temperature during pressurization of the main pressure bonding head 17 at a temperature within a certain range that is equal to or higher than the NCF curing temperature and equal to or higher than the melting point of the solder.

  The control device 24 is connected to the temporary pressure bonding unit 6 and the main pressure bonding unit 16 and can control the applied pressure in the Z-axis direction between the temporary pressure bonding unit 6 and the main pressure bonding unit 16.

  The control device 24 is connected to the temporary crimping attachment 9 and can control the suction state of the temporary crimping attachment 9.

  The control device 24 is connected to the temporary pressure-bonding image recognition device 11 and the main pressure-bonding image recognition device 20, and controls the temporary pressure-bonding image recognition device 11 and the main pressure-bonding image recognition device 20, respectively. Position information with the circuit board C can be acquired.

  The control device 24 is connected to the transport device 23 and can control the transport device 23.

  The control device 24 is connected to the temporary pressure bonding displacement sensor 10 and can acquire the distance in the Z-axis direction of the chip part D when the temporary pressure bonding is completed from the temporary pressure bonding displacement sensor 10. In particular, the control device 24 determines whether or not the variation in the Z-axis direction of the chip part D at the time of temporary fixing is within the reference range Ltt.

  The control device 24 obtains information on the provisional press-bondable position Pt of the chip component D on the circuit board C and information on the reference main press-bonding range Ap from an upper control device (not shown). Here, the temporarily press-bondable position Pt is a position where the chip component D can be temporarily fixed without problems such as wiring defects on the circuit board C. The reference main press-bonding range Ap is a range of the temporary press-bondable positions Pt that are simultaneously pressed by the main press-bonding head 17, and all the temporary press-bondable positions Pt are included in any of the plurality of reference main press-bonding ranges Ap. (See FIG. 6).

  As described above, as shown in FIG. 4A, the semiconductor mounting apparatus 1 has a circuit board mounted on the temporary pressure bonding stage 4 of the temporary pressure bonding apparatus 2 as a temporary pressure bonding process in the mounting method in which the chip component D is fixed to the circuit board C. C is adsorbed and held. On the other hand, the semiconductor mounting apparatus 1 heats the chip component D to the temporary pressure bonding temperature Tt (see FIG. 5) while attracting and holding the chip component D by the temporary pressure bonding head 7 of the temporary pressure bonding apparatus 2. Next, the semiconductor mounting apparatus 1 pressurizes the chip component D with the temporary press-bonding load Ft to the temporary press-bondable position Pt (the temporary press-bondable position Pt (2) in FIG. 4A) on the circuit board C. Temporarily fix to C. Similarly, the semiconductor mounting apparatus 1 temporarily fixes the chip components D sequentially at other temporarily press-bondable positions Pt on the circuit board C (temporary press-bondable positions Pt (3) in FIG. 4A). Next, the semiconductor mounting apparatus 1 conveys the circuit board C from the temporary pressure bonding stage 4 of the temporary pressure bonding apparatus 2 to the final pressure bonding stage 14 of the final pressure bonding apparatus 12 by the conveying device 23.

  As shown in FIG. 4 (b), the semiconductor mounting apparatus 1 performs the final crimping process in the mounting method in which the chip component D is fixed to the circuit board C. The final crimping apparatus 12 places the circuit board C on the final crimping stage 14. Hold by adsorption. Next, the semiconductor mounting apparatus 1 simultaneously heats the plurality of chip parts D temporarily fixed in the reference main press-bonding range Ap while heating to the main press-bonding temperature Tp (see FIG. 5). The circuit board C is fixed by pressurizing with the main pressure bonding load Fp calculated by the above. Similarly, the semiconductor mounting apparatus 1 sequentially fixes a plurality of chip components D that are temporarily fixed to the other reference main press bonding range Ap. At this time, the variation in the position in the Z-axis direction of the plurality of chip parts D temporarily fixed to the circuit board C is absorbed by the rubber members 19a supporting the main-bonding attachment 19 being independently deformed. The

  With this configuration, the semiconductor mounting apparatus 1 can temporarily fix the chip component D to the temporarily press-bondable position Pt of the circuit board C with the temporary press-bonding apparatus 2 and then simultaneously use the multiple press-bonding apparatus 12 to make a plurality of chips. The component D can be fixed to the circuit board C. For this reason, as shown in FIG. 5, the semiconductor mounting apparatus 1 maintains the temperature of the temporary crimping head 7 at the time of the temporary crimping of the temporary crimping apparatus 2 at the temporary crimping temperature Tt, and at the time of the final crimping of the final crimping apparatus 12. It is only necessary to maintain the temperature of the main pressure bonding head 17 at the main pressure bonding temperature Tp. Therefore, the semiconductor mounting apparatus 1 does not need to cool the temporary press-bonding head 7 and the main press-bonding head 17 every mounting cycle, and the temperature management is facilitated. Can be suppressed. Further, in the semiconductor mounting apparatus 1, the position in the Z-axis direction of each main press-bonding attachment 19 at the time of the main press-bonding of the main press-bonding apparatus 12 is adjusted by deformation of the rubber member 19 a. Therefore, the semiconductor mounting apparatus 1 does not adjust the position in the Z-axis direction for each main-bonding attachment 19 even if the positions in the Z-axis direction of the plurality of chip parts D to be simultaneously pressed vary. Is uniformly pressed, so that it is possible to suppress the occurrence of poor bonding in the main press bonding.

  Hereinafter, with reference to FIGS. 6 to 9, the main pressure bonding load control and the main pressure bonding head replacement control of the main pressure bonding apparatus 12 in the main pressure bonding process of the semiconductor mounting apparatus 1 according to the present invention will be described.

  The control device 24 of the semiconductor mounting apparatus 1 acquires information on the provisional press-bondable position Pt of the chip component D on the circuit board C and information on the reference main press-bonding range Ap from an upper control device (not shown). That is, the control device 24 of the semiconductor mounting apparatus 1 temporarily fixes the temporary press-bonding position Pt of the circuit board C within each reference main press-bonding range Ap from the information of the reference main press-bonding range Ap and the information of the pre-bonding possible position Pt. It is possible to calculate the number of chip parts D that are being processed.

  As shown in FIG. 6, the number of chip parts D temporarily fixed at the temporary press-bondable position Pt in each reference main press-bonding range Ap is determined based on the position of each reference main press-bonding range Ap on the circuit board C or the circuit board C. It depends on the situation. For example, in FIG. 6, there are three chip components D that are temporarily fixed in the reference main pressure bonding range Ap (1), and there are two chip components D that are temporarily fixed in the reference main pressure bonding range Ap (2). . The semiconductor mounting apparatus 1 calculates the number of chip components D temporarily fixed at the temporary press-bondable position Pt within each reference main press-bonding range Ap as the main press-fit load control. Next, the semiconductor mounting apparatus 1 determines each reference main pressing range based on the calculated number of chip components D in each reference main pressing range Ap and a unit main pressing load UFp necessary for fixing one chip component D. A final pressure bonding load Fp, which is the pressure applied by Ap, is calculated. The semiconductor mounting apparatus 1 presses the chip component D by the main press-bonding head 17 with a main press-fit load Fp corresponding to each reference main press-bond range Ap.

  At this time, as shown in FIG. 7A, when the main press-bonding head 17 of the semiconductor mounting apparatus 1 presses the reference main press-bonding range Ap (1), the first attachment constituting each main press-bonding attachment 19 is provided. Among the 19A, the second attachment 19B, the third attachment 19C, and the fourth attachment 19D, the chip part D is pressurized by the second attachment 19B, the third attachment 19C, and the fourth attachment 19D. On the other hand, as shown in FIG. 7B, the main press-bonding head 17 pressurizes the chip component D with the first attachment 19 </ b> A and the fourth attachment 19 </ b> D when the reference main press-bonding range Ap (2) is pressed. That is, the main press-bonding head 17 is attached to the chip component D among the first attachment 19A, the second attachment 19B, the third attachment 19C, and the fourth attachment 19D according to the reference main press-bonding range Ap to be pressed and the provisional press-bondable position Pt. Something that doesn't touch. For this reason, the first attachment 19A, the second attachment 19B, the third attachment 19C, and the fourth attachment 19D have a difference in the number of times the chip component D is pressed (hereinafter simply referred to as “pressing number Np”).

  The semiconductor mounting apparatus 1 accumulates the number N of times that the main crimping head 17 presses the chip component D by the main crimping unit 16 of the final crimping apparatus 12 as the main crimping head replacement control. Further, the semiconductor mounting apparatus 1 accumulates the number of pressurizations Np for each main press-bonding attachment 19 corresponding to the position where the chip component D is pressed in the main press-bonding head 17. In other words, the semiconductor mounting apparatus 1 accumulates the number of deformations of the rubber member 19 a of the main press attachment 19 that pressurizes the chip component D among the main press attachments 19.

  Next, as shown in FIG. 8A, the semiconductor mounting apparatus 1 performs at least one final press-bonding attachment 19 out of the number of pressurization times Np of each main press-fit attachment 19 as shown in FIG. When the number of pressurizations Np is equal to or greater than the predetermined number of times Npt, as shown in FIG. 8B, the difference in number ΔNp between the maximum value and the minimum value of the number of pressurizations Np of each main crimping attachment 19 is a predetermined number of times. When the difference ΔNpt is greater than or equal to, or as shown in FIG. 8C, at least one of the distance change amounts ΔLp to the main crimping attachments 19 detected by the displacement sensor as the distance detection means. When the change amount ΔLp of the distance of the attachment 19 becomes equal to or larger than the predetermined change amount ΔLpt, the rubber member 19a supporting the main pressure bonding attachment 19 is appropriately It is determined that the component D cannot be pressurized, and the notification means (see FIG. 3) notifies the operator and the host control device to that effect. At this time, the semiconductor mounting apparatus 1 uses the reference position so that the difference ΔNp between the maximum value and the minimum value of the number of pressurizations Np of each main press-bonding attachment 19 is reduced from the arrangement of the provisional press-bondable position Pt of the circuit board C. The main press bonding range Ap is calculated in advance. Further, the circuit board C and the main press-bonding head 17 may be rotated so as to reduce the number of times difference ΔNp. In the present embodiment, the semiconductor mounting device 1 is configured to notify when each of the above-described conditions is satisfied in each of the main-bonding attachments 19, but is not limited thereto. Alternatively, a determination may be made based on only one or two conditions, or a notification may be made when all of a plurality of selected conditions are satisfied.

  Further, as shown in FIG. 9, the semiconductor mounting apparatus 1 is configured so that the main crimping head 17 of the main crimping apparatus 12 can be automatically replaced in addition to the above-described notification means 22 as the main crimping head replacement control. May be. The main pressure bonding device 12 of the semiconductor mounting apparatus 1 includes a plurality of main pressure bonding heads 17 (in this embodiment, a first main pressure bonding head 17a and a second main pressure bonding head 17b). The first and second crimping heads 17 a and 17 b are supported by the final crimping unit 16. The first and second crimping heads 17 a and 17 b are configured to be movable in the Z-axis direction with respect to the final crimping unit 16. Further, the first main crimping head 17a and the second main crimping head 17b are positioned close to the main crimping stage 14 by an actuator (not shown) (hereinafter simply referred to as “pressing position Pf”) and the book. The position can be switched to a position separated from the crimping stage 14 (hereinafter, simply referred to as “standby position Pw”).

  In the semiconductor mounting apparatus 1, either one of the first and second crimping heads 17a and 17b (the first and only crimping head 17a in the present embodiment) is moved to the pressing position Pf by an actuator (not shown). The other (second main crimping head 17b in this embodiment) is moved to the standby position Pw by an actuator (not shown). The semiconductor mounting apparatus 1 pressurizes the chip component D only by the first main crimping head 17a at the pressurization position Pf. The semiconductor mounting apparatus 1 accumulates the number of pressurizations Np for each main-crimping attachment 19 that pressurizes the chip component D in the first main-crimping head 17a.

  In the semiconductor mounting apparatus 1, when the number of pressurizations Np of at least one final press-bonding attachment 19 out of the number of pressurizations Np of each main-compression attachment 19 accumulated in the first main-compression-bonding head 17 a becomes equal to or greater than a predetermined number Npt. (Refer to FIG. 8A), when the difference ΔNp between the maximum value and the minimum value of the pressurization frequency Np of each main pressure bonding attachment 19 is equal to or larger than a predetermined frequency difference ΔNpt (see FIG. 8B), Alternatively, when the change amount ΔLp of the distance of at least one main crimping attachment 19 out of the change amount ΔLp of the distance Lp to each main crimping attachment 19 detected by the displacement sensor is equal to or greater than the predetermined change amount ΔLpt (FIG. 8 ( c)), it is determined that the rubber member 19a supporting the main pressure bonding attachment 19 cannot properly pressurize the chip component D due to change over time, and Notify the operator and higher-level control device. Further, the semiconductor mounting apparatus 1 switches the position of the first main pressure bonding head 17a from the pressurization position Pf to the standby position Pw by an actuator (not shown), and changes the position of the second main pressure bonding head 17b by an actuator (not shown). To the pressure position Pf. In the present embodiment, the semiconductor mounting apparatus 1 is configured to switch the position in the Z-axis direction between the first crimping head 17a and the second crimping head 17b. A configuration may be adopted in which the first crimping head 17a is replaced with a second crimping head 17b in a spare head rack (not shown) by an auto tool changer or the like.

  Below, the control aspect of the semiconductor mounting apparatus 1 which concerns on 1st embodiment of this invention is demonstrated concretely using FIGS. 10-13. In the following control mode, the temporary crimping heater 8 is maintained in advance at a temperature necessary for heating the chip component D to the temporary crimping temperature Tt, and the final crimping heater 18 is configured to maintain the chip component D at the final crimping temperature. It is assumed that the temperature necessary for heating to Tp is maintained in advance. The main crimping device 12 includes a first main crimping head 17a and a second main crimping head 17b. The first main crimping head 17a is disposed at the pressing position Pf, and the second main crimping head 17b. Is arranged at the standby position Pw.

  As shown in FIG. 10, in step S100, the control device 24 acquires information on the reference main press-bonding range Ap and information on the provisional press-bondable position Pt from the host control device, and shifts the step to step S200.

  In step S200, the control apparatus 24 starts the temporary press-bonding process control A, and shifts the step to step S210 (see FIG. 11). Then, when the temporary press-bonding process control A is completed, the step is shifted to step S300.

In step S300, the control device 24 determines the difference between the maximum distance Ltmax and the minimum Ltmin among the distances Lt when the chip components D to be simultaneously press-bonded are temporarily fixed to the circuit board C (at the time of temporary fixing). It is determined whether or not the variation in the Z-axis direction of the chip component D is equal to or less than the reference range Ltt.
As a result, when it is determined that the Z-axis direction variation of the temporarily fixed chip part D is equal to or less than the reference range Ltt, the control device 24 shifts the step to step S400.
On the other hand, when it is determined that the variation in the Z-axis direction of the temporarily fixed chip part D is not less than or equal to the reference range Ltt, that is, when it is determined that the temporary fixing is defective, the control device 24 ends the step.

  In step S400, the control device 24 starts the main crimping process control B and shifts the step to step S410 (see FIG. 12). And when this press-bonding process control B is complete | finished, a step is made to transfer to step S500.

In step S500, the control device 24 determines whether or not the number of pressurizations of the main crimping head 17 has reached a predetermined number.
As a result, when it is determined that the number of pressurizations of the main press bonding head 17 has reached the predetermined number, the control device 24 shifts the step to step S600.
On the other hand, if it is determined that the number of pressurizations of the main press bonding head 17 has not reached the predetermined number, the control device 24 ends the step.

  In step S600, the control device 24 resets the number of times for distance measurement that the displacement sensor 21 for main crimping in the number of pressurizations of the head 17 for main crimping accumulates to measure the distance, and the process proceeds to step S700. Let

  In step S700, the control device 24 starts the main pressure bonding head replacement control C, and shifts the step to step S710 (see FIG. 13). Then, when the main pressure bonding head replacement control C is completed, the step is terminated.

  As shown in FIG. 11, in step S <b> 210 of the temporary pressure bonding process control A, the control device 24 transfers the circuit board C transferred from the upstream process (not shown) by the transfer device 23 to the temporary pressure bonding suction table 4 b of the temporary pressure bonding stage 4. Is held by suction, and the process proceeds to step S220.

  In step S220, the control device 24 sucks and holds the chip component D by the temporary crimping attachment 9 of the temporary crimping head 7, and shifts the step to step S230.

  In step S <b> 230, the control device 24 sucks and holds the alignment mark of the chip component D held by the temporary pressure bonding head 9 and the temporary pressure bonding stage 4 by the temporary pressure bonding image recognition device 11. The image information with the alignment mark of the circuit board C that has been acquired is acquired, and the process proceeds to step S240.

  In step S240, the control device 24, based on the acquired image information of the circuit board C and the chip component D, in the X-axis direction of the temporary crimping stage 4 for alignment between the circuit board C and the chip component D, The coordinate positions in the Y-axis direction and the θ direction are calculated, and the temporary pressure-bonding suction table 4b of the temporary pressure-bonding stage 4 is moved by the temporary pressure-bonding drive unit 4a, and the process proceeds to step S250.

  In step S250, the control device 24 presses and temporarily fixes the chip component D to the temporary press-bondable position Pt of the circuit board C with the temporary press-fit load Ft for a predetermined time by the temporary press-bonding unit 6, and shifts the step to step S260. .

  In step S260, the control device 24 moves the Z-axis direction of the chip component D (temporary pressure bonding head 7) temporarily fixed from the arbitrary reference position to the temporary pressure bonding possible position Pt of the circuit board C by the temporary pressure bonding displacement sensor 10. The distance Lt is acquired, and the process proceeds to step S270.

In step S <b> 270, the control device 24 determines whether or not the chip component D is temporarily fixed at all the temporary press-bondable positions Pt of the circuit board C.
As a result, when it is determined that the chip component D is temporarily fixed to all the temporary press-bondable positions Pt of the circuit board C, the control device 24 ends the temporary press-bonding process control A and shifts the step to step S300 ( (See FIG. 10).
On the other hand, when it is determined that the chip component D is not temporarily fixed at all the temporary press-bondable positions Pt of the circuit board C, the control device 24 shifts the step to step S220.

  As shown in FIG. 12, in step S410 of the main crimping process control B, the control device 24 determines the number of chip components D temporarily fixed within each reference main crimping range Ap of the circuit board C and one chip component D. Based on the unit final press-bonding load UFp necessary for fixing, the main press-bonding load Fp, which is the applied pressure in each reference main press-bonding range Ap, is calculated.

  In step S420, the control device 24 sucks and holds the circuit board C transported from the temporary press-bonding stage 4 by the transport device 23 by the main press-bonding suction table 14b of the main press-bonding stage 14, and shifts the step to step S430. .

  In step S430, the control device 24 acquires the image information of the alignment mark of the circuit board C that is attracted and held by the main press-bonding stage 14 by the main press-bonding image recognition device 20, and shifts the step to step S440.

  In step S440, based on the image information of the circuit board C, the control device 24 calculates coordinate positions in the X-axis direction, the Y-axis direction, and the θ-direction of the main press-bonding stage 14 for alignment of the circuit board C. At the same time, the main pressure-bonding suction table 14b of the main pressure-bonding stage 14 is moved by the main pressure-bonding drive unit 14a, and the process proceeds to step S450.

  In step S450, the control device 24 pressurizes the plurality of chip components D temporarily fixed in the reference main press-bonding range Ap with a main press-bonding load Fp in the reference main press-bonding range Ap to be pressed by the main press-bonding unit 16 for a predetermined time. And the process proceeds to step S460.

  In step S460, the control device 24 adds 1 to the number of times the main crimping head 17 has pressed the chip component D so far, and pressurizes the chip component D in the pressurized standard crimping range Ap. 1 is added to the number of pressurizations Np of the attachment 19 so far, and the process proceeds to step S470.

In step S470, the control device 24 determines whether or not the fixing of all the chip components D to the circuit board C by the main crimping unit 16 has been completed.
As a result, when it is determined that the fixing of all the chip components D to the circuit board C by the main crimping unit 16 is finished, the control device 24 finishes the main crimping process control B and shifts the step to Step S500 ( (See FIG. 10).
On the other hand, when it is determined that the fixing of all the chip components D to the circuit board C by the main crimping unit 16 has not been completed, the control device 24 shifts the step to step S430.

  As shown in FIG. 13, in step S <b> 710 of the main press-bonding head replacement control C, the control device 24 controls the main press-bonding head 17 disposed at a predetermined position by the main press-bonding displacement sensor 21 up to each main press-bonding attachment 19. The distance Lp in the Z-axis direction is measured, and the step moves to step S720.

In step S720, the control device 24 determines whether or not the number of pressurizations Np of each main crimping attachment 19 is less than a predetermined number Npt.
As a result, when it is determined that the pressurization frequency Np of each main pressure bonding attachment 19 is less than the predetermined frequency Npt, the control device 24 shifts the step to step S730.
On the other hand, when it is determined that the number of pressurizations Np of at least one main-compression attachment 19 among the pressurization-counts Np of each main-compression attachment 19 is not less than the predetermined number Npt, the control device 24 shifts the step to step S750. .

In step S730, the control device 24 determines whether or not the difference ΔNp between the maximum value and the minimum value of the pressurization frequency Np of each main pressure bonding attachment 19 is less than a predetermined frequency difference ΔNpt.
As a result, when it is determined that the number difference ΔNp between the maximum value and the minimum value of the number of pressurizations Np of each main pressure bonding attachment 19 is less than the predetermined number difference ΔNpt, the control device 24 shifts the step to Step S740.
On the other hand, when it is determined that the number difference ΔNp between the maximum value and the minimum value of the number of pressurizations Np of each main pressure bonding attachment 19 is not less than the predetermined number difference ΔNpt, the control device 24 shifts the step to Step S750.

In step S740, the control device 24 determines whether or not the amount of change ΔLp from the initial value of the distance Lp to each main crimping attachment 19 measured by the main crimping displacement sensor 21 is less than a predetermined change amount ΔLpt.
As a result, when it is determined that the amount of change from the initial value of the distance to each main crimping attachment 19 is less than the predetermined change amount ΔLpt, the control device 24 ends the main crimping head replacement control C and ends the step. (See FIG. 10).
On the other hand, when it is determined that the change amount of at least one main crimping attachment 19 is not less than the predetermined change amount ΔLpt among the change amounts from the initial values of the distances to the respective main crimping attachments 19, the control device 24 performs steps. The process proceeds to S750.

  In step S750, the control device 24 notifies the operator that the rubber member 19a supporting the main pressure bonding attachment 19 has deteriorated due to aging, and notifies the operator to the higher-order control device. And the process proceeds to step S760.

  In step S760, the control device 24 switches the one at the pressing position Pf between the first and second crimping heads 17a and 17b to the standby position Pw by an actuator (not shown), and Of the head 17a and the second final crimping head 17b, the one at the standby position Pw is switched to the pressurizing position Pf by an actuator (not shown), the final crimping head replacement control C is terminated, and the step is terminated (see FIG. 10). ).

  With this configuration, the semiconductor mounting apparatus 1 does not apply an excessive load to the rubber member 19a that supports the main pressure bonding attachment 19 of the main pressure bonding head 17 in the main pressure bonding step. That is, regardless of the number of chip components D simultaneously pressed by the main pressure bonding head 17, the force applied to one chip component D becomes equal, and the change with time due to the pressing of the pressure head becomes uniform. In addition, the semiconductor mounting apparatus 1 detects the use state of each rubber member 19a that supports each main-bonding attachment 19 regardless of the number and position of the temporarily fixed chip parts D. That is, it is possible to indirectly grasp the time-dependent change of the rubber member 19a from the number of pressurization times Np of each main-bonding attachment 19 that is in use, and notify the occurrence of variations in the pressurization state based on the change over time. it can. Further, the semiconductor mounting apparatus 1 changes the first crimping head 17a that pressurizes the chip component D based on the change over time according to the number of pressurization times Np of the rubber member 19a by quantitative evaluation. By exchanging them with each other, variation due to aging of the rubber member 19a can be suppressed within a certain range. Thereby, generation | occurrence | production of the joining defect of the chip component D resulting from the dispersion | variation in a pressurization state can be suppressed. In the present embodiment, the semiconductor mounting apparatus 1 includes a notification that the rubber member 19a supporting the main pressure bonding attachment 19 has deteriorated due to a change with time, and the first pressure bonding head 17a and the second pressure bonding head 17a. Although the replacement with the pressure bonding head 17b is performed together, the present invention is not limited to this, and a configuration in which only one of them is performed may be employed.

  Next, with reference to FIG. 14, as a second embodiment of the semiconductor mounting apparatus 1 according to the present invention, a description will be given of the equalization processing control of the main press bonding head 17 of the main press bonding apparatus 12 in the main press bonding process of the semiconductor mounting apparatus 1. To do. In the following embodiments, the same points as those of the above-described embodiments will not be specifically described, and different portions will be mainly described.

  As shown in FIG. 14A, the semiconductor mounting apparatus 1 performs at least one of the pressurization times Np of each main press-bonding attachment 19 accumulated in the main press-bonding apparatus 12 as control for equalizing the main press-bonding head 17. When the number of pressurizations Np of one main crimping attachment 19 is equal to or greater than the predetermined number Npt (see FIG. 8A), the difference between the maximum and minimum values of the number of pressurizations Np of each maincompression attachment 19 When ΔNp is equal to or greater than the predetermined number of differences ΔNpt (see FIG. 8B), the distance of at least one main crimping attachment 19 among the change amount ΔLp of the distance to each main crimping attachment 19 detected by the displacement sensor. When the amount of change ΔLp of this becomes equal to or greater than the predetermined amount of change ΔLpt (see FIG. 8C), the rubber member 19a supporting the main pressure bonding attachment 19 changes over time. It is determined that the chip part D cannot be pressurized more appropriately. Then, as shown in FIG. 14B, the semiconductor mounting apparatus 1 is configured such that the main press-bonding head 17 is applied to the main press-bonding stage 14 or a uniformizing stage (not shown) with a predetermined uniformizing temperature Te and a uniformizing load Fe. Pressurize for the equalization time. Thereby, the sag in the Z-axis direction due to the change with time of the rubber member 19a supporting each main-bonding attachment 19 is made uniform. In the present embodiment, the semiconductor mounting device 1 is configured to notify when each of the above-described conditions is satisfied in each of the main-bonding attachments 19, but is not limited thereto. Alternatively, a determination may be made based on only one or two conditions, or a determination may be made when all of a plurality of selected conditions are satisfied.

  Below, the control aspect of the semiconductor mounting apparatus 1 which concerns on 2nd embodiment of this invention is demonstrated concretely using FIG. 15 and FIG.

  As shown in FIG. 15, in step S <b> 600, the control device 24 resets the distance measurement count accumulated by the main crimping displacement sensor 21 for measuring the distance in the number of pressurizations of the main crimping head 17. , The process proceeds to step S800.

  In step S800, the control device 24 starts the main press-bonding head 17 equalization process control D, and shifts the step to step S810 (see FIG. 16). Then, when the main press-bonding head 17 equalizing process control D is finished, the step is finished.

  As shown in FIG. 16, steps S810 to S850 of the main crimping head replacement control C are the same as steps S710 to S750 of the main crimping head replacement control C already described, and thus description thereof is omitted. .

  In step S860, the control device 24 pressurizes the main press-bonding head 17 to the main press-bonding stage 14 or a uniformizing stage (not shown) for a predetermined time with a predetermined uniformizing temperature Te and a uniformizing load Fe. The head 17 equalization process control D is terminated and the step is terminated (see FIG. 15).

  By configuring in this way, the semiconductor mounting apparatus 1 is configured so that, in the final crimping step, the Z-axis direction of the rubber member 19a supporting each final crimping attachment 19 is based on the grasped change with time of the rubber member 19a. Since the sag is made uniform, it is possible to suppress the occurrence of defective bonding of the chip component D due to the variation in the pressurizing state without replacing the main pressure bonding head 17. In the first embodiment and the second embodiment according to the present invention, the semiconductor mounting apparatus 1 fixes the chip component D to the circuit board C. However, the present invention is not limited to this. A configuration in which a plurality of chip components D are stacked and fixed may be employed. Further, the semiconductor mounting apparatus 1 has a moving mechanism by the main pressure bonding stage 14, but is not limited to this.

  The embodiment of the present invention has been described above, but the present invention is not limited to such an embodiment, and is merely an example, and various modifications can be made without departing from the scope of the present invention. Of course, the scope of the present invention is indicated by the description of the scope of claims, and further, the equivalent meanings described in the scope of claims and all modifications within the scope of the scope of the present invention are included. Including.

DESCRIPTION OF SYMBOLS 1 Semiconductor mounting apparatus 2 Temporary crimping apparatus 17 Head for final crimping C Circuit board D Chip component Pt Temporary crimping possible position Fp Final crimping load Np Number of pressurization

Claims (4)

In a semiconductor mounting apparatus including a pressure head that pressurizes and fixes a chip component at a predetermined position on a circuit board.
From the position of the pressure head with respect to the circuit board, calculate the number of chip parts that the pressure head simultaneously presses at that position, and change the pressure of the pressure head based on the number of the chip parts,
While the pressure head pressurizes the chip component ,
A semiconductor mounting apparatus that integrates the number of times the chip component is pressed at each position where the chip component is pressed in the pressure head . The pressure head includes a plurality of attachments that contact the chip component and a plurality of elastic bodies that support each attachment independently, and the variation in position in the pressing direction of the chip component that contacts each attachment is an elastic body. The semiconductor mounting apparatus according to claim 1, wherein the number of times the chip component is pressed is integrated for each attachment. A distance detecting means for measuring a distance from an arbitrary reference position to each attachment is provided, and the number of times of pressing the chip component of at least one attachment out of the number of times of pressing the chip component of each attachment is equal to or more than a predetermined number. If the difference between the maximum value and the minimum value of the number of times of pressing the chip part of each attachment is equal to or greater than a predetermined number of times, or the amount of change in distance to each attachment detected by the distance detection means 3. The semiconductor mounting apparatus according to claim 2 , wherein when at least one attachment distance change amount is equal to or greater than a predetermined change amount, at least one of notification to that effect and replacement of the pressure head is performed. A distance detecting means for measuring a distance from an arbitrary reference position to each attachment is provided, and the number of times of pressing the chip component of at least one attachment out of the number of times of pressing the chip component of each attachment is equal to or more than a predetermined number. If the difference between the maximum value and the minimum value of the number of times of pressing the chip part of each attachment is equal to or greater than a predetermined number of times, or the amount of change in distance to each attachment detected by the distance detection means 3. The method according to claim 2 , wherein when the amount of change in the distance of at least one of the attachments is equal to or greater than a predetermined amount of change, at least one of heat treatment and pressure treatment for making the state of the elastic body of each attachment the same is performed. Semiconductor mounting equipment.

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