JP2021027294A - Component mounting apparatus and component mounting method - Google Patents

Abstract

To provide a component mounting apparatus whose crimp accuracy can be improved.SOLUTION: A component mounting apparatus 10 for mounting a component 300 on a board 200 by crimping a plurality of board electrodes 202 of the board 200 on a plurality of component electrode 302 of the component 300 comprises: an electrode information acquisition unit 37 that with respect to the plurality of board electrodes 202 and the plurality of component electrode 302 to be crimped on each other, acquires first electrode information including information on arrangement of the plurality of board electrodes 202 and second electrode information including information on arrangement of the plurality of component electrodes 302; a parameter determination unit 40 that on the basis of the first electrode information and the second electrode information, determines a parameter on crimping between the plurality of board electrodes 202 and the plurality of component electrode 302 to be crimped on each other; and a crimping unit 23 that on the basis of the parameter, crimps the plurality of board electrodes 202 and the plurality of component electrode 302 to be crimped on each other.SELECTED DRAWING: Figure 6

Description

The present invention relates to a component mounting device and a component mounting method for mounting components on a substrate.

Patent Document 1 discloses a mounting device for mounting components on a substrate. In the mounting device of Patent Document 1, a component is temporarily crimped to the upper surface of the substrate via an anisotropic conductive member, the temporarily crimped component is pressed to the substrate side with a pressurizing tool, and the component is main crimped to the upper surface of the substrate. By doing so, the component is mounted on the board. Further, in the mounting apparatus of Patent Document 1, after the component is main crimped to the substrate, the amount of deviation between the first lead of the substrate and the second lead of the component is measured, and based on the amount of deviation, the subsequent main crimping is performed. Set the descent speed of the pressurizing tool.

Japanese Unexamined Patent Publication No. 2013-12677

However, in the mounting apparatus of Patent Document 1, it is set when the size of the substrate and the component to which the displacement is measured before crimping differs from the dimension of the substrate and the component to be crimped after that due to an error during manufacturing or the like. It is conceivable that the descending speed is not appropriate and the crimping accuracy deteriorates.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a component mounting device and a component mounting method capable of improving crimping accuracy.

In order to achieve the above object, the component mounting device, which is one of the present inventions, mounts the component on the substrate by crimping a plurality of substrate electrodes of the substrate and a plurality of component electrodes of the component. In the component mounting device, the first electrode information including information regarding the arrangement of the plurality of substrate electrodes and the arrangement of the plurality of component electrodes in the plurality of substrate electrodes and the plurality of component electrodes to be crimped to each other. The electrode information acquisition unit that acquires the second electrode information including information about, and the plurality of substrate electrodes and the plurality of components that are crimped to each other based on the first electrode information and the second electrode information. It includes a parameter determining unit that determines parameters related to crimping with the electrodes, and a crimping unit that crimps the plurality of substrate electrodes and the plurality of component electrodes that are crimped to each other based on the parameters.

Further, in order to achieve the above object, another component mounting method of the present invention is to press a plurality of substrate electrodes of the substrate and a plurality of component electrodes of the component to the substrate. A component mounting method for mounting components, wherein the plurality of substrate electrodes and the plurality of component electrodes to be crimped to each other include first electrode information including information regarding arrangement of the plurality of substrate electrodes, and the plurality of electrodes. The electrode information acquisition step of acquiring the second electrode information including the information regarding the arrangement of the component electrodes, and the plurality of substrate electrodes to be crimped to each other based on the first electrode information and the second electrode information. The present invention includes a parameter determination step of determining parameters related to crimping with the plurality of component electrodes, and a crimping step of crimping the plurality of substrate electrodes and the plurality of component electrodes to be crimped to each other based on the parameters. ..

According to the present invention, the accuracy of crimping can be improved.

It is a schematic diagram which shows the whole structure of a component mounting system. (A) is a diagram showing a substrate, and (b) is a diagram showing parts. It is a schematic view which shows the temporary crimping part of the component mounting system of FIG. 1, (a) is a figure which shows the state which the substrate is not placed on the 1st stage, (b) is the figure which shows the substrate | It is a figure which shows the state which is placed on the stage. It is a schematic view which shows the main crimping part of the component mounting system of FIG. 1, (a) is a figure which shows the state which the substrate is not placed on the 2nd stage, (b) is the figure which shows the substrate | It is a figure which shows the state which is placed on the stage. It is a block diagram which shows the electrical structure of the component mounting apparatus of the component mounting system of FIG. It is a flowchart which shows an example of the operation of the component mounting apparatus of the component mounting system of FIG. It is a flowchart which shows an example of the operation included in step S3 of FIG. It is a table which shows the parameter about crimping. It is a figure which shows an example of the operation of the temporary crimping part when Δ is a predetermined value, (a) is a graph which shows the relationship between the height and time of a 1st head, and (b) is a 1st load It is a graph showing the relationship with time, (c) is a graph showing the relationship between the temperature and time of the first head, and (d) is a graph showing the relationship between the temperature and time of the first stage. is there. It is a figure which shows an example of the operation of a temporary crimping part, (a) is a graph which shows the relationship between the height of the 1st head and time, and (b) is a 1st load when Δ is a predetermined value. It is a graph which shows the relationship with time, (c) is a graph which shows the relationship between the first load and time when Δ is larger than a predetermined value, and (d) is a graph which shows Δ is smaller than a predetermined value. It is a graph which shows the relationship between the 1st load and time in the case. It is a figure which shows an example of the operation of this crimping part when Δ is a predetermined value, (a) is a graph which shows the relationship between the height and time of a 2nd head, and (b) is a 2nd load It is a graph showing the relationship with time, (c) is a graph showing the relationship between the temperature and time of the second head, and (d) is a graph showing the relationship between the temperature and time of the second stage. is there. It is a figure which shows an example of the operation of this crimping part, (a) is a graph which shows the relationship between the height of a 2nd head and time, and (b) is a 2nd load when Δ is a predetermined value. It is a graph which shows the relationship with time, (c) is a graph which shows the relationship between the 2nd load and time when Δ is larger than a predetermined value, and (d) is a graph which shows Δ is smaller than a predetermined value. It is a graph which shows the relationship between the 2nd load and time in the case.

Next, an embodiment of the component mounting device and the component mounting method according to the present invention will be described with reference to the drawings. It should be noted that all of the embodiments described below are comprehensive or specific examples. The numerical values, shapes, materials, components, arrangement positions and connection forms of the components, steps, the order of steps, etc. shown in the following embodiments are examples, and are not intended to limit the present invention. Further, among the components in the following embodiments, the components not described in the independent claims indicating the highest level concept are described as arbitrary components.

In addition, the drawings are schematic views in which emphasis, omission, and ratio are adjusted as appropriate to show the present invention, and may differ from the actual shape, positional relationship, and ratio.

FIG. 1 is a schematic view showing the overall configuration of the component mounting system 100. FIG. 2A is a diagram showing a substrate 200, and FIG. 2B is a diagram showing a component 300. FIG. 3 is a schematic view showing a temporary crimping portion 24 of the component mounting system 100 of FIG. 1, and FIG. 3A is a view showing a state in which the substrate 200 is not placed on the first stage 32. b) is a diagram showing a state in which the substrate 200 is placed on the first stage 32. FIG. 4 is a schematic view showing the main crimping portion 28 of the component mounting system 100 of FIG. 1, and FIG. 4A is a diagram showing a state in which the substrate 200 is not placed on the second stage 36. b) is a diagram showing a state in which the substrate 200 is placed on the second stage 36. The configuration of the component mounting system 100 will be described with reference to FIGS. 1 to 4.

The component mounting system 100 is a system for mounting components 300 on a substrate 200, and includes a component mounting device 10, a loader 12, a washing machine 14, an unloader 16, and a line controller 18 as shown in FIG. ..

As shown in FIG. 2A and FIG. 3, the substrate 200 on which the component 300 is mounted has a plate shape. In the present embodiment, as the substrate 200, a substrate constituting a smartphone or the like is illustrated. For example, as a material constituting the substrate 200, a resin such as glass or polyimide can be used. The shape of the substrate 200 is not particularly limited and may not be plate-shaped. The substrate 200 has a plurality of substrate electrodes 202 provided at the edges and a pair of first alignment marks 204 on one main surface. The plurality of substrate electrodes 202 are conductive members such as metal provided on the surface of the substrate 200. The plurality of substrate electrodes 202 are arranged side by side in the first direction (X-axis direction in the drawing). Further, each of the plurality of substrate electrodes 202 is a thin and thin plate-shaped member extending in the second direction (Y-axis direction in the drawing) orthogonal to the first direction, and is exposed. The pair of first alignment marks 204 are provided on both sides of the plurality of substrate electrodes 202 in the first direction (X-axis direction in the drawing), and are provided so as to sandwich the plurality of substrate electrodes 202. The pair of first alignment marks 204 are cross-shaped marks, for acquiring first electrode information including information regarding the arrangement of a plurality of substrate electrodes 202, and for acquiring the positional relationship between the substrate 200 and the component 300. Etc. are used. The shape of the pair of first alignment marks 204 is not particularly limited and may not be cross-shaped.

As shown in FIG. 2B and FIG. 3, the component 300 has a plate shape. The type of the component 300 is not particularly limited, and can be exemplified as a circuit film component in which an electronic component is mounted on a flexible resin film such as TCP (Tape Carrier Package). For example, a resin such as polyimide can be used as the material constituting the component 300. The shape of the component 300 is not particularly limited and may not be plate-shaped. The component 300 has a plurality of component electrodes 302 provided on one end surface, and a pair of second alignment marks 304. The plurality of component electrodes 302 are conductive members such as metal provided on the surface of the component 300. The plurality of component electrodes 302 are arranged side by side in the first direction (X-axis direction in the drawing). Further, each of the plurality of component electrodes 302 is a thin and thin plate-shaped member extending in the second direction (Y-axis direction in the drawing) orthogonal to the first direction, and is exposed. The pair of second alignment marks 304 are provided on both sides of the plurality of component electrodes 302 in the first direction (X-axis direction in the drawing), and are provided so as to sandwich the plurality of component electrodes 302. The pair of second alignment marks 304 are cross-shaped marks, for acquiring second electrode information including information regarding the arrangement of a plurality of component electrodes 302, and for acquiring the positional relationship between the substrate 200 and the component 300. Etc. are used. The shape of the pair of second alignment marks 304 is not particularly limited and may not be cross-shaped.

As shown in FIG. 1, the loader 12 is a device for introducing a substrate 200 manufactured in another process into a component mounting system 100. On the other hand, the unloader 16 is a device that derives the board 200 on which the component 300 is mounted in the component mounting system 100 and delivers it to another process.

The washing machine 14 is a device that receives the substrate 200 supplied by the loader 12 and cleans the portion of the substrate 200 to which the ACF (Anisotropic Conductive Film) 400 is attached.

The component mounting device 10 is a device for mounting the component 300 on the substrate 200 by crimping the plurality of substrate electrodes 202 of the substrate 200 and the plurality of component electrodes 302 of the component 300, and the ACF sticking portion 20 and the component mounting device 10 A supply unit 22, a crimping unit 23, and an imaging unit 26 are provided.

The ACF sticking portion 20 sticks the ACF 400 at a predetermined position on the surface of the substrate 200. Here, the ACF 400 is a member capable of ensuring electrical conduction only in the pressure direction only in the portion to which the pressure is applied by applying heat and pressure together (see FIGS. 3 and 4). ). In this embodiment, the ACF 400 corresponds to an anisotropic conductive member.

The supply unit 22 supplies the component 300 mounted on the board 200. For example, the supply unit 22 sequentially punches the parts 300 from the tape members provided with the plurality of parts 300 at predetermined intervals, and supplies the punched parts 300 to the crimping unit 23.

The crimping unit 23 crimps the plurality of substrate electrodes 202 and the plurality of component electrodes 302 based on the parameters determined by the parameter determining unit 40 (described later). The crimping portion 23 has a temporary crimping portion 24 and a main crimping portion 28.

As shown in FIGS. 1 and 3, the temporary crimping portion 24 arranges the component 300 on the ACF 400 attached to the substrate 200 by the ACF attaching portion 20, and temporarily attaches the component 300 and the substrate 200 via the ACF 400. Crimping. The temporary crimping portion 24 has a first head 30 and a first stage 32.

The first head 30 sucks and holds the component 300 supplied from the supply unit 22 by a suction nozzle or the like, and transfers and arranges the component 300 to a predetermined position. Further, the first head 30 is held by moving in a third direction (Z-axis direction in the figure) orthogonal to the first direction (X-axis direction in the figure) and the second direction (Y-axis direction in the figure). The component 300 is pressed toward the substrate 200 mounted on the first stage 32, and a first load is applied to the component 300 and the substrate 200. The temperature of the first head 30 is adjusted by the first heater 42 (described later).

The first stage 32 is a member that supports the edge of the substrate 200 from below, and when the first head 30 presses the component 300 toward the substrate 200, a holding force for temporarily crimping the component 300 to the substrate 200. Is a member that gives The first stage 32 has a transparent portion, and the imaging unit 26 can image the substrate 200 and the component 300 from below the first stage 32. The temperature of the first stage 32 is adjusted by the first heater 42.

Further, the temporary crimping portion 24 further has a table (not shown) that supports the substrate 200 from below, and the substrate 200 is placed on the first stage 32 by the table, and the first stage 32 is evacuated from above.

As shown in FIGS. 1 and 3, the imaging unit 26 is provided in the temporary crimping unit 24, and images the substrate 200 and the component 300 that are crimped to each other. Specifically, the imaging unit 26 is provided so as to be located below the first stage 32 in the temporary crimping unit 24, and the pair of first alignment marks 204 of the substrate 200 and the pair of first parts 300 from below. 2 The alignment mark 304 is imaged (see the dotted arrow in FIG. 3A and the dotted arrow in FIG. 3B). In the present embodiment, the substrate 200 has a transparent portion, and the imaging unit 26 can image a pair of first alignment marks 204 of the substrate 200 from below. The image captured by the imaging unit 26 is transmitted to the line controller 18. For example, as the image pickup unit 26, a digital camera or the like including a line sensor or the like can be used. In the present embodiment, the imaging unit 26 corresponds to the first imaging unit and the second imaging unit.

As shown in FIGS. 1 and 4, the crimping portion 28 further presses the component 300 temporarily crimped to the substrate 200 to ensure the continuity between the substrate electrode 202 and the component electrode 302, and the component 300 and the substrate are connected. This is crimped with 200. For example, the main crimping portion 28 presses the component 300 toward the substrate 200 with a force larger than that of the temporary crimping portion 24. The crimping portion 28 has a second head 34 and a second stage 36.

By moving in the third direction (Z-axis direction in the drawing), the second head 34 presses the component 300 temporarily crimped to the substrate 200 placed on the second stage 36 toward the substrate 200. Then, a second load is applied to the component 300 and the substrate 200. For example, when the substrate 200 and the component 300 are main-bonded, the temperature of the second head 34 is set higher than the temperature of the first head 30, and the second head 34 has a force larger than that of the first head 30. Press 300. The temperature of the second head 34 is adjusted by the second heater 46 (described later).

The second stage 36 is a member that supports the edge of the substrate 200 from below, and when the second head 34 presses the component 300 toward the substrate 200, the holding force for main crimping the component 300 to the substrate 200. Is a member that gives The second stage 36 has a transparent portion so that the substrate 200 and the component 300 can be imaged from below the second stage 36. For example, when the substrate 200 and the component 300 are main-bonded, the temperature of the second stage 36 is set higher than the temperature of the first stage 32. The temperature of the second stage 36 is adjusted by the second heater 46.

Further, the crimping portion 28 further has a table (not shown) that supports the substrate 200 from below, and the substrate 200 is placed on the second stage 36 by the table, and the second stage 36 Evacuated from above.

The line controller 18 is a computer that manages and controls the operating status of the entire component mounting system 100, communication of various data, and the like. The line controller 18 is connected to each device.

FIG. 5 is a block diagram showing an electrical configuration of the component mounting device 10 of the component mounting system 100 of FIG. The electrical configuration of the component mounting device 10 will be described with reference to FIG. The component mounting device 10 further includes an electrode information acquisition unit 37 and a parameter determination unit 40.

The electrode information acquisition unit 37 includes first electrode information including information on the arrangement of the plurality of substrate electrodes 202 and arrangement of the plurality of component electrodes 302 in the plurality of substrate electrodes 202 and the plurality of component electrodes 302 that are crimped to each other. The second electrode information including the information about the second electrode is acquired. For example, the first electrode information also includes information such as the shape and size of the plurality of substrate electrodes 202. For example, the second electrode information also includes information such as the shape and size of the plurality of component electrodes 302. The electrode information acquisition unit 37 includes an imaging unit 26 and an image processing unit 38.

As described above, the imaging unit 26 is provided so as to be located below the first stage 32 in the temporary crimping unit 24.

The image processing unit 38 is provided in the line controller 18 and is connected to the image pickup unit 26. The image processing unit 38 calculates the distance A (see (a) in FIG. 2) between the pair of first alignment marks 204 on the substrate 200 by analyzing the image captured by the image pickup unit 26. Further, the image processing unit 38 calculates the distance B between the pair of second alignment marks 304 of the component 300 (see (b) in FIG. 2) and the like by analyzing the image captured by the image capturing unit 26. In this way, the electrode information acquisition unit 37 acquires information regarding the arrangement of the plurality of substrate electrodes 202, which is information including the distance A between the pair of first alignment marks 204 by the image pickup unit 26 and the image processing unit 38. To do. Further, the electrode information acquisition unit 37 acquires information regarding the arrangement of the plurality of component electrodes 302, which is information including the distance B between the pair of second alignment marks 304, by the imaging unit 26 and the image processing unit 38. As described above, the first electrode information includes the distance A between the pair of first alignment marks 204 of the substrate 200, and the second electrode information includes the distance B between the pair of second alignment marks 304 of the component 300. Is included.

The parameter determination unit 40 is provided in the line controller 18 and is connected to the electrode information acquisition unit 37. Based on the first electrode information and the second electrode information acquired by the electrode information acquisition unit 37, the parameter determination unit 40 sets parameters related to crimping between the plurality of substrate electrodes 202 and the plurality of component electrodes 302 to be crimped to each other. decide. Specifically, the parameter determination unit 40 is crimped to each other based on the distance A between the pair of first alignment marks 204 of the substrate 200 and the distance B between the pair of second alignment marks 304 of the component 300. Parameters related to crimping between the plurality of substrate electrodes 202 and the plurality of component electrodes 302 are determined. For example, the parameters include the magnitude of the first load, the rate of change when the magnitude of the first load is changed over time (hereinafter referred to as "first load velocity"), the temperature of the first head 30 and the like. The rate of change when the temperature of the first head 30 is changed with the passage of time, the temperature of the first stage 32, the rate of change when the temperature of the first stage 32 is changed with the passage of time, the rate of change of the first head 30 The parameter determination unit 40 includes the difference between the temperature and the temperature of the first stage 32, the moving speed of the first head 30 in the third direction (Z-axis direction in the drawing), and the like, and the parameter determination unit 40 determines the magnitude of the first load and the first load. 1 Determine the load speed, etc. The parameters include the magnitude of the second load, the rate of change when the magnitude of the second load is changed with the passage of time (hereinafter referred to as "second load speed"), the temperature of the second head 34, and so on. The rate of change when the temperature of the second head 34 is changed with the passage of time, the temperature of the second stage 36, the rate of change when the temperature of the second stage 36 is changed with the passage of time, the rate of change of the second head 34 The parameter determination unit 40 includes the difference between the temperature and the temperature of the second stage 36, the moving speed of the second head 34 in the third direction (Z-axis direction in the figure), and the like, and the parameter determination unit 40 determines the magnitude of the second load and the second load. 2 Determine the load speed, etc.

The temporary crimping unit 24 further includes a first heater 42 and a first control unit 44. The first heater 42 is connected to the first head 30 and the first stage 32, and adjusts the temperature of the first head 30 and the first stage 32. The first control unit 44 is connected to the parameter determination unit 40, the first head 30, the first stage 32, and the first heater 42. The first control unit 44 controls the first head 30, the first stage 32, and the first heater 42 based on the parameters determined by the parameter determination unit 40, and temporarily crimps the substrate 200 and the component 300. Specifically, the first control unit 44 temporarily crimps the substrate 200 and the component 300 with the magnitude of the first load determined by the parameter determination unit 40, the first load speed, and the like. The first stage 32 and the first heater 42 are controlled.

The crimping portion 28 further includes a second heater 46 and a second control portion 48. The second heater 46 is connected to the second head 34 and the second stage 36, and adjusts the temperature of the second head 34 and the second stage 36. The second control unit 48 is connected to the parameter determination unit 40, the second head 34, the second stage 36, and the second heater 46. The second control unit 48 controls the second head 34, the second stage 36, and the second heater 46 based on the parameters determined by the parameter determination unit 40, and mainly crimps the substrate 200 and the component 300. Specifically, the second control unit 48 has the second head 34, so as to perform main crimping between the substrate 200 and the component 300 with the magnitude of the second load determined by the parameter determination unit 40, the second load speed, and the like. The second stage 36 and the second heater 46 are controlled.

Next, the operation of the component mounting device 10 configured as described above will be described.

FIG. 6 is a flowchart showing an example of the operation of the component mounting device 10 of the component mounting system 100 of FIG. FIG. 7 is a flowchart showing an example of the operation included in step S3 of FIG.

With reference to FIG. 6, when the substrate 200 to which the ACF 400 is attached and the component 300 are supplied to the temporary crimping portion 24, the electrode information acquisition portion 37 acquires the first electrode information (first electrode information). Acquisition step) (step S1 in FIG. 6). For example, as shown in FIG. 3B, the substrate 200 is placed on the first stage 32, and the pair of first alignment marks 204 of the substrate 200 are arranged above the imaging unit 26. Then, the image pickup unit 26 images the substrate 200, and the image processing unit 38 analyzes the image captured by the image pickup unit 26 to acquire the first electrode information. The first electrode information includes a distance A between a pair of first alignment marks 204 on the substrate 200. In this way, the electrode information acquisition unit 37 takes an image of the substrate 200 before being crimped to the component 300, and acquires the first electrode information of the substrate 200 before being crimped to the component 300.

Next, the electrode information acquisition unit 37 acquires the second electrode information (second electrode information acquisition step) (step S2 in FIG. 6). For example, as shown in FIG. 3A, the substrate 200 is temporarily retracted from the first stage 32, and a pair of second alignment marks 304 of the component 300 are arranged above the imaging unit 26. Then, the imaging unit 26 images the component 300, and the image processing unit 38 analyzes the image captured by the imaging unit 26 to acquire the second electrode information. The second electrode information includes a distance B between a pair of second alignment marks 304 of the component 300. In this way, the electrode information acquisition unit 37 takes an image of the component 300 before being crimped to the substrate 200, and acquires the second electrode information of the component 300 before being crimped to the substrate 200.

Next, the parameters are determined based on the acquired first electrode information and the second electrode information (parameter determination step) (step S3 in FIG. 6).

With reference to FIG. 7, first, the parameter determination unit 40 determines the distance A between the pair of first alignment marks 204 on the substrate 200 and the pair of components 300 based on the first electrode information and the second electrode information. Compared with the distance B between the second alignment marks 304, (distance A between the pair of first alignment marks 204 of the substrate 200)-(distance B between the pair of second alignment marks 304 of the component 300) (hereinafter, It is determined whether or not (referred to as Δ) is a predetermined value (step S11 in FIG. 7). For example, the predetermined value is preset based on the material constituting the substrate 200, the material constituting the component 300, and the like. Specifically, it is set in advance based on the coefficient of thermal expansion of the material constituting the substrate 200, the coefficient of thermal expansion of the material constituting the component 300, and the like. For example, the predetermined value may be set to a predetermined value such as 0 μm or 1 μm, or may be set to a value in a predetermined range such as -1 μm or more and 1 μm or less. For example, when the predetermined value is set to 0 μm, if the distance A between the pair of first alignment marks 204 of the substrate 200 and the distance B between the pair of second alignment marks 304 of the component 300 are equal, Δ is It becomes 0 μm, that is, a predetermined value. On the other hand, if the distance A between the pair of first alignment marks 204 of the substrate 200 and the distance B between the pair of second alignment marks 304 of the component 300 are not equal, Δ will not be 0 μm and will not be a predetermined value. Further, for example, when the predetermined value is set to -1 μm or more and 1 μm or less, if Δ is 0 μm, 1 μm, or the like, Δ is a predetermined value, and if Δ is 2 μm or the like, Δ is not a predetermined value.

If Δ is a predetermined value (Yes in step S11 of FIG. 7), the parameter determination unit 40 uses the parameter as a reference value (step S12 of FIG. 7). FIG. 8 is a table showing parameters related to crimping. As shown in FIG. 8, here, the parameters are the first load velocity, the maximum value of the first load, the maximum value of the temperature of the first head 30, the maximum value of the temperature of the first stage 32, and the first head 30. The difference between the temperature of the first stage 32 and the temperature of the first stage 32, and the descending speed of the first head 30 are included. The parameters include the second load velocity, the maximum value of the second load, the maximum value of the temperature of the second head 34, the maximum value of the temperature of the second stage 36, the temperature of the second head 34, and the temperature of the second stage 36. The difference from the temperature and the descending speed of the second head 34 are included. Then, the first load velocity, the maximum value of the first load, the maximum value of the temperature of the first head 30, the maximum value of the temperature of the first stage 32, the difference between the temperature of the first head 30 and the temperature of the first stage 32. , The descending speed of the first head 30, the second load speed, the maximum value of the second load, the maximum value of the temperature of the second head 34, the maximum value of the temperature of the second stage 36, the temperature of the second head 34 and the second. Reference values are set for each of the difference from the temperature of the stage 36 and the descending speed of the second head 34. If Δ is a predetermined value (Yes in step S11 of FIG. 7), the parameter determination unit 40 sets the parameter as the reference value. Each reference value is set in advance to a value or the like that allows the substrate 200 and the component 300 to be appropriately crimped when Δ is a predetermined value.

If Δ is determined whether or not it is a predetermined value (step S11 in FIG. 7) and Δ is not a predetermined value (No in step S11 in FIG. 7), the parameter determination unit 40 determines whether or not Δ is larger than the predetermined value. (Step S13 in FIG. 7). For example, when the predetermined value is set to 0 μm, the parameter determination unit 40 determines that Δ is larger than the predetermined value if Δ is larger than 0 μm, and Δ is the predetermined value if Δ is smaller than 0 μm. Judged to be smaller than. Further, for example, when the predetermined value is set to -1 μm or more and 1 μm or less, the parameter determination unit 40 determines that if Δ is larger than 1 μm, Δ is larger than the predetermined value, and Δ is larger than -1 μm. If it is small, it is determined that Δ is smaller than the predetermined value.

When Δ is larger than a predetermined value (Yes in step S13 of FIG. 7), the parameter determination unit 40 changes the parameter to a value different from the reference value (step S14 of FIG. 7). For example, the parameter determination unit 40 changes the parameter to a value different from the reference value so as to promote the thermal expansion of the component 300. For example, the parameter determination unit 40 reduces the first load velocity from the reference value. Further, the parameter determination unit 40 reduces the maximum value of the first load from the reference value. Further, the parameter determination unit 40 increases the maximum value of the temperature of the first head 30 from the reference value. Further, the parameter determination unit 40 reduces the maximum value of the temperature of the first stage 32 from the reference value. Further, the parameter determination unit 40 increases the difference between the temperature of the first head 30 and the temperature of the first stage 32 from the reference value. Further, the parameter determination unit 40 increases the descending speed of the first head 30 from the reference value. In addition, the parameter determination unit 40 reduces the second load speed from the reference value. Further, the parameter determination unit 40 reduces the maximum value of the second load from the reference value. Further, the parameter determination unit 40 increases the maximum value of the temperature of the second head 34 from the reference value. Further, the parameter determination unit 40 reduces the maximum value of the temperature of the second stage 36 from the reference value. Further, the parameter determination unit 40 increases the difference between the temperature of the second head 34 and the temperature of the second stage 36 from the reference value. Further, the parameter determination unit 40 increases the descending speed of the second head 34 from the reference value. In addition, the parameter determination unit 40 may change only one of the above parameters, may change any two or more of them, or may change all of them.

When it is determined whether or not Δ is larger than the predetermined value (step S13 in FIG. 7) and Δ is not larger than the predetermined value (No in step S13 in FIG. 7), the parameter determination unit 40 uses the parameter as a reference value. Change to a value different from (step S15 in FIG. 7). For example, the parameter determination unit 40 changes the parameter to a value different from the reference value so as to suppress the thermal expansion of the component 300. For example, the parameter determination unit 40 increases the first load velocity from the reference value. Further, the parameter determination unit 40 increases the maximum value of the first load from the reference value. Further, the parameter determination unit 40 reduces the maximum value of the temperature of the first head 30 from the reference value. Further, the parameter determination unit 40 increases the maximum value of the temperature of the first stage 32 from the reference value. Further, the parameter determination unit 40 reduces the difference between the temperature of the first head 30 and the temperature of the first stage 32 from the reference value. Further, the parameter determination unit 40 reduces the descending speed of the first head 30 from the reference value. Further, the parameter determination unit 40 increases the second load speed from the reference value. Further, the parameter determination unit 40 increases the maximum value of the second load from the reference value. Further, the parameter determination unit 40 reduces the maximum value of the temperature of the second head 34 from the reference value. Further, the parameter determination unit 40 increases the maximum value of the temperature of the second stage 36 from the reference value. Further, the parameter determination unit 40 reduces the difference between the temperature of the second head 34 and the temperature of the second stage 36 from the reference value. Further, the parameter determination unit 40 reduces the descending speed of the second head 34 from the reference value. In addition, the parameter determination unit 40 may change only one of the above parameters, may change any two or more of them, or may change all of them.

As described above, the parameter determination unit 40 determines whether the parameter related to crimping should be a reference value or a value different from the reference value by comparing Δ with a predetermined value. Specifically, the parameter determination unit 40 determines the magnitude of the first load, the magnitude of the second load, and the like by comparing Δ with a predetermined value.

Returning to FIG. 6, when the parameters are determined, the first control unit 44 controls the first head 30, the first stage 32, the first heater 42, and the like based on the determined parameters, and the substrate 200 and the like. Temporarily crimping the component 300 (temporary crimping step) (step S4 in FIG. 6).

FIG. 9 is a graph showing an example of the operation of the temporary crimping portion when Δ is a predetermined value, FIG. 9A is a graph showing the relationship between the height of the first head and time, and FIG. 9B is a graph showing the relationship between the height and time of the first head. It is a graph which shows the relationship between the 1st load and time, (c) is a graph which shows the relationship between the temperature and time of the 1st head, and (d) is the relationship between the temperature and time of the 1st stage. It is a graph which shows. An example of the operation of the temporary crimping portion when Δ is a predetermined value, that is, when the parameter is a reference value will be described with reference to FIG.

First, the first control unit 44 controls the first head 30 and the like based on the image captured by the image pickup unit 26, and aligns the substrate 200 with the component 300. Specifically, in the first control unit 44, the substrate 200 is placed on the first stage 32, the plurality of substrate electrodes 202 and the plurality of component electrodes 302 face each other, and a pair of first alignment marks on the substrate 200. The substrate 200 and the component 300 are aligned so that the center between the 204 and the center between the pair of second alignment marks 304 of the component 300 substantially coincide with the third direction (Z-axis direction in the drawing). Then, the first control unit 44 controls the first head 30 and the like so that the magnitude of the first load, the first load speed, and the like become reference values, and temporarily crimps the substrate 200 and the component 300. For example, the first control unit 44 lowers the first head 30 at a predetermined speed at the time T1 (see (a) of FIG. 9). Then, at time T2, the component 300 held by the first head 30 comes into contact with the substrate 200 via the ACF 400 (see FIG. 9A). When the component 300 comes into contact with the substrate 200 via the ACF 400, the first control unit 44 determines the substrate 200 at a predetermined first load rate so that the first load applied to the substrate 200 and the component 300 increases with the passage of time. And a load is applied to the component 300 (see time T2 to time T3 in FIG. 9B). Then, at the time T3, the first load becomes the maximum value. When the first load reaches the maximum value, the first control unit 44 maintains the state in which the first load reaches the maximum value until the time T4. At the time T4, the first control unit 44 applies a load to the substrate 200 and the component 300 at a predetermined first load speed so that the first load applied to the substrate 200 and the component 300 decreases with the passage of time. See time T4 to time T5 in (b) of FIG. 9). Then, at time T5, the first head 30 is separated from the component 300. Further, for example, the first control unit 44 may maintain the temperature of the first head 30 constant (see (i) of (c) of FIG. 9), and may change according to the operation of the first head 30. In some cases (see (ii) in (c) of FIG. 9). Further, the first control unit 44 may maintain the temperature of the first stage 32 constant (see (iii) in (d) of FIG. 9), or may change the temperature according to the operation of the first head 30. There is also.

10A and 10B are graphs showing an example of the operation of the temporary crimping portion, FIG. 10A is a graph showing the relationship between the height of the first head and time, and FIG. 10B is a graph when Δ is a predetermined value. It is a graph which shows the relationship between a 1st load and time, (c) is a graph which shows the relationship between a 1st load and time when Δ is larger than a predetermined value, and (d) is a graph which shows Δ is predetermined. It is a graph which shows the relationship between the first load and time when it is smaller than a value.

When Δ is larger than a predetermined value, for example, the first control unit 44 controls the first head 30 and the like so that the first load speed becomes smaller than the reference value. In this case, for example, as shown in FIG. 10C, when Δ is a predetermined value for the time from the contact of the component 300 with the substrate 200 to the maximum value of the first load at the time T2 (FIG. Compared to (see (b) of 10), it is longer. As a result, for example, the thermal expansion of the component 300 is promoted, and the substrate 200 and the component can be accurately crimped.

When Δ is not larger than a predetermined value, for example, the first control unit 44 controls the first head 30 and the like so that the first load speed becomes larger than the reference value. In this case, for example, as shown in FIG. 10D, when Δ is a predetermined value for the time from the contact of the component 300 with the substrate 200 to the maximum value of the first load at the time T2 (FIG. Compared to 10 (b)), it is shorter. As a result, for example, the thermal expansion of the component 300 is suppressed, and the substrate 200 and the component can be accurately crimped.

As described above, the temporary crimping unit 24 temporarily crimps the substrate 200 and the component 300 based on the parameters determined by the parameter determining unit 40.

Returning to FIG. 6, when the temporary crimping of the substrate 200 and the component 300 is completed, the substrate 200 and the component 300 are transferred to the main crimping portion 28, and the second control unit 48 is subjected to the second control unit 48 based on the determined parameters. The head 34, the second stage 36, the second heater 46, and the like are controlled to perform main crimping of the substrate 200 and the component 300 (main crimping step) (step S5 in FIG. 6).

FIG. 11 is a graph showing an example of the operation of the main crimping portion when Δ is a predetermined value, FIG. 11A is a graph showing the relationship between the height of the second head and time, and FIG. The graph shows the relationship between the second load and time, (c) is a graph showing the relationship between the temperature and time of the second head, and (d) is the relationship between the temperature and time of the second stage. It is a graph which shows. An example of the operation of the crimping portion when Δ is a predetermined value, that is, when the parameter is a reference value will be described with reference to FIG.

First, the second control unit 48 places the substrate 200 on which the component 300 is temporarily crimped on the second stage 36. Then, the second control unit 48 controls the second head 34 and the like so that the magnitude of the second load, the second load speed, and the like become reference values, and the substrate 200 and the component 300 are mainly crimped. For example, the second control unit 48 lowers the second head 34 at a predetermined speed at the time T6 (see (a) in FIG. 11). Then, at time T7, the second head 34 comes into contact with the component 300 temporarily crimped to the substrate 200 (see (a) in FIG. 11). When the second head 34 comes into contact with the component 300, the second control unit 48 determines the substrate 200 and the component at a predetermined second load speed so that the second load applied to the substrate 200 and the component 300 increases with the passage of time. A load is applied to 300 (see time T7 to time T8 in FIG. 11B). Then, at time T8, the second load becomes the maximum value. When the second load reaches the maximum value, the second control unit 48 maintains the state in which the second load reaches the maximum value until the time T9. At time T9, the second control unit 48 applies a second load to the substrate 200 and the component 300 at a predetermined second load speed so that the second load applied to the substrate 200 and the component 300 decreases with the passage of time. Multiply (see time T9 to time T10 in (b) of FIG. 11). Then, at time T10, the second head 34 is separated from the component 300. Further, for example, the second control unit 48 may maintain the temperature of the second head 34 constant (see (iv) in (c) of FIG. 11), and changes according to the operation of the second head 34. In some cases (see (v) in (c) of FIG. 11). Further, the second control unit 48 may maintain the temperature of the second stage 36 constant (see (vi) in (d) of FIG. 11), or may change the temperature according to the operation of the second head 34. There is also.

12A and 12B are graphs showing an example of the operation of the main crimping portion, FIG. 12A is a graph showing the relationship between the height of the second head and time, and FIG. 12B is a graph when Δ is a predetermined value. It is a graph which shows the relationship between a 2nd load and time, (c) is a graph which shows the relationship between a 2nd load and time when Δ is larger than a predetermined value, and (d) is a graph which shows Δ is predetermined. It is a graph which shows the relationship between the 2nd load and time when it is smaller than a value.

When Δ is larger than a predetermined value, for example, the second control unit 48 controls the second head 34 and the like so that the second load speed becomes smaller than the reference value. In this case, for example, as shown in (c) of FIG. 12, when Δ is a predetermined value, the time from when the second head 34 comes into contact with the component 300 to when the second load reaches the maximum value at time T7. (See (b) in FIG. 12), which is longer. As a result, for example, the thermal expansion of the component 300 is promoted, and the substrate 200 and the component can be accurately crimped.

When Δ is not larger than a predetermined value, for example, the second control unit 48 controls the second head 34 and the like so that the second load speed becomes larger than the reference value. In this case, for example, as shown in FIG. 12D, when Δ is a predetermined value, the time from when the second head 34 comes into contact with the component 300 to when the second load reaches the maximum value at time T7. (See (b) in FIG. 12), which is shorter. As a result, for example, the thermal expansion of the component 300 is suppressed, and the substrate 200 and the component can be accurately crimped.

As described above, the main crimping unit 28 mainly crimps the substrate 200 and the component 300 based on the parameters determined by the parameter determining unit 40. By the main crimping of the substrate 200 and the component 300 in this way, the component 300 is mounted on the substrate 200.

As described above, the component mounting device 10 according to the present embodiment attaches the component 300 to the substrate 200 by crimping the plurality of substrate electrodes 202 included in the substrate 200 and the plurality of component electrodes 302 included in the component 300. In the component mounting device to be mounted, the first electrode information including information on the arrangement of the plurality of substrate electrodes 202 and the plurality of component electrodes 302 in the plurality of substrate electrodes 202 and the plurality of component electrodes 302 to be crimped to each other. A plurality of substrate electrodes 202 and a plurality of component electrodes to be crimped to each other based on the electrode information acquisition unit 37 for acquiring the second electrode information including the information regarding the arrangement of the first electrode and the second electrode information. A parameter determining unit 40 for determining parameters related to crimping with the 302 is provided, and a crimping unit 23 for crimping a plurality of substrate electrodes 202 and a plurality of component electrodes 302 to be crimped to each other based on the parameters.

According to this configuration, in the plurality of substrate electrodes 202 and the plurality of component electrodes 302 that are crimped to each other, the first electrode information including the information regarding the arrangement of the plurality of substrate electrodes 202 and the arrangement of the plurality of component electrodes 302 are related. The second electrode information including the information is acquired. Then, the parameters related to crimping are determined based on the first electrode information and the second electrode information, and the plurality of substrate electrodes 202 and the plurality of component electrodes 302 to be crimped to each other are crimped based on the parameters. By determining the parameters for each of the plurality of substrate electrodes 202 and the plurality of component electrodes 302 that are crimped to each other in this way, the accuracy of crimping between the plurality of substrate electrodes 202 and the plurality of component electrodes 302 can be improved.

Further, in the component mounting device 10 according to the present embodiment, the electrode information acquisition unit 37 has an image pickup unit 26 that images the substrate 200, and acquires the first electrode information based on the image captured by the image pickup unit 26. To do.

According to this configuration, the first electrode information can be acquired based on the image captured by the imaging unit 26, and the parameters related to the crimping between the plurality of substrate electrodes 202 and the plurality of component electrodes 302 to be crimped to each other can be determined.

Further, in the component mounting device 10 according to the present embodiment, the electrode information acquisition unit 37 has an image pickup unit 26 that images the component 300, and acquires the second electrode information based on the image captured by the image pickup unit 26. To do.

According to this configuration, the second electrode information can be acquired based on the image captured by the imaging unit 26, and the parameters related to the crimping between the plurality of substrate electrodes 202 and the plurality of component electrodes 302 to be crimped to each other can be determined.

Further, in the component mounting device 10 according to the present embodiment, the crimping portion 23 includes a temporary crimping portion 24 that temporarily crimps a plurality of substrate electrodes 202 and a plurality of component electrodes 302 to be crimped to each other via an ACF 400. It has a main crimping portion 28 for main crimping a plurality of temporarily crimped substrate electrodes 202 and a plurality of component electrodes 302.

According to this configuration, the crimping portion 23 has a temporary crimping portion 24 and a main crimping portion 28, and the parameter determining portion 40 determines the parameters in the temporary crimping portion 24 and the parameters in the main crimping portion 28. To do. By making it possible to determine more parameters in this way, for example, it becomes easier to control the thermal expansion of the substrate 200 and the thermal expansion of the component 300, and the substrate 200 and the component 300 can be pressure-bonded with high accuracy.

Further, in the component mounting device 10 according to the present embodiment, the imaging unit 26 is provided in the temporary crimping portion 24, and the temporary crimping portions 24 are crimped to each other based on the image captured by the imaging unit 26. After aligning the substrate electrodes 202 and the plurality of component electrodes 302, the plurality of substrate electrodes 202 and the plurality of component electrodes 302 that are mutually crimped based on the parameters are temporarily crimped.

According to this configuration, the temporary crimping portion 24 can align the substrate 200 and the component 300 based on the image captured by the imaging unit 26, so that it is not necessary to separately provide an imaging unit or the like for the alignment. , Cost can be reduced.

Further, in the component mounting device 10 according to the present embodiment, the temporary crimping portion 24 moves toward the first stage 32 on which the substrate 200 is mounted and the substrate 200 mounted on the first stage 32. It has a first head 30 that presses the component 300 toward the substrate 200, and the parameters are the magnitude of the first load that the first head 30 gives to the substrate 200 and the component 300, and the magnitude of the first load in time. The rate of change when changing over time, the temperature of the first head 30, the temperature of the first stage 32, the difference between the temperature of the first head 30 and the temperature of the first stage 32, and the moving speed of the first head 30. Includes at least one.

According to this configuration, the thermal expansion of the substrate 200 can be promoted or suppressed and the thermal expansion of the component 300 can be promoted or suppressed by appropriately determining the magnitude of the first load and the like. Therefore, the substrate electrode 202 and the component The accuracy of crimping with the electrode 302 can be further improved.

Further, in the component mounting device 10 according to the present embodiment, the crimping portion 28 moves toward the second stage 36 on which the substrate 200 is mounted and the substrate 200 mounted on the second stage 36. It has a second head 34 that presses the component 300 toward the substrate 200, and the parameters are the magnitude of the second load that the second head 34 gives to the substrate 200 and the component 300, and the magnitude of the second load in time. The rate of change when changing over time, the temperature of the second head 34, the temperature of the second stage 36, the difference between the temperature of the second head 34 and the temperature of the second stage 36, and the moving speed of the second head 34. Includes at least one.

According to this configuration, the thermal expansion of the substrate 200 can be promoted or suppressed and the thermal expansion of the component 300 can be promoted or suppressed by appropriately determining the magnitude of the second load and the like. Therefore, the substrate electrode 202 and the component The accuracy of crimping with the electrode 302 can be further improved.

Further, in the component mounting device 10 according to the present embodiment, the plurality of substrate electrodes 202 are provided side by side, and the substrate 200 is a pair of first pairs sandwiching the plurality of substrate electrodes 202 in the direction in which the plurality of substrate electrodes 202 are arranged. Further having an alignment mark 204, a plurality of component electrodes 302 are provided side by side, and the component 300 further has a pair of second alignment marks 304 sandwiching the plurality of component electrodes 302 in the direction in which the plurality of component electrodes 302 are arranged. The first electrode information includes the distance A between the pair of first alignment marks 204, the second electrode information includes the distance B between the pair of second alignment marks 304, and the parameter determination unit 40 includes a pair of distances B. The parameters are determined based on the distance A between the first alignment marks 204 and the distance B between the pair of second alignment marks 304.

According to this configuration, for example, a pair of first alignment marks 204 and a pair of second alignment marks 304, which can be used for alignment of a plurality of substrate electrodes 202 and a plurality of component electrodes 302, are used for crimping. Since the parameters can be determined, it is not necessary to separately provide a member or the like for determining the parameters, and the cost can be reduced.

The present invention is not limited to the above embodiment. For example, an embodiment of the present invention may be an embodiment of the present invention realized by arbitrarily combining the components described in the present specification and excluding some of the components. The present invention also includes modifications obtained by making various modifications that can be conceived by those skilled in the art within the scope of the gist of the present invention, that is, the meaning indicated by the words described in the claims. Is done.

In the above-described embodiment, the substrate 200 is an example of a substrate used for a smartphone or the like, but the substrate 200 is not limited thereto. For example, the substrate may be a substrate used for a television or the like.

In the above-described embodiment, the circuit film in which the electronic component is mounted on the wiring film is exemplified as the component 300, but the present invention is not limited to this. For example, the component may be a wiring film or the like on which no electronic component is mounted.

In the above-described embodiment, the case where one component 300 is mounted on one substrate 200 has been described, but the present invention is not limited to this. For example, a plurality of components may be mounted on one board.

In the above-described embodiment, the case where the crimping portion 23 has the temporary crimping portion 24 and the main crimping portion 28 has been described, but the present invention is not limited to this. The crimping portion may have only a temporary crimping portion or may have only a main crimping portion.

In the above-described embodiment, the case where the imaging unit 26 is provided on the temporary crimping unit 24 has been described, but the present invention is not limited to this. For example, the imaging unit 26 may be provided in the loader 12, the washing machine 14, the ACF sticking unit 20, the supply unit 22, the main crimping unit 28, or the like.

In the above-described embodiment, the case where the imaging unit 26 images the substrate 200 and the component 300 has been described, but the present invention is not limited to this. For example, the first imaging unit may image the substrate 200, and the second imaging unit different from the first imaging unit may image the substrate 200.

In the above-described embodiment, the case where the imaging unit 26 images the substrate 200 and the component 300 from below has been described, but the present invention is not limited to this. For example, the imaging unit 26 may image the component 300 from below, and an imaging unit different from the imaging unit 26 may image the substrate 200 from above.

In the above-described embodiment, the case where the image processing unit 38 is provided in the line controller 18 has been described, but the present invention is not limited to this. For example, the image processing unit 38 may be provided in the loader 12, the washing machine 14, the unloader 16, the ACF sticking unit 20, the supply unit 22, the temporary crimping unit 24, the main crimping unit 28, or the like.

In the above-described embodiment, the case where the parameter determination unit 40 is provided in the line controller 18 has been described, but the present invention is not limited to this. For example, the parameter determination unit 40 may be provided in the loader 12, the washing machine 14, the unloader 16, the ACF sticking unit 20, the supply unit 22, the temporary crimping unit 24, the main crimping unit 28, or the like.

In the above-described embodiment, the electrode information acquisition unit 37 analyzes the image captured by the image pickup unit 26 to obtain a distance A between the pair of first alignment marks 204 on the substrate 200 and a pair of third parts 300. Although the case of acquiring the distance B between the two alignment marks 304 has been described, the present invention is not limited to this. For example, the electrode information acquisition unit captures an image captured by the imaging unit 26 of one of the distance A between the pair of first alignment marks 204 on the substrate 200 and the distance B between the pair of second alignment marks 304 of the component 300. It may be acquired by analysis, and the other may be acquired from a design drawing or the like.

In the above-described embodiment, the case where the first control unit 44 is provided in the temporary crimping unit 24 has been described, but the present invention is not limited to this. For example, the first control unit 44 may be provided in the loader 12, the washing machine 14, the unloader 16, the line controller 18, the ACF sticking unit 20, the supply unit 22, the main crimping unit 28, or the like.

In the above-described embodiment, the case where the second control unit 48 is provided in the main crimping unit 28 has been described, but the present invention is not limited to this. For example, the second control unit 48 may be provided in the loader 12, the washing machine 14, the unloader 16, the line controller 18, the ACF sticking unit 20, the supply unit 22, the temporary crimping unit 24, and the like.

In the above-described embodiment, the case where the first electrode information is acquired (step S1) and then the second electrode information is acquired (step S2) has been described, but the present invention is not limited to this. For example, the first electrode information may be acquired after the second electrode information is acquired.

The present invention can be used when a driver IC or the like is attached to a flat panel used for an organic EL display, a liquid crystal display or the like.

10 Parts mounting device 12 Loader 14 Washer 16 Unloader 18 Line controller 20 ACF pasting part 22 Supply part 23 Crimping part 24 Temporary crimping part 26 Imaging part 28 Crimping part 30 1st head 32 1st stage 34 2nd head 36 2nd Stage 37 Electrode information acquisition unit 38 Image processing unit 40 Parameter determination unit 42 1st heater 44 1st control unit 46 2nd heater 48 2nd control unit 100 Parts mounting system 200 Board 202 Board electrode 204 1st alignment mark 300 Parts 302 Parts Electrode 304 2nd Alignment Mark 400 ACF

Claims (11)

A component mounting device for mounting the component on the substrate by crimping a plurality of substrate electrodes of the substrate and a plurality of component electrodes of the component.
In the plurality of substrate electrodes and the plurality of component electrodes to be crimped to each other, the first electrode information including information on the arrangement of the plurality of substrate electrodes and the second electrode including information on the arrangement of the plurality of component electrodes are included. Electrode information acquisition unit for acquiring information and
A parameter determination unit that determines parameters related to crimping between the plurality of substrate electrodes and the plurality of component electrodes to be crimped to each other based on the first electrode information and the second electrode information.
A crimping portion for crimping the plurality of substrate electrodes and the plurality of component electrodes to be crimped to each other based on the parameters is provided.
Component mounting device. The electrode information acquisition unit has a first imaging unit that images the substrate, and acquires the first electrode information based on an image captured by the first imaging unit.
The component mounting device according to claim 1. The crimping portion includes a temporary crimping portion that temporarily crimps the plurality of substrate electrodes that are crimped to each other and the plurality of component electrodes via an anisotropic conductive member, and the plurality of temporarily crimped substrate electrodes. It has a main crimping portion for main crimping the plurality of component electrodes.
The component mounting device according to claim 2. The first imaging unit is provided on the temporary crimping unit and is provided.
The temporary crimping portion aligns the plurality of substrate electrodes and the plurality of component electrodes to be crimped to each other based on the image captured by the first imaging unit, and then based on the parameters. Temporarily crimp the plurality of substrate electrodes to be crimped to each other and the plurality of component electrodes.
The component mounting device according to claim 3. The electrode information acquisition unit has a second imaging unit that images the component, and acquires the second electrode information based on the image captured by the second imaging unit.
The component mounting device according to claim 1. The crimping portion includes a temporary crimping portion that temporarily crimps the plurality of substrate electrodes that are crimped to each other and the plurality of component electrodes via an anisotropic conductive member, and the plurality of temporarily crimped substrate electrodes. It has a main crimping portion for main crimping the plurality of component electrodes.
The component mounting device according to claim 5. The second imaging unit is provided on the temporary crimping unit and is provided.
The temporary crimping portion aligns the plurality of substrate electrodes and the plurality of component electrodes to be crimped to each other based on the image captured by the second imaging unit, and then based on the parameters. Temporarily crimp the plurality of substrate electrodes to be crimped to each other and the plurality of component electrodes.
The component mounting device according to claim 6. The temporary crimping portion includes a first stage on which the substrate is placed and a first head that moves toward the substrate mounted on the first stage and presses the component toward the substrate. Have and
The parameters are the magnitude of the first load applied by the first head to the substrate and the component, the rate of change when the magnitude of the first load is changed with the passage of time, the temperature of the first head, and the temperature of the first head. It comprises at least one of the temperature of the first stage, the difference between the temperature of the first head and the temperature of the first stage, and the moving speed of the first head.
The component mounting device according to any one of claims 3, 4, 6 and 7. The main crimping portion includes a second stage on which the substrate is placed, and a second head that moves toward the substrate mounted on the second stage and presses the component toward the substrate. Have and
The parameters include the magnitude of the second load applied by the second head to the substrate and the component, the rate of change when the magnitude of the second load is changed over time, the temperature of the second head, and the like. It includes at least one of the temperature of the second stage, the difference between the temperature of the second head and the temperature of the second stage, and the moving speed of the second head.
The component mounting device according to any one of claims 3, 4, 6, 7, and 8. The plurality of substrate electrodes are provided side by side.
The substrate further has a pair of first alignment marks that sandwich the plurality of substrate electrodes in the direction in which the plurality of substrate electrodes are arranged.
The plurality of component electrodes are provided side by side.
The component further has a pair of second alignment marks that sandwich the plurality of component electrodes in the direction in which the plurality of component electrodes are arranged.
The first electrode information includes the distance between the pair of first alignment marks.
The second electrode information includes the distance between the pair of second alignment marks.
The parameter determining unit determines the parameter based on the distance between the pair of first alignment marks and the distance between the pair of second alignment marks.
The component mounting device according to any one of claims 1 to 9. A component mounting method for mounting the component on the substrate by crimping a plurality of substrate electrodes of the substrate and a plurality of component electrodes of the component.
In the plurality of substrate electrodes and the plurality of component electrodes to be crimped to each other, the first electrode information including information on the arrangement of the plurality of substrate electrodes and the second electrode including information on the arrangement of the plurality of component electrodes are included. Electrode information acquisition process to acquire information and
A parameter determination step of determining parameters related to crimping between the plurality of substrate electrodes to be crimped to each other and the plurality of component electrodes based on the first electrode information and the second electrode information.
A crimping step of crimping the plurality of substrate electrodes and the plurality of component electrodes to be crimped to each other based on the parameters is provided.
Component mounting method.

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