CN104882387B - 热压接合系统及其操作方法 - Google Patents

热压接合系统及其操作方法 Download PDF

Info

Publication number
CN104882387B
CN104882387B CN201510126097.5A CN201510126097A CN104882387B CN 104882387 B CN104882387 B CN 104882387B CN 201510126097 A CN201510126097 A CN 201510126097A CN 104882387 B CN104882387 B CN 104882387B
Authority
CN
China
Prior art keywords
control valve
cooling fluid
fluid
hot press
pressurization
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201510126097.5A
Other languages
English (en)
Chinese (zh)
Other versions
CN104882387A (zh
Inventor
M·B·瓦塞尔曼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kulicke and Soffa Investments Inc
Original Assignee
Kulicke and Soffa Investments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kulicke and Soffa Investments Inc filed Critical Kulicke and Soffa Investments Inc
Publication of CN104882387A publication Critical patent/CN104882387A/zh
Application granted granted Critical
Publication of CN104882387B publication Critical patent/CN104882387B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating processes for reflow soldering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0475—Molten solder just before placing the component
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/016—Manufacture or treatment of strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07152—Means for cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07183—Means for monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07188—Apparatus chuck
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07232—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
CN201510126097.5A 2014-02-28 2015-02-27 热压接合系统及其操作方法 Active CN104882387B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201461945916P 2014-02-28 2014-02-28
US61/945,916 2014-02-28

Publications (2)

Publication Number Publication Date
CN104882387A CN104882387A (zh) 2015-09-02
CN104882387B true CN104882387B (zh) 2018-12-11

Family

ID=53949830

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510126097.5A Active CN104882387B (zh) 2014-02-28 2015-02-27 热压接合系统及其操作方法

Country Status (5)

Country Link
US (2) US9659902B2 (https=)
JP (1) JP6568671B2 (https=)
KR (1) KR102332745B1 (https=)
CN (1) CN104882387B (https=)
TW (1) TWI644374B (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10245668B2 (en) * 2016-10-31 2019-04-02 Kulicke And Soffa Industries, Inc Fluxing systems, bonding machines including fluxing systems, and methods of operating the same
EP3340287B1 (en) * 2016-12-23 2020-10-28 Huawei Technologies Co., Ltd. Pattern-based temperature measurement for a bonding device and a bonding system
JP2018147911A (ja) * 2017-03-01 2018-09-20 東レエンジニアリング株式会社 ボンディングヘッド冷却システムおよびこれを備えた実装装置ならびに実装方法
EP3808860B1 (en) * 2018-07-06 2023-11-08 Shanghai Joulead Electric Co., Ltd Inductive hot crimping apparatus
US11784160B2 (en) * 2020-09-23 2023-10-10 International Business Machines Corporation Asymmetric die bonding
CN112462221B (zh) * 2020-11-05 2022-06-17 清华大学 一种用于压接式半导体的高温老化失效的模拟测试装置
US12431404B2 (en) 2020-11-13 2025-09-30 International Business Machines Corporation Fatigue failure resistant electronic package
KR102604789B1 (ko) * 2020-11-30 2023-11-21 세메스 주식회사 히터 조립체 및 이를 포함하는 본딩 헤드
KR20220153723A (ko) * 2021-05-11 2022-11-21 삼성디스플레이 주식회사 표시 장치의 제조장치 및 표시 장치의 제조방법
TWI787036B (zh) * 2022-01-04 2022-12-11 萬潤科技股份有限公司 散熱片壓合方法及裝置
JP7812734B2 (ja) * 2022-05-20 2026-02-10 芝浦メカトロニクス株式会社 実装装置及び実装方法
US12456709B2 (en) * 2022-12-28 2025-10-28 International Business Machines Corporation Structures and processes for void-free hybrid bonding
CN121035013B (zh) * 2025-08-26 2026-03-24 常熟市兆恒众力精密机械有限公司北京分公司 温度控制方法及电子设备

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2757738B2 (ja) * 1992-12-25 1998-05-25 ヤマハ株式会社 回路部品の着脱装置および回路部品の着脱方法
CN1513202A (zh) * 2001-06-08 2004-07-14 ֥�ֻ�е����װ�ùɷ����޹�˾ 电子部件压接装置及其方法
CN1650415A (zh) * 2002-04-30 2005-08-03 东丽工程株式会社 粘附方法及其装置
JP4631796B2 (ja) * 2006-05-22 2011-02-16 パナソニック株式会社 電子部品の熱圧着装置
CN102959695A (zh) * 2010-06-30 2013-03-06 株式会社新川 电子器件安装装置以及电子器件安装方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4830649A (https=) * 1971-08-25 1973-04-23
JP3591977B2 (ja) * 1996-03-18 2004-11-24 キヤノン株式会社 マイクロ波プラズマｃｖｄ法を用いた膜堆積方法および膜堆積装置
JP3455838B2 (ja) * 1997-01-28 2003-10-14 澁谷工業株式会社 不活性ガス供給機構付ボンディングヘッド
JP4544755B2 (ja) * 2001-01-17 2010-09-15 パナソニック株式会社 ボンディングヘッド及び部品装着装置
TWI529829B (zh) * 2011-05-27 2016-04-11 東麗工程股份有限公司 Installation method and installation device
TWI501828B (zh) * 2012-03-13 2015-10-01 印能科技股份有限公司 晶片壓合裝置及方法
US8870051B2 (en) * 2012-05-03 2014-10-28 International Business Machines Corporation Flip chip assembly apparatus employing a warpage-suppressor assembly
KR101920941B1 (ko) * 2012-06-08 2018-11-21 도쿄엘렉트론가부시키가이샤 기판 처리 장치, 기판 처리 방법, 유체의 공급 방법 및 기억 매체
JP5793473B2 (ja) * 2012-07-20 2015-10-14 株式会社新川 ボンディング装置用ヒータ及びその冷却方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2757738B2 (ja) * 1992-12-25 1998-05-25 ヤマハ株式会社 回路部品の着脱装置および回路部品の着脱方法
CN1513202A (zh) * 2001-06-08 2004-07-14 ֥�ֻ�е����װ�ùɷ����޹�˾ 电子部件压接装置及其方法
CN1650415A (zh) * 2002-04-30 2005-08-03 东丽工程株式会社 粘附方法及其装置
JP4631796B2 (ja) * 2006-05-22 2011-02-16 パナソニック株式会社 電子部品の熱圧着装置
CN102959695A (zh) * 2010-06-30 2013-03-06 株式会社新川 电子器件安装装置以及电子器件安装方法

Also Published As

Publication number Publication date
TW201533820A (zh) 2015-09-01
US20150249027A1 (en) 2015-09-03
US20170221854A1 (en) 2017-08-03
US9659902B2 (en) 2017-05-23
TWI644374B (zh) 2018-12-11
JP6568671B2 (ja) 2019-08-28
KR20150102739A (ko) 2015-09-07
US9780066B2 (en) 2017-10-03
CN104882387A (zh) 2015-09-02
KR102332745B1 (ko) 2021-11-30
JP2015165566A (ja) 2015-09-17

Similar Documents

Publication Publication Date Title
CN104882387B (zh) 热压接合系统及其操作方法
CN104051281B (zh) 超声波振动辅助倒装芯片塑封成型下填充装置及方法
CN102272911A (zh) 引线焊接装置及焊接方法
CN107030415B (zh) 用于引线焊接的焊接机上的自动悬置芯片优化工具及相关方法
CN102187443A (zh) 引线焊接方法以及半导体装置
CN106981434B (zh) 全自动粘片键合设备及粘片键合方法
CN103730390A (zh) 引线接合机以及测试引线接合连接的方法
US20130068826A1 (en) Die Bonder and Bonding Method
CN102187444A (zh) 导电凸部、引线环及导电凸部、引线环的形成方法
CN105845655A (zh) 微焊盘上叠加进行球形焊接的方法及微焊盘叠加键合结构
CN206657800U (zh) 全自动粘片键合设备
CN204118038U (zh) 大功率晶体管粘片机
TWI705120B (zh) 接合時之半導體晶片的加熱條件設定方法以及非導電性膜之黏度測量方法以及接合裝置
CN111656505B (zh) 用于焊接机的焊接工具、用于焊接半导体元件的焊接机及相关方法
CN100511612C (zh) 引线结合装置以及引线结合方法
Massa et al. Process development for flip chip bonding with different bump compositions
Yao et al. Improving the deflection of wire bonds in stacked chip scale package (CSP)
CN110015457B (zh) 结合和变位设备
Wang et al. Modeling study of thermosonic flip chip bonding process
CN105405778B (zh) 打线装置及排除不良焊线的方法
CN107999919B (zh) 助焊系统、包括助焊系统的焊接机及其操作方法
Pan et al. Comparing the copper and gold wire bonding during thermalsonic wire bonding process
Clauberg et al. Advanced thermocompression flip chip bonding
JP2018147911A (ja) ボンディングヘッド冷却システムおよびこれを備えた実装装置ならびに実装方法
CN110729208A (zh) 一种高密度打线复位方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant