TWI644342B - 熱處理裝置及熱處理方法 - Google Patents

熱處理裝置及熱處理方法 Download PDF

Info

Publication number
TWI644342B
TWI644342B TW105101214A TW105101214A TWI644342B TW I644342 B TWI644342 B TW I644342B TW 105101214 A TW105101214 A TW 105101214A TW 105101214 A TW105101214 A TW 105101214A TW I644342 B TWI644342 B TW I644342B
Authority
TW
Taiwan
Prior art keywords
control
temperature
value
heat treatment
temperature adjustment
Prior art date
Application number
TW105101214A
Other languages
English (en)
Chinese (zh)
Other versions
TW201637077A (zh
Inventor
門間徹
Toru MOMMA
福本靖博
Yasuhiro Fukumoto
西幸治
Koji Nishi
後藤茂宏
Shigehiro Goto
城憲一郎
Kenichiro JO
田中淳
Atsushi Tanaka
Original Assignee
日商思可林集團股份有限公司
Screen Holdings Co,. Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商思可林集團股份有限公司, Screen Holdings Co,. Ltd. filed Critical 日商思可林集團股份有限公司
Publication of TW201637077A publication Critical patent/TW201637077A/zh
Application granted granted Critical
Publication of TWI644342B publication Critical patent/TWI644342B/zh

Links

Classifications

    • H10P72/0431—
    • H10P72/0602—
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F25B21/04—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect reversible
    • H10P72/0432—
    • H10P72/0604—
    • H10P74/23—
    • H10P76/00—
    • H10P95/90—
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/021—Control thereof
    • F25B2321/0212—Control thereof of electric power, current or voltage

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Liquid Crystal (AREA)
  • Waste-Gas Treatment And Other Accessory Devices For Furnaces (AREA)
  • Control Of Temperature (AREA)
TW105101214A 2015-03-26 2016-01-15 熱處理裝置及熱處理方法 TWI644342B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-063949 2015-03-26
JP2015063949A JP6442339B2 (ja) 2015-03-26 2015-03-26 熱処理装置および熱処理方法

Publications (2)

Publication Number Publication Date
TW201637077A TW201637077A (zh) 2016-10-16
TWI644342B true TWI644342B (zh) 2018-12-11

Family

ID=56977144

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105101214A TWI644342B (zh) 2015-03-26 2016-01-15 熱處理裝置及熱處理方法

Country Status (6)

Country Link
US (1) US10629463B2 (enExample)
JP (1) JP6442339B2 (enExample)
KR (1) KR101994570B1 (enExample)
CN (1) CN107430985B (enExample)
TW (1) TWI644342B (enExample)
WO (1) WO2016151651A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10908195B2 (en) 2016-06-15 2021-02-02 Watlow Electric Manufacturing Company System and method for controlling power to a heater
JP6872914B2 (ja) * 2017-01-30 2021-05-19 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置および熱処理方法
EP3879564B1 (en) * 2017-06-15 2023-11-15 Watlow Electric Manufacturing Company System and method for controlling power to a heater
IT201800020272A1 (it) * 2018-12-20 2020-06-20 Amx Automatrix S R L Pressa di sinterizzazione per sinterizzare componenti elettronici su un substrato
JP7256034B2 (ja) * 2019-03-04 2023-04-11 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置および熱処理方法
JP7198718B2 (ja) * 2019-04-26 2023-01-04 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置および熱処理方法
JP2022125685A (ja) * 2021-02-17 2022-08-29 株式会社Kelk 半導体ウエハの温度制御装置及び半導体ウエハの温度制御方法
JP2025132352A (ja) 2024-02-29 2025-09-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6080969A (en) * 1997-05-29 2000-06-27 Smc Corporation Apparatus for and method of thermally processing substrate
TW201342473A (zh) * 2011-09-13 2013-10-16 東京威力科創股份有限公司 熱處理裝置、溫度控制系統、熱處理方法、溫度控制方法以及記錄有用以執行該熱處理方法或該溫度控制方法的程式之記錄媒體
TW201415556A (zh) * 2012-10-05 2014-04-16 光洋熱系統股份有限公司 熱處理裝置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07115058A (ja) 1993-10-18 1995-05-02 Dainippon Screen Mfg Co Ltd 基板冷却装置
JPH08148421A (ja) 1994-11-21 1996-06-07 Dainippon Screen Mfg Co Ltd 基板冷却装置
JPH08203796A (ja) 1995-01-30 1996-08-09 Dainippon Screen Mfg Co Ltd 基板冷却装置
US5638687A (en) 1994-11-21 1997-06-17 Dainippon Screen Mfg. Co., Ltd. Substrate cooling method and apparatus
JPH08236414A (ja) * 1995-02-27 1996-09-13 Dainippon Screen Mfg Co Ltd 基板冷却装置
JP3504018B2 (ja) * 1995-03-31 2004-03-08 大日本スクリーン製造株式会社 基板冷却装置
US6230497B1 (en) * 1999-12-06 2001-05-15 Motorola, Inc. Semiconductor circuit temperature monitoring and controlling apparatus and method
US6191399B1 (en) * 2000-02-01 2001-02-20 Asm America, Inc. System of controlling the temperature of a processing chamber
WO2004038776A1 (ja) 2002-10-25 2004-05-06 Tokyo Electron Limited 熱処理装置及び熱処理方法
JP4384538B2 (ja) * 2003-06-16 2009-12-16 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP5040213B2 (ja) 2006-08-15 2012-10-03 東京エレクトロン株式会社 熱処理装置、熱処理方法及び記憶媒体
JP5041016B2 (ja) 2010-03-01 2012-10-03 東京エレクトロン株式会社 熱処理装置、熱処理方法及び記憶媒体
JP5048810B2 (ja) 2010-06-23 2012-10-17 東京エレクトロン株式会社 熱処理装置及び熱処理方法
KR101512874B1 (ko) 2010-09-07 2015-04-16 도쿄엘렉트론가부시키가이샤 종형 열처리 장치 및 그 제어 방법
JP2012080080A (ja) 2010-09-07 2012-04-19 Tokyo Electron Ltd 縦型熱処理装置及びその制御方法
US9038404B2 (en) 2011-04-19 2015-05-26 Liebert Corporation High efficiency cooling system
US9316424B2 (en) 2011-04-19 2016-04-19 Liebert Corporation Multi-stage cooling system with tandem compressors and optimized control of sensible cooling and dehumidification
US9845981B2 (en) 2011-04-19 2017-12-19 Liebert Corporation Load estimator for control of vapor compression cooling system with pumped refrigerant economization
JP5708310B2 (ja) 2011-07-01 2015-04-30 東京エレクトロン株式会社 基板処理装置
JP6064613B2 (ja) 2013-01-18 2017-01-25 株式会社ノーリツ 給湯装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6080969A (en) * 1997-05-29 2000-06-27 Smc Corporation Apparatus for and method of thermally processing substrate
TW201342473A (zh) * 2011-09-13 2013-10-16 東京威力科創股份有限公司 熱處理裝置、溫度控制系統、熱處理方法、溫度控制方法以及記錄有用以執行該熱處理方法或該溫度控制方法的程式之記錄媒體
TW201415556A (zh) * 2012-10-05 2014-04-16 光洋熱系統股份有限公司 熱處理裝置

Also Published As

Publication number Publication date
US20180033660A1 (en) 2018-02-01
WO2016151651A1 (ja) 2016-09-29
KR20170120151A (ko) 2017-10-30
KR101994570B1 (ko) 2019-06-28
US10629463B2 (en) 2020-04-21
JP2016183815A (ja) 2016-10-20
CN107430985B (zh) 2020-10-30
JP6442339B2 (ja) 2018-12-19
TW201637077A (zh) 2016-10-16
CN107430985A (zh) 2017-12-01

Similar Documents

Publication Publication Date Title
TWI644342B (zh) 熱處理裝置及熱處理方法
KR100299418B1 (ko) 기판열처리장치및방법
US6461438B1 (en) Heat treatment unit, cooling unit and cooling treatment method
JP3838208B2 (ja) 半導体ウェハの熱処理装置および方法
JP3933765B2 (ja) 基板加熱処理方法および装置
JP4781931B2 (ja) 熱処理方法および熱処理装置
JP7198718B2 (ja) 熱処理装置および熱処理方法
JP7723556B2 (ja) 温度調整装置および温度調整方法
TWI772745B (zh) 熱處理裝置及熱處理方法
JP3648150B2 (ja) 冷却処理装置及び冷却処理方法
JP4938552B2 (ja) 加熱装置および加熱装置の制御方法
TWI753401B (zh) 熱處理裝置、熱處理系統及熱處理方法
JP2807844B2 (ja) 基板加熱装置
JP4128318B2 (ja) 熱処理装置および熱処理装置の制御方法
JPH08148421A (ja) 基板冷却装置
JPH08236414A (ja) 基板冷却装置
JPH10284582A (ja) 半導体基板の温度調節器及び半導体基板の冷却方法
JP4739132B2 (ja) 熱処理装置及び熱処理方法
JP2000183071A (ja) 基板加熱処理装置
JPH10340835A (ja) 基板熱処理装置
JPH08203796A (ja) 基板冷却装置
JP2002341948A (ja) 温度制御方法及び装置
JP2002351552A (ja) 調節器の入力補正方法および温度調節器
JP2003031645A (ja) 基板冷却装置