JP6442339B2 - 熱処理装置および熱処理方法 - Google Patents

熱処理装置および熱処理方法 Download PDF

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Publication number
JP6442339B2
JP6442339B2 JP2015063949A JP2015063949A JP6442339B2 JP 6442339 B2 JP6442339 B2 JP 6442339B2 JP 2015063949 A JP2015063949 A JP 2015063949A JP 2015063949 A JP2015063949 A JP 2015063949A JP 6442339 B2 JP6442339 B2 JP 6442339B2
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Japan
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control
temperature
value
heat treatment
unit
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JP2015063949A
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English (en)
Japanese (ja)
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JP2016183815A5 (enExample
JP2016183815A (ja
Inventor
徹 門間
徹 門間
靖博 福本
靖博 福本
幸治 西
幸治 西
茂宏 後藤
茂宏 後藤
憲一郎 城
憲一郎 城
田中　淳
淳 田中
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Screen Holdings Co Ltd
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Screen Holdings Co Ltd
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Publication date
Priority to JP2015063949A priority Critical patent/JP6442339B2/ja
Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd
Priority to KR1020177026625A priority patent/KR101994570B1/ko
Priority to US15/556,919 priority patent/US10629463B2/en
Priority to PCT/JP2015/005727 priority patent/WO2016151651A1/ja
Priority to CN201580077665.5A priority patent/CN107430985B/zh
Priority to TW105101214A priority patent/TWI644342B/zh
Publication of JP2016183815A publication Critical patent/JP2016183815A/ja
Publication of JP2016183815A5 publication Critical patent/JP2016183815A5/ja
Application granted granted Critical
Publication of JP6442339B2 publication Critical patent/JP6442339B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F25B21/04—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect reversible
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/021—Control thereof
    • F25B2321/0212—Control thereof of electric power, current or voltage

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Liquid Crystal (AREA)
  • Waste-Gas Treatment And Other Accessory Devices For Furnaces (AREA)
  • Control Of Temperature (AREA)
JP2015063949A 2015-03-26 2015-03-26 熱処理装置および熱処理方法 Active JP6442339B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2015063949A JP6442339B2 (ja) 2015-03-26 2015-03-26 熱処理装置および熱処理方法
US15/556,919 US10629463B2 (en) 2015-03-26 2015-11-17 Thermal processing apparatus and thermal processing method
PCT/JP2015/005727 WO2016151651A1 (ja) 2015-03-26 2015-11-17 熱処理装置および熱処理方法
CN201580077665.5A CN107430985B (zh) 2015-03-26 2015-11-17 热处理装置以及热处理方法
KR1020177026625A KR101994570B1 (ko) 2015-03-26 2015-11-17 열처리 장치 및 열처리 방법
TW105101214A TWI644342B (zh) 2015-03-26 2016-01-15 熱處理裝置及熱處理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015063949A JP6442339B2 (ja) 2015-03-26 2015-03-26 熱処理装置および熱処理方法

Publications (3)

Publication Number Publication Date
JP2016183815A JP2016183815A (ja) 2016-10-20
JP2016183815A5 JP2016183815A5 (enExample) 2018-03-22
JP6442339B2 true JP6442339B2 (ja) 2018-12-19

Family

ID=56977144

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JP2015063949A Active JP6442339B2 (ja) 2015-03-26 2015-03-26 熱処理装置および熱処理方法

Country Status (6)

Country Link
US (1) US10629463B2 (enExample)
JP (1) JP6442339B2 (enExample)
KR (1) KR101994570B1 (enExample)
CN (1) CN107430985B (enExample)
TW (1) TWI644342B (enExample)
WO (1) WO2016151651A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6872914B2 (ja) * 2017-01-30 2021-05-19 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置および熱処理方法
TWI720330B (zh) * 2017-08-10 2021-03-01 美商瓦特洛威電子製造公司 控制送至加熱器之電力的系統及方法
IT201800020272A1 (it) * 2018-12-20 2020-06-20 Amx Automatrix S R L Pressa di sinterizzazione per sinterizzare componenti elettronici su un substrato
JP7256034B2 (ja) * 2019-03-04 2023-04-11 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置および熱処理方法
JP7198718B2 (ja) * 2019-04-26 2023-01-04 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置および熱処理方法
JP2022125685A (ja) * 2021-02-17 2022-08-29 株式会社Kelk 半導体ウエハの温度制御装置及び半導体ウエハの温度制御方法
JP2025132352A (ja) 2024-02-29 2025-09-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07115058A (ja) 1993-10-18 1995-05-02 Dainippon Screen Mfg Co Ltd 基板冷却装置
JPH08148421A (ja) 1994-11-21 1996-06-07 Dainippon Screen Mfg Co Ltd 基板冷却装置
US5638687A (en) 1994-11-21 1997-06-17 Dainippon Screen Mfg. Co., Ltd. Substrate cooling method and apparatus
JPH08203796A (ja) 1995-01-30 1996-08-09 Dainippon Screen Mfg Co Ltd 基板冷却装置
JPH08236414A (ja) 1995-02-27 1996-09-13 Dainippon Screen Mfg Co Ltd 基板冷却装置
JP3504018B2 (ja) * 1995-03-31 2004-03-08 大日本スクリーン製造株式会社 基板冷却装置
JP3665826B2 (ja) * 1997-05-29 2005-06-29 Ｓｍｃ株式会社 基板熱処理装置
US6230497B1 (en) * 1999-12-06 2001-05-15 Motorola, Inc. Semiconductor circuit temperature monitoring and controlling apparatus and method
US6191399B1 (en) * 2000-02-01 2001-02-20 Asm America, Inc. System of controlling the temperature of a processing chamber
WO2004038776A1 (ja) 2002-10-25 2004-05-06 Tokyo Electron Limited 熱処理装置及び熱処理方法
JP4384538B2 (ja) * 2003-06-16 2009-12-16 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP5040213B2 (ja) 2006-08-15 2012-10-03 東京エレクトロン株式会社 熱処理装置、熱処理方法及び記憶媒体
JP5041016B2 (ja) 2010-03-01 2012-10-03 東京エレクトロン株式会社 熱処理装置、熱処理方法及び記憶媒体
JP5048810B2 (ja) 2010-06-23 2012-10-17 東京エレクトロン株式会社 熱処理装置及び熱処理方法
JP2012080080A (ja) 2010-09-07 2012-04-19 Tokyo Electron Ltd 縦型熱処理装置及びその制御方法
KR101512874B1 (ko) 2010-09-07 2015-04-16 도쿄엘렉트론가부시키가이샤 종형 열처리 장치 및 그 제어 방법
US9038404B2 (en) 2011-04-19 2015-05-26 Liebert Corporation High efficiency cooling system
US9845981B2 (en) 2011-04-19 2017-12-19 Liebert Corporation Load estimator for control of vapor compression cooling system with pumped refrigerant economization
US8881541B2 (en) 2011-04-19 2014-11-11 Liebert Corporation Cooling system with tandem compressors and electronic expansion valve control
JP5708310B2 (ja) 2011-07-01 2015-04-30 東京エレクトロン株式会社 基板処理装置
JP2013062361A (ja) 2011-09-13 2013-04-04 Tokyo Electron Ltd 熱処理装置、温度制御システム、熱処理方法、温度制御方法及びその熱処理方法又はその温度制御方法を実行させるためのプログラムを記録した記録媒体
JP5951438B2 (ja) 2012-10-05 2016-07-13 光洋サーモシステム株式会社 熱処理装置
JP6064613B2 (ja) 2013-01-18 2017-01-25 株式会社ノーリツ 給湯装置

Also Published As

Publication number Publication date
WO2016151651A1 (ja) 2016-09-29
TW201637077A (zh) 2016-10-16
CN107430985B (zh) 2020-10-30
US20180033660A1 (en) 2018-02-01
TWI644342B (zh) 2018-12-11
US10629463B2 (en) 2020-04-21
KR20170120151A (ko) 2017-10-30
CN107430985A (zh) 2017-12-01
JP2016183815A (ja) 2016-10-20
KR101994570B1 (ko) 2019-06-28

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