TWI641913B - 聚合物、有機層組成物與形成圖案之方法 - Google Patents

聚合物、有機層組成物與形成圖案之方法 Download PDF

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Publication number
TWI641913B
TWI641913B TW106112730A TW106112730A TWI641913B TW I641913 B TWI641913 B TW I641913B TW 106112730 A TW106112730 A TW 106112730A TW 106112730 A TW106112730 A TW 106112730A TW I641913 B TWI641913 B TW I641913B
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Taiwan
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substituted
unsubstituted
chemical formula
polymer
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TW106112730A
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English (en)
Chinese (zh)
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TW201816517A (zh
Inventor
金瑆煥
朴裕信
林栽範
金昇炫
鄭鉉日
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三星Ｓｄｉ股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/12—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/34—Imagewise removal by selective transfer, e.g. peeling away

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
TW106112730A 2016-10-27 2017-04-17 聚合物、有機層組成物與形成圖案之方法 TWI641913B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020160141244A KR101994367B1 (ko) 2016-10-27 2016-10-27 중합체, 하드마스크 조성물 및 패턴형성방법
??10-2016-0141244 2016-10-27

Publications (2)

Publication Number Publication Date
TW201816517A TW201816517A (zh) 2018-05-01
TWI641913B true TWI641913B (zh) 2018-11-21

Family

ID=62025093

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106112730A TWI641913B (zh) 2016-10-27 2017-04-17 聚合物、有機層組成物與形成圖案之方法

Country Status (3)

Country Link
KR (1) KR101994367B1 (ko)
TW (1) TWI641913B (ko)
WO (1) WO2018079936A1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102171075B1 (ko) * 2018-07-12 2020-10-28 삼성에스디아이 주식회사 중합체, 하드마스크 조성물 및 패턴 형성 방법
KR102244470B1 (ko) 2018-07-18 2021-04-23 삼성에스디아이 주식회사 중합체, 유기막 조성물 및 패턴 형성 방법
KR102303554B1 (ko) * 2018-12-26 2021-09-16 삼성에스디아이 주식회사 중합체, 하드마스크 조성물 및 패턴 형성 방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101523642A (zh) * 2006-08-02 2009-09-02 巴斯夫燃料电池有限责任公司 具有增强性能的膜电极组件和燃料电池
TW201525066A (zh) * 2013-12-31 2015-07-01 Samsung Sdi Co Ltd 硬罩幕組成物和使用硬罩幕組成物形成圖案的方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1715020A3 (en) * 1994-12-28 2007-08-29 Cambridge Display Technology Limited Polymers for use in optical devices
JP4539845B2 (ja) * 2005-03-17 2010-09-08 信越化学工業株式会社 フォトレジスト下層膜形成材料及びパターン形成方法
KR100819162B1 (ko) 2007-04-24 2008-04-03 제일모직주식회사 반사방지성을 갖는 하드마스크 조성물 및 이를 이용한재료의 패턴화 방법
JP6066092B2 (ja) * 2011-09-29 2017-01-25 日産化学工業株式会社 ジアリールアミンノボラック樹脂
US8993215B2 (en) * 2012-03-27 2015-03-31 Nissan Chemical Industries, Ltd. Resist underlayer film forming composition containing phenylindole-containing novolac resin

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101523642A (zh) * 2006-08-02 2009-09-02 巴斯夫燃料电池有限责任公司 具有增强性能的膜电极组件和燃料电池
TW201525066A (zh) * 2013-12-31 2015-07-01 Samsung Sdi Co Ltd 硬罩幕組成物和使用硬罩幕組成物形成圖案的方法

Also Published As

Publication number Publication date
KR101994367B1 (ko) 2019-06-28
TW201816517A (zh) 2018-05-01
WO2018079936A1 (ko) 2018-05-03
KR20180046236A (ko) 2018-05-08

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