TWI626873B - 印刷配線板之製造方法 - Google Patents

印刷配線板之製造方法 Download PDF

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Publication number
TWI626873B
TWI626873B TW105123902A TW105123902A TWI626873B TW I626873 B TWI626873 B TW I626873B TW 105123902 A TW105123902 A TW 105123902A TW 105123902 A TW105123902 A TW 105123902A TW I626873 B TWI626873 B TW I626873B
Authority
TW
Taiwan
Prior art keywords
carrier
layer
ultra
thin copper
wiring board
Prior art date
Application number
TW105123902A
Other languages
English (en)
Chinese (zh)
Other versions
TW201720261A (zh
Inventor
Akitoshi Takanashi
髙梨哲聡
Hiroto Iida
飯田浩人
Original Assignee
Mitsui Mining & Smelting Co., Ltd.
三井金屬鑛業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co., Ltd., 三井金屬鑛業股份有限公司 filed Critical Mitsui Mining & Smelting Co., Ltd.
Publication of TW201720261A publication Critical patent/TW201720261A/zh
Application granted granted Critical
Publication of TWI626873B publication Critical patent/TWI626873B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
TW105123902A 2015-10-28 2016-07-28 印刷配線板之製造方法 TWI626873B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015211741 2015-10-28

Publications (2)

Publication Number Publication Date
TW201720261A TW201720261A (zh) 2017-06-01
TWI626873B true TWI626873B (zh) 2018-06-11

Family

ID=58630112

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105123902A TWI626873B (zh) 2015-10-28 2016-07-28 印刷配線板之製造方法

Country Status (5)

Country Link
JP (1) JP6131395B1 (ja)
KR (1) KR102039844B1 (ja)
CN (1) CN108029202B (ja)
TW (1) TWI626873B (ja)
WO (1) WO2017073121A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109951969B (zh) * 2017-12-21 2021-06-29 台郡科技股份有限公司 薄型化埋入式线路卷式制造方法
CN110876239B (zh) * 2018-08-31 2022-01-11 庆鼎精密电子（淮安）有限公司 电路板及其制作方法
JP2020077811A (ja) * 2018-11-09 2020-05-21 住友ベークライト株式会社 犠牲基板およびコアレス基板の製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005101137A (ja) * 2003-09-24 2005-04-14 Hitachi Chem Co Ltd 回路形成用支持基板と、半導体素子搭載用パッケージ基板及びその製造方法
US20090047539A1 (en) * 2006-03-10 2009-02-19 Mitsui Mining & Smelting Co., Ltd Surface-treated electro-deposited copper foil and method for manufacturing the same
JP2014208484A (ja) * 2013-03-29 2014-11-06 Jx日鉱日石金属株式会社 キャリア付銅箔、プリント配線板、銅張積層板、電子機器及びプリント配線板の製造方法
TW201524279A (zh) * 2013-09-20 2015-06-16 Mitsui Mining & Smelting Co 銅箔、具有載子箔的銅箔以及覆銅層積板
WO2015152380A1 (ja) * 2014-04-02 2015-10-08 三井金属鉱業株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、キャリア付銅箔を用いて得られる銅張積層板及びプリント配線板

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090189631A1 (en) * 2006-03-02 2009-07-30 Advantest Corporation Movement apparatus and electronic device test apparatus
JP2014130856A (ja) 2012-12-28 2014-07-10 Kyocer Slc Technologies Corp 配線基板の製造方法
JP6149016B2 (ja) * 2014-05-09 2017-06-14 Ｊｘ金属株式会社 キャリア付銅箔、銅張積層板の製造方法、電子機器の製造方法、キャリア付銅箔の製造方法、及び、プリント配線板の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005101137A (ja) * 2003-09-24 2005-04-14 Hitachi Chem Co Ltd 回路形成用支持基板と、半導体素子搭載用パッケージ基板及びその製造方法
US20090047539A1 (en) * 2006-03-10 2009-02-19 Mitsui Mining & Smelting Co., Ltd Surface-treated electro-deposited copper foil and method for manufacturing the same
JP2014208484A (ja) * 2013-03-29 2014-11-06 Jx日鉱日石金属株式会社 キャリア付銅箔、プリント配線板、銅張積層板、電子機器及びプリント配線板の製造方法
TW201524279A (zh) * 2013-09-20 2015-06-16 Mitsui Mining & Smelting Co 銅箔、具有載子箔的銅箔以及覆銅層積板
WO2015152380A1 (ja) * 2014-04-02 2015-10-08 三井金属鉱業株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、キャリア付銅箔を用いて得られる銅張積層板及びプリント配線板

Also Published As

Publication number Publication date
JP6131395B1 (ja) 2017-05-17
JPWO2017073121A1 (ja) 2017-10-26
KR102039844B1 (ko) 2019-11-01
TW201720261A (zh) 2017-06-01
CN108029202B (zh) 2020-01-21
CN108029202A (zh) 2018-05-11
WO2017073121A1 (ja) 2017-05-04
KR20180041167A (ko) 2018-04-23

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