TWI624536B - Polishing composition, polishing composition manufacturing method, and polishing product manufacturing method - Google Patents

Polishing composition, polishing composition manufacturing method, and polishing product manufacturing method Download PDF

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Publication number
TWI624536B
TWI624536B TW103104570A TW103104570A TWI624536B TW I624536 B TWI624536 B TW I624536B TW 103104570 A TW103104570 A TW 103104570A TW 103104570 A TW103104570 A TW 103104570A TW I624536 B TWI624536 B TW I624536B
Authority
TW
Taiwan
Prior art keywords
water
polishing
soluble polymer
polishing composition
particles
Prior art date
Application number
TW103104570A
Other languages
English (en)
Chinese (zh)
Other versions
TW201443212A (zh
Inventor
土屋公亮
丹所久典
浅田真希
須賀裕介
Original Assignee
福吉米股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 福吉米股份有限公司 filed Critical 福吉米股份有限公司
Publication of TW201443212A publication Critical patent/TW201443212A/zh
Application granted granted Critical
Publication of TWI624536B publication Critical patent/TWI624536B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1436—Composite particles, e.g. coated particles
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/129—Preparing bulk and homogeneous wafers by polishing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Composite Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW103104570A 2013-02-13 2014-02-12 Polishing composition, polishing composition manufacturing method, and polishing product manufacturing method TWI624536B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013-026020 2013-02-13
JP2013026020 2013-02-13

Publications (2)

Publication Number Publication Date
TW201443212A TW201443212A (zh) 2014-11-16
TWI624536B true TWI624536B (zh) 2018-05-21

Family

ID=51354053

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103104570A TWI624536B (zh) 2013-02-13 2014-02-12 Polishing composition, polishing composition manufacturing method, and polishing product manufacturing method

Country Status (8)

Country Link
US (1) US20150376464A1 (enExample)
EP (1) EP2957613B1 (enExample)
JP (2) JP5897200B2 (enExample)
KR (1) KR102226441B1 (enExample)
CN (1) CN104995277B (enExample)
SG (1) SG11201506001VA (enExample)
TW (1) TWI624536B (enExample)
WO (1) WO2014126051A1 (enExample)

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US11130883B2 (en) 2016-11-22 2021-09-28 Fujimi Incorporated Polishing composition
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JP6929239B2 (ja) * 2018-03-30 2021-09-01 株式会社フジミインコーポレーテッド 研磨用組成物および研磨方法
US20210277282A1 (en) * 2018-07-04 2021-09-09 Sumitomo Seika Chemicals Co., Ltd. Polishing composition
JP7424768B2 (ja) * 2019-08-08 2024-01-30 株式会社フジミインコーポレーテッド 研磨用添加剤含有液の濾過方法、研磨用添加剤含有液、研磨用組成物、研磨用組成物の製造方法およびフィルタ
EP3792327B1 (en) * 2019-09-11 2025-05-28 Fujimi Incorporated Polishing composition, polishing method and method for manufacturing semiconductor substrate
JP6761554B1 (ja) * 2020-01-22 2020-09-23 日本酢ビ・ポバール株式会社 研磨用組成物
JP7741793B2 (ja) * 2020-03-13 2025-09-18 株式会社フジミインコーポレーテッド 研磨用組成物および研磨方法
CN112175524B (zh) * 2020-09-21 2022-02-15 万华化学集团电子材料有限公司 一种蓝宝石抛光组合物及其应用
KR102492236B1 (ko) * 2020-12-17 2023-01-26 에스케이실트론 주식회사 연마장치 및 웨이퍼의 연마방법
KR20240167843A (ko) 2022-03-23 2024-11-28 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물
AU2023298447A1 (en) * 2022-06-29 2024-11-28 Locus Solutions Ipco, Llc Grinding aid compositions and methods of use

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Also Published As

Publication number Publication date
SG11201506001VA (en) 2015-09-29
WO2014126051A1 (ja) 2014-08-21
JPWO2014126051A1 (ja) 2017-02-02
EP2957613A1 (en) 2015-12-23
KR20150119062A (ko) 2015-10-23
KR102226441B1 (ko) 2021-03-12
EP2957613B1 (en) 2020-11-18
JP6387032B2 (ja) 2018-09-05
TW201443212A (zh) 2014-11-16
JP5897200B2 (ja) 2016-03-30
CN104995277A (zh) 2015-10-21
JP2016138278A (ja) 2016-08-04
CN104995277B (zh) 2018-05-08
EP2957613A4 (en) 2016-11-09
US20150376464A1 (en) 2015-12-31

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