TWI621736B - 化學鍍鎳或鎳合金用鎳膠體催化劑液及化學鍍鎳或鎳合金方法 - Google Patents

化學鍍鎳或鎳合金用鎳膠體催化劑液及化學鍍鎳或鎳合金方法 Download PDF

Info

Publication number
TWI621736B
TWI621736B TW104125364A TW104125364A TWI621736B TW I621736 B TWI621736 B TW I621736B TW 104125364 A TW104125364 A TW 104125364A TW 104125364 A TW104125364 A TW 104125364A TW I621736 B TWI621736 B TW I621736B
Authority
TW
Taiwan
Prior art keywords
acid
nickel
electroless
colloidal
liquid
Prior art date
Application number
TW104125364A
Other languages
English (en)
Chinese (zh)
Other versions
TW201610228A (zh
Inventor
内田衛
田中薫
川端愛
Original Assignee
石原化學股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 石原化學股份有限公司 filed Critical 石原化學股份有限公司
Publication of TW201610228A publication Critical patent/TW201610228A/zh
Application granted granted Critical
Publication of TWI621736B publication Critical patent/TWI621736B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Catalysts (AREA)
TW104125364A 2014-09-11 2015-08-05 化學鍍鎳或鎳合金用鎳膠體催化劑液及化學鍍鎳或鎳合金方法 TWI621736B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014184889A JP6201153B2 (ja) 2014-09-11 2014-09-11 無電解ニッケル又はニッケル合金メッキ用のニッケルコロイド触媒液並びに無電解ニッケル又はニッケル合金メッキ方法
JP2014-184889 2014-09-11

Publications (2)

Publication Number Publication Date
TW201610228A TW201610228A (zh) 2016-03-16
TWI621736B true TWI621736B (zh) 2018-04-21

Family

ID=55458777

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104125364A TWI621736B (zh) 2014-09-11 2015-08-05 化學鍍鎳或鎳合金用鎳膠體催化劑液及化學鍍鎳或鎳合金方法

Country Status (5)

Country Link
JP (1) JP6201153B2 (ja)
KR (1) KR101831099B1 (ja)
CN (1) CN106460179B (ja)
TW (1) TWI621736B (ja)
WO (1) WO2016039016A1 (ja)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6268379B2 (ja) * 2016-07-08 2018-01-31 石原ケミカル株式会社 無電解ニッケル又はニッケル合金メッキ用のニッケルコロイド触媒液並びに無電解ニッケル又はニッケル合金メッキ方法
CN108866517B (zh) * 2018-07-03 2020-04-17 广东工业大学 一种无光化学镀镍制备方法
CN109576686A (zh) * 2019-01-11 2019-04-05 江门市德商科佐科技实业有限公司 一种增强化学镀镍溶液稳定性的添加剂
CN110548527B (zh) * 2019-07-26 2022-08-09 青岛科技大学 一种化学镀制备负载型Ni-Fe-P-MnFeO3电催化剂的方法
CN110306174A (zh) * 2019-07-29 2019-10-08 深圳市飞荣达科技股份有限公司 胶体镍组合物及其应用
JP6843455B1 (ja) * 2020-04-27 2021-03-17 石原ケミカル株式会社 無電解ニッケル又はニッケル合金メッキ用のニッケルコロイド触媒液並びに無電解ニッケル又はニッケル合金メッキ方法
JP6858425B1 (ja) * 2020-06-24 2021-04-14 石原ケミカル株式会社 無電解ニッケル又はニッケル合金メッキ用のニッケルコロイド触媒液並びに無電解ニッケル又はニッケル合金メッキ方法
JP6950051B1 (ja) * 2020-07-22 2021-10-13 上村工業株式会社 無電解Ｎｉ−Ｐめっき用触媒液、および該触媒液を用いた無電解Ｎｉ−Ｐめっき皮膜の形成方法
CN112680761B (zh) * 2020-12-16 2023-12-26 江西瑞顺超细铜线科技协同创新有限公司 一种镀镍铈合金软铜线生产工艺
RU2762733C1 (ru) * 2021-02-18 2021-12-22 Федеральное государственное бюджетное образовательное учреждение высшего образования "Российский химико-технологический университет имени Д.И. Менделеева" (РХТУ им. Д.И. Менделеева) Раствор для химического никелирования металлических изделий
CN113122846B (zh) * 2021-04-03 2023-04-28 昆山陆新新材料科技有限公司 一种铝合金金属镀件
KR20230077067A (ko) 2021-11-25 2023-06-01 삼우금속공업 주식회사 티타늄 소재의 무전해 니켈 도금방법
CN114411127B (zh) * 2022-01-26 2023-08-08 深圳市溢诚电子科技有限公司 基于钌-钯体系的化学镀镍前处理活化液及其制备方法
JP7220494B1 (ja) 2022-08-26 2023-02-10 石原ケミカル株式会社 金含有メッキ液中の金濃度測定装置並びに測定方法
CN115522186B (zh) * 2022-10-09 2023-04-11 深圳创智芯联科技股份有限公司 一种玻璃基板的化学镀镍液及其化学镀镍工艺
CN116770282B (zh) * 2023-07-04 2024-03-19 江苏贺鸿电子有限公司 一种线路板用化学镀镍工艺

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0293076A (ja) * 1988-09-29 1990-04-03 Sanko Tokushu Kinzoku Kogyo Kk 無電解メッキに利用される微細な金属体の製造方法
JPH03180476A (ja) * 1989-12-08 1991-08-06 Sony Corp 光ディスクの原盤作成方法
JPH11209878A (ja) * 1998-01-22 1999-08-03 Dipsol Chem Co Ltd 金属コロイド安定化剤、該安定化剤を含有する金属コロイド液状組成物、その調製方法及びその使用
JP2007270344A (ja) * 2006-03-09 2007-10-18 Okuno Chem Ind Co Ltd 無電解ニッケルめっき液
JP2013028866A (ja) * 2006-03-09 2013-02-07 Okuno Chemical Industries Co Ltd 無電解ニッケルめっき液

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3826544B2 (ja) 1998-02-27 2006-09-27 奥野製薬工業株式会社 無電解めっき用触媒組成物
GB0025989D0 (en) * 2000-10-24 2000-12-13 Shipley Co Llc Plating catalysts
JP4679716B2 (ja) 2000-12-08 2011-04-27 日揮触媒化成株式会社 金属コロイド溶液の製造方法
JP4069248B2 (ja) * 2002-12-09 2008-04-02 大阪市 無電解めっき用触媒組成物
JP4081576B2 (ja) 2003-06-18 2008-04-30 上村工業株式会社 無電解めっき皮膜の形成方法、それに用いる置換触媒溶液、並びにプリント配線基板及び放熱めっき部材
CN101684554B (zh) * 2008-09-23 2012-03-07 比亚迪股份有限公司 一种聚酰亚胺薄膜的化学镀铜液及其表面化学镀铜方法
JP5570285B2 (ja) * 2010-04-19 2014-08-13 株式会社日本表面処理研究所 無電解めっき法で用いる触媒水溶液、その触媒水溶液の調製方法及びその触媒水溶液を用いた無電解めっき法並びにその無電解めっき法を用いて形成した金属皮膜を備える金属層付被めっき物
US8591637B2 (en) * 2010-12-14 2013-11-26 Rohm And Haas Electronic Materials Llc Plating catalyst and method
US8591636B2 (en) * 2010-12-14 2013-11-26 Rohm And Haas Electronics Materials Llc Plating catalyst and method
CN102877046A (zh) * 2011-07-13 2013-01-16 比亚迪股份有限公司 一种化学镀铜液及化学镀铜方法
JP6013753B2 (ja) * 2012-03-30 2016-10-25 タキロン株式会社 軒樋曲り継手

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0293076A (ja) * 1988-09-29 1990-04-03 Sanko Tokushu Kinzoku Kogyo Kk 無電解メッキに利用される微細な金属体の製造方法
JPH03180476A (ja) * 1989-12-08 1991-08-06 Sony Corp 光ディスクの原盤作成方法
JPH11209878A (ja) * 1998-01-22 1999-08-03 Dipsol Chem Co Ltd 金属コロイド安定化剤、該安定化剤を含有する金属コロイド液状組成物、その調製方法及びその使用
JP2007270344A (ja) * 2006-03-09 2007-10-18 Okuno Chem Ind Co Ltd 無電解ニッケルめっき液
JP2013028866A (ja) * 2006-03-09 2013-02-07 Okuno Chemical Industries Co Ltd 無電解ニッケルめっき液

Also Published As

Publication number Publication date
KR101831099B1 (ko) 2018-04-04
KR20170008287A (ko) 2017-01-23
WO2016039016A1 (ja) 2016-03-17
CN106460179A (zh) 2017-02-22
TW201610228A (zh) 2016-03-16
JP2016056421A (ja) 2016-04-21
CN106460179B (zh) 2019-05-10
JP6201153B2 (ja) 2017-09-27

Similar Documents

Publication Publication Date Title
TWI621736B (zh) 化學鍍鎳或鎳合金用鎳膠體催化劑液及化學鍍鎳或鎳合金方法
TWI613321B (zh) 化學鍍銅用之水系銅膠體催化劑溶液及化學鍍銅方法
TWI684673B (zh) 化學鍍銅用之銅膠體催化溶液及化學鍍銅方法
TWI749234B (zh) 化學鍍銅用銅膠體催化劑液、化學鍍銅方法、以及鍍銅基板的製造方法
TWI597384B (zh) Electroless nickel or electroless nickel alloy pretreatment solution and plating method
WO2021220788A1 (ja) 無電解ニッケル又はニッケル合金メッキ用のニッケルコロイド触媒液、無電解ニッケル又はニッケル合金メッキ方法、及びニッケル又はニッケル合金メッキ基板の製造方法
CN115803476A (zh) 化学镀镍或镍合金用镍胶体催化液、化学镀镍或镍合金方法、以及镀镍或镍合金基板的制造方法
TWI734804B (zh) 用於化學鍍鎳或鎳合金的鎳膠體催化劑液以及化學鍍鎳或鎳合金方法
JP6735981B2 (ja) 無電解銅メッキ方法及び当該方法を用いたプリント配線板の製造方法
JP2023008598A (ja) 無電解ニッケル又はニッケル合金メッキ方法