TWI617367B - 基板處理方法及基板處理裝置 - Google Patents

基板處理方法及基板處理裝置 Download PDF

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Publication number
TWI617367B
TWI617367B TW105106666A TW105106666A TWI617367B TW I617367 B TWI617367 B TW I617367B TW 105106666 A TW105106666 A TW 105106666A TW 105106666 A TW105106666 A TW 105106666A TW I617367 B TWI617367 B TW I617367B
Authority
TW
Taiwan
Prior art keywords
gas
liquid
substrate
liquid film
processing
Prior art date
Application number
TW105106666A
Other languages
English (en)
Chinese (zh)
Other versions
TW201703882A (zh
Inventor
Kenji Kobayashi
小林健司
Original Assignee
SCREEN Holdings Co., Ltd.
思可林集團股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SCREEN Holdings Co., Ltd., 思可林集團股份有限公司 filed Critical SCREEN Holdings Co., Ltd.
Publication of TW201703882A publication Critical patent/TW201703882A/zh
Application granted granted Critical
Publication of TWI617367B publication Critical patent/TWI617367B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02046—Dry cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW105106666A 2015-03-05 2016-03-04 基板處理方法及基板處理裝置 TWI617367B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2015-043708 2015-03-05
JP2015043708 2015-03-05
JP2016028312A JP6709555B2 (ja) 2015-03-05 2016-02-17 基板処理方法および基板処理装置
JP2016-028312 2016-02-17

Publications (2)

Publication Number Publication Date
TW201703882A TW201703882A (zh) 2017-02-01
TWI617367B true TWI617367B (zh) 2018-03-11

Family

ID=56897760

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105106666A TWI617367B (zh) 2015-03-05 2016-03-04 基板處理方法及基板處理裝置

Country Status (4)

Country Link
JP (1) JP6709555B2 (ja)
KR (2) KR20160108232A (ja)
CN (1) CN105938791B (ja)
TW (1) TWI617367B (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6811619B2 (ja) * 2017-01-12 2021-01-13 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP6966917B2 (ja) * 2017-10-12 2021-11-17 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
TWI643683B (zh) * 2017-10-19 2018-12-11 Scientech Corporation 流體供應裝置
KR102134261B1 (ko) * 2018-10-25 2020-07-16 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
JP7446181B2 (ja) * 2020-08-20 2024-03-08 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100293806A1 (en) * 2006-01-18 2010-11-25 Liu Zhi Lewis Systems and methods for drying a rotating substrate
TW201442104A (zh) * 2013-02-15 2014-11-01 Dainippon Screen Mfg 基板處理裝置
TW201445628A (zh) * 2013-03-28 2014-12-01 Dainippon Screen Mfg 基板處理裝置及基板處理方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4343018B2 (ja) * 2004-04-20 2009-10-14 東京エレクトロン株式会社 基板の処理方法及び基板の処理装置
JP2007036152A (ja) * 2005-07-29 2007-02-08 Tokyo Seimitsu Co Ltd ウェーハ洗浄乾燥方法及びウェーハ洗浄乾燥装置
JP2008034428A (ja) * 2006-07-26 2008-02-14 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2008243935A (ja) * 2007-03-26 2008-10-09 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP5153296B2 (ja) * 2007-10-31 2013-02-27 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP2013201334A (ja) * 2012-03-26 2013-10-03 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
US10043653B2 (en) * 2012-08-27 2018-08-07 Taiwan Semiconductor Manufacturing Company Maranagoni dry with low spin speed for charging release
JP6317547B2 (ja) * 2012-08-28 2018-04-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法
JP6111104B2 (ja) * 2013-03-15 2017-04-05 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板洗浄乾燥方法および基板現像方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100293806A1 (en) * 2006-01-18 2010-11-25 Liu Zhi Lewis Systems and methods for drying a rotating substrate
TW201442104A (zh) * 2013-02-15 2014-11-01 Dainippon Screen Mfg 基板處理裝置
TW201445628A (zh) * 2013-03-28 2014-12-01 Dainippon Screen Mfg 基板處理裝置及基板處理方法

Also Published As

Publication number Publication date
KR20180040127A (ko) 2018-04-19
CN105938791A (zh) 2016-09-14
KR20160108232A (ko) 2016-09-19
TW201703882A (zh) 2017-02-01
JP2016167582A (ja) 2016-09-15
JP6709555B2 (ja) 2020-06-17
CN105938791B (zh) 2019-07-09

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