TWI616247B - Article manufacturing device and manufacturing method - Google Patents

Article manufacturing device and manufacturing method Download PDF

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Publication number
TWI616247B
TWI616247B TW105113044A TW105113044A TWI616247B TW I616247 B TWI616247 B TW I616247B TW 105113044 A TW105113044 A TW 105113044A TW 105113044 A TW105113044 A TW 105113044A TW I616247 B TWI616247 B TW I616247B
Authority
TW
Taiwan
Prior art keywords
information
manufacturing
replaceable
replaceable component
section
Prior art date
Application number
TW105113044A
Other languages
English (en)
Chinese (zh)
Other versions
TW201711771A (zh
Inventor
Makoto Matsuo
Kazuhiro Takahashi
Fumiaki Tagashira
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of TW201711771A publication Critical patent/TW201711771A/zh
Application granted granted Critical
Publication of TWI616247B publication Critical patent/TWI616247B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/30—Mounting, exchanging or centering
    • B29C33/306—Exchangeable mould parts, e.g. cassette moulds, mould inserts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D37/00—Tools as parts of machines covered by this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D37/00—Tools as parts of machines covered by this subclass
    • B21D37/04—Movable or exchangeable mountings for tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/30—Mounting, exchanging or centering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/36—Moulds having means for locating or centering cores
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/02—Dies; Inserts therefor; Mounting thereof; Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
TW105113044A 2015-04-29 2016-04-27 Article manufacturing device and manufacturing method TWI616247B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015092475A JP6566706B2 (ja) 2015-04-29 2015-04-29 物品の製造装置及び製造方法

Publications (2)

Publication Number Publication Date
TW201711771A TW201711771A (zh) 2017-04-01
TWI616247B true TWI616247B (zh) 2018-03-01

Family

ID=57198359

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105113044A TWI616247B (zh) 2015-04-29 2016-04-27 Article manufacturing device and manufacturing method

Country Status (5)

Country Link
JP (1) JP6566706B2 (ko)
KR (1) KR20170141194A (ko)
CN (1) CN107530913B (ko)
TW (1) TWI616247B (ko)
WO (1) WO2016175056A1 (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6894285B2 (ja) * 2017-04-26 2021-06-30 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品の製造方法
CN110961970B (zh) * 2018-09-28 2022-05-03 兄弟工业株式会社 控制装置、加工装置、控制方法及输送控制程序
KR102084964B1 (ko) * 2019-06-28 2020-03-05 리얼룩앤컴퍼니 주식회사 금형 식별 기능을 구비한 3d 포밍필름 제조 장치 및 이를 이용한 3d 포밍필름 제조 방법
JP7003184B2 (ja) * 2020-06-22 2022-01-20 Ｔｏｗａ株式会社 樹脂成形装置、及び、樹脂成形品の製造方法
CN114055728A (zh) * 2021-11-09 2022-02-18 东莞市巨成模具有限公司 一种塑胶模具抽芯装置
KR102470320B1 (ko) 2022-01-26 2022-11-25 이미아 생체 정보를 측정하여 분석 이미지를 제공하는 방법 및 그 검사 장치

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06246894A (ja) * 1993-02-24 1994-09-06 Kyushu Hitachi Maxell Ltd スクリーン印刷版の製造方法
TW200638050A (en) * 2005-04-27 2006-11-01 Advanced Semiconductor Eng Machine modifying procedure for IC testing machine
JP2009184220A (ja) * 2008-02-06 2009-08-20 Dainippon Printing Co Ltd 金型、金型収納体および金型管理システム
CN102363354A (zh) * 2011-11-02 2012-02-29 宁波安信数控技术有限公司 一种基于机械视觉的注塑机模具保护系统和方法
TW201412488A (zh) * 2012-09-26 2014-04-01 Prec Machinery Res & Dev Ct 用於熱加工設備之自發電感測模組、具有該自發電感測模組之監控系統，以及該監控系統之操作方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2243618B (en) * 1990-05-04 1995-01-11 Scient Generics Ltd Improvements in the production process for making continuously electroformed thickness modulated or perforated metal foil
JPH07161745A (ja) * 1993-12-02 1995-06-23 Hitachi Ltd 樹脂封止型半導体装置用トランスファモールド装置
JP3595572B2 (ja) * 1994-05-11 2004-12-02 ファナック株式会社 射出成形機の段取り誤り検出方法
JP3943443B2 (ja) * 2002-05-29 2007-07-11 Ｔｏｗａ株式会社 金型交換装置
JP4448869B2 (ja) * 2007-07-02 2010-04-14 ウシオ電機株式会社 金型監視装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06246894A (ja) * 1993-02-24 1994-09-06 Kyushu Hitachi Maxell Ltd スクリーン印刷版の製造方法
TW200638050A (en) * 2005-04-27 2006-11-01 Advanced Semiconductor Eng Machine modifying procedure for IC testing machine
JP2009184220A (ja) * 2008-02-06 2009-08-20 Dainippon Printing Co Ltd 金型、金型収納体および金型管理システム
CN102363354A (zh) * 2011-11-02 2012-02-29 宁波安信数控技术有限公司 一种基于机械视觉的注塑机模具保护系统和方法
TW201412488A (zh) * 2012-09-26 2014-04-01 Prec Machinery Res & Dev Ct 用於熱加工設備之自發電感測模組、具有該自發電感測模組之監控系統，以及該監控系統之操作方法

Also Published As

Publication number Publication date
TW201711771A (zh) 2017-04-01
CN107530913A (zh) 2018-01-02
JP6566706B2 (ja) 2019-08-28
CN107530913B (zh) 2019-09-27
WO2016175056A1 (ja) 2016-11-03
KR20170141194A (ko) 2017-12-22
JP2016210006A (ja) 2016-12-15

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