TWI616247B - Article manufacturing device and manufacturing method - Google Patents

Article manufacturing device and manufacturing method Download PDF

Info

Publication number
TWI616247B
TWI616247B TW105113044A TW105113044A TWI616247B TW I616247 B TWI616247 B TW I616247B TW 105113044 A TW105113044 A TW 105113044A TW 105113044 A TW105113044 A TW 105113044A TW I616247 B TWI616247 B TW I616247B
Authority
TW
Taiwan
Prior art keywords
information
manufacturing
replaceable
replaceable component
section
Prior art date
Application number
TW105113044A
Other languages
Chinese (zh)
Other versions
TW201711771A (en
Inventor
Makoto Matsuo
Kazuhiro Takahashi
Fumiaki Tagashira
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of TW201711771A publication Critical patent/TW201711771A/en
Application granted granted Critical
Publication of TWI616247B publication Critical patent/TWI616247B/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00Moulds or cores; Details thereof or accessories therefor
    • B29C33/30Mounting, exchanging or centering
    • B29C33/306Exchangeable mould parts, e.g. cassette moulds, mould inserts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21DWORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D37/00Tools as parts of machines covered by this subclass
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21DWORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D37/00Tools as parts of machines covered by this subclass
    • B21D37/04Movable or exchangeable mountings for tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00Moulds or cores; Details thereof or accessories therefor
    • B29C33/30Mounting, exchanging or centering
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/26Moulds
    • B29C45/36Moulds having means for locating or centering cores
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/76Measuring, controlling or regulating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B30PRESSES
    • B30BPRESSES IN GENERAL
    • B30B15/00Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/02Dies; Inserts therefor; Mounting thereof; Moulds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565Moulds

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

在裝設於樹脂密封裝置(1)的可換組件之成形模具(6)設置標識(9),在資訊形成面(9a)設置標識(9),在資訊形成面(9a)形成有微細圖案,此微細圖案是表示包含特定此成形模具(6)的資訊之第一資訊。資訊讀取工具(10)讀取微細圖案,解讀部(DE)基於被讀取的微細圖案而取得第一資訊。判別部(J)比較第一資訊、與包含特定此成形模具(6)的資訊且被預先記憶的第二資訊,進行判別。控制部(8)基於各自的判別的結果,控制樹脂密封裝置(1),在成形模具(6)對於第二資訊為適合時,使樹脂密封裝置(1)動作,在成形模具(6)對於第二資訊為不適合時,使製造裝置顯示以下事項:成形模具對於第二資訊為不適合。因此,防止用於樹脂密封裝置(1)的成形模具(6)並非適合品項的情況。 A logo (9) is provided on the forming mold (6) of the replaceable component mounted on the resin sealing device (1), a logo (9) is provided on the information forming surface (9a), and a fine pattern is formed on the information forming surface (9a). This fine pattern is the first information indicating that it contains information specific to this forming mold (6). The information reading tool (10) reads the fine pattern, and the interpretation unit (DE) obtains the first information based on the read fine pattern. The discriminating unit (J) compares the first information with the second information that contains information specifying the forming mold (6) and is stored in advance, and performs discrimination. The control unit (8) controls the resin sealing device (1) based on the results of the respective determinations, and operates the resin sealing device (1) when the molding die (6) is appropriate for the second information, and When the second information is unsuitable, the manufacturing device is caused to display the following: the forming mold is unsuitable for the second information. Therefore, it is prevented that the molding die (6) used for the resin sealing device (1) is not suitable for the item.

Description

物品之製造裝置及製造方法 Article manufacturing device and manufacturing method

本發明是關於物品之製造裝置及製造方法,藉由防止按照所製造的物品在製造裝置被替換的可換組件的誤安裝等,保持物品的品質且防止對製造裝置造成不良影響。 The present invention relates to a device and a method for manufacturing an article, by preventing erroneous installation of a replaceable component that is replaced in a manufacturing device in accordance with the manufactured article, etc., maintaining the quality of the article and preventing adverse effects on the manufacturing device.

在替換按照在沖壓機等被加工的物品的種類而被替換的金屬模具之作業時,以使製品不良不發生為目的之一,會進行「正確的金屬模具」的判別。例如,對應於附在裝設於沖壓機本體的金屬模具的識別編號的條碼標籤,是被張貼在設於機械安排部的條碼管理面板。安排金屬模具時,藉由條碼讀取器,讀取對應於安裝的金屬模具的識別編號的條碼標籤。有人提出一種金屬模具管理方法,將藉由條碼讀取器被讀取的固有的金屬模具資訊、與設定用於加工的金屬模具時的設定金屬模具資訊予以記憶,在加工時基於設定金屬模具資訊呼叫所需的金屬模具設定,進行金屬模具替換(請參考專利文獻1的第0006、0009、0027段及圖5)。 When replacing a metal mold that is replaced according to the type of an article to be processed in a press, etc., one of the purposes is to prevent the occurrence of product defects, and a "correct mold" is determined. For example, a bar code label corresponding to an identification number attached to a metal mold mounted on the main body of the press is attached to a bar code management panel provided in the mechanical arrangement section. When arranging the metal mold, a barcode reader corresponding to the identification number of the installed metal mold is read by a barcode reader. Some people have proposed a metal mold management method that memorizes the inherent metal mold information read by a bar code reader and the metal mold information set when the metal mold is set for processing. Based on the metal mold set information during processing, Call the required mold setting and replace the mold (refer to paragraphs 0006, 0009, 0027 and Figure 5 of Patent Document 1).

樹脂成形裝置的一種之電子零件用的樹脂密封裝置,是藉由密封樹脂,覆蓋裝設於基板(導線架、印刷基板等)之上的半導體晶片等的片狀元件。藉此,完成成形品之密封後基板。在樹脂密封裝置的樹脂密封用的成形模具,是在變更密 封後基板的機種(產品種類)時、成形模具磨耗時,被替換。因此,成形模具是按照所製造的物品(密封後基板)的種類而被替換的可換組件。 A resin sealing device for electronic parts, which is a type of resin molding device, covers a chip-like element such as a semiconductor wafer mounted on a substrate (a lead frame, a printed circuit board, or the like) with a sealing resin. Thereby, the sealed substrate of the molded product is completed. The mold for resin sealing in the resin sealing device is changing the seal. It is replaced when the type (product type) of the post-sealed substrate is worn or the molding die is worn. Therefore, the molding die is a replaceable component that is replaced according to the type of the manufactured article (sealed substrate).

在被換上而被新裝設的成形模具並非適用的成形模具時(例如起因於作業員的選擇失誤等的成形模具的誤裝設發生時)、已被裝設異於品質受保證且特性符合的正確的金屬模具(適合品)的模具時等,會有損及成形品的品質之虞。此外,有發生對樹脂密封裝置的本體造成不良影響等的缺點之虞。 When the newly installed forming mold is not a suitable forming mold (for example, when an incorrect installation of the forming mold occurs due to an operator's selection error, etc.), the installation is different from the one with guaranteed quality and characteristics If the mold is a correct metal mold (suitable product), the quality of the molded product may be impaired. In addition, there is a possibility that disadvantages such as adverse effects on the body of the resin sealing device may occur.

在替換裝配於電子零件的樹脂密封裝置而被使用的成形模具時,作業員是藉由手動進行替換作業。由於這種情況,無法在機械安排部設置條碼標籤。此外,為了識別成形模具,在此成形模具設置條碼標籤時,會有如下的問題。成形模具在被安裝於樹脂成形裝置後,會被加熱至既定的成形溫度(例如約180℃),在此狀態被使用。因此,將條碼標籤作為標識使用時,條碼標籤會因高溫而損傷,而容易損及施作於此標識的顯示功能。因此,即使在條碼標籤顯示主旨為適合品的標識,在此條碼標籤損傷時,會有無法正確地進行被裝設的成形模具的適當與否的判別之問題。因此,有發生用於物品製造時的可換組件的誤裝設的問題。 When replacing a molding die used for a resin sealing device mounted on an electronic component, the operator performs the replacement operation manually. Due to this situation, it is not possible to set a bar code label in the mechanical arrangement department. In addition, in order to identify the forming mold, when the barcode label is set on the forming mold, there are the following problems. After being installed in the resin molding apparatus, the molding die is heated to a predetermined molding temperature (for example, about 180 ° C), and is used in this state. Therefore, when a bar code label is used as a logo, the bar code label may be damaged due to high temperature, which may easily impair the display function applied to the logo. Therefore, even if the bar code label shows the identification of a suitable product, if the bar code label is damaged, there is a problem that the appropriateness of the installed mold cannot be accurately determined. For this reason, there is a problem that an erroneous installation of a replaceable module is used in the manufacture of an article.

作為管理金屬模具的方法,有人提出在構成金屬模具的各金屬模具零件附加無線射頻識別(Radio Frequency Identification;RFID)標籤的方法(請參考專利文獻2的第0013段)。此方法無法適用於被使用於高溫(例如約180℃)的金屬模具。這是因為被附加於金屬模具零件的無線射頻識別標籤會被 熱破壞。 As a method for managing a metal mold, a method of attaching a radio frequency identification (RFID) tag to each metal mold part constituting the metal mold has been proposed (refer to paragraph 0013 of Patent Document 2). This method cannot be applied to a metal mold used at a high temperature (for example, about 180 ° C). This is because the RFID tag attached to the metal mold part will be Thermal damage.

【先行技術文獻】 [Advanced technical literature]

【專利文獻】 [Patent Literature]

【專利文獻1】日本特開平07-164073號公報 [Patent Document 1] Japanese Unexamined Patent Publication No. 07-164073

【專利文獻2】日本特開2003-050614號公報 [Patent Document 2] Japanese Patent Laid-Open No. 2003-050614

本發明所欲解決的問題是:在物品的製造裝置使用於物品的製造的可換組件,有發生不適合本來應使用的可換組件之虞的情況。 The problem to be solved by the present invention is that the replaceable module used in the manufacture of an article in an article manufacturing apparatus may be unsuitable for a replaceable module that should be used originally.

為了解決上述問題,本發明相關的物品之製造裝置,其特徵在於包括:至少一個可換組件,其包含於物品之製造裝置,按照從材料製造的物品的種類而被替換;標識,設在可換組件;圖案,形成於標識;讀取部,光學式地讀取圖案;解讀部,基於被讀取的圖案,取得含有特定可換組件的資訊的第一資訊;控制部,基於已被預先記憶且至少包含特定可換組件的資訊之第二資訊,控制製造裝置的動作;以及判別部,比較第一資訊與第二資訊而進行判別;其中控制部在基於判別的結果,可換組件對於第二資訊為適合時,控制製造裝置而使製造裝置動作;以及控制部在基於判別的結果,可換組件對於第二資訊為不適合時,控制製造裝置而使製造裝置顯示以下事項:可換組件對於第二資訊為不適合。在關於可換組件為適合品與否的判別、與關於可換組件為需維護品與否的判別中的至 少任一個,可使用第二資訊。 In order to solve the above problems, the device for manufacturing an article related to the present invention is characterized by including: at least one replaceable component included in the article manufacturing device, which is replaced according to the type of the article manufactured from the material; The reading unit reads the pattern optically; the reading unit obtains the first information containing the information of the specific replaceable unit based on the read pattern; the control unit, based on the Second information memorized and including at least information of a specific replaceable component to control the operation of the manufacturing device; and a discrimination section that compares the first information with the second information for determination; wherein the control section is based on the determination result, When the second information is appropriate, the manufacturing device is controlled to operate the manufacturing device; and when the control unit is not suitable for the second information based on the determination result, the control unit controls the manufacturing device and causes the manufacturing device to display the following: Not suitable for secondary information. In the judgment of whether the replaceable component is suitable or not, and the judgment of whether the replaceable component is required to be maintained or not, Either one can use the second information.

在上述物品之製造裝置,亦可:控制部在基於判別的結果,可換組件對於第二資訊為不適合時,控制製造裝置而使製造裝置不動作。 In the above-mentioned article manufacturing device, the control unit may control the manufacturing device so that the manufacturing device does not operate when the replaceable component is not suitable for the second information based on the determination result.

在上述物品之製造裝置,亦可:控制部控制製造裝置而使製造裝置不動作後,按照已接收的訊號,控制上述製造裝置而使上述製造裝置動作。 In the above-mentioned article manufacturing apparatus, the control unit may control the manufacturing apparatus so that the manufacturing apparatus does not operate, and then control the manufacturing apparatus to operate the manufacturing apparatus according to the received signal.

在上述物品之製造裝置,亦可:可換組件包含單個可換組件或複數個可換組件;在單個可換組件或複數個可換組件的各自的既定位置設有標識;讀取部具有受光部、導光部與影像取得部;以及至少受光部是分別對應於既定位置而設置。 In the manufacturing device of the above article, the replaceable component may include a single replaceable component or a plurality of replaceable components; a mark may be provided at each predetermined position of the single replaceable component or a plurality of replaceable components; The light guide section, the light guide section, and the image acquisition section; and at least the light receiving section are provided corresponding to predetermined positions, respectively.

在上述物品之製造裝置,亦可:可換組件包含單個可換組件或複數個可換組件;在單個可換組件或複數個可換組件的各自的既定位置設有標識;讀取部具有受光部、導光部與影像取得部;以及至少受光部藉由移動,受光部分別對於單個可換組件或複數個可換組件而被共通使用。 In the manufacturing device of the above article, the replaceable component may include a single replaceable component or a plurality of replaceable components; a mark may be provided at each predetermined position of the single replaceable component or a plurality of replaceable components; The light receiving unit, the light guiding unit, and the image acquisition unit; and at least the light receiving unit are commonly used for a single replaceable component or a plurality of replaceable components by moving.

在上述物品之製造裝置,亦可:至少受光部是被設置於搬運機構,搬運機構具有將材料供應至可換組件的功能與將物品從可換組件搬出的功能中的至少任一個功能;以及受光部是藉由搬運機構而移動至既定位置。 In the above-mentioned article manufacturing device, at least the light-receiving unit is provided in a conveying mechanism, and the conveying mechanism has at least one of a function of supplying materials to the replaceable module and a function of moving the article out of the replaceable module; The light receiving unit is moved to a predetermined position by a transport mechanism.

在上述物品之製造裝置,亦可:影像取得部是被設在遠離單個可換組件或複數個可換組件的位置;以及受光部與影像取得部是藉由導光部而光學性連接。 In the above-mentioned article manufacturing device, the image acquisition section may be located away from a single replaceable component or a plurality of replaceable components; and the light receiving section and the image acquisition section are optically connected through a light guide section.

在上述物品之製造裝置,可換組件亦可包含單個模具或複數個模具。 In the above-mentioned article manufacturing device, the replaceable component may also include a single mold or a plurality of molds.

在上述物品之製造裝置,亦可:可換組件至少具有第一模具及與第一模具相對向的第二模具;以及包括驅動機構,至少使第一模具與第二模具相對移動。 In the above-mentioned article manufacturing device, the replaceable component may have at least a first mold and a second mold opposite to the first mold; and a driving mechanism for relatively moving at least the first mold and the second mold.

在上述物品之製造裝置,亦可包括:可換組件模組,其設有至少可換組件;以及接收模組,接收材料;其中可換組件模組,相對於接收模組為可裝卸;以及可換組件模組,相對於其他的可換組件模組為可裝卸。 The above-mentioned article manufacturing device may also include: a replaceable component module provided with at least a replaceable component; and a receiving module that receives materials; wherein the replaceable component module is removable with respect to the receiving module; and The replaceable component module is removable relative to other replaceable component modules.

在上述物品之製造裝置,形成於標識的圖案,亦可包含藉由電鑄加工形成的圖案。 In the device for manufacturing the article, the pattern formed on the logo may include a pattern formed by electroforming.

在上述物品之製造裝置,亦可包括由形成有上述圖案的另一個組件構成的上述標識,其中另一個組件是被固定於上述可換組件。 The above-mentioned article manufacturing device may further include the above-mentioned logo formed by another component formed with the above-mentioned pattern, wherein the other component is fixed to the replaceable component.

為了解決上述問題,本發明相關的物品之製造方法,是藉由使用製造裝置而從材料製造物品之製造方法,其特徵在於包括:準備至少一個可換組件的步驟,至少一個可換組件包含於製造裝置,按照製造的物品的種類而被替換;準備標識的步驟,標識設在可換組件;使用讀取部而光學式地讀取預先形成在標識的圖案的步驟;基於被讀取的圖案而取得第一資訊的步驟,第一資訊含有特定可換組件的資訊;讀出已被預先記憶且至少包含特定可換組件的資訊之第二資訊的步驟;比較第一資訊與第二資訊而進行判別的步驟;基於判別的結果,可換組件對於第二資訊為適合時,控制製造裝置而使製造裝置動 作的步驟;以及基於判別的結果,可換組件對於第二資訊為不適合時,控制製造裝置而使製造裝置顯示以下事項的步驟:可換組件對於第二資訊為不適合。在進行判別的步驟,在關於可換組件為適合品與否的判別、與關於可換組件為需維護品與否的判別中的至少任一個,可使用第二資訊。 In order to solve the above problems, a method for manufacturing an article related to the present invention is a method for manufacturing an article from a material by using a manufacturing device, which is characterized by including a step of preparing at least one replaceable component, and at least one replaceable component is included in The manufacturing device is replaced according to the type of article to be manufactured; the step of preparing a mark is provided on a replaceable component; the step of optically reading a pattern previously formed on the mark using a reading section; based on the read pattern The step of obtaining the first information, the first information contains information of a specific replaceable component; the step of reading out the second information which has been memorized in advance and contains at least the information of the specific replaceable component; comparing the first information with the second information; A step of discriminating; based on the discriminating result, when the replaceable component is suitable for the second information, the manufacturing device is controlled to move the manufacturing device And the step of controlling the manufacturing device to display the following when the replaceable component is not suitable for the second information based on the result of the discrimination: the replaceable component is not suitable for the second information. In the discriminating step, the second information may be used in at least one of the determination as to whether the replaceable component is suitable or not, and the determination as to whether the replaceable component is required to be maintained or not.

在上述製造方法,亦可包含:基於上述判別的結果,可換組件對於第二資訊為不適合時,控制製造裝置而使製造裝置不動作的步驟。 The manufacturing method may further include the step of controlling the manufacturing apparatus so that the manufacturing apparatus does not operate when the replaceable component is not suitable for the second information based on a result of the determination.

在上述製造方法,亦可包含:控制製造裝置而使製造裝置不動作後,按照已接收的訊號,控制製造裝置而使製造裝置動作的步驟。 The manufacturing method described above may include a step of controlling the manufacturing apparatus so that the manufacturing apparatus does not operate, and then controlling the manufacturing apparatus to operate the manufacturing apparatus according to the received signal.

在上述製造方法,亦可包含:在讀取部準備受光部、導光部與影像取得部的步驟;其中可換組件包含單個可換組件或複數個可換組件;在單個可換組件或複數個可換組件的各自的既定位置設有標識;以及在光學式地讀取上述圖案的步驟,是使用分別設於單個可換組件或複數個可換組件的受光部,讀取第一資訊。 The above manufacturing method may further include the steps of preparing a light receiving section, a light guiding section, and an image acquiring section in the reading section; wherein the replaceable component includes a single replaceable component or a plurality of replaceable components; and the single replaceable component or a plurality of replaceable components Each of the replaceable components is provided with a mark at a predetermined position; and the step of optically reading the pattern is to read the first information using a light receiving unit provided on a single replaceable component or a plurality of replaceable components.

在上述製造方法,亦可包含:在讀取部準備受光部、導光部與影像取得部的步驟;其中可換組件是單個可換組件或複數個可換組件;在單個可換組件或上述複數個可換組件的各自的既定位置設有標識;以及在光學式地讀取上述圖案的步驟,是使用共通設於單個可換組件或複數個可換組件的受光部,上述第一資訊。 The above manufacturing method may further include the steps of preparing the light receiving section, the light guiding section, and the image obtaining section in the reading section; wherein the replaceable component is a single replaceable component or a plurality of replaceable components; The predetermined position of each of the plurality of replaceable components is provided with a logo; and the step of optically reading the pattern is to use a light receiving unit that is commonly provided in a single replaceable component or a plurality of replaceable components, the above-mentioned first information.

在上述製造方法,亦可:準備受光部、導光部與 影像取得部的步驟,具有:在遠離單個可換組件或複數個可換組件的位置,準備影像取得部的步驟;在搬運機構準備受光部的步驟,搬運機構具有將材料供應至可換組件的功能與將物品從可換組件搬出的功能中的至少任一個功能;以及準備導光部的步驟,導光部光學性連接受光部與影像取得部;其中在光學式地讀取上述圖案的步驟,是藉由使搬運機構移動而使受光部移動至既定位置。 In the above manufacturing method, the light receiving unit, the light guiding unit, and The steps of the image acquisition section include: a step of preparing the image acquisition section at a position far from a single replaceable component or a plurality of replaceable components; and a step of preparing the light receiving section of the transfer mechanism, the transfer mechanism includes At least one of a function and a function of carrying an article out of the interchangeable module; and a step of preparing a light guide section, which optically connects the light receiving section and the image acquisition section; wherein the step of optically reading the above pattern Is to move the light receiving unit to a predetermined position by moving the conveying mechanism.

在上述製造方法,亦可:準備受光部、導光部與影像取得部的步驟,具有:在遠離單個可換組件或複數個可換組件的位置,準備影像取得部的步驟;以及準備導光部的步驟,導光部光學性連接受光部與影像取得部。 In the above manufacturing method, the steps of preparing the light receiving section, the light guiding section, and the image obtaining section may include the step of preparing the image obtaining section at a position far from a single replaceable component or a plurality of replaceable components; and preparing the light guide The light guide unit optically connects the light receiving unit and the image acquisition unit.

在上述製造方法,亦可包括準備包含於可換組件的單個模具或複數個模具的步驟。 The manufacturing method described above may include a step of preparing a single mold or a plurality of molds included in the replaceable component.

在上述製造方法,亦可包括:準備包含於可換組件的第一模具、與包含於可換組件且與第一模具相對向的第二模具的步驟;以及控制驅動機構的步驟,驅動機構至少使第一模具與第二模具相對移動。 The manufacturing method may further include the steps of preparing a first mold included in the replaceable component and a second mold included in the replaceable component and facing the first mold; and a step of controlling the driving mechanism, the driving mechanism being at least The first mold is moved relative to the second mold.

在上述製造方法,亦可包括:準備可換組件模組與接收模組的步驟,可換組件模組設有至少可換組件,接收模組上述材料;其中可換組件模組,相對於接收模組為可裝卸;以及可換組件模組,相對於其他的可換組件模組為可裝卸。 The above manufacturing method may also include the steps of preparing a replaceable component module and a receiving module. The replaceable component module is provided with at least a replaceable component and receives the above-mentioned materials of the module; wherein the replaceable component module is opposite to the receiving component. Modules are removable; and replaceable component modules are removable with respect to other replaceable component modules.

在上述製造方法,亦可:在準備標識的步驟,是準備包含藉由電鑄加工形成的圖案之標識。 In the manufacturing method described above, in the step of preparing a mark, a mark including a pattern formed by an electroforming process may be prepared.

在上述製造方法,亦可:在準備標識的步驟,是 準備由被固定於可換組件的另一個組件構成的上述標識。 In the manufacturing method described above, the step of preparing the logo is also Prepare the above-mentioned logo composed of another component fixed to the replaceable component.

根據本發明,在被裝設於物品之製造裝置的設置標識。在標識形成圖案,此圖案顯示含有特定此可換組件的資訊之第一資訊。讀取部讀取圖案,解讀部基於已被讀取的圖案取得第一資訊。判別部比較第一資訊、與預先記憶且包含特定此可換組件的資訊之第二資訊,進行判別。控制部基於判別的結果,可換組件對於第二資訊為適合時,控制製造裝置而使製造裝置動作。控制部基於判別的結果,可換組件對於第二資訊為不適合時,控制製造裝置而使製造裝置顯示以下事項:可換組件對於第二資訊為不適合。因此,起因於用於物品的製造的可換組件不適合第二資訊之不良之發生被抑制。 According to the present invention, a setting mark is provided on a manufacturing apparatus mounted on an article. A pattern is formed on the logo, and this pattern displays the first information containing information specifying the replaceable component. The reading unit reads the pattern, and the reading unit obtains the first information based on the pattern that has been read. The discrimination section compares the first information with the second information that is stored in advance and contains information specifying the replaceable component, and performs discrimination. The control unit controls the manufacturing apparatus to operate the manufacturing apparatus when the replaceable component is suitable for the second information based on the determination result. When the control unit determines that the replaceable component is not suitable for the second information, based on the determination result, the control unit controls the manufacturing device so that the manufacturing device displays the following: the replaceable component is not suitable for the second information. Therefore, the occurrence of defects due to the unsuitability of the replaceable component for the manufacture of the second information is suppressed.

1‧‧‧樹脂密封裝置(製造裝置) 1‧‧‧resin sealing device (manufacturing device)

2‧‧‧固定盤 2‧‧‧Fixed plate

3‧‧‧可動盤 3‧‧‧Movable plate

4‧‧‧固定模具(可換組件) 4‧‧‧Fixed mold (replaceable components)

4a、5c‧‧‧樹脂通路 4a, 5c‧‧‧Resin pathway

4b、5b‧‧‧模穴 4b, 5b‧‧‧

4d、5d‧‧‧凹處 4d, 5d ‧‧‧ recess

5‧‧‧可動模具(可換組件) 5‧‧‧ Movable mold (replaceable components)

5a‧‧‧壺 5a‧‧‧pot

5v‧‧‧通氣孔 5v‧‧‧ Vent

6‧‧‧成形模具(可換組件) 6‧‧‧Forming mold (replaceable components)

7‧‧‧驅動機構 7‧‧‧Drive mechanism

7a‧‧‧來回驅動機構(模具開閉機構) 7a‧‧‧Back and forth drive mechanism (mold opening and closing mechanism)

7b‧‧‧樹脂加壓機構 7b‧‧‧resin pressurizing mechanism

8‧‧‧控制部 8‧‧‧Control Department

9‧‧‧標識(另一組件) 9‧‧‧ Logo (another component)

9a‧‧‧資訊形成面 9a‧‧‧ Information Formation

9b‧‧‧黏著劑 9b‧‧‧ Adhesive

9c‧‧‧剝離紙 9c‧‧‧ peeling paper

10‧‧‧資訊讀取工具(資訊讀取部) 10‧‧‧Information Reading Tool (Information Reading Department)

10a‧‧‧雷射二極體 10a‧‧‧laser diode

10b‧‧‧雷射光 10b‧‧‧laser light

10c‧‧‧來回振動鏡 10c‧‧‧Back and forth vibrating mirror

10d‧‧‧反射光 10d‧‧‧Reflected light

10e‧‧‧光學二極體 10e‧‧‧Optical Diode

20‧‧‧電鑄加工槽 20‧‧‧Electroforming processing tank

21‧‧‧電解浴 21‧‧‧ electrolytic bath

22‧‧‧金屬 22‧‧‧ Metal

23‧‧‧母模 23‧‧‧Female

24‧‧‧電鑄品(標識、另一組件) 24‧‧‧Electrocasting (logo, another component)

30‧‧‧滾珠螺桿 30‧‧‧ball screw

31‧‧‧滾珠螺帽 31‧‧‧ball nut

32‧‧‧主搬運機構(搬運機構) 32‧‧‧ main handling mechanism (handling mechanism)

33‧‧‧X方向導軌 33‧‧‧X direction guide

34‧‧‧Y方向導軌 34‧‧‧Y-direction guide

35‧‧‧副搬運機構(搬運機構) 35‧‧‧Deputy transfer mechanism (transfer mechanism)

36‧‧‧受光部 36‧‧‧Light receiving section

37‧‧‧凸透鏡 37‧‧‧ convex lens

38‧‧‧反射鏡 38‧‧‧Reflector

39‧‧‧照明 39‧‧‧lighting

40‧‧‧影像感應器 40‧‧‧Image sensor

41‧‧‧影像取得部 41‧‧‧Image Acquisition Department

42‧‧‧纜線 42‧‧‧cable

43‧‧‧相機控制器 43‧‧‧ Camera Controller

44‧‧‧模穴區塊(可換組件) 44‧‧‧Mould block block (replaceable components)

45、46‧‧‧導光部 45, 46‧‧‧ Light guide

50‧‧‧電源 50‧‧‧ Power

51‧‧‧基板材料接收部 51‧‧‧ Substrate Material Receiving Department

52‧‧‧樹脂材料接收部 52‧‧‧Resin material receiving department

53‧‧‧材料移送機構 53‧‧‧Material Transfer Agency

54‧‧‧裝設後基板 54‧‧‧ after installation

55‧‧‧密封後基板 55‧‧‧sealed substrate

56‧‧‧成形品移送機構 56‧‧‧formed product transfer mechanism

57‧‧‧匣 57‧‧‧box

58‧‧‧真空泵 58‧‧‧Vacuum pump

A‧‧‧材料接收模組 A‧‧‧Material receiving module

B‧‧‧繳出模組 B‧‧‧Delivery Module

CAV‧‧‧模穴 CAV‧‧‧Mould Cavity

DE‧‧‧解讀部 DE‧‧‧Interpretation Department

J‧‧‧判別部 J‧‧‧Discrimination Department

La‧‧‧導光部(光導) La‧‧‧light guide (light guide)

Lb‧‧‧凸透鏡 Lb‧‧‧ convex lens

Lc‧‧‧導光部 Lc‧‧‧light guide

Ld‧‧‧影像感應器 Ld‧‧‧Image Sensor

Le‧‧‧纜線 Le‧‧‧cable

M‧‧‧成形模組 M‧‧‧forming module

ME‧‧‧記憶部 ME‧‧‧Memory Department

R‧‧‧樹脂材料 R‧‧‧ resin material

S1~S11‧‧‧步驟 S1 ~ S11‧‧‧step

【第1A圖】是本發明的實施例相關之樹脂密封裝置所具有的成形模組的示意正面圖。 FIG. 1A is a schematic front view of a molding module included in a resin sealing device according to an embodiment of the present invention.

【第1B圖】是成形模具所具有的固定模具及可動模具的展開斜視圖。 FIG. 1B is a development perspective view of a fixed mold and a movable mold included in the molding mold.

【第2A圖】是在第1A圖所示成形模組的示意側面圖。 FIG. 2A is a schematic side view of the molding module shown in FIG. 1A.

【第2B圖】是將成形模具的重點部分放大顯示的側面圖。 FIG. 2B is a side view showing an enlarged view of an important part of a molding die.

【第3圖】是光學式地讀取圖案的讀取部的說明圖。 FIG. 3 is an explanatory diagram of a reading section that optically reads a pattern.

【第4A圖】是顯示製作標識的步驟之圖,為針對電鑄加工步驟的說明圖。 FIG. 4A is a diagram showing a step of making a logo, and is an explanatory diagram for the steps of electroforming processing.

【第4B圖】是顯示製作標識的步驟之圖,為針對電鑄加 工步驟的說明圖。 [Figure 4B] is a diagram showing the steps of making a logo, An illustration of the process.

【第4C圖】是顯示製作標識的步驟之圖,為針對隔著黏著劑使剝離紙一體化於標識的背面的步驟的說明圖。 FIG. 4C is a diagram showing a step of making a mark, and is an explanatory diagram of a step of integrating a release paper on the back surface of the mark with an adhesive therebetween.

【第4D圖】是顯示製作標識的步驟之圖,為針對隔著黏著劑使剝離紙一體化於標識的背面的步驟的說明圖。 [FIG. 4D] A diagram showing a step of making a mark, and is an explanatory diagram of a step of integrating a release paper on the back surface of the mark through an adhesive.

【第5圖】是流程圖,顯示關於成形模具為適合品與否的判別的順序。 FIG. 5 is a flowchart showing a procedure for determining whether a molding die is suitable or not.

【第6圖】是部分側面圖,顯示讀取部周邊的構成。 Fig. 6 is a partial side view showing the configuration around the reading section.

【第7圖】是平面圖,顯示本發明的實施例相關的製造裝置的概要。 FIG. 7 is a plan view showing an outline of a manufacturing apparatus according to an embodiment of the present invention.

以下,參照圖式,敘述本發明的實施例。關於在本申請文件的所有圖式,均為了容易理解,會作適當地省略或誇張而作示意性地繪示。對相同的元件賦予相同的元件符號,適當地省略說明。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. All the drawings in this application document are easy to understand and will be omitted or exaggerated for schematic illustration. The same elements are assigned the same element symbols, and descriptions thereof are appropriately omitted.

[實施例1] [Example 1]

基於第1A、1B圖及第2A、2B圖,敘述本發明相關的物品之製造裝置及製造方法的實施例1。針對電子零件的樹脂密封裝置,作為物品之製造裝置的例子敘述。電子零件的樹脂密封裝置,是進行藉由密封樹脂覆蓋已裝設於基板(導線架、印刷基板等)之上的半導體晶片等的片狀元件的步驟。在已裝設有片狀元件的基板(裝設後基板),藉由使用成形模具將密封樹脂成形,完成相當於成形品的密封後基板。有些情況,密封後基板是相當於物品(完成品)。有些情況,將密封後基板 裁切(分割)後的各個單片是相當於物品(完成品),在此情況,密封後基板是半成品。在本申請文件,「製品」之類的詞彙是包含半成品。 Embodiment 1 of the manufacturing apparatus and manufacturing method of the article concerning this invention is described based on FIGS. 1A and 1B and FIGS. 2A and 2B. A resin sealing device for electronic parts will be described as an example of an article manufacturing device. The resin sealing device for electronic parts is a step of covering a chip-like element such as a semiconductor wafer mounted on a substrate (a lead frame, a printed circuit board, or the like) with a sealing resin. On the substrate (post-installed substrate) on which the sheet-like element has been mounted, the sealing resin is molded by using a molding die to complete a post-sealed substrate equivalent to a molded product. In some cases, the substrate after sealing is equivalent to an article (finished product). In some cases, the back substrate will be sealed Each single piece after cutting (division) is equivalent to an article (finished product). In this case, the substrate after sealing is a semi-finished product. In this application, terms such as "product" include semi-finished products.

如第1A、1B圖所示,電子零件的樹脂密封裝置1,包括一個或複數個成形模組M。包括複數個成形模組M時,可將其沿著X方向排列且相互連結。如後文敘述,複數個成形模組M可相互裝設,並可在事後分離。 As shown in FIGS. 1A and 1B, the resin sealing device 1 for electronic parts includes one or a plurality of forming modules M. When a plurality of forming modules M are included, they can be arranged along the X direction and connected to each other. As described later, the plurality of forming modules M can be installed on each other and can be separated afterwards.

成形模組M具有固定盤2與可動盤3,固定盤2被固定於本體,可動盤3被對向於固定盤2而配置,並被設置為可對固定盤2接觸、離開。樹脂密封裝置1至少包括固定模具(上模具)4與可動模具(下模具)5,固定模具4是被裝設為對固定盤2可自由裝卸(可替換的樣態),可動模具5是被裝設為對可動盤3可自由裝卸。固定模具4與可動模具5是一起構成成形模具(樹脂密封模具)6。成形模具6是按照所製造的製品而被替換的組件(以下適當地稱為「可換組件」)。樹脂密封裝置1包括用於控制樹脂密封裝置1中的驅動機構7的動作的控制部8,驅動機構7包含例如可動盤3的來回驅動機構(模具開閉機構)7a與樹脂加壓機構7b。 The molding module M includes a fixed plate 2 and a movable plate 3. The fixed plate 2 is fixed to the main body. The movable plate 3 is disposed opposite to the fixed plate 2 and is provided to be able to contact and leave the fixed plate 2. The resin sealing device 1 includes at least a fixed mold (upper mold) 4 and a movable mold (lower mold) 5. The fixed mold 4 is configured to be freely attachable and detachable to the fixed disk 2 (replaceable form), and the movable mold 5 is The movable plate 3 is detachably mounted. The fixed mold 4 and the movable mold 5 together form a molding mold (resin-sealed mold) 6. The molding die 6 is a component (hereinafter referred to as a “replaceable component” as appropriate) that is replaced in accordance with the manufactured product. The resin sealing device 1 includes a control unit 8 for controlling the operation of the driving mechanism 7 in the resin sealing device 1. The driving mechanism 7 includes, for example, a back-and-forth driving mechanism (mold opening and closing mechanism) 7 a and a resin pressing mechanism 7 b of the movable disk 3.

在成形模具6的既定位置,是被標識9黏貼。在標識9具有的資訊形成面9a,藉由凹凸等形成有微細圖案,微細圖案顯示至少含有特定成形模具6的資訊之第一資訊。微細圖案是藉由例如條碼、二維條碼等構成。 The predetermined position of the forming die 6 is adhered by the mark 9. A fine pattern is formed on the information formation surface 9a of the mark 9 by unevenness, etc., and the fine pattern displays first information including at least information of the specific molding die 6. The fine pattern is constituted by, for example, a bar code, a two-dimensional bar code, and the like.

在特定成形模具6的資訊,包含成形模具6的製造者、供應者、勞務的提供者等的資訊、成形模具6的模具號 碼及製造編號、藉由此成形模具6成形的成形品(密封後基板)的機種(產品種類)、顯示此成形模具6為適合品的適合品資訊。「適合品」這樣的詞彙,是意指關於此成形模具6為原本應使用的成形模具,具體而言,至少有以下二個意思。「適合品」這樣的詞彙,第一,是意指:此成形模具6是對於欲製造的製品為適合的成形模具,為品質受到保證的成形模具。「適合品」這樣的詞彙,第二,是意指:此成形模具6是由正當的製造者或供應者提供的成形模具。 The information on the specific mold 6 includes information on the manufacturer, supplier, and service provider of the mold 6 and the mold number of the mold 6. Code and manufacturing number, model (product type) of the molded product (sealed substrate) formed by the molding die 6, and information on the applicable product indicating that the molding die 6 is a suitable product. The term "suitable product" means that the forming die 6 is a forming die that should be used originally, and specifically has at least the following two meanings. The term "suitable product" means, first, that the forming mold 6 is a forming mold suitable for a product to be manufactured, and a forming mold whose quality is guaranteed. The term "suitable product" means, secondly, that the forming mold 6 is a forming mold provided by a legitimate manufacturer or supplier.

如第2A、2B圖所示,在樹脂密封裝置1,在成形模具6中的既定位置的對應位置,設有資訊讀取工具(資訊讀取部)10,資訊讀取工具10用以讀取形成在被黏貼於成形模具6的標識9的資訊形成面9a的微細圖案。 As shown in FIGS. 2A and 2B, in the resin sealing device 1, an information reading tool (information reading section) 10 is provided at a corresponding position in a predetermined position in the molding die 6. A fine pattern formed on the information formation surface 9a of the logo 9 adhered to the molding die 6.

如第1A圖所示,在控制部8設有解讀部DE與記憶部ME,解讀部DE基於被資訊讀取工具10讀取之形成於資訊形成面9a的微細圖案而取得第一資訊,記憶部ME預先記憶特定成形模具6的資訊(第二資訊)。在控制部8,設有判別部J,判別部J比較已獲得的第一資訊與已預先被記憶的第二資訊,進行關於成形模具6對於第二資訊適合與否的判別。控制部8是基於判別的結果,控制包含驅動機構7的動作之樹脂密封裝置1的動作。 As shown in FIG. 1A, the control unit 8 is provided with a reading unit DE and a memory unit ME. The reading unit DE obtains the first information based on the fine pattern formed on the information forming surface 9a read by the information reading tool 10 and stores the first information. The part ME previously memorizes information (second information) of the specific molding die 6. The control unit 8 is provided with a judging unit J. The judging unit J compares the obtained first information with the second information that has been memorized in advance, and judges whether the molding die 6 is suitable for the second information. The control unit 8 controls the operation of the resin sealing device 1 including the operation of the drive mechanism 7 based on the result of the determination.

如第1B圖所示,在構成成形模具6的可動模具5,設置壺5a、可動模具5之側(以下稱為「可動側」)的模穴5b、連接於可動側的模穴5b之可動側的樹脂通路5c、與通氣孔5v,樹脂材料是供應至壺5a。在固定模具4,設置固定模具4 之側(以下稱為「固定側」)的樹脂通路4a與固定側的模穴4b。 As shown in FIG. 1B, the movable mold 5 constituting the forming mold 6 is provided with a pot 5a, a cavity 5b on the side of the movable mold 5 (hereinafter referred to as "movable side"), and a movable cavity 5b connected to the movable side. On the side of the resin passage 5c and the vent hole 5v, a resin material is supplied to the pot 5a. In the fixed mold 4, set the fixed mold 4 The resin passage 4a on the side (hereinafter referred to as the "fixed side") and the cavity 4b on the fixed side.

可動模具5與固定模具4,是藉由模具開閉機構7a而被鎖模。可動模具5與固定模具4在被鎖模的狀態,相對向的可動模具5的模具面(在第1A圖的上表面)與固定模具4的模具面(在第1A圖的下表面)為密接。在此狀態,可動模具5的壺5a與固定側的樹脂通路(淘汰部)4a連通,而且固定側的樹脂通路4a與可動側的樹脂通路5c連通。此外,可動模具5的壺5a是依序經由樹脂通路4a與樹脂通路5c,連通於固定側的模穴4b與可動側的模穴5b。 The movable mold 5 and the fixed mold 4 are clamped by a mold opening and closing mechanism 7a. In a state where the movable mold 5 and the fixed mold 4 are clamped, the mold surface (on the upper surface in FIG. 1A) of the movable mold 5 that is opposite to the mold surface (on the lower surface in FIG. 1A) of the fixed mold 4 is in close contact . In this state, the pot 5a of the movable mold 5 communicates with the resin passage (elimination section) 4a on the fixed side, and the resin passage 4a on the fixed side communicates with the resin passage 5c on the movable side. In addition, the pot 5a of the movable mold 5 communicates with the fixed cavity 4b and the movable cavity 5b via the resin passage 4a and the resin passage 5c in this order.

在樹脂成形時,在固定側的模穴4b與可動側的模穴5b的內部,充填熔融樹脂等的流動性樹脂。殘留於模穴4b與模穴5b的內部之氣體,伴隨著流動性樹脂的充填而通過通氣孔5v排出至成形模具6外部。 During resin molding, the inside of the cavity 4b on the fixed side and the cavity 5b on the movable side are filled with a fluid resin such as a molten resin. The gas remaining inside the cavity 4b and the cavity 5b is discharged to the outside of the molding die 6 through the vent hole 5v along with the filling of the fluid resin.

如第2A圖所示,資訊讀取工具10,是分別配置於樹脂密封裝置1的本體,對應於在固定模具4及可動模具5分別裝設有標識9的位置。因此’各資訊讀取工具10’可以從在被分別裝設於固定盤2及可動盤3的固定模具4及可動模具5所黏貼的各標識9的資訊形成面9a,分別讀取微細圖案。 As shown in FIG. 2A, the information reading tools 10 are respectively disposed on the main body of the resin sealing device 1, and correspond to positions where the marks 9 are respectively mounted on the fixed mold 4 and the movable mold 5. Therefore, 'each information reading tool 10' can read a fine pattern from the information forming surface 9a of each mark 9 pasted on the fixed mold 4 and the movable mold 5 respectively mounted on the fixed plate 2 and the movable plate 3.

如第2B圖所示,顯示資訊形成面9a的影像的光,經由導光部(光導)La、凸透鏡(集光透鏡)Lb與導光部Lc,進入影像感應器Ld。影像感應器Ld是例如CCD感應器、CMOS感應器等。藉由影像感應器Ld,相當於資訊形成面9a的影像的光,被轉換成電性訊號。由顯示資訊形成面9a的影像的電性訊號構成的影像資料,經由纜線Le而被送到控制部8(請參 考第1A圖、第1B圖)。作為資訊讀取工具10,亦可配置具有影像感應器的數位相機,取代凸透鏡Lb、導光部Lc及影像感應器Ld之組合。以此數位相機具有耐熱性為佳。 As shown in FIG. 2B, the light of the image on the display information forming surface 9 a enters the image sensor Ld through the light guide section (light guide) La, the convex lens (light collecting lens) Lb, and the light guide section Lc. The image sensor Ld is, for example, a CCD sensor, a CMOS sensor, or the like. With the image sensor Ld, light equivalent to the image of the information forming surface 9a is converted into an electrical signal. The image data composed of the electrical signals of the image on the display information forming surface 9a is sent to the control unit 8 via the cable Le (see also Consider Figures 1A and 1B). As the information reading tool 10, a digital camera having an image sensor may be arranged instead of the combination of the convex lens Lb, the light guide portion Lc, and the image sensor Ld. With this, the digital camera has better heat resistance.

由固定模具4及可動模具5構成的成形模具6,構成一組模具單元。因此,亦可藉由在固定模具4與可動模具5的任一者黏貼標識9等方法而固定。在此情況,對應於在成形模具6之黏貼有標識9之側,先將資訊讀取工具10配置於在樹脂密封裝置1的固定模具4與可動模具5的任一者之側即可。在以下的敘述,是以在固定模具4黏貼有標識9的情況為對象。 The forming mold 6 composed of the fixed mold 4 and the movable mold 5 constitutes a set of mold units. Therefore, it may be fixed by a method such as pasting the logo 9 on either of the fixed mold 4 and the movable mold 5. In this case, the information reading tool 10 may be disposed on either of the fixed mold 4 and the movable mold 5 of the resin sealing device 1 corresponding to the side on which the mark 9 is pasted on the forming mold 6. The following description is directed to a case where the logo 9 is stuck to the fixed mold 4.

如第3圖所示,在成形模具6(固定模具4與可動模具5中的至少一個)被標識黏貼的面,設置標識黏貼用的凹處4d,使其成為比即將被黏貼於此面而一體化的標識9的厚度還深。因此,如後文所述,藉由將標識9黏貼於凹處4d的內底面而一體化,可以防止此標識9的資訊形成面9a與其他的構成組件等接觸而使資訊形成面9a變形、破損等的缺陷。 As shown in FIG. 3, a recess 4d for labeling is provided on the surface to which the mold 6 (at least one of the fixed mold 4 and the movable mold 5) is pasted, so that it is more than the surface to be pasted on the surface. The thickness of the integrated logo 9 is still deep. Therefore, as described later, by integrating the logo 9 on the inner bottom surface of the recess 4d, the information formation surface 9a of the logo 9 can be prevented from contacting other constituent components and the information formation surface 9a can be deformed, Defects such as breakage.

以下,敘述在第一資訊為適合品資訊時,控制部8控制樹脂密封裝置1的內容。如後文所述,控制部8是基於藉由判別部J獲得的「適合品與否」的判別結果,將成為判別的對象之成形模具6為適合品與否的資訊,在樹脂密封裝置1顯示。具體而言,在成形模具6為適合品時,在顯示螢幕顯示其主旨。此外,以包含此成形模具6的成形模組M轉變為可動作的狀態為佳。在成形模具6不是適合品時,在顯示螢幕顯示其主旨之後,藉由警告燈的點燈、熄滅、警告音之產生等的方法,對作業員發布警告。亦可使此成形模組M轉變為:此成 形模組M成為不可動作的狀態(例如:電源為ON但無法受理動作開始訊號的狀態、電源成為OFF的狀態等)。 In the following, the content of the resin sealing device 1 is controlled by the control unit 8 when the first information is suitable product information. As will be described later, the control unit 8 is based on the determination result of "suitable product" obtained by the determination unit J, and uses the information on whether or not the forming mold 6 that is the object of the determination is a suitable product in the resin sealing device 1 display. Specifically, when the molding die 6 is a suitable product, its purpose is displayed on a display screen. In addition, it is preferable that the forming module M including the forming mold 6 is in a state in which it can be operated. When the molding die 6 is not a suitable product, after the purpose is displayed on the display screen, a warning is issued to the operator by means of turning on, turning off, and generating a warning sound. This forming module M can also be transformed into: The module M is in an inoperable state (for example, a state in which the power is turned on but the operation start signal cannot be received, and a state in which the power is turned off).

在將固定模具4及可動模具5各自分割成複數個而構成之所謂的分割模具的情況(未圖示),在例如最重要的部分且可被替換的模穴區塊黏貼標識9。在此情況,可以防止關於在樹脂成形最重要的組成元件且為可換組件的模穴區塊的誤換裝、不適合品的裝設等。 When a fixed mold 4 and a movable mold 5 are each divided into a plurality of so-called divided molds (not shown), for example, the logo 9 is affixed to the most important part and a replaceable cavity block. In this case, it is possible to prevent erroneous replacement of the cavity block which is the most important constituent element of the resin molding and is a replaceable component, installation of unsuitable products, and the like.

第3圖是例示雷射式之所謂的非接觸式代碼讀取感應器作為資訊讀取工具10。資訊讀取工具10是藉由使來回振動鏡(掃描鏡)10c來回運動,使從雷射二極體10a發光的雷射光10b反射。藉此,藉由在來回振動鏡10c反射後的雷射光10b,掃描形成於標識9的資訊形成面9a。藉由光學二極體10e接收雷射光10b在資訊形成面9a反射而成的反射光10d。藉此,光學式地讀取已被形成於資訊形成面9a的微細圖案。 FIG. 3 illustrates a so-called non-contact code reading sensor of a laser type as the information reading tool 10. The information reading tool 10 reflects the laser light 10b emitted from the laser diode 10a by moving the vibrating mirror (scanning mirror) 10c back and forth. Thereby, the information forming surface 9a formed on the mark 9 is scanned by the laser light 10b reflected by the vibrating mirror 10c. The optical diode 10e receives the reflected light 10d which is reflected by the laser light 10b on the information forming surface 9a. Thereby, the fine pattern already formed on the information formation surface 9a is optically read.

如第4A~4D圖所示,在標識9的資訊形成面9a之側(正面側),藉由電鑄(電鑄加工)形成高精度的微細圖案。在標識9的背面側隔著黏著劑9b黏貼有剝離紙9c。在將剝離紙9c剝離後的狀態,隔著黏著劑9b將標識9的背面側黏著並一體化於成形模具6的標識黏貼面中的標識黏貼用的凹處4d(5d)的內底面(請參照第3圖)。 As shown in FIGS. 4A to 4D, on the side (front side) of the information formation surface 9a of the mark 9, a high-precision fine pattern is formed by electroforming (electroforming processing). A release paper 9c is stuck on the back side of the mark 9 with an adhesive 9b interposed therebetween. In a state where the release paper 9c is peeled off, the back side of the logo 9 is adhered through the adhesive 9b and integrated with the inner bottom surface of the recess 4d (5d) for logo pasting in the logo pasting surface of the forming mold 6 (please (See Figure 3).

標識9是藉由電鑄加工,被形成為薄形的片狀。標識9具有以下二個目的。第一目的是避免把不適合品判別為適合品(誤判)。第二目的是將標識9從在成形模具6(固定模具4及可動模具5)的標識黏貼面(標識黏貼用凹處4d‧5d的內底 面)剝離,可以避免將已被剝離的標識9黏貼於其他的不適合品等而再使用。因此,標識9的厚度,是被設定為同時滿足以下的二個條件的程度的厚度(換言之,必要且充分的薄度)。第一,在黏貼至適合品時,可以維持標識9的堅實度(firmness)、與讀取被形成於資訊形成面9a的微細圖案(所顯示的資訊)時的高精度及確實性之厚度。第二,在如將原本黏貼於標識黏貼面4d(5d)的標識9剝離的情況,至少使資訊形成面9a受損的程度之厚度。 The logo 9 is formed into a thin sheet shape by electroforming. The logo 9 has the following two purposes. The first purpose is to avoid identifying unsuitable products as suitable products (misjudgment). The second purpose is to remove the logo 9 from the logo pasting surface (inner bottom of the logo pasting recess 4d‧5d on the forming mold 6 (fixed mold 4 and movable mold 5)). (Face) peeling, it is possible to avoid re-use of the peeled mark 9 on other unsuitable products. Therefore, the thickness of the mark 9 is a thickness (in other words, a necessary and sufficient thickness) set to such an extent that the following two conditions are simultaneously satisfied. First, it is possible to maintain the firmness of the logo 9 and the thickness with high accuracy and reliability when reading a fine pattern (displayed information) formed on the information formation surface 9a when pasted to a suitable product. Secondly, if the logo 9 originally affixed to the logo sticking surface 4d (5d) is peeled off, the thickness of at least the information forming surface 9a is damaged.

包括上述二個條件的標識9(電鑄製品)的厚度,例如在電鑄為面轉印的情況,可以是0.05~0.1μm的厚度。在此厚度,可高精度地製作顯示資訊的微細圖案。在製作具有含立體形狀(三維形狀)的資訊形成面9a的標識9的情況,亦是可藉由一般的電鑄加工來製作包括上述二個條件的厚度的電鑄製品。 The thickness of the mark 9 (electroformed product) including the above two conditions may be, for example, a thickness of 0.05 to 0.1 μm in the case of electroforming for surface transfer. With this thickness, fine patterns for displaying information can be produced with high accuracy. When the logo 9 having a three-dimensional shape (three-dimensional shape) including the information forming surface 9a is produced, an electroformed product having a thickness including the above two conditions can be produced by general electroforming processing.

基於第4A~4D圖,針對製作標識9的情況作敘述。第4A圖及第4B圖是簡略地顯示電鑄加工步驟,而第4C圖及第4D圖是簡略地顯示隔著黏著劑使剝離紙一體化於標識9的背面的步驟。 Based on FIGS. 4A to 4D, the case of making the logo 9 will be described. 4A and 4B are diagrams showing the steps of the electroforming process briefly, and FIGS. 4C and 4D are diagrams showing the steps of integrating the release paper on the back surface of the mark 9 through an adhesive.

如第4A圖所示,在電鑄加工步驟,在電鑄加工槽20內的電解浴21中,從外部將固定的電壓施加於金屬(鎳陽極)22與母模(陰極)23之間。藉此,在陽極引起金屬的離子化,在母模23發生金屬的還原造成的電沈積。示於第4A~4D圖的電沈積是藉由鎳而成。藉由電沈積後的鎳而構成的電鑄品24是被作為標識9的本體而使用。母模23是以藉由橢圓振動切削加工等的精密加工而製作為佳。 As shown in FIG. 4A, in the electroforming process step, a fixed voltage is applied from the outside to the metal (nickel anode) 22 and the female mold (cathode) 23 in the electrolytic bath 21 in the electroforming processing tank 20. As a result, metal ionization occurs at the anode, and electrodeposition due to metal reduction occurs at the master mold 23. The electrodepositions shown in Figures 4A to 4D are made of nickel. An electroformed article 24 made of electrodeposited nickel is used as the body of the logo 9. The master mold 23 is preferably produced by precision machining such as elliptical vibration cutting.

接下來,如第4B圖所示,將已電沈積於母模23的電鑄品24從母模23剝離。在電鑄品24,藉由反轉已形成於母模23的高精度的形狀等,形成有微細圖案。由已在電鑄品24形成的高精度的形狀構成的微細圖案,是被作為在標識9的資訊形成面9a表示特定成形模具6的資訊的微細圖案而使用。 Next, as shown in FIG. 4B, the electroformed product 24 which has been electrodeposited on the master mold 23 is peeled from the master mold 23. In the electroformed product 24, a fine pattern is formed by inverting a high-precision shape or the like already formed on the master mold 23. A fine pattern composed of a high-precision shape that has been formed on the electroformed product 24 is used as a fine pattern that displays information of a specific molding die 6 on the information formation surface 9 a of the mark 9.

接下來,如第4C圖所示,在電鑄品24的背面(在資訊形成面9a的相反側之面)黏貼已附著剝離紙9c的黏著劑9b。藉此,製作附黏著劑9b的標識9。 Next, as shown in FIG. 4C, the adhesive 9 b to which the release paper 9 c is attached is adhered to the back surface of the electroformed product 24 (the surface opposite to the information formation surface 9 a). Thereby, the mark 9 with the adhesive agent 9b was produced.

接下來,如第4D圖所示,從標識9剝下剝離紙9c。將標識9的背面隔著黏著劑9b黏貼於成形模具6的標識黏貼面中的標識黏貼用的凹處4d(5d)的內底面。其結果,可以使成形模具6的凹處4d(5d)的內底面與標識9一體化。 Next, as shown in FIG. 4D, the release paper 9 c is peeled from the mark 9. The back surface of the logo 9 is pasted to the inner bottom surface of the recess 4d (5d) for logo pasting in the logo pasting surface of the forming mold 6 via the adhesive 9b. As a result, the inner bottom surface of the recess 4d (5d) of the molding die 6 and the mark 9 can be integrated.

黏著劑9b及剝離紙9c,是在剝下剝離紙9c的狀態,用於隔著黏著劑9b而將標識9的背面黏貼並使其一體化於成形模具6的標識黏貼面中的標識黏貼用的凹處4d(5d)的內底面。在對於凹處4d(5d)的內底面直接黏貼電鑄品24(標識9的本體)的情況,亦可預先將雙面黏著膠帶黏貼於凹處4d(5d)的內底面,取代黏著劑9b及剝離紙9c。 The adhesive 9b and the release paper 9c are in a state where the release paper 9c is peeled off, and are used for pasting the logo 9 through the adhesive 9b and integrating the back of the logo 9 into the logo pasting surface of the forming mold 6. The inner bottom surface of the recess 4d (5d). In the case where the inner bottom surface of the recess 4d (5d) is directly adhered to the electroformed product 24 (the body of the logo 9), a double-sided adhesive tape may be pasted to the inner bottom surface of the recess 4d (5d) in advance, instead of the adhesive 9b. And release paper 9c.

顯示適合品資訊的微細圖案所形成的標識9,第一,是意指:此成形模具6是對於欲製造的製品為適合的成形模具,為品質受到保證的成形模具。顯示適合品資訊的微細圖案所形成的標識9,第二,是意指:此成形模具6是由例如樹脂密封裝置的正規的製作者、正規的模具製作者或是關於正規的樹脂密封裝置或正規的模具的勞務的供應者等(以下稱為 「適合品提供者」)提供的成形模具。在標識9,形成有顯示特定模具的資訊的微細圖案的資訊形成面9a,是被高精度地形成,而可以對於未被附上標識的不適合品、由適合品提供者以外的人作成的標識等作區別。 The logo 9 formed by the fine pattern displaying suitable product information firstly means that the forming mold 6 is a forming mold suitable for a product to be manufactured, and a forming mold of which quality is guaranteed. The logo 9 formed by displaying a fine pattern suitable for product information, secondly, means that the forming mold 6 is, for example, a regular maker of a resin sealing device, a regular mold maker, or an official resin sealing device or Suppliers of regular mold services (hereinafter referred to as "Suitable product supplier"). On the mark 9, an information forming surface 9a having a fine pattern showing information of a specific mold is formed with high accuracy, and a mark made by a person other than the supplier of the unsuitable product without the mark may be provided with the mark And so on.

在資訊形成面9a,是形成例如條碼、二維條碼等。在這些以外或是用以取代這些,在資訊形成面9a亦可形成由被適合品提供者任意訂定的文字、文字列、記號、形狀、立體的形狀或上述之組合、難以模仿的特殊影像、全像圖(hologram)、其他高精度記號等構成的微細圖案。基於已被形成於資訊形成面9a的微細圖案,讀取特定成形模具6的資訊。已被形成於資訊形成面9a的微細圖案是以難以模仿的圖案為佳。已被形成於資訊形成面9a的微細圖案,亦可包含顯示適合品提供者的微細圖案且具有顯示勞務的出處的功能的記號等的標章、商標(包含註冊商標)、商標標誌(logotype)。 On the information formation surface 9a, for example, a barcode, a two-dimensional barcode, and the like are formed. In addition to or in place of these, the information forming surface 9a can also form a special image arbitrarily set by the supplier of the suitable product, a character string, a symbol, a shape, a three-dimensional shape, or a combination of the above, which is difficult to imitate. , Hologram, other high-precision marks and other fine patterns. Based on the fine pattern formed on the information formation surface 9a, the information of the specific molding die 6 is read. The fine pattern already formed on the information formation surface 9a is preferably a pattern that is difficult to imitate. The fine pattern that has been formed on the information forming surface 9a may include a seal, a trademark (including a registered trademark), and a trademark type (logotype) showing a fine pattern suitable for the supplier of the product and a mark showing the source of the labor service. .

以下,請參考第1A~3圖與示於第5圖的流程圖,敘述特定成形模具6(請參考第1A圖、第1B圖、第2A圖、第2B圖)並判斷此成形模具6為適合品與否的步驟。首先,在第5圖如步驟S1所示,在樹脂密封裝置1的電源已被投入的狀態,對固定盤2裝設固定模具4,對可動盤3裝設可動模具5。在此步驟之固定模具4與可動模具5的裝設,只要可以讀取已被形成於標識9的資訊形成面9a的微細圖案,亦可為暫時設置(暫時固定)。 In the following, please refer to FIGS. 1A to 3 and the flowchart shown in FIG. 5 to describe the specific forming mold 6 (please refer to FIGS. 1A, 1B, 2A, and 2B) and determine whether the forming mold 6 is Steps to fit or not. First, in FIG. 5, as shown in step S1, in a state where the power supply of the resin sealing device 1 is turned on, a fixed mold 4 is mounted on the fixed disk 2, and a movable mold 5 is mounted on the movable disk 3. The installation of the fixed mold 4 and the movable mold 5 at this step may be temporarily set (temporarily fixed) as long as the fine pattern that has been formed on the information formation surface 9a of the mark 9 can be read.

接下來,如步驟S2所示,使用資訊讀取工具10,讀取已被形成於分別被黏貼在已被裝設於固定模具4及可動模 具5的標識9的資訊形成面9a的微細圖案。 Next, as shown in step S2, using the information reading tool 10, reading has been formed on each of the fixed mold 4 and the movable mold which have been pasted and pasted. The information with the logo 9 of 5 forms a fine pattern of the surface 9a.

接下來,如步驟S3所示,控制部8從已被形成於資訊形成面9a的微細圖案取得第一資訊。例如,在微細圖案為二維條碼時,解讀此二維條碼。 Next, as shown in step S3, the control unit 8 obtains the first information from the fine pattern already formed on the information formation surface 9a. For example, when the fine pattern is a two-dimensional barcode, interpret the two-dimensional barcode.

接下來,如步驟S4所示,控制部8讀出包含特定成形模具6的資訊的第二資訊(已被預先記憶的資訊)。第二資訊是被預先記憶於樹脂密封裝置1的控制部8所具有的記憶部ME。 Next, as shown in step S4, the control unit 8 reads out the second information (information that has been stored in advance) including the information of the specific molding die 6. The second information is stored in the memory unit ME included in the control unit 8 of the resin sealing device 1 in advance.

接下來,如步驟S5所示,在控制部8的判別部J,比較從已被形成於標識9的資訊形成面9a的微細圖案獲得的第一資訊、與已被預先記憶的第二資訊所含之特定成形模具6的資訊。判別部J基於比較後的結果,判別「固定模具4是否為「適合品」」的事項與「可動模具5是否為「適合品」」的事項。 Next, as shown in step S5, the determination section J of the control section 8 compares the first information obtained from the fine pattern already formed on the information formation surface 9a of the marker 9 with the second information store that has been previously stored. Contains information on specific forming dies 6. The determination unit J determines, based on the result of the comparison, an item "whether the fixed mold 4 is a" suitable product "" and an item "whether the movable mold 5 is a" suitable product ".

以下,敘述在比較後的結果為「固定模具4及可動模具5各自為適合品」的情況(第一情況)的處理。接著步驟S5,如步驟S6所示,判別部J生成顯示「固定模具4為「適合品」」的適合訊號與顯示「可動模具5為「適合品」」的適合訊號。 Hereinafter, the processing in the case where the comparison result is "each of the fixed mold 4 and the movable mold 5 is a suitable product" (the first case) will be described. Following step S5, as shown in step S6, the discriminating unit J generates a suitable signal indicating "the fixed mold 4 is a" suitable product "and a suitable signal indicating" movable mold 5 is a "suitable product".

接下來,如步驟S7所示,控制部8基於接收的適合訊號,在樹脂密封裝置1的控制部8的顯示部(觸控面板等;未圖示),顯示「固定模具4為「適合品」」的事項與「可動模具5為「適合品」」的事項。控制部8亦可一並將警告燈以顯示樹脂密封裝置1為可動作的狀態之樣態(例如將綠色的光連續點亮的樣態)點亮。控制部8亦可一並藉由「可動作」等的聲音顯示樹脂密封裝置1為可動作的狀態。 Next, as shown in step S7, the control unit 8 displays "the fixed mold 4 is" suitable product "on the display unit (touch panel, etc .; not shown) of the control unit 8 of the resin sealing device 1 based on the received appropriate signal. "" And "movable mold 5 is a" suitable product "". The control unit 8 may also light the warning lamp in a state that indicates that the resin sealing device 1 is operable (for example, a state in which green light is continuously lit). The control unit 8 may also indicate that the resin sealing device 1 is in an operable state by a sound such as “operable”.

接下來,如步驟S8所示,控制部8基於接收的適 合訊號,使樹脂密封裝置1轉移為可動作的狀態(動作狀態)。在樹脂密封裝置1已經在可動作的狀態時,控制部8繼續將樹脂密封裝置1維持在可動作的狀態。步驟S7與步驟S8的順序亦可互換、亦可以同時進行的方式實施。 Next, as shown in step S8, the control section 8 based on the received fitness The combination signal shifts the resin sealing device 1 to an operable state (operating state). When the resin sealing device 1 is already in an operable state, the control unit 8 continues to maintain the resin sealing device 1 in an operable state. The order of step S7 and step S8 can also be interchanged or implemented simultaneously.

以下,敘述在比較後的結果為「固定模具4及可動模具5的至少一個不是「適合品」」的情況(第二情況)的處理。例如,敘述在固定模具4為「適合品」、可動模具5不是「適合品」的情況的處理。接著步驟S5,如步驟S9所示,判別部J生成顯示「可動模具5不是「適合品」」的不適合訊號。 In the following, a description will be given of a process (second case) in which the comparison result is that "at least one of the fixed mold 4 and the movable mold 5 is not a" suitable product "". For example, a description will be given of a process in a case where the fixed mold 4 is a “suitable product” and the movable mold 5 is not a “suitable product”. Following step S5, as shown in step S9, the determination unit J generates an unsuitable signal indicating that "the movable mold 5 is not a" suitable product ".

接下來,如步驟S10所示,控制部8基於接收的不適合訊號,在樹脂密封裝置1的控制部8的顯示部(未圖示),顯示「可動模具5不是「適合品」」的事項。控制部8亦可一並將警告燈以顯示樹脂密封裝置1為不可動作的狀態之樣態(例如將黃色或紅色的光斷斷續續地點亮的樣態)點亮。控制部8亦可一並藉由「不可動作」等的聲音顯示樹脂密封裝置1為不可動作的狀態。 Next, as shown in step S10, the control unit 8 displays an item "the movable mold 5 is not a" suitable product "on the display unit (not shown) of the control unit 8 of the resin sealing device 1 based on the received inappropriate signal. The control unit 8 may also light the warning lamp in a state showing that the resin sealing device 1 is inoperable (for example, a state in which yellow or red light is intermittently lit). The control unit 8 may also indicate that the resin sealing device 1 is in an inoperable state by a sound such as “impossible operation”.

接下來,如步驟S11所示,控制部8基於接收的不適合訊號,使樹脂密封裝置1轉移為不可動作的狀態(不動作狀態)。步驟S10與步驟S11的順序亦可互換、亦可以同時進行的方式實施。在固定模具4不是「適合品」的情況以及固定模具4及可動模具5二者均不是「適合品」的情況,亦是進行與上述的第二情況同樣的處理。 Next, as shown in step S11, the control unit 8 shifts the resin sealing device 1 to a non-operation state (non-operation state) based on the received inappropriate signal. The order of step S10 and step S11 can also be interchanged, and can also be implemented simultaneously. In the case where the fixed mold 4 is not a “suitable product” and the case where neither of the fixed mold 4 and the movable mold 5 is a “suitable product”, the same processing as in the second case described above is performed.

在固定模具4及可動模具5的至少一個不是「適合品」的模具(以下稱「不適合模具」)之情況,作業員從成形 模具的庫存之中尋找「適合品」(以下稱「適合模具」)。作業員將不適合模具替換為找到的適合模具。作業員在適合模具已被暫時設置於樹脂密封裝置1的狀態,遵循示於第5圖的流程圖,使樹脂密封裝置1的控制部8動作。在此情況,由於適合模具已被暫時設置於樹脂密封裝置1,藉由進行步驟S1~S5~S8的處理,將樹脂密封裝置1轉換為動作狀態。 In the case where at least one of the fixed mold 4 and the movable mold 5 is not a "suitable product" mold (hereinafter referred to as "inappropriate mold"), the operator starts from forming Look for "suitable products" (hereinafter referred to as "suitable molds") in the inventory of molds. The operator replaces the unsuitable mold with the found suitable mold. The worker operates the control unit 8 of the resin sealing device 1 in a state where the mold is temporarily installed in the resin sealing device 1 and follows the flowchart shown in FIG. 5. In this case, since the suitable mold has been temporarily installed in the resin sealing device 1, the resin sealing device 1 is switched to the operating state by performing the processing of steps S1 to S5 to S8.

至此,已敘述特定成形模具6的資訊至少包含於第一資訊的事項。此外,至此,已敘述在特定成形模具6的資訊,包含成形模具6的製造者、提供者、勞務的提供者等的資訊、成形模具6的模具號碼及製造編號、藉由此成形模具6成形的成形品(封裝後基板)的產品種類、顯示此成形模具6為適合品的適合品資訊之事項。不限於此,在特定成形模具6的資訊,亦可包含顯示關於此成形模具6的製造年月日、使用開始年月日、使用年月日、已製造的物品(封裝後基板)的批號、使用次數(射注次數)等的歷程的歷程資訊。在歷程資訊,亦可包含顯示成形模具6的清潔、點檢、維護(保養)及替換(以下稱為「點檢、維護等」)的內容及時期等的歷程的歷程資訊。在歷程資訊,亦可包含顯示對於成形模具6在過去的缺陷、改善等的歷程的歷程資訊。藉此,樹脂密封裝置1或成形模具6的使用者(user)或是適合品提供者,進行上述資訊(顯示缺陷、改善等的歷程的資訊)的資料庫化。這些資訊,適用於使樹脂密封裝置1或成形模具6的稼動率提升的目的。 So far, it has been described that the information of the specific molding die 6 includes at least the first information. In addition, the information on the specific forming mold 6 has been described so far, including information on the manufacturer, supplier, and service provider of the forming mold 6, the mold number and manufacturing number of the forming mold 6, and the forming by the forming mold 6. The product type of the molded product (the substrate after packaging), and the information indicating the applicable product information of the mold 6 as the suitable product. Not limited to this, the information of a specific molding die 6 may include information on the manufacturing date, the start date, the use date, the batch number of the manufactured article (packaged substrate), History information such as the number of uses (shots). The history information may also include history information showing the history and content of the cleaning, inspection, maintenance (maintenance), and replacement (hereinafter referred to as "inspection, maintenance, etc.") of the forming mold 6. The history information may also include history information showing a history of past defects, improvements, and the like of the forming mold 6. Thereby, a user of the resin sealing device 1 or the molding die 6 or a supplier of suitable products performs a database of the above-mentioned information (information showing the history of defects and improvements). This information is suitable for the purpose of improving the productivity of the resin sealing device 1 or the molding die 6.

敘述判別部J(請參考第1A圖、第1B圖)針對例如可動模具5,基於歷程資訊判別為應進行點檢、維護等的時 期來到的情況。在此情況,判別部J產生顯示「可動模具5為需要點檢、維護等等的「需維護品」」的事項的需維護訊號。控制部8基於已接收的需維護訊號,顯示「可動模具5為需維護品」的事項,使樹脂密封裝置1轉移為無法動作的狀態(不動作狀態)。因此,樹脂密封裝置1的使用者(user)、作業員等,可以知道應進行以此可動模具5為對象之點檢、維護等的時期已經來到。此外,可以防止一不注意就徒然過了需要點檢、維護等的時期而繼續使用含此可動模具5的成形模具6的事態。上述的「需維護品」的詞彙,是意指:從是否需要點檢、維護等的觀點,此成形模具不是原本應使用的成形模具。 The description section J (refer to FIG. 1A and FIG. 1B), for example, determines when the movable mold 5 should be inspected, maintained, etc. based on the history information. The situation is coming. In this case, the discriminating unit J generates a maintenance-requiring signal indicating that “the movable mold 5 is a“ maintenance-requiring product ”requiring inspection, maintenance, and the like”. Based on the received maintenance-required signal, the control unit 8 displays the item “the movable mold 5 is a maintenance-required product”, and shifts the resin sealing device 1 to an inoperative state (inoperative state). Therefore, a user, an operator, and the like of the resin sealing device 1 can know that the time has come to perform inspection, maintenance, and the like for the movable mold 5. In addition, it is possible to prevent the situation where the time required for inspection, maintenance, etc. is passed without notice and the molding die 6 including the movable die 5 is continuously used. The term "maintenance-requiring product" mentioned above means that from the viewpoint of whether inspection, maintenance, etc. are required, this forming mold is not a forming mold that should be used originally.

在特定成形模具6的資訊,至少含有適合品資訊,並視需求亦可含有歷程資訊。在特定成形模具6的資訊,視需求亦可含有適合品資訊與歷程資訊的任一個。 The information on the specific forming mold 6 contains at least information on suitable products, and may also include process information as required. The information on the specific molding die 6 may include any of product information and process information as required.

另外,即使是成形模具6不是適合品的情況,仍可能有在使用此成形模具6的方面無問題的情況。例如,在顯示適合品的資訊,包含在成形模具的製造者所具有的特定的工廠製造的成形模具6的情況。在成形模具的製造者所具有的另一個工廠製造的成形模具6的情況,可使用此成形模具6。預設這樣的情況,在作業員確認顯示適合品的資訊而判斷為可以使用此成形模具6的情況,亦可設為:藉由作業員從樹脂密封裝置1的外部輸入的訊號,可以變更在控制部8的判別。具體而言,只要按照作業員已輸入的訊號,設為可以從「不是適合品」的判別轉換為「是適合品」的判別即可。 In addition, even in the case where the molding die 6 is not a suitable product, there may be cases where there is no problem in using this molding die 6. For example, the display of information on suitable products includes the case where the mold 6 is manufactured in a specific factory owned by the mold maker. This molding die 6 can be used in the case of a molding die 6 manufactured in another factory owned by the manufacturer of the molding die. By default, when the operator confirms that the information of the suitable product is displayed and judges that the mold 6 can be used, it can also be set as follows: The signal input by the operator from the outside of the resin sealing device 1 can be changed. Determination by the control unit 8. Specifically, as long as the operator has input a signal, it can be changed from the determination of "not a suitable product" to the determination of "is a suitable product".

如第3圖所示,例示雷射式代碼讀取感應器作為 資訊讀取工具10。資訊讀取工具10並不限於這樣的工具。例如,亦可藉由影像讀取感應器之CCD元件(電荷耦合裝置;Charge Coupled Device)等的影像感應器的使用,將拍攝標識9的資訊形成面9a所獲得的影像資料送至控制部8。亦可設為比較被傳送的影像資料與已被預先記憶的特定的影像資料(基準資料),進行適合品與否的判別。作為影像讀取感應器,亦可使用CMOS感應器。只要資訊讀取工具10是可以以高精度且正確地讀取已被形成於標識9的資訊形成面9a的微細圖案的工具即可。 As shown in Figure 3, the laser code reading sensor is exemplified as Information reading tool 10. The information reading tool 10 is not limited to such a tool. For example, by using an image sensor such as a CCD element (Charge Coupled Device) of the image reading sensor, the image data obtained from the information forming surface 9a of the shooting mark 9 can be sent to the control unit 8 . It can also be set to compare the transmitted image data with specific image data (reference data) that has been stored in advance, and determine whether it is suitable or not. As an image reading sensor, a CMOS sensor can also be used. The information reading tool 10 only needs to be a tool that can accurately read the fine pattern of the information formation surface 9a formed on the mark 9 with high accuracy.

本實施例,是達成以下所述的有用且顯著的功效。第一,在關於可換組件的成形模具6為適合品與否的判別,是使用從已被固定於成形模具6的標識9讀取的第一資訊、與已被預先記憶的第二資訊。第一資訊包含特定成形模具6的資訊,第二資訊至少包含特定成形模具6的資訊。在特定成形模具6的資訊,含有適合品資訊與歷程資訊的至少任一個,而以包含其二者為佳。藉由上述事項,第一,可以判別可換組件之成形模具6為適合品與否。第二,可以判別可換組件之成形模具6為需維護品與否。 This embodiment achieves the useful and remarkable effects described below. First, in determining whether the forming mold 6 of the replaceable component is suitable or not, the first information read from the mark 9 fixed to the forming mold 6 and the second information that has been memorized in advance are used. The first information includes information of a specific forming mold 6, and the second information includes at least information of a specific forming mold 6. The information on the specific molding die 6 preferably includes at least one of suitable product information and history information, and preferably includes both of them. By the above-mentioned matters, first, it can be judged whether the forming mold 6 of the replaceable component is suitable or not. Second, it can be judged whether the forming mold 6 of the replaceable component is a maintenance-requiring product or not.

第二,由於標識9是藉由電鑄加工製作,可以在標識9的資訊形成面9a高精度地形成微細圖案。此外,標識9具有耐熱性。藉由這些事項,可以獲得最適合黏貼在裝配於包含電子零件的樹脂密封裝置之樹脂成形裝置的成形模具6的使用目的之標識9。因此,由於可以使用已黏貼標識9的成形模具6,可以防止作業員造成的誤安裝等。 Second, since the logo 9 is manufactured by electroforming, a fine pattern can be formed on the information formation surface 9a of the logo 9 with high accuracy. In addition, the marker 9 has heat resistance. By these matters, it is possible to obtain a mark 9 which is most suitable for the purpose of use of the molding die 6 which is adhered to the resin molding device mounted on the resin sealing device including the electronic component. Therefore, since the forming mold 6 to which the mark 9 is adhered can be used, it is possible to prevent an erroneous installation or the like caused by an operator.

第三,藉由使用已被標識9黏貼的成形模具6,可以防止損及成形品的品質之類的問題、與對於樹脂密封裝置1造成動作不良、耐久性降低、其他的不良影響等之類的問題。 Third, by using the molding die 6 that has been pasted with the logo 9, it is possible to prevent problems such as deterioration of the quality of the molded product, poor operation of the resin sealing device 1, reduced durability, and other adverse effects. The problem.

第四,由於標識9是被形成為薄形的片狀,標識9會在從成形模具將標識9剝下時破損。起因於此,無法剝下標識9而以原本的狀態再黏貼於其他的成形模具。因此,可以防止例如適合品提供者以外的人所作的標識9的不正當使用、不適合品的成形模具之供應等。 Fourth, since the logo 9 is formed in a thin sheet shape, the logo 9 is broken when the logo 9 is peeled from the forming mold. Because of this, the logo 9 cannot be peeled off and then stuck to another molding die in the original state. Therefore, it is possible to prevent, for example, improper use of the logo 9 made by a person other than the supplier of the suitable product, supply of a molding die for the unsuitable product, and the like.

[實施例2] [Example 2]

敘述本發明相關的物品之製造裝置及製造方法的實施例2。在本實施例,第二資訊是被預先記憶在設於樹脂密封裝置1的外部的記憶裝置。作為設於外部的記憶裝置,可舉出以下二個。第一記憶裝置,是用於由樹脂密封裝置1的使用者(user)管理半導體製程的伺服器等所具有的記憶裝置。第二記憶裝置,是用於由關於樹脂密封裝置1或成形模具6的適合品提供者管理自己的製品、勞務等的伺服器等所具有的記憶裝置。 Embodiment 2 of the manufacturing apparatus and manufacturing method of the article concerning this invention is demonstrated. In this embodiment, the second information is stored in advance in a memory device provided outside the resin sealing device 1. Examples of the external storage device include the following two. The first memory device is a memory device included in a server or the like for managing a semiconductor process by a user of the resin sealing device 1. The second memory device is a memory device included in a server or the like that manages its own products, labor, and the like by a supplier of suitable products related to the resin sealing device 1 or the molding die 6.

在本實施例,第一,從用於由樹脂密封裝置1或成形模具6的使用者(user)管理半導體製程全體的伺服器等所具有的記憶裝置,讀出第二資訊。藉此,樹脂密封裝置1或成形模具6的使用者及作業員可以知道成形模具6是否為適合品。此外,樹脂密封裝置1或成形模具6的使用者及作業員可以知道應進行以成形模具6為對象的點檢、維護等的時期是否已經來到。在「點檢、維護等」,是包含以成形模具6為對象的清潔(在洗淨之外,包含使用刷子、雷射光、電漿等的物理 性或化學性的清潔)。 In this embodiment, first, the second information is read from a memory device included in a server or the like for managing the entire semiconductor manufacturing process by a user of the resin sealing device 1 or the molding die 6. This allows users and operators of the resin sealing device 1 or the molding die 6 to know whether the molding die 6 is a suitable product. In addition, the user and operator of the resin sealing device 1 or the mold 6 can know whether or not the time has come to perform inspection, maintenance, and the like for the mold 6. "Inspection, maintenance, etc." includes cleaning (for cleaning, physical use of brushes, laser light, plasma, etc.) Or chemical cleaning).

第二,從用於由關於樹脂密封裝置1或成形模具6的適合品提供者管理自己的製品、勞務等的伺服器等所具有的記憶裝置,讀出第二資訊。藉此,關於樹脂密封裝置1或成形模具6的適合品提供者可以知道應進行以成形模具6為對象的點檢、維護等的時期是否已經來到。基於此一事項,適合品提供者會以應進行點檢、維護等的時期已經來到的主旨,對於樹脂密封裝置1或成形模具6的使用者(user)進行聯絡並促使其注意。適合品提供者亦可視需求,對使用者傳達有派遣適合品提供者的服務工程師之準備、供應替換用的可換組件之準備等。適合品提供者的伺服器,亦可將接近應進行點檢、維護等的時期的情況、有派遣服務工程師之準備的情況、有供應替換用的可換組件之準備的情況等,自動式地傳送訊息給樹脂密封裝置1的控制部8、或是樹脂密封裝置1的使用者所具有的伺服器。藉此,對於關於樹脂密封裝置1或成形模具6的適合品提供者及使用者二者,提供用以確實地進行預防維護、定期維護的資訊。 Secondly, the second information is read out from a memory device included in a server or the like that manages its own products, labor, etc., by a supplier of suitable products regarding the resin sealing device 1 or the molding die 6. Accordingly, the supplier of the suitable product regarding the resin sealing device 1 or the molding die 6 can know whether or not the time has come to perform inspection, maintenance, and the like for the molding die 6. Based on this matter, the supplier of suitable products will contact the user of the resin sealing device 1 or the molding die 6 with the main purpose of the time when inspection, maintenance, etc. have come, and draw their attention. The supplier of suitable products can also communicate to the user the preparations for dispatching service engineers for the suppliers of suitable products and the preparation of supply of replaceable components for replacement. The server suitable for the product supplier can also be used to automatically approach the time when inspection, maintenance, etc. should be performed, when a service engineer is ready to be dispatched, and when a replacement unit is ready for supply and replacement. The message is transmitted to the control unit 8 of the resin sealing device 1 or a server included in the user of the resin sealing device 1. Thereby, for both the supplier and the user of the suitable product regarding the resin sealing device 1 or the molding die 6, information is provided to reliably perform preventive maintenance and regular maintenance.

[實施例3] [Example 3]

基於第6圖,敘述本發明相關的物品之製造裝置及製造方法的實施例3。以下,作為製造裝置的樹脂密封裝置1,舉出在下模具5設有一個模穴CAV且使用壓縮成形方式的樹脂密封裝置1作為例子,進行敘述。示於第6圖的成形模具6,是被使用在高溫(例如約180℃)。據此,有必要保護資訊讀取工具10免受高溫危害。本實施例是顯示以被使用於高溫的可換組件為對象的情況中的資訊讀取工具10的較佳例子。 Embodiment 3 of the manufacturing apparatus and manufacturing method of the article concerning this invention is described based on FIG. Hereinafter, as the resin sealing device 1 of the manufacturing apparatus, a resin sealing device 1 provided with a cavity CAV in the lower mold 5 and using a compression molding method will be described as an example. The molding die 6 shown in Fig. 6 is used at a high temperature (for example, about 180 ° C). Accordingly, it is necessary to protect the information reading tool 10 from high temperature. This embodiment is a preferred example of the information reading tool 10 in a case where a replaceable component used at a high temperature is targeted.

如第6圖所示,在樹脂密封裝置1,設有滾珠螺桿(ball screw)30與滾珠螺帽(ball nut)31。在滾珠螺帽31,安裝主搬運機構32。為了使主搬運機構32可以沿著X方向移動,設置沿著X方向延伸的X方向導軌33。在主搬運機構32,設置沿著-Y方向延伸的Y方向導軌34。 As shown in FIG. 6, the resin sealing device 1 is provided with a ball screw 30 and a ball nut 31. A main conveyance mechanism 32 is attached to the ball nut 31. In order to allow the main conveyance mechanism 32 to move in the X direction, an X-direction guide rail 33 extending in the X-direction is provided. The main conveyance mechanism 32 is provided with a Y-direction guide 34 extending in the -Y direction.

副搬運機構35,是被設置為可以沿著Y方向導軌34移動的樣態。副搬運機構35是將在基板裝設半導體晶片後的裝設後基板(未圖示)保持於上側,而供應至固定模具4的下表面。在固定模具4的下表面,藉由吸附、夾持等的方法,暫時性地固定裝設後基板。副搬運機構35將片狀、粉粒狀的固態樹脂、在常溫具有流動性的液狀樹脂等的樹脂材料(未圖示),保持在被設於下側的容器等。副搬運機構35是將已被保持的樹脂材料,供應至被設於可動模具5的模穴CAV的內部。 The auxiliary conveyance mechanism 35 is provided so that it can move along the Y-direction guide rail 34. The sub conveying mechanism 35 holds the mounted substrate (not shown) on the upper side after mounting the semiconductor wafer on the substrate, and supplies it to the lower surface of the fixed mold 4. The rear substrate is temporarily fixed on the lower surface of the fixed mold 4 by a method such as suction or clamping. The sub-conveying mechanism 35 holds a resin material (not shown) such as a sheet-shaped or powder-shaped solid resin, or a liquid resin having fluidity at normal temperature, in a container provided on the lower side, or the like. The auxiliary conveyance mechanism 35 supplies the held resin material to the inside of the cavity CAV provided in the movable mold 5.

在副搬運機構35,例如在下表面或側面,設有包含於資訊讀取工具10的受光部36。在受光部36,設由分別由耐熱玻璃構成的凸透鏡37與反射鏡38。在受光部36,在設有凸透鏡37之側(入光側),設置例如環狀的照明39。 The sub conveying mechanism 35 is provided with a light receiving unit 36 included in the information reading tool 10 on the lower surface or the side surface, for example. The light receiving section 36 is provided with a convex lens 37 and a reflecting mirror 38 each made of heat-resistant glass. The light receiving unit 36 is provided with, for example, a ring-shaped illumination 39 on the side (light incident side) where the convex lens 37 is provided.

在位於遠離成形模具6的位置的主搬運機構32,安裝具有CCD感應器、CMOS感應器等的影像感應器40的影像取得部41。藉由影像感應器40獲得的電性訊號構成的影像資料,是例如經由纜線42,被送至包含於控制部8的相機控制器43。作為影像取得部41,亦可在主搬運機構32安裝具有影像感應器40的電子相機。在樹脂密封裝置1具有沿著X方向排列的複數個成形模組M的情況,包含一個副搬運機構35的 一個主搬運機構32,是被複數個成形模組M共通使用。 An image acquisition unit 41 including an image sensor 40 such as a CCD sensor, a CMOS sensor, and the like is mounted on the main conveyance mechanism 32 located away from the molding die 6. The image data constituted by the electrical signals obtained by the image sensor 40 is sent to the camera controller 43 included in the control unit 8 via a cable 42, for example. As the image acquisition unit 41, an electronic camera having an image sensor 40 may be mounted on the main conveyance mechanism 32. When the resin sealing device 1 includes a plurality of molding modules M arranged in the X direction, One main conveyance mechanism 32 is commonly used by a plurality of forming modules M.

在可動模具(下模具)5,安裝有已形成有模穴CAV的模穴區塊44。模穴區塊44是按照所製造的製品(在本實施例為封裝後基板)而被替換的可換組件。在模穴區塊44,是藉由例如黏貼、螺旋旋緊等固定具有資訊形成面9a的標識9。 A cavity block 44 in which a cavity CAV has been formed is mounted on the movable mold (lower mold) 5. The cavity block 44 is a replaceable component that is replaced in accordance with the manufactured product (the substrate after packaging in this embodiment). In the cavity block 44, a mark 9 having an information forming surface 9a is fixed by, for example, sticking or screwing.

顯示被形成於資訊形成面9a的微細圖案的影像的光,是經由空間構成的導光部45而進入凸透鏡37而被集光。被集光的光在反射鏡38反射。在反射鏡38反射後的光,是經由空間構成的導光部46而進入影像感應器40,被轉換成電性訊號構成的影像資料。轉換後的影像資料是經由纜線42,被送至包含於控制部8(請參考第1A圖、第1B圖)的相機控制器43。在本實施例,至少,具有凸透鏡37與反射鏡38的受光部36、導光部46與具有影像感應器40的影像取得部41,是具有相當於示於第2A圖、第2B圖的資訊讀取工具10的功能。至少,受光部36、導光部46與影像取得部41,是包含於資訊讀取工具10。 The light that displays the image of the fine pattern formed on the information formation surface 9 a is collected by entering the convex lens 37 through the light guide 45 formed in space. The collected light is reflected by the mirror 38. The light reflected by the reflector 38 enters the image sensor 40 through the light guide portion 46 formed in the space, and is converted into image data composed of electrical signals. The converted image data is sent to the camera controller 43 included in the control unit 8 (see FIG. 1A and FIG. 1B) via the cable 42. In this embodiment, at least the light receiving section 36, the light guide section 46, and the image obtaining section 41 having the image sensor 40 having the convex lens 37 and the reflecting mirror 38 have information equivalent to those shown in FIGS. 2A and 2B. Functions of the reading tool 10. At least the light receiving section 36, the light guide section 46, and the image acquisition section 41 are included in the information reading tool 10.

藉由本實施例可獲得以下功效。第一,由於自動式地判別可換組件的成形模具6為適合品與否,可以防止成形模具6的誤安裝。此功效,是藉由以下構成獲得:從已被固定於成形模具6的標識9所具有的資訊形成面9a,自動式地讀取特定此成形模具6的資訊,自動式地判別此成形模具6為適合品與否。 The following effects can be obtained by this embodiment. First, because the forming mold 6 of the replaceable component is automatically determined to be suitable or not, it is possible to prevent erroneous installation of the forming mold 6. This effect is obtained by the following structure: from the information forming surface 9a of the mark 9 which has been fixed to the forming mold 6, automatically reading the information identifying the forming mold 6 and automatically determining the forming mold 6 For the fit or not.

第二,可防止起因於徒然過了應進行以可換組件的成形模具6為對象的維護點檢的時期等之製品品質的降低、成 形模具6的劣化等。此功效,是藉由以下構成獲得:從已被固定於成形模具6的標識9所具有的資訊形成面9a,自動式地判別應進行以此成形模具6為對象的維護點檢的時期已來到與否。 Secondly, it is possible to prevent a reduction in product quality caused by a lapse in time, such as a period when maintenance inspections on the mold 6 for the replaceable component should be performed. Deterioration of the mold 6 and the like. This effect is obtained by the following configuration: From the information forming surface 9a of the mark 9 fixed to the forming mold 6, it is automatically determined that the time for the maintenance check for the forming mold 6 should be performed. Yes or no.

第三,防止位於高溫的環境下所具有之含凸透鏡37與反射鏡38的資訊讀取工具10的劣化、與通常位於非在高溫的環境下的場所的影像感應器40的劣化。此功效是藉由以下的構成獲得。凸透鏡37與反射鏡38是攸關於影像資料的取得的光學元件,由耐熱玻璃構成。將影像感應器40配置在遠離成為高溫的成形模具6的位置,從資訊形成面9a依序經由凸透鏡37與反射鏡38而到影像感應器40的導光部45、46,是藉由空間構成。藉由這些構成,防止具有包含凸透鏡37與反射鏡38的受光部36、由空間構成的導光部46及包含影像感應器40的影像取得部41之資訊讀取工具10的劣化。 Third, the deterioration of the information reading tool 10 including the convex lens 37 and the reflector 38 located in a high-temperature environment and the deterioration of the image sensor 40 usually located in a place other than a high-temperature environment are prevented. This effect is obtained by the following constitution. The convex lens 37 and the reflecting mirror 38 are optical elements related to acquisition of image data, and are made of heat-resistant glass. The image sensor 40 is disposed away from the molding mold 6 which becomes a high temperature, and from the information forming surface 9a to the light guide portions 45 and 46 of the image sensor 40 through the convex lens 37 and the reflecting mirror 38 in this order, is constituted by space. . With these configurations, deterioration of the information reading tool 10 including the light receiving section 36 including the convex lens 37 and the reflecting mirror 38, the light guide section 46 including a space, and the image acquisition section 41 including the image sensor 40 is prevented.

第四,可以抑制樹脂密封裝置1的製造原價的增加。此功效是藉由以下的構成獲得。在資訊讀取工具10中,是採用:在副搬運機構35設置分別由耐熱玻璃構成的凸透鏡37與反射鏡38之構成。在資訊讀取工具10中,是採用:將包含影像感應器40的影像取得部41安裝於主搬運機構32的構成。因此,由於沒有必要新設置用以使資訊讀取工具10移動的工具,可以抑制樹脂密封裝置1的製造原價的增加。此外,在樹脂密封裝置1具有複數個成形模組M的情況,可以共用一組資訊讀取工具10。藉此,可以進一步有效地抑制樹脂密封裝置1的製造原價的增加。 Fourth, an increase in the manufacturing cost of the resin sealing device 1 can be suppressed. This effect is obtained by the following constitution. In the information reading tool 10, a configuration is provided in which the sub-conveying mechanism 35 is provided with a convex lens 37 and a reflecting mirror 38 each made of heat-resistant glass. The information reading tool 10 has a configuration in which an image acquisition unit 41 including an image sensor 40 is mounted on the main conveyance mechanism 32. Therefore, since it is not necessary to newly provide a tool for moving the information reading tool 10, it is possible to suppress an increase in the manufacturing cost of the resin sealing device 1. When the resin sealing device 1 includes a plurality of molding modules M, a group of information reading tools 10 can be shared. This makes it possible to further effectively suppress an increase in the manufacturing cost of the resin sealing device 1.

在第6圖,是顯示從受光部36到影像取得部41 的導光部46是藉由空間構成之例子。亦可取而代之,採用包括導引進入凸透鏡37、被凸透鏡37集光的光之光纖,作為導光部46。以在具有耐熱性的保護管的內部配置光纖為佳。在此情況,光纖是相當於導光部。藉由此構成,藉由適當地布局光纖,可以自由選擇配置影像取得部41的場所。 In Fig. 6, the light receiving section 36 to the image acquiring section 41 are shown. The light guide section 46 is an example of a space structure. Alternatively, an optical fiber including light guided into the convex lens 37 and light collected by the convex lens 37 may be used as the light guide portion 46. It is preferable to arrange the optical fiber inside the heat-resistant protective tube. In this case, the optical fiber is equivalent to a light guide. With this configuration, by appropriately arranging the optical fibers, a place where the image acquisition section 41 is arranged can be freely selected.

在第6圖,是顯示將包含影像感應器40的影像取得部41安裝於主搬運機構32的例子。不限於此,亦可採用將包含影像感應器的數位相機安裝於主搬運機構32而作為影像取得部41的構成。在此情況,可將數位相機安裝於主搬運機構32、亦可安裝於副搬運機構35。在將數位相機安裝於副搬運機構35的情況,以在數位相機設置冷卻機構為佳。 FIG. 6 shows an example in which the image acquisition unit 41 including the image sensor 40 is mounted on the main conveyance mechanism 32. Not limited to this, a digital camera including an image sensor may be mounted on the main conveyance mechanism 32 as the image acquisition unit 41. In this case, the digital camera may be attached to the main conveyance mechanism 32 or may be attached to the sub conveyance mechanism 35. When the digital camera is mounted on the sub-conveying mechanism 35, it is preferable to provide a cooling mechanism for the digital camera.

[實施例4] [Example 4]

基於第6圖與第7圖,敘述本發明相關的物品之製造裝置及製造方法的實施例4。如第7圖所示,樹脂密封裝置1具有一個材料接收模組A、四個成形模組M(請參考第1A圖、第1B圖)與一個繳出模組B。樹脂密封裝置1分別以樹脂密封裝置1全體為對象,具有供應電力的電源50與控制各構成元件的控制部8(請參考第1A圖、第1B圖)與一個繳出模組B。 A fourth embodiment of an apparatus and method for manufacturing an article according to the present invention will be described based on FIGS. 6 and 7. As shown in FIG. 7, the resin sealing device 1 includes a material receiving module A, four forming modules M (refer to FIGS. 1A and 1B), and a delivery module B. The resin sealing device 1 is directed to the entire resin sealing device 1 and includes a power source 50 for supplying power, a control unit 8 (refer to FIG. 1A and FIG. 1B) that controls each component, and a delivery module B.

可以將材料接收模組A與在第7圖最左側的成形模組M,相互裝設、相互分離。可以將相鄰的成形模組M的彼此,相互裝設、相互分離。可以將在第7圖最右側的成形模組M與繳出模組B,相互裝設、相互分離。裝設上述構成元件時的定位,是藉由定位孔及定位銷等的習知的工具進行。裝設是藉由使用螺栓、螺帽旋緊等構成的習知的工具進行。 The material receiving module A and the forming module M on the far left in FIG. 7 can be installed and separated from each other. The adjacent forming modules M can be installed and separated from each other. The forming module M and the withdrawing module B at the far right of FIG. 7 can be installed and separated from each other. The positioning of the above-mentioned constituent elements is performed by a known tool such as a positioning hole and a positioning pin. The installation is performed by a known tool that is configured by using a bolt, a nut, and the like.

材料接收模組A具有基板材料接收部51、樹脂材料接收部52與材料移送機構53。基板材料接收部51是從樹脂密封裝置1的外部接收裝設後基板54。樹脂材料接收部52是從樹脂密封裝置1的外部接收粉粒狀的固態樹脂構成的樹脂材料R。 The material receiving module A includes a substrate material receiving portion 51, a resin material receiving portion 52, and a material transfer mechanism 53. The substrate material receiving section 51 receives the mounted substrate 54 from the outside of the resin sealing device 1. The resin material receiving portion 52 is a resin material R composed of a powdered solid resin from the outside of the resin sealing device 1.

請參考第6圖與第7圖,敘述具有樹脂密封裝置1的搬運系統。在樹脂密封裝置1,在從材料接收模組A經由四個成形模組M到繳出模組B,沿著X方向設置X方向導軌33。在X方向導軌33,設置主搬運機構32使其可以沿著X方向移動。在主搬運機構32,沿著Y方向設置Y方向導軌34。在Y方向導軌34,設置主搬運機構32所具有的副搬運機構35,使其可以沿著Y方向移動。副搬運機構35在上部收容裝設後基板54,在下部收容樹脂材料R。副搬運機構35,是在接觸於一個成形模組M中的X方向導軌33的待機位置與下模具5中的模穴CAV的上方之間來回。副搬運機構35是將裝設後基板54供應至上模具4的下表面,將樹脂材料R供應至下模具5的模穴CAV。 Referring to FIGS. 6 and 7, a conveyance system having a resin sealing device 1 will be described. In the resin sealing device 1, an X-direction guide 33 is provided along the X-direction from the material receiving module A through the four forming modules M to the delivery module B. A main conveyance mechanism 32 is provided on the X-direction guide rail 33 so as to be movable in the X-direction. A Y-direction guide 34 is provided in the main conveyance mechanism 32 along the Y-direction. The Y-direction guide rail 34 is provided with a sub-conveyance mechanism 35 included in the main conveyance mechanism 32 so as to be movable in the Y-direction. The sub-conveyance mechanism 35 houses the rear substrate 54 on the upper side, and houses the resin material R on the lower side. The sub-conveying mechanism 35 moves back and forth between the standby position in contact with the X-direction guide rail 33 in one forming module M and above the cavity CAV in the lower mold 5. The sub conveyance mechanism 35 supplies the mounted substrate 54 to the lower surface of the upper mold 4 and supplies the resin material R to the cavity CAV of the lower mold 5.

在本實施例,由主搬運機構32與副搬運機構35構成的搬運機構,搬運裝設後基板54、以及以樹脂密封已被裝設於裝設後基板54的半導體晶片(未圖示)而成形後的成形品之密封後基板55二者。藉由此構成,由於由主搬運機構32與副搬運機構35構成的搬運機構兼用於搬入機構與搬出機構,簡化樹脂密封裝置1的構成。 In this embodiment, a transporting mechanism composed of a main transporting mechanism 32 and a sub-transporting mechanism 35 transports the mounted substrate 54 and a semiconductor wafer (not shown) mounted on the mounted substrate 54 with a resin seal. Both of the post-sealed substrates 55 of the molded article after the molding. With this configuration, since the conveyance mechanism including the main conveyance mechanism 32 and the sub conveyance mechanism 35 is used for both the carry-in mechanism and the carry-out mechanism, the configuration of the resin sealing device 1 is simplified.

繳出模組B具有搬運密封後基板55的成形品移送機構56、收容密封後基板55的匣57。此外,繳出模組B具有真空泵58。真空泵58是用於將包含模穴CAV的空間減壓的減 壓源。亦可將真空泵58用來以樹脂密封裝置1全體為對象,作為用於吸附密封後基板54、密封後基板55等的減壓源。亦可將真空泵58設於材料接收模組A,亦可設於各成形模組M。 The delivery module B includes a molded product transfer mechanism 56 that conveys the sealed substrate 55, and a cassette 57 that houses the sealed substrate 55. The delivery module B includes a vacuum pump 58. The vacuum pump 58 is a pressure reducing device for reducing the pressure in the space containing the cavity CAV. Pressure source. The vacuum pump 58 may also be used as a decompression source for the entire resin sealing device 1 as a decompression source for adsorbing the substrate 54 after sealing, the substrate 55 after sealing, and the like. The vacuum pump 58 may be provided in the material receiving module A, and may also be provided in each forming module M.

根據本實施例,可以將四個成形模組M之中相鄰的成形模組M的彼此,相互裝設、相互分離。藉此,可以按照需求的增大而增加成形模組M,可以按照需求的減低而減少成形模組M。例如,在工廠Fa設立的地區特定的製品的需求增大時,從設立於需求未增大的地區的工廠Fb所具有的樹脂密封裝置1,分離用於此特定的製品的生產的成形模組M(卸下成形模組M)。將分離後的成形模組M運送至工廠Fa,在工廠Fa所具有的樹脂密封裝置1,增設被運送到的成形模組M。藉此,可以因應在工廠Fa的設立地區增大的需求。因此,根據本實施例,實現可以有彈性地對應於需求的增減之樹脂密封裝置1。 According to this embodiment, the adjacent forming modules M among the four forming modules M can be installed and separated from each other. Thereby, the forming module M can be increased as the demand increases, and the forming module M can be reduced as the demand decreases. For example, when the demand for an area-specific product established by the factory Fa increases, the resin sealing device 1 provided in the factory Fb established in an area where the demand is not increased separates the molding module used for the production of the specific product M (remove the forming module M). The separated molding module M is transported to the factory Fa, and the resin sealing device 1 included in the factory Fa is added with the molding module M to which it is transported. This can respond to increased demand in the area where the factory Fa is established. Therefore, according to this embodiment, the resin sealing device 1 that can flexibly respond to increase or decrease in demand is realized.

可採用以下的變形例作為樹脂密封裝置1。在第一變形例,統合材料接收模組A與繳出模組B,將被統合後的一個接收/繳出模組配置於樹脂密封裝置1的其中一端(在第7圖為左端或右端)。在此情況,由於在樹脂密封裝置1的另一端(在第7圖為右端或左端)曝露一個成形模組M,容易進行成形模組M彼此的裝設與分離。 The following modified examples can be adopted as the resin sealing device 1. In the first modification, the integrated material receiving module A and the withdrawing module B are integrated with one receiving / withdrawing module at one end of the resin sealing device 1 (the left or right end in FIG. 7). . In this case, since one molding module M is exposed at the other end (the right end or the left end in FIG. 7) of the resin sealing device 1, it is easy to mount and separate the molding modules M from each other.

在第二變形例,統合材料接收模組A與一個成形模組M,將被統合後的一個接收/成形模組配置於樹脂密封裝置1的其中一端(在第7圖為左端或右端)。在此情況,在接收/成形模組裝設一個成形模組M或依序裝設複數個成形模組M。在位於樹脂密封裝置1的另一端(在第7圖為右端或左端) 的成形模組M裝設繳出模組B,構成樹脂密封裝置1。 In the second modified example, the integrated material receiving module A and the forming module M are arranged at one end (the left or right end in FIG. 7) of the integrated resin receiving device 1. In this case, one forming module M is assembled in the receiving / forming die or a plurality of forming modules M are sequentially installed. On the other end of the resin sealing device 1 (right or left end in Figure 7) The forming module M is provided with a delivery module B to constitute a resin sealing device 1.

藉由第三變形例,在樹脂密封裝置1,合併主搬運機構32與副搬運機構35作為搬入機構,而包括有別於此搬入機構的搬出機構。在此情況,由於搬入機構與搬出機構是獨立動作,在樹脂密封裝置1提升成形動作的效率。 According to the third modification, the resin sealing device 1 incorporates the main conveyance mechanism 32 and the sub conveyance mechanism 35 as a carry-in mechanism, and includes a carry-out mechanism different from the carry-in mechanism. In this case, since the carrying-in mechanism and the carrying-out mechanism operate independently, the efficiency of the molding operation is improved in the resin sealing device 1.

不限於上述的變形例,只要構成為使相鄰的成形模組M的彼此,可以相互裝設、可以相互分離即可。以如此構成的樹脂密封裝置1為對象,可以適用本發明。 It is not limited to the above-mentioned modification, and it may be configured so that the adjacent forming modules M can be installed and separated from each other. The present invention is applicable to the resin sealing device 1 having such a configuration.

以下敘述的內容,共通適用於目前為止已敘述的各實施例。作為模具的材料,使用工具鋼等的金屬材料。不限於此,如陶瓷系材料、玻璃系材料等,使用按照模具的用途、成形品的材料等最適合的材料。此外,作為模具的材料,可以使用在金屬材料、陶瓷系材料、玻璃系材料等的表面形成陶瓷系材料的薄膜後的複合材料。 The contents described below are commonly applied to the embodiments described so far. As a material of the mold, a metal material such as tool steel is used. It is not limited to this. For ceramic-based materials, glass-based materials, etc., the most suitable materials are used depending on the use of the mold and the material of the molded product. In addition, as a material of the mold, a composite material in which a thin film of a ceramic material is formed on a surface of a metal material, a ceramic material, a glass material, or the like can be used.

關於模具的種類,不限於樹脂密封用的成形模具,包含在將一般性的塑膠製品成形時所使用的塑膠用的成形模具(樹脂成形模具)。關於樹脂成形的方式,至少包含使用相對向的二個模具的方式。上述方式例如為射出成形、壓縮成形、轉移成形、吹氣成型等。關於樹脂成形的方式,包含使用一個模具的方式。上述方式例如為真空成形(將軟化後的熱塑性塑膠板、熱塑性塑膠片等吸附於一個模具的表面之成形)。 The type of the mold is not limited to a molding mold for sealing a resin, and includes a molding mold (resin molding mold) for plastic used in molding a general plastic product. The resin molding method includes at least a method using two opposing molds. The above-mentioned methods are, for example, injection molding, compression molding, transfer molding, and blow molding. The method of resin molding includes a method using one mold. The above method is, for example, vacuum forming (molding of a softened thermoplastic plastic plate, a thermoplastic plastic sheet, etc. on the surface of a mold).

在樹脂成形模具以外,包含沖壓模具、鑄造模具、壓鑄模具、鍛造模具、擠製模具等。關於樹脂成形模具以外的模具,如沖壓模具包含相對向的一對模具,換言之為一組模具 構成者。關於樹脂成形模具以外的模具,如例如用於鋁等的擠製加工的擠製模具,是包含一個模具構成者。在此情況,一個模具是相當於一組模具。 In addition to resin molding dies, stamping dies, casting dies, die casting dies, forging dies, extrusion dies, and the like are included. Regarding the molds other than the resin mold, for example, the stamping mold includes a pair of opposite molds, in other words, a set of molds Constructor. Regarding a mold other than the resin molding mold, for example, an extrusion mold used for extrusion processing of aluminum or the like includes a mold configuration. In this case, one mold is equivalent to a group of molds.

在模具以外,在製造裝置使用的治具類、工具類是包含於可換組件。作為這些治具類、工具類的第一例,可列舉被設於在半導體製程使用的裁切裝置(切塊機)之裁切用的工作檯(載台),其為固定被切斷物的固定治具。 In addition to molds, jigs and tools used in manufacturing equipment are included in interchangeable components. As a first example of these jigs and tools, a cutting table (carrier) provided in a cutting device (dicer) used in a semiconductor manufacturing process can be cited, which is a fixed object to be cut. Fixed fixture.

作為第二例,可列舉被設於各種加工裝置之檯(載台),其為固定被加工物(包含被裁切物,下同)的固定治具。 As a second example, a table (carrier) provided in various processing apparatuses may be used, and it is a fixed jig for fixing an object to be processed (including a cut object, the same below).

作為第三例,可列舉被設於在機械加工使用的工作機械之固定被加工物的固定治具(夾持器、安裝具等)。根據先前的技術,由於加工被加工物時噴射的切削油、產生的切削屑等的附著,條碼標籤本身有劣化之虞。另一方面藉由本實施例,藉由將壓縮空氣等的高壓氣體吹送至固定治具所具有的資訊形成面9a,可以縮小資訊形成面9a所受之切削油、切削屑等的影響的程度。藉此,可以穩定地讀取特定固定治具的資訊(第一資訊)。 As a third example, a fixing jig (such as a holder, a fixture, etc.) provided on a work machine for fixing a workpiece to be used in machining may be mentioned. According to the prior art, the barcode label itself may be deteriorated due to the adhesion of cutting oil sprayed during the processing of the workpiece, generated chips, and the like. On the other hand, according to this embodiment, high-pressure gas such as compressed air is blown to the information forming surface 9a of the fixed jig, so that the degree of influence of the cutting oil, cutting chips, and the like on the information forming surface 9a can be reduced. Thereby, the information (first information) of a specific fixed jig can be stably read.

作為第四例,可列舉為了在各種加工裝置加工被加工物所使用的工具。關於工具,含有切削刀、旋轉刀、研磨片等。 As a fourth example, a tool used for processing an object to be processed in various processing devices may be mentioned. The tool includes a cutting blade, a rotary blade, an abrasive sheet, and the like.

在上述的四個例子中,藉由先前的技術,由於加工被加工物時噴射的切削水、切削液、產生的切削屑等的附著,條碼標籤本身有劣化之虞。由於切削水等的影響,RFID標籤的可靠度有下降之虞。另一方面藉由本實施例,藉由將壓縮空氣 等的高壓氣體吹送至可換組件所具有的資訊形成面9a,可以縮小資訊形成面9a所受之切削水、切削屑等的影響的程度。藉此,可以穩定地讀取特定可換組件的資訊(第一資訊)。 In the above four examples, the barcode label itself may be deteriorated due to the adhesion of cutting water, cutting fluid, generated chips, and the like, which are sprayed during processing of the object by the prior art. Due to the influence of cutting water, etc., the reliability of RFID tags may decrease. On the other hand, with this embodiment, Such high-pressure gas is blown to the information forming surface 9a of the replaceable component, and the degree of influence of cutting water, cutting chips, and the like on the information forming surface 9a can be reduced. Thereby, information (first information) of a specific replaceable component can be stably read.

關於藉由物品之製造裝置而製造的物品,包含藉由樹脂成形加工、沖壓加工、機械加工等製造後的完成品。此外,關於所製造的物品,包含如上述實施例中的密封後基板的半成品。 The article manufactured by the article manufacturing apparatus includes a finished product manufactured by a resin molding process, a press process, a machining process, or the like. In addition, as for the manufactured article, the semi-finished product of the sealed substrate as in the above embodiment is included.

作為被形成於標識9的資訊形成面9a的微細圖案,在藉由電鑄加工形成的微細圖案以外,可以使用以以下的加工形成的微細圖案。第一加工為機械加工。關於機械加工,在切削加工(包含振動切削加工)以外,包含噴擊(blast)加工、噴水(waterjet)加工等。 As the fine pattern formed on the information formation surface 9a of the logo 9, in addition to the fine pattern formed by electroforming, a fine pattern formed by the following processing can be used. The first processing is machining. The mechanical processing includes, in addition to cutting processing (including vibration cutting processing), blast processing, waterjet processing, and the like.

第二加工為雷射加工。雷射的種類未特別限定。使用按照被加工的材料(構成標識9的材料)之最適合的雷射。 The second processing is laser processing. The type of laser is not particularly limited. Use the most suitable laser according to the material to be processed (the material constituting the mark 9).

第三加工為蝕刻加工。關於蝕刻加工,包含溼蝕刻與乾蝕刻二者。 The third process is an etching process. The etching process includes both wet etching and dry etching.

第四加工為使膜附著於標識的表面之加工。關於,使膜附著之加工,包含網版印刷、噴墨印刷、塗裝等。在此情況,作為構成膜的材料,以使用具有高硬度、耐化學品性、耐熱性等的特性的材料為佳。在使用這些材料的情況,難以將膜從標識的表面除去。因此,可以跨越長時間、穩定地從可換組件的標識9取得資訊。 The fourth process is a process of attaching the film to the surface of the mark. The processing for attaching the film includes screen printing, inkjet printing, and painting. In this case, as a material constituting the film, it is preferable to use a material having characteristics such as high hardness, chemical resistance, and heat resistance. In the case of using these materials, it is difficult to remove the film from the surface of the mark. Therefore, information can be obtained from the identification 9 of the replaceable component stably over a long period of time.

第五加工,是使用以光造形法為代表的積層造形法、切削造形法等的所謂三維印表機之加工。藉由這樣的三維 造形法,可以在標識的表面形成微細圖案。 The fifth processing is processing using a so-called three-dimensional printer, such as a multilayer molding method and a cutting molding method typified by a photo-forming method. With this three-dimensional The forming method can form a fine pattern on the surface of the logo.

將使用上述的加工而完成形成的片狀、薄板狀等的標識9黏貼於模具的表面。亦可藉由螺旋旋緊等的機械性手段,將標識9固定於模具的表面。亦可使用上述的加工,在可換組件的表面直接形成微細圖案。 A sheet-like, thin-plate-like mark 9 formed using the above-mentioned processing is adhered to the surface of the mold. The logo 9 may be fixed to the surface of the mold by mechanical means such as screwing. It is also possible to form a fine pattern directly on the surface of the replaceable component using the above-mentioned processing.

此外,亦可使用上述的加工,製作具有標識9的可換組件本身。亦可使用上述的各種加工,製作包含於可換組件的構成元件、且為具有標識9的構成元件(例如,在樹脂成形模具的模穴區塊、柵片(gate piece)等)。 In addition, the above-mentioned processing can also be used to make the replaceable module itself with the mark 9. It is also possible to use the various processes described above to produce a constituent element included in a replaceable component and having a mark 9 (for example, in a cavity block of a resin molding die, a gate piece, etc.).

作為微細圖案,可使用條碼、矩陣式二維條碼等既有的編碼。亦可使用製造裝置的製造者、使用者等適當訂定之微細圖案。例如,使微細圖案所具有的凹凸分別對應於「0」及「1」(或是「1」及「0」),可以藉由連續8個凹凸顯示1位元組(8位元)的資訊。使微細圖案所具有的凹凸分別對應於摩斯密碼的長點及短點(或是短點及長點),可以藉由摩斯密碼顯示資訊。亦可將摩斯密碼本身形成於可換組件。其他例如訂定構成條碼中的一條(bar)的點(dot)的數量、或是構成二維條碼中的一個構成元件的點(dot)的數量作為適當數量的凹或凸,使其帶有這些凹或凸的數量的意思。 As the fine pattern, existing codes such as a bar code and a matrix two-dimensional bar code can be used. It is also possible to use a fine pattern appropriately determined by a manufacturer or a user of the manufacturing apparatus. For example, by making the unevenness of the fine pattern correspond to "0" and "1" (or "1" and "0"), one byte (8 bits) of information can be displayed by eight consecutive unevennesses. . The irregularities of the fine pattern correspond to the long and short points (or short and long points) of the Morse code, respectively, and information can be displayed by the Morse code. The Morse code itself can also be formed in a replaceable component. Others, for example, determine the number of dots that make up a bar in a bar code, or the number of dots that make up a component in a two-dimensional bar code as an appropriate number of concavities or convexities, so that they have The meaning of these concave or convex numbers.

作為微細圖案,在藉由微細加工而加工而成的凹凸以外,亦可使用藉由微細加工而加工而成的圖樣本身、影像本身。例如先對應於複數個種類的圖樣、影像等賦予各種資訊的意思,藉由辨識這些圖樣、影像等,可以讀取對應的資訊。 As the fine pattern, in addition to the concavities and convexities processed by microfabrication, a drawing sample body and an image itself processed by microfabrication may be used. For example, the meanings of various kinds of information corresponding to a plurality of types of patterns, images, etc. are given first, and by identifying these patterns, images, etc., the corresponding information can be read.

關於藉由微細加工而加工而成的圖樣本身、影像 本身,包含用於特定可換組件的製造者、販賣者、關於可換組件的勞務的提供者等(以下稱為「關於可換組件的出處」)之圖樣、影像、文字等。作為微細圖案的這些圖樣、影像、文字等,亦可使用具有顯示關於可換組件的出處之功能的標識,例如公司名稱等的商號、商標(包含註冊商標)。具有顯示關於可換組件的出處之功能的標識亦可包含於微細圖案。 About the sample body and image processed by micro processing In itself, it includes drawings, images, texts, etc. for the manufacturers, sellers, and service providers of replaceable components of the specified replaceable components (hereinafter referred to as "the source of the replaceable components"). These drawings, images, texts, etc., which are fine patterns, may also use a logo having a function of displaying the source of the replaceable component, such as a company name such as a company name, a trademark (including a registered trademark). The logo with the function of showing the source of the replaceable component can also be included in the fine pattern.

此外,根據本發明,可以是以下的實施例。根據此實施例,從可換組件的標識取得特定可換組件的資訊,作為第一資訊。基於從第一資訊取得的可換組件的歷程資訊(第二資訊)、換言之基於第一資訊取得的可換組件的歷程資訊,可以追蹤已被製造的物品的歷程(例如製造年月日、物品的批號、用於製造的製造裝置及可換組件等)。關於已使用此可換組件而製造的物品的歷程之資訊(物品歷程資訊;第三資訊),是被記憶於例如用於由樹脂密封裝置1或成形模具6的使用者(user)管理半導體製程全體的伺服器所具有的記憶部、樹脂密封裝置1的控制部8所具有的記憶部ME(請參考第1A圖、第1B圖)等。根據本實施例,例如製造裝置或可換組件的使用者(user),可以將從可換組件所具有的標識取得的歷程資訊(可換組件歷程資訊;第二資訊),作為推導顯示已使用此可換組件製造的物品的可追蹤性(traceability)的物品歷程資訊(第三資訊)之資訊使用。 In addition, according to the present invention, the following embodiments are possible. According to this embodiment, information of a specific replaceable component is obtained from the identification of the replaceable component as the first information. Based on the history information of the replaceable component (second information) obtained from the first information, in other words, the history information of the replaceable component obtained based on the first information, it is possible to track the history of the item that has been manufactured (such as the date of manufacture, the item Batch number, manufacturing equipment used for manufacturing and replaceable components, etc.). Information about the history of the articles manufactured using this replaceable component (item history information; third information) is memorized in, for example, a user who manages the semiconductor process by the resin sealing device 1 or the molding die 6 A memory unit included in the entire server, a memory unit ME included in the control unit 8 of the resin sealing device 1 (see FIGS. 1A and 1B), and the like. According to this embodiment, for example, a user of a manufacturing device or a replaceable component can use the history information (changeable component history information; second information) obtained from the identification possessed by the replaceable component as a deduction to show that it has been used. The use of information of the item traceability information (third information) of the traceability of the items manufactured by this replaceable component.

本發明,並未被限定於上述實施例的內容,只要未脫離本發明的要旨的範圍內,可以依需求任意且適當地變更‧選擇而採用。 The present invention is not limited to the contents of the above-mentioned embodiments, and may be arbitrarily and appropriately changed and selected according to needs as long as it does not deviate from the scope of the gist of the present invention.

1‧‧‧樹脂密封裝置(製造裝置) 1‧‧‧resin sealing device (manufacturing device)

2‧‧‧固定盤 2‧‧‧Fixed plate

3‧‧‧可動盤 3‧‧‧Movable plate

4‧‧‧固定模具(可換組件) 4‧‧‧Fixed mold (replaceable components)

5‧‧‧可動模具(可換組件) 5‧‧‧ Movable mold (replaceable components)

6‧‧‧成形模具(可換組件) 6‧‧‧Forming mold (replaceable components)

7‧‧‧驅動機構 7‧‧‧Drive mechanism

8‧‧‧控制部 8‧‧‧Control Department

9‧‧‧標識(另一組件) 9‧‧‧ Logo (another component)

10‧‧‧資訊讀取工具(資訊讀取部) 10‧‧‧Information Reading Tool (Information Reading Department)

DE‧‧‧解讀部 DE‧‧‧Interpretation Department

J‧‧‧判別部 J‧‧‧Discrimination Department

M‧‧‧成形模組 M‧‧‧forming module

ME‧‧‧記憶部 ME‧‧‧Memory Department

Claims (36)

一種物品之製造裝置,其特徵在於包括:至少一個可換組件,其包含於物品之製造裝置,按照從材料製造的上述物品的種類而被替換;標識,設在上述可換組件;圖案,形成於上述標識;讀取部,光學式地讀取上述圖案;解讀部,基於被讀取的上述圖案,取得含有特定上述可換組件的資訊的第一資訊;控制部,基於已被預先記憶且至少包含特定上述可換組件的資訊之第二資訊,控制上述製造裝置的動作;以及判別部,比較上述第一資訊與上述第二資訊而進行判別;其中上述控制部在基於上述判別的結果,上述可換組件對於上述第二資訊為適合時,控制上述製造裝置而使上述製造裝置動作;上述控制部在基於上述判別的結果,上述可換組件對於上述第二資訊為不適合時,控制上述製造裝置而使上述製造裝置顯示以下事項:上述可換組件對於上述第二資訊為不適合;以及形成於上述標識的上述圖案,包含藉由電鑄加工形成的電鑄品所具有的凹凸所構成的圖案。 An article manufacturing device, comprising: at least one replaceable component, which is included in the article manufacturing device, and is replaced according to the type of the above-mentioned article manufactured from materials; a logo is provided on the above-mentioned replaceable component; and a pattern is formed The reading unit reads the pattern optically; the reading unit obtains the first information containing the information of the specific replaceable component based on the read pattern; the control unit, based on the information previously stored and Second information that includes at least information specific to the replaceable component to control the operation of the manufacturing device; and a discrimination unit that compares the first information with the second information to determine; wherein the control unit is based on a result of the discrimination, When the replaceable component is suitable for the second information, control the manufacturing device to make the manufacturing device operate; based on the result of the determination, the control unit controls the manufacturing when the replaceable component is not suitable for the second information. Device to cause the manufacturing device to display the following: News unsuitable; and forming the pattern on the marker, the pattern comprising electroformed article has irregularities formed by the electroforming process configuration. 如申請專利範圍第1項所述之物品之製造裝置,其中上述控制部在基於上述判別的結果,上述可換組件對於上述第 二資訊為不適合時,控制上述製造裝置而使上述製造裝置不動作。 According to the device for manufacturing an article according to item 1 of the scope of patent application, wherein the control unit is based on the result of the determination, the replaceable component is When the two pieces of information are not suitable, the manufacturing device is controlled so that the manufacturing device does not operate. 如申請專利範圍第2項所述之物品之製造裝置,其中上述控制部控制上述製造裝置而使上述製造裝置不動作後,按照已接收的訊號,控制上述製造裝置而使上述製造裝置動作。 According to the manufacturing apparatus of the article described in the second item of the patent application scope, wherein the control unit controls the manufacturing apparatus so that the manufacturing apparatus does not operate, and then controls the manufacturing apparatus to operate the manufacturing apparatus according to the received signal. 如申請專利範圍第1項所述之物品之製造裝置,其中上述可換組件包含單個可換組件或複數個可換組件;在上述單個可換組件或上述複數個可換組件的各自的既定位置設有上述標識;上述讀取部具有受光部、導光部與影像取得部;以及至少上述受光部是分別對應於上述既定位置而設置。 The device for manufacturing an article according to item 1 of the scope of patent application, wherein the replaceable component includes a single replaceable component or a plurality of replaceable components; at the respective predetermined positions of the single replaceable component or the plurality of replaceable components The sign is provided; the reading section includes a light receiving section, a light guide section, and an image acquisition section; and at least the light receiving section is provided corresponding to each of the predetermined positions. 如申請專利範圍第1項所述之物品之製造裝置,其中上述可換組件包含單個可換組件或複數個可換組件;在上述單個可換組件或上述複數個可換組件的各自的既定位置設有上述標識;上述讀取部具有受光部、導光部與影像取得部;以及至少上述受光部藉由移動,上述受光部分別對於上述單個可換組件或上述複數個可換組件而被共通使用。 The device for manufacturing an article according to item 1 of the scope of patent application, wherein the replaceable component includes a single replaceable component or a plurality of replaceable components; at the respective predetermined positions of the single replaceable component or the plurality of replaceable components The above-mentioned sign is provided; the reading section has a light receiving section, a light guiding section, and an image obtaining section; and at least the light receiving section is moved, and the light receiving section is common to the single replaceable component or the plurality of replaceable components, respectively. use. 如申請專利範圍第5項所述之物品之製造裝置,其中至少上述受光部是被設置於搬運機構,上述搬運機構具有將上述材料供應至上述可換組件的功能與將上述物品從上述可換組件搬出的功能中的至少任一個功能;以及上述受光部是藉由上述搬運機構而移動至上述既定位置。 The device for manufacturing an article according to item 5 of the scope of patent application, wherein at least the light receiving unit is provided in a conveying mechanism, and the conveying mechanism has a function of supplying the material to the replaceable component and removing the item from the replaceable. At least one of the functions of carrying out a module; and the light receiving unit is moved to the predetermined position by the conveyance mechanism. 如申請專利範圍第4項所述之物品之製造裝置,其中上述影像取得部是被設在遠離上述單個可換組件或上述複數個可換組件的位置;以及上述受光部與上述影像取得部是藉由上述導光部而光學性連接。 The device for manufacturing an article according to item 4 of the scope of patent application, wherein the image acquisition section is located away from the single replaceable component or the plurality of replaceable components; and the light receiving section and the image acquisition section are It is optically connected by the light guide unit. 一種物品之製造裝置,其特徵在於包括:至少一個可換組件,其包含於物品之製造裝置,按照從材料製造的上述物品的種類而被替換;標識,設在上述可換組件;圖案,形成於上述標識;讀取部,光學式地讀取上述圖案;解讀部,基於被讀取的上述圖案,取得含有特定上述可換組件的資訊的第一資訊;控制部,基於已被預先記憶且至少包含特定上述可換組件的資訊之第二資訊,控制上述製造裝置的動作;以及判別部,比較上述第一資訊與上述第二資訊而進行判別;其中上述控制部在基於上述判別的結果,上述可換組件對於上述第二資訊為適合時,控制上述製造裝置而使上述製造裝置動作;上述控制部在基於上述判別的結果,上述可換組件對於上述第二資訊為不適合時,控制上述製造裝置而使上述製造裝置顯示以下事項:上述可換組件對於上述第二資訊為不適合; 形成於上述標識的上述圖案,包含藉由加工形成的圖案;以及上述加工包含機械加工、雷射加工、蝕刻加工、使膜附著於標識的表面之加工與使用三維印表機之加工,上述機械加工包含切削加工、噴擊(blast)加工與噴水(waterjet)加工。 An article manufacturing device, comprising: at least one replaceable component, which is included in the article manufacturing device, and is replaced according to the type of the above-mentioned article manufactured from materials; a logo is provided on the above-mentioned replaceable component; and a pattern is formed The reading unit reads the pattern optically; the reading unit obtains the first information containing the information of the specific replaceable component based on the read pattern; the control unit, based on the information previously stored and Second information that includes at least information specific to the replaceable component to control the operation of the manufacturing device; and a discrimination unit that compares the first information with the second information to determine; wherein the control unit is based on a result of the discrimination, When the replaceable component is suitable for the second information, control the manufacturing device to make the manufacturing device operate; based on the result of the determination, the control unit controls the manufacturing when the replaceable component is not suitable for the second information. Device to cause the manufacturing device to display the following: News is not suitable; The pattern formed on the logo includes a pattern formed by processing; and the processing includes machining, laser processing, etching processing, processing for attaching a film to the surface of the logo, and processing using a three-dimensional printer. Processing includes cutting processing, blast processing, and waterjet processing. 如申請專利範圍第8項所述之物品之製造裝置,其中上述控制部在基於上述判別的結果,上述可換組件對於上述第二資訊為不適合時,控制上述製造裝置而使上述製造裝置不動作。 According to the device for manufacturing an article according to item 8 of the scope of patent application, wherein the control unit controls the manufacturing device so that the manufacturing device does not operate when the replaceable component is not suitable for the second information based on a result of the determination. . 如申請專利範圍第9項所述之物品之製造裝置,其中上述控制部控制上述製造裝置而使上述製造裝置不動作後,按照已接收的訊號,控制上述製造裝置而使上述製造裝置動作。 According to item 9 of the scope of patent application, the control unit controls the manufacturing device so that the manufacturing device does not operate, and then controls the manufacturing device to operate the manufacturing device according to the received signal. 如申請專利範圍第8項所述之物品之製造裝置,其中上述可換組件包含單個可換組件或複數個可換組件;在上述單個可換組件或上述複數個可換組件的各自的既定位置設有上述標識;上述讀取部具有受光部、導光部與影像取得部;以及至少上述受光部是分別對應於上述既定位置而設置。 The device for manufacturing an article according to item 8 of the scope of patent application, wherein the replaceable component includes a single replaceable component or a plurality of replaceable components; at the respective predetermined positions of the single replaceable component or the plurality of replaceable components The sign is provided; the reading section includes a light receiving section, a light guide section, and an image acquisition section; and at least the light receiving section is provided corresponding to each of the predetermined positions. 如申請專利範圍第8項所述之物品之製造裝置,其中上述可換組件包含單個可換組件或複數個可換組件;在上述單個可換組件或上述複數個可換組件的各自的既定位置設有上述標識;上述讀取部具有受光部、導光部與影像取得部;以及 至少上述受光部藉由移動,上述受光部分別對於上述單個可換組件或上述複數個可換組件而被共通使用。 The device for manufacturing an article according to item 8 of the scope of patent application, wherein the replaceable component includes a single replaceable component or a plurality of replaceable components; at the respective predetermined positions of the single replaceable component or the plurality of replaceable components The above-mentioned logo is provided; the reading section has a light receiving section, a light guiding section, and an image obtaining section; and At least the light receiving unit is moved, and the light receiving unit is commonly used for the single replaceable component or the plurality of replaceable components, respectively. 如申請專利範圍第12項所述之物品之製造裝置,其中至少上述受光部是被設置於搬運機構,上述搬運機構具有將上述材料供應至上述可換組件的功能與將上述物品從上述可換組件搬出的功能中的至少任一個功能;以及上述受光部是藉由上述搬運機構而移動至上述既定位置。 The device for manufacturing an article according to item 12 of the scope of patent application, wherein at least the light receiving unit is provided in a conveying mechanism, and the conveying mechanism has a function of supplying the material to the replaceable component and removing the item from the replaceable. At least one of the functions of carrying out a module; and the light receiving unit is moved to the predetermined position by the conveyance mechanism. 如申請專利範圍第11項所述之物品之製造裝置,其中上述影像取得部是被設在遠離上述單個可換組件或上述複數個可換組件的位置;以及上述受光部與上述影像取得部是藉由上述導光部而光學性連接。 The device for manufacturing an article according to item 11 of the scope of patent application, wherein the image acquisition section is located away from the single replaceable component or the plurality of replaceable components; and the light receiving section and the image acquisition section are It is optically connected by the light guide unit. 如申請專利範圍第1至14項任一項所述之物品之製造裝置,其中上述可換組件包含單個模具或複數個模具。 The device for manufacturing an article according to any one of claims 1 to 14, wherein the replaceable component includes a single mold or a plurality of molds. 如申請專利範圍第1至14項任一項所述之物品之製造裝置,其中上述可換組件至少具有第一模具及與上述第一模具相對向的第二模具;以及包括驅動機構,至少使上述第一模具與上述第二模具相對移動。 The device for manufacturing an article according to any one of claims 1 to 14, wherein the replaceable component has at least a first mold and a second mold opposite to the first mold; and includes a driving mechanism at least The first mold is relatively moved with the second mold. 如申請專利範圍第1至14項任一項所述之物品之製造裝置,包括:可換組件模組,其設有至少上述可換組件;以及接收模組,接收上述材料;其中 上述可換組件模組,相對於上述接收模組為可裝卸;以及上述可換組件模組,相對於其他的可換組件模組為可裝卸。 The device for manufacturing an article according to any one of claims 1 to 14, including: a replaceable module module provided with at least the above-mentioned replaceable module; and a receiving module to receive the above materials; wherein The replaceable component module is removable with respect to the receiving module; and the replaceable component module is removable with respect to other replaceable component modules. 如申請專利範圍第1至14項任一項所述之物品之製造裝置,包括由形成有上述圖案的另一個組件構成的上述標識,其中上述另一個組件是被固定於上述可換組件。 The device for manufacturing an article according to any one of claims 1 to 14 of the scope of patent application, includes the above-mentioned logo formed by another component formed with the above-mentioned pattern, wherein the another component is fixed to the replaceable component. 一種物品之製造方法,是藉由使用製造裝置而從材料製造物品之製造方法,其特徵在於包括:準備至少一個可換組件的步驟,上述至少一個可換組件包含於上述製造裝置,按照製造的上述物品的種類而被替換;準備標識的步驟,上述標識設在上述可換組件;使用讀取部而光學式地讀取預先形成在上述標識的圖案的步驟;基於被讀取的上述圖案而取得第一資訊的步驟,上述第一資訊含有特定上述可換組件的資訊;讀出已被預先記憶且至少包含特定上述可換組件的資訊之第二資訊的步驟;比較上述第一資訊與上述第二資訊而進行判別的步驟;基於上述判別的結果,上述可換組件對於上述第二資訊為適合時,控制上述製造裝置而使上述製造裝置動作的步驟;以及基於上述判別的結果,上述可換組件對於上述第二資訊為不適合時,控制上述製造裝置而使上述製造裝置顯示以下事項的步驟:上述可換組件對於上述第二資訊為不適合; 其中在準備上述標識的步驟,是準備包含電鑄品之上述標識,上述電鑄品具有藉由電鑄加工形成的凹凸所構成的圖案。 An article manufacturing method is a method for manufacturing an article from a material by using a manufacturing device, which is characterized by comprising the steps of preparing at least one replaceable component, the at least one replaceable component included in the manufacturing device, The type of the item is replaced; a step of preparing a mark, the mark is provided on the replaceable component; a step of optically reading a pattern formed in advance on the mark using a reading section; and based on the read pattern, A step of obtaining first information, wherein the first information contains information specifying the replaceable component; a step of reading out second information which has been memorized in advance and contains at least information specific to the replaceable component; comparing the first information with the above A step of determining based on the second information; a step of controlling the manufacturing apparatus to operate the manufacturing apparatus when the replaceable component is suitable for the second information based on a result of the discrimination; and a step based on the result of the discrimination When the replacement module is not suitable for the second information, control the manufacturing device Display means for producing the following steps: the above-described assembly to said second transducer may be unsuitable information; In the step of preparing the logo, the logo including the electroformed product is prepared, and the electroformed product has a pattern composed of irregularities formed by electroforming. 如申請專利範圍第19項所述之物品之製造方法,包含:基於上述判別的結果,上述可換組件對於上述第二資訊為不適合時,控制上述製造裝置而使上述製造裝置不動作的步驟。 The method for manufacturing an article as described in item 19 of the scope of patent application, includes the step of controlling the manufacturing apparatus so that the manufacturing apparatus does not operate when the replaceable component is not suitable for the second information based on a result of the determination. 如申請專利範圍第20項所述之物品之製造方法,包含:控制上述製造裝置而使上述製造裝置不動作後,按照已接收的訊號,控制上述製造裝置而使上述製造裝置動作的步驟。 The method for manufacturing an article according to item 20 of the scope of patent application, includes the steps of controlling the manufacturing apparatus to prevent the manufacturing apparatus from operating, and then controlling the manufacturing apparatus to operate the manufacturing apparatus according to a received signal. 如申請專利範圍第19項所述之物品之製造方法,包含:在上述讀取部準備受光部、導光部與影像取得部的步驟;其中上述可換組件包含單個可換組件或複數個可換組件;在上述單個可換組件或上述複數個可換組件的各自的既定位置設有上述標識;以及在光學式地讀取上述圖案的步驟,是使用分別設於上述單個可換組件或上述複數個可換組件的上述受光部,讀取上述第一資訊。 The method for manufacturing an article as described in item 19 of the scope of patent application, includes the steps of preparing a light receiving section, a light guiding section, and an image obtaining section in the reading section; wherein the replaceable component includes a single replaceable component or a plurality of replaceable components Change the component; set the above-mentioned logo at each predetermined position of the single replaceable component or the plurality of replaceable components; and the step of optically reading the pattern is to use the separate replaceable component or the The light receiving units of the plurality of replaceable components read the first information. 如申請專利範圍第19項所述之物品之製造方法,包含:在上述讀取部準備受光部、導光部與影像取得部的步驟;其中上述可換組件是單個可換組件或複數個可換組件; 在上述單個可換組件或上述複數個可換組件的各自的既定位置設有上述標識;以及在光學式地讀取上述圖案的步驟,是使用共通設於上述單個可換組件或上述複數個可換組件的上述受光部,讀取上述第一資訊。 The method for manufacturing an article as described in item 19 of the scope of patent application, including: the steps of preparing a light receiving section, a light guiding section, and an image obtaining section in the reading section; wherein the replaceable component is a single replaceable component or a plurality of replaceable components Change components The aforementioned mark is provided on each of the predetermined positions of the single replaceable component or the plurality of replaceable components; and the step of optically reading the pattern is to use a common arrangement on the single replaceable component or the plurality of replaceable components. The light receiving unit of the module is changed to read the first information. 如申請專利範圍第23項所述之物品之製造方法,其中上述準備受光部、導光部與影像取得部的步驟,具有:在遠離上述單個可換組件或上述複數個可換組件的位置,準備上述影像取得部的步驟;在搬運機構準備上述受光部的步驟,上述搬運機構具有將材料供應至上述可換組件的功能與將上述物品從上述可換組件搬出的功能中的至少任一個功能;以及準備上述導光部的步驟,上述導光部光學性連接上述受光部與上述影像取得部;其中在光學式地讀取上述圖案的步驟,是藉由使上述搬運機構移動而使上述受光部移動至上述既定位置。 The method for manufacturing an article as described in item 23 of the scope of patent application, wherein the step of preparing the light receiving section, the light guiding section, and the image obtaining section has a position far from the single replaceable component or the multiple replaceable components, A step of preparing the image acquisition section; a step of preparing the light receiving section in a conveying mechanism, the conveying mechanism having at least one of a function of supplying materials to the replaceable module and a function of moving the article out of the replaceable module And a step of preparing the light guiding unit, the light guiding unit optically connecting the light receiving unit and the image acquisition unit; wherein the step of optically reading the pattern is to move the transport mechanism to the light receiving unit. The part moves to the above-mentioned predetermined position. 如申請專利範圍第22項所述之物品之製造方法,其中上述準備受光部、導光部與影像取得部的步驟,具有:在遠離上述單個可換組件或上述複數個可換組件的位置,準備上述影像取得部的步驟;以及準備上述導光部的步驟,上述導光部光學性連接上述受光部與上述影像取得部。 The method for manufacturing an article according to item 22 of the scope of patent application, wherein the step of preparing the light-receiving section, the light-guiding section, and the image acquisition section has a position far from the single replaceable component or the multiple replaceable components, A step of preparing the image acquisition section; and a step of preparing the light guide section, the light guide section optically connects the light receiving section and the image acquisition section. 一種物品之製造方法,是藉由使用製造裝置而從材料製造物品之製造方法,其特徵在於包括: 準備至少一個可換組件的步驟,上述至少一個可換組件包含於上述製造裝置,按照製造的上述物品的種類而被替換;準備標識的步驟,上述標識設在上述可換組件;使用讀取部而光學式地讀取預先形成在上述標識的圖案的步驟;基於被讀取的上述圖案而取得第一資訊的步驟,上述第一資訊含有特定上述可換組件的資訊;讀出已被預先記憶且至少包含特定上述可換組件的資訊之第二資訊的步驟;比較上述第一資訊與上述第二資訊而進行判別的步驟;基於上述判別的結果,上述可換組件對於上述第二資訊為適合時,控制上述製造裝置而使上述製造裝置動作的步驟;以及基於上述判別的結果,上述可換組件對於上述第二資訊為不適合時,控制上述製造裝置而使上述製造裝置顯示以下事項的步驟:上述可換組件對於上述第二資訊為不適合;其中在準備上述標識的步驟,是準備包含藉由加工形成的圖案之上述標識;以及上述加工包含機械加工、雷射加工、蝕刻加工、使膜附著於標識的表面之加工與使用三維印表機之加工,上述機械加工包含切削加工、噴擊加工與噴水加工。 An article manufacturing method is a method for manufacturing an article from a material by using a manufacturing device, which is characterized by including: The step of preparing at least one replaceable component, the at least one replaceable component is included in the manufacturing device, and is replaced according to the type of the article manufactured; the step of preparing a mark, the mark is provided on the replaceable component; using a reading section The step of optically reading the pattern previously formed on the logo; the step of obtaining first information based on the pattern being read, the first information containing information specifying the replaceable component; the reading has been previously stored And at least a step of second information specifying the information of the replaceable component; a step of comparing the first information with the second information to determine; based on a result of the determination, the replaceable component is suitable for the second information A step of controlling the manufacturing device to cause the manufacturing device to operate; and a step of controlling the manufacturing device to cause the manufacturing device to display the following items when the replaceable component is not suitable for the second information based on the result of the determination: The above-mentioned replaceable component is not suitable for the above-mentioned second information; The identification step is to prepare the above-mentioned logo including a pattern formed by processing; and the above-mentioned processing includes mechanical processing, laser processing, etching processing, processing for attaching a film to the surface of the logo, and processing using a three-dimensional printer. Machining includes cutting, blasting, and water jetting. 如申請專利範圍第26項所述之物品之製造方法,包含:基於上述判別的結果,上述可換組件對於上述第二資訊為 不適合時,控制上述製造裝置而使上述製造裝置不動作的步驟。 According to the method for manufacturing an article as described in item 26 of the scope of patent application, including: based on the result of the above determination, the replaceable component has the following second information for the second information: When it is not suitable, a step of controlling the manufacturing apparatus to prevent the manufacturing apparatus from operating. 如申請專利範圍第27項所述之物品之製造方法,包含:控制上述製造裝置而使上述製造裝置不動作後,按照已接收的訊號,控制上述製造裝置而使上述製造裝置動作的步驟。 The method for manufacturing an article as described in item 27 of the scope of patent application, includes the steps of controlling the manufacturing apparatus to prevent the manufacturing apparatus from operating, and then controlling the manufacturing apparatus to operate the manufacturing apparatus according to a received signal. 如申請專利範圍第26項所述之物品之製造方法,包含:在上述讀取部準備受光部、導光部與影像取得部的步驟;其中上述可換組件包含單個可換組件或複數個可換組件;在上述單個可換組件或上述複數個可換組件的各自的既定位置設有上述標識;以及在光學式地讀取上述圖案的步驟,是使用分別設於上述單個可換組件或上述複數個可換組件的上述受光部,讀取上述第一資訊。 The method for manufacturing an article as described in item 26 of the scope of patent application, including: the steps of preparing a light receiving section, a light guiding section, and an image acquiring section in the reading section; wherein the replaceable module includes a single replaceable module or a plurality of replaceable modules. Change the component; set the above-mentioned logo at each predetermined position of the single replaceable component or the plurality of replaceable components; and the step of optically reading the pattern is to use the separate replaceable component or the The light receiving units of the plurality of replaceable components read the first information. 如申請專利範圍第26項所述之物品之製造方法,包含:在上述讀取部準備受光部、導光部與影像取得部的步驟;其中上述可換組件是單個可換組件或複數個可換組件;在上述單個可換組件或上述複數個可換組件的各自的既定位置設有上述標識;以及在光學式地讀取上述圖案的步驟,是使用共通設於上述單個可換組件或上述複數個可換組件的上述受光部,讀取上述第一資訊。 The method for manufacturing an article as described in item 26 of the scope of patent application, including: the steps of preparing a light receiving section, a light guiding section, and an image acquiring section in the reading section; wherein the replaceable component is a single replaceable component or a plurality of replaceable components Change the component; set the above-mentioned mark at the respective predetermined position of the above-mentioned single replaceable component or the above-mentioned multiple replaceable components; and the step of optically reading the above-mentioned pattern is to commonly use the single-changeable component or the above-mentioned The light receiving units of the plurality of replaceable components read the first information. 如申請專利範圍第30項所述之物品之製造方法,其中上述準備受光部、導光部與影像取得部的步驟,具有:在遠離上述單個可換組件或上述複數個可換組件的位置,準備上述影像取得部的步驟;在搬運機構準備上述受光部的步驟,上述搬運機構具有將材料供應至上述可換組件的功能與將上述物品從上述可換組件搬出的功能中的至少任一個功能;以及準備上述導光部的步驟,上述導光部光學性連接上述受光部與上述影像取得部;其中在光學式地讀取上述圖案的步驟,是藉由使上述搬運機構移動而使上述受光部移動至上述既定位置。 The method for manufacturing an article according to item 30 of the scope of patent application, wherein the step of preparing the light receiving section, the light guiding section, and the image obtaining section has a position far from the single replaceable component or the multiple replaceable components, A step of preparing the image acquisition section; a step of preparing the light receiving section in a conveying mechanism, the conveying mechanism having at least one of a function of supplying materials to the replaceable module and a function of moving the article out of the replaceable module And a step of preparing the light guiding unit, the light guiding unit optically connecting the light receiving unit and the image acquisition unit; wherein the step of optically reading the pattern is to move the transport mechanism to the light receiving unit. The part moves to the above-mentioned predetermined position. 如申請專利範圍第29項所述之物品之製造方法,其中上述準備受光部、導光部與影像取得部的步驟,具有:在遠離上述單個可換組件或上述複數個可換組件的位置,準備上述影像取得部的步驟;以及準備上述導光部的步驟,上述導光部光學性連接上述受光部與上述影像取得部。 The method for manufacturing an article according to item 29 of the scope of patent application, wherein the step of preparing the light receiving section, the light guiding section, and the image acquiring section has a position far from the single replaceable component or the multiple replaceable components, A step of preparing the image acquisition section; and a step of preparing the light guide section, the light guide section optically connects the light receiving section and the image acquisition section. 如申請專利範圍第19至32項任一項所述之物品之製造方法,包括準備包含於上述可換組件的單個模具或複數個模具的步驟。 The method for manufacturing an article according to any one of claims 19 to 32, including the step of preparing a single mold or a plurality of molds included in the above-mentioned replaceable component. 如申請專利範圍第19至32項任一項所述之物品之製造方法,包括:準備包含於上述可換組件的第一模具、與包含於上述可換組件且與上述第一模具相對向的第二模具的步驟;以及 控制驅動機構的步驟,上述驅動機構至少使上述第一模具與上述第二模具相對移動。 The method for manufacturing an article according to any one of claims 19 to 32, comprising: preparing a first mold included in the replaceable component, and a first mold included in the replaceable component and facing the first mold. Steps of the second mold; and A step of controlling the driving mechanism, the driving mechanism moving at least the first mold and the second mold relatively. 如申請專利範圍第19至32項任一項所述之物品之製造方法,包括:準備可換組件模組與接收模組的步驟,上述可換組件模組設有至少上述可換組件,上述接收模組接收上述材料;其中上述可換組件模組,相對於上述接收模組為可裝卸;以及上述可換組件模組,相對於其他的可換組件模組為可裝卸。 The method for manufacturing an article as described in any one of claims 19 to 32, including the steps of preparing a replaceable component module and a receiving module, the replaceable component module is provided with at least the replaceable component, and the above The receiving module receives the above materials; wherein the replaceable component module is removable with respect to the receiving module; and the replaceable component module is removable with respect to other replaceable component modules. 如申請專利範圍第19至32項任一項所述之物品之製造方法,其中在準備上述標識的步驟,是準備由被固定於上述可換組件的另一個組件構成的上述標識。 According to the method for manufacturing an article according to any one of claims 19 to 32, in the step of preparing the above-mentioned mark, the above-mentioned mark composed of another component fixed to the replaceable component is prepared.
TW105113044A 2015-04-29 2016-04-27 Article manufacturing device and manufacturing method TWI616247B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015092475A JP6566706B2 (en) 2015-04-29 2015-04-29 Article manufacturing apparatus and method

Publications (2)

Publication Number Publication Date
TW201711771A TW201711771A (en) 2017-04-01
TWI616247B true TWI616247B (en) 2018-03-01

Family

ID=57198359

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105113044A TWI616247B (en) 2015-04-29 2016-04-27 Article manufacturing device and manufacturing method

Country Status (5)

Country Link
JP (1) JP6566706B2 (en)
KR (1) KR20170141194A (en)
CN (1) CN107530913B (en)
TW (1) TWI616247B (en)
WO (1) WO2016175056A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6894285B2 (en) * 2017-04-26 2021-06-30 Towa株式会社 Resin molding equipment and manufacturing method of resin molded products
CN110961970B (en) * 2018-09-28 2022-05-03 兄弟工业株式会社 Control device, machining device, control method, and conveyance control program
KR102084964B1 (en) * 2019-06-28 2020-03-05 리얼룩앤컴퍼니 주식회사 3d forming film production device with foaming film identification function and method for manufacturing 3d forming film using the same
JP7003184B2 (en) * 2020-06-22 2022-01-20 Towa株式会社 Resin molding equipment and manufacturing method of resin molded products
CN114055728A (en) * 2021-11-09 2022-02-18 东莞市巨成模具有限公司 Plastic mould core-pulling device
KR102470320B1 (en) 2022-01-26 2022-11-25 이미아 method for providing analysis image by measuring biometric information, and apparatus for testing the same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06246894A (en) * 1993-02-24 1994-09-06 Kyushu Hitachi Maxell Ltd Manufacture of screen printing block
TW200638050A (en) * 2005-04-27 2006-11-01 Advanced Semiconductor Eng Machine modifying procedure for IC testing machine
JP2009184220A (en) * 2008-02-06 2009-08-20 Dainippon Printing Co Ltd Mold, mold container and mold management system
CN102363354A (en) * 2011-11-02 2012-02-29 宁波安信数控技术有限公司 Mechanical-vision-based injection molding machine mold protecting system and method
TW201412488A (en) * 2012-09-26 2014-04-01 Prec Machinery Res & Dev Ct Self-power generation sensing module for thermal processing equipment, monitoring system having the same, and operating method of monitoring system

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2243618B (en) * 1990-05-04 1995-01-11 Scient Generics Ltd Improvements in the production process for making continuously electroformed thickness modulated or perforated metal foil
JPH07161745A (en) * 1993-12-02 1995-06-23 Hitachi Ltd Transfer molding machine for resin-sealed semiconductor device
JP3595572B2 (en) * 1994-05-11 2004-12-02 ファナック株式会社 Setup error detection method for injection molding machine
JP3943443B2 (en) * 2002-05-29 2007-07-11 Towa株式会社 Mold changer
JP4448869B2 (en) * 2007-07-02 2010-04-14 ウシオ電機株式会社 Mold monitoring device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06246894A (en) * 1993-02-24 1994-09-06 Kyushu Hitachi Maxell Ltd Manufacture of screen printing block
TW200638050A (en) * 2005-04-27 2006-11-01 Advanced Semiconductor Eng Machine modifying procedure for IC testing machine
JP2009184220A (en) * 2008-02-06 2009-08-20 Dainippon Printing Co Ltd Mold, mold container and mold management system
CN102363354A (en) * 2011-11-02 2012-02-29 宁波安信数控技术有限公司 Mechanical-vision-based injection molding machine mold protecting system and method
TW201412488A (en) * 2012-09-26 2014-04-01 Prec Machinery Res & Dev Ct Self-power generation sensing module for thermal processing equipment, monitoring system having the same, and operating method of monitoring system

Also Published As

Publication number Publication date
TW201711771A (en) 2017-04-01
JP6566706B2 (en) 2019-08-28
CN107530913B (en) 2019-09-27
JP2016210006A (en) 2016-12-15
CN107530913A (en) 2018-01-02
WO2016175056A1 (en) 2016-11-03
KR20170141194A (en) 2017-12-22

Similar Documents

Publication Publication Date Title
TWI616247B (en) Article manufacturing device and manufacturing method
TWI625215B (en) Article manufacturing device and manufacturing method
JP2016210007A5 (en)
JP2016210006A5 (en)
CN101116180B (en) Fixation carrier, production method of fixation carrier, use method of fixation carrier, and substrate reception container
JP6231188B2 (en) Traceability information management system and traceability information management method for component mounting line
KR20160048659A (en) Work suction plate, work cutting device, work cutting method and method of manufacturing work suction plate
CN1939716A (en) Silk screen printing device and printing system comprising same
JPWO2011125844A1 (en) Eyeglass lens marking device and eyeglass lens layout mark printing method
JP2019130832A (en) Injection molding method and molding device
CN207976914U (en) A kind of device automatically recording tire-mold vulcanized tyre quantity
JP2008254353A (en) Thermal transfer press molding apparatus and thermal transfer press mold
CN111981976B (en) Holding member, method of manufacturing the same, inspection mechanism, cutting device, and method of manufacturing holding object
KR20190110026A (en) Die bonding apparatus and manufacturing method of semiconductor device
CN203110246U (en) Devices for manufacturing objects with assistance of die-casting tool
WO2018099057A1 (en) A composite logo structure and manufacturing method thereof
JP2002046046A (en) Machining method for workpiece and pre-treatment device for workpiece
TWI660311B (en) Management system and management method
JP7026497B2 (en) How to post-treat glass tube semi-finished products
CN114311648A (en) Manufacturing method of three-dimensional object and consumable component
JP2019130834A (en) Injection molding method and molding device
CN220517832U (en) Jet printing equipment
US11839942B2 (en) Apparatus, method and system to temporarily hold a workpiece during manufacturing using adhesive attachment
CN109041441B (en) Batch management exposure method and exposure equipment for PCB
KR20240092597A (en) Semiconductor manufacturing apparatus, tool mounting method, and semiconductor device manufacturing method

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees