JPH06246894A - Manufacture of screen printing block - Google Patents

Abstract

PURPOSE:To improve the handling properties of an extremely thin electrodeposit metal mask by reinforcing a primary electrodeposit metal layer working as a metal mask by means of a secondary electrodeposit metal layer as a reinforcing plate, being released from a matrix and sticking in tension to a plate frame through an elastic support body. CONSTITUTION:A primary electrodeposit metal layer 10 working as either one of a metal mask 2 or a reinforcing plate 12 is electrodeposited on the surface not coated with a photoresist film 9 of a matrix 5 by the thickness less than that of the photoresist film 9. Then, a secondary electrodeposit metal layer 11 working as another reinforcing plate 12 or the metal mask 2 is electrodeposited on the surface of the primary electrodeposit metal layer 10 after being released. Then the primary electrodeposit metal layer 10 is released from the matrix 5 together with the secondary electrodeposit metal layer 11. Then, peripheral sections 2a of the primary electrodeposit layer 10 of the secondary electrodeposit metal layer 11 working as the metal mask is bonded to and fixed with an elastic support body 4 of a plate frame 3 in the state of attaching the secondary electrodeposit metal layer 10 or the primary electrodeposit metal layer 11 working as the reinforcing plate 12.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a screen printing plate composed of an electroformed metal mask, which is preferably used for screen printing of bar codes or IC or LSI printed wiring.

[0002]

2. Description of the Related Art A metal mask for screen printing manufactured by electroforming has excellent chemical resistance and abrasion resistance, and the dimensional change due to the printing pressure of a squeegee is extremely small. It is well known that you can do it.

[0003]

In recent years, it has been required to reduce the printing thickness of a bar code or the like for screen printing, and accordingly, the metal mask used for the screen printing is inevitable. Ultra thin, eg 10μ
Thick materials are required. However, when electroforming such an ultra-thin metal mask, the metal mask is easily deformed when it is peeled off from the mother die after electroforming, during transportation or transportation of the metal mask, or when it is attached to the plate frame. It is very difficult to handle because it is prone to wrinkles and wrinkles.

An object of the present invention is to enable ultrathin electroformed metal masks to be safely peeled from a mother die or attached to a plate frame without being deformed or dented, thereby facilitating handling. An object of the present invention is to provide a method for producing a screen printing plate that can be improved.

[0005]

According to the present invention, a metal mask is electroformed, and is formed by electrodeposition so that the metal mask can be peeled off as a reinforcement of the metal mask before the completion of attachment to the plate frame after electroforming. With the reinforcement plate still attached, the reinforcement plate is finally peeled off from the metal mask. That is, in the method for manufacturing a screen printing plate of the present invention, as shown in the manufacturing process in FIG. 1, first, the photoresist 6 is arranged on the surface of the matrix 5. Next, a print pattern film 7 is placed on the surface of the photoresist 6 and exposed to light, and then developed to form a photoresist film 9 having a print pattern thicker than the metal mask 2. Then, the primary electrodeposited metal layer 10 corresponding to either the metal mask 2 or the reinforcing plate 12 is formed on the surface of the matrix 5 not covered with the photoresist film 9 by the photoresist film 9
The thickness is less than or equal to the electrode thickness. Then, the other reinforcing plate 12
Alternatively, the secondary electrodeposited metal layer 11 corresponding to the metal mask 2
Is subjected to peeling treatment on the surface of the primary electrodeposited metal layer 10 and then electrodeposited. Then, from the master block 5 to the primary electrodeposited metal layer 1
0 is peeled off together with the secondary electrodeposited metal layer 11. Then, the primary electrodeposited metal layer 10 or the secondary electrodeposited metal layer 11 corresponding to the metal mask 2 is replaced with the secondary electrodeposited metal layer 1 corresponding to the reinforcing plate 12.
The peripheral portion 2a is bonded and fixed to the elastic support 4 of the plate frame 3 with the primary or primary electrodeposited metal layer 10 still attached. Finally, the secondary electrodeposition metal layer 11 or the primary electrodeposition metal layer 10 corresponding to the reinforcing plate 12 is peeled from the primary electrodeposition metal layer 10 or the secondary electrodeposition metal layer 11 corresponding to the metal mask 2.

[0006]

Function: Primary electrodeposited metal layer 10 corresponding to the metal mask 2
Alternatively, the secondary electrodeposited metal layer 11 corresponds to the reinforcing plate 12
Under the condition that the secondary electrodeposited metal layer 11 or the primary electrodeposited metal layer 10 is attached and reinforced, the secondary electrodeposited metal layer 11 or the primary electrodeposited metal layer 10 is peeled off, and the plate frame 3 is attached to the plate frame 3 through the elastic support 4 in a tensioned state. Even when the mask 2 is formed to be extremely thin, it is not necessary to add deformation or dents to it.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will be described with reference to FIGS. The screen printing plate obtained by the present invention,
As shown in FIGS. 2 and 3, a metal mask 2 having a large number of pattern holes 1 patterned into a desired printing pattern such as a bar code by electroforming and a plate frame 3 are formed.
And the elastic support 4 made of nylon or polyester fiber mesh for attaching the metal mask 2 to the plate frame 3 in a tensioned state, and the peripheral portion 2a surrounding the outer periphery of the pattern hole 1 of the metal mask 2 on all sides is elastic. It is polymerized and fixed to the support 4. In screen printing, ink or paste is placed on the metal mask 2 of the printing plate, and a squeegee is applied to eject the ink or paste downward from the pattern holes 1 to attach the ink or paste to an object to be printed. At this time, the metal mask 2
Due to the elasticity of the elastic support 4, the printing target is brought into contact with the printing target by the squeegee pressure, and after releasing the squeegee pressure, the plate is immediately released from the printing target by the elastic restoring force.

FIGS. 1A to 1H show process charts for obtaining such a screen printing plate. First, the metal mask 2 is electroformed, and at the same time, as a reinforcement of the metal mask 2, a reinforcing plate 12 is electrodeposited on one surface of the mask 2 in a peelable manner. In this electroforming, (A) of FIG.
As shown in, a photoresist 6 thicker than the thickness of the metal mask 2 is provided on the surface of the stainless master block 5.
Instead of laminating the photoresist 6 made of a film, a liquid photoresist can be applied. As these photoresists, for example, ALPHO321Y50 manufactured by Nippon Synthetic Chemical Industry Co., Ltd. is used.

Next, as shown in FIG. 3B, a desired print pattern film 7 of a mask for screen printing is brought into close contact with the photoresist 6, and each process of baking, developing and drying is carried out. As shown in (C), the photoresist film 9 having a desired print pattern is formed to be thicker than the metal mask 2.

Then, this is immersed in an electrodeposition tank, for example, a nickel sulfamate bath to perform nickel electroforming,
As shown in (D) of the figure, the photoresist film 9 of the matrix 5 is formed.
A primary electrodeposited metal layer 10 corresponding to the thin metal mask 2 is formed on the surface not covered with the electrode to a thickness of 10 μm, for example.

Then, the surface of the primary electrodeposited metal layer 10 is stripped with selenious acid, dichromic acid or the like, and then secondary electroforming is performed, as shown in FIG. A secondary electrodeposited metal layer 11 corresponding to the reinforcing plate 12 is formed on the surface of the electrodeposited metal layer 10.
Equal to or thicker than the thickness of the next electrodeposited metal layer 10,
For example, it is formed to a thickness of 30 μm.

After the secondary electroforming, the photoresist film 9 is removed with a sodium hydroxide solution or a commercially available photoresist removing solution, and then the primary electrodeposited metal layer 10 is secondary-coated as shown in FIG. The electrodeposited metal layer 11 is peeled off from the matrix 5. In this way, when the primary electrodeposited metal layer 10 is peeled off while being reinforced by the secondary electrodeposited metal layer 11, the primary electrodeposited metal layer 10 is peeled off.
It is no longer necessary to add deformation or dents to the.

After the peeling, the primary electrodeposited metal layer 10 corresponding to the metal mask 2 is attached to the plate frame 3. At this time, as shown in FIG. While the secondary electrodeposition metal layer 11 corresponding to the reinforcing plate 12 is attached, the peripheral portion 2a thereof is superposed on the elastic support 4 stretched in a tension state on the plate frame 3, and the area between the overlapping surfaces is photosensitive. It is bonded and fixed with a resin or an organic adhesive 13 (see FIG. 3). When connecting and fixing the peripheral portion 2a, as shown in FIGS. 2 and 3, if the connecting hole 14 is provided in the peripheral portion 2a at the same time as the patterning formation of the pattern hole 1, the adhesive 13 is embedded therein. It is possible to increase the bonding strength between the two 2a and 4a. Thus, even when the primary electrodeposited metal layer 10 corresponding to the metal mask 2 is overlaid on and bonded to the elastic support 4 of the plate frame 3, the primary electrodeposited metal layer 10 is the secondary electrodeposited metal layer. Since the process is performed with 11 attached, even if the primary electrodeposited metal layer 10 is thin, deformation or dents do not occur.

Finally, as shown in FIG. 1H, the secondary electrodeposited metal layer 11 is peeled off from the primary electrodeposited metal layer 10, and the elastic support 4 is bonded with the adhesive 13 by a cutter or the like. By cutting inside the peripheral portion 2a of the metal mask 2, the metal mask 2 is elastically supported by the plate frame 3 via the elastic support 4 in a tensioned state, and the screen printing plate as shown in FIGS. Obtainable. Further, the above-mentioned cutting step of the elastic support 4 may be performed before peeling off the secondary electrodeposited metal layer 11. In this case, the elastic support 4 is cut so that the metal mask 2 itself is cut by the elastic support 4. It is tensioned and fixed to the plate frame 3 and then the secondary electrodeposited metal layer 1
Even when peeling off 1, the primary electrodeposited metal layer 10 corresponding to the metal mask 2 is tensioned via the elastic support 4 and the plate frame 3
Since the second electrodeposition metal layer 11 is peeled off, the metal mask 2 itself is not dented or deformed.

After the surface of the primary electrodeposited metal layer 10 corresponding to the metal mask 2 is peeled off and before the secondary electroforming, as shown in FIG. 4, a peripheral portion 2a of the primary electrodeposited metal layer 10 is formed. If the insulating tape 15 is attached, the secondary electrodeposited metal layer 11 is not formed only on the insulating tape 15 during the secondary electroforming, so that in the subsequent process, the secondary electrodeposited metal layer 10 will not be formed. When peeling the deposited metal layer 11, the end 12a is easily grasped,
The peeling can be easily performed. Further, if the insulating tape 15 is attached in such a manner, the coupling hole 14 of the metal mask 2
When the adhesive 13 is used to bond the superposed portions of the peripheral portion 2 a having the edges and the elastic support 4 of the plate frame 3 with each other,
Insulation tape 1 should be projected from 4 to the surface opposite to the adhesive surface.
5 can be prevented, which is advantageous.

In the above embodiment, the metal mask 2 1
After forming the next electrodeposited metal layer 10, the secondary electrodeposited metal layer 11 to be the reinforcing plate 12 was formed. On the contrary, as shown in the manufacturing process diagram of FIG. It is also possible to form the primary electrodeposited metal layer 10 to be the reinforcing plate 12 ((D) of FIG. 5) and then to form the secondary electrodeposited metal layer 11 to be the metal mask 2 (( E)). In this case, a patterning step ((A) to (C) in the same figure), a peeling step from the mother die 5 ((F) in the same figure), and a step of connecting the plate frame 3 to the elastic support 4 (the same figure). (G)) and the step of peeling the reinforcing plate 12 ((H) in the figure) are the same as those in the above-mentioned embodiment. In the case of this embodiment, a step of polishing the surface of the secondary electrodeposited metal layer 11 to be the metal mask 2 may be added before peeling from the mother die 5, that is, after the step (E) in the figure. . Instead of nickel electroforming, nickel-cobalt alloy or the like may be used for electroforming.

[0017]

According to the present invention, the ultrathin metal mask 2
When electroforming, the reinforcing plate 12 is formed by electrodeposition so as to be separable so as to be overlapped with it, and the metal mask 2 is separated from the mother die 5 with the reinforcing plate 12 attached and is reinforced, or the plate frame 3
Since it is attached to the master mold 5, the peeling from the mother die 5, the transportation and transportation of the metal mask 2 and the attachment to the plate frame 3 can be safely and easily performed without fear of causing deformation or dents, and thin screen printing can be performed. It has come to be possible with high accuracy.

[Brief description of drawings]

FIG. 1 is a process drawing of a screen printing plate showing an embodiment of the present invention.

FIG. 2 is a plan view of a screen printing plate.

FIG. 3 is an enlarged sectional view taken along line XX in FIG.

FIG. 4 is a cross-sectional view showing a connection structure between a peripheral portion of a metal mask of a screen printing plate and an elastic support member before a reinforcing plate is peeled off.

FIG. 5 is a manufacturing process diagram of a screen printing plate showing another embodiment.

[Explanation of symbols]

 2 Metal Mask 3 Plate Frame 4 Elastic Support 5 Master 6 Photoresist 7 Printing Pattern Film 9 Photoresist Film 10 Primary Electrodeposited Metal Layer 11 Secondary Electrodeposited Metal Layer 12 Reinforcement Plate

Claims (1)

[Claims] 1. A step of disposing a photoresist 6 on the surface of a mother die 5, and a printing pattern film 7 is placed on the surface of the photoresist 6 and exposed, and then developed to develop a photoresist film 9 having a printing pattern on a metal. The step of forming the mask 2 thicker than the thickness of the mask 2 and the surface of the master electrode 5 not covered with the photoresist film 9 of the primary electrodeposited metal layer 10 corresponding to either the metal mask 2 or the reinforcing plate 12. First, a step of electrodeposition forming to a thickness of the photoresist film 9 or less, and a second electrodeposition metal layer 11 corresponding to the other reinforcing plate 12 or the metal mask 2 on the surface of the primary electrodeposition metal layer 10 is peeled off. A step of forming the electrodeposited metal layer 10 after the formation of the metal mask, a step of peeling the primary electrodeposited metal layer 10 together with the secondary electrodeposited metal layer 11 from the mother die 5, and a primary electrodeposited metal layer 10 corresponding to the metal mask 2. Or 2
The secondary electrodeposited metal layer 11 remains attached to the secondary electrodeposited metal layer 11 or the primary electrodeposited metal layer 10 corresponding to the reinforcing plate 12, and its peripheral portion 2a is attached to the elastic support 4 of the plate frame 3. The step of bonding and fixing, and the secondary electrodeposited metal layer 11 or the primary electrodeposited metal layer 10 corresponding to the reinforcing plate 12, the primary electrodeposited metal layer 10 or the secondary electrodeposited metal layer 11 corresponding to the metal mask 2. A method for producing a screen printing plate, which comprises a step of peeling from the screen.