JPH07331479A - Formation of electrodeposited image - Google Patents

Abstract

PURPOSE:To lower the stress to be added to electrodeposited images and to obtain the electrodeposited images having good image quality by executing peeling between a metallic sheet and a conductive film at the time of transferring the electrodeposited images formed on the conductive film surface to the pressure sensitive adhesive layer of a supporting substrate. CONSTITUTION:The conductive film 2 is formed on the surface of the metallic sheet 1 consisting of a stainless steel, etc., and the electrodeposited images are formed thereon. On the other hand, a resist is applied on the conductive film 2 and is exposed and developed to form conductive parts 8. The metal is deposited by an electrodeposition method on the conductive parts 8 to form the desired electrodeposited images 9, 10. The electrodeposited images 9, 10 are transferred onto the pressure sensitive adhesive layer 12 of the supporting substrate 11. At this time, the conductive film 2 is simultaneously peeled. Namely, the peeling is executed at the boundary between the conductive film 2 and the metallic sheet to peel the electrodeposited images 9, 10 while the images are held by the conductive film 2 and the supporting substrate 11. Scattering of the electrodeposited images 9, 10 is prevented and the electrodeposited images are produced at a good yield.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a timepiece, for example, after forming an image of a rose character or a decorative part for a watch by an electrodeposition method and transferring the image (electrodeposition image) to a support such as a film. The present invention relates to a method for forming an electrodeposition image to be attached to an adherend such as a display plate.

[0002]

2. Description of the Related Art Recently, for example, in articles having fine and complicated shapes such as rose letters for clocks and decorative parts, a resist film is formed on the surface of a metal plate except for these image forming portions. By forming a conductive part along the shape of these images on the surface of the metal plate, a metal is deposited on this conductive part by an electrodeposition method to form an electrodeposition image. Is transferred to and held on a supporting base material such as a film via an adhesive, and then this electrodeposited image is transferred to an adherend such as a timepiece display plate while being separated from the supporting base material via the adhesive. Is widely practiced.

In order to transfer an electrodeposited image onto a supporting substrate,
The electrodeposited image must be separated from the metal plate, but at this time, it is necessary to deform the supporting base material, deform the metal plate, or both at the same time. Whichever method is adopted, stress is applied to the electrodeposition image when the metal plate and the supporting base material are separated from each other. For example, as shown in FIG. 15, at the point of peeling, the electrodeposition image tries to maintain rigidity, but since the metal plate or the supporting base material is deformed, stress is added to the electrodeposition image and the electrodeposition image is temporarily Distorted. When the peeling is completed, the electro-deposited image instantly tries to return to its original shape, so that the electro-deposited image itself becomes a spring and scatters. Therefore, the electro-deposited image may not be transferred to the supporting base material and the yield may decrease.

Further, when excessive stress is applied to the electrodeposition image as described above, the stress remains in the electrodeposition image,
There is also a problem that the electrodeposited image (individual characters) may be deformed after being attached to the adherend.

Further, conventionally, since the electrodeposition image was directly formed on the metal plate, it was difficult to repeatedly use the metal plate. Further, since the surface roughness of the metal plate has a great influence on the surface roughness of the back surface of the electrodeposited image, a step of mirror-finishing the surface of the metal plate was necessary to obtain a smooth electrodeposition image of the back surface. . Similarly, if the surface of the metal plate is rough, the resist film used for forming the electrodeposition image does not adhere to the metal plate, which causes burrs around the obtained electrodeposition image.

[0006]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a method for forming an electrodeposited image, which enables an electrodeposited image to be easily produced with a high yield.

Another object of the present invention is to reduce the stress applied to the electrodeposition image when the electrodeposition image is transferred to the supporting base material, and prevent the deformation of the electrodeposition image that occurs after attachment to the adherend. I am trying.

A further object of the present invention is to provide a method for forming an electro-deposited image which allows a metal plate to be used semi-permanently. Still another object of the present invention is to provide a method for forming a high-quality electrodeposition image having a smooth back surface and no defects such as burrs without mirror-finishing the surface of the metal plate.

[0009]

In order to achieve the above object, the method for forming an electro-deposited image according to the present invention comprises forming a conductive film on the surface of a metal plate and forming an electro-deposited image on the surface of the conductive film. The electro-deposited image is peel-transferred from the metal plate together with the conductive coating to the pressure-sensitive adhesive layer of the supporting substrate provided with the pressure-sensitive adhesive layer, and the conductive coating is peeled from the electro-deposited image. Then, a fixing adhesive layer is formed on the exposed surface of the electrodeposition image, and the electrodeposition image is peeled from the supporting base material while the electrodeposition image is on the surface of the adherend through the fixing adhesive layer. It is characterized by being attached to.

Prior to the formation of the conductive coating, it is preferable to subject the surface of the metal plate to a mold release treatment, and before the formation of the electrodeposition image, a release treatment is applied to a portion of the conductive coating surface corresponding to the electrodeposition image. It is preferable to give it.

[0011]

According to the present invention constructed as described above, when the electrodeposited image is transferred to the pressure-sensitive adhesive layer of the supporting substrate, the metal plate and the conductive film are separated from each other, and The electrodeposited image formed on the coating is transferred onto the pressure sensitive adhesive layer of the supporting substrate. Since the conductive coating can be peeled off from the metal plate with a comparatively small force, no excessive stress is applied to the electrodeposited image. Therefore, no internal stress remains in the electrodeposited image, so that the electrodeposition image is not deformed after being attached to the adherend. Further, since the electro-deposited image is peeled off in a form sandwiched between the supporting base material and the conductive coating, even if stress is applied during peeling, the electro-deposited image does not scatter.

Further, according to this method, since the metal plate is hard to be deformed, it can be used semipermanently. Further, even if the surface of the metal plate is not mirror-finished, it is possible to manufacture a high-quality electrodeposition image having a smooth back surface and no defects such as burrs.

[0013]

Embodiments of the present invention will be described below with reference to the drawings. In the present embodiment, an example is shown in which rose characters for a watch are used as an electro-deposited image and are attached to the surface of a display plate (adherend) for a watch, but the present invention is not limited to the rose characters for a watch. It can be applied to the production of various decorative characters and symbols.

First, as shown in FIG. 1, a conductive coating 2 is formed on the surface of a metal plate 1 such as stainless steel. The conductive film 2 is a flexible thin film having conductivity. As such a conductive coating 2, a conductive metal thin film formed by electrolytic plating (electrodeposition) or electroless plating, a conductive coating film, a conductive polymer thin film, or the like is used, preferably conductive by electrodeposition. A thin metal film is used. Conductive film 2
The film thickness of is not particularly limited, but is usually 10 to 50 μm.
m, preferably about 20 to 30 μm.

The conductive coating 2 is peeled off from the surface of the metal plate 1 in a later step. Therefore, the conductive coating 2
In order to facilitate the peeling off, it is preferable that the surface of the metal plate 1 be subjected to a mold release treatment before the formation of the conductive coating film 2. The mold release treatment is performed by, for example, surface oxidation by anodic electrolysis, or by treating the surface of the metal plate 1 with a surfactant or the like.

Then, an electrodeposited image is formed on the surface of the conductive coating film 2 by a conventional method. This concrete method is disclosed in JP-A-5
No. 9-16989, Japanese Patent Laid-Open No. 3-107496, and the like. Without any limitation,
A general method for forming an electrodeposited image will be described below.

In this example, a rose character for a watch is used as an electro-deposited image, and the electro-deposited image is applied to the surface of a watch display plate (adherend). First, as shown in FIG. Photomask film for negative or positive electrodeposition image 3
To create a photo or print.

What is shown in the figure is a positive film,
On this film 3, a target image FIG. 4 constituting roses for letters 3, 6, 9 and 12 and a rectangular frame-shaped guide image FIG. 5 surrounding the target image FIG. (Indicated by diagonal lines in FIG. 5) is drawn in black ink or the like, and the guide mark 6 is drawn in a white space at a predetermined position inside the guide image FIG.

On the other hand, as shown in FIG. 3, a photoresist 7 such as a liquid resist, a dry film resist or a printing resist ink is applied on the upper surface of the conductive film 2 and baked to prepare it. .

Then, as shown in FIG. 4, the film 3 is placed on the conductive film 2 with the photoresist 7 interposed therebetween, and in this state, exposure is carried out by an exposure machine or the like. The shaded portion in 3 is the portion that blocks light corresponding to the target image FIG. 4 and the guide image FIG. 5).

After this exposure, development is performed to remove the unexposed photoresist 7a (see FIG. 4), whereby the target image shown in FIG. Guide image A conductive portion 8 (also referred to as an electrodeposition image corresponding surface) having a shape according to the shape of FIG. 5 is formed. Then, if necessary, the surface of the conductive portion 8 (the surface corresponding to the electrodeposition image)
Mold release treatment. When the release treatment is performed, the electrodeposition image formed later can be easily peeled from the conductive film 2. This mold release process is performed by the same method as described above.

Next, as shown in FIG. 6, a metal is deposited on the conductive portion 8 by an electrodeposition method (electrodeposition image method),
An electrodeposition image 9 having a shape along the shape of the target image FIG. 4,
Guide image An electrodeposition image 10 having the shape shown in FIG. 5 is formed.

Although the electrodeposition image 9 has the numbers 3, 6, 9 or 12 when viewed from the plane, it is drawn as having these widths in the drawing. Also,
Inside the electro-deposited image 10, a guide hole (not shown) penetrating along the shape of the guide mark 6 is formed.

Here, for example, when nickel is used as the metal forming the electrodeposited images 9 and 10, nickel sulphate solution is used as the watt solution to deposit nickel on the conductive portion 8. The electrodeposition conditions at this time are, for example, to obtain an electrodeposition image of 100 μm ± 10 μm in 3 hours by applying a current of 3 A / dm ² to an electrodeposition effective area of 150 mm × 150 mm. You can

In addition to nickel, gold, silver, copper,
Of course, any metal such as iron or an alloy may be deposited on the conductive portion 8 to form an electrodeposition image, and by changing the electrodeposition conditions, for example, 20 to 300 μm.
An electrodeposited image having an arbitrary thickness can be obtained within the range of the order.

Next, as shown in FIG. 7, after dipping in a solution to remove the photoresist 7 on the conductive film 2,
If necessary, the surface of the electrodeposited images 9 and 10 may be subjected to metal plating as a surface treatment or decoration (coloring) such as electrodeposition coating, spray coating, printing, electrostatic coating or vacuum deposition. .

In this way, after the electrodeposition images 9 and 10 having a desired shape are formed on the surface of the conductive coating film 2 by the electrodeposition method, the electrodeposition images 9 and 10 are formed as shown in FIG. Is transferred onto the pressure-sensitive adhesive layer 12 of the supporting base material 11 such as a film. At this time, the conductive film 2 is peeled off at the same time. That is, peeling is performed at the interface between the conductive coating 2 and the metal plate 1, and the electrodeposited images 9 and 10 are displayed on the conductive coating 2 and the supporting substrate 1.
Peel while sandwiching with 1. As a result, since the electrodeposition images 9 and 10 are prevented from being scattered, it is possible to manufacture the electrodeposition images with high yield. Further, since the electrodeposition image and the metal plate can be peeled off with almost no deformation, no stress remains in the electrodeposition image and no deformation occurs even after being attached to the adherend. Further, there is an advantage that the metal plate can be repeatedly used. Further, when a film having a high surface smoothness such as an electroplating film (electrodeposition film) is used as the conductive film 2, the back surface of the electrodeposition image becomes smooth, so that it can be surely adhered to the adherend. Become. Moreover, since the photoresist also adheres to the conductive coating film 2 having a high surface smoothness, it is possible to prevent the occurrence of burrs and obtain a high-quality electrodeposition image.

The pressure-sensitive adhesive layer 12 can be formed of, for example, a UV-curable pressure-sensitive adhesive, a heat-curable pressure-sensitive adhesive, or a time-curable pressure-sensitive adhesive. Here, as a typical example of the ultraviolet-curable pressure-sensitive adhesive, a photopolymerizable compound such as an addition polymerizable compound having two or more unsaturated bonds or an alkoxysilane having an epoxy group, a carbonyl compound or an organic sulfur compound, Examples thereof include a rubber pressure-sensitive adhesive compounded with a photopolymerization initiator such as a peroxide, an amine and an onium salt compound, and an acrylic pressure-sensitive adhesive agent (JP-A-60-1969).
No. 56). The amount of the photopolymerizable compound and the photopolymerization initiator to be compounded is 10 to 100 parts by weight of the base polymer, respectively.
Generally 500 parts by weight, 0.1 to 20 parts by weight.

Acrylic polymers are commonly used (Japanese Patent Publication No. 57-54068, Japanese Patent Publication No. 58-339).
(See Japanese Patent Publication No. Sho 61-56264) as well as those having a radical-reactive unsaturated group in the side chain.
Alternatively, those having an epoxy group in the molecule can also be used.

Examples of addition-polymerizable compounds having two or more unsaturated bonds include polyhydric alcohol-based esters and oligoesters of acrylic acid and methacrylic acid, epoxy-based and urethane-based compounds.

Further, an epoxy group-functional cross-linking agent having one or more epoxy groups in the molecule such as ethylene glycol diglycidyl ether can be additionally compounded to enhance the cross-linking effect.

When the pressure-sensitive adhesive layer 12 is formed by using an ultraviolet curable adhesive, it is necessary to use a transparent film or the like as the support base 11 in order to enable the ultraviolet irradiation treatment.

Typical examples of the heat-curable pressure-sensitive adhesive include polyisocyanate, melamine resin, amine-
A rubber system containing a cross-linking agent such as an epoxy resin, a peroxide or a metal chelate compound, and a cross-linking regulator composed of a polyfunctional compound such as divinylbenzene, ethylene glycol diacrylate or trimethylolpropane trimethacrylate, if necessary. Examples thereof include pressure sensitive adhesives and acrylic pressure sensitive adhesives.

Further, as a time-curable pressure-sensitive adhesive,
An example is one in which the adhesive force is lowered by evaporating the compounded solvent over time. Next, if necessary, the adhesive force of the pressure-sensitive adhesive layer 12 is reduced, and then, as shown in FIG.
As shown in, the fixing adhesive layer 14 is formed on the exposed surface of the electrodeposited image (the surface to be attached to the adherend later) via the mask 13 and the like. Next, the mask 13 is removed, and the electrodeposition image is attached to the adherend 15, as shown in FIG. If the release paper 16 is not used immediately, the release paper 16 is attached to the fixing adhesive layer side as shown in FIG.
Remove and use.

Further, in the present invention, after reducing the adhesive force of the pressure-sensitive adhesive layer 12, as shown in FIG.
It is also possible to apply a fixing adhesive 14 having a stronger adhesive force than the pressure-sensitive adhesive layer 12 to the entire surface of the supporting substrate 11 on the electrodeposition image holding side. After that, a release paper 16 is attached to the application surface of the fixing adhesive 14 if necessary.

When the pressure-sensitive adhesive layer 12 is formed of a UV-curable pressure-sensitive adhesive, the supporting base material 11 is exposed from the surface side of the electrodeposited images 9 and 10, that is, the electrodeposited image 9 , 10
By irradiating with ultraviolet rays from the side opposite to the holding side, the adhesive force of the pressure-sensitive adhesive layer 12 is changed to an extremely weak adhesive force.

When the pressure-sensitive adhesive layer 12 is formed of a heat-curable pressure-sensitive adhesive, the supporting base material 11 is further heated to form a time-curable pressure-sensitive adhesive. In some cases, the adhesive force of the pressure-sensitive adhesive layer 12 is changed to an extremely weak adhesive force by giving a change over time.

After the fixing adhesive 14 is applied to the holding side of the electrodeposited images 9 and 10 on the supporting substrate 11, the adhesive force of the pressure-sensitive adhesive layer 12 is reduced in the same manner as described above. May be.

Next, as shown in FIG. 13, the surface of a timepiece display plate 15 ′ as an adherend 15 is adhered to the surface of the supporting base material 11 via the fixing adhesive 14 applied on the electrodeposition image holding side. The electrodeposited images 9 and 10 are attached and fixed while being peeled off from the supporting base material 11.

Here, as shown in FIG. 14, a guide pin 17 is provided in a protruding manner on a holding plate 16 holding a timepiece display plate 15 ', and the guide pin 17 and the electroplated image 10 are formed.
The electroplated image 9 through a guide hole (not shown) provided on the
Can be positioned with respect to the timepiece display plate 15 '.

At this time, as described above, since the adhesive force of the pressure-sensitive adhesive layer 12 is lowered, it becomes the same state as that where the electro-deposited images 9 and 10 are held by the weak adhesive, and the support is performed. The electrodeposition image 9 is attached to the surface of the timepiece display plate (adherend) 15 'while being peeled off from the supporting base material 11 via the adhesive 14 for fixing applied to the electrodeposition image holding side of the base material 11. be able to.

The adhesive force at the interface between the pressure-sensitive adhesive layer 12 and the fixing adhesive 14 is the timepiece display plate 1.
By selecting both adhesives 12 and 14 so as to be larger than the bonding force at the interface between 5'and the fixing adhesive 14, the fixing adhesive 14 is prevented from adhering to the timepiece display plate 15 '. be able to.

For example, when an acrylic pressure-sensitive adhesive containing a photopolymerizable compound and a photopolymerization initiator is used as the pressure-sensitive adhesive forming the pressure-sensitive adhesive layer 12, the fixing adhesive 14 is used. , An adhesive of the same kind as the pressure-sensitive adhesive forming the pressure-sensitive adhesive layer 12, that is, an acrylic pressure-sensitive adhesive is used only as a base polymer containing no photopolymerizable compound and a photopolymerization initiator. After coating, by aging for 9 hours in an atmosphere of 40 ° C., the adhesive force at the interface between the pressure-sensitive adhesive layer 12 and the fixing adhesive 14 is higher than that of the timepiece display plate 15 ′ and the fixing adhesive. It can be made larger than the bonding force at the interface with 14. Then, the adhesive other than the fixed portion can be removed without leaving any residue. As described above, the bonding force at the interface between the pressure-sensitive adhesive layer 12 and the fixing adhesive 14 after the adhesive force is reduced is more than the bonding force at the interface between the adherend 15 and the fixing adhesive 14. By selecting both adhesives so that
It is also possible to apply the adhesive 14 for fixing to the entire surface of the electrodeposition image holding side, thereby eliminating the troublesome work of applying the adhesive only to the back surface of the electrodeposition image and simplifying the process.

[0044]

According to the present invention, when the electrodeposited image is transferred to the pressure-sensitive adhesive layer of the supporting substrate, it is peeled off between the metal plate and the conductive coating, and the conductive coating is formed along with the electrodeposited image. It is transcribed. Since this peeling can be performed with a relatively small force, no excessive stress is applied to the electrodeposited image. Therefore, no internal stress remains in the electrodeposited image, so that no deformation occurs after being attached to the adherend. Further, since the electrodeposited image is peeled off in the form sandwiched between the supporting base material and the conductive coating, the electrodeposited image does not scatter even if excessive stress is applied during peeling. Furthermore, according to this method, the metal plate can be used semipermanently. Further, even if the surface of the metal plate is not mirror-finished, it is possible to produce a high-quality electrodeposition image having a smooth surface and having no defects such as burrs.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a normal state in which a conductive film is formed on a metal plate.

FIG. 2 is a plan view showing an example of a photomask film for electrodeposition image.

FIG. 3 is a cross-sectional view showing a state in which a photoresist is laminated on a conductive film.

FIG. 4 is a sectional view showing a state during exposure.

FIG. 5 is a cross-sectional view showing a state of development after exposure.

FIG. 6 is a cross-sectional view showing a state in which electrodeposition is applied after development.

FIG. 7 is a cross-sectional view showing a state in which the photoresist has been removed after electrodeposition.

FIG. 8 is a cross-sectional view showing a state in which an electrodeposited image is transferred and held on a supporting base material together with a conductive coating.

FIG. 9 is a cross-sectional view showing a state in which a fixing adhesive is formed on an exposed surface of an electrodeposition image via a mask.

FIG. 10 is a sectional view showing a state in which an electrodeposition image is applied to an adherend.

FIG. 11 is a cross-sectional view showing a state in which release paper is attached to the fixing adhesive layer.

FIG. 12 is a cross-sectional view showing a state in which the adhesive force of the pressure-sensitive adhesive layer is reduced, a fixing adhesive is applied to the electrodeposition image holding surface side of the supporting base material, and a release paper is applied to the applied surface. .

FIG. 13 is a cross-sectional view showing a state in which an electrodeposition image is attached to an adherend.

FIG. 14 is a perspective view showing an adherend on which an electrodeposition image is applied.

FIG. 15 is a cross-sectional view showing a conventional electrodeposition image peeling method.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Metal plate 2 Conductive film 9,10 Electrodeposition image 11 Supporting substrate 12 Pressure-sensitive adhesive layer 14 Adhesive for fixation 15, 15 'Adhered object (watch display plate)

Claims (3)

[Claims] 1. A conductive coating is formed on the surface of a metal plate, an electro-deposited image is formed on the surface of the conductive coating, and the pressure-sensitive adhesive layer of a supporting substrate provided with the pressure-sensitive adhesive layer has the above-mentioned pressure-sensitive adhesive layer. The electrodeposition image is peeled and transferred from the metal plate together with the conductive coating, the conductive coating is peeled from the electrodeposition image, and a fixing adhesive layer is formed on the exposed surface of the electrodeposition image. A method for forming an electro-deposited image, which comprises adhering the electro-deposited image to the surface of an adherend via the fixing adhesive layer while peeling off the electro-deposited image. 2. The method of forming an electro-deposited image according to claim 1, wherein a conductive coating is formed by electrodeposition after the mold release treatment is applied to the surface of the metal plate. 3. The method for forming an electrodeposition image according to claim 1, wherein the electrodeposition image is formed after the electrocoating image-corresponding surface of the surface of the conductive coating film is subjected to a release treatment.