JP4359791B2 - Method for fixing minute articles - Google Patents

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JP4359791B2
JP4359791B2 JP50964699A JP50964699A JP4359791B2 JP 4359791 B2 JP4359791 B2 JP 4359791B2 JP 50964699 A JP50964699 A JP 50964699A JP 50964699 A JP50964699 A JP 50964699A JP 4359791 B2 JP4359791 B2 JP 4359791B2
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山口　　克行
廣男 中山
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TEFCO AOMORI Co Ltd
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    • G—PHYSICS
    • G04—HOROLOGY
    • G04D—APPARATUS OR TOOLS SPECIALLY DESIGNED FOR MAKING OR MAINTAINING CLOCKS OR WATCHES
    • G04D3/00—Watchmakers' or watch-repairers' machines or tools for working materials
    • G04D3/0002—Watchmakers' or watch-repairers' machines or tools for working materials for mechanical working other than with a lathe
    • G04D3/0043—Watchmakers' or watch-repairers' machines or tools for working materials for mechanical working other than with a lathe for components of the time-indicating mechanisms
    • G04D3/0051—Watchmakers' or watch-repairers' machines or tools for working materials for mechanical working other than with a lathe for components of the time-indicating mechanisms for time markers
    • G—PHYSICS
    • G04—HOROLOGY
    • G04B—MECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
    • G04B19/00—Indicating the time by visual means
    • G04B19/06—Dials
    • G04B19/10—Ornamental shape of the graduations or the surface of the dial; Attachment of the graduations to the dial
    • G04B19/103—Ornamental shape of the graduations or the surface of the dial; Attachment of the graduations to the dial attached or inlaid numbers

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Description

技術分野
本発明は、例えば時計用バラ文字や装飾部品等の微小物品を、時計用表示板等の被着体に固着する方法に関する。
背景技術
近時、例えば、時計用のバラ文字や装飾部品等の微細で複雑な形状を有する物品にあっては、いわゆる電着画像法による製造が広く行われている。電着画像法によれば、均一性の高い製品を大量に生産でき、また得られた電着画像を一括して整列したまま被着体に固着できるので、特に画像数が多く、正確な位置決めが要求される時計用文字盤を製造するのに好適である。
このような電着画像については様々な改善が提案されており、たとえば特開平７−３２３６５４号公報、同７−３３１４７９号公報、同８−２７５９７号公報等にその詳細が記載されている。
電着画像法においては、電着法（電鋳法ともいう）により、バラ文字等の電着画像のみならず、位置決めに用いられるガイド用電着、過剰電着を防止するための線状電着の形成が同時に行われている。すなわち、この方法では、目的とする電着画像だけでなく、最終的には製品とならない補助的電着物も同時に形成される。このような補助的電着物は、工程管理上必要なものではあるが、最終製品とはならないので、より安価な金属から形成することが望ましい。このため、電着画像法においては製品価格のバランス等を考慮して、比較的安価なニッケル等の金属によって電着画像を製造している。
したがって、最終製品とはならない補助的電着物が多量に形成されるため、金や銀、白金等の貴金属類にあっては、上記のような電着画像法を採用することは一般的ではない。また、樹脂、ガラス、宝石等の非金属類からなる微小物品においては、もとより電着画像法を採用できない。このため、貴金属類あるいは非金属類からなる微小物品を文字盤等に適用する場合には、高度な熟練者により、一つ一つの画像を、手作業により文字盤に埋め込んだり、固着するため、非常に高価なものになる。
本発明は、上記のような従来技術に鑑みてなされたものであって、貴金属製、非金属製あるいは電着法では得られにくい形状が鋭角的で表面に模様を有する微小物品を、精度よく一括して被着体表面に固着できる微小物品の固着方法を提供することを目的としている。
発明の開示
上記目的を達成するため、本発明者等は電着画像法により培った基礎技術を応用し、以下のような本発明を完成するに至った。
すなわち、本発明に係る第１の微小物品の固着方法は、
金属板と、その上に形成された導電性被膜とからなる導電性基材表面の導電性被膜の表面に電着法またはエッチング法により形成された微小物品収容部を有する治具用薄膜を形成する工程と、
前記微小物品収容部に、別途製作した微小物品を収容する工程と、
該微小物品裏面に固着用接着剤層を形成する工程と、
該微小物品を、固着用接着剤層を介して被着体に固着する工程を含むことを特徴としている。
特に、第１の方法の好ましい態様の一つとしては、
金属箔をエッチングして形成されたものであるか、または、金属板と、その上に形成された導電性被膜とからなる導電性基材表面の導電性被膜の表面に電着法またはエッチング法により形成された微小物品収容部を有する治具用薄膜を形成し、
紫外線硬化型感圧接着剤層を設けた支持基材の該紫外線硬化型感圧接着剤層に、前記治具用薄膜を転写し、
前記微小物品収容部に、別途製作した微小物品を収容し、
前記微小物品裏面に固着用接着剤層を形成し、前記治具用薄膜を除去し、
前記支持基材から前記微小物品を剥離しつつ、
前記固着用接着剤層を介して前記微小物品を被着体の表面に固着する微小物品の固着方法が挙げられる。
また、第１の方法の好ましい態様の他の一つとしては、
金属箔をエッチングして形成されたものであるか、または、金属板と、その上に形成された導電性被膜とからなる導電性基材表面の導電性被膜の表面に電着法またはエッチング法により形成された微小物品収容部を有する治具用薄膜を形成し、
紫外線硬化型感圧接着剤層を設けた支持基材の該紫外線硬化型感圧接着剤層に、前記治具用薄膜を転写し、
前記微小物品収容部に、別途製作した微小物品を収容し、
前記微小物品裏面に固着用接着剤層を形成し、
前記治具用薄膜および微小物品を、被着体表面に載置し、
微小物品部を押圧して前記固着用接着剤層を介して前記微小物品を被着体の表面に固着し、
前記治具用薄膜を除去する微小物品の固着方法が挙げられる。
また、本発明に係る第２の微小物品の固着方法は、
金属箔をエッチングして形成されたものであるか、または、金属板と、その上に形成された導電性被膜とからなる導電性基材表面の導電性被膜の表面に電着法またはエッチング法により形成された微小物品収容部を有する治具用薄膜を形成する工程と、
前記微小物品収容部に、別途製作した微小物品を収容する工程と、
被着体の微小物品固着予定部に紫外線硬化型感圧接着剤からなる固着用接着剤層を形成する工程と、
該微小物品を、紫外線硬化型感圧接着剤からなる固着用接着剤層を介して紫外線透過性である被着体に固着した後、被着体裏面から紫外線を照射して固着用接着剤層を硬化させ、微小物品と被着体とを強固に接合する工程を含むことを特徴としている。
第２の方法の好ましい態様の一つとしては、
金属箔をエッチングして形成されたものであるか、または、金属板と、その上に形成された導電性被膜とからなる導電性基材表面の導電性被膜の表面に電着法またはエッチング法により形成された微小物品収容部を有する治具用薄膜を形成し、
紫外線硬化型感圧接着剤層を設けた支持基材の該紫外線硬化型感圧接着剤層に、前記治具用薄膜を転写し、前記微小物品収容部に、別途製作した微小物品を収容し、
被着体の微小物品固着予定部に紫外線硬化型感圧接着剤からなる固着用接着剤層を形成する工程と、
前記支持基材および微小物品を、紫外線透過性である被着体表面に載置し、
前記紫外線硬化型感圧接着剤からなる固着用接着剤層を介して前記微小物品を被着体の表面に固着した後、被着体裏面から紫外線を照射して固着用接着剤層を硬化させ、微小物品と被着体とを強固に接合することを特徴とする微小物品の固着方法がが挙げられる。
また、前記感圧接着剤層は、紫外線硬化型感圧接着剤からなる。
さらに、本発明においては、前記治具用薄膜が、導電性基材表面に電着法によって形成されたものであることが好ましく、この場合には、前記導電性基材が、金属板と、その上に形成された導電性被膜とからなることが好ましい。
また、前記治具用薄膜は、金属箔をエッチングして形成されたものであってもよい。
さらに、第２の方法においては、被着体が紫外線透過性であり、固着用接着剤層が紫外線硬化型感圧接着剤からなる。この場合、微小物品を被着体に固着後、被着体裏面から紫外線を照射して固着用接着剤層を硬化させると、微小物品と被着体とをより強固に接合することができる。
このような本発明によれば、微小物品を、精度よく一括して被着体表面に固着することができる。
【図面の簡単な説明】
図１は、導電性基材上表面に、微小物品収容部を有する治具用薄膜を形成した状態を示す断面図、図２は、導電性基材（多層基材）の一例を示す断面図、図３は、フォトマスクフィルムの一例を示す平面図、図４は、導電性基材表面にフォトレジストを積層した状態の断面図、図５は、露光時の状態を示す断面図、図６は、露光後、現像した状態を示す断面図、図７は、現像後、電着を施した状態を示す断面図、図８は、電着後、フォトレジストを除去し、治具用薄膜を導電性被膜とともに、支持基材に転写保持した状態を示す断面図、図９は、導電性被膜を除去した状態を示す断面図、図１０は、微小物品収容部に微小物品を収容した状態を示す断面図、図１１は、治具用薄膜、微小物品の保持側全面に固着用接着剤層を形成した状態を示す断面図、図１２は、固着用接着剤層に離型紙を貼付けた状態を示す断面図、図１３は、紫外線照射により、感圧接着剤層の接着力を低減している状態を示す断面図、図１４は、治具用薄膜を除去した状態を示す断面図、図１５は、微小物品の固着を行っている状態を示す断面図、図１６は、治具用薄膜、微小物品を被着体上に載置した状態を示す断面図、図１７は、微小物品を押圧している状態を示す断面図、図１８は、治具用薄膜を除去し、微小物品のみを被着体上に固着した状態を示す断面図である。図１９は、被着体の微小物品固着予定部に固着用接着剤層を形成した状態を示す断面図であり、図２０は、微小物品を固着後、固着用接着剤層を紫外線硬化している状態を示す断面図である。
１...導電性基材（多層基材：１ａ...金属板、１ｂ...導電性被膜）；２...微小物品；３...微小物品収容部；４...治具用薄膜；５...フォトマスク；６...微小物品収容部３に対応するマーク；７...フォトレジスト；８...導電部；９...支持基材；１０...感圧接着剤層；１１...固着用接着剤層；１２...離型紙；１３...被着体
発明を実施するための最良の形態
以下、本発明の実施例を図面を参照して、さらに具体的に説明する。
この実施例では、時計用のバラ文字を微小物品として、これを時計用表示板（被着体）の表面に固着するようにした例を示すが、本発明は時計用バラ文字に限らず、種々の装飾文字、記号、樹脂成形体、ガラス、宝石等の微小物品の固着に適用することができる。このような微小物品は例えば、金属プレス加工、電気成形加工、樹脂成形加工、ガラス、宝石類の研磨・切削により製造される。
たとえば、金属プレス加工によりバラ文字を作成する場合には、以下のように行う。
（1）バラ文字が凹状に形成された金型をプレス機にセットする。
（2）プレスにより黄銅等の銅合金からなる帯材表面に凸状のバラ文字を連続的に形成する（コインニグ加工）。なお、一般的な時計用バラ文字の場合、凸状のバラ文字の上面側に２本の基板固定用の足を有しているが、本発明で用いるバラ文字にはこの足がない。
（3）バラ文字を帯材から抜金型により抜き落とす。
（4）バラ文字を円板状の治具の外周面または側面に溶剤可溶型の接着剤で接着固定する。
（5）バラ文字を接着固定した治具を機械的に回転させ、先端にダイヤモンドチップのついたバイトでバラ文字表面を所望の形状に切削し、形状出し及び鏡面出しを行う。
（6）溶剤にて接着剤を溶解し、円板状の治具よりバラ文字を取り外す。
（7）バラ文字表面に、湿式メッキまたは乾式メッキ処理によりメッキ膜を形成し、バラ文字が完成する。
微小物品の大きさは、用途により様々であり、たとえば時計用バラ文字の場合には、厚さは約１００〜４００μｍ程度である。このような微小物品は、以下の工程に先立ち、予め別途製作しておく。
本発明では、まず、治具用薄膜４の作成を行う。治具用薄膜は、たとえば電着法やエッチング法によって形成することができる。
電着法による場合には、図１に示すように、導電性基材１表面に、上記した微小物品２を収容するための空白部（以下「微小物品収容部３）と呼ぶ）を有する治具用薄膜４を形成する。微小物品収容部３は、前記微小物品よりもやや大きめに形成する。
導電性基材１としては、ステンレス鋼等の金属板、あるいはこのような金属板１ａ表面に導電性被膜１ｂを設けた積層体（以下、多層基材１と呼ぶこともある）が用いられる（図２参照）。本発明においては、特に金属板１ａ表面に導電性被膜１ｂを設けた多層基材を導電性基材１として用いることが好ましい。このような多層基材１を用いることにより、治具用薄膜を支持基材に転写する際に、治具用薄膜が飛散することを防止することができる。以下の実施例では、この多層基材１を用いた場合を例にとって説明する。
多層基材１の導電性被膜１ｂは、導電性を有する可撓性の薄膜である。このような導電性被膜１ｂとしては、電解メッキ（電着）または無電解メッキによって形成される導電性金属薄膜、あるいは導電性塗料により形成される導電性塗料被膜、導電性重合体により形成される導電性高分子薄膜等が用いられ、好ましくは電着による導電性金属薄膜が用いられる。導電性被膜１ｂの膜厚は特に限定はされないが、通常は１０〜５０μｍ、好ましくは２０〜３０μｍ程度である。
導電性被膜１ｂは、後の工程において、金属板１ａの表面から剥離される。したがって、導電性被膜１ｂの剥離を容易にするために、導電性被膜１ｂの形成に先立って、金属板１ａの表面に離型処理を施しておくことが好ましい。離型処理は、たとえば陽極電解による表面酸化、界面活性剤等で金属板１ａの表面を処理することにより行なわれる。
次いで導電性被膜１ｂの表面に微小物品収容部３を有する電着画像４を形成する（電着画像４を「治具用薄膜４」と呼ぶ）。電着画像形成の具体的手法は、たとえば特開平３−１０７４９６号公報に記載されている。何ら限定されるものではないが、以下に治具用薄膜４の一般的な形成方法について説明する。
この例は、時計用のバラ文字を微小物品２として、これを時計用表示板（被着体）の表面に固着するようにしたもので、先ず、図３に示すように、必要とするネガまたはポジのフォトマスクフィルム５を写真や印刷等によって作成する。
同図に示すものは、ネガフィルムであり、このフィルム５には、微小物品収容部３に対応するマーク６が白抜きで描かれている。
一方、図４に示すように、多層基材１の誘電性被膜１ｂの上面に、液レジスト、ドライフィルムレジストまたは印刷用レジストインク等のフォトレジスト７を塗布し、焼き付けを行ったものを用意しておく。
そして、図５に示すように、前記導電性被膜１ｂの上にフォトレジスト７を挟んで前記フィルム５を乗せ、この状態で露光機等による露光を行う（なお、同図において、フィルム５中の斜線で示す部分は、治具用薄膜４に相当して光を遮断する部分である）。
この露光後に現像を行って、露光されなかったフォトレジスト７ａ（図５参照）を除去し、これによって、図６に示すように、導電性被膜１ｂの表面に前記治具用薄膜４の形状に沿った形状の導電部８（電着画像対応面とも言う）を形成する。次いで、必要に応じて導電部８の表面（電着画像対応面）に離型処理を施す。離型処理を施しておくと、後に形成される治具用薄膜４を、導電性被膜１ｂから容易に剥離できるようになる。この離型処理は前記と同様の手法によって行なわれる。なお、フォトレジスト７を使用せず、レジストインキを使用し、印刷によりレジスト膜（露光されたフォトレジスト７ｂに該当）を形成してもよいことは言う迄もない。
次に、図７に示すように、前記導電部８の上に電着法（電着画像法）によって金属を析出させて、治具用薄膜４を形成する。
なお、電着に際しては、電着針方式を採用することで、垂直穴でエッジの鋭い微小物品収容部３を形成できる。具体的には、５０μｍ厚のドライフィルムレジストを５枚積層（計２５０μｍ）し、これを露光、現像後、２００μｍ厚に電着しレジスト膜を除去すると、２００μｍ厚でエッジの鋭い電着膜が得られる。
ここに、電着に用いる金属として、例えばニッケルを使用した場合には、ワット液として硫酸ニッケル液を使用することにより、導電部８の上にニッケルを電着させるのであり、この時の電着条件としては、例えば１５０ｍｍ×１５０ｍｍの電着有効面積に対して、３Ａ／ｄｍ2の電流を流すことにより、３時間で１００μｍ±１０μｍの電着画像を得ることができる。
また、前記ニッケルの他に、最終製品の価格等を考慮した上で、金、銀、銅、鉄、プラチナまたはそれらの合金等の金属を用いることもできる。また電着条件を変えることにより、例えば２０〜３００μｍ位の範囲で、任意の肉厚の治具用薄膜４を得ることができる。なお、治具用薄膜４の厚みは、前述した微小物品２の厚みの略等しいことが好ましい。治具用薄膜４と微小物品２との厚みを略等しくすると、後述する固着用接着剤を均一な厚さで塗布できる。
次に、剥離液に浸漬させて導電性被膜１ｂ上のフォトレジスト７を除去し、図１に示すように、導電性基材１表面に、微小物品収容部３を有する治具用薄膜４が形成される。
一方、エッチング法によって治具用薄膜４を形成する場合には、アルミニウム、真鍮、ステンレスなどの金属箔上に、所定の形状でレジスト膜を形成した後、エッチング液を噴霧または浸漬して治具用薄膜を作成する。金属箔の厚みは、前述した微小物品２の厚みに応じて適宜に選択される。エッチング法は以下のような工程からなる。
（1）金属箔上にフォトレジストを塗膜する。
（2）前述したフォトマスク５をフォトレジスト上に載置する。
（3）露光・現像を行う。
（4）エッチングを行う。
ここで、フォトレジスト、エッチング液としては、従来公知のものが特に制限されることなく用いられる。なお、上記アルミニウム、真鍮、ステンレスに使用するエッチング液としては、塩化第二鉄、塩酸、水酸化ナトリウム等の溶液やこれらの混合溶液を一般的に用いる。
ついで、上記のような電着法あるいはエッチング法によって得られた治具用薄膜４を、フィルム等の支持基材９の感圧接着剤層１０上に転写する。
電着法による場合の転写法を図８に示す。多層基材１を用いた場合には、導電性被膜１ｂ上に治具用薄膜４が形成されるが、この場合には治具用薄膜４を転写する際に、導電性被膜１ｂを同時に剥離する。すなわち、導電性被膜１ｂと金属板１ａとの界面で剥離を行い、治具用薄膜と、導電性被膜１ｂと支持基材９とで挟み込みながら剥離する。この結果、治具用薄膜４を確実に保持しながら剥離することができる。また、治具用薄膜４および金属板を殆ど変形することなく剥離することができるため、治具用薄膜４に応力が残留せず、変形が起こることはない。さらに金属板を繰り返し使用できるという利点もある。また、導電性被膜１ｂとして表面平滑性の高い膜、たとえば電解メッキ膜（電着膜）等を使用すると、導電性被膜１ｂにフォトレジストが密着するため、バリの発生を防止できる。
また、エッチング法によって治具用薄膜を形成した場合には、単純にフィルム等の支持基材９の感圧接着剤層１０上に貼着すればよい。前記惑圧接着剤層１０は、例えば紫外線硬化型、加熱硬化型、更には経時硬化型の感圧接着剤によって形成することができる。
ここに、紫外線硬化型の感圧接着剤の代表例としては、不飽和結合を２以上有する付加重合性化合物やエポキシ基を有するアルコキシシランの如き光重合性化合物と、カルボニル化合物や有機硫黄化合物、過酸化物、アミン、オニウム塩系化合物の如き光重合開始剤を配合したゴム系感圧接着剤や、アクリル系感圧接着剤等が挙げられる（特開昭６０−１９６９５６号公報参照）。光重合性化合物、光重合開始剤の配合量は、それぞれベースポリマ１００重量部当り１０〜５００重量部、０．１〜２０重量部が一般的である。
なお、アクリル系ポリマには、通例のもの（特公昭５７−５４０６８号公報、特公昭５８−３３９０９号公報等参照）の他、側鎖にラジカル反応性不飽和基を有するもの（特公昭６１−５６２６４号公報参照）や、分子中にエポキシ基を有するものも用いることができる。また、不飽和結合を２個以上有する付加重合性化合物としては、例えばアクリル酸やメタクリル酸の多価アルコール系エステルやオリゴエステル、エポキシ系やウレタン系化合物等が挙げられる。
更に、エチレングリコールジグリシジルエーテルの如き分子中にエポシキ基を１個または２個以上有するエポキシ基官能性架橋剤を追加配合して架橋効果を上げることもできる。紫外線硬化型の接着剤を用いて感圧接着剤層１０を形成した場合には、紫外線照射処理を可能とするために、支持基材９として透明なフィルム等を用いる必要がある。
また、加熱硬化型の感圧接着剤の代表例としては、ポリイソシアネート、メラミン樹脂、アミン−エポキシ樹脂、過酸化物、金属キレート化合物の如き架橋剤や、必要に応じてジビニルベンゼン、エチレングリコールジアクリレート、トリメチロールプロパントリメタクリレートの如き多官能性化合物からなる架橋調節剤等を配合したゴム系感圧接着剤やアクリル系感圧接着剤等が挙げられる。
更に、経時硬化型の感圧接着剤としては、配合した溶剤が経時的に蒸発することによって接着力が低下するようにしたものが挙げられる。
治具用薄膜４を導電性被膜１ｂとともに、支持基材９の感圧接着剤層１０に転写した後、図９に示すように、導電性被膜１ｂを除去し、治具用薄膜４を露出させる（以下、この露出面を保持側全面と呼ぶことがある）。なお、前記感圧接着剤層１０を紫外線硬化型の感圧接着剤で形成した場合には、導電性被膜１ｂの除去に先立ち、感圧接着剤層１０に少量の紫外線を照射しておき、感圧接着剤層１０の接着力を低減しておくことが好ましい。また金属板１ａと導電性被膜１ｂとの剥離（図８参照）に先立ち、感圧接着剤層１０の接着力を低減しておくこともできる。すなわち、紫外線硬化型接着剤の接着力は、２４００ｇ／25mm幅と強力なため、ある程度接着力を低減しておかないと、導電性被膜１ｂを感圧接着剤層１０から剥離することが困難になるためである。また紫外線硬化型接着剤層の接着力の低減を過度に行なうと、導電性被膜１ｂを除去する際に、治具用薄膜４も一緒に剥離するため、好ましくない。したがって、紫外線照射後の接着力は、３００〜６００ｇ／25mm幅程度、好ましくは４００〜５００ｇ／25mm幅程度とすることが望ましい。
次に、図１０に示すように、治具用薄膜４の微小物品収容部３に、上述したように別途製作した微小物品２を収容する。この際、微小物品２の裏面（すなわち被着体に固着される側の面）が上側に位置するように、微小物品２を収容し、感圧接着剤層１０に貼付する。
次いで、第１の方法では、図１１に示すように、治具用薄膜４および微小物品２の保持側全面に固着用接着剤層１１を形成する。固着用接着剤層１１は、前記感圧接着剤層１０よりも強い接着力を有するものであることが好ましい。その後、固定用接着剤層１１上に離型紙１２を貼付（図１２参照）し、固着用接着剤の熟成を行う。次いで、この状態で感圧接着剤層１０の接着力をさらに低減する。
ここに、前記感圧接着剤層１０を紫外線硬化型の感圧接着剤で形成した場合には、離型紙１２を貼付後、支持基材９側から、即ち治具用薄膜４の保持側と反対側から、図１３に示すように、紫外線を照射することにより、感圧接着剤層１０の接着力を極めて弱い接着力に変化させる。
また、感圧接着剤層１０を加熱硬化型の感圧接着剤で形成した場合には、支持基材９に加熱を施すことにより、更に経時硬化型の感圧接着剤に形成した場合には、経時変化を与えることにより、感圧接着剤層１０の接着力を極めて弱い接着力に変化させる。
このような処理により、感圧接着剤層１０の接着力を、１００ｇ／25mm幅以下、好ましくは３０〜５０ｇ／25mm幅程度に低減することが望ましい。
次いで、離型紙１２を除去し、被着体１３に対する微小物品２の固着を行うが、この際、以下の２通りの手法を採用できる。
（Ａ） 一つの方法においては、図１４に示すように、治具用薄膜４を予め剥離して、裏面に固着用接着剤層を有する微小物品２のみを感圧接着剤層１０上に保待し、この状態で図１５に示すように、被着体１３上に、固着用接着剤層を介して微小物品２を固着する。
ただし、上記（Ａ）の方法では、微小物品２の大きさが極めて小さかったり、感圧接着剤層１０の接着力を極端に低下させた場合に、微小物品２の位置ズレが起こることがある。このような場合には、次の（Ｂ）の方法を採用することもできる。
（Ｂ） 他の方法では、治具用薄膜４を剥離することなく、微小物品２とともに被着体１３上に載置する（図１６）。次いで、必要に応じ、支持基材９を感圧接着剤層１０とともに剥離除去（図１７）し、微小物品２のみを押圧し、微小物品２を被着体１３上に固着する。この際、治具用薄膜４に対しては圧力は付加されていないので、治具用薄膜４と被着体１３との接着力は大きくない。したがって、治具用薄膜４を剥離除去すると、治具用薄膜４上の固着用接着剤層も同時に除去でき、微小物品２のみが被着体１３上に残留し、微小物品２の固着が行われる（図１８）。
次に、本発明に係る第２の微小物品の固着方法について説明する。
本発明に係る第２の微小物品の固着方法は、紫外線透過性の被着体に対して特に有効である。
第２の微小物品の固着方法では、図１０に示す工程までは、上記第１の方法と同様であるが、固着用接着剤層１１を被着体１３の側に形成しておく点で第１の方法と異なる（図１９）。固着用接着剤層１１は、被着体１３表面の微小物品固着予定部に予め、スクリーン印刷、パッド印刷等の手法により形成しておく。固着用接着剤層１１は、特に限定されず、従来より公知の種々の接着剤より形成されうるが、後述するように、被着体１３が紫外線透過性のものである場合には、紫外線硬化型感圧接着剤により形成することが好ましい。
次いで、この固着用接着剤層１１を介して上記第１の方法と同様にして、微小物品２を被着体表面に固着する。
なお、微小物品２の固着に先立ち、治具用薄膜４を支持基材９の感圧接着剤層１０から除去し、微小物品２を支持基材９に保持した状態で、微小物品２を被着体表面に固着してもよく、また、微小物品２を被着体表面に固着した後に、治具用薄膜４を支持基材９とともに除去してもよい。
第２の方法における被着体１３としては、紫外線透過性のもの、たとえばガラス、樹脂、セラミックス、貝等が好ましく用いられる。このような紫外線透過性被着体の紫外線透過率は、好ましくは３０〜８０％、特に好ましくは５０〜８０％の範囲にある。このような紫外線透過性被着体を用いた場合には、固着用接着剤層１１を、上述した紫外線硬化型感圧接着剤から形成することが好ましい。
この場合、微小物品を被着体に固着後、図２０に示すように、被着体裏面から紫外線を照射して固着用接着剤層を硬化させると、微小物品と被着体とをより強固に接合することができる。紫外線硬化型感圧接着剤は、紫外線照射により硬化し、感圧性の接着力を失うが、いわゆるアンカー効果によって、微小物品と被着体とを強固に接合することができる。
すなわち、本発明に係る第２の方法の好ましい実施形態は、以下のとおりである。
微小物品収容部３を有する治具用薄膜４を形成し（図１〜図７）、
紫外線硬化型感圧接着剤層１０を設けた支持基材９の該感圧接着剤層に、前記治具用薄膜４を転写し（図８、図９）、
前記微小物品収容部３に、別途製作した微小物品２を収容し（図１０）、
紫外線透過性の被着体１３の微小物品固着予定部に紫外線硬化型の固着用接着剤層１１を形成し（図１９）、
支持基材９および前記微小物品２を、被着体表面に載置して、前記固着用接着剤層１１を介して前記微小物品２を被着体１３の表面に固着し、被着体１３裏面から紫外線を照射して固着用接着剤層１１を硬化させ、微小物品２と被着体１３とを強固に接合し（図２０）、
さらに支持基材９の側から紫外線を照射して、紫外線硬化型感圧接着剤層１０を硬化させ、支持基材９を除去し、治具用薄膜４が残っている場合にはこれも除去して、
かくして、時計用文字盤等の被着体１３表面に、バラ文字等の微小物品２を固着させることができる。
以上、本発明に係る微小物品の固着方法について説明してきたが、本発明においては、従来の電着画像法において採用されている様々な技術を応用でき、たとえば治具用薄膜４の形成と同時に、位置決めに用いるガイド穴を有するガイド用電着を形成してもよい。なお、エッチング法による場合も同様に、治具用薄膜を形成すると同時に位置決めに用いるガイド穴を有するガイド用薄膜を形成してもよい。
また時計用文字盤の製造例に沿って本発明の説明を行ったが、本発明は時計用文字盤の製造に限らず、たとえば商品名、会社名等を商品に付着するためにも採用できるし、種々の装飾品の製造にも適用できる。
発明の効果
本発明によれば、従来は高度な熟練を要した微小物品の整列固着を、簡便に行うことができる。 Technical field
The present invention relates to a method for fixing a minute article such as a rose for a clock or a decorative part to an adherend such as a display panel for a clock.
Background art
In recent years, for example, for articles having fine and complicated shapes such as roses for clocks and decorative parts, manufacture by the so-called electrodeposition imaging method has been widely performed. According to the electrodeposition imaging method, products with high uniformity can be produced in large quantities, and the obtained electrodeposition images can be fixed to the adherend while being aligned in a lump, so that the number of images is particularly large and accurate positioning is possible. It is suitable for manufacturing a timepiece dial that requires the above.
Various improvements have been proposed for such electrodeposition images, and details thereof are described, for example, in JP-A-7-323654, JP-A-7-331479, and JP-A-8-27597.
In the electrodeposition imaging method, the electrodeposition method (also referred to as electroforming method) is used not only for electrodeposited images such as rose characters, but also for electrodeposition for guides used for positioning and linear electrodeposition for preventing excessive electrodeposition. The formation of clothing is done at the same time. That is, in this method, not only the intended electrodeposition image, but also an auxiliary electrodeposition that does not eventually become a product is formed at the same time. Such an auxiliary electrodeposit is necessary for process control, but it is not a final product, so it is desirable to form it from a less expensive metal. For this reason, in the electrodeposition imaging method, an electrodeposition image is manufactured with a relatively inexpensive metal such as nickel in consideration of a balance of product prices.
Therefore, since a large amount of auxiliary electrodeposits that do not become final products are formed, it is not common to use the electrodeposition imaging method as described above for noble metals such as gold, silver, and platinum. . In addition, the electrodeposition imaging method cannot be employed for fine articles made of non-metals such as resin, glass, and jewelry. For this reason, when applying a fine article made of precious metals or non-metals to a dial or the like, a highly skilled person embeds and fixes each image manually on the dial, It will be very expensive.
The present invention has been made in view of the prior art as described above, and is capable of accurately producing a minute article having a sharp surface and a pattern on the surface which is difficult to obtain by a noble metal, non-metal or electrodeposition method. An object of the present invention is to provide a method for fixing minute articles that can be fixed to the surface of an adherend at once.
Disclosure of the invention
In order to achieve the above object, the present inventors have applied the basic technology cultivated by the electrodeposition imaging method and have completed the present invention as follows.
That is, the first method for fixing a micro article according to the present invention includes:
Forming a thin film for a jig having a minute article containing portion formed by an electrodeposition method or an etching method on the surface of the conductive coating on the surface of the conductive substrate comprising a metal plate and a conductive coating formed thereon And a process of
Storing the separately manufactured micro article in the micro article storage unit;
Forming a bonding adhesive layer on the back surface of the micro article;
Including a step of fixing the micro article to an adherend through an adhesive layer for fixing.It is a feature.
In particular, as one preferred embodiment of the first method,
It is formed by etching a metal foil, or an electrodeposition method or an etching method on the surface of the conductive coating on the surface of the conductive substrate composed of a metal plate and a conductive coating formed thereon Forming a thin film for a jig having a minute article containing portion formed by
The jig thin film is transferred to the ultraviolet curable pressure sensitive adhesive layer of the support substrate provided with the ultraviolet curable pressure sensitive adhesive layer,
In the minute article storage unit, a separately manufactured minute article is accommodated,
Forming a bonding adhesive layer on the back surface of the micro article, removing the jig thin film;
While peeling the micro article from the support substrate,
A method for fixing a micro article, wherein the micro article is fixed to a surface of an adherend through the fixing adhesive layer.Is mentioned.
In addition, as another preferred embodiment of the first method,
It is formed by etching a metal foil, or an electrodeposition method or an etching method on the surface of the conductive coating on the surface of the conductive substrate composed of a metal plate and a conductive coating formed thereon Forming a thin film for a jig having a minute article containing portion formed by
The jig thin film is transferred to the ultraviolet curable pressure sensitive adhesive layer of the support substrate provided with the ultraviolet curable pressure sensitive adhesive layer,
In the minute article storage unit, a separately manufactured minute article is accommodated,
Forming an adhesive layer for fixing on the back surface of the micro article,
The jig thin film and the micro article are placed on the adherend surface,
Press the micro article part to fix the micro article to the surface of the adherend through the fixing adhesive layer,
Remove the jig thin filmA method for fixing a fine article is included.
In addition, the second method for fixing a micro article according to the present invention includes:
It is formed by etching a metal foil, or an electrodeposition method or an etching method on the surface of the conductive coating on the surface of the conductive substrate composed of a metal plate and a conductive coating formed thereon Forming a thin film for a jig having a micro article housing portion formed by:
Storing the separately manufactured micro article in the micro article storage unit;
Forming an adhesive layer for fixing composed of an ultraviolet curable pressure-sensitive adhesive on a part to be adhered to a fine article on an adherend;
The fine article is fixed to an adherend that is transparent to ultraviolet light through an adhesive layer made of ultraviolet curable pressure-sensitive adhesive, and then irradiated with ultraviolet rays from the back of the adherend to fix the adhesive layer. A step of hardening the fine article and firmly bonding the minute article and the adherend.It is characterized by that.
As one of the preferable embodiments of the second method,
It is formed by etching a metal foil, or an electrodeposition method or an etching method on the surface of the conductive coating on the surface of the conductive substrate composed of a metal plate and a conductive coating formed thereon Forming a thin film for a jig having a minute article containing portion formed by
The jig thin film is transferred to the ultraviolet curable pressure-sensitive adhesive layer of the support substrate provided with the ultraviolet curable pressure-sensitive adhesive layer, and a separately manufactured micro article is accommodated in the micro article accommodating portion. ,
Forming an adhesive layer for fixing composed of an ultraviolet curable pressure-sensitive adhesive on a part to be adhered to a fine article on an adherend;
The support substrate and the micro article are placed on an adherend surface that is UV transmissive,
After fixing the micro article to the surface of the adherend through the adhesive layer made of the ultraviolet curable pressure sensitive adhesive, the adhesive adhesive layer is cured by irradiating ultraviolet rays from the back of the adherend. There is a fixing method of a micro article characterized by firmly joining the micro article and the adherend.
The pressure-sensitive adhesive layer is made of an ultraviolet curable pressure-sensitive adhesive.Become.
Furthermore, in the present invention, the jig thin film is preferably formed on the surface of a conductive base material by an electrodeposition method. In this case, the conductive base material is a metal plate, Formed on itConductive coatingIt is preferable to consist of.
Further, the jig thin film may be formed by etching a metal foil.
Furthermore, in the second method, the adherend is UV transmissive, and the fixing adhesive layer is made of UV curable pressure sensitive adhesive.Become.In this case, after the fine article is fixed to the adherend, the fine article and the adherend can be bonded more firmly by irradiating ultraviolet rays from the back of the adherend to cure the fixing adhesive layer.
According to the present invention as described above, the minute articles can be fixed to the surface of the adherend accurately and collectively.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing a state in which a thin film for a jig having a minute article accommodating portion is formed on the surface of a conductive base material, and FIG. 2 is a cross-sectional view showing an example of a conductive base material (multilayer base material). 3 is a plan view showing an example of a photomask film, FIG. 4 is a cross-sectional view showing a state in which a photoresist is laminated on the surface of a conductive substrate, and FIG. 5 is a cross-sectional view showing a state at the time of exposure, FIG. FIG. 7 is a cross-sectional view showing a developed state after exposure, FIG. 7 is a cross-sectional view showing a state after electrodeposition after development, and FIG. 8 is a diagram showing a jig thin film after removing the photoresist after electrodeposition. FIG. 9 is a cross-sectional view showing a state where the conductive film is transferred and held together with the conductive coating, FIG. 9 is a cross-sectional view showing a state where the conductive coating is removed, and FIG. FIG. 11 shows a state in which an adhesive layer for fixing is formed on the entire holding side of the jig thin film and the micro article. FIG. 12 is a cross-sectional view showing a state where a release paper is attached to the adhesive layer for fixing, and FIG. 13 is a cross-sectional view showing a state where the adhesive force of the pressure-sensitive adhesive layer is reduced by ultraviolet irradiation. 14 is a cross-sectional view showing a state where the jig thin film is removed, FIG. 15 is a cross-sectional view showing a state where the micro article is fixed, and FIG. FIG. 17 is a cross-sectional view showing a state in which the micro article is pressed, and FIG. 18 is a cross-sectional view showing a state in which the micro article is pressed. FIG. It is sectional drawing which shows the state which adhered. FIG. 19 is a cross-sectional view showing a state in which an adhesive layer for fixing is formed on a part to be adhered to a micro article on an adherend, and FIG. 20 is a diagram showing an example in which the adhesive layer for fixing is UV cured after fixing the micro article. It is sectional drawing which shows the state which exists.
1 ... conductive substrate (multilayer substrate: 1a ... metal plate, 1b ...Conductive coating2) Micro article; 3 ... Micro article storage part; 4 ... Thin film for jig; 5 ... Photomask; 6 ... Mark corresponding to micro article storage part 3; .. Photoresist; 8 ... Conductive part; 9 ... Support substrate; 10 ... Pressure sensitive adhesive layer; 11 ... Adhesive layer for fixing; 12 ... Release paper; Adherend
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described more specifically with reference to the drawings.
In this embodiment, an example is shown in which a rose for a watch is a micro article, and this is fixed to the surface of a display plate (adhered body) for a watch, but the present invention is not limited to a rose for a watch, It can be applied to the fixing of various decorative characters, symbols, resin moldings, glass, jewels and other fine articles. Such a micro article is manufactured by, for example, metal pressing, electroforming, resin molding, glass, and jewelry polishing / cutting.
For example, when creating a rose character by metal press processing, it carries out as follows.
(1) Set a die with concave letters formed in a concave shape on the press.
(2) Convex rose characters are continuously formed on the surface of a strip made of a copper alloy such as brass by pressing (coining process). In addition, in the case of a general rose for a clock, two feet for fixing the substrate are provided on the upper surface side of the convex rose, but the rose for use in the present invention does not have this foot.
(3) Remove the rose letters from the strip with a die.
(4) Adhere and fix the rose character to the outer peripheral surface or side surface of the disk-shaped jig with a solvent-soluble adhesive.
(5) Mechanically rotate the jig to which the rose character is bonded and fixed, cut the rose character surface into a desired shape with a cutting tool with a diamond tip at the tip, and shape and mirror finish.
(6) Dissolve the adhesive with a solvent and remove the loose letters from the disc-shaped jig.
(7) A plated film is formed on the surface of the rose character by wet plating or dry plating to complete the rose character.
The size of the minute article varies depending on the application. For example, in the case of a clock letter, the thickness is about 100 to 400 μm. Such a micro article is separately manufactured in advance prior to the following steps.
In the present invention, the jig thin film 4 is first prepared. The thin film for jigs can be formed by, for example, an electrodeposition method or an etching method.
In the case of the electrodeposition method, as shown in FIG. 1, a treatment having a blank part (hereinafter referred to as “micro article storage part 3”) for storing the above-described micro article 2 on the surface of the conductive substrate 1. The tool thin film 4 is formed, and the minute article accommodating portion 3 is formed slightly larger than the minute article.
As the conductive substrate 1, a metal plate such as stainless steel or a laminate (hereinafter also referred to as the multilayer substrate 1) in which a conductive coating 1 b is provided on the surface of such a metal plate 1 a is used ( (See FIG. 2). In the present invention, it is preferable to use as the conductive substrate 1 a multilayer substrate in which the conductive coating 1b is provided on the surface of the metal plate 1a. By using such a multilayer substrate 1, it is possible to prevent the jig thin film from being scattered when the jig thin film is transferred to the support substrate. In the following examples, the case where this multilayer substrate 1 is used will be described as an example.
The conductive coating 1b of the multilayer substrate 1 is a flexible thin film having conductivity. Such a conductive film 1b is formed of a conductive metal thin film formed by electrolytic plating (electrodeposition) or electroless plating, a conductive paint film formed of a conductive paint, or a conductive polymer. A conductive polymer thin film or the like is used, and a conductive metal thin film by electrodeposition is preferably used. Although the film thickness of the electroconductive film 1b is not specifically limited, Usually, it is 10-50 micrometers, Preferably it is about 20-30 micrometers.
The conductive coating 1b is peeled off from the surface of the metal plate 1a in a later step. Therefore, in order to facilitate the peeling of the conductive coating 1b, it is preferable to perform a mold release treatment on the surface of the metal plate 1a prior to the formation of the conductive coating 1b. The mold release treatment is performed, for example, by treating the surface of the metal plate 1a with surface oxidation by anodic electrolysis, a surfactant or the like.
Next, an electrodeposition image 4 having the minute article accommodating portion 3 is formed on the surface of the conductive coating 1b (the electrodeposition image 4 is referred to as “a thin film for jig 4”). A specific method of electrodeposition image formation is described in, for example, Japanese Patent Laid-Open No. 3-107496. Although not limited at all, the general formation method of the jig | tool thin film 4 is demonstrated below.
In this example, a small rose 2 for a clock is used as a minute article 2 and is fixed to the surface of a clock display board (adhered body). First, as shown in FIG. Alternatively, a positive photomask film 5 is created by photography or printing.
What is shown in the figure is a negative film. On this film 5, a mark 6 corresponding to the minute article accommodating portion 3 is drawn in white.
On the other hand, as shown in FIG. 4, a photoresist 7 such as a liquid resist, a dry film resist or a printing resist ink is applied to the upper surface of the dielectric coating 1b of the multilayer substrate 1 and baked. Keep it.
Then, as shown in FIG. 5, the film 5 is placed on the conductive coating 1b with the photoresist 7 interposed therebetween, and exposure is performed by an exposure machine or the like in this state (in FIG. 5, in the film 5 The portion indicated by the oblique lines is a portion that blocks light corresponding to the jig thin film 4).
After this exposure, development is performed to remove the unexposed photoresist 7a (see FIG. 5), thereby forming the jig thin film 4 on the surface of the conductive coating 1b as shown in FIG. A conductive portion 8 (also referred to as an electrodeposition image corresponding surface) having a shape along the shape is formed. Next, a release treatment is performed on the surface of the conductive portion 8 (surface corresponding to the electrodeposition image) as necessary. When the mold release treatment is performed, the jig thin film 4 to be formed later can be easily peeled from the conductive coating 1b. This mold release process is performed by the same method as described above. Needless to say, a resist film (corresponding to the exposed photoresist 7b) may be formed by printing using a resist ink without using the photoresist 7.
Next, as shown in FIG. 7, a metal film is deposited on the conductive portion 8 by an electrodeposition method (electrodeposition image method) to form the jig thin film 4.
In addition, in the electrodeposition, by adopting an electrodeposition needle method, it is possible to form the minute article accommodating portion 3 having a sharp edge with a vertical hole. Specifically, five dry film resists of 50 μm thickness are laminated (total 250 μm), and after exposure and development, electrodeposition is performed to 200 μm thickness and the resist film is removed. can get.
Here, when nickel is used as the metal used for electrodeposition, for example, nickel sulfate solution is used as the watt solution, so that nickel is electrodeposited on the conductive portion 8. The condition is 3 A / dm for an electrodeposition effective area of 150 mm × 150 mm, for example.2When an electric current of 1 μm is applied, an electrodeposition image of 100 μm ± 10 μm can be obtained in 3 hours.
In addition to the nickel, metals such as gold, silver, copper, iron, platinum, or alloys thereof can be used in consideration of the price of the final product. Further, by changing the electrodeposition conditions, it is possible to obtain the jig thin film 4 having an arbitrary thickness in the range of, for example, about 20 to 300 μm. The thickness of the jig thin film 4 is preferably substantially equal to the thickness of the micro article 2 described above. When the thickness of the jig thin film 4 and the minute article 2 are substantially equal, a fixing adhesive described later can be applied with a uniform thickness.
Next, the photoresist 7 on the conductive film 1b is removed by being immersed in a stripping solution, and as shown in FIG. 1, the jig thin film 4 having the minute article accommodating portion 3 is formed on the surface of the conductive substrate 1. It is formed.
On the other hand, when the jig thin film 4 is formed by an etching method, a resist film is formed in a predetermined shape on a metal foil such as aluminum, brass, or stainless steel, and then an etching solution is sprayed or dipped into the jig. Create a thin film. The thickness of the metal foil is appropriately selected according to the thickness of the fine article 2 described above. The etching method includes the following steps.
(1) A photoresist is coated on the metal foil.
(2) The above-described photomask 5 is placed on the photoresist.
(3) Perform exposure and development.
(4) Etching is performed.
Here, as the photoresist and the etching solution, conventionally known ones are used without particular limitation. In addition, as etching liquid used for the said aluminum, brass, and stainless steel, solutions, such as ferric chloride, hydrochloric acid, sodium hydroxide, and these mixed solutions are generally used.
Next, the jig thin film 4 obtained by the electrodeposition method or the etching method as described above is transferred onto the pressure-sensitive adhesive layer 10 of the support base 9 such as a film.
FIG. 8 shows a transfer method using the electrodeposition method. When the multilayer substrate 1 is used, the jig thin film 4 is formed on the conductive coating 1b. In this case, when transferring the jig thin film 4, the conductive coating 1b is peeled off at the same time. To do. That is, peeling is performed at the interface between the conductive coating 1b and the metal plate 1a, and peeling is performed while being sandwiched between the jig thin film, the conductive coating 1b, and the support base 9. As a result, the jig thin film 4 can be peeled while being securely held. In addition, since the jig thin film 4 and the metal plate can be peeled off with almost no deformation, no stress remains on the jig thin film 4 and no deformation occurs. Furthermore, there is an advantage that a metal plate can be used repeatedly. In addition, when a film having high surface smoothness, such as an electrolytic plating film (electrodeposition film), is used as the conductive film 1b, the photoresist is in close contact with the conductive film 1b, so that generation of burrs can be prevented.
Further, when the jig thin film is formed by the etching method, it may be simply pasted onto the pressure-sensitive adhesive layer 10 of the support base 9 such as a film. The negative pressure adhesive layer 10 can be formed of, for example, an ultraviolet curable type, a heat curable type, or a time curable type pressure sensitive adhesive.
Here, as a typical example of an ultraviolet curable pressure-sensitive adhesive, an addition polymerizable compound having two or more unsaturated bonds, a photopolymerizable compound such as an alkoxysilane having an epoxy group, a carbonyl compound or an organic sulfur compound, Examples thereof include rubber pressure sensitive adhesives and acrylic pressure sensitive adhesives which are blended with photopolymerization initiators such as peroxides, amines, and onium salt compounds (see JP-A-60-196956). The blending amounts of the photopolymerizable compound and the photopolymerization initiator are generally 10 to 500 parts by weight and 0.1 to 20 parts by weight per 100 parts by weight of the base polymer, respectively.
In addition to acrylic polymers (see Japanese Patent Publication No. 57-54068, Japanese Patent Publication No. 58-33909, etc.), those having a radical reactive unsaturated group in the side chain (Japanese Patent Publication No. 61- 56264) and those having an epoxy group in the molecule can also be used. Examples of the addition polymerizable compound having two or more unsaturated bonds include polyhydric alcohol esters and oligoesters of acrylic acid and methacrylic acid, epoxy compounds and urethane compounds, and the like.
Furthermore, an epoxy group functional crosslinking agent having one or more epoxy groups in the molecule such as ethylene glycol diglycidyl ether can be additionally blended to increase the crosslinking effect. When the pressure-sensitive adhesive layer 10 is formed using an ultraviolet curable adhesive, it is necessary to use a transparent film or the like as the support substrate 9 in order to enable ultraviolet irradiation treatment.
Typical examples of thermosetting pressure-sensitive adhesives include cross-linking agents such as polyisocyanates, melamine resins, amine-epoxy resins, peroxides, and metal chelate compounds, and divinylbenzene and ethylene glycol diethylene as necessary. Examples thereof include rubber-based pressure-sensitive adhesives and acrylic-based pressure-sensitive adhesives in which a crosslinking regulator composed of a polyfunctional compound such as acrylate and trimethylolpropane trimethacrylate is blended.
Furthermore, examples of the time-curable pressure sensitive adhesive include those in which the adhesive strength is reduced by the evaporation of the mixed solvent over time.
Jig thin film 4Conductive coatingAfter being transferred to the pressure-sensitive adhesive layer 10 of the supporting substrate 9 together with 1b, as shown in FIG.Conductive coating1b is removed to expose the jig thin film 4 (hereinafter, this exposed surface may be referred to as the entire holding side). When the pressure-sensitive adhesive layer 10 is formed of an ultraviolet curable pressure-sensitive adhesive, prior to the removal of the conductive coating 1b, the pressure-sensitive adhesive layer 10 is irradiated with a small amount of ultraviolet light, It is preferable to reduce the adhesive force of the pressure-sensitive adhesive layer 10 in advance. Also with metal plate 1aConductive coatingPrior to peeling from 1b (see FIG. 8), the adhesive force of the pressure-sensitive adhesive layer 10 can be reduced. That is, the adhesive force of the UV curable adhesive is as strong as 2400 g / 25 mm width.Conductive coatingThis is because it is difficult to peel 1b from the pressure-sensitive adhesive layer 10. If the adhesive strength of the UV curable adhesive layer is excessively reduced,Conductive coatingWhen removing 1b, since the jig | tool thin film 4 also peels together, it is unpreferable. Therefore, it is desirable that the adhesive strength after ultraviolet irradiation is about 300 to 600 g / 25 mm width, preferably about 400 to 500 g / 25 mm width.
Next, as shown in FIG. 10, the minute article 2 separately manufactured as described above is accommodated in the minute article accommodating portion 3 of the thin film for jig 4. At this time, the micro article 2 is accommodated and attached to the pressure-sensitive adhesive layer 10 so that the back surface of the micro article 2 (that is, the surface fixed to the adherend) is positioned on the upper side.
Next, in the first method, as shown in FIG.andAn adhesive layer 11 for fixing is formed on the entire holding side of the micro article 2. The fixing adhesive layer 11 preferably has a stronger adhesive force than the pressure-sensitive adhesive layer 10. Thereafter, release paper 12 is stuck on the fixing adhesive layer 11 (see FIG. 12), and the fixing adhesive is aged. Next, the adhesive force of the pressure sensitive adhesive layer 10 is further reduced in this state.
Here, when the pressure-sensitive adhesive layer 10 is formed of an ultraviolet curable pressure-sensitive adhesive, after the release paper 12 is pasted, from the support base material 9 side, that is, the holding side of the jig thin film 4 and As shown in FIG. 13, the adhesive force of the pressure-sensitive adhesive layer 10 is changed to an extremely weak adhesive force by irradiating ultraviolet rays from the opposite side.
Further, when the pressure-sensitive adhesive layer 10 is formed of a thermosetting pressure-sensitive adhesive, when the support substrate 9 is further heated to form a time-curable pressure-sensitive adhesive. By giving a change with time, the adhesive force of the pressure-sensitive adhesive layer 10 is changed to an extremely weak adhesive force.
By such treatment, it is desirable to reduce the adhesive force of the pressure-sensitive adhesive layer 10 to 100 g / 25 mm width or less, preferably to about 30 to 50 g / 25 mm width.
Next, the release paper 12 is removed, and the fine article 2 is fixed to the adherend 13. At this time, the following two methods can be employed.
(A) In one method, as shown in FIG. 14, the jig thin film 4 is peeled in advance, and only the micro article 2 having the adhesive layer for fixing on the back surface is kept on the pressure-sensitive adhesive layer 10. In this state, as shown in FIG. 15, the minute article 2 is fixed on the adherend 13 via the fixing adhesive layer.
However, in the method (A), when the size of the micro article 2 is extremely small or the adhesive force of the pressure-sensitive adhesive layer 10 is extremely reduced, the positional deviation of the micro article 2 may occur. . In such a case, the following method (B) can also be adopted.
(B) In another method, the jig thin film 4 is placed on the adherend 13 together with the minute article 2 without peeling off (FIG. 16). Next, if necessary, the supporting substrate 9 is peeled and removed together with the pressure-sensitive adhesive layer 10 (FIG. 17), and only the minute article 2 is pressed to fix the minute article 2 on the adherend 13. At this time, since no pressure is applied to the jig thin film 4, the adhesive force between the jig thin film 4 and the adherend 13 is not large. Therefore, when the jig thin film 4 is peeled and removed, the fixing adhesive layer on the jig thin film 4 can be removed at the same time, so that only the micro article 2 remains on the adherend 13 and the micro article 2 is fixed. (FIG. 18).
Next, the second method for adhering a minute article according to the present invention will be described.
The second method for fixing a micro article according to the present invention is particularly effective for an adherend that is transmissive to ultraviolet rays.
The second fine article fixing method is the same as the first method up to the step shown in FIG. 10 except that the fixing adhesive layer 11 is formed on the adherend 13 side. This is different from the first method (FIG. 19). The fixing adhesive layer 11 is formed in advance on the surface of the adherend 13 by a technique such as screen printing or pad printing on the fine article fixing scheduled portion. The fixing adhesive layer 11 is not particularly limited, and can be formed from various conventionally known adhesives. However, as will be described later, when the adherend 13 is UV transmissive, UV curing is performed. It is preferable to form with a type pressure sensitive adhesive.
Next, the micro article 2 is fixed to the adherend surface through the fixing adhesive layer 11 in the same manner as in the first method.
Prior to the fixing of the fine article 2, the jig thin film 4 is removed from the pressure-sensitive adhesive layer 10 of the supporting base material 9, and the fine article 2 is held on the supporting base material 9 and the fine article 2 is covered. The jig thin film 4 may be removed together with the support base material 9 after the micro article 2 is fixed to the adherend surface.
As the adherend 13 in the second method, an ultraviolet light transmissive material such as glass, resin, ceramics, shellfish or the like is preferably used. The ultraviolet transmittance of such an ultraviolet transmissive adherend is preferably 30 to 80%, particularly preferably 50 to 80%. When such an ultraviolet transparent adherend is used, the adhesive layer 11 for fixing is preferably formed from the above-described ultraviolet curable pressure sensitive adhesive.
In this case, after fixing the fine article to the adherend, as shown in FIG. 20, when the adhesive layer for fixing is cured by irradiating ultraviolet rays from the back side of the adherend, the fine article and the adherend are more strongly bonded. Can be joined. The ultraviolet curable pressure-sensitive adhesive is cured by irradiation with ultraviolet rays and loses the pressure-sensitive adhesive force, but the micro article and the adherend can be firmly bonded by a so-called anchor effect.
That is, a preferred embodiment of the second method according to the present invention is as follows.
Forming a thin film 4 for a jig having a minute article housing part 3 (FIGS. 1 to 7);
The jig thin film 4 was transferred to the pressure-sensitive adhesive layer of the support substrate 9 provided with the ultraviolet curable pressure-sensitive adhesive layer 10 (FIGS. 8 and 9).
In the micro article storage unit 3, a separately manufactured micro article 2 is stored (FIG. 10),
An ultraviolet curable adhesive layer 11 for fixing is formed on a portion to be fixed to the minute article of the adherend 13 that is transparent to ultraviolet rays (FIG. 19);
The support substrate 9 and the micro article 2 are placed on the surface of the adherend, and the micro article 2 is fixed to the surface of the adherend 13 via the adhesive layer 11 for fixing. The adhesive layer 11 for fixing is cured by irradiating ultraviolet rays from the back surface, and the micro article 2 and the adherend 13 are firmly bonded (FIG. 20).
Further, the ultraviolet curable pressure-sensitive adhesive layer 10 is cured by irradiating ultraviolet rays from the side of the supporting substrate 9, the supporting substrate 9 is removed, and if the jig thin film 4 remains, this is also removed. do it,
Thus, the minute article 2 such as a rose character can be fixed to the surface of the adherend 13 such as a timepiece dial.
As described above, the method for adhering a micro article according to the present invention has been described. However, in the present invention, various techniques employed in the conventional electrodeposition imaging method can be applied. For example, simultaneously with the formation of the jig thin film 4. Alternatively, electrodeposition for guides having guide holes used for positioning may be formed. Similarly, when the etching method is used, a guide thin film having guide holes used for positioning may be formed simultaneously with the formation of the jig thin film.
Further, the present invention has been described with reference to a timepiece dial manufacturing example. However, the present invention is not limited to the timepiece dial manufacture, and can be used to attach a product name, a company name, etc. to a product, for example. It can also be applied to the manufacture of various decorative products.
The invention's effect
According to the present invention, it is possible to easily perform alignment and fixing of minute articles that conventionally required high skill.

Claims (5)

金属板と、その上に形成された導電性被膜とからなる導電性基材表面の導電性被膜の表面に電着法またはエッチング法により形成された微小物品収容部を有する治具用薄膜を形成する工程と、
前記微小物品収容部に、別途製作した微小物品を収容する工程と、
該微小物品裏面に固着用接着剤層を形成する工程と、
該微小物品を、固着用接着剤層を介して被着体に固着する工程を含むことを特徴とする微小物品の固着方法。Forming a thin film for a jig having a minute article containing portion formed by an electrodeposition method or an etching method on the surface of the conductive coating on the surface of the conductive substrate comprising a metal plate and a conductive coating formed thereon And a process of
Storing the separately manufactured micro article in the micro article storage unit;
Forming a bonding adhesive layer on the back surface of the micro article;
A method for fixing a micro article, comprising a step of fixing the micro article to an adherend through an adhesive layer for fixing. 金属箔をエッチングして形成されたものであるか、または、金属板と、その上に形成された導電性被膜とからなる導電性基材表面の導電性被膜の表面に電着法またはエッチング法により形成された微小物品収容部を有する治具用薄膜を形成し、
紫外線硬化型感圧接着剤層を設けた支持基材の該紫外線硬化型感圧接着剤層に、前記治具用薄膜を転写し、
前記微小物品収容部に、別途製作した微小物品を収容し、
前記微小物品裏面に固着用接着剤層を形成し、前記治具用薄膜を除去し、
前記支持基材から前記微小物品を剥離しつつ、
前記固着用接着剤層を介して前記微小物品を被着体の表面に固着することを特徴とする微小物品の固着方法。 It is formed by etching a metal foil, or an electrodeposition method or an etching method on the surface of the conductive coating on the surface of the conductive substrate composed of a metal plate and a conductive coating formed thereon Forming a thin film for a jig having a minute article containing portion formed by
The jig thin film is transferred to the ultraviolet curable pressure sensitive adhesive layer of the support substrate provided with the ultraviolet curable pressure sensitive adhesive layer,
In the minute article storage unit, a separately manufactured minute article is accommodated,
Forming a bonding adhesive layer on the back surface of the micro article, removing the jig thin film;
While peeling the micro article from the support substrate,
A method for fixing a micro article, wherein the micro article is fixed to a surface of an adherend through the fixing adhesive layer. 金属箔をエッチングして形成されたものであるか、または、金属板と、その上に形成された導電性被膜とからなる導電性基材表面の導電性被膜の表面に電着法またはエッチング法により形成された微小物品収容部を有する治具用薄膜を形成し、
紫外線硬化型感圧接着剤層を設けた支持基材の該紫外線硬化型感圧接着剤層に、前記治具用薄膜を転写し、
前記微小物品収容部に、別途製作した微小物品を収容し、
前記微小物品裏面に固着用接着剤層を形成し、
前記治具用薄膜および微小物品を、被着体表面に載置し、
微小物品部を押圧して前記固着用接着剤層を介して前記微小物品を被着体の表面に固着し、
前記治具用薄膜を除去することを特徴とする微小物品の固着方法。 It is formed by etching a metal foil, or an electrodeposition method or an etching method on the surface of the conductive coating on the surface of the conductive substrate composed of a metal plate and a conductive coating formed thereon Forming a thin film for a jig having a minute article containing portion formed by
The jig thin film is transferred to the ultraviolet curable pressure sensitive adhesive layer of the support substrate provided with the ultraviolet curable pressure sensitive adhesive layer,
In the minute article storage unit, a separately manufactured minute article is accommodated,
Forming an adhesive layer for fixing on the back surface of the micro article,
The jig thin film and the micro article are placed on the adherend surface,
Press the micro article part to fix the micro article to the surface of the adherend through the fixing adhesive layer,
A method for fixing a micro article, wherein the jig thin film is removed. 金属箔をエッチングして形成されたものであるか、または、金属板と、その上に形成された導電性被膜とからなる導電性基材表面の導電性被膜の表面に電着法またはエッチング法により形成された微小物品収容部を有する治具用薄膜を形成する工程と、
前記微小物品収容部に、別途製作した微小物品を収容する工程と、
被着体の微小物品固着予定部に紫外線硬化型感圧接着剤からなる固着用接着剤層を形成する工程と、
該微小物品を、紫外線硬化型感圧接着剤からなる固着用接着剤層を介して紫外線透過性である被着体に固着した後、被着体裏面から紫外線を照射して固着用接着剤層を硬化させ、微小物品と被着体とを強固に接合する工程を含むことを特徴とする微小物品の固着方法。 It is formed by etching a metal foil, or an electrodeposition method or an etching method on the surface of the conductive coating on the surface of the conductive substrate composed of a metal plate and a conductive coating formed thereon Forming a thin film for a jig having a micro article housing portion formed by:
Storing the separately manufactured micro article in the micro article storage unit;
Forming an adhesive layer for fixing composed of an ultraviolet curable pressure-sensitive adhesive on a part to be adhered to a fine article on an adherend;
The fine article is fixed to an adherend that is transparent to ultraviolet light through an adhesive layer made of ultraviolet curable pressure-sensitive adhesive, and then irradiated with ultraviolet rays from the back of the adherend to fix the adhesive layer. A method for fixing a micro article, comprising the step of curing the micro article and firmly bonding the micro article and the adherend . 金属箔をエッチングして形成されたものであるか、または、金属板と、その上に形成された導電性被膜とからなる導電性基材表面の導電性被膜の表面に電着法またはエッチング法により形成された微小物品収容部を有する治具用薄膜を形成し、
紫外線硬化型感圧接着剤層を設けた支持基材の該紫外線硬化型感圧接着剤層に、前記治具用薄膜を転写し、前記微小物品収容部に、別途製作した微小物品を収容し、
被着体の微小物品固着予定部に紫外線硬化型感圧接着剤からなる固着用接着剤層を形成する工程と、
前記支持基材および微小物品を、紫外線透過性である被着体表面に載置し、前記紫外線硬化型感圧接着剤からなる固着用接着剤層を介して前記微小物品を被着体の表面に固着した後、被着体裏面から紫外線を照射して固着用接着剤層を硬化させ、微小物品と被着体とを強固に接合することを特徴とする微小物品の固着方法。 It is formed by etching a metal foil, or an electrodeposition method or an etching method on the surface of the conductive coating on the surface of the conductive substrate composed of a metal plate and a conductive coating formed thereon Forming a thin film for a jig having a minute article containing portion formed by
The jig thin film is transferred to the ultraviolet curable pressure - sensitive adhesive layer of the support substrate provided with the ultraviolet curable pressure - sensitive adhesive layer, and a separately manufactured micro article is accommodated in the micro article accommodating portion. ,
Forming an adhesive layer for fixing composed of an ultraviolet curable pressure-sensitive adhesive on a part to be adhered to a fine article on an adherend;
The support substrate and the minute article are placed on the surface of the adherend that is transmissive to ultraviolet rays , and the minute article is placed on the surface of the adherend through an adhesive layer for fixing made of the ultraviolet curable pressure-sensitive adhesive. A method for fixing a micro article, comprising: fixing the micro article to the adherend by irradiating ultraviolet rays from the back side of the adherend to cure the adhesive layer for fixing.
JP50964699A 1997-07-22 1998-07-16 Method for fixing minute articles Expired - Lifetime JP4359791B2 (en)

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PCT/JP1998/003196 WO1999005233A1 (en) 1997-07-22 1998-07-16 Method of fixing very small articles

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