JP2004284182A - Metal mask screen plate and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a metal mask screen plate formed by laminating a metal mask and meshes together, in which lift and shift in adhesion/fixture of the mask and meshes are suppressed and which has a good dimensional accuracy, and a manufacturing method for easily obtaining this highly accurate metal mask screen plate. <P>SOLUTION: In this metal mask screen plate, the meshes 12 and the metal mask 12 having image-wise holes provided thereon are pasted together through a resin adhesive material 16. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a metal mask screen plate which is a plate material for screen printing which enables high-precision pattern printing, and a method for manufacturing the same. More specifically, the present invention relates to a metal mask screen plate having a structure in which a metal mask and a mesh are bonded together. And its manufacturing method.
[0002]
[Prior art]
[Patent Document 1]
JP-A-56-140353
[Patent Document 2]
JP-A-63-203787
[Patent Document 3]
JP-A-11-78203
[Patent Document 4]
JP-A-11-157042
[0003]
2. Description of the Related Art Conventionally, when solder paste, conductor paste, or the like is applied to a printed wiring board for mounting various electronic components or the like, screen printing that enables high-precision pattern printing has been employed. In particular, when high-precision pattern printing is desired, a metal mask screen plate is used as a plate material for screen printing (for example, see Patent Documents 3 and 4).
[0004]
Screen printing using a metal mask screen stencil is performed by pressing a metal mask screen stencil from one side to the other side of the metal mask stencil, which is located slightly away from the surface of the printing object, with a doctor or roller, while pressing the printing ink or other material. By extruding the adhered material, printing is performed on the surface of the printing medium. This printing method is suitable when the printing medium is hard and flat.
[0005]
A metal mask screen plate is obtained by laminating an elastic mesh (shape) and a metal mask (image forming layer) having a through image hole (generally, a “suspend metal mask plate” or a “suspend metal mask screen”). Plate, etc.) and a metal mask itself without mesh holes, through which ink is extruded straight through the through image holes (generally, "solid metal mask plate" or "solid metal mask screen plate"). Etc.). The latter is difficult to adopt when there is an island surrounded by holes in the image, or it is necessary to perform the printing work in a plurality of times. The former, which is capable of forming a high-definition image in operation, is generally advantageous.
[0006]
In order to manufacture such a metal mask screen plate, it is necessary to bond a metal mask and a mesh, and a plating method has been conventionally used for the bonding (for example, Patent Document 1 and Patent Document 1). Reference 2). That is, in a state where the metal mask and the mesh are overlapped, plating such as nickel plating is performed from the side of the mesh, thereby bonding and fixing the two. At this time, electroplating capable of forming a relatively thin plating layer is adopted so as not to block the holes of the mesh.
[0007]
[Problems to be solved by the invention]
Such electroplating is performed by vertically immersing in a plating bath while maintaining a state in which the metal mask and the mesh are overlapped. However, since the metal mask or mesh is thin and flexible, it may not be partially adhered. In this case, the adhesion / fixation of the portion becomes insufficient and the mesh floats, In the worst case, it cannot be used.
[0008]
In some cases, the plate-like support is attached to a metal mask, and the metal mask is superimposed on the metal mask from the surface on the side opposite to the plate-like support. If a certain degree of rigidity is adopted as the plate-shaped support, the flexibility of the metal mask side can be suppressed, but in this case, the mesh side still has flexibility, and the problem is solved. Does not connect.
[0009]
In addition, since plating is performed in a state where the fixing of the two is unstable, precise alignment of the two is difficult, and the dimensional accuracy is likely to deteriorate. Furthermore, since the two are bonded in a plating bath, workability is poor and cannot be visually confirmed. Therefore, even if the positions are shifted, the bonding is performed as it is, and the production is performed. It is easy to lead to a decline in sex.
[0010]
Therefore, the present invention provides a metal mask screen plate having a structure in which a metal mask and a mesh are bonded to each other. It is an object of the present invention to provide a screen plate and a manufacturing method capable of easily obtaining such a high-precision metal mask screen plate.
[0011]
[Means for Solving the Problems]
The above object is achieved by the present invention described below. That is, the metal mask screen plate of the present invention is characterized in that a mesh and a metal mask provided with image-like holes are bonded via a resin adhesive material.
[0012]
The resinous adhesive material can be applied to the surface of the mesh and / or the metal mask, and then bonded together. That is, the metal mask screen plate of the present invention is not required to be performed in a bath at the time of lamination at the time of production, and can be performed on, for example, a flat work table (flat table). Therefore, the metal mask screen plate of the present invention manufactured without performing the bonding operation in the bath as described above is capable of suppressing the occurrence of floating and displacement in bonding and fixing the two, and having good dimensional accuracy. It becomes.
The metal mask screen stencil of the present invention is generally a screen in a state in which the metal mask is stuck to the edge of the mesh except for a predetermined area, and the edge of the mesh is adhesively fixed to a plate frame. Provided for printing.
[0013]
On the other hand, the method of manufacturing a metal mask screen plate of the present invention is a method of manufacturing a metal mask screen plate obtained by laminating a mesh and a metal mask provided with image-like holes,
An image forming step of forming the metal mask on the surface of the flat support,
An application step of applying a resin adhesive material to the surface of the mesh and / or the metal mask;
An adhesion step of superimposing the mesh and the surface of the flat support on the metal mask side, and thereafter curing the resinous adhesive material,
A peeling step of peeling the mesh to which the metal mask is attached from the flat support,
It is characterized by comprising.
[0014]
As described above, the method for producing a metal mask screen plate of the present invention enables the operation of the bonding step to be performed outside the bath, regardless of whether the operation of the coating step is performed in the bath. Alignment is easy, dimensional accuracy is good, workability is good, and it can be confirmed by eyes, so that misalignment hardly occurs and productivity is high. Furthermore, since it is not necessary to keep the two superimposed vertically, and there is no restriction on the support as in a bath, the positioning is easy, and also the floating and misalignment of the bonding and fixing of the two. Is suppressed.
[0015]
In particular, in the bonding step, if the flat support is placed on a flat base with the metal mask side facing upward, and the mesh is superimposed thereon, the planar state of the metal mask is reduced. Since it is easily held and firmly fixed, workability is extremely good, and it is possible to suppress the occurrence of floating and misalignment in bonding and fixing the two to a higher degree.
[0016]
In the method for producing a metal mask screen plate of the present invention, it is preferable that the resinous adhesive material is an electrodeposition paint, and the application step is a step of electrodepositing the electrodeposition paint.
According to the electrodeposition coating, it is possible to easily form a thin and uniform coating film of the resin adhesive material in a necessary and sufficient amount for bonding the metal mask and the mesh, and to form holes in the mesh. It is possible to prevent problems such as sealing or forming a coating film in such an amount as to greatly change the opening area of the hole or the hole of the metal mask. In particular, to form a uniform coating film on a fine mesh-like mesh, it is advantageous to employ electrodeposition coating.
At this time, it is desirable that the electrodeposition paint used is a cationic electrodeposition paint. The cationic electrodeposition paint can be applied with a smaller film thickness as compared with the anion electrodeposition paint, and a coating film having higher hardness can be obtained.
[0017]
In the method for producing a metal mask screen plate of the present invention, it is preferable that the flat support is a stainless steel plate. By using a stainless steel plate, separation with the metal mask in the separation step is easily performed.
[0018]
In the image forming step, the metal mask is formed by depositing a resist imagewise on the surface of the plate-shaped support, applying a metal plating thereto, and forming a metal plating layer only on a portion where the resist is not attached. Generally, it is a step of forming and further removing the resist.
[0019]
In addition, the method for manufacturing a metal mask screen plate of the present invention generally further includes a gauging step of bonding and fixing the edge of the mesh to a plate frame. By this gauging step, a metal mask screen plate that can be mounted on a general screen printing apparatus can be obtained.
[0020]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, the present invention will be described in detail with reference to the drawings.
<Metal mask screen plate of the present invention>
FIG. 1 is a plan view of a metal mask screen plate according to an embodiment which is an exemplary aspect of the present invention, and FIG. 2 is a cross-sectional view taken along line AA of FIG. As shown in FIGS. 1 and 2, the metal mask screen plate according to the present embodiment is mainly attached to a plate frame 14, a mesh (grid) 12 stretched on the plate frame 14, and a central portion of the mesh 12. And a metal mask (image forming layer) 10. The metal mask 10 is provided with an image-like hole as an image forming layer.
[0021]
FIG. 3 is an enlarged cross-sectional view of a portion where the mesh 12 and the metal mask 10 of the metal mask screen plate of the present embodiment are bonded. As shown in FIG. 3, the mesh 12 and the metal mask 10 are bonded together via a resin adhesive material 16 applied to the entire mesh 12.
[0022]
FIG. 4 is an enlarged cross-sectional view of a portion where the mesh 12 ′ and the metal mask 10 ′ of the metal mask screen plate as a modification of the present embodiment are bonded. In this modification, as shown in FIG. 4, the mesh 12 'and the metal mask 10' are bonded together via a resin adhesive material 16 'applied to the entire metal mask 10'.
In the present invention, the surface to be coated with the resinous adhesive material may be either a mesh or a metal mask, or both may be coated with the resinous adhesive material.
[0023]
Further, in the present embodiment and the above-described modified example, the resin adhesive material is applied so as to cover the entire mesh or the metal mask, but the resin adhesive material is applied only to a portion where the metal mask and the mesh are bonded. Is sufficient if it is applied. When the resin adhesive material is applied by electrodeposition coating described later or by other dip coating, the resin adhesive material is generally applied in a state of covering the entire mesh or metal mask.
[0024]
In any case, the metal mask and the mesh are included in the scope of the present invention as long as they are bonded via a resin adhesive material. In addition, a resin adhesive material does not necessarily have to be interposed between the metal mask and the mesh, and the metal mask and the mesh come into direct contact with each other, and the metal adhesive and the resin adhesive material adhere around the mesh. It may be fixed, and such a state is included in the concept of “via a resinous adhesive material” in the present invention.
[0025]
In order to perform screen printing using the metal mask screen plate having the above-described configuration, the side on which the metal mask 10 is attached is directed downward (that is, shown in FIG. 2), and the upper side of the planar printing target is exposed. A hole provided in the metal mask 10 while the metal mask 10 is brought into contact with the surface of the printing object by being slid while being pressed from above by a squeegee member such as a doctor or a roller. Then, an attachment member such as ink is extruded from the substrate, and the attachment member is attached imagewise. In this way, a printed matter on which a desired image is drawn can be obtained.
[0026]
Next, each material constituting the metal mask screen plate of the present invention will be described.
(Metal mask)
In the present invention, the material of the metal mask is not particularly limited, and various metals conventionally used as the material of the metal mask in the metal mask screen plate can be used without any problem. Specific examples include nickel, iron, copper, and alloys containing these metals. Among these, nickel and its alloys are preferable from the viewpoint of workability and economy.
[0027]
In the present invention, the thickness of the metal mask is not particularly limited, but is preferably selected from the range of 5 μm to 20 μm, and is preferably 10 μm to 15 μm in order to secure a certain degree of flexibility and durability during printing. It is more preferable to select from the range.
[0028]
In the present invention, the size of the metal mask depends on the area of the surface to be printed, and is not particularly limited. Generally, a rectangular shape having a side of 200 mm to 650 mm is selected. Of course, the shape of the metal mask is not limited to a rectangle.
[0029]
The method of providing image-like holes in the metal mask will be described in the section of (Image Forming Step) in <Method of Manufacturing Metal Mask Screen Plate of the Present Invention> to be described later.
In addition, various aspects such as the physical properties, characteristics, and forms of the metal mask are not particularly limited, and may be used in the present invention without any problem as long as they are in the range that has been conventionally used for metal masks in metal mask screen plates. Can be used.
[0030]
(mesh)
In the present invention, the material of the mesh is not particularly limited, and any material conventionally used as a material for a mesh (shape) in a metal mask screen plate can be used without any problem. Specific examples include metal meshes such as stainless steel, aluminum, iron, copper, and alloys containing these metals, and resin meshes such as polyester (for example, Tetron (registered trademark)). Further, the surface of these resin meshes may be covered with the above metal or alloy.
[0031]
In the present invention, the thickness of the fibers constituting the mesh is as thin as not to impair the function as a metal mask screen plate, and, in order to secure a certain degree of flexibility and durability during printing, from 25 m to It is preferable to select from the range of 80 μm, and more preferable to select from the range of 28 μm to 35 μm.
[0032]
In the present invention, the density of the fibers constituting the mesh (so-called “mesh”) is preferably large (fine eyes) to form a high-definition image, but is too large (fine eyes). In some cases, the components of the attachment member such as ink cannot be sufficiently transmitted. Therefore, it is preferably 39 to 177 (100 to 450 mesh) per mm, and more preferably 78 to 350 (200 to 350 mesh).
[0033]
In the present invention, the size of the mesh depends on the area of the metal mask and is not particularly limited. Generally, a rectangular shape whose one side is larger than the metal mask within a range of 400 mm to 450 mm is selected. You. Of course, a shape other than a rectangle may be selected according to the shape of the metal mask, but a rectangular mesh or another shape may be selected regardless of the shape of the metal mask.
In addition, various aspects such as the physical properties, characteristics, and form of the mesh are not particularly limited, and may be used in the present invention without any problem as long as they are in the range conventionally used for meshes in metal mask screen plates. be able to.
[0034]
(Resin adhesive material)
In the present invention, as the resin-made adhesive material, any resin material can be used as long as it can bond and fix the metal mask and the mesh. Resin material, depending on its properties, thermoplastic resin, thermosetting resin, room temperature curable resin, ultraviolet curable resin, curing agent curable resin, etc., if considering each of these properties, if selected according to the purpose Good. Further, a resin material particularly used as an adhesive can also be used in the present invention. Further, resin materials generally used as paints can also be suitably used in the present invention.
[0035]
Specific examples of the resinous adhesive material that can be used in the present invention include an epoxy resin, an acrylic resin, a melamine resin, and a melamine-alkyd resin.
[0036]
The thickness (dry / cured state) of the coating film formed by the resin-made adhesive material may be in a range where printing accuracy and the adhesive strength between the metal mask and the mesh are sufficiently maintained. Since it varies depending on the resin adhesive material used, the mesh or metal mask used, and the required printing accuracy, etc., it cannot be said unconditionally, but it is preferably in the range of about 2 to 10 μm, and more preferably in the range of 5 to 7 μm. Is more preferred. However, when applying a resin adhesive material to the metal mask, the size of the hole provided in the metal mask may be designed to be large in advance in consideration of the coating thickness of the resin adhesive material, or the hole may be designed to be large. The upper limit of the thickness of the coating film is relaxed by applying the coating film so as not to wrap around the edge of the film.
[0037]
(Plate frame)
In the present invention, the plate frame is not particularly limited, and a plate frame conventionally used as a plate frame in a metal mask screen plate can be used without any problem. When the mesh is stretched, sufficient tension is applied to the mesh, and the shape, structure, size, and material of the mesh are not limited as long as the mesh has sufficient shape retention when subjected to screen printing. Specific materials include metal materials such as stainless steel, aluminum, iron, and copper, as well as various plastic materials.
[0038]
In the present invention, the plate frame is not an essential component, but is used in normal screen printing in a state where the plate frame is stretched. However, it is also conceivable that screen printing can be performed without a plate frame such as a mode in which the metal mask screen is directly attached to a printing apparatus. Even in such a case, the metal mask screen plate of the present invention can be suitably used.
[0039]
<Method for producing metal mask screen plate of the present invention>
The method for manufacturing a metal mask screen plate of the present invention (hereinafter, sometimes simply referred to as “the manufacturing method of the present invention”) includes an image forming step, a coating step, a bonding step, and a peeling step, which are essential steps. In the case of using a stencil on a plate frame, a sieving step is further included. This gauging step may be performed after any of the above steps, or may be performed, for example, during the bonding step. Hereinafter, the manufacturing method of the present invention will be described for each step.
[0040]
(Image forming step)
In the manufacturing method of the present invention, the “image forming step” refers to a step of forming a metal mask (image forming layer) provided with image-like holes on the surface of a flat support.
The flat support used here is not particularly limited as long as it can hold the formed metal mask in a flat shape. Specifically, stainless steel, aluminum, copper, iron, zinc, lead, etc. Examples thereof include metal materials and alloys containing these materials. Among these, a material having good peelability in a peeling step described later is preferable, and specifically, stainless steel, aluminum, and copper are preferable, and stainless steel is particularly preferable.
[0041]
As a method of forming a metal mask on the surface of the plate-shaped support, a known method conventionally used for manufacturing a metal mask screen plate can be used without any problem. As such a method, specifically, a resist method described later, an etching method in which a metal layer is provided on a plate-shaped support, and only a metal layer is chemically removed after providing a mask provided with image-like holes, A laser method for directly peeling only the metal layer imagewise, a resist electrodeposition method by plating, and the like can be mentioned, and any of them can be suitably applied to the present invention.
The most common resist method among these will be described below as an example.
[0042]
FIG. 5 is a process explanatory view showing an example of a manufacturing method of the present invention in a cross-sectional view, in which an image forming step is performed by a resist method, and a metal mask screen plate is manufactured through the subsequent steps. 5A to 5C show the flow of the image forming process by the resist method.
[0043]
First, as shown in FIG. 5A, a resist 22 is imagewise adhered to the surface of the flat support 18. The resist 22 can be formed, for example, by using a material such as NEF150, 125 (trade name, manufactured by Nichigo Morton Co., Ltd.). For the attachment of the resist 22, any conventionally known method can be adopted, and the various conditions can be the same as those commonly used in the production of a metal mask screen plate. Omit.
[0044]
Next, as shown in FIG. 5 (a), metal plating is applied to the surface on which the resist 22 is formed imagewise, and as shown in FIG. The layer 20 is formed. Metal plating is also performed according to a conventional method according to the metal material used.
[0045]
Then, the resist 22 is removed by an ordinary method. Although the removal of the resist 22 depends on the material used as the resist, there is no problem if this is performed by a conventionally known method. When the resist 22 is removed, only the metal plating layer 20 remains on the surface of the flat support 18 as shown in FIG. The metal plating layer 20 forms a metal mask (image forming layer) 10. Note that, in FIG. 5, the metal mask 10 is slightly exaggerated in thickness as compared with FIGS. 1 to 4.
[0046]
In the above example, the resist method was used, but the present invention is not limited to this. Regardless of the image forming process performed by either method, finally, as shown in FIG. It is sufficient if the metal mask 10 is formed on the surface of the support 18. However, according to the resist method, the dimensional accuracy is higher and the shape of the opening is better than other methods.
[0047]
(Coating process)
In the manufacturing method of the present invention, the “coating step” refers to a step of coating a resin adhesive material on the surface of the mesh and / or the metal mask.
Various methods can be employed for applying the resinous adhesive material in the application step, depending on the resinous adhesive material used. Specific examples include a dip coating method, a spray coating method, a roller coating method, and a brush coating method. For example, when the resinous adhesive material to be used is a general adhesive, a roller coating method and a brush coating method are preferable. On the other hand, when the resinous adhesive material is in a state of a so-called paint in which the resin material is dissolved in an appropriate solvent, all of the exemplified coating methods can be employed, and among them, a uniform coating film can be formed. It is preferable to use a dip coating method which is easy.
[0048]
Electrodeposition coating is desirably applied to metal masks and meshes for which precise film thickness control is desired, as in the production method of the present invention. In particular, when applying to the mesh when applying a method other than electrodeposition coating, it is difficult to maintain uniformity of the coating film, and clogging is likely to occur. Is preferred.
[0049]
Electrodeposition coating uses an electrodeposition paint as the resinous adhesive material, immerses a metal mask or a mesh as an application target in the electrodeposition paint, immerses the counter electrode at the same time, and forms a coating between the application target and the counter electrode. This is performed by applying a DC voltage between them. At this time, an electrodeposition coating film having a desired film thickness can be formed by controlling the voltage, the conduction time and the temperature, or controlling the coulomb.
[0050]
Further, in the electrodeposition coating, by arranging the counter electrode so as to face a portion where the coating film is to be positively applied, the thickness of the portion can be made thicker than other portions. Therefore, in the manufacturing method of the present invention, when electrodeposition coating is adopted in the coating step, in the case of coating any of a metal mask and a mesh, the counter electrode is opposed to the surface on which both are to be bonded. It is preferable to arrange them.
[0051]
There is no limitation on the electrodeposition paint to be used, and the electrodeposition paint may be used or the electrodeposition paint may be prepared according to the resinous adhesive material to be applied. Therefore, either an anionic electrodeposition paint or a cationic electrodeposition paint may be used, but the cationic electrodeposition paint is preferable in consideration of the throwing power, adhesiveness and durability after curing, resin film hardness, and the like. In that case, an epoxy resin is most preferable as the resin component.
[0052]
In addition, not only the electrodeposition coating, but also in all coatings, the surface on which the coating film may not be formed, that is, when coating any of the metal mask and the mesh, the surface on which both are bonded is If the operation of the coating process is performed by masking the opposite surface, the coating film can be formed only on the surface on which both are bonded, and the amount of paint used can be reduced. The dimensional accuracy of the obtained metal mask screen plate can be improved.
[0053]
The application conditions (for example, in the case of a coating containing a solvent, the heating residue (NV), viscosity, application environment temperature, application liquid temperature, etc.) are not particularly limited, and are set according to a desired coating film formation state. What is necessary is just to select suitably according to the knowledge conventionally performed in the field of coating and plastic molding. In particular, in the case of electrodeposition coating, the conditions of the coating material are also various (for example, in addition to the above conditions, for example, acid concentration, ash content, voltage, energizing time, coulomb amount, etc.). Just select. For example, in the case of electrodeposition coating using an epoxy resin-based (amino-modified) cationic electrodeposition coating material, a use temperature of 20 to 30 ° C. (more preferably 25 to 28 ° C.), a voltage of 30 to 200 V, and a conduction time of 1 to 20 minutes. It is desirable to select each from the range.
[0054]
The surface of the mesh and the metal mask may be applied with the resin adhesive material. By applying it to at least one of the surfaces, the adhesion in the next step can be performed. Of course, it is also possible to apply to both.
When applying the resinous adhesive material in an application liquid such as electrodeposition coating or other dip coating method, since a coating film is usually formed on the front and back surfaces of the object to be coated, an attempt is made to apply the metal mask to the metal mask. As a result, a coating film is formed on the side of the flat support supporting the metal mask opposite to the side on which the metal mask is formed, and also on the surface exposed from the holes of the metal mask, which is not economical. Accordingly, in this case, it is preferable to take measures such as applying a mask as described above or modifying the arrangement of the electrodes. However, in order to simplify the operation, it is preferable to apply the coating only to the mesh. The mesh itself is advantageous because it has a small area to be applied.
[0055]
In the production method of the present invention, in the coating step, a coating film is formed, but the coating film is not cured. This is because curing of the coating film is used for bonding the metal mask and the mesh in a bonding step described later. Therefore, even when a paint containing a solvent is applied, the operation of the application step may be terminated while the coating film is in a wet state, but if the coating film is not too dry, it may be used in the next bonding step. It is preferable that the coating film is dried because the handleability of the film deteriorates. In particular, in the case of electrodeposition coating, the object to be coated is immersed in the electrodeposition coating, energized, pulled up, washed with water, and the coating operation is completed, but in that state a large amount of moisture remains on the surface, Drying is preferred. Of course, when a resin material containing no solvent is heated and melted or applied, or a so-called adhesive is applied, drying is unnecessary.
[0056]
In the case of drying, the drying may be performed to the extent of touch-drying or slightly dried. Of course, if it is dried too much, the adhesive strength will be lost. Such drying conditions (temperature and time) vary greatly depending on the amount and type of the solvent, the type of the resin material, the thickness of the coating film, etc., and cannot be said unconditionally. However, for example, cationic electrodeposition of epoxy resin (amino-modified) In the case of electrodeposition coating with a paint, it is desirable to select from a range of 20 to 60 minutes at 50 to 80 ° C.
[0057]
(Adhesion process)
In the manufacturing method of the present invention, the “adhesion step” refers to a step of superimposing the mesh and the surface of the flat support on the metal mask side, and thereafter curing the resin adhesive material. That is, the bonding step can be further subdivided into two steps of “superposition” and “curing”.
[0058]
The operation of “overlapping” is performed by fixing one of the mesh and the plate-shaped support on which the metal mask is formed, and holding the other by an operator's hand or mechanically. Are performed by superimposing them exactly. Both may be held mechanically, and the superposition operation may be performed mechanically. At this time, control is performed so that the metal mask is arranged at the center of the mesh.
[0059]
Thus, regardless of whether the operation of the coating process is performed in the bath or not, the “overlapping” operation can be performed outside the bath, and precise positioning of the two can be easily performed, and the dimensional accuracy can be improved. In addition, the workability is good, and it can be visually confirmed, so that the displacement is hardly generated and the productivity is high. Furthermore, since it is not necessary to keep the two superimposed vertically, and there is no restriction on the support as in a bath, the positioning is easy, and also the floating and misalignment of the bonding and fixing of the two. Is suppressed.
[0060]
At this time, it is particularly preferable that the flat support is placed on a flat base with the metal mask side facing upward, and the mesh is overlaid thereon. By doing so, the planar state of the metal mask is easily maintained, and the metal mask is firmly fixed, so that the workability is extremely good, and the occurrence of floating or misalignment in bonding and fixing the two is more improved. It can be suppressed at a high level.
[0061]
After the “overlap” operation is performed in this manner, the “curing” operation is performed, and the mesh and the metal mask are bonded and fixed. The operation of “curing” is selected according to the type of the resinous adhesive material applied in the application step. When the thermoplastic resin is applied by heating and melting as it is, the resin may be left at room temperature. When a paint containing a thermosetting resin is applied, it is cured by heating and baking. When a paint containing an ultraviolet-curable resin is applied or heated and melted and applied, it is cured by irradiating ultraviolet rays. When a paint containing a room temperature curable resin or a so-called adhesive is applied, it may be left as it is at room temperature. When applying a coating material containing a curing agent-curable resin, it is, of course, necessary to add a curing agent at the application stage and complete the operation of the bonding step quickly before curing.
[0062]
The curing conditions are, of course, determined according to the curing operation and the type of the resinous adhesive material applied in the application step. Although it cannot be said unconditionally, for example, an epoxy resin (amino-modified) cationic electrodeposition paint is used. In the case of electrodeposition coating, the firing temperature and time are preferably selected from the range of 100 to 200 ° C (more preferably 130 to 150 ° C) and 20 to 60 minutes.
[0063]
FIG. 5D shows the state after the end of the bonding step. As shown in FIG. 5D, the metal mask 10 (metal plating layer 20) formed on the surface of the flat support 18 and the mesh 12 are bonded and fixed through the bonding step.
[0064]
(Peeling process)
In the manufacturing method of the present invention, the “peeling step” refers to a step of peeling the mesh on which the metal mask is bonded from the flat support.
The flat-plate support, the mesh and the metal mask are sandwiched and provided for the step, and the mesh is peeled off from the flat-plate support in the step, whereby the metal mask is also moved. The metal mask screen plate of the present invention in a state where the mesh is peeled off and the metal mask is bonded via a resin adhesive material is manufactured. As described above, a material having good releasability at the time of the peeling is preferable as the flat support. When peeling off, it is desired that the work be performed with care so as not to damage the mesh 12 and the metal mask 10.
[0065]
FIG. 5E shows a state after the peeling step is completed. As shown in FIG. 5E, the metal mask 10 (metal plating layer 20) formed on the surface of the flat support 18 is peeled off together with the mesh 12 through the peeling step, and the mesh 12 and the metal mask are removed. Thus, the metal mask screen plate of the present invention, which is bonded to No. 10, is manufactured.
[0066]
(Saori process)
In the manufacturing method of the present invention, the “grinding step”, which is an ancillary step, refers to a step of bonding and fixing the edge of the mesh to the plate frame.
As described above, the gauging step may be performed after any of the above steps, or may be performed, for example, during the bonding step. More specifically, the mesh to be used in the manufacturing method of the present invention is preliminarily gauged in this step, or in the bonding step, the mesh is overlapped with the surface of the flat support on the metal mask side. The gauging process may be performed at any stage between the image forming process and the peeling process, such as performing gauging by the gauging process at the stage, and then curing the resin adhesive material. Absent. Of course, there is no problem if the gauging step is performed after the peeling step is performed.
[0067]
The gauging step is, more specifically, an operation of adhesively fixing the edge to the above-described plate frame while applying tension to the mesh, and any conventionally known method may be employed for this. Can be. For example, examples of the adhesive fixing method include a method by welding, a method by an adhesive, a method by plating, a method by ultrasonic welding, a mechanical mounting method such as mounting by pressing with a screw or a holding tool, and the like. It does not matter which method is used.
[0068]
FIG. 5F shows a state in which a gauze process is performed after the peeling process is completed. As shown in FIG. 5 (f), the mesh 12 to which the metal mask 10 (the metal plating layer 20) is bonded is further stretched to the plate frame 14 at the edge by passing through the peeling step. A metal mask screen plate is manufactured.
[0069]
As described above, the metal mask screen printing plate of the present invention and the method for manufacturing the same have been described in detail with reference to specific examples. However, the present invention is not limited to the above examples, and those skilled in the art will be able to use the known knowledge. Changes and improvements can be made to the configuration of the invention.
[0070]
【The invention's effect】
As described above, according to the present invention, there is provided a metal mask screen plate having a structure in which a metal mask and a mesh are bonded to each other. A metal mask screen plate and a manufacturing method capable of easily obtaining such a high-precision metal mask screen plate can be provided.
[Brief description of the drawings]
FIG. 1 is a plan view of a metal mask screen plate of an embodiment which is an exemplary aspect of the present invention.
FIG. 2 is a sectional view of the metal mask screen plate of FIG. 1 taken along the line AA.
FIG. 3 is an enlarged sectional view of a portion where the mesh and the metal mask of the metal mask screen plate of FIG. 1 are bonded.
FIG. 4 is an enlarged sectional view of a portion where a mesh and a metal mask of a metal mask screen plate as a modification are bonded.
FIGS. 5A and 5B are cross-sectional views illustrating an example of a manufacturing method of the present invention in which an image forming step is performed by a resist method, and a metal mask screen plate is manufactured through the subsequent steps. In the process, a state in which a resist is imagewise adhered to the surface of a flat support, (b) is a state in which a metal plating layer is formed only in a portion where no resist is adhered in an image forming process, and (c) is an image. The state where the resist is removed in the forming step and the step is completed, (d) is the state after the bonding step is completed, (e) is the state after the peeling step is completed, and (f) is the gauging step after the peeling step is completed. , Respectively.
[Explanation of symbols]
10, 10 'metal mask
12, 12 'mesh
14 plate frame
16, 16 'Resin adhesive material
18 flat support
20 Metal plating layer
22 Resist

Claims (9)

A metal mask screen plate, wherein a mesh and a metal mask provided with image-like holes are bonded via a resin adhesive material. 2. The metal mask screen according to claim 1, wherein the metal mask is bonded to the mesh except for a predetermined area from an edge of the mesh, and the edge of the mesh is adhesively fixed to a plate frame. 3. Edition. A method for manufacturing a metal mask screen plate, comprising bonding a mesh and a metal mask provided with image-like holes,
An image forming step of forming the metal mask on the surface of the flat support,
An application step of applying a resin adhesive material to the surface of the mesh and / or the metal mask;
An adhesion step of superimposing the mesh and the surface of the flat support on the metal mask side, and thereafter curing the resinous adhesive material,
A peeling step of peeling the mesh to which the metal mask is attached from the flat support,
A method for producing a metal mask screen plate, comprising: 4. The metal mask screen according to claim 3, wherein in the bonding step, the flat support is placed on a flat base with the metal mask side facing upward, and the mesh is overlaid thereon. 5. Plate manufacturing method. The method according to claim 3 or 4, wherein the resinous adhesive material is an electrodeposition paint, and the applying step is a step of electrodepositing the electrodeposition paint. The method according to claim 5, wherein the electrodeposition paint is a cationic electrodeposition paint. The method for producing a metal mask screen plate according to any one of claims 3 to 6, wherein the flat support is a plate made of stainless steel. In the image forming step, a resist is adhered imagewise to the surface of the flat support, metal plating is performed on the plate, a metal plating layer is formed only on a portion where the resist is not attached, and the resist is further removed. The method for manufacturing a metal mask screen plate according to any one of claims 3 to 7, wherein the method is a step of forming the metal mask. The method for manufacturing a metal mask screen plate according to any one of claims 3 to 8, further comprising a gauze step of bonding and fixing an edge of the mesh to a plate frame.

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