JP3364195B2 - Patterned electrodeposited image and manufacturing method thereof - Google Patents
Patterned electrodeposited image and manufacturing method thereofInfo
- Publication number
- JP3364195B2 JP3364195B2 JP2000167526A JP2000167526A JP3364195B2 JP 3364195 B2 JP3364195 B2 JP 3364195B2 JP 2000167526 A JP2000167526 A JP 2000167526A JP 2000167526 A JP2000167526 A JP 2000167526A JP 3364195 B2 JP3364195 B2 JP 3364195B2
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- Prior art keywords
- image
- thin film
- pattern
- patterned
- electrodeposition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
【０００１】[0001]
【発明の属する技術分野】本発明は、時計用バラ文字や
装飾部品等に用いられる電着画像およびその製造方法に
関し、さらに詳しくは、布目、紙目、石目などの微細模
様が表面に形成されてなる電着画像およびその製造方法
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electro-deposited image used for rose characters for clocks, decorative parts and the like and a method for producing the same. More specifically, a fine pattern such as cloth, paper or stone is formed on the surface. The present invention relates to an electro-deposited image and a manufacturing method thereof.
【０００２】[0002]
【従来の技術】時計用のバラ文字や装飾部品等の微細で
複雑な形状を有する物品にあっては、金属板の表面にこ
れらの画像形成部以外の部分にレジスト膜を形成するこ
とによって、金属板の表面にこれらの画像の形状に沿っ
た導電部を形成し、この導電部の上に電着法により金属
を析出させて電着画像を形成し、この電着画像を接着剤
を介して一旦フィルム等の支持基材に転写して保持した
後、この電着画像を支持基材から剥離しつつ、接着剤を
介して時計用表示板等の被着物に再度転写することが広
く行われている。たとえば、特開平７−３３１４７９号
公報、特開平８−２７５９７号公報等には、上記の電着
画像法ならびにその改良が種々開示されている。2. Description of the Related Art In articles having fine and complicated shapes such as rose letters for clocks and decorative parts, a resist film is formed on the surface of a metal plate except for these image forming portions. A conductive part is formed on the surface of the metal plate according to the shape of these images, a metal is deposited on this conductive part by an electrodeposition method to form an electrodeposition image, and this electrodeposition image is transferred via an adhesive. After being transferred to a supporting substrate such as a film and held, the electrodeposited image can be peeled from the supporting substrate and transferred to an adherend such as a timepiece display plate through an adhesive. It is being appreciated. For example, Japanese Patent Application Laid-Open No. 7-331479 and Japanese Patent Application Laid-Open No. 8-27597 disclose various above-mentioned electrodeposition image methods and improvements thereof.
【０００３】ところで、近年、上記のようなバラ文字や
装飾部品等においては、さらに装飾性の向上が求められ
ている。By the way, in recent years, further improvement in decorativeness has been demanded for the above-mentioned rose letters and decorative parts.
【０００４】[0004]
【発明が解決しようとする課題】本発明は、模様付電着
画像およびその製造方法を提供することを目的としてい
る。SUMMARY OF THE INVENTION It is an object of the present invention to provide a patterned electrodeposition image and a method for producing the same.
【０００５】[0005]
【課題を解決するための手段】本発明に係る模様付電着
画像は、表面に模様を有し、断面が略方形であることを
特徴としている。本発明に係る模様付電着画像の製造方
法は、模様を有する物品の表面模様を、導電性薄膜に転
写し、必要に応じ、該導電性薄膜の模様面に離型処理を
施し装飾用薄膜層を形成した後、該模様面に電着画像を
形成することを特徴としている。The patterned electrodeposition image according to the present invention is characterized by having a pattern on the surface and having a substantially rectangular cross section. The method for producing a patterned electrodeposition image according to the present invention is a decorative thin film in which the surface pattern of an article having a pattern is transferred to a conductive thin film, and if necessary, the pattern surface of the conductive thin film is subjected to release treatment. After the layer is formed, an electrodeposition image is formed on the patterned surface.
【０００６】また、本発明に係る模様付電着画像の製造
方法においては、導電性薄膜の平滑面を、導電性基材上
に固定した後、導電性薄膜の模様面に電着画像を形成す
ることが好ましい。本発明に係る模様付電着画像の固着
方法は、上記のような製造方法により模様付電着画像形
成後、電着画像の平滑面を第１の支持基材に貼着し、導
電性薄膜を剥離して電着画像の模様面を露出させ、電着
画像の模様面を第２の支持基材に貼着し、前記第１の支
持基材を剥離して電着画像の平滑面を露出させ、該電着
画像の平滑面に固着用粘着剤層を形成し、該固着用粘着
剤層を介して電着画像を被着体に固着し、第２の支持基
材を剥離することを特徴としている。In the method for producing a patterned electrodeposition image according to the present invention, after fixing the smooth surface of the conductive thin film on the conductive substrate, the electrodeposition image is formed on the patterned surface of the conductive thin film. Preferably. The method for fixing a patterned electrodeposition image according to the present invention is a method in which a smooth surface of the electrodeposition image is adhered to a first supporting substrate after the patterning electrodeposition image is formed by the manufacturing method as described above, and a conductive thin film is formed. To expose the patterned surface of the electro-deposited image, adhere the patterned surface of the electro-deposited image to the second supporting base material, peel off the first supporting base material to form the smooth surface of the electro-deposited image. Exposing, forming a sticking pressure-sensitive adhesive layer on the smooth surface of the electrodeposition image, fixing the electrodeposition image to the adherend via the fixing pressure-sensitive adhesive layer, and peeling off the second supporting base material. Is characterized by.
【０００７】[0007]
【発明の実施の形態】以下、本発明に係る模様付電着画
像およびその製造方法について、図面を参照しながら、
さらに具体的に説明する。図１に示すように、本発明に
係る模様付電着画像１は、表面が凹凸状の模様面になっ
ており、その断面が略方形の形状をしている。BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, a patterned electrodeposition image and a method for producing the same according to the present invention will be described with reference to the drawings.
A more specific description will be given. As shown in FIG. 1, the patterned electrodeposition image 1 according to the present invention has an uneven patterned surface, and its cross section has a substantially rectangular shape.
【０００８】模様は特に限定はされず、布、紙、石目、
木目、輝石、葉、花弁、貝殻、皮革、各種人工物（人造
皮革、彫刻、彫金）の微細模様、ホログラム、グリーテ
ィング、ヘアライン等の極めて微細なパターンであって
もよい。電着画像は、電着可能な種々の金属から形成さ
れうるが、コスト、入手の容易性等の観点から、ニッケ
ル、銅などの、電着画像の形成に汎用されている金属が
好ましく用いられる。The pattern is not particularly limited, and may be cloth, paper, stone,
It may be a fine pattern of wood grain, pyroxene, leaves, petals, shells, leather, various artificial objects (artificial leather, engraving, metal engraving), holograms, greetings, and hairlines. The electrodeposition image can be formed from various metals that can be electrodeposited, but from the viewpoint of cost, availability, etc., a metal generally used for forming an electrodeposition image such as nickel or copper is preferably used. .
【０００９】このような模様付電着画像１は、後述する
ような本発明に係る模様付電着画像の製法により得るこ
とができ、その断面は、略方形の形状をしている。ここ
で略方形とは、側面と底面が互いにほぼ垂直（８０〜１
００°）の関係にあることを意味する。また電着画像法
により得られるため、その底面（模様面の反対面）は、
極めて平滑性、鏡面性が高い。Such a patterned electrodeposition image 1 can be obtained by a method for producing a patterned electrodeposition image according to the present invention as described later, and its cross section has a substantially rectangular shape. Here, the substantially rectangular shape means that the side surface and the bottom surface are substantially perpendicular to each other (80 to 1
00 °). Also, since it is obtained by the electrodeposition image method, the bottom surface (the surface opposite to the pattern surface) is
Extremely smooth and highly specular.
【００１０】模様付電着画像の厚みは、その用途により
様々であるが、一般的には２０〜３００μｍ程度が好ま
しい。このような模様付電着画像１は、図１に示すよう
に固着用粘着剤層２を介して被着体３上に固着すること
ができる。固着用粘着剤層２は、たとえばゴム系、アク
リル系、エポキシ系等の粘着剤または接着剤であって、
８００〜３０００ｇ／25mm幅程度の剥離強度を有する比
較的強力な粘着剤または接着剤から形成される。The thickness of the patterned electrodeposited image varies depending on its use, but generally it is preferably about 20 to 300 μm. Such a patterned electrodeposition image 1 can be fixed on the adherend 3 via the fixing adhesive layer 2 as shown in FIG. The sticking pressure-sensitive adhesive layer 2 is, for example, a rubber-based, acrylic-based, epoxy-based pressure-sensitive adhesive or adhesive,
It is formed of a relatively strong adhesive or adhesive having a peel strength of about 800 to 3000 g / 25 mm width.
【００１１】また、被着体３は、電着画像１の用途によ
り様々であり、たとえば、時計用文字盤、各種電化製
品、各種装飾品等である。本発明の模様付電着画像１に
おいては図２に示すように、その装飾性をさらに高める
ため、模様面に装飾用薄膜層４が形成されていてもよ
い。装飾用薄膜層４の厚さは、その素材により様々であ
るが、一般的には、０．１〜３μｍ程度が好適である。
この装飾用薄膜層４は、インク、塗料、樹脂などの絶縁
性材料から形成されていてもよいが、後述する本発明に
係る製法により模様付電着画像１を製造する場合には、
導電性材料により形成されている必要がある。Further, the adherend 3 varies depending on the use of the electrodeposition image 1, and is, for example, a timepiece dial, various electric appliances, various ornaments or the like. In the patterned electrodeposition image 1 of the present invention, as shown in FIG. 2, a decorative thin film layer 4 may be formed on the pattern surface in order to further enhance the decorative property. The thickness of the decorative thin film layer 4 varies depending on the material thereof, but generally, about 0.1 to 3 μm is suitable.
The decorative thin film layer 4 may be formed of an insulating material such as ink, paint, resin, etc. However, when the patterned electrodeposition image 1 is manufactured by the manufacturing method according to the present invention described later,
It must be made of a conductive material.
【００１２】すなわち、模様付電着画像１を形成後に、
別途装飾用薄膜層４を模様面に形成する場合には、装飾
用薄膜層４は絶縁性材料から形成されていてもよいが、
本発明に係る製法により模様付電着画像１を製造する場
合には、装飾用薄膜層４上を予め形成した後に、電着を
行うため、装飾用薄膜層４は導電性材料により形成され
ている必要がある。この場合、装飾用薄膜層４は、金、
銀、白金、錫コバルト合金などからなる電着薄膜であっ
てもよく、無電解メッキ膜、導電性塗料膜、導電性重合
体膜であってもよい。That is, after forming the patterned electrodeposition image 1,
When the decorative thin film layer 4 is separately formed on the patterned surface, the decorative thin film layer 4 may be formed of an insulating material.
When the patterned electrodeposition image 1 is manufactured by the manufacturing method according to the present invention, since the decorative thin film layer 4 is formed in advance and then electrodeposition is performed, the decorative thin film layer 4 is formed of a conductive material. Need to be In this case, the decorative thin film layer 4 is made of gold,
It may be an electrodeposition thin film made of silver, platinum, tin-cobalt alloy, etc., or may be an electroless plating film, a conductive coating film, or a conductive polymer film.
【００１３】次ぎに本発明に係る模様付電着画像の製造
方法について説明する。本発明に係る模様付電着画像の
製造方法は、模様を有する物品の表面模様を、導電性薄
膜に転写し、必要に応じ、該導電性薄膜の模様面に離型
処理を施しおよび／または装飾用薄膜層を形成した後、
該模様面に電着画像を形成することを特徴としている。Next, a method for producing a patterned electrodeposition image according to the present invention will be described. The method for producing a patterned electrodeposition image according to the present invention, the surface pattern of an article having a pattern is transferred to a conductive thin film, and if necessary, a release treatment is applied to the pattern surface of the conductive thin film, and / or After forming the decorative thin film layer,
The feature is that an electrodeposited image is formed on the pattern surface.
【００１４】模様を有する物品の表面模様を、導電性薄
膜に転写するには、種々の方法を採用できる。たとえ
ば、模様を有する物品の表面に、導電性塗料または導電
性重合体を塗布・硬化することで、模様が転写された導
電性樹脂膜を得ることができるし、また模様を有する物
品の表面に、無電解メッキを施すことで、模様が転写さ
れた無電解メッキ膜を得ることもできる。Various methods can be used to transfer the surface pattern of the patterned article onto the conductive thin film. For example, a conductive resin film to which a pattern is transferred can be obtained by applying and curing a conductive paint or a conductive polymer on the surface of an article having a pattern, and the surface of an article having a pattern can be obtained. By performing electroless plating, an electroless plated film having a transferred pattern can be obtained.
【００１５】しかし、本発明においては、強度、経済
性、操作性および品質の均一性などの点から、電気成形
法（電鋳法ともいう）により、模様を有する物品の表面
模様を金型化して得られる導電性薄膜を用いることが特
に好ましい。模様を有する物品の表面模様を、電気成形
法により金型化するためには、図３に示すように、模様
を有する物品１１に電鋳を施す。該物品１１が導電性を
有しない場合には、物品１１表面に金属膜１２を形成す
るなどして、該物品１１に導電性を付与する。However, in the present invention, the surface pattern of an article having a pattern is formed into a mold by an electroforming method (also referred to as an electroforming method) in terms of strength, economy, operability, and uniformity of quality. It is particularly preferable to use the conductive thin film obtained as described above. In order to mold the surface pattern of the patterned article by the electroforming method, as shown in FIG. 3, the patterned article 11 is electroformed. When the article 11 does not have conductivity, a metal film 12 is formed on the surface of the article 11 to impart conductivity to the article 11.
【００１６】ここで、該模様を有する物品１１として
は、布、紙、石目、木目、輝石、葉、花弁、貝殻、皮
革、各種の微細パターンを有する人工物（人造皮革、彫
刻、彫金）などが挙げられ、好ましくは布、紙、石目、
木目、輝石、葉、彫刻、彫金が用いられる。さらに、ホ
ログラム、グリーティング、ヘアライン等の極めて微細
なパターンであってもよい。Here, as the article 11 having the pattern, cloth, paper, stones, wood grain, pyroxene, leaves, petals, shells, leather, artificial objects having various fine patterns (artificial leather, engraving, engraving) Etc., preferably cloth, paper, stone grain,
Wood grain, pyroxene, leaves, carvings, and engraving are used. Further, it may be an extremely fine pattern such as a hologram, a greeting, and a hairline.
【００１７】図３に示すように、物品１１の表面には、
模様が形成されている（図３における表面の凹凸）。図
３においては、物品１１の裏面については記載を省略し
た。まず、物品１１の表面に導電性を付与するために、
物品１１の表面を清浄にした後、物品１１の表面に金属
膜１２を形成する。金属膜１２の形成は、たとえば真空
蒸着法、イオンプレーティング法、スパッタリング法、
無電解メッキ法、銀鏡反応などにより行われる。金属膜
１２は、銀、金等の金属またはこれらの合金から形成さ
れ、その厚さは特に限定はされないが、１〜３０μm程
度、好ましくは１〜１０μm程度が適当である。As shown in FIG. 3, on the surface of the article 11,
A pattern is formed (irregularities on the surface in FIG. 3). In FIG. 3, description of the back surface of the article 11 is omitted. First, in order to impart conductivity to the surface of the article 11,
After cleaning the surface of the article 11, the metal film 12 is formed on the surface of the article 11. The metal film 12 is formed by, for example, a vacuum vapor deposition method, an ion plating method, a sputtering method,
It is performed by an electroless plating method, a silver mirror reaction, or the like. The metal film 12 is formed of a metal such as silver or gold or an alloy thereof, and the thickness thereof is not particularly limited, but about 1 to 30 μm, preferably about 1 to 10 μm is suitable.
【００１８】なお、前述したように、物品１１が導電性
を有する場合には、金属膜１２を形成する必要はない。
次いで、必要に応じ、金属膜１２の表面に剥離処理を施
す。物品１１が導電性を有する場合には、物品１１の表
面に直接剥離処理を施す。剥離処理は、アセレン酸処
理、重クロム酸カリウム処理、陽極酸化などにより行え
る。剥離処理を施しておくと、導電性薄膜１３（電気成
形型）の剥離が容易になる。As described above, when the article 11 has conductivity, it is not necessary to form the metal film 12.
Then, if necessary, the surface of the metal film 12 is subjected to a peeling treatment. When the article 11 has conductivity, the surface of the article 11 is directly subjected to the peeling treatment. The peeling treatment can be performed by aselenic acid treatment, potassium dichromate treatment, anodization, or the like. When the peeling process is performed, the conductive thin film 13 (electroforming mold) can be easily peeled off.
【００１９】次に、図４に示すように、前記物品１１の
表面または金属膜１２の表面に、電気成形法（電鋳法）
により金属を析出させて模様が転写された導電性薄膜１
３を形成する。導電性薄膜１３の材質としては、ニッケ
ル、銅、鉄等の金属、またはこれらの合金が好ましく用
いられる。Next, as shown in FIG. 4, the surface of the article 11 or the surface of the metal film 12 is electroformed (electroformed).
Conductive thin film 1 on which metal is deposited to transfer the pattern
3 is formed. As a material of the conductive thin film 13, a metal such as nickel, copper, iron, or an alloy thereof is preferably used.
【００２０】導電性薄膜１３の厚さは、100〜500μmの
範囲にある。導電性薄膜１３の厚さがこの範囲にある
と、適度なコシを有するため、操作性が良好である。転
写される模様の深さが10μm未満の場合は、導電性薄膜
１３の厚さは、100〜200μm程度が好ましい。また、模
様の深さが10〜50μmの場合は、導電性薄膜１３の厚さ
は、200〜300μm程度が好ましい。さらに模様の深さが5
0〜100μmの場合は、導電性薄膜１３の厚さは、300〜50
0μm程度が好ましい。The thickness of the conductive thin film 13 is in the range of 100 to 500 μm. When the thickness of the conductive thin film 13 is within this range, the conductive thin film 13 has an appropriate rigidity, and thus the operability is good. When the transferred pattern has a depth of less than 10 μm, the conductive thin film 13 preferably has a thickness of about 100 to 200 μm. Further, when the pattern depth is 10 to 50 μm, the thickness of the conductive thin film 13 is preferably about 200 to 300 μm. Furthermore, the depth of the pattern is 5
In the case of 0 to 100 μm, the thickness of the conductive thin film 13 is 300 to 50
About 0 μm is preferable.
【００２１】電気成形時の条件は、特に制限されること
なく、従来公知の電気成形（メッキ）条件から適宜に選
択される。なんら限定されるものではないが、以下にニ
ッケル金属を用い、厚さ200μmの導電性薄膜１３を得る
場合の電気成形条件を簡単に説明する。まず前処理とし
て、模様を有する物品１１または金属膜１２の表面に、
電解脱脂、水洗、酸中和、水洗、剥離処理（重クロム酸
カリウム）、水洗の各処理を行う。The conditions for electroforming are not particularly limited and may be appropriately selected from conventionally known electroforming (plating) conditions. Although not limited in any way, the electroforming conditions for obtaining the conductive thin film 13 having a thickness of 200 μm using nickel metal will be briefly described below. First, as a pretreatment, on the surface of the patterned article 11 or the metal film 12,
Electrolytic degreasing, water washing, acid neutralization, water washing, stripping treatment (potassium dichromate), and water washing are performed.
【００２２】次いで、ニッケルメッキ浴（スルファミン
酸ニッケル450 g/リットル、ホウ酸40 g/リットル）を
用いて、液温５０℃にて、265 AH (1A/dm2)で電鋳を行
うことで、厚さ200μmの導電性薄膜１３が得られる。次
いで、前記物品１１の表面または金属膜１２の表面か
ら、導電性薄膜１３を剥離することで、金型化した模様
面を有する導電性薄膜１３（電気成形型）が得られる。Next, electroplating was performed at 265 AH (1 A / dm 2 ) at a liquid temperature of 50 ° C. using a nickel plating bath (nickel sulfamate 450 g / liter, boric acid 40 g / liter). A conductive thin film 13 having a thickness of 200 μm is obtained. Then, the conductive thin film 13 is peeled from the surface of the article 11 or the surface of the metal film 12 to obtain the conductive thin film 13 (electroforming mold) having a patterned surface.
【００２３】本発明においては、上記のようにして得ら
れた導電性薄膜１３の模様面に電着を施すことで、模様
付電着画像を得る。模様付電着画像の製造は、特開平７
−３３１４７９号公報、特開平８−２７５９７号公報等
に記載された常法に準じて行うことができるが、品質の
向上および操作点等の観点から、以下のような工程を付
加することが特に望ましい。In the present invention, the patterned surface of the electroconductive thin film 13 obtained as described above is subjected to electrodeposition to obtain a patterned electrodeposition image. The production of a patterned electrodeposited image is described in Japanese Patent Application Laid-Open No. Hei 7 (1998)
It can be carried out according to the usual method described in JP-A-331479, JP-A-8-27597 and the like, but it is particularly preferable to add the following steps from the viewpoint of quality improvement and operating points. desirable.
【００２４】導電性薄膜１３は、前述したようにその厚
みが、100〜500μm程度と薄いため、取扱いが困難にな
る場合がある。したがって、本発明では、図５に示すよ
うに、導電性薄膜１３の平滑面（模様面の反対側）を導
電性基材１４上に固定して模様付電着画像の製造を行う
ことが好ましい。ここで、導電性基材１４としては、充
分な強度を有し、導電性を有し、かつ導電性薄膜１３を
固定できるものであれば、種々の板状部材を用いること
ができる。したがって、たとえば導電性基材１４として
は、導電性マグネットラバー、磁性金属板等の磁性導電
板が好ましく用いられる。また、通常の金属板、導電性
ポリマーシートなどに、導電性の再剥離型粘着剤を介し
て、導電性薄膜１３を固定してもよい。Since the conductive thin film 13 has a thin thickness of about 100 to 500 μm as described above, it may be difficult to handle. Therefore, in the present invention, as shown in FIG. 5, it is preferable to fix the smooth surface (the side opposite to the pattern surface) of the conductive thin film 13 on the conductive substrate 14 to manufacture a patterned electrodeposition image. . Here, as the conductive base material 14, various plate-shaped members can be used as long as they have sufficient strength, conductivity, and can fix the conductive thin film 13. Therefore, for example, as the conductive base material 14, a magnetic conductive plate such as a conductive magnet rubber or a magnetic metal plate is preferably used. In addition, the conductive thin film 13 may be fixed to an ordinary metal plate, a conductive polymer sheet, or the like via a conductive removable adhesive.
【００２５】このように、導電性薄膜１３の平滑面（模
様面の反対側）を導電性基材１４上に固定しておくと、
導電性薄膜１３の取扱いが容易になるとともに、電着時
の振動等も防止できるため、品質の高い模様付電着画像
が得られる。本発明では、上記の導電性薄膜１３の模様
面に目的とする電着画像１および、必要に応じ工程管理
用のガイド用電着等を形成する。この具体的手法の基本
的工程は、特開平３−１０７４９６号公報に記載されて
いる。以下に電着画像１の特に好ましい形成方法につい
て説明する。As described above, when the smooth surface (the side opposite to the pattern surface) of the conductive thin film 13 is fixed on the conductive base material 14,
Since the conductive thin film 13 can be easily handled, and vibration and the like at the time of electrodeposition can be prevented, a high quality patterned electrodeposition image can be obtained. In the present invention, the target electrodeposition image 1 and, if necessary, guide electrodeposition for process control are formed on the patterned surface of the conductive thin film 13. The basic steps of this concrete method are described in JP-A-3-107496. A particularly preferable method for forming the electrodeposited image 1 will be described below.
【００２６】先ず、本発明においては、導電性薄膜１３
の模様面に、離型処理を施すことが好ましい。離型処理
は、前記と同様の方法で行うことができる。離型処理を
施しておくと、得られる電着画像１を、導電性薄膜１３
から容易に剥離できる。また、本発明においては、導電
性薄膜１３の模様面に予め装飾用薄膜層４を形成しても
よい。First, in the present invention, the conductive thin film 13
It is preferable to subject the patterned surface to a release treatment. The mold release treatment can be performed by the same method as described above. When the release treatment is performed, the obtained electrodeposition image 1 is the conductive thin film 13
Can be easily peeled off. Further, in the present invention, the decorative thin film layer 4 may be previously formed on the patterned surface of the conductive thin film 13.
【００２７】装飾用薄膜層４は、後に形成される模様付
電着画像１の模様面を覆うものであり、これによりに模
様付電着画像１の装飾性をさらに高めることができる。
装飾用薄膜層４は、その表面（模様面）に金属を析出さ
せ、これにより電着画像１が形成されるため、導電性材
料により形成されている必要がある。装飾用薄膜層４
は、金、銀、白金、錫コバルト合金などからなる電着薄
膜であってもよく、無電解メッキ膜、導電性塗料膜、導
電性重合体膜であってもよい。装飾用薄膜層４の厚さ
は、その素材により様々であるが、一般的には、０．１
〜３μｍ程度が好適である。The decorative thin film layer 4 covers the pattern surface of the patterned electrodeposition image 1 to be formed later, whereby the decorativeness of the patterned electrodeposition image 1 can be further enhanced.
The decorative thin film layer 4 needs to be formed of a conductive material because a metal is deposited on the surface (pattern surface) of the decorative thin film layer 4 to form the electrodeposition image 1. Thin film layer 4 for decoration
May be an electrodeposition thin film made of gold, silver, platinum, tin-cobalt alloy or the like, or may be an electroless plating film, a conductive coating film, or a conductive polymer film. The thickness of the decorative thin film layer 4 varies depending on its material, but is generally 0.1.
Approximately 3 μm is preferable.
【００２８】また、装飾用薄膜層４は、後に形成される
模様付電着画像１の模様面に強固に接合しうるものが好
ましく、したがって、金、銀、白金、錫コバルト合金な
どからなる電着薄膜であることが好ましい。上記のよう
な導電性薄膜１３の模様面に対する離型処理および装飾
用薄膜層４の形成は、本発明では必ずしも必須ではない
が、操作性、品質の向上の観点からはこれらを実施して
おくことが特に好ましい。なお、以下の説明では、「導
電性薄膜１３の模様面」と表記するが、導電性薄膜１３
の模様面に対する離型処理が施されている場合には、
「導電性薄膜１３の離型処理面」を表わし、また装飾用
薄膜層４が形成されている場合には、「導電性薄膜１３
の模様面に形成された装飾用薄膜層４の表面」を意味す
る。図面では、装飾用薄膜層４の形成を行った場合を例
にとって説明するが、この場合にも「導電性薄膜１３の
模様面」は「導電性薄膜１３の模様面に形成された装飾
用薄膜層４の表面」を意味する。Further, the decorative thin film layer 4 is preferably one that can be firmly bonded to the pattern surface of the patterning electrodeposition image 1 to be formed later, and therefore, it is composed of gold, silver, platinum, tin cobalt alloy or the like. It is preferably a coating film. The mold release treatment and the formation of the decorative thin film layer 4 on the pattern surface of the conductive thin film 13 as described above are not always essential in the present invention, but they are carried out from the viewpoint of operability and quality improvement. Is particularly preferred. It should be noted that in the following description, the conductive surface is referred to as “the pattern surface of the conductive thin film 13”,
When mold release treatment is applied to the pattern surface of
When the decorative thin film layer 4 is formed, it means "the release-treated surface of the conductive thin film 13".
Means the surface of the decorative thin film layer 4 formed on the patterned surface. In the drawings, the case where the decorative thin film layer 4 is formed is described as an example, but in this case as well, the "pattern surface of the conductive thin film 13" is the "decorative thin film formed on the pattern surface of the conductive thin film 13". “Surface of layer 4”.
【００２９】導電性薄膜１３の模様面への電着画像１の
形成は、以下のように行なうことができる。まず、必要
とするネガまたはポジの電着画像用フォトマスクフィル
ムを写真や印刷等によって作成する。このフィルムに
は、時計用バラ文字等の電着画像を構成する目標画像図
と、必要に応じて形成される工程管理用電着画像図が黒
インク等で描かれている。The electrodeposition image 1 can be formed on the pattern surface of the conductive thin film 13 as follows. First, the required negative or positive photomask film for electro-deposited image is prepared by photography or printing. On this film, a target image diagram that constitutes an electro-deposited image such as a rose for a watch and a process control electro-deposited image diagram that is formed as needed are drawn in black ink or the like.
【００３０】一方、導電性薄膜１３の模様面に、液レジ
スト、ドライフィルムレジストまたは印刷用レジストイ
ンク等のフォトレジスト１５を塗布し、焼き付けを行っ
たものを用意しておく。そして、導電性薄膜１３の模様
面の上にフォトレジスト１５を挟んで前記フォトマスク
フィルムを乗せ、この状態で露光機等による露光を行
う。この露光後に現像を行って、露光されなかったフォ
トレジストを除去し、これによって、図７に示すよう
に、導電性薄膜１３の模様面に前記目標画像図の形状に
沿った形状の導電部１６（電着画像対応面とも言う）を
形成する。On the other hand, a photoresist 15 such as a liquid resist, a dry film resist or a printing resist ink is applied to the patterned surface of the conductive thin film 13 and baked to prepare it. Then, the photomask film is placed on the patterned surface of the conductive thin film 13 with the photoresist 15 interposed therebetween, and in this state, exposure is performed by an exposure device or the like. After this exposure, development is performed to remove the unexposed photoresist, so that as shown in FIG. 7, the conductive portion 16 having a shape along the shape of the target image diagram is formed on the pattern surface of the conductive thin film 13. (Also referred to as an electrodeposition image corresponding surface) is formed.
【００３１】なお、前述した導電性薄膜１３の模様面に
対する離型処理および装飾用薄膜層４の形成は、導電部
１６を形成した後に、この部位に対してのみ行っても良
い。次に、図８に示すように、前記導電部１６の上に電
着法（電着画像法）によって金属を析出させて、前記目
標画像図の形状に沿った形状の電着画像１と、必要に応
じ工程管理用電着画像とを形成する。この結果、導電性
薄膜１３の模様面の凹凸が、電着画像にも同様に形成さ
れるため、模様付電着画像が得られる。The mold release treatment and formation of the decorative thin film layer 4 on the patterned surface of the conductive thin film 13 may be performed only on this portion after forming the conductive portion 16. Next, as shown in FIG. 8, a metal is deposited on the conductive portion 16 by an electrodeposition method (electrodeposition image method), and an electrodeposition image 1 having a shape along the shape of the target image diagram, If necessary, a process control electrodeposition image is formed. As a result, the unevenness of the pattern surface of the conductive thin film 13 is also formed on the electrodeposition image in the same manner, so that the patterning electrodeposition image can be obtained.
【００３２】ここに、前記電着画像１を形成する金属と
して、例えばニッケルを使用した場合には、ワット液と
して硫酸ニッケル液を使用することにより、導電部１６
の上にニッケルを電着させるのであり、この時の電着条
件としては、例えば１５０ｍｍ×１５０ｍｍの電着有効
面積に対して、３Ａ／ｄｍ2 の電流を流すことにより、
３時間で１００μｍ±１０μｍの電着画像を得ることが
できる。Here, for example, when nickel is used as the metal forming the electro-deposited image 1, by using nickel sulfate liquid as the Watt liquid, the conductive portion 16 is formed.
Nickel is electrodeposited on the electrodeposition. The electrodeposition condition at this time is, for example, by applying a current of 3 A / dm 2 to an electrodeposition effective area of 150 mm × 150 mm,
An electrodeposited image of 100 μm ± 10 μm can be obtained in 3 hours.
【００３３】なお、前記ニッケルの他に、金、銀、銅、
鉄または合金等の任意の金属を導電部１６上に析出させ
て、電着画像を形成しても良いことは勿論であり、また
電着条件を変えることにより、例えば２０〜３００μｍ
位の範囲で、任意の肉厚の電着画像を得ることができ
る。次に、剥離液に浸漬させて導電性薄膜上に残着して
いるフォトレジストを除去すると、図９に示すように、
導電性薄膜上に、電着画像１と、必要に応じて形成され
る工程管理用電着画像が残留する。In addition to nickel, gold, silver, copper,
Needless to say, any metal such as iron or alloy may be deposited on the conductive portion 16 to form an electrodeposition image, and by changing the electrodeposition conditions, for example, 20 to 300 μm.
An electrodeposited image having an arbitrary thickness can be obtained within the range of the order. Next, when the photoresist remaining on the conductive thin film is removed by immersing it in a stripping solution, as shown in FIG.
The electrodeposition image 1 and the process control electrodeposition image formed as necessary remain on the conductive thin film.
【００３４】このようにして、電着法によって導電性薄
膜１３の表面に、模様を有する電着画像１が得られる。
得られた電着画像１は、その平滑面に、固着用粘着剤層
２を設けて、直接被着体３に固着してもよいが、品質の
維持および歩留りの向上の観点から、好ましくは以下の
ように、支持基材を用いた転写を経て、被着体３への固
着を行う。In this way, the electrodeposited image 1 having a pattern on the surface of the conductive thin film 13 is obtained by the electrodeposition method.
The obtained electro-deposited image 1 may be directly adhered to the adherend 3 by providing the adhesive layer 2 for adhesion on the smooth surface thereof, but it is preferable from the viewpoint of maintaining quality and improving yield. As described below, fixing to the adherend 3 is performed through the transfer using the supporting base material.
【００３５】本発明に係る模様付電着画像の固着方法
は、上記のような製造方法により導電性薄膜１３の表面
に模様付電着画像１を形成後、電着画像の平滑面（模様
面の反対側）を第１の支持基材１７に貼着し（図１
０）、導電性薄膜１３を剥離して電着画像１の模様面を
露出させ（図１２）、電着画像１の模様面を第２の支持
基材１８に貼着し（図１３）、前記第１の支持基材１７
を剥離して電着画像１の平滑面を露出させ（図１４）、
該電着画像１の平滑面に固着用粘着剤層２を形成し（図
１５）、該固着用粘着剤層２を介して電着画像１を被着
体３に固着し[図１６]、第２の支持基材１８を剥離する
ことを特徴としている。According to the method of fixing the patterned electrodeposition image according to the present invention, after the patterned electrodeposition image 1 is formed on the surface of the conductive thin film 13 by the above manufacturing method, the smooth surface (pattern surface) of the electrodeposition image is formed. The opposite side) to the first supporting base material 17 (see FIG. 1).
0), the conductive thin film 13 is peeled off to expose the pattern surface of the electrodeposition image 1 (FIG. 12), and the pattern surface of the electrodeposition image 1 is attached to the second supporting base material 18 (FIG. 13). The first supporting base material 17
To expose the smooth surface of the electrodeposited image 1 (FIG. 14),
An adhesive layer 2 for fixation is formed on the smooth surface of the electrodeposited image 1 (FIG. 15), and the electrodeposited image 1 is adhered to the adherend 3 via the adhesive layer 2 for adhesion [FIG. 16], The feature is that the second supporting base material 18 is peeled off.
【００３６】導電性基材１４を用いた場合には、図１
０、図１１に示すように、電着画像１を第１の支持基材
１７と導電性薄膜１３とでサンドイッチして、導電性基
材１４から、支持基材１７／電着画像１／導電性薄膜１
３の積層体を剥離することが好ましい。すなわち、導電
性基材１４と導電性薄膜１３との界面で剥離を行い、電
着画像１を、導電性薄膜１３と第１の支持基材１７とで
挟み込みながら剥離する。この結果、電着画像１の散乱
が防止されるため、電着画像１を歩留り良く製造するこ
とができる。また、電着画像１を殆ど変形することなく
剥離することができるため、電着画像内に応力が残留せ
ず、被着体３に貼付後も変形が起こることはない。When the conductive base material 14 is used, as shown in FIG.
0, as shown in FIG. 11, the electro-deposited image 1 is sandwiched between the first supporting base material 17 and the conductive thin film 13, and the electro-conductive base material 14 is moved to the supporting base material 17 / electro-deposited image 1 / conductive surface. Thin film 1
It is preferable to peel off the laminate of No. 3. That is, peeling is performed at the interface between the conductive base material 14 and the conductive thin film 13, and the electrodeposited image 1 is peeled while being sandwiched between the conductive thin film 13 and the first supporting base material 17. As a result, the electrodeposition image 1 is prevented from being scattered, so that the electrodeposition image 1 can be manufactured with high yield. Further, since the electro-deposited image 1 can be peeled off with almost no deformation, no stress remains in the electro-deposited image and no deformation occurs even after being attached to the adherend 3.
【００３７】ついで、図１２に示すように、支持基材１
７／電着画像１／導電性薄膜１３の積層体から、導電性
薄膜１３を剥離し、電着画像１の模様面を露出させる。
したがって、第１の支持基材１７の粘着力は、導電性薄
膜１３の剥離に打ち勝って、電着画像１を保持できる程
度である必要がある。一方、後述するように、電着画像
１を第２の支持基材１８に転写する際には、第２の支持
基材１８の粘着力よりも、第１の支持基材の粘着力が小
さいことが必要である。さらに、固着用粘着剤層２を介
して電着画像１を被着体３に固着する必要があるため、
第２の支持基材１８の粘着力は、固着用粘着剤層２の粘
着力よりも小さい必要がある。Then, as shown in FIG. 12, the supporting substrate 1
7 / Electrodeposited image 1 / The conductive thin film 13 is peeled off from the laminate of the electroconductive thin film 13 to expose the patterned surface of the electrodeposited image 1.
Therefore, the adhesive force of the first supporting base material 17 needs to be sufficient to overcome the peeling of the conductive thin film 13 and hold the electrodeposited image 1. On the other hand, as described later, when the electrodeposition image 1 is transferred to the second supporting base material 18, the adhesive force of the first supporting base material is smaller than the adhesive force of the second supporting base material 18. It is necessary. Further, since it is necessary to fix the electro-deposited image 1 to the adherend 3 via the sticking pressure-sensitive adhesive layer 2,
The adhesive force of the second supporting base material 18 needs to be smaller than the adhesive force of the sticking adhesive layer 2.
【００３８】このため、支持基材１７の粘着力は、導電
性薄膜１３の剥離時には大きく、電着画像１を第２の支
持基材１８に転写する際には小さくできるような機能を
備えていることが望ましい。すなわち、第１の支持基材
１７の粘着剤層１７ａは、粘着力を可変的に制御できる
ものであることが好ましい。このような粘着力を可変的
に制御できる粘着剤としては、例えば紫外線硬化型、加
熱硬化型、更には経時硬化型の感圧接着剤が知られてい
る。ここに、紫外線硬化型の感圧接着剤の代表例として
は、不飽和結合を２以上有する付加重合性化合物やエポ
キシ基を有するアルコキシシランの如き光重合性化合物
と、カルボニル化合物や有機硫黄化合物、過酸化物、ア
ミン、オニウム塩系化合物の如き光重合開始剤を配合し
たゴム系感圧接着剤や、アクリル系感圧接着剤等が挙げ
られる（特開昭６０−１９６９５６号公報参照）。光重
合性化合物、光重合開始剤の配合量は、それぞれベース
ポリマ１００重量部当り１０〜５００重量部、０．１〜
２０重量部が一般的である。For this reason, the adhesive force of the supporting base material 17 is large when the conductive thin film 13 is peeled off, and can be reduced when transferring the electrodeposited image 1 to the second supporting base material 18. Is desirable. That is, it is preferable that the pressure-sensitive adhesive layer 17a of the first supporting base material 17 be capable of variably controlling the pressure-sensitive adhesive force. As such an adhesive capable of variably controlling the adhesive force, for example, an ultraviolet curable type, a heat curable type, and a time-curable pressure sensitive adhesive are known. Here, as a typical example of the ultraviolet-curable pressure-sensitive adhesive, a photopolymerizable compound such as an addition polymerizable compound having two or more unsaturated bonds or an alkoxysilane having an epoxy group, a carbonyl compound or an organic sulfur compound, Examples thereof include a rubber pressure-sensitive adhesive compounded with a photopolymerization initiator such as a peroxide, an amine and an onium salt compound, and an acrylic pressure-sensitive adhesive agent (see JP-A-60-196956). The photopolymerizable compound and the photopolymerization initiator are blended in amounts of 10 to 500 parts by weight and 0.1 to 100 parts by weight of the base polymer, respectively.
20 parts by weight is common.
【００３９】なお、アクリル系ポリマには、通例のもの
（特公昭５７−５４０６８号公報、特公昭５８−３３９
０９号公報等参照）の他、側鎖にラジカル反応性不飽和
基を有するもの（特公昭６１−５６２６４号公報参照）
や、分子中にエポキシ基を有するものも用いることがで
きる。また、不飽和結合を２個以上有する付加重合性化
合物としては、例えばアクリル酸やメタクリル酸の多価
アルコール系エステルやオリゴエステル、エポキシ系や
ウレタン系化合物等が挙げられる。Acrylic polymers are commonly used (Japanese Patent Publication No. 57-54068 and Japanese Patent Publication No. 58-339).
(See Japanese Patent Publication No. Sho 61-56264) as well as those having a radical-reactive unsaturated group in the side chain.
Alternatively, those having an epoxy group in the molecule can also be used. Examples of the addition-polymerizable compound having two or more unsaturated bonds include polyhydric alcohol-based esters of acrylic acid and methacrylic acid, oligoesters, epoxy-based compounds and urethane-based compounds.
【００４０】更に、エチレングリコールジグリシジルエ
ーテルの如き分子中にエポキシ基を１個または２個以上
有するエポキシ基官能性架橋剤を追加配合して架橋効果
を上げることもできる。紫外線硬化型の接着剤を用いて
粘着剤層１７ａを形成した場合には、紫外線照射処理を
可能とするために、支持基材１７として透明なフィルム
等を用いる必要がある。Further, an epoxy group functional crosslinking agent having one or more epoxy groups in the molecule such as ethylene glycol diglycidyl ether may be additionally compounded to enhance the crosslinking effect. When the pressure-sensitive adhesive layer 17a is formed using an ultraviolet curable adhesive, it is necessary to use a transparent film or the like as the support base 17 in order to enable the ultraviolet irradiation treatment.
【００４１】また、加熱硬化型の感圧接着剤の代表例と
しては、ポリイソシアネート、メラミン樹脂、アミン−
エポキシ樹脂、過酸化物、金属キレート化合物の如き架
橋剤や、必要に応じてジビニルベンゼン、エチレングリ
コールジアクリレート、トリメチロールプロパントリメ
タクリレートの如き多官能性化合物からなる架橋調節剤
等を配合したゴム系感圧接着剤やアクリル系感圧接着剤
等が挙げられる。Typical examples of the heat-curable pressure-sensitive adhesive are polyisocyanate, melamine resin, amine-
A rubber system containing a cross-linking agent such as an epoxy resin, a peroxide or a metal chelate compound, and a cross-linking regulator composed of a polyfunctional compound such as divinylbenzene, ethylene glycol diacrylate or trimethylolpropane trimethacrylate, if necessary. Examples thereof include pressure sensitive adhesives and acrylic pressure sensitive adhesives.
【００４２】更に、経時硬化型の感圧接着剤としては、
配合した溶剤が経時的に蒸発することによって接着力が
低下するようにしたものが挙げられる。電着画像１を導
電性薄膜１３とともに、支持基材１７の粘着剤層１７ａ
に転写した後、図１２に示すように、導電性薄膜１３を
除去し、電着画像１の模様面を露出させる。この際、装
飾用薄膜層４を設けた場合には、図１２に示すように、
電着画像１上に設けられた装飾用薄膜層４は、電着画像
１上に残留するが、その他の装飾用薄膜層は、導電性薄
膜１３上に残着したまま除去される。装飾用薄膜層４は
極めて薄く、また電着画像１とは強固に接合されている
ため、上記のように、電着画像１の模様面にのみ装飾用
薄膜層４を残着できる。また導電性薄膜１３の表面に離
型処理を施しておくと、さらに容易に、電着画像１の模
様面にのみ装飾用薄膜層４を残着できる。Further, as a time-curable pressure-sensitive adhesive,
An example is one in which the adhesive force is lowered by evaporating the compounded solvent over time. The electro-deposited image 1 together with the conductive thin film 13 and the adhesive layer 17a of the supporting base material 17
12, the conductive thin film 13 is removed to expose the patterned surface of the electrodeposited image 1 as shown in FIG. At this time, when the decorative thin film layer 4 is provided, as shown in FIG.
The decorative thin film layer 4 provided on the electrodeposition image 1 remains on the electrodeposition image 1, but the other decoration thin film layers are removed while remaining on the conductive thin film 13. Since the decorative thin film layer 4 is extremely thin and is firmly bonded to the electrodeposition image 1, the decorative thin film layer 4 can be left on only the pattern surface of the electrodeposition image 1 as described above. Further, if the surface of the conductive thin film 13 is subjected to a mold release treatment, the decorative thin film layer 4 can be left on only the patterned surface of the electrodeposition image 1 more easily.
【００４３】ついで、図１３に示すように、第２の支持
基材１８を、電着画像１の模様面に貼着する。なお、第
１の支持基材１７の粘着剤層１７ａを、粘着力を可変的
に制御できる粘着剤で形成した場合には、第２の支持基
材１８を貼付する前または後に、粘着剤層１７ａの粘着
力を低下させる。Then, as shown in FIG. 13, the second supporting base material 18 is attached to the patterned surface of the electrodeposition image 1. When the pressure-sensitive adhesive layer 17a of the first supporting base material 17 is formed of a pressure-sensitive adhesive that can variably control the adhesive strength, the pressure-sensitive adhesive layer before or after the second supporting base material 18 is attached. The adhesive strength of 17a is reduced.
【００４４】次いで、図１４に示すように、第１の支持
基材１７を剥離して、電着画像１の平滑面を露出させ
る。したがって、第２の支持基材１８の粘着力は、第１
の支持基材１７の剥離に打ち勝って、電着画像１を保持
できる程度である必要がある。一方、後述するように、
固着用粘着剤層２を介して電着画像１を被着体３に固着
する必要があるため、第２の支持基材１８の粘着力は、
固着用粘着剤層２の粘着力よりも小さい必要がある。Next, as shown in FIG. 14, the first supporting base material 17 is peeled off to expose the smooth surface of the electrodeposited image 1. Therefore, the adhesive force of the second supporting base material 18 is
It is necessary that the electrodeposited image 1 can be held by overcoming the peeling of the supporting base material 17 in FIG. On the other hand, as described below,
Since it is necessary to fix the electrodeposition image 1 to the adherend 3 via the sticking pressure-sensitive adhesive layer 2, the adhesive force of the second supporting base material 18 is
It must be smaller than the adhesive force of the adhesive layer 2 for fixing.
【００４５】このため、支持基材１８の粘着力は、第１
の支持基材１７の剥離時には大きく、電着画像１を被着
体３に固着する際には小さくできるような機能を備えて
いることが望ましい。すなわち、第２の支持基材１８の
粘着剤層１８ａもまた、上述したような粘着力を可変的
に制御できるものであることが好ましい。なお、第１の
支持基材１７の粘着剤層１７ａとして、粘着力を極めて
低いレベルまで低減できる粘着剤を用いた場合には、第
２の支持基材１８の粘着剤層１８ａとしては、通常使用
されている弱粘着タイプの粘着剤を使用することもでき
る。Therefore, the adhesive force of the supporting base material 18 is
It is desirable to have a function of making it large when the supporting base material 17 is peeled off and being small when the electrodeposition image 1 is fixed to the adherend 3. That is, it is preferable that the pressure-sensitive adhesive layer 18a of the second supporting base material 18 also be capable of variably controlling the pressure-sensitive adhesive force as described above. When a pressure-sensitive adhesive that can reduce the adhesive strength to an extremely low level is used as the pressure-sensitive adhesive layer 17a of the first supporting base material 17, the pressure-sensitive adhesive layer 18a of the second supporting base material 18 is usually It is also possible to use the weak-adhesive type adhesive that is used.
【００４６】たとえば、第１および第２の支持基材の粘
着剤層として、粘着力を可変的に制御できる粘着剤とし
て、紫外線硬化型粘着剤を用いた場合には、紫外線硬化
前には２４００ｇ／25mm幅以上の強力な粘着力を有し、
紫外線照射により、粘着力が６００ｇ／25mm幅以下、好
ましくは４００ｇ／25mm幅以下、より好ましくは２００
ｇ／25mm幅以下、さらに好ましくは１００ｇ／25mm幅以
下、特に好ましくは３０〜５０ｇ／25mm幅程度にまで低
下できる粘着剤を選択することが好ましい。For example, when a UV-curable pressure-sensitive adhesive is used as the pressure-sensitive adhesive layer of the first and second supporting base materials, the pressure-sensitive adhesive force of which can be variably controlled, it is 2400 g before UV-curing. Has a strong adhesive strength of / 25 mm width or more,
Adhesion by UV irradiation is 600g / 25mm width or less, preferably 400g / 25mm width or less, more preferably 200
It is preferable to select an adhesive capable of reducing the width to g / 25 mm width or less, more preferably 100 g / 25 mm width or less, and particularly preferably to about 30 to 50 g / 25 mm width.
【００４７】また、第２の支持基材１８の粘着剤層１８
ａとして、弱粘着タイプの粘着剤を使用する場合には、
前記第１の支持基材の紫外線照射後の粘着力よりも強
く、かつ固着粘着剤層２の粘着力よりも弱い粘着力を有
する粘着剤を選択する。第１の支持基材１７を剥離し
て、電着画像１の平滑面を露出させた後、該平滑面に、
固着用粘着剤層２を形成する。The pressure-sensitive adhesive layer 18 of the second supporting substrate 18
As a, when using a weak adhesive type adhesive,
A pressure-sensitive adhesive having a pressure-sensitive adhesive strength that is higher than the pressure-sensitive adhesive strength of the first supporting substrate after being irradiated with ultraviolet rays and that is lower than the pressure-sensitive adhesive strength of the fixed pressure-sensitive adhesive layer 2 is selected. After peeling off the first supporting base material 17 to expose the smooth surface of the electrodeposited image 1,
The adhesive layer 2 for fixing is formed.
【００４８】固着用粘着剤層２は、前述したように、た
とえばゴム系、アクリル系、エポキシ系等の粘着剤また
は接着剤であって、粘着剤層１８ａの粘着力も大きく、
８００〜３０００ｇ／25mm幅程度の剥離強度を有する比
較的強力な粘着剤または接着剤から形成される。固着用
粘着剤層２は、マスクなどを用いて電着画像１の平滑面
にのみ形成してもよく、また、支持基材１８の粘着剤層
１８ａの露出面全面に形成してもよい。The fixing adhesive layer 2 is, for example, a rubber-based, acrylic-based or epoxy-based adhesive or adhesive as described above, and the adhesive layer 18a has a large adhesive force.
It is formed of a relatively strong adhesive or adhesive having a peel strength of about 800 to 3000 g / 25 mm width. The adhesive layer 2 for fixing may be formed only on the smooth surface of the electrodeposition image 1 using a mask or the like, or may be formed on the entire exposed surface of the adhesive layer 18a of the supporting base material 18.
【００４９】次いで、図１６に示すように、固着用粘着
剤層２を介して電着画像１を所定の被着体３に固着し、
支持基材１８を剥離除去する。この際、工程管理用電着
画像として、位置決め用のガイド電着画像を形成した場
合には、該ガイド電着画像を所定の位置に固定した後、
電着画像１を所定の被着体３に固着することで、電着画
像１を高い精度で被着体３に固着できる。Then, as shown in FIG. 16, the electro-deposited image 1 is fixed to a predetermined adherend 3 via the fixing adhesive layer 2.
The supporting base material 18 is peeled and removed. At this time, when a guide electrodeposition image for positioning is formed as the process control electrodeposition image, after fixing the guide electrodeposition image at a predetermined position,
By fixing the electrodeposition image 1 to a predetermined adherend 3, the electrodeposition image 1 can be fixed to the adherend 3 with high accuracy.
【００５０】固着用粘着剤層２を支持基材１８の粘着剤
層１８ａの露出面全面に形成した場合であっても、粘着
剤層１８ａと固着用粘着剤層２との界面の接着力の方
が、被着体３と固着用粘着剤層２との界面における接合
力よりも大きくなるようにすることができる。この結
果、固着部以外の粘着剤を残さず剥離除去できる。この
ように、粘着剤層１８ａと固着用粘着剤層２との界面に
おける接合力の方が、被着体３と固着用粘着剤層２との
界面における接合力よりも大きくなるように粘着剤を選
択することにより、マスクを用いて粘着剤層を形成する
といった面倒な作業をなくして工程の簡素化を図ること
もできる。Even when the fixing pressure-sensitive adhesive layer 2 is formed on the entire exposed surface of the pressure-sensitive adhesive layer 18a of the supporting substrate 18, the adhesive force at the interface between the pressure-sensitive adhesive layer 18a and the fixing pressure-sensitive adhesive layer 2 is increased. In this case, the bonding force at the interface between the adherend 3 and the sticking pressure-sensitive adhesive layer 2 can be made larger. As a result, it is possible to peel and remove the adhesive except for the fixed portion without leaving it. Thus, the adhesive at the interface between the pressure-sensitive adhesive layer 18a and the adhesive pressure-sensitive adhesive layer 2 is greater than the adhesive force at the interface between the adherend 3 and the adhesive pressure-sensitive adhesive layer 2 for adhesion. By selecting, it is possible to eliminate the troublesome work of forming a pressure-sensitive adhesive layer using a mask and simplify the process.
【００５１】[0051]
【発明の効果】以上説明したように本発明によれば、模
様付電着画像およびその製造方法を提供できる。As described above, according to the present invention, it is possible to provide a patterned electrodeposition image and a method for producing the same.
【図１】本発明に係る模様付電着画像の概略断面図であ
る。FIG. 1 is a schematic sectional view of a patterned electrodeposition image according to the present invention.
【図２】本発明に係る模様付電着画像の概略断面図であ
る。FIG. 2 is a schematic sectional view of a patterned electrodeposition image according to the present invention.
【図３】本発明に係る製造方法の１工程の概略を示す。FIG. 3 shows an outline of one step of the manufacturing method according to the present invention.
【図４】本発明に係る製造方法の１工程の概略を示す。FIG. 4 shows an outline of one step of the manufacturing method according to the present invention.
【図５】本発明に係る製造方法の１工程の概略を示す。FIG. 5 shows an outline of one step of the manufacturing method according to the present invention.
【図６】本発明に係る製造方法の１工程の概略を示す。FIG. 6 shows an outline of one step of the manufacturing method according to the present invention.
【図７】本発明に係る製造方法の１工程の概略を示す。FIG. 7 shows an outline of one step of the manufacturing method according to the present invention.
【図８】本発明に係る製造方法の１工程の概略を示す。FIG. 8 shows an outline of one step of the manufacturing method according to the present invention.
【図９】本発明に係る製造方法の１工程の概略を示す。FIG. 9 shows an outline of one step of the manufacturing method according to the present invention.
【図１０】本発明に係る製造方法の１工程の概略を示
す。FIG. 10 shows an outline of one step of the manufacturing method according to the present invention.
【図１１】本発明に係る製造方法の１工程の概略を示
す。FIG. 11 shows an outline of one step of the manufacturing method according to the present invention.
【図１２】本発明に係る製造方法の１工程の概略を示
す。FIG. 12 shows an outline of one step of the manufacturing method according to the present invention.
【図１３】本発明に係る製造方法の１工程の概略を示
す。FIG. 13 shows an outline of one step of the manufacturing method according to the present invention.
【図１４】本発明に係る製造方法の１工程の概略を示
す。FIG. 14 shows an outline of one step of the manufacturing method according to the present invention.
【図１５】本発明に係る製造方法の１工程の概略を示
す。FIG. 15 shows an outline of one step of the manufacturing method according to the present invention.
【図１６】本発明に係る製造方法の１工程の概略を示
す。FIG. 16 shows an outline of one step of the manufacturing method according to the present invention.
１…模様付電着画像 ２…固着用粘着剤層 ３…被着体 ４…装飾用薄膜層 １１…模様を有する物品 １２…金属膜 １３…導電性薄膜 １４…導電性基材 １５…フォトレジスト １６…導電部 １７…第１の支持基材 １７ａ…第１の支持基材の粘着剤層 １８…第２の支持基材 １８ａ…第２の支持基材の粘着剤層 1 ... Patterned electrodeposition image 2 ... Adhesive layer for fixing 3 ... Adherend 4 ... Thin film layer for decoration 11 ... Article having a pattern 12 ... Metal film 13 ... Conductive thin film 14 ... Conductive substrate 15 ... Photoresist 16 ... Conductive part 17 ... First supporting base material 17a ... Adhesive layer of first supporting base material 18 ... Second supporting base material 18a ... Adhesive layer of second supporting base material
Claims (7)
付電着画像。1. A patterned electrodeposition image having a pattern on the surface and a substantially rectangular cross section.
薄膜に転写し、該導電性薄膜の模様面に、電着画像を形
成することを特徴とする模様付電着画像の製造方法。2. A method for producing a patterned electrodeposition image, which comprises transferring a surface pattern of an article having a pattern onto a conductive thin film and forming an electrodeposition image on the patterned surface of the conductive thin film.
薄膜に転写し、該導電性薄膜の模様面に装飾用薄膜層を
形成した後、該模様面に電着画像を形成することを特徴
とする模様付電着画像の製造方法。3. A method for transferring a surface pattern of an article having a pattern onto a conductive thin film, forming a decorative thin film layer on the pattern surface of the conductive thin film, and then forming an electrodeposition image on the pattern surface. A method for producing a characteristic electrodeposited image.
薄膜に転写し、該導電性薄膜の模様面に離型処理を施し
た後、該模様面に電着画像を形成することを特徴とする
模様付電着画像の製造方法。4. The surface pattern of an article having a pattern is transferred to a conductive thin film, the pattern surface of the conductive thin film is subjected to a release treatment, and then an electrodeposition image is formed on the pattern surface. And a method for producing a patterned electrodeposition image.
薄膜に転写し、該導電性薄膜の模様面に離型処理を施し
た後、装飾用薄膜層を形成し、該模様面に電着画像を形
成することを特徴とする模様付電着画像の製造方法。5. The surface pattern of an article having a pattern is transferred to a conductive thin film, the pattern surface of the conductive thin film is subjected to a mold release treatment, and then a decorative thin film layer is formed. A method for producing a patterned electrodeposition image, which comprises forming a reception image.
固定した後、導電性薄膜の模様面に電着画像を形成する
ことを特徴とする請求項２〜５の何れかに記載の模様付
電着画像の製造方法。6. The electro-deposited image is formed on the patterned surface of the conductive thin film after the smooth surface of the conductive thin film is fixed on the conductive base material. A method for producing a patterned electrodeposition image as described.
着画像の製造方法により模様付電着画像形成後、電着画
像の平滑面を第１の支持基材に貼着し、導電性薄膜を剥
離して電着画像の模様面を露出させ、電着画像の模様面
を第２の支持基材に貼着し、前記第１の支持基材を剥離
して電着画像の平滑面を露出させ、該電着画像の平滑面
に固着用粘着剤層を形成し、該固着用粘着剤層を介して
電着画像を被着体に固着し、第２の支持基材を剥離する
ことを特徴とする模様付電着画像の固着方法。7. After forming a patterned electrodeposition image by the method for producing a patterned electrodeposition image according to claim 2, the smooth surface of the electrodeposition image is adhered to the first supporting substrate. , The conductive thin film is peeled off to expose the patterned surface of the electrodeposited image, the patterned surface of the electrodeposited image is adhered to the second supporting base material, and the first supporting base material is peeled off to form the electrodeposition image. To expose the smooth surface of the electrodeposited image, to form a sticking pressure-sensitive adhesive layer on the smooth surface of the electro-deposited image, and to fix the electro-deposited image to the adherend through the sticking pressure-sensitive adhesive layer. A method for fixing an electrodeposited image with a pattern, which comprises peeling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000167526A JP3364195B2 (en) | 2000-06-05 | 2000-06-05 | Patterned electrodeposited image and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000167526A JP3364195B2 (en) | 2000-06-05 | 2000-06-05 | Patterned electrodeposited image and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001342595A JP2001342595A (en) | 2001-12-14 |
| JP3364195B2 true JP3364195B2 (en) | 2003-01-08 |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006052448A (en) * | 2004-08-12 | 2006-02-23 | Tefuko Aomori Kk | Patterned metal sheet and preparing method therefor |
| EP1835339B1 (en) * | 2006-03-15 | 2012-05-16 | Rolex S.A. | Fabrication process by LIGA type technology, of a monolayer or multilayer metallic structure, and structure obtained therewith |
| JP2009062603A (en) * | 2007-09-10 | 2009-03-26 | Oudenshiya:Kk | Method for producing electroformed image such as character with pattern |
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