KR100630315B1 - Metal flake forming a figure and the method for manufacturing the same - Google Patents

Abstract

An object of the present invention is to provide a shaped metal foil and a method of manufacturing the same, wherein the fixing surface is flat and capable of coating a sufficient amount of adhesive. The present invention relates to a metal foil with a shape, and a method of manufacturing the same, for the purpose of providing a method for producing metal foil.

The shaped metal foil according to the present invention has a shape on the surface and is substantially trapezoidal in cross section. The shaped metal foil is subjected to electroforming on a conductive mold having a shape to form a shaped metal thin film, and the shaped metal is It is obtained by etching a thin film in a predetermined pattern shape.

Shaped metal thin film, corrosion resistant plating film, conductive mold

Description

Metallic Flake with Shape and Manufacturing Method Thereof {METAL FLAKE FORMING A FIGURE AND THE METHOD FOR MANUFACTURING THE SAME}

1 is a cross-sectional view of one form of a shaped metal foil according to the present invention.

Figure 2 is a cross-sectional view of one form of a shaped metal foil according to the present invention.

Figure 3 is a cross-sectional view of one form of a shaped metal foil according to the present invention.

4 is a diagram showing one step of a method for producing a conductive mold;

5 is a diagram showing one step of the method for producing a conductive mold.

6 is a view showing one step of the manufacturing method of the present invention.

7 is a view showing one step of the manufacturing method of the present invention.

8 is a view showing one step of the manufacturing method of the present invention.

9 is a view showing one step of the manufacturing method of the present invention.

10 is a view showing one step of the manufacturing method of the present invention.

FIG. 11 is a diagram illustrating a plan view of FIG. 10.

※ Explanation of symbols for main parts of drawing

1: shape-attached metal foil 2: adhesive layer for fixing

3: adherend 4: corrosion resistant plating film

11: shaped article 12: metal film

13: conductive mold 14: conductive substrate

15: metal thin film with shape 16: resist film

17: exposed part 18: adhesive sheet

21: Positioning pattern for process control 22: Mask pattern for process control

The present invention relates to a shape-attached metal foil used in product logos and decorative parts, and to a manufacturing method thereof. More specifically, the shape-attached metal foil formed of fine shapes such as hologram patterns, cloth grains, paper grains, stones, etc. It relates to a manufacturing method.

In the manufacture of metal products having fine and complicated shapes such as product logos and decorative parts, for example, the electrodeposition imaging method described in Japanese Patent Application Laid-Open Nos. 7-331479 and 8-27597 is adopted. In recent years, such a product logo is required to further improve decorative properties, for example, to form a fine pattern on the surface. However, the method described in these publications does not disclose forming a pattern on the electrodeposited image surface.

Patent Literature 1 discloses a shape-adhesive electrodeposition image and its manufacturing method. This manufacturing method consists of the process of transferring the surface shape of the article which has a shape to a conductive thin film, and forming an electrodeposition image on the shape surface of this conductive thin film.

[Patent Document 1] Japanese Patent Application Laid-Open No. 2001-342595

According to the said patent document 1, the electrodeposition image which has a pattern on the surface is provided, and it is highly appreciated also in the market, but further improvement was calculated | required by the following point.

(1) Since the character pattern is formed by the electrodeposition imaging method, the edge portion (end) of the opposite surface (hereinafter referred to as "fixing surface") of the pattern surface may be rounded. In particular, this tendency is remarkable for small character patterns or narrow character patterns. The electrodeposited image is attached to the adherend by a fixing adhesive layer formed on the fixing surface. If the fixing surface is rounded, a sufficient amount of adhesive may not be coated, and the required adhesive force may not be obtained. For this reason, after fixation to a to-be-adhered body, an electrodeposition image may fall.

(2) When peeling an electrodeposition image from a conductive thin film, a conductive thin film is curved and performed. For this reason, the conductive thin film is crooked and cannot be reused.

(3) An electrodeposition image is formed for each independent character pattern. The formed electrodeposited image is transferred onto the supporting film, and the shape surface is exposed. Since the character patterns are independent from each other, and the support film is insulative, electroplating cannot be applied to the surface as a finish. In the case of electroless plating, since a bath temperature becomes about 100 degreeC, a support film may soften and a character pattern may fall out by the expansion and contraction of a film.

(4) For the above (3), Patent Document 1 teaches that a thin film layer for decoration is formed on the surface of the conductive thin film in advance before the formation of the electrodeposited image, and the electrodeposition is performed thereon. As a result, a patterned electrodeposition image having a decorative thin film layer on the surface is obtained. But this process is complicated.

This invention is made | formed in order to solve the said subject, Comprising: It aims at providing the shaping | molding metal foil and its manufacturing method which can adhere | attach a fixed amount of plane, and a sufficient amount of adhesive. Moreover, an object of this invention is to provide the manufacturing method of the metal-clad metal foil with which a corrosion-resistant plating layer can be easily formed in a surface.

The summary of this invention which solves such a subject is as follows.

[1] Shaped metal flakes having a shape on the surface and having an approximately trapezoidal cross section.

[2] The shaped metal foil as described in [1], wherein corrosion resistant plating is performed on the shaped surface.

[3] A method for producing a shaped metal foil, comprising the steps of: electroforming a conductive mold having a shape to form a shaped metal thin film, and etching the shaped metal thin film in a predetermined pattern.

[4] electroforming the conductive mold having a shape to form a metal foil with shape, peeling the metal foil with shape from the conductive mold, and performing corrosion-resistant plating on the shape surface of the metal foil with shape. A method for producing a shaped metal foil comprising a step of etching the attached metal thin film in a predetermined pattern.

EMBODIMENT OF THE INVENTION Hereinafter, the shaping | molding metal foil and its manufacturing method which concern on this invention are demonstrated in detail, referring drawings.

As shown in FIG. 1, 2, the surface-attached metal foil 1 which concerns on this invention has the surface as an uneven | corrugated pattern surface, and the cross section is substantially trapezoid shape.

The shape is not particularly limited, and textiles, paper, grains, wood grains, stones, leaves, petals, shells, leathers, fine shapes of various artificial (artificial leathers, sculptures, bits), holograms, greetings, hairlines Very fine patterns, such as these, may be sufficient.

The shaped metal foil 1 can be formed of various metals that can be poled, and metals such as nickel, copper, iron, etc. are preferably used in view of cost and ease of acquisition.

Such shaped metal foil 1 can be obtained by the manufacturing method of the shaped metal foil which concerns on this invention mentioned later, The cross section is substantially trapezoid shape. Here, an approximately trapezoid means that the average plane A of a shape surface side, and a fixed surface (the surface in which the adhesive agent layer 3 for fastening is formed) are parallel. The mean plane A is defined by the arithmetic mean of irregularities of the shape plane.

In the shaped metal foil 1, the lower angle θ formed between the side surface and the fixing surface is preferably more than 100 ° and less than 150 ° when the upper side of the shape surface shown in FIG. 1 is longer than the lower side of the fixing surface. In particular, it is preferable to exceed 100 degrees and 120 degrees or less. The two low angles may be the same or different.

Moreover, in the form where the upper side shown in FIG. 2 is shorter than a lower side, it is preferable that the low angle (theta) is less than 80 degrees and 50 degrees or more, and it is especially preferable that it is less than 80 degrees and 60 degrees or more. The two bottom angles may be the same or different.

The use form of the shaping | molding metal foil 1 of this invention has a use form as shown to FIG. 1 and FIG. The shape of FIG. 1 is long in the upper side which is a shape surface, and short in the lower side which is a fixation surface. Therefore, when this is viewed from the shape surface side, the side surface is not seen and gives a sharp impression. In addition, in the form of FIG. 2, the upper side is short and the lower side is long. Therefore, when this is seen from the shape surface side, the side surface is seen and gives a three-dimensional impression. The shaped metal foil of this invention can select a use mode suitably according to the visual effect made into the objective.

Since the shaped metal foil 1 is obtained by the manufacturing method of this invention mentioned later, unlike the electrodeposition imaging method described in the said patent document 1, the edge part of a fixed surface does not become round. Therefore, a sufficient amount of adhesive can be coated on the fixing surface, so that after the adhesion to the adherend 3, the flakes 1 do not easily fall off.

Although the thickness of the shaped metal foil 1 is various according to the use, it is generally about 20-300 micrometers, Preferably it is 50-200 micrometers, More preferably, it is 100-150 micrometers. Moreover, the unevenness | corrugation of a shape surface is various according to the shape formed.

As shown in Figs. 1 and 2, the shaped metal foil 1 can be fixed onto the adherend 3 via the fixing adhesive layer 2.

The fixing adhesive layer 2 is, for example, an adhesive or an adhesive such as rubber, acrylic or epoxy, and is formed of a relatively strong adhesive or adhesive having a peel strength of about 800 to 3000 g / 25 mm width. Moreover, a hot melt adhesive and an ultraviolet curing adhesive agent may be sufficient.

Moreover, the to-be-adhered body 3 is various according to the use of the shaped metal foil 1, for example, a clock face, various telephone products, various ornaments, etc. In addition, the adherend 3 may be provided with a recess of approximately the same size as the shaped metal foil 1, and the shaped metal foil 1 may be embedded in the recess.

In the patterned metal foil 1 of the present invention, as shown in Fig. 3, the decorative layer and the corrosion resistance are further enhanced, so that the coating layer 4 may be formed on the pattern surface. Although the thickness of the coating layer 4 varies with the raw material, about 0.1-3 micrometers is generally the most suitable. This coating layer 4 may be formed with insulating materials, such as ink, a coating material, and resin. Moreover, the electroplating film which consists of gold, silver, platinum, a tin cobalt alloy, etc. may be sufficient, and an electroless plating film, an ion-plating film, a sputtering film may be sufficient. In particular, for the purpose of imparting corrosion resistance, a corrosion resistant electroplating film of chromium, gold and the like, particularly chromium, is preferable.

Next, the manufacturing method of the shaped metal foil which concerns on this invention is demonstrated.

The method for producing a shaped metal foil according to the present invention includes the step of electroforming a conductive mold having a shape to form a shaped metal thin film, and etching the shaped metal thin film in a predetermined pattern. Doing.

A conductive mold having a shape is obtained by various methods. For example, by applying and curing a conductive paint or a conductive polymer on the surface of an article having a shape, a conductive mold can be obtained as the conductive resin film transferred to the shape, and electroless plating is performed on the surface of the article having a shape. As a result, an electroconductive mold can be obtained as the electroless plating film on which the pattern is transferred.

However, in the present invention, it is particularly preferable to use an electroconductive mold obtained by forming a surface shape of an article having a shape by an electroforming method (also called electroforming method) in terms of strength, economy, operability and uniformity of quality. .

In order to mold the surface shape of the shaped article by the electroforming method, electroforming is performed on the shaped article 11. When the article 11 does not have conductivity, as shown in FIG. 4, the metal film 12 is formed on the surface of the article 11 to impart conductivity to the article 11.

Examples of the article 11 having the shape include fabrics, paper, grains, wood grains, stones, leaves, petals, shells, leathers, and artefacts having various fine patterns (artificial leathers, sculptures, pieces), and the like. Preferably, textiles, paper, grains, wood grains, ore, leaves, pieces, or bits are used. Also, very fine patterns such as holograms, greetings, and hairlines may be used.

As shown in FIG. 4, the pattern is formed in the surface of the article 11 (unevenness | corrugation of the surface in FIG. 4). In FIG. 4, description is abbreviate | omitted about the back surface of the article 11. As shown in FIG.

First, in order to impart conductivity to the surface of the article 11, the surface of the article 11 is cleaned, and then a metal film 12 is formed on the surface of the article 11. The metal film 12 is formed by, for example, a vacuum deposition method, an ion plating method, a sputtering method, an electroless plating method, a silver mirror reaction, or the like. The metal film 12 is formed of a metal such as silver or gold or an alloy thereof, and the thickness thereof is not particularly limited. The metal film 12 is not embedded in the concave-convex shape of the shape surface, and is preferably about 1 to 30 μm, preferably 1 About 10 micrometers is suitable.

As described above, when the article 11 is conductive, it is not necessary to form the metal film 12.

Next, a peeling process is performed to the surface of the metal film 12 as needed. When the article 11 is conductive, the surface of the article 11 is directly peeled off. The peeling treatment can be performed by selenic acid treatment, potassium dichromate treatment, anodization or the like. When the peeling treatment is performed, the conductive mold 13 (electroforming) is easily peeled off.

Next, as shown in FIG. 5, a metal is deposited on the surface of the article 11 or the surface of the metal film 12 by an electroforming method (electric casting method) to form a conductive mold 13 whose shape is transferred.

Examples of the material of the conductive mold 13 include nickel, copper, iron, and the like. Metals or alloys thereof are preferably used.

The thickness of the electroconductive mold 13 exists in the range of 100-500 micrometers. If the thickness of the electroconductive mold 13 exists in this range, since it will have moderate elasticity, operability is favorable.

When the depth of the pattern to be transferred is less than 10 µm, the thickness of the conductive mold 13 is preferably about 100 to 200 µm. Moreover, when the depth of a pattern is 10-50 micrometers, about 200-300 micrometers of the thickness of the electroconductive mold 13 are preferable. Moreover, when the depth of a pattern is 50-100 micrometers, the thickness of the electroconductive mold 13 is preferable about 300-500 micrometers.

The conditions at the time of electroforming are not particularly limited, and are appropriately selected from conventionally known electroforming (plating) conditions. Although not limited at all, the electroforming conditions in the case of obtaining the conductive mold 13 having a thickness of 200 mu m using nickel metal will be briefly described below.

First, electrolytic degreasing, washing with water, acid neutralization, washing with water, peeling treatment (potassium dichromate) and washing with water are performed on the surface of the article 11 or the metal film 12 having a shape as pretreatment.

Next, a nickel plating bath (450 g / liter sulfamate, 40 g / liter boric acid) was used to perform electroforming at 265AH (1 A / dm 2) at a liquid temperature of 50 ° C., whereby the conductive mold 13 having a thickness of 200 μm was formed. Obtained.

Next, by peeling the conductive mold 13 from the surface of the article 11 or the surface of the metal film 12, a conductive mold 13 (electroforming) having a mold surface is obtained.

In addition, when the shaped article 11 itself has conductivity, the article 11 may be used as the conductive mold 13.

In the present invention, the metal-coated thin film is obtained by performing electroforming on the surface of the conductive mold 13. The manufacture of the patterned metal thin film can be carried out in accordance with the ordinary electroforming method similarly to the production of the conductive mold 13, but it is particularly preferable to add the following steps from the viewpoint of improvement of quality and operability.

Since the electroconductive mold 13 is thin as about 100-500 micrometers as mentioned above, handling may become difficult. Therefore, in this invention, as shown in FIG. 6, it is preferable to fix the smooth surface (opposite side of a shape surface) of the electroconductive mold 13 on the electroconductive base material 14, and to manufacture a shaping metal thin film.

Here, as the conductive base material 14, various plate members can be used as long as they have sufficient strength, have conductivity, and can fix the conductive mold 13. Therefore, for example, as the conductive substrate 14, magnetic conductive plates such as conductive magnet rubbers and magnetic metal plates are preferably used. Moreover, you may fix the electroconductive mold 13 to a normal metal plate, an electroconductive polymer sheet, etc. through electroconductive peelable type | mold adhesive. When the smooth surface (the opposite side of the shape surface) of the electroconductive mold 13 is fixed on the electroconductive base material 14, handling of the electroconductive mold 13 becomes easy, and also the vibration etc. at the time of electric pole can be prevented, The shaped metal thin film 15 is obtained.

The patterned metal thin film 15 is obtained by depositing a metal on the surface of the conductive mold 13 by electroforming. As a result, as shown in FIG. 7, the patterned metal thin film 15 is obtained because the same is also formed in the metal thin film in which the unevenness of the surface of the conductive mold 13 precipitates.

Nickel is electrodeposited on the surface of the electroconductive mold 13 by using nickel sulfate liquid as a watt liquid, for example, when nickel is used as a metal which forms the shaping metal thin film 15 here. As electrodeposition conditions at this time, for example, a metal thin film having a thickness of 100 μm ± 10 μm can be obtained in 3 hours by flowing a current of 3 A / dm 2 with respect to the effective area of the pole of 150 mm × 150 mm.

In addition to the above nickel, any metal such as gold, silver, copper, iron, or alloy may be deposited to form the thin metal film 15 having a shape, and of course, for example, 20 to 300 by changing the pole conditions. The shape-attached metal thin film 15 of arbitrary thickness can be obtained in the range of about micrometer.

In this invention, it is preferable to perform a peeling process to the pattern surface of the electroconductive mold 13 before electroforming. Peeling process can be performed by the method similar to the above. When the peeling treatment is performed, the patterned metal thin film 15 obtained can be easily peeled from the conductive mold 13.

After peeling the shaping metal thin film 15 from the electroconductive mold 13, the shaping metal thin film 1 of this invention is obtained by etching the shaping metal thin film 15 to predetermined | prescribed character and figure pattern.

In addition, the above-described coating layer 4, preferably a corrosion-resistant plating film, may be formed on the pattern surface of the patterned metal thin film 15 before etching.

The etched metal thin film 15 can be etched according to a known method for etching metal foil. Specifically, a resist film is formed by applying a dry or dry resist film to a shape-resisting metal thin film 15 by applying an application resist or a resist ink, and exposing and developing the resist film on a desired character or figure pattern, and then etching. By carrying out, the shaped metal foil 1 of a desired shape is obtained.

The formation of the resist film may be performed on the pattern surface of the patterned metal thin film 15, or on the opposite surface (fixed surface) of the pattern surface. When a resist film is formed on the fixing surface of the shaping metal thin film 15, and etching is performed from the fixing surface side, the shaping metal foil of the cross-sectional shape as shown in FIG. 1 is obtained. When a resist film is formed on the pattern surface of the pattern-shaped metal thin film 15, and etching is performed from the pattern surface side, the shaped metal sheet with a cross-sectional shape as shown in Fig. 2 is obtained.

In addition, a metal foil with a desired shape may be formed, and at the same time, a metal foil for process control used for a mask during positioning and fixing adhesive layer 2 may be formed.

Hereinafter, the case where a resist film is formed in the adhesion surface of the shaping metal thin film 15, and it etches from the adhesion surface side is demonstrated more concretely.

First, the necessary negative or positive photomask film is prepared by photographs or printing. In this film, the letters corresponding to the target metal foils, the image patterns of the figure patterns, and the image diagrams corresponding to the shapes of the metal foils for process control to be formed as required are drawn with black ink or the like.

On the other hand, a photoresist such as an liquid resist, a dry film resist, or a printing ink for printing is applied to the fixing surface of the metal-attached metal thin film 15, and then printed. Then, the photomask film is placed on the photoresist, and exposure is performed with an exposure machine or the like in this state. After this exposure, development is performed to remove the unexposed photoresist, whereby the resist film 16 having a shape in accordance with the shape of the image diagram on the fixing surface of the shaped metal thin film 15 as shown in FIG. 8. And the exposed portion 17 is formed.

When etching is performed from the fixing surface side, the photomask is an inversion pattern of a character and a target object.

At this time, the adhesive sheet 18 is attached to the shape surface side of the metal thin film 15 to prevent the etching from being immersed in the shape surface side and to prevent unnecessary etching and to prevent the displacement and dropping of the pattern after etching. It is desirable to do so. As the pressure sensitive adhesive sheet, an ultraviolet curable pressure sensitive adhesive sheet is particularly preferably used since it is easy to peel later. The ultraviolet curable pressure sensitive adhesive sheet has a property of adhering to the adherend with sufficient adhesive force before irradiation of ultraviolet rays, polymerizing curing by ultraviolet irradiation, and losing the adhesive force. Such ultraviolet curing adhesive sheets are commercially available.

Next, etching liquid is sprayed from the fixing surface side in which the resist film was formed, and full etching is performed. As a result, an etching solution is immersed in the exposed portion 17, the metal thin film 15 in this portion is removed, a desired letter and figure pattern is formed, and the shaped metal foil 1 is formed as shown in FIG. Obtained.

The etching solution and the etching conditions are appropriately selected in a known range in consideration of the material and thickness of the metal thin film 15. Since the etching proceeds from the fixing surface side, the fixing surface side is largely etched, and the shape surface side is only slightly etched. For this reason, the side surface of the metal foil 1 is etched in taper shape, and when the etching is performed from the fixing surface side, the shaped metal foil with a cross-sectional shape shown in FIG. 1 is obtained. Moreover, when etching is performed from the surface side, the cross-sectional shaped metal foil with a cross section shown in FIG. 2 is obtained. However, when etching time is too long, it may be excessively side etched. Therefore, it is desirable to adjust the etching time appropriately in order to achieve a desired cross-sectional shape.

Subsequently, when the photoresist remaining on the fixing surface by removing the photoresist is immersed in the stripping solution, as shown in FIG. 10, the metal-clad metal foil 1 and the process control metal formed as necessary on the adhesive sheet 18. The flakes 21 and 22 remain. An example of the top view of FIG. 10 is shown in FIG. In this example, the target metal foil 1 as a target is a letter pattern " XYZ ", and a process control positioning pattern 21 and a process control mask pattern 22 are formed. XYZ, which is a character pattern, is a reversed pattern because the fixing surface side is shown.

Next, the fixing adhesive layer 2 is formed on the fixing surface side. Specific examples of the fixing adhesive are as described above. The fixing adhesive layer 2 is preferably formed only on the fixing surface of the shaped metal foil 1 in order to prevent unnecessary adhesive from adhering to the adherend. Therefore, when the fixing adhesive layer 2 is formed, it is recommended that a separately prepared mask having an opening having a letter pattern shape is placed on the letter pattern to form a fixing adhesive layer, and then the mask is removed. However, as shown in FIG. 11, when the process control mask pattern 22 is formed, it is not necessary to prepare a mask separately. In this case, when the adhesive bonding layer is formed on the entire exposed surface of the shaped metal foil 1 and the process control mask pattern 22, and then the process control mask pattern 22 is removed, the shaped metal foil 1 The adhesive layer 2 for fixing is formed only on the fixing surface of the).

Next, the shaped metal foil 1 is fixed to the desired adherend 3 through the fixing adhesive layer 2. When the adhesive having a larger adhesive strength than the adhesive force of the adhesive sheet 18 is selected as the adhesive for fixing, the adhered body is formed by attaching the shape-attached metal foil 1 adhered onto the adhesive sheet 18 through the adhesive layer 2. When the adhesive sheet 18 is removed after fixing to (3), the shaped metal foil 1 is transferred and fixed to the adherend side. Moreover, when the adhesive sheet 18 is an ultraviolet curing adhesive sheet, since the adhesive force of the adhesive sheet 18 decreases by ultraviolet irradiation, transfer of the shaped metal foil 1 to the to-be-adhered body can be performed reliably. .

Through such a process, fixing to the adherend 3 of the shaped metal foil 1 as shown in FIG. 1 is performed.

In the case where etching is performed from the shape surface side, the shape-attached metal foil 1 and the process control pattern aligned on the adhesive sheet 18 are once transferred to another adhesive sheet, and the adhesive surface for fixing is exposed by exposing the fixing surface side. 2) form. Other processes are the same as above.

According to the present invention, there is provided a shaped metal foil and a manufacturing method thereof, wherein the fixing surface is flat and capable of coating a sufficient amount of adhesive. Moreover, according to the manufacturing method of this invention, a corrosion-resistant plating layer can be easily formed in a shaped surface.

Claims (6)

Electroforming is performed on a conductive mold having a shape to form a metal foil with a shape, the metal foil with a shape is peeled off from the conductive mold, and a desired character or figure pattern on the opposite side of the shape face of the metal foil with the shape. Forming a resist film, and immersing the etchant in an exposed portion where the shaped metal thin film is exposed from the resist film, and etching the shaped metal thin film of the exposed portion into a tapered shape to form the desired character or figure pattern. Method of manufacturing a shaped metal foil. Electroforming on a conductive mold having a shape to form a shaped metal thin film, peeling the shaped metal thin film from the conductive mold, and corresponding to a desired character or figure pattern on the shaped surface of the shaped metal thin film. A resist film is formed, and the etching solution is immersed in an exposed portion where the shaped metal thin film is exposed from the resist film, and the shaped metal thin film is etched in a tapered shape to form the desired shaped character or figure pattern. How to prepare flakes. Electroforming is performed on a conductive mold having a shape to form a shaped metal thin film, the shaped metal thin film is peeled from the conductive mold, and a corrosion-resistant plating is performed on the shaped surface of the shaped metal thin film. A resist film corresponding to a desired character or figure pattern is formed on the opposite side of the shape surface of the metal thin film, and the etching solution is immersed in the exposed portion where the shape-attached metal thin film is exposed from the resist film, thereby forming the shape-shaped metal thin film of the exposed portion. A method of manufacturing a shape-attached metal foil formed by etching in a tapered shape on the desired character or figure pattern. Electroforming is performed on a conductive mold having a shape to form a shaped metal thin film, the shaped metal thin film is peeled from the conductive mold, and a corrosion-resistant plating is performed on the shaped surface of the shaped metal thin film. A resist film corresponding to a desired character or figure pattern is formed on the shape surface of the metal thin film, and the etching solution is immersed in the exposed portion where the shape-attached metal thin film is exposed from the resist film to taper the shape-shaped metal thin film of the exposed portion. Etching to form a shaped metal foil formed into the desired character or figure pattern. It is obtained by the manufacturing method of Claim 1 or 3, The shaped metal foil characterized by the above-mentioned. It is obtained by the manufacturing method of Claim 2 or 4, The shaped metal foil characterized by the above-mentioned.

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