KR20100112018A - Method for treating surface of substance made by diecasting - Google Patents

Abstract

PURPOSE: A method for treating surface of substance made by diecasting is provided to form the pattern by using the laser about the material shaped by dicasting method, thereby it can form freely on not only plan part but also curving or bending rounding unit. CONSTITUTION: A method for treating surface of substance made by diecasting comprises next; a stage of forming a pattern by using the laser in rounding part at least in rounding part about a substrate having a plane part and rounding part, a stage of formally forming a plating layer on a substrate which pattern is formed, a stage for formally forming the coating layer for realizing color on a plating layer. A stage for forming the pattern comprises next(S1); a stage of coating a masking layer on a substrate(S11), a stage of printing a desired pattern on the masking layer by exposed phenomena by laser(S12), a stage of etching the surface of the substrate with the same pattern with the printed pattern by using the printed pattern on the masking layer(S13), a stage of removing the masking layer(S14).

Description

Surface treatment method of die cast material {METHOD FOR TREATING SURFACE OF SUBSTANCE MADE BY DIECASTING}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface treatment method of a die cast material, and more particularly, to a surface treatment method of forming a pattern such as a logo or a pattern on a surface of a case of an electronic component manufactured by die casting.

In general, the surface treatment is made for a variety of purposes, such as to make the surface of the material beautiful, corrosion resistance, wear resistance, surface hardening. For example, an electronic device has a form in which electronic components are accommodated in an outer case made of metal or plastic, and the outer case not only improves mechanical and chemical strength through surface treatment but also expresses a precise and beautiful appearance so that the outer case can be removed from the external environment. It can protect the electronic components inside and give consumers aesthetics.

Among the surface treatment methods performed on the material, a method of forming a pattern such as a logo or a pattern on the surface of the material is particularly performed in order to impart aesthetics of a product, a function of displaying a source, and the like.

Conventionally, a method of forming a pattern on a material includes applying a photoresist on a material, exposing the surface of the material between the photoresist through exposure and development using a mask on which a desired pattern is formed, and then etching and remaining photoresist of the exposed portion. By removing the pattern, a pattern is formed on the material.

In the conventional pattern forming method, when the material is in the form of a flat plate, the pattern can be formed without any problem, but in the case of a material having a complicated shape formed by a die casting method, the pattern can be formed only on the flat part. There is a problem in that a pattern cannot be formed in a bent portion or a curved portion.

" 형상인 경우, 종래 패턴 형성 방법에 의하면, 평면부인 상면에만 패턴을 형성할 수 있을 뿐 양 측면 및 굴곡진 모서리 부분에는 패턴을 형성할 수 없는 문제점이 있다.For example, a rectangular shape in which the lower part of the material formed by die casting is opened, that is, "

", In the case of the conventional pattern formation method, there is a problem in that the pattern can be formed only on the upper surface, which is the planar portion, and the pattern cannot be formed on both side surfaces and the curved edge portions.

An object of the present invention is to provide a surface treatment method capable of freely forming a pattern on an entire region of a material having a complicated shape by molding by a die casting method.

According to an aspect of the present invention, there is provided a method for treating a surface, the method including: forming a pattern by using a laser on at least the rounding part of a substrate formed by a die casting method and having a flat part and a rounding part; Conformally forming a plating layer on the patterned substrate; And conformally forming a coating layer for implementing color on the plating layer.

The forming of the pattern may include: coating a masking layer on the substrate; Transferring a desired pattern to the masking layer by exposure and development with a laser; Etching the surface of the substrate in the same pattern as the transferred pattern by using the pattern transferred to the masking layer; And removing the masking layer.

In addition, the substrate may be an alloy of any one selected from an aluminum alloy and a magnesium alloy.

The substrate may be one in which a copper layer and a nickel layer are sequentially plated on any one alloy layer selected from an aluminum alloy and a magnesium alloy, and the etching pattern is any one of the nickel layer, the copper layer, and the alloy layer. It can be formed in the layer of.

In addition, between the step of forming the pattern and the step of forming the plating layer may be further included a step of mechanical processing to form a rough portion on the surface of the substrate.

According to the surface treatment method according to the present invention, since a pattern is formed using a laser on a material formed by a die casting method, the pattern can be freely formed not only on the flat part but also on the curved or bent rounding part, thereby improving the decorativeness of the product. It has the advantage of improving the quality and patterning of the source marking function in all areas of the product.

Hereinafter, a surface treatment method according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 is a flow chart sequentially showing a surface treatment method according to a first embodiment of the present invention, Figures 2a to 2e is a view showing a surface treatment method sequentially in the order of FIG.

Referring to FIG. 1, the surface treatment method of the present invention includes a pattern forming step S1, a plating step S2, and a painting step S3.

The pattern forming step S1 is a step of forming an arbitrary pattern on the substrate 10 by using a laser. The masking layer coating step S11, the exposure / development step S12, and the etching step S13 are performed. ) And removing the masking layer (S14).

The substrate 10 may be made of a metal material such as aluminum alloy or magnesium alloy, and may be manufactured by a die casting method. The substrate 10 may be manufactured in various and complicated shapes according to the customer's request as well as the flat form by die casting. In the present embodiment, the substrate 10 will be described by illustrating a case where the flat portion and the round portion includes a rounded portion is bent to extend.

1 and 2A, the masking layer coating step S11 may include a masking layer over the entire surface of the substrate 10 having the flat portion 11 and the rounded portion 12 from which the flat portion 11 extends. (20) is coated. The masking layer 20 is a photosensitive material including a polymer material, a positive photosensitive material in which a polymer chain is broken by a laser, or a negative photosensitive material in which cross-linking is generated by a laser. Can be. The substrate 10 used in the masking layer coding step S11 may be subjected to a buffing process before coating the masking layer.

1 and 2B, the exposure / development step S12 is performed through an exposure process and a development process by the laser 30 to the masking layer 20, and a pattern to be formed is formed on the masking layer 20. To be transferred.

Transfer of the pattern by exposure and development of the laser 30 exposes the masking layer 20 while moving the laser 30 along the pattern shape to be formed, and develops the exposed portion. Therefore, according to the present embodiment, a conventional patterned mask is unnecessary, and a desired pattern can also be formed on the rounding part 12 which cannot form a pattern through the conventional patterned mask.

When the intaglio pattern is to be formed on the substrate 10, the masking layer 20 is a positive photosensitive material. A portion of the masking layer 20 corresponding to the portion of the intaglio pattern to be formed on the substrate 10 is removed by exposure and development to form an intaglio pattern on the masking layer 20, so that the surface of the substrate 10 is masked. It is exposed in the form of the intaglio pattern of (20).

Referring to FIGS. 1 and 2C, in the etching step S13, the substrate 10 having the negative pattern formed on the masking layer 20 is etched in an etchant. The etchant may be an aluminum etchant including iron chloride (ex: FeCl 3 + HC 1). In this case, the portion of the substrate 10 having the exposed surface is etched to a predetermined depth, and the substrate 10 has the same intaglio pattern 13 as the pattern formed on the masking layer 20.

1 and 2D, the masking layer removing step S14 removes the masking layer 20 remaining on the substrate 10 on which the etching step S13 is completed using a masking layer 20 release agent.

Next, the plating step S2 and the painting step S3 will be described with reference to FIGS. 1 and 2E. The plating step S2 is a step of forming the plating layer 40 conformally on the substrate 10 on which the intaglio pattern 13 is formed. The plating layer may have a form in which a nickel (Ni) layer and a chromium (Cr) layer are formed on the nickel (Ni) layer. By forming the plating layer 40 on the substrate 10, the texture of the intaglio pattern 13 formed on the substrate 10 may be emphasized, and a beautiful metal texture may be applied to the substrate 10.

The coating step S3 is a step of forming the coating layer 50 conformally on the plating layer 40 using a polymer or conductive coloring. The coating layer 50 is formed by connecting (+) and (-) electrodes to the substrate (the substrate on which the plating layer is formed) and the tank, respectively, and passing a current through the water-soluble paint in the tank to form a polymer-based coating film on the coating. Electrodeposition coating method, or a coating method for curing a polymer-based water-soluble coating solution containing fluorine, urethane using heat energy. By the formation of the coating layer 50, the substrate 10 may have various colors.

According to the surface treatment method as described above, a pattern can be formed regardless of the form of the material because the exposure is performed while moving the laser to a complex and various types of substrates formed by die casting.

Meanwhile, in the present exemplary embodiment, the pattern formed on the substrate 10 is an intaglio pattern 13. However, the pattern formed on the substrate 10 is not limited to the intaglio pattern. For example, the masking layer may be a negative photosensitive material. When formed, the pattern formed on the substrate may be an embossed pattern.

3 is a view schematically showing an etching depth of a substrate by the surface treatment method according to the second embodiment of the present invention.

Referring to FIG. 3, the substrate 10 according to the second embodiment of the present invention includes a metal layer such as a copper (Cu) layer 10b and a nickel (Ni) layer 10c on an aluminum or magnesium alloy layer 10a. It may be formed by plating sequentially.

In the second embodiment of the present invention, the pattern forming step (S1) is to coat the masking layer 20 on the substrate 10, while moving the laser 30 in the form of a desired pattern plane portion 11 and After exposing and developing the masking layer 20 on the rounding part 12, the substrate 10 is placed in an etchant to etch the substrate 10 in the exposed portion and the remaining masking layer 20 is removed. The intaglio pattern 13 is formed on 10.

The substrate 10 may be selectively etched to a predetermined depth of the nickel layer 10c as shown in (a) of FIG. 3, and may be etched through the nickel layer 10c as shown in FIG. It may be etched to a predetermined depth of 10b), and may be etched to a predetermined depth of the alloy layer 10a through the nickel layer 10c and the copper layer 10b as shown in FIG.

The intaglio pattern 13 may be formed on the substrate 10 as described above, and the three-dimensional effect of the intaglio pattern 13 may be selectively adjusted by changing the etching depth of the intaglio pattern 13.

In the second embodiment, the same or similar configuration and operation as those in the first embodiment can be easily understood by those skilled in the art from the first embodiment, and thus a detailed description thereof will be omitted.

4 is a flow chart sequentially showing a pattern forming step of the surface treatment method according to the third embodiment of the present invention, Figure 5 is a schematic view showing a mechanically processed substrate of FIG.

4 and 5, the surface treatment method of the present invention includes a pattern forming step S1, a mechanical processing step S15, a plating step S2, and a painting step S3.

The pattern forming step S1 is a step of forming the intaglio pattern 13 only on the rounded portion 12 or on the flat portion 11 and the rounded portion 12 of the surface of the substrate 10. It is the same as the example pattern formation step S1.

The mechanical processing step S15 is a step of forming the rough portion 14 through a sanding process or the like on the substrate 10 on which the intaglio pattern 13 is formed. The rough portion 14 may be formed in the shape of a mountain and a valley with irregular periods and amplitudes.

The plating (S2) and the painting step (S3) is a step of forming the plating layer 40 and the coating layer 50 conformally on the substrate 10 on which the pattern 13 and the rough portion 14 are formed.

When the rough portion 14 is formed on the substrate 10 through the mechanical machining step S15 as described above, 75 to 85% of the case where the plating layer is formed on the substrate 10 on which the rough portion 14 is not formed. It may have a reflectance. This lowers the reflectance of the light by the formation of the rough portion 14, thereby making it possible to exhibit a visually soft gloss effect, thereby achieving high quality of the product in which the substrate 10 is used.

In the third embodiment, the same configuration and operation as those of the first and second embodiments are easily understood by those skilled in the art from the first and second embodiments, and thus detailed description thereof is omitted.

The substrate 10 manufactured according to the embodiment of the present invention is a mobile phone, a portable multimedia player (PMP), personal digital assistants (PDA), MP3 (MP3: MPEG Audio Layer-3) It can be used as an external case of electronic products such as a player. According to the surface treatment method according to the embodiment of the present invention, the pattern 13 may be freely formed not only on the planar portion 11 but also on the curved or bent rounded portion 12 with respect to a complex substrate formed by a die casting method. It is possible to improve the decorativeness of the product in which the substrate 10 is used and to form a pattern as a source display function in the entire area of the product.

1 is a flowchart sequentially showing a surface treatment method according to a first embodiment of the present invention;

2a to 2e are views sequentially showing the surface treatment method in the order of FIG.

3 is a view schematically showing an etching depth of a substrate by the surface treatment method according to the second embodiment of the present invention;

4 is a flow chart sequentially showing a pattern forming step of the surface treatment method according to a third embodiment of the present invention,

FIG. 5 is a schematic view of the mechanically processed substrate of FIG. 4.

<Description of the symbols for the main parts of the drawings>

10. Substrate 11. Flat Part

12. Rounding part 13. Engraving pattern

14. Roughness 20. Masking layer

30. Laser 40. Plating Layer

50. Paint layer

Claims (7)

Forming a pattern on a substrate having a flat portion and a rounded portion using a laser at least on the rounded portion; Conformally forming a plating layer on the patterned substrate; And Conformally forming a coating layer for color implementation on the plating layer. The method of claim 1, wherein forming the pattern comprises: Coating a masking layer on the substrate; Transferring a desired pattern to the masking layer by exposure and development by the laser; Etching the surface of the substrate in the same pattern as the transferred pattern by using the pattern transferred to the masking layer; And Removing the masking layer. The method of claim 2, wherein the substrate Surface treatment method characterized in that the alloy of any one selected from aluminum alloy and magnesium alloy. The method of claim 2, wherein the substrate Surface treatment method characterized in that the copper layer and the nickel layer are sequentially plated on any one alloy layer selected from aluminum alloy and magnesium alloy. The method of claim 4, wherein the pattern by etching It is formed in any one of said nickel layer, a copper layer, and an alloy layer. The method according to claim 1, And performing mechanical processing between the step of forming the pattern and the step of forming the plating layer to form a rough portion on the surface of the substrate. The method according to claim 1, wherein the substrate, Surface treatment method characterized in that the molding by the die casting method.

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