JP3937568B2 - Method for forming metal pattern on curved surface - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method of forming a metal pattern on the surface of a curved body.
[0002]
[Prior art]
A metal wire is disposed on the surface of a bent rear glass of an automobile and used as a heat transfer wire for defrosting or used as a radio wave receiving wire, that is, an antenna. Also, in recent years, the formation of metal patterns such as wiring patterns on curved bodies such as cases in electrical products that are becoming smaller year by year is expected to increase further as various electronic devices become smaller and have higher performance. Is done.
[0003]
Conventionally, as a method of forming a metal pattern on a curved body, there is a method in which a metal piece formed in a desired shape by a press or the like is first attached to a desired position. This method is effective for a large pattern, but is difficult to employ for a fine pattern such as a wiring pattern.
[0004]
As another method, there is a method of transferring a plated metal formed in a desired pattern by electroplating or electroless plating.
[0005]
The normal process of the plating metal pattern transfer method is as shown in FIG.
As a substrate, a stainless steel plate 51 that can be plated and from which the plated metal can be easily peeled is used, and a photoresist 52 is applied and exposed through a photomask 53 having a desired pattern (FIG. 5A). ) And developing to obtain a substrate 51 other than the desired plated portion covered with the photoresist 52 (FIG. 5B).
[0006]
Plate 54 to the desired thickness and if necessary polish and flatten (FIG. 5 (c)). The photoresist 52 is peeled off (FIG. 5 (d)) and bonded to a member 56 (referred to as a transferred body in this invention) to which the adhesive material 55 is applied and the metal pattern is transferred (FIG. 5 (e)). Then, both are peeled off, and the plated metal 54 is transferred to the transfer target 56 (FIG. 5 (f)).
[0007]
For example, a printed wiring board is manufactured using this method on a flat plate. Moreover, there is a screen plate mesh that is not transferred but only peeled. Further, as an example of application to a curved surface transfer body, there is manufacture of a mesh portion of an electric razor. In this case, it peels instead of transferring.
[0008]
A method for transferring between curved bodies and forming a metal pattern on the surface of the curved body has not been known so far. The present invention provides a method of forming a metal pattern on the surface of a curved body by transfer between the curved bodies.
[0009]
In this case, unless a metal is formed on the entire surface, it is necessary to provide a region that is not plated by any method, that is, a masked region for plating, or leave a desired pattern by using an etching method after plating the entire surface. In this case as well, it is necessary to provide a region having a masking action against etching. In the plating metal transfer method, a layer having a function of preventing plating is generally called a plating mask layer or simply a mask layer. In the present invention, it is called a plating mask layer.
[0010]
In the step of transferring the plating metal deposited in the recess (conductive pattern portion) surrounded by the plating mask layer to the transfer object, the photoresist 52 which is the plating mask layer is peeled off in the conventional method. The reason for this is that if it is transferred without peeling in order to improve productivity, a part or all of the plating mask layer will be adhered to the adhesive material on the transfer target and will be damaged during peeling. Or, conversely, the adhesive adheres to the plating mask layer, which becomes an obstacle when repeatedly used. For this reason, there was a problem that productivity was low.
[0011]
In an improved process to avoid this problem, instead of peeling off the photoresist, an adhesive material is electrodeposited, and without peeling off the plating mask layer, the surface is pasted with a transfer material on which no adhesive material is applied. After that, both are peeled off.
[0012]
It is a clever method of using plating again for patterning the adhesive. Due to this improvement, the pressure-sensitive adhesive layer is formed only on the necessary portion, so that the pressure-sensitive adhesive is less likely to adhere to the plating mask layer.
[0013]
However, the electrodeposition process is increased by one, and the pressure-sensitive adhesive having such an electrodeposition property is expensive, and there are cases where the adhesive properties and the like are not sufficient. Also, since the side of the plating mask is in contact with the adhesive, the plating mask layer may be damaged, and in general, the plating mask layer of the photoresist is damaged by the pressurization during transfer. The plating mask layer had to be peeled and re-formed every time or every 2-3 times.
[0014]
Japanese Patent Laid-Open No. 6-175340 has proposed a further improved method for preventing damage to the plating mask layer. This is a method of forming a peelable resin layer on the entire surface of the substrate for plating transfer. However, this method has the following problems.
[0015]
That is, this is an insulating layer as a masking layer formed on the entire surface of the substrate by various thin film forming methods such as ion plating, vacuum deposition, sputtering, etc., and then this layer is patterned by photolithography, Thereafter, a releasable resin layer such as a silicone resin is formed on the entire surface of the substrate in this state by, for example, a flow method, a spin coat method, a roll coat method or the like. It was difficult to adjust the thickness.
[0016]
The thickness of the peelable resin layer is preferably about 0.005 to 0.1 μm, and if it is less than 0.005 μm, the masking layer is not sufficiently protected due to breakage of the peelable resin layer due to external force, etc. Absent. On the other hand, if the thickness of the peelable resin layer exceeds 0.1 μm, the plated metal is not formed in the recess or the shape of the recess is deviated from a predetermined shape, which is not preferable.
[0017]
However, if such a restriction is satisfied, a fine copper pattern having a line width of 5 μm and a thickness of 1 μm can be formed. However, in practice, it is quite difficult to apply to an uneven surface while maintaining this thickness accuracy. In particular, if there is unevenness in the thickness of the recess, there is a problem that the electrical resistance becomes uneven, the deposition rate becomes uneven, the plating metal becomes uneven, and the uniformity of the conductive pattern decreases.
[0018]
A further improvement of this improvement is disclosed in Japanese Patent Laid-Open No. 6-283842. That is, this is a method using electrodeposition coating in order to use a conductive organopolysiloxane that can be electrodeposited on the peelable layer and to keep the thickness constant at a desired value. Further, in the present invention, the pressure-sensitive adhesive layer is formed only in a necessary place using an electrodepositable pressure-sensitive adhesive. However, this method requires a long process, and a peelable layer is not formed on the side surface of the electrodeposition mask. Therefore, as in the case described above, the problem of adhesion and damage occurs with the adhesive. In addition, the electrodeposition mask is damaged by mechanical action such as pressurization at the time of transfer, and the action may be incomplete, which is a problem.
[0019]
On the other hand, with respect to the wiring pattern, for example, as proposed in Japanese Patent Publication No. 6-101617, a method using a conductive paste and using a technique similar to water transfer in terms of printing, As proposed in Japanese Patent No. 41189, there is a method of transferring what is printed on a rubber plate.
[0020]
In either case, a conductive paste pattern is first formed on a flat surface and then deformed into a curved surface. Although it is not difficult to make a curved surface into a cylindrical shape, it is difficult to make a curved surface into a spherical shape. At that time, the flexibility of the conductive paste is used. For this reason, defects are generated when deformation is large, so that it is difficult to have a large curvature, and there is a problem that the conductivity is considerably lower than that of metal.
[0021]
[Problems to be solved by the invention]
First, there is provided a method for forming a metal pattern on the surface of a curved body instead of a conductive paste. In that case, a method is provided in which a mask pattern does not need to be formed or removed every time, such as plating or etching.
[0022]
Second, since the gap is generated when the shape accuracy between the curved body and the transfer target is desired to form a metal pattern, and normal transfer of the metal pattern cannot be expected, normal transfer can be performed with high shape accuracy. I will provide a.
[0023]
Third, if the metal pattern is simply transferred, it is transferred in a state of protruding on the curved surface, but it may be preferable to be buried in the curved surface as much as possible. For example, a wiring pattern formed on the inner surface of the housing is an example of this. A method for solving this problem is also provided.
[0024]
[Means for Solving the Problems]
Therefore, the present invention A required surface excluding the groove formed on the curved surface of a member having a curved surface similar to a curved body desired to form a metal pattern is covered with a non-conductive material, and the groove not covered with the non-conductive material is plated. To form a plated metal, transfer the plated metal to the surface of the curved body forming mold member via an adhesive, and inject and cure the curved body forming member into the curved body forming space surrounded by the mold member. And transferring the plating metal to the curved surface formed by the injection hardening. Provided is a method for forming a metal pattern on a curved surface.
[0025]
Further, in the metal pattern forming method, the non-conductive material covering the entire required surface including the groove portion is rubbed and developed to remove the non-conductive material in the groove portion, and the metal pattern forming method on the curved body surface I will provide a.
[0026]
Next, The present invention Of the technology we studied An example of a basic process will be described with reference to FIG.
A reverse type (female type) 2 of a required curved surface of the transfer target 1 on which a metal pattern is to be formed is created (FIG. 1A).
[0027]
The required surface of the reverse mold 2 is in a state capable of being plated (conductivity is imparted if electroplating, activation treatment if electroless plating) and an easily peelable surface 3 on which the plated metal can be easily peeled (FIG. 1B).
[0028]
A portion other than the portion corresponding to the desired conductor pattern portion on the easily peelable surface 3 is covered with the plating resist 4 (FIG. 1C).
[0029]
A desired metal is plated on the easily peelable surface 3 to dispose a plated metal 5 (FIG. 1 (d)).
[0030]
The formed plating metal 5 is applied to the surface of the transfer body 1 by applying a transfer adhesive 6 and pressed while being aligned, and the reverse mold 2 and the transfer body 1 are peeled off to place the plating metal 5 on the transfer body 1. Transfer (FIG. 1 (e)).
[0031]
The reverse mold 2 for forming the plated metal 5 is a female mold of the transferred object 1, and the production method thereof is to take a first mold from the transferred object 1 using a mold-taking silicone resin, and subsequently There is a method in which a second mold is taken from the first mold (the shape is the same as that of the transfer object), and a plastic mold is poured into the mold to obtain a female mold. As the plastic for molding, epoxy resin, acrylic resin, and urethane resin can be used.
[0032]
Further, when the reverse mold 2 is formed of a material having rubber elasticity, for example, urethane rubber, nitrile rubber, chloroprene rubber or the like, and the back side thereof is supported by a rigid body, the plated metal 5 shown in FIG. There is an advantage that adhesion is improved when the toner is transferred by being pressed against the surface of the transfer target 1.
[0033]
In addition, when the transfer object is formed using a mother die as in the injection molding method, once the silicone resin die for taking a mold is taken from the mother die, it is the above-mentioned second It corresponds to the mold.
[0034]
Of course, it is also possible to create a female die by machining such as electric discharge machining without taking a mold in this way. In this case, the material can be selected quite freely. For example, if stainless steel is used, the plated metal is easily peeled off even if it is used as it is as a plated metal transfer body.
[0035]
As a method for easily removing the plated metal from the surface of the plastic plated metal transfer member, there is a method of forming a plated metal easily peelable metal layer such as nickel or chromium on the surface by a vacuum deposition method or the like. However, it is not a very suitable method for curved bodies. It is preferable to form by electroless plating. That is, an electroless plating method known as a metal plating method for plastics can be used. Further, chromium or the like may be deposited on the electroless plating layer by electroplating.
[0036]
As a result of various studies on plating mask materials, the present inventors have confirmed that a silicone resin is preferable. Many silicone resins can be used, but a preferred one is an adhesion preventing one used on the inner surface of a bread baking pot. An example of the baking mold is YSR6209 manufactured by Toshiba Silicone. An example of the room temperature drying type is TSR144 manufactured by the same company.
[0037]
Also, a mold-taking one can be used. For example, there are TSE350, TSE3502, XE3508, and TSE3562 made by the company. Further, YE5623, TSE3450, and TSE3466 manufactured by the same company are available as addition polymerization types. A millable type is also preferable. In any case, the selection is made according to physical properties such as hardness, non-adhesiveness to the adhesive, and tear strength.
[0038]
However, we confirmed that the silicone resin is not necessary for the plating part and that it is often inconvenient because it causes uneven plating thickness. did.
[0039]
As a method for forming a desired pattern on the curved surface, there is a method of thermally decomposing and removing the convex curved surface by a beam such as a laser processing method. For example, a member coated with a uniform thickness of silicone resin is attached to a triaxial machining head in which an XYZ stage and a gonio head are combined, irradiated with a beam, and a required portion is removed by thermal decomposition.
On the other hand, for concave curved surfaces with such a curvature that this method cannot be applied (that is, the convex curved surface that finally forms the plating pattern), a desired plating mask pattern is formed on the convex curved surface that is the reverse type, and plating is performed. The plating pattern is first transferred to a temporary concave curved surface, and further transferred to a target convex curved surface.
[0040]
Examples of usable lasers include a carbon dioxide laser, a YAG laser, a ruby laser, a copper ion laser, and an excimer laser.
[0041]
There is also a method of patterning a silicone resin by a so-called lift-off method. This method will be described. First, an electrodeposition type negative photoresist (for example, Sonnene EDUV376 manufactured by Kansai Paint Co., Ltd.) is coated to a predetermined thickness, for example, 20 μm, and dried. Then, the portions other than the wiring pattern are formed by (1) handwriting using black ink, (2) black ink transfer using a hydraulic transfer method, (3) black ink spraying using an ink jet printer, etc. The upper surface is blackened, exposed, and dipped in a predetermined developer to dissolve and remove the portion of the photoresist covered with black ink, leaving only the portion of the photoresist not covered with black ink. Subsequently, a silicone resin primer is sprayed on the entire surface, and a room temperature curable silicone rubber agent is applied and cured at a constant thickness. Finally, the cured photoresist is stripped with a stripping solution to obtain a mold coated with a silicone rubber agent except for the desired electrodeposition pattern.
[0042]
Furthermore, a swelling-peeling development method used for so-called waterless offset plates is also used.
[0043]
On the other hand, as a material of the plated metal transfer body, first, a transfer body itself or a material whose thermal expansion coefficient is almost the same as that of the transfer body is used, and a metal layer or a metal oxide layer as a conductive layer is used thereon. Form. As a method for forming the metal layer, there are vacuum film forming methods such as an electroless plating method, an electroplating method, a metal foil sticking method, and a vacuum deposition method. In addition, since the plated metal can be easily peeled off with the stainless steel as it is, it can be used if it can be formed by a method such as pressing or cutting. Generally, the surface is polished for use. The plated metal is easier to peel off when polished.
[0044]
In addition, the metal oxide layer uses the property that the plating metal can be easily peeled off. Among them, a copper oxide film, a nickel oxide film, a chromium oxide film, a titanium oxide film, a tin oxide film, An indium oxide film, or an oxide film of a mixture or alloy of the above metals is preferred. Examples of the formation method include an anodic oxidation method, a sol-gel method, a thermal oxidation method, and a natural oxidation method. The oxide layer needs to have a thickness that can provide electroconductivity that can be plated. As a resistance value, a sheet resistance of 1 kΩ or less is practical.
[0045]
[ Examples of study technologies ]
An example in which an antenna wiring pattern is formed on the concave side of a curved rear glass of an automobile will be described with reference to FIGS.
[0046]
Usually, the rear glass 11 is made of heat strengthened glass, and is already formed in a predetermined curved surface. However, the shape of the curved surface is slightly different for each glass due to the difference in the heating state in the curved surface forming process.
[0047]
From among a number of rear glasses 11, select the one with the closest curvature, or create it intentionally, and apply a fluorine-based mold release agent 12 to the concave side (sometimes described as the back side). Then, an epoxy resin for mold making was poured between the rear surface of the rear glass 11 and the mold frame 13 and cured to form a mold 14 having a thickness of about 3 mm (FIG. 2A).
[0048]
The epoxy resin mold 14 has some flexibility, and even the rear glass 11 having a slightly different curvature is in close contact with the glass surface when pressed from the back surface.
[0049]
The convex surface side of the mold 14 in contact with the rear glass 11 was washed, and pretreatment (surface roughening, sensitization, activation) of electroless plating was performed. Next, 2 μm of electroless nickel plating 15 was applied. Furthermore, 10 μm of nickel electroplating 16 was applied thereon, and 3 μm of chromium plating 17 was further applied. Further thereon, a primer for silicone resin (ME151 manufactured by Toshiba Silicone) 18 was applied (FIG. 2B).
[0050]
Then, a layer having a thickness of 100 μm was formed on the primer 18 using a room temperature curable silicone resin (TSE3450 manufactured by Toshiba Silicone) as follows.
[0051]
That is, a surfactant is applied to the back surface of the first used rear glass 11 to form a silicone resin release layer 19, and the gap between the silicone resin release layer 19 and the chromium plating 17 of the mold 14 is set to 100 μm. In this gap, a room temperature curable silicone resin added with a predetermined amount of a curing agent (referred to as silicone resin 20) was placed and allowed to cure (FIG. 2 (c)).
[0052]
As a method for accurately maintaining the gap between the silicone resin release layer 19 and the chromium plating 17 of the mold 14 at 100 μm, for example, the mold 14 can be held as shown in FIG. 31 is a cushion and 32 is a height adjusting screw.
[0053]
When the room temperature curable silicone resin 20 was cured and the rear glass 11 and the mold 14 were peeled off, the silicone resin 20 was peeled off while being adhered to the mold 14 (FIG. 2D).
[0054]
A support is set on the inner surface of the mold 14, and the laser processing support is attached to a triaxial rotary head (none of which are shown), and a desired portion of the silicone resin 20 is thermally decomposed using a YAG laser. The residual silica powder was removed by washing with water to form a groove 21 reaching the chromium plating 17. In this way, a plated metal transfer body 22 was obtained in which the chrome plating 17 was exposed on the desired antenna wiring pattern portion and the other portion was covered with the silicone resin 20 (FIG. 2D).
[0055]
Nickel 23 was deposited in a thickness of 50 μm on the groove 21 portion of the plated metal transfer body 22 using a plating bath having the following composition. Next, when the epoxy adhesive 24 was applied to the surface, the silicone resin 20 part was repelled and collected on the nickel 23. After the excess adhesive was wiped off (FIG. 2 (d)), the plating metal transfer body 22 was brought into close contact with the rear glass 11N where the metal pattern was to be formed, while being pressed. After the epoxy adhesive 24 was cured, when the plated metal transfer body 22 was peeled off, the nickel 23 was transferred to the inner surface of the rear glass 11N, and a metal pattern was formed (FIG. 2 (e)).
[0056]
Nickel plating bath Plating conditions
NiSO ₂ ・ 7H ₂ O 240 (g / l) pH 5
NiCl ₂ ・ 6H ₂ O 45 (g / l) Bath temperature 45 ° C
H ₃ BO ₃ 30 (g / l) Current density 4 (A / dm ² )
[0057]
DETAILED DESCRIPTION OF THE INVENTION
Next, the present invention Based on FIG. 4, the wiring pattern by the copper wire was formed inside the ABS resin case 41 of the cellular phone. Depending on the embodiment explain.
[0058]
First, the groove | channel 42 corresponding to a wiring pattern was formed in the required part of the appropriate case 41 using the laser processing method. The width of the groove 42 is the width of the wiring pattern, and the depth is 30 μm deeper than the thickness of the wiring pattern (for example, 30 μm) (FIG. 4A).
[0059]
The entire surface of the case 21 was subjected to oxygen plasma treatment to make the surface hydrophilic. Then, after embedding an acrylic water-absorbing resin 43 in the groove 42, a predetermined amount of a curing agent is added to a room temperature curable silicone resin (TSE3540 manufactured by Toshiba) on the entire surface (hereinafter referred to as a silicone resin 44). Was applied and cured (FIG. 4 (b)). The silicone resin 44 is formed in a desired thickness (for example, about 5 to 30 μm) in the same manner as in FIG.
[0060]
After the silicone resin 44 is cured, it is immersed in a developer for a waterless plate (for example, Toray TAP plate) used for offset printing, and the portion of the silicone resin 44 in which the water absorbent resin 43 is swollen is rubbed and developed. Further, the water-absorbing resin 43 in the groove 42 was removed (FIG. 4C).
[0061]
In order to perform electroless plating on the groove 42, a sensitization treatment with a tin chloride solution and an activation treatment with a solution of palladium chloride were subsequently performed. The silicone resin 44 part repelled the liquid and did not accept these treatments.
[0062]
An electroless nickel plating 45 was applied to the groove 42 with a thickness of 5 μm, and an electroless copper plating 46 was applied thereon with a thickness of 30 μm (FIG. 4D).
[0063]
An epoxy-based adhesive (Ciba Geigy Araldite) 47 was applied thereon. The adhesive 47 was repelled from the portion of the silicone resin 44 and collected on the copper plating 46 and cured. Further, a water-soluble adhesive 48 such as starch paste, which has adhesiveness in an undried state but loses adhesiveness when water is evaporated and dried, is applied to the adhesive 48 on the epoxy adhesive 47. (FIG. 4 (d)), when the semi-dried state is reached, the case 41 is fitted into an injection mold 49 (FIG. 4 (e)), and the adhesive 48 is dried. Then, the metal pattern such as the copper plating 46 was transferred to the pouring die 49 together with the epoxy adhesive 47 etc. thereon (FIG. 4 (f)).
[0064]
Then, the ABS resin 51 for molding the case is poured between the casting molds 49 and 50 (FIG. 4G), and after cooling, the casting molds 49 and 50 are opened and the casing 41N is newly molded with the ABS resin 51. Then, the wiring pattern formed by copper plating 46 or the like in the groove 42 of the case 41 was transferred to the case 41N (FIG. 4 (h)).
[0065]
Since the adhesive 48 is water-soluble, it is removed by washing with water if necessary, and an ABS resin 51 used for molding the case is embedded in the resulting recesses on the surface to form a metal pattern such as a copper plating 46. Can also be coated.
[0066]
In addition, although the adhesive 47 used the epoxy type | system | group in consideration of the adhesiveness with the copper plating 46, another type may be sufficient. Of course, it is also conceivable to use the same type of adhesive as the resin for molding the case 41.
[0067]
Alternatively, the water-soluble adhesive may be applied directly without using the epoxy adhesive 47. In that case, after removing the water-soluble adhesive from the molds 49 and 50, the water-soluble adhesive is washed and removed. It is necessary to embed a resin in the recess.
[0068]
Further, the electroless copper plating 46 can be directly applied to the groove 42, but the plating is more stable when the electroless nickel plating 45 and the electroless copper plating 46 are divided into two portions as shown in the figure. There is an advantage that can be done.
[0069]
【The invention's effect】
As described above, the present invention , Unlike the conventional technology in which a plating mask is formed on the surface of a curved body on which a metal pattern is formed and electroplating or electroless plating is directly applied to the surface of the curved body, the plating mask is formed on a plated metal transfer body. The number of time-consuming processes for forming a plating mask is drastically reduced.
[0070]
That is, in the conventional method, the same number of plating mask production steps as the number of products are required, but only one time is required when forming the plated metal transfer body. Although it depends on the durability of the plated metal transfer body, it can withstand the transfer of about 100 times, so the process of forming the plating mask is reduced to 1/100 or less.
[0071]
Further, in the conventional method, it is necessary to remove the plating mask if it is inconvenient if it remains on the product, but this is not necessary in the method of the present invention.
[0072]
Further, in the conventional method, formation of the metal pattern on the concave curved surface is more difficult than formation of the metal pattern on the convex curved surface. However, since the present invention is a transfer method, the transfer onto the concave curved surface can be performed very easily.
[0073]
In addition, the conventional method requires that the curved body forming the metal pattern be immersed in the plating solution, which causes the problem of contamination of the curved body by the plating solution and conversely, contamination of the plating solution by the curved body. The material of the curved body was limited. However, in the method of the present invention, there is almost no limit to the material of the curved body. In addition, the size of the curved body is large, and when a metal pattern is formed on a part of the curved body, a plating metal transfer body having a required metal pattern can be used, so that the size of the plating bath can be reduced.
[0074]
Further, in the conventional method, the adhesive force between the plated metal and the curved body is not so strong in many cases, but in the method of the present invention, the metal pattern and the curved body are bonded with an adhesive, so that a strong adhesive strength can be obtained.
[0075]
In addition, unlike the conventional metal pattern forming method using a conductive paste, the present invention forms a plated metal in a pattern, so that the electrical resistance is low and it is resistant to wear. Suitable.
[0076]
Furthermore, the metal pattern formed on the surface of the curved body can be easily embedded.
[Brief description of the drawings]
[Figure 1] Study technology It is explanatory drawing which shows an example of the basic process of.
[Figure 2] Examples of study technologies It is explanatory drawing which shows.
[Fig. 3] Examples of study technologies It is explanatory drawing which shows 1 process.
[Fig. 4] The present invention It is explanatory drawing which shows this embodiment.
FIG. 5 is an explanatory diagram showing a conventional technique.
[Explanation of symbols]
1 Transferee
2 Reverse type
3 Easy peelable surface
4 resists
5 plated metal
6 Transfer adhesive
11, 11N rear glass
12 Release agent
13 Formwork
Type 14
15 Electroless nickel plating
16 Nickel electroplating
17 Chrome plating
18 Primer
19 Silicone resin release layer
20 Silicone resin
21 groove
22 Plated metal transfer body
23 Nickel
24 Epoxy adhesive
31 cushion
32 Height adjustment screw
41, 41N case
42 groove
43 Water-absorbing resin
44 Silicone resin
45 Electroless nickel plating
46 Electroless copper plating
47 Epoxy adhesive
48 (Water-soluble) adhesive
49, 50 Injection type
51 ABS resin

Claims (2)

A required surface excluding the groove formed on the curved surface of a member having a curved surface similar to a curved body desired to form a metal pattern is covered with a non-conductive material, and the groove not covered with the non-conductive material is plated. To form a plated metal, transfer the plated metal to the surface of the curved body forming mold member via an adhesive, and inject and cure the curved body forming member into the curved body forming space surrounded by the mold member. And forming a metal pattern on the surface of the curved surface , wherein the plating metal is transferred to the curved surface formed by injection hardening . 2. The method for forming a metal pattern on the surface of a curved body according to claim 1, wherein the nonconductive material covering the entire surface including the groove is rubbed and developed to remove the nonconductive material in the groove .

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