JPH01139791A - Production of metal sticker - Google Patents
Production of metal stickerInfo
- Publication number
- JPH01139791A JPH01139791A JP29821187A JP29821187A JPH01139791A JP H01139791 A JPH01139791 A JP H01139791A JP 29821187 A JP29821187 A JP 29821187A JP 29821187 A JP29821187 A JP 29821187A JP H01139791 A JPH01139791 A JP H01139791A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- metal plate
- conductive
- decorative
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 64
- 239000002184 metal Substances 0.000 title claims abstract description 64
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 229920005989 resin Polymers 0.000 claims abstract description 29
- 239000011347 resin Substances 0.000 claims abstract description 29
- 239000002313 adhesive film Substances 0.000 claims abstract description 16
- 238000004070 electrodeposition Methods 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims description 18
- 238000005323 electroforming Methods 0.000 claims description 14
- 229920003002 synthetic resin Polymers 0.000 claims description 4
- 239000000057 synthetic resin Substances 0.000 claims description 4
- 239000002904 solvent Substances 0.000 claims description 2
- 239000002932 luster Substances 0.000 abstract description 6
- 239000011247 coating layer Substances 0.000 abstract 6
- 239000010410 layer Substances 0.000 abstract 6
- 230000000694 effects Effects 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000008151 electrolyte solution Substances 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000000839 emulsion Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005282 brightening Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000002659 electrodeposit Substances 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000007602 hot air drying Methods 0.000 description 1
- 239000003350 kerosene Substances 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明は金属材料よりなる薄板状のメタルステッカ−
の製造方法に関するものである。[Detailed Description of the Invention] (Industrial Application Field) This invention provides a thin metal sticker made of a metal material.
The present invention relates to a manufacturing method.
（従来の技術）
従来、この種の製造方法として、特開昭６１−２０９７
９号公報において開示されたものが知られている。(Prior art) Conventionally, as this type of manufacturing method, Japanese Patent Application Laid-Open No. 61-2097
The one disclosed in Publication No. 9 is known.
この製造方法を説明すると、第１１図（ａ）に示すよう
に、まず導電性金属板ｌの表面に樹脂層２を形成し、そ
の樹脂層２に所定のパターンを有する凹部２ａを形成し
て同凹部２ａ内にて金属板１を露出させた後、その露出
部分に剥離用被膜５を形成する。To explain this manufacturing method, as shown in FIG. 11(a), first a resin layer 2 is formed on the surface of a conductive metal plate l, and recesses 2a having a predetermined pattern are formed in the resin layer 2. After exposing the metal plate 1 in the recess 2a, a peeling film 5 is formed on the exposed portion.
次に、第１１図（ｂ）に示すように、樹脂層２を形成し
た金属板１を所定の電解？ＦＬＴ中に浸漬して金属板１
の露出部分の剥離層５上に対して電鋳によって電着層９
を形成する。Next, as shown in FIG. 11(b), the metal plate 1 with the resin layer 2 formed thereon is subjected to a predetermined electrolytic treatment. Metal plate 1 immersed in FLT
An electrodeposited layer 9 is formed by electroforming on the exposed portion of the release layer 5.
form.
続いて、第１１図（Ｃ）に示すように、電着層９を形成
した金属板１の電鋳面側に対して粘着フィルム１０を貼
着した後、第１１図（ｄ）に示すようにこれを電着層９
と共に金属板１から剥離してメタルステッカ−を構成す
る装飾片１１を形成する。Subsequently, as shown in FIG. 11(C), an adhesive film 10 is attached to the electroformed surface side of the metal plate 1 on which the electrodeposited layer 9 has been formed, and then as shown in FIG. 11(d), Electrodeposit layer 9
At the same time, a decorative piece 11 is peeled off from the metal plate 1 to form a metal sticker.
最後に、第１２図に示すように、装飾片１１を粘着フィ
ルムＩＯと共に離型紙１３に貼着して、メタルステッカ
−の製品を完成する。Finally, as shown in FIG. 12, the decorative piece 11 is attached to the release paper 13 together with the adhesive film IO to complete the metal sticker product.
そして、上記のような製造方法を適用することにより、
メタルステッカ−を構成する細かい線模様等の装飾片１
１を正確に形成することができると共に、分離した模様
の装飾片１１を所望の状態で正確に配置することができ
、よってこれまでにない画期的なメタルステッカ−の製
造を可能にしていた。Then, by applying the manufacturing method described above,
Decorative pieces such as fine line patterns that make up the metal sticker 1
1 can be formed accurately, and the separated patterned decorative pieces 11 can be placed accurately in the desired state, thus making it possible to manufacture an unprecedented metal sticker. .
（発明が解決しようとする問題点）
しかしながら、従前の製造方法では、第１１図（ｂ）に
示すように、電着Ｎ９の表面９ａが樹脂層２の表面２ｂ
と面一になるように形成されていたので、その電着層９
の表面９ａの縁部９ｂが角状に尖ることになる。従って
、その電着層９から装飾片１１を形成し、同装飾片１１
を所望の被貼着面に貼着した場合に、装飾片１１の表面
１１ａに引っ掛かりが生じて肌触りが良くなかった。更
に、装飾片１１の表面１１ａが単に平面的になるだけな
ので、光の乱反射が少なく、立体感のある金属光沢が少
なかった。(Problems to be Solved by the Invention) However, in the conventional manufacturing method, as shown in FIG. 11(b), the surface 9a of the electrodeposited N9 is
Since the electrodeposited layer 9 was formed flush with the
The edge 9b of the surface 9a is sharpened into an angular shape. Therefore, a decorative piece 11 is formed from the electrodeposited layer 9, and the decorative piece 11
When the decorative piece 11 was attached to a desired surface, the surface 11a of the decorative piece 11 got caught and did not feel good to the touch. Furthermore, since the surface 11a of the decorative piece 11 was simply flat, there was less diffuse reflection of light and less three-dimensional metallic luster.
第１１図（ｄ）に示すように、電着層９の剥離工程の際
に、樹脂層２の凹部２ａから電着層９を引き出すことに
なり、余分な剥離抵抗が生じて電着層９の剥離を円滑に
行うことができないという虞れがあった。As shown in FIG. 11(d), during the peeling process of the electrodeposition layer 9, the electrodeposition layer 9 is pulled out from the recess 2a of the resin layer 2, and extra peeling resistance is generated, causing the electrodeposition layer 9 to There was a fear that the peeling could not be performed smoothly.
（発明の目的）
この発明は前述した事情に鑑みてなされたものであって
、装飾片の表面の肌触りを良くすることが可能であると
共に、立体感ある金属光沢を増大することが可能で、更
には電着層の剥離工程を円滑に行い得るメタルステッカ
−の製造方法の提供を目的としいる。(Object of the Invention) This invention was made in view of the above-mentioned circumstances, and it is possible to improve the texture of the surface of a decorative piece, and also to increase the three-dimensional metallic luster. A further object of the present invention is to provide a method for manufacturing a metal sticker that allows the process of peeling off the electrodeposited layer to be carried out smoothly.
（問題点を解決するための手段）
上記の目的を達成するために、この発明においては、導
電性金属板上に非導電層を部分的に形成して同金属板の
一部を所定の装飾パターンで露出させる工程と、この装
飾パターン形成工程の後に導電性金属板の露出部分に電
鋳により電着層を非４′電層よりも外方へ盛り上がるよ
うに形成する工程と、この電鋳工程の後に非導電層を除
去する工程と、この非導電層除去工程の後に導電性金属
板の電鋳面側に対して粘着フィルムを貼着し、これを電
着層と共に導電性金属板から剥離して装飾片を形成する
工程と、この剥離工程の後に装飾片を粘着フィルムと共
に離型紙に貼着する工程とからなる構成を採用している
。(Means for Solving the Problems) In order to achieve the above object, in the present invention, a non-conductive layer is partially formed on a conductive metal plate, and a part of the metal plate is decorated with a predetermined decoration. a step of exposing the conductive metal plate in a pattern, a step of forming an electrodeposited layer on the exposed portion of the conductive metal plate by electroforming after the decorative pattern forming step so as to bulge outward from the non-4' electrode layer, and this electroforming. After the process, there is a step of removing the non-conductive layer, and after this non-conductive layer removal step, an adhesive film is attached to the electroformed surface side of the conductive metal plate, and this is removed from the conductive metal plate together with the electrodeposited layer. A configuration is adopted that consists of a step of peeling off to form a decorative piece, and a step of pasting the decorative piece together with an adhesive film on a release paper after this peeling step.
（作用）
従って、導電性金属板上の露出部分に電着層を非導電性
層よりも外方へ盛り上がるように形成することにより、
その電着層の少なくとも側縁が丸みを帯びて形成される
。(Function) Therefore, by forming the electrodeposited layer on the exposed portion of the conductive metal plate so as to swell outward from the non-conductive layer,
At least the side edges of the electrodeposited layer are rounded.
又、電着層の剥離工程の際に、その剥離抵抗が低減され
る。Furthermore, the peeling resistance during the peeling process of the electrodeposited layer is reduced.
（実施例）
以下、この発明を具体化した一実施例を第１図〜第１０
図に基いて詳細に説明する。(Example) Hereinafter, an example embodying this invention will be shown in Figs. 1 to 10.
This will be explained in detail based on the figures.
第１図（ｃ）に示すように、銅板、ステンレス板等より
なる導電性金属板１上には、同金属板１の一部を所定の
装飾パターン４（第２図参照）で露出させた凹部２ａを
有する非導電層としての樹脂層２が形成されている。As shown in FIG. 1(c), on a conductive metal plate 1 made of a copper plate, a stainless steel plate, etc., a part of the metal plate 1 is exposed in a predetermined decorative pattern 4 (see FIG. 2). A resin layer 2 as a non-conductive layer is formed having recesses 2a.
この装飾パターン４の凹部２ａを形成する工程を説明す
ると、まず金属板１上に感光性を存する液状の合成樹脂
材を塗布乾燥して、第１図（ａ）に示すように金属板１
上全体に樹脂層２を形成する。To explain the process of forming the recesses 2a of this decorative pattern 4, first, a photosensitive liquid synthetic resin material is applied and dried on the metal plate 1, and as shown in FIG.
A resin layer 2 is formed on the entire top.
次に、第１図（ｂ）に示すように、樹脂層ｚ上に白黒写
真用のポジフィルム３を載置する。第２図に示すように
、この場合のポジフィルム３は、予め装飾パターン４を
１最影した後に現像されたものである。Next, as shown in FIG. 1(b), a positive film 3 for black and white photography is placed on the resin layer z. As shown in FIG. 2, the positive film 3 in this case was developed after the decorative pattern 4 was first shaded in advance.
樹脂層２上にポジフィルム３を載置した後、同フィルム
３に対して上方からアーク灯、水銀灯等の強い光を照射
して露光処理を行う。この露光処理において、アーク灯
等から発射された光はポジフィルム３の透明部分（乳剤
が定着した部分）３ａを透過して樹脂層２に達し、不透
明部分（乳剤が洗い流された部分）３ｂでは遮断されて
樹脂層２に達することはない。このため、樹脂層２には
、ポジフィルム３の透明部分３ａ及び不透明部分３ｂに
対応して、感光部分及び未感光部分が形成される。After placing the positive film 3 on the resin layer 2, the film 3 is exposed to strong light such as an arc lamp or a mercury lamp from above. In this exposure process, light emitted from an arc lamp or the like passes through the transparent part (the part where the emulsion is fixed) 3a of the positive film 3 and reaches the resin layer 2, and the light emitted from the opaque part (the part where the emulsion has been washed away) 3b. It will not be blocked and will not reach the resin layer 2. Therefore, in the resin layer 2, exposed areas and unexposed areas are formed corresponding to the transparent areas 3a and opaque areas 3b of the positive film 3.
この後、樹脂層２からポジフィルム３を取り除き、樹脂
層２を白灯油、トリクロルチレン等の溶剤により処理し
て樹脂層２の未感光部分のみを溶解除去する。この結果
、ポジフィルム３の装飾パターン４の形状に対応して第
１図（Ｃ）及び第３図に示すように、樹脂層２に凹部２
ａが形成され、その凹部２ａ内にて金属板１の一部が露
出される。Thereafter, the positive film 3 is removed from the resin layer 2, and the resin layer 2 is treated with a solvent such as white kerosene or trichlorotyrene to dissolve and remove only the unexposed portion of the resin layer 2. As a result, a recess 2 is formed in the resin layer 2 as shown in FIGS.
A is formed, and a part of the metal plate 1 is exposed within the recess 2a.
次に、上記のように樹脂層２の凹部２ａにより装飾パタ
ーン４を形成した金属板ｌをクロム酸の２％溶液内に所
定時間浸漬した後、それを水洗いする。これにより、第
４図に示すように、樹脂層２の凹部２ａ内に露出する金
属板ｌ上に薄いクロムの剥離用被膜５が定着した状態に
なる。この被膜形成工程は後述する電鋳処理にて金属板
１上に形成される電着層９の剥離を容易にするために行
うものである。Next, the metal plate 1 on which the decorative pattern 4 is formed by the concave portions 2a of the resin layer 2 as described above is immersed in a 2% chromic acid solution for a predetermined period of time, and then washed with water. As a result, as shown in FIG. 4, the thin chromium peeling film 5 is fixed on the metal plate l exposed in the recess 2a of the resin layer 2. This film forming step is performed to facilitate peeling off of the electrodeposited layer 9 formed on the metal plate 1 in the electroforming process described later.
金属板１の露出部分に剥離用被膜５を形成した後、次に
電鋳工程に移る。After forming the peeling film 5 on the exposed portion of the metal plate 1, the next step is an electroforming process.
即ち、第５図（ａ）に示すように、樹脂層２を有する金
属板１を電解液槽６内の電解液７中にて電鋳処理する。That is, as shown in FIG. 5(a), the metal plate 1 having the resin layer 2 is electroformed in an electrolytic solution 7 in an electrolytic solution tank 6. As shown in FIG.
電解液７は硫酸銅（２４０ｇ／ｅ）、硫酸（９０ｇ／ｆ
ｆ１） ＆び光沢剤（この場合、奥野製薬社製のカパラ
シド２１Ｏ）の混合液である。そして、その電解液７中
に浸漬した銅よりなる電鋳材料８と金属板１との間に電
流（この場合、電流密度ＩＡ／ｄｍ２）を流す。尚、金
属板１の樹脂層２の形成面の反対側に露出する金属板１
の他側面は、予めラッカー等が塗布されて非電着性を帯
びている。Electrolyte 7 contains copper sulfate (240g/e), sulfuric acid (90g/f
f1) A mixed solution of a brightening agent (in this case, Caparacid 21O manufactured by Okuno Pharmaceutical Co., Ltd.). Then, a current (current density IA/dm2 in this case) is passed between the electroformed material 8 made of copper immersed in the electrolytic solution 7 and the metal plate 1. Note that the metal plate 1 exposed on the opposite side of the surface of the metal plate 1 on which the resin layer 2 is formed
The other side is coated with lacquer or the like in advance to make it non-electrodepositable.
この結果、第５図（ｂ）に示すように、金属板１上の樹
脂層２の凹部２ａ内にて銅よりなる電着層９が付着形成
される。この時、電鋳処理時間を調節することにより、
電着層９を樹脂層２よりも外方へ盛り上がるように形成
すると、その電着層９の表面９ａ側の少なくとも縁部９
ｂが丸みを帯びて成長することになる。As a result, as shown in FIG. 5(b), an electrodeposited layer 9 made of copper is deposited within the recess 2a of the resin layer 2 on the metal plate 1. At this time, by adjusting the electroforming treatment time,
When the electrodeposition layer 9 is formed so as to bulge outward from the resin layer 2, at least the edge 9 on the surface 9a side of the electrodeposition layer 9
b will grow rounded.
次に、金属板１上に電着層９が形成されたことを確認し
た後、第６図に示すように金属板１を電解液１！６から
取り出し、その後に金属板１上の樹脂層２を有機溶剤に
より溶解除去する。これにより、第７図に示すように、
金属板１上には被膜５及び電着層９のみが残ることにな
る。そして、金属板１から樹脂層２を除去した後、温風
乾燥により金属板１及び電着層９等を完全に乾燥させる
。Next, after confirming that the electrodeposited layer 9 has been formed on the metal plate 1, the metal plate 1 is taken out from the electrolytic solution 1!6 as shown in FIG. 2 is dissolved and removed using an organic solvent. As a result, as shown in Fig. 7,
Only the coating 5 and the electrodeposited layer 9 remain on the metal plate 1. After removing the resin layer 2 from the metal plate 1, the metal plate 1, electrodeposition layer 9, etc. are completely dried by hot air drying.
金属板１及び電着層９等の乾燥が完了した後、次に電着
層９の剥離工程に移る。After the drying of the metal plate 1, electrodeposited layer 9, etc. is completed, the next step is to peel off the electrodeposited layer 9.
即ち、第８図に示すように、金属板１の電鋳面に半透明
な合成樹脂製の粘着フィルム１０を一旦貼着した後、第
９図に示すように、粘着フィルム１０を電着層９と共に
金属板１から剥離する。この際、金属板ｌ上の電着層９
は単に剥離用被膜５上に付着しているのみであり、被膜
５との間の剥離抵抗以外の余分な剥離抵抗が作用するこ
とはなく、剥離抵抗を低減して電着層９を金属板１から
円滑に剥離することができる。しかも、電着層９は剥離
用被膜５の作用と相俟って金属板ｌから容易に剥離する
ことができる。That is, as shown in FIG. 8, a translucent synthetic resin adhesive film 10 is once attached to the electroformed surface of the metal plate 1, and then, as shown in FIG. 9 is peeled off from the metal plate 1. At this time, the electrodeposited layer 9 on the metal plate l
is simply attached to the peeling film 5, and no extra peeling resistance other than the peeling resistance between the peeling film 5 and the peeling resistance is reduced, and the electrodeposited layer 9 is removed from the metal plate. 1 can be peeled off smoothly. Moreover, the electrodeposited layer 9 can be easily peeled off from the metal plate 1 in combination with the action of the peeling film 5.
この結果、装飾パターン４に対応する状態で装飾片１１
を粘着フィルム１０に付着させて得ることができる。特
に、金属板ｌ上において複数の電着層９が互いに分離し
た状態で形成されているような場合でも、電着層９を粘
着フィルム１０に貼着させて移すので、各電着層９の配
置関係を崩すことがなく、よって所望の配置状態で装飾
片１１を得ることができる。又、この装飾片ＩＩの表面
１１ａの少なくとも縁部１１ｂは丸みを帯びている。As a result, the decorative piece 11 is in a state corresponding to the decorative pattern 4.
can be obtained by attaching it to the adhesive film 10. In particular, even if a plurality of electrodeposited layers 9 are formed on the metal plate l in a state where they are separated from each other, since the electrodeposited layers 9 are attached to the adhesive film 10 and transferred, each electrodeposited layer 9 can be separated from each other. The decorative pieces 11 can be obtained in a desired arrangement without disrupting the arrangement. Moreover, at least the edge 11b of the surface 11a of this decorative piece II is rounded.
粘着フィルム１０を金属板１から剥離した後、第１０図
に示すように、装飾片１１の裏面に所定の粘着剤１２を
塗布し、装飾片１１を粘着フィルム１０と共に離型紙１
３の表面に貼着する。この離型紙１３の表面には、蝋引
き処理又はシリコン処理が施されており、後で装飾片１
１及び粘着フィルム１０から剥がし易くなっている。After peeling off the adhesive film 10 from the metal plate 1, as shown in FIG.
Paste it on the surface of 3. The surface of this release paper 13 is waxed or siliconized, and later decorated with decorative pieces 1.
1 and the adhesive film 10.
従って、装飾片１１を所望の被貼着面に貼着してステッ
カ−として使用する場合には、離型紙１３から粘着フィ
ルム１０を装飾片１１と共にに剥がし、装飾片１１の粘
着剤１２の塗布面側を被貼着面に貼着する。そして、そ
の後に粘着フィルム１０のみを被貼着面から剥がせばよ
い。Therefore, when using the decorative piece 11 as a sticker by pasting it on a desired surface, the adhesive film 10 is peeled off from the release paper 13 together with the decorative piece 11, and the adhesive 12 of the decorative piece 11 is applied. Attach the surface side to the target surface. Then, only the adhesive film 10 may be peeled off from the surface to be adhered.
上記のようにこの実施例では、電鋳工程を採用している
ので、微細な線を有するデザインの装飾片１１でも正確
に形成することができる。As described above, since the electroforming process is adopted in this embodiment, even the decorative piece 11 having a design having fine lines can be accurately formed.
しかも電鋳工程の際に、電着１ｉ９を樹脂層２よりも外
方へ盛り上がるように形成し、その電着層９の表面９ａ
の少なくとも縁部９ｂに丸みを設けているので、電着層
９から得られる装飾片１１の表面１１ａに触った場合に
、肌に引っ掛かる感じがなく、肌触りを良くすることが
できる。Moreover, during the electroforming process, the electrodeposited layer 1i9 is formed so as to bulge outward from the resin layer 2, and the surface 9a of the electrodeposited layer 9 is
Since at least the edge 9b of the decorative piece 11 is rounded, when the surface 11a of the decorative piece 11 obtained from the electrodeposited layer 9 is touched, it does not feel like it gets caught on the skin, and the touch can be improved.
又、装飾片１１の表面１１ａの少なくとも縁部１１ｂが
丸みを帯びているので、そこに当たる光が乱反射し、金
属光沢のある立体感を出すことができる。特に、微細線
な線よりなる複数の装飾片１１が互いに隣接している場
合には、各装飾片１１における光の乱反射が相互に干渉
したり、各装飾片１１で反射した光の一部が他の装飾片
１１で再び反射されたりして、立体感のある金属光沢を
増大することができる。この結果、装飾片１１よりなる
メタルステッカ−に新鮮で豪華な印象を与えることがで
きる。Furthermore, since at least the edge 11b of the surface 11a of the decorative piece 11 is rounded, light hitting the edge 11b is diffusely reflected, creating a three-dimensional effect with metallic luster. In particular, when a plurality of decorative pieces 11 made of fine lines are adjacent to each other, the diffuse reflection of light on each decorative piece 11 may interfere with each other, or a portion of the light reflected from each decorative piece 11 may By being reflected again by other decorative pieces 11, it is possible to increase the metallic luster with a three-dimensional effect. As a result, a fresh and luxurious impression can be given to the metal sticker made of the decorative piece 11.
尚、この発明は前記実施例に限定されるものではなく、
例えば非導１ｔＮとして合成樹脂以外の非導電性材料を
適用したり、装飾片１１の色や高級感等を変えるために
、電鋳工程の際に銅の電着層９を形成した後、電着層９
上に電気鍍金によりニッケル層を形成したり、更にその
上に純金層又はブラッククロム層を形成したりする等、
発明の趣旨を逸脱しない範囲において構成の一部を適宜
に変更して実施することもできる。Note that this invention is not limited to the above embodiments,
For example, in order to apply a non-conductive material other than synthetic resin as the non-conductive 1 tN, or to change the color or luxurious feel of the decorative piece 11, after forming the copper electrodeposition layer 9 during the electroforming process, Layer 9
Forming a nickel layer on top by electroplating, and further forming a pure gold layer or black chromium layer on top of it, etc.
It is also possible to modify a part of the configuration as appropriate without departing from the spirit of the invention.
（発明の効果）
以上詳述したようにこの発明によれば、装飾片の表面の
肌触りを良くすることができると共に立体感のある金属
光沢を増大することができ、更には電着層の剥離工程を
少ない剥離抵抗で円滑に行うことができるという優れた
効果を発揮する。(Effects of the Invention) As detailed above, according to the present invention, it is possible to improve the texture of the surface of the decorative piece, increase the metallic luster with a three-dimensional effect, and furthermore, the peeling of the electrodeposited layer can be improved. It has the excellent effect of allowing processes to be carried out smoothly with little peeling resistance.
第１図〜第１０図はこの発明を具体化した一実施例を示
す図面であって、第１図（ａ）〜第１図（ｃ）は装飾パ
ターン形成工程を説明する断面図、第２図は装飾パター
ンを形成するためのポジフィルムを示す平面図、第３図
は装飾パターンを形成した状態を示す要部拡大断面図、
第４図は剥離用被膜を形成した状態を示す要部拡大断面
図、第５図（ａ）は電鋳の状態を示す説明図、第５図（
ｂ）は同じく要部拡大断面図、第６図は電鋳工程後の要
部拡大断面図、第７図は樹脂層を除去した状態を示す要
部拡大断面図、第８図は剥離工程における粘着フィルム
を貼着した状態を示す要部拡大断面図、第９図は同じく
剥離工程において電着層を剥離して装飾片を形成すると
ころを示す要部拡大断面図、第１０図は装飾片の裏面に
離型紙を貼着した状態を示す要部拡大断面図である。第
１１図（ａ）〜第１１図（ｄ）は従来例の製造方法の各
工程を示す要部拡大断面図、第１２図は同じ〈従来例の
完成したステッカ−の断面図である。
１・・・金属板、２・・・非導電層としての樹脂層、２
ａ・・・凹部、３・・・ポジフィルム、９・・・電着層
、１０・・・粘着フィルム、１１・・・装飾片、１３・
・・離型紙。1 to 10 are drawings showing one embodiment embodying the present invention, and FIGS. 1(a) to 1(c) are sectional views explaining the decorative pattern forming process, and FIG. The figure is a plan view showing a positive film for forming a decorative pattern, FIG.
Fig. 4 is an enlarged sectional view of the main part showing the state in which the peeling film is formed, Fig. 5(a) is an explanatory view showing the state of electroforming, and Fig. 5(a) is an explanatory diagram showing the state of electroforming.
b) is an enlarged sectional view of the main part, FIG. 6 is an enlarged sectional view of the main part after the electroforming process, FIG. 7 is an enlarged sectional view of the main part after the resin layer has been removed, and FIG. FIG. 9 is an enlarged cross-sectional view of the main part showing the adhesive film attached, FIG. 9 is an enlarged cross-sectional view of the main part showing how the electrodeposited layer is peeled off in the peeling process to form a decorative piece, and FIG. 10 is the decorative piece. FIG. 2 is an enlarged cross-sectional view of a main part showing a state in which a release paper is attached to the back surface of the holder. FIGS. 11(a) to 11(d) are enlarged sectional views of essential parts showing each step of the conventional manufacturing method, and FIG. 12 is a sectional view of the same completed sticker of the conventional example. DESCRIPTION OF SYMBOLS 1... Metal plate, 2... Resin layer as a non-conductive layer, 2
a... Concavity, 3... Positive film, 9... Electrodeposition layer, 10... Adhesive film, 11... Decorative piece, 13...
・Release paper.
Claims (1)
形成して同金属板（１）の一部を所定の装飾パターン（
４）で露出させる工程と、この装飾パターン（４）形成
工程の後に前記導電性金属板（１）の露出部分に電鋳に
より電着層（９）を前記非導電層（２）よりも外方へ盛
り上がるように形成する工程と、この電鋳工程の後に前
記非導電層（２）を除去する工程と、この非導電層（２
）除去工程の後に前記導電性金属板（１）の電鋳面側に
対して粘着フィルム（１０）を貼着し、これを前記電着
層（９）と共に導電性金属板（１）から剥離して装飾片
（１１）を形成する工程と、この剥離工程の後に前記装
飾片（１１）を粘着フィルム（１０）と共に離型紙（１
３）に貼着する工程とからなることを特徴とするメタル
ステッカーの製造方法。 ２ 前記装飾パターン形成工程は導電性金属板（１）上
に感光性合成樹脂よりなる樹脂層（２）を形成し、同樹
脂層（２）上に白黒写真用のポジフィルム（３）を載置
した上で露光し、前記ポジフィルム（３）を離間した後
に樹脂層（２）を溶剤処理して所定のパターンの凹部（
２ａ）を形成し、その凹部（２ａ）内にて導電性金属板
（１）を露出させたものである特許請求の範囲第１項に
記載のメタルステッカーの製造方法。[Claims] 1. A non-conductive layer (2) is partially formed on a conductive metal plate (1), and a part of the metal plate (1) is patterned with a predetermined decorative pattern (
After the exposing step (4) and the decorative pattern (4) forming step, an electrodeposited layer (9) is formed on the exposed portion of the conductive metal plate (1) by electroforming to an area outside the non-conductive layer (2). a step of forming the non-conductive layer (2) so as to bulge in the direction; a step of removing the non-conductive layer (2) after this electroforming process; and a step of removing the non-conductive layer (2).
) After the removal step, an adhesive film (10) is attached to the electroformed surface side of the conductive metal plate (1), and this is peeled off from the conductive metal plate (1) together with the electrodeposition layer (9). to form a decorative piece (11), and after this peeling process, the decorative piece (11) is attached to a release paper (11) together with an adhesive film (10).
3) A method for producing a metal sticker, comprising the steps of: 2 In the decorative pattern forming step, a resin layer (2) made of photosensitive synthetic resin is formed on the conductive metal plate (1), and a positive film (3) for black and white photography is placed on the resin layer (2). After the positive film (3) is separated, the resin layer (2) is treated with a solvent to form a predetermined pattern of recesses (
2a), and the conductive metal plate (1) is exposed within the recess (2a).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29821187A JPH01139791A (en) | 1987-11-26 | 1987-11-26 | Production of metal sticker |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29821187A JPH01139791A (en) | 1987-11-26 | 1987-11-26 | Production of metal sticker |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01139791A true JPH01139791A (en) | 1989-06-01 |
| JPH0588320B2 JPH0588320B2 (en) | 1993-12-21 |
Family
ID=17856655
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29821187A Granted JPH01139791A (en) | 1987-11-26 | 1987-11-26 | Production of metal sticker |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01139791A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002356793A (en) * | 2001-05-30 | 2002-12-13 | Kyushu Hitachi Maxell Ltd | Electrocasting metal and method of manufacturing for the same |
| KR100438321B1 (en) * | 2001-09-28 | 2004-07-01 | 김영준 | Manufacturing method of metallic sticker |
| JP2005290429A (en) * | 2004-03-31 | 2005-10-20 | Seiko Instruments Inc | Method for producing electroformed component using low melting point metal |
| KR100869289B1 (en) * | 2007-05-16 | 2008-11-19 | 김원철 | Manufacturing method of metal sticker |
| JP2009223010A (en) * | 2008-03-17 | 2009-10-01 | Murata Mfg Co Ltd | Metal plate for wire grid, self-supported wire grid, and method of manufacturing metal plate for wire grid |
| WO2010079968A3 (en) * | 2009-01-07 | 2010-11-04 | Kim Young Jun | Metal sticker and manufacturing method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5137821A (en) * | 1974-09-28 | 1976-03-30 | Kubota Ltd | Chuzoyo shoshitsuseimokeizairyo |
| JPS5916989A (en) * | 1982-07-16 | 1984-01-28 | Oudenshiya:Kk | Preparation of separate character by electrotyping |
| JPS6120979A (en) * | 1984-07-10 | 1986-01-29 | 華陽技研工業株式会社 | Manufacture of sticker |
-
1987
- 1987-11-26 JP JP29821187A patent/JPH01139791A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5137821A (en) * | 1974-09-28 | 1976-03-30 | Kubota Ltd | Chuzoyo shoshitsuseimokeizairyo |
| JPS5916989A (en) * | 1982-07-16 | 1984-01-28 | Oudenshiya:Kk | Preparation of separate character by electrotyping |
| JPS6120979A (en) * | 1984-07-10 | 1986-01-29 | 華陽技研工業株式会社 | Manufacture of sticker |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002356793A (en) * | 2001-05-30 | 2002-12-13 | Kyushu Hitachi Maxell Ltd | Electrocasting metal and method of manufacturing for the same |
| KR100438321B1 (en) * | 2001-09-28 | 2004-07-01 | 김영준 | Manufacturing method of metallic sticker |
| JP2005290429A (en) * | 2004-03-31 | 2005-10-20 | Seiko Instruments Inc | Method for producing electroformed component using low melting point metal |
| JP4530262B2 (en) * | 2004-03-31 | 2010-08-25 | セイコーインスツル株式会社 | Manufacturing method of electroformed parts using low melting point metal |
| KR100869289B1 (en) * | 2007-05-16 | 2008-11-19 | 김원철 | Manufacturing method of metal sticker |
| JP2009223010A (en) * | 2008-03-17 | 2009-10-01 | Murata Mfg Co Ltd | Metal plate for wire grid, self-supported wire grid, and method of manufacturing metal plate for wire grid |
| WO2010079968A3 (en) * | 2009-01-07 | 2010-11-04 | Kim Young Jun | Metal sticker and manufacturing method thereof |
| KR101108093B1 (en) * | 2009-01-07 | 2012-01-31 | 김영준 | Metal sticker and manufacturing method of the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0588320B2 (en) | 1993-12-21 |
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