JP3834829B2 - Embossed film production master and method for producing the same - Google Patents

Description

[0001]
[Industrial application fields]
An embossed shaped film is used when producing a decorative board having a concavo-convex pattern on the surface. The present invention relates to an original plate for producing the embossed shaped film and a method for producing the same.
[0002]
[Prior art]
Conventionally, an embossed shaping film used for producing a decorative board having a concavo-convex pattern on the surface has been made by press-molding mainly using a metal plate produced by using a photoresist etching method as an original plate.
However, in this method, since the embossed portion is formed by one etching, if the etching is performed too deeply, the influence of the side etching is large, and the desired embossed shape cannot be obtained, so that the embossing is shallow.
Also, a method of etching in two stages has been devised, but it is difficult to align the resist with respect to the second etching, and the finish is not constant.
[0003]
[Problems to be solved by the invention]
The present invention has been made in order to solve the above-described problems, and an object of the present invention is to provide an embossed plate that can minimize the influence of side etching and can provide an embossed plate that is deeper than before. The present invention relates to a master for producing a shaped film and a method for producing the same.
[0004]
[Means for Solving the Problems]
In order to achieve the above object in the present invention, first, in the first invention, a resist layer (30) is formed on a metal plate (10) such as iron or copper, and the pattern (42) is exposed and developed. After forming a resist (32) and etching to form an etching groove (16), an electrodeposition resist (64) is formed along the etching groove (16) by an electrodeposition method, and the resist (32) is removed. Then, the embossing is characterized in that the non-etched portion (18) exposed by removing the resist (32) is subjected to electrolytic plating to form a metal plating layer (20), and the electrodeposition resist (64) is removed. This is a method for producing an original plate for producing a moldable film.
[0005]
In the second invention, a resist (32) is formed on a metal plate (10) such as iron or copper by a solvent-type resist and etched to form an etching groove (16), and then the etching groove is formed by electrodeposition. The electrodeposition resist (64) is formed along (16), the resist (32) is removed with trichloroethane, and the non-etched portion (18) exposed by removing the resist (32) is subjected to electrolytic plating to form a metal. A plating layer (20) is formed, and the electrodeposition resist (64) is removed, which is a method for producing an original plate for producing an embossed film.
[0006]
Furthermore, in the third aspect of the invention, a resist (32) is formed on a metal plate (10) formed by forming a back layer (14) made of an insulating material that is not etched on the back surface of the metal layer (12) with a solvent-type resist. ) And etching to form an etching groove (16), and then an electrodeposition resist (64) is formed along the etching groove (16) by an electrodeposition method, and the resist (32) is removed with trichloroethane, Embossing, characterized in that the non-etched portion (18) exposed by removing the resist (32) is electroplated to form a metal plating layer (20), and the electrodeposition resist (64) is removed. This is a method for producing an original plate for film production.
[0009]
Hereinafter, the present invention will be described in detail with reference to the drawings.
FIG. 1 is a schematic view of an embossing original plate manufacturing process according to the present invention.
A metal plate (10) is prepared by forming a back layer (14) made of an insulating material that is not etched on the back surface of the metal layer (12). (See Figure 1A)
As the metal layer (12), iron, copper, or the like can be used.
The back layer (14) is preferably insulative so that it is not etched by a subsequent etching process, and the electrodeposition resist (64) does not adhere to this surface during a subsequent electrodeposition process.
In manufacturing the metal plate (10) formed by forming the back layer (14) made of an insulating material that is not etched on the back surface of the metal layer (12), the back layer (14) has a thickness of 100 to 200 μm. Preparing a metal sheet (10) by preparing a plastic sheet and forming a metal layer (12) by bonding a metal foil on the surface of the plastic sheet, or forming a metal layer by chemical plating, etc. Can do.
[0010]
A resist layer (30) is applied to the metal plate (10) to form a resist (32). (See Figure 1B)
As the resist layer (30), a solvent-type resist is preferable. When the solvent-type resist is used, when the resist (32) is peeled later, the electrodeposition resist (64) is not peeled off using trichloroethane or the like. The resist (32) can be peeled off.
[0011]
A pattern film (40) is superimposed on the metal plate (10) on which the resist layer (30) is formed, and is exposed by a light source (46) such as a mercury lamp, and the pattern (42) is exposed to the resist layer (30). . (See Figure 1C)
After the exposure, development is performed to obtain a metal plate (10) on which a resist (32) is formed. (See Figure 1D)
[0012]
Thereafter, the metal plate (10) is put into an etching tank (50), and the metal plate (10) is etched with an etching solution (52) to form an etching groove (16) in the metal plate (10). (See Figure 1E)
[0013]
Next, the etched metal plate (10) is placed in the electrodeposition tank (60), thereby forming an electrodeposition resist (64) in the etching groove (16) of the metal plate (10). (See Figure 1F)
[0014]
Further, the metal plate (10) on which the electrodeposition resist (64) is formed is baked by the light source (70), and the electrodeposition resist (64) is fixed to the metal plate (10). (See Figure 1G)
[0015]
After fixing, the resist (32) is peeled off using a solvent such as trichloroethane, thereby exposing the non-etched portion (18) of the metal plate (10). (See Figure 1H)
[0016]
Next, this metal plate (10) is put in a plating tank (80) and electroplated to form a metal plating layer (20) on the non-etched portion (18). (See Fig. 1I)
[0017]
Finally, the electrodeposition resist (64) is peeled off using an alkaline solution to complete the original plate for producing the embossed film. (See Figure 1J)
[0018]
Here, if the metal plate (10) to be used is copper, there are ferric chloride, cupric chloride, nitric acid, chromic acid, sulfate, etc., and any etching solution may be used. In general, ferric chloride is frequently used.
The resist is hardened by ultraviolet light, visible light or the like and should have a resolution of at least 20 to 30 μm. However, the resist (32) and the electrodeposition resist (64) should not have the same stripping solution.
If a solvent-type resist is used for the resist layer (30), 1 · 1.1 · 1 trichloroethane or the like is used for the stripping solution. In this case, the electrodeposition resist (64) is a water-soluble electrode that is not affected by the stripping solution. It is necessary to use a resist that uses a weak alkali of the resist as a stripping solution.
[0019]
In the case of copper plating, copper sulfate is preferably used as the plating solution. The liquid temperature is preferably about 25 to 35 ° C., and the cathode current density is preferably ² to 5 Amp / dm ² . The thickness capable of stable plating was around 30 μm.
[0020]
[Action]
According to the method for producing an original plate for producing an embossed shaped film of the present invention as described above, a metal plating layer (20) is applied to the non-etched portion (18) thickly after etching the metal plate (10). A deeper embossed version than the law can be obtained.
[0021]
【Example】
Hereinafter, the present invention will be described in detail by way of examples.
As a test pattern, an embossed plate was prepared using the method of the present invention with an emboss depth of 100 μm as a target.
Since the thickness plating is 30 μm, the actual etching depth is 70 μm.
A metal plate made by laminating and laminating a 100 μm thick copper foil to a 200 μm thick polyethylene sheet is prepared, and a solvent-type dry film (copolymer of methyl methacrylate and butyl methacrylate) is brought into close contact with a high pressure mercury lamp. The pattern was exposed, developed, and further etched with ferric chloride solution.
When etching of about 70 μm was performed, side etching was about 37 μm.
A dichromate-based electrodeposition resist was formed in the etching groove, and then the resist was removed with 1 · 1 · 1 trichloroethane, and copper was plated to a thickness of 30 μm with a copper sulfate electrolyte on the exposed metal plate surface.
Thereafter, the electrodeposition resist was peeled off with a weak alkali solution to prepare an original plate for embossed film production.
[0022]
(Comparative example)
The metal plate used in the examples was exposed and developed using the same resist layer and line pattern film, and etched to a depth of 100 μm.
In this comparative example, the side etch was about 55 μm.
[0023]
As a result of comparing the embossed plate obtained in the example and the embossed plate obtained in the comparative example, the embossed plate of the comparative example has a large side etch, so the same line putter and almost the same embossed depth (100 μm). Regardless, the pattern width (the width of the pattern remaining as the embossed convex portion) was narrower by about 35 μm than the pattern width of the example.
As described above, according to the embossing plate manufacturing method of the present invention, compared to the embossing plate of the comparative example, an embossing plate having a narrow and high cross-sectional shape with less pattern “thinning” was obtained.
[0024]
【The invention's effect】
Since this invention is the above structure, there exist the following effects.
That is, according to the original plate for producing an embossed-shaped film and the method for producing the same according to the present invention, embossing at a deeper depth than in the conventional method can be reproduced with less side etching.
[Brief description of the drawings]
FIG. 1 is a schematic view showing a cross section of an embossing original plate production process according to an embodiment of the present invention.
[Explanation of symbols]
10 Metal plate 12 Metal layer 14 Back layer 16 Etching groove 18 Non-etched portion 20 Metal plating layer 30 Resist layer 32 Resist 40 Pattern film 42 Pattern 46 ... Light source 50 ... Etching tank 52 ... Etching solution 60 ... Electrodeposition tank 64 ... Electrodeposition resist 70 ... Light source 80 ... Plating tank

Claims (3)

  A resist layer (30) is formed on a metal plate (10) such as iron or copper, the pattern (42) is exposed, developed to form a resist (32), and etched to form an etching groove (16). Thereafter, an electrodeposition resist (64) is formed along the etching groove (16) by an electrodeposition method, the resist (32) is removed, and the resist (32) is removed to expose the non-etched portion (18). A method for producing an original plate for producing an embossing-type film, characterized in that electrolytic plating is performed to form a metal plating layer (20) and the electrodeposition resist (64) is removed.   A resist (32) is formed on a metal plate (10) such as iron or copper by a solvent-type resist and etched to form an etching groove (16). Then, electrodeposition is performed along the etching groove (16) by an electrodeposition method. A resist (64) is formed, the resist (32) is removed with trichloroethane, and the non-etched portion (18) exposed by removing the resist (32) is electroplated to form a metal plating layer (20). A method for producing an original plate for producing an embossed film, wherein the electrodeposition resist (64) is removed.   A resist (32) is formed with a solvent-type resist on a metal plate (10) formed with a back layer (14) made of an insulating material that is not etched on the back surface of the metal layer (12), etched and etched. After forming the groove (16), an electrodeposition resist (64) is formed along the etching groove (16) by electrodeposition, the resist (32) is removed by trichloroethane, and the resist (32) is removed and exposed. A method for producing an original plate for producing an embossed-type film, wherein the non-etched portion (18) is electrolytically plated to form a metal plating layer (20) and the electrodeposition resist (64) is removed.

Images