KR101041498B1 - compression molding method - Google Patents

Abstract

The present invention relates to a compression molding die for producing a compression molded article in the form of a plate, a method for producing the same, and a compression molding method using the same.

Specifically, the present invention comprises the steps of (a) preparing a substrate made of a metal on at least one surface; (b) forming a first photoresist film on one surface of the substrate; (c) exposing and developing the first photoresist film using a first mask to form a first photoresist pattern exposing one surface of the substrate; (d) plating the substrate to form a first plating pattern on one surface of the substrate between the first photoresist patterns; (e) It provides a compression molding die manufacturing method comprising the step of removing the first photoresist pattern and the compression molding mold obtained through this. In addition, the present invention is a compression molding method using the compression molding die, (a) applying a UV curable resin on one surface of the substrate; (b) bonding the base plate of transparent synthetic resin to one surface of the substrate, and irradiating UV while applying pressure to form a UV curable resin layer by the UV curable resin; c) providing a compression molding method comprising separating the base plate and the UV curable resin layer together.

Description

Compression molding method

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a compression molding mold and a manufacturing method and a compression molding method using the same. More specifically, a compression molding mold for producing a compression molded article in the form of a plate and a manufacture thereof The method and the compression molding method which obtains a compression molding using the same metal mold | die.

Generally, die & mold is a material that is widely used by using physical properties such as plasticity, malleability, ductility, fluidity, and the like of materials. The term 'frame' or 'form' for producing a product by processing molding is collectively, but by agreement means a metal frame for mass production of the same standard product. In addition to molds and patterns, jigs, fixtures and standard parts are included.

These molds are widely used throughout our industry because they have high dimensional accuracy and the same product specifications, so they are excellent in compatibility, and the appearance of the products is not only beautiful but also the production time can be shortened. In addition, it is widely used and widely used for manufacturing transportation machinery such as automobiles, railways, ships, aircrafts, semiconductors and telecommunications equipment, industrial machinery, precision machinery, optical equipment, agricultural and building equipment or toys. .

In particular, electro-forming molds for producing precision products in micro (μm) units are obtained through electroplating, and plated by compression molding, such as various decorations or keypads for mobile phones and remote controllers. Widely used to obtain compression moldings in the form of plates.

At this time, Jeonju refers to a method of precisely replicating products of the same standard by using electrode as a mold after electrodepositing a plating layer on the surface of a circular plate. In view of process yield, master plates are usually copied in large quantities. Next, it is repeatedly arranged up, down, left and right to form a large-scale mass production master plate assembly, and a plurality of compression moldings are obtained in one process as compression molding is performed using the master plate assembly.

Let's look at the general pole casting process in more detail.

First, prepare a circular plate engraved with the same shape as the final compression molding. At this time, the circular plate may be used a metal material such as brass or nickel, one side is engraved with a piece of the same shape as the molding to be finally obtained by a machine tool such as CNC (Computerized Numerical Control) equipment.

Next, while a release agent such as dichromic acid is applied to one surface of the circular plate, the surface is electrically masked and then immersed in an electrolytic cell to perform electroplating, thereby growing a plating layer on one surface of the circular plate.

Next, the master plate is obtained by separating the plating layer from the circular plate, where the intaglio shape opposite to the pieces of the circular plate is realized. Then, the above plating process is repeated to obtain a plurality of master plates.

Next, a plurality of master plates are arranged in a matrix on the same plane to complete a large-area master plate assembly. Compression molding of molten synthetic resin or the like is then used to cut them into product units. A plurality of moldings are completed.

However, the conventional pole and the compression molding method using the same as described above represents a disadvantage that requires a costly and time-consuming and complicated facility for the process progress.

In other words, for general electroplating method, it is necessary not only to make a separate circular plate by using a machine tool such as CNC, but also to master the plating process several times again after acquiring the master plate through the plating process for a long time. Plates must be replicated in large quantities, and these master plates can only be compression molded of the molding material after the large area master plate assembly has been completed. Therefore, the existing pole method is a large waste of time for each step, it usually takes ten days to complete the master plate assembly by the actual pole casting mold.

Furthermore, the general method of pole casting is a separate process with a completely different nature, which includes the manufacture of a circular plate by a machine tool, the manufacture and duplication of a master plate by plating, and the assembly process of a large area master plate assembly. The losses are large and the problem of having to build a large facility to deal with a series of connected works is revealed.

Accordingly, the present invention has been made to solve the above problems, and an object of the present invention is to provide a compression molding die and a method for manufacturing the same, which can be obtained in a large amount with a desired compression molding at a lower cost and effort.

To this end, the present invention provides a mold for compression molding by photolithography and plating, and a manufacturing method thereof, thereby improving work yield and reducing cost and time effort. In addition, the present invention provides a compression molding method using the above-mentioned compression molding mold, and through this, it is intended to present a concrete method for forming a compression molding having a beautiful appearance.

The present invention to achieve the above object, (a) preparing a substrate made of at least one surface of the metal; (b) forming a first photoresist film on one surface of the substrate; (c) exposing and developing the first photoresist film using a first mask to form a first photoresist pattern exposing one surface of the substrate; (d) plating the substrate to form a first plating pattern on one surface of the substrate between the first photoresist patterns; (e) it provides a method for manufacturing a die for compression molding comprising the step of removing the first photoresist pattern.

At this time, after the step (e), (f) forming a second photoresist film on one surface of the substrate on which the first plating pattern is formed; (g) exposing and developing the second photoresist film using a second mask to form a second photoresist pattern, and after step (g), (h) removing the substrate. Plating the object to form a second plating pattern on at least one of the first plating pattern or the surface of the substrate between the second photoresist patterns; (i) removing the second photoresist pattern, and after the step (g), (h ') etching the substrate to perform the etching between the second photoresist pattern. Implementing at least one hole pattern on one surface of the first plating pattern or the substrate; (i ') further comprising removing the second photoresist pattern.

In addition, the present invention and at least one surface of the substrate made of a metal; Provided is a mold for compression molding comprising a first plating pattern formed on one surface of the substrate to define a molding area for exposing the one surface of the substrate, the second mold is located in the molding area and made of the same material as the first plating pattern And at least one of a third plating pattern located in the molding area or a hole pattern located in the molding area, wherein the molding area is formed on one surface of the substrate. The plurality is characterized in that arranged in a matrix.

In another aspect, the present invention provides a compression molding method using a compression molding die prepared by the above method, comprising the steps of: (a) applying a UV curable resin to one surface of the substrate; (b) bonding the base plate of transparent synthetic resin to one surface of the substrate, and irradiating UV while applying pressure to form a UV curable resin layer by the UV curable resin; (C) provides a compression molding method comprising the step of separating the base plate and the UV curable resin layer together. At this time, the base plate is a plurality of UV curable resin layers are arranged in a matrix, and after the step (c), characterized in that it further comprises the step of cutting the base plate for each of the UV curable resin layer.

Compression molding die according to the present invention has the advantage that can be obtained in a large amount of the desired compression molding with a low cost and effort.

In particular, the present invention provides a mold and a manufacturing method for compression molding by photolithography and plating and etching, which can improve the work yield for the mold production and reduce the cost and time, and inline (in There is an advantage in that it is possible to continue the process in a 'line' manner.

In addition, the present invention provides an compression molding method using the above-described mold, thereby obtaining an approximate compression molding having a beautiful appearance.

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.

1 and 2 attached to each of the mold 10 for compression molding (hereinafter, simply referred to as a mold 10) according to an aspect of the present invention, respectively, and the compression molded product 60 produced therefrom. Is an exploded perspective view and an exploded cross-sectional view of. At this time, the exposed surface of the compression molding 60 that can be seen in Figure 1 corresponds to the back toward the mold 10 as compared to that of Figure 2, which will be described later in Figures 11 and 12 and 17 and 18 same. However, the back surface refers to one surface facing the mold 10 during the process, and is not related to the finished product form.

As can be seen, the mold 10 according to the invention consists of a substrate 12 and a first plating pattern 14 of metal formed on one surface thereof, the first plating pattern 14 exposing a portion of the substrate 12. The forming region 16 is defined, and the second plating pattern 18 formed of the same material as the first plating pattern 14 is positioned in the forming region 16.

In this case, the first and second plating patterns 14 and 18 are implemented by the same plating process, and thus the heights of the first and second plating patterns 14 and 18 are the same.

In addition, the molding region 16 is a cavity for obtaining a desired compression molded product 60 through the compression and molding steps described below, and considering the process yield, the molding area 16 is allocated as much as possible on the substrate 12. Preferably, as long as the process conditions are satisfied, the substrate 12 exhibits a large area, and the forming region 16 shows a continuous matrix arrangement up, down, left and right on one surface of the substrate 12, and the first plating between them. The pattern 14 may be in a partitioning form in a matrix form. Therefore, the part shown in the figure is only a part of the mold 10 according to the present invention.

In addition, the compression molded product 60 obtained through the mold 10 may represent a form in which a UV curable resin layer 61 is laminated on one surface of a base plate 80 of synthetic resin, and the base plate 80 may be formed. It can be substantially the same size as the substrate 12, the UV curable resin layer 61 is substantially the same size as the forming region 16 and the first pattern hole 62 by the second plating pattern 18 This is provided. Therefore, the second plating pattern 18 present in the forming region 16 of the mold 10 is for forming the first pattern hole 62 of the UV curable resin layer 61. Various patterns, letters, and the like may be used, and the first pattern hole 62 may have an intaglio opposite thereto.

Hereinafter, the manufacturing method of the mold 10 according to the present invention will be described in detail.

3 is a flowchart illustrating a manufacturing method of the mold 10 according to the present invention and a compression molding method using the same, and FIGS. 4 to 8 are process diagrams according to a manufacturing procedure of the mold 10 according to the present invention. Reference is made together with FIGS. 1 and 2 above.

First, as a substrate preparation step, a substrate 12 is prepared as shown in FIG. 4 (st1).

In this case, at least one surface of the substrate 12 may be made of metal. For example, a metal layer having a predetermined thickness may be coated on one surface of a metal plate made of metal such as stainless steel or an insulating plate such as glass.

Next, as a photoresist (PR) coating step, as shown in FIG. 5, a photoresist of photosensitive resin is coated on one surface of the substrate 12 to form a first photoresist film 32 having a uniform thickness. (st2)

At this time, the step of cleaning the substrate 12 before applying the photoresist may be preceded, and the photoresist may be a positive type or a negative type in which lighted portions are removed. ) Are all possible.

Next, as an exposure and development step, as shown in FIG. 6, the first mask 40 in the form of a film is disposed on the first photoresist film 32, and then exposed and developed to expose the substrate 12. A first photoresist pattern (see 30 in FIG. 7) of a predetermined type exposing a portion is formed. (St3)

In this case, the first mask 40 is divided into a first transmission part 42 for transmitting light and a first blocking part 44 for blocking light, and for convenience, the exposure and development steps are performed under the premise that the photoresist is a positive type. A portion of the first photoresist pattern 32 corresponding to the first transmission part 42 is removed. The first mask 40 for this purpose may be a contact type in direct contact with the first photoresist film 32, but may be a proximity type spaced apart from the first photoresist film 32 to some extent as necessary. (proximity type) or projection type (projection type) is also possible, and the exposure process may be a step and repeat or step and scan method as so-called reduced projection exposure.

Next, as a plating step, plating is performed on one surface of the substrate 12 on which the first photoresist pattern 30 is formed as shown in FIG. 7, except for the remaining portion of the first photoresist pattern 30, that is, the first A metal plating layer is formed along a portion of the substrate 12 exposed between the photoresist patterns 30. As a result, as shown in FIG. 8, the first and second plating patterns 14 and 18 are completed and a molding region is defined. (St4)

At this time, a suitable plating method is to immerse the substrate 12 in the electrolytic cell containing the electrolyte solution to connect the (-) pole, while the metal material to be plated, for example, by immersing the nickel plate to connect the (+) pole Using a wet electroplating method to reduce and precipitate on one side of the substrate 12, and if necessary, the step of electrically masking the back surface of the substrate 12 before the plating step may be preceded.

Next, as a stripping step, the first photoresist pattern 30 is removed using an appropriate chemical agent as shown in FIG. 8 (st5).

As a result, at least one side of the mold 12 as shown in FIGS. 1 and 2 defines a substrate 12 made of metal and a molding region 16 exposing a part of the substrate 12. The mold 10 according to the present invention, which is formed of the first plating pattern 14 and the second plating pattern 18 having the same material and the same height as the first plating pattern 14, is formed in the forming region 16. (Figure 9).

Next, a compression molding method using the mold 10 will be described with reference to FIGS. 9 and 10.

To this end, a subsequent step is applying and curing the UV curable resin, and applying the UV curable resin to one surface of the mold 10 as shown in FIG. 9 and then facing the base plate 80 of the transparent synthetic resin as shown in FIG. 10. After curing, the UV curable resin is cured by applying UV light by press or roller press. (St6, st7)

At this time, if necessary, the base plate 80 may be supplied in a so-called roll to roll manner.

Next, as a compression molding separation step, when the UV curable resin is sufficiently cured and the UV curable resin layer 61 is completed, the UV curable resin layer is peeled off together with the base plate 80 to obtain a desired compression molding 60. (st8)

In this case, as described above, when a plurality of molding regions 16 are defined in a matrix form on one surface of the substrate 12, the cured products obtained from the mold 10 may also be provided on the base plate 80 with a plurality of UV curable resin layers 61. ) Is arranged in a matrix manner, a plurality of products can be obtained simultaneously through the process of cutting each cell, that is, the UV curable resin layer 61 unit, if necessary, the first plating pattern 14 may be provided with a guide hole for indicating the cutting position.

On the other hand, the mold 10 and the compression molding 60 obtained through the above is the simplest form of the present invention, if necessary, after the strip step (st5) through a separate photolithography process and plating and / or etching process Various types of molds 10 and compression moldings 60 can be obtained.

Hereinafter, a description will be given of the first and second application examples.

First Application example

11 and 12 are exploded perspective and exploded cross-sectional views respectively illustrating a mold 10 and a compression molding 60 obtained through the first application example of the present invention.

When these drawings are compared with those of FIGS. 1 and 2, the third plating pattern 20, together with the second plating pattern 18, is present in the forming region 16 of the mold 10, and the compression molding ( In the UV curable resin layer 61 of FIG. 60, a second pattern hole 64 is formed by the third plating pattern 20 together with the first pattern hole 62 by the second plating pattern 18. In this case, although the third plating pattern 20 is relatively lower than the first and second plating patterns 14 and 18 in the drawing, the third plating pattern 20 may have the same height according to the purpose, and the second pattern hole 64 may also be The first pattern hole 62 may have the same or shallower depth.

13 to 16 are process cross-sectional views according to a method of manufacturing a mold 10 according to a first application example of the present invention, which is followed by the strip step st5 described with reference to FIG. 9 and 10 may be followed by the UV curable resin coating and bonding step, the pressing and curing step, and the separation and cutting of the compression molding. Accordingly, the same reference numerals are given to the parts that play the same role instead of omitting descriptions overlapping with the above-described contents.

First, the mold 10 shown in FIGS. 1 and 2 is obtained by the stripping step st5 of FIG.

Next, as a separate photoresist coating step, as shown in FIG. 13, a photoresist is applied to one surface of the substrate 12 to form a second photoresist film 36.

In this case, the second photoresist film 36 covers the entirety of the first and second plating patterns 14 and 18 including the molding region 16, and may be a positive type or a negative type.

Next, as an exposure and development step, as shown in FIG. 14, the second mask 50 is disposed on the second photoresist film 36, and then exposed and developed to expose at least one of the second plating pattern 18 and the substrate 12. A second photoresist pattern 34 exposing one is formed.

In this case, the second mask 50 is divided into a second transmission part 52 that transmits light and a second blocking part 54 that blocks light, and the exposure and development steps are performed under the premise that the photoresist is a positive type. A portion of the second photoresist film 36 corresponding to the second transmission portion 52 is removed to expose at least one of the substrate 12 or the second plating pattern 18 on the lower surface.

Next, as a plating step, plating is performed on the substrate 12 on which the second photoresist pattern 34 is formed as shown in FIG. 15, except for the remaining portion of the second photoresist pattern 34. A plating layer is formed along at least one of the substrate 12 and the second plating pattern 18 exposed between the resist patterns 34, thereby obtaining a third plating pattern (see 20 in FIG. 16).

Next, as a stripping step, the second photoresist pattern 34 is removed using an appropriate chemical agent as shown in FIG. 16. As a result, a mold 10 is obtained according to the first application described with reference to FIGS. 11 and 12, wherein at least one surface of the substrate 12 is made of metal, and the molding region 16 exposing one surface of the substrate 12. A first plating pattern 14 formed on one surface of the substrate 12, a second plating pattern 18 formed in the forming region 16 and made of the same material as the first plating pattern 14, and molding A third plating pattern 20 located in the region 16 is obtained.

Subsequently, after the UV curable resin coating and the base plate 80 described in FIG. 9 and FIG. 10 are bonded to each other, pressing and curing are performed, and the base plate 80 and the UV curable resin layer 80 are separated. If necessary, a plurality of compression moldings 60 may be obtained by performing a cutting process.

2nd Application example

17 and 18 are exploded perspective and exploded cross-sectional views, respectively, showing a mold 10 according to a second application example of the present invention and a compression molded product 60 produced through the same. This is also given the same reference numerals for the same parts that play the same role as before.

1 and 2, in the forming region 16 of the mold 10, there are separate hole patterns 22 together with the second plating pattern 18, and UV curing of the compression molding 60 is performed. The resin layer 61 is provided with a separate projection pattern 66 by the hole pattern 22 together with the first pattern hole 62 by the second plating pattern 18.

19 to 22 are process cross-sectional views of a manufacturing process of the mold 10 according to the second application of the present invention, which are also followed by the stripping step st5 described with reference to FIG. 9 may be followed by a step (st6) of UV curable resin coating and coalescence of FIG. 9, a pressurization and curing step (st7) of FIG. 10, and a separation process (st8) by cutting of the compression molding (60). Accordingly, descriptions overlapping with the above description will be omitted from FIG. 19 instead.

First, the mold 10 shown in FIGS. 1 and 2 is obtained by the stripping step st6 of FIG.

Next, as a photoresist coating step, as shown in FIG. 19, a photoresist is coated on one surface of the substrate 12 to form a third photoresist film 39.

In this case, the third photoresist film 39 covers the entirety of the first and second plating patterns 14 and 18 including the molding region 16, and may be both a positive type and a negative type.

Next, as an exposure and development step, as shown in FIG. 20, the third mask 56 is disposed on the third photoresist film 39, and then exposed and developed to expose at least one of the substrate 12 and the second plating pattern 18. A third photoresist pattern 38 is formed which exposes one.

In this case, the third mask 56 is divided into a third transmission part 58 that transmits light and a third blocking part 59 that blocks light, and the exposure and development steps are performed under the premise that the photoresist is a positive type. A portion of the third photoresist film 39 corresponding to the third transmission portion 58 is removed to expose at least one of the underlying second plating pattern 18 and the substrate 12.

Next, as an etching step, at least one of the substrate 12 and the second plating pattern 18 is etched by etching the substrate 12 on which the third photoresist pattern 38 is formed, as shown in FIG. 21. As a result, the hole pattern 22 is obtained.

At this time, the etching may be any method of dry or wet, but wet etching is advantageous in consideration of process yield or equipment, and the depth of the hole pattern 22 is determined according to the wet conditions.

Next, as a stripping step, the third photoresist pattern 38 is removed using an appropriate chemical agent as shown in FIG. 22. As a result, according to the second application example shown in FIGS. 17 and 18, a mold 10 is obtained, and at least one surface of the substrate 12 made of metal and a molding region 16 exposing one surface of the substrate 12 are formed. The first plating pattern 14 formed on one surface of the substrate 12, the second plating pattern 18 formed in the forming region 16 and made of the same material as the first plating pattern 14, and the forming region. The hole pattern 22 located within 16 appears.

Subsequently, the UV curable resin coating and bonding step (st6) and the pressurization and curing step (st7) described above with reference to FIGS. 9 and 10 are continued, and the base plate 80 is separated together with the UV curable resin layer 61. Subsequently, a plurality of compression moldings 60 may be obtained after the cutting process, thereby obtaining the compression moldings 60 described with reference to FIGS. 17 and 18.

On the other hand, some of the application examples described above are also only some examples of various embodiments of the present invention, if necessary, a separate photolithography process and plating or etching process is repeated to obtain more various molds and compression moldings The possibilities will be apparent to those skilled in the art. Therefore, the technical idea of the present invention is not limited to the above description, and all kinds of modifications without departing from the spirit of the present invention described in the following claims should be included within the scope of the present invention.

1 and 2 are exploded perspective and exploded cross-sectional view of the mold according to the present invention and the compression molding produced therefrom, respectively.

Figure 3 is a process flow chart of the mold manufacturing and compression molding method according to the present invention.

4 to 11 is a process schematic diagram of a mold manufacturing and compression molding method according to the present invention.

12 and 13 are exploded perspective and exploded cross-sectional view of the mold according to the first application example of the present invention and the compression molding produced therefrom, respectively.

14 to 18 is a process schematic diagram of a mold manufacturing method according to a first application example of the present invention.

19 and 20 are exploded perspective and exploded cross-sectional view, respectively, of a mold according to a second application of the present invention and the compression molding produced therefrom.

21 to 24 is a process schematic diagram of a mold manufacturing method according to a second application example of the present invention.

<Description of the symbols for the main parts of the drawings>

10: mold 12: substrate

14,18,20: first to third plating patterns

16: molding area 60: compression molding

61 UV curable resin layer 62 first pattern hole

64: second pattern hole

Claims (10)

(a) a mold for compression molding including a substrate made of at least one surface of a metal, a first plating pattern formed on one surface of the substrate, and a second plating pattern formed in the molding region to define a molding region exposing a surface of the substrate; Preparing a; (b) applying UV curable resin to one surface of the substrate; (c) bonding the base plate of the transparent synthetic resin to one surface of the substrate, and bonding the base plate of the transparent synthetic resin to pressure to form UV curable resin layer by curing the UV curable resin; (d) separating the baseplate and the UV curable resin layer together to obtain a plate-shaped compression molded product by the UV curable resin layer attached to the baseplate, In step (a), (a1) preparing the substrate; (a2) forming a first photoresist film on one surface of the substrate; (a3) exposing and developing the first photoresist film using a first mask to form a first photoresist pattern exposing one surface of the substrate; (a4) plating the one surface of the substrate to obtain the first and second plating patterns between the first photoresist patterns; (a5) removing the first photoresist pattern to obtain the molding area. The method according to claim 1, The compression molding die further includes a third plating pattern located in the molding area, Step (a) is after the step (a5), (a6) forming a second photoresist film on one surface of the substrate; (a7) exposing and developing the second photoresist film using a second mask to form a second photoresist pattern exposing the molding region or the second plating pattern; (a8) plating the one surface of the substrate to obtain the third plating pattern between the second photoresist patterns; (a9) further comprising removing the second photoresist pattern. The method according to claim 1, The mold for compression molding further includes a hole pattern located in the molding region, Step (a) is after the step (a5), (a6) forming a second photoresist film on one surface of the substrate; (a7) exposing and developing the second photoresist film using a second mask to form a second photoresist pattern exposing one surface of the substrate; (a8) forming the hole pattern on the forming region or the second plating pattern between the second photoresist pattern by etching the substrate; (a9) further comprising removing the second photoresist pattern. The method according to any one of claims 1 to 3, In the compression molding die, the molding regions are arranged in a plurality of matrices on one surface of the substrate, After the step (d), (e) further comprising the step of cutting the base plate for each of the compression molding. delete delete delete delete delete delete

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