KR20110067616A - Double layer screen printing plate using mold and a method for preparing the same - Google Patents

Abstract

PURPOSE: A double layer screen printing board using a mold and a method for manufacturing the same are provided to improve durability of the printing board. CONSTITUTION: A method for manufacturing a double layer screen print board using a mold comprises: a step of preparing a mold(10) having regular patterns inside; a step of forming a first photoresist layer(20) on the upper portion; a step of forming a first pattern on the first photoresist layer to have a plating part(21) on the upper side of an electric conductor and a non-plating part(22) at the part except for the upper side of the electric conductor; a step of forming a first plating layer(30) on the plating part of the first photoresist layer; a step of depositing or coating entire upper side of the first photoresist layer; a step of forming a second photoresist layer(50) on the deposited or coated side; and a step of forming a second plating layer(60).

Description

Double layer screen printing plate using mold and A method for preparing the same}

The present invention is applied to the electroplating without applying a photosensitive resin or a mesh to the substrate, using a metal mold with a conductor having a predetermined shape to form a first plating layer having a predetermined pattern, on the first plating layer The present invention relates to a double-layer screen printing plate using a mold and a method of manufacturing the same, in which a second plating layer representing a number or a symbol is integrally formed to improve durability and productivity, and to improve the sharpness and transferability of the ink so that print quality is excellent. .

In general, the existing screen printing plate is a mesh made of stainless steel, nickel plated stainless steel, etc., a nickel plate formed by electroplating, and a suspended methyl mask in which a mesh and a nickel plate are joined by plating. The photosensitive resin is applied onto various kinds of plates such as (suspend metal mask), and the photosensitive resin is subjected to an exposure and developing process for selectively irradiating, crystallizing, or curing ultraviolet (UV) light through a photomask. By patterning the numbers and letters are formed.

When the pattern is formed on the printing plate as described above, the transfer body such as ink passes through the open area forming the pattern to transfer to the printed object.

However, numbers and letters formed by patterning the photosensitive resin had a problem of low durability due to exposure of the photosensitive resin to dropping, abrasion and durability inhibiting elements due to printing pressure, mesh deformation, and ink cleaning solution applied during printing. .

In addition, various kinds of screen meshes, rigid meshes, stainless meshes, stainless meshes electrodeposited with nickel, and nickel meshes are found to be damaged due to printing pressure or foreign matters.

In addition, due to the above problems, the printing failure rate such as ink bleeds during printing is high and this causes an error in dimensions.

In addition, the deterioration of printing performance reduces the durability of the screen printing plate, that is, the usable period.

On the other hand, in the case of screen printing ink having a large screen particles, the blockage of the mesh often occurs due to the structure of the screen printing plate, and frequent chemical and physical treatments are required to remove the blockage.

In this process, durability has a great effect.

In addition, in the case of a conventional Woven type wire mesh, bending occurs due to a difference in position between wires, and causes unnecessary marks or damages to a printed object.

In addition, the mesh composed of the mesh has a problem that the tearing of the plate occurs in the case of the rotary screen.

In addition, the current screen printing plate applied to the security printing that requires a high degree of precision has a problem in that the durability is poor because the number of usable sheets is about 110,000 sheets and usually one or more printing plates are used per day.

Double-layer screen printing plate using the mold of the present invention and its manufacturing method to solve the problems caused in the prior art as described above, it is repeated through two to three plating process using a mold having a predetermined pattern is formed It is to provide a screen printing plate and a method of manufacturing the same by forming a pattern and numbers, letters, and symbols so as not to apply a photosensitive resin or install a mesh, thereby greatly improving durability.

More specifically, it is to improve the durability of the printing plate by performing electroplating by using a mold having a conductor embedded to have a constant pattern without applying a photosensitive resin or installing a mesh to form a constant pattern.

In particular, it is intended to facilitate the repeated manufacturing of the printing plate by using a mold for pattern formation.

In addition, the first plating layer to form a predetermined pattern and the second plating layer to form a number or symbol are integrally formed to improve the sharpness and transferability of the ink to produce a printing plate having excellent print quality.

In order to solve the above problems, in the method of manufacturing a double-layer screen printing plate using the mold of the present invention, i) a conductor having a shape having a predetermined pattern is inserted therein, but the conductor is exposed on one side. Preparing a mold; Ii) forming a first photoresist layer on an upper surface of the mold where the conductor is exposed; Iii) forming a first pattern composed of the plating portion and the non-plating portion such that the upper portion of the conductor becomes the plating portion and the other portion is the non-plating portion in the first photoresist layer; Iii) electroplating the first photoresist layer to form a first plating layer on the plating portion of the first photoresist layer; Iv) sputtering silver (Ag) the entire upper surface of the first photoresist layer on which the first plating layer is formed; Iii) forming a second photoresist layer on the sputtered surface; Iii) forming a second pattern on the second photoresist layer, the second pattern having a shape different from the first pattern and comprising a plating portion and a non-plating portion; Iii) electroplating the upper portion of the second photoresist layer to form a second plating layer on the plating portion of the second photoresist layer; And iii) peeling off the first photoresist layer and the second photoresist layer after the mold is separated.

At this time, after the mold is separated, the step of performing electroplating around the entire first plating layer and the second plating layer may be further performed.

In addition, the step (iii) is carried out by loading a photomask having a predetermined shape on the first photoresist layer, exposing it to ultraviolet light or laser light, and then developing.

In addition, the brushing process may be further performed after the step iii) such that the height of the non-plating part of the first photoresist and the second plating layer are the same.

In addition, the conductor inserted into the mold in the step iii) is characterized in that the lower portion of the cross-sectional shape is inserted into the larger width formed.

In addition, the mold in step iii) is characterized in that the synthetic resin material.

In the step iii), a photomask having a predetermined shape is loaded on the second photoresist layer, and then exposed to ultraviolet light or laser light, and then developed.

In addition, step ii) is characterized in that the first photoresist layer is coated on the substrate 10 by spin coating, roll coating, dipping, shedding or spraying.

In addition, the step iii) is characterized in that the second photoresist layer is coated on the substrate 10 by spin coating, roll coating, dipping, shedding, or spraying.

In addition, the steps ii) and iii) may be formed by printing a first photoresist layer including a plating part and a non-plating part on a substrate.

At this time, the mold preparation step is to sputter the silver on the substrate and then to apply a photoresist on it, to form a plated portion and a non-plated portion on the photoresist and then electroplating on the plating portion, peeling the photoresist The resin is applied and cured, and then the resin is peeled off from the substrate.

The double-layer screen printing plate using the mold of the present invention is manufactured by any one of the above manufacturing methods, the printing plate is formed on the first plated layer and the first plated layer formed with a shape having a predetermined pattern, and different from the first plated layer It is comprised by the 2nd plating layer which has a shape.

According to the present invention, by repeating two or three plating processes using a metal mold having a predetermined pattern, a repeating pattern, a number, letters, and symbols are formed to apply a photosensitive resin or to install a mesh, thereby greatly improving durability. The screen printing plate and the manufacturing method thereof are provided.

More specifically, durability of the printing plate is greatly improved by performing electroplating by using a mold having a conductor embedded therein to have a constant pattern without applying photosensitive resin or installing a mesh to form a constant pattern.

In particular, the use of a mold for pattern formation facilitates repeated manufacture of the printing plate.

In addition, the first plating layer forming a predetermined pattern and the second plating layer forming numerals or symbols are integrally formed to improve the sharpness and transferability of the ink, thereby improving print quality.

Hereinafter, a double-layer screen printing plate and a manufacturing method thereof using the mold of the present invention will be described in detail with reference to the accompanying drawings.

Iii) step

The conductor 11 having a shape having a predetermined pattern is inserted therein, but the mold 10 having the conductor 11 exposed on one side is prepared.

2 shows an example of a mold 10 and a manufacturing method thereof used in the present invention.

As shown in the cross-sectional structure of the metal mold 10, the conductor 11 is exposed on one side of the metal mold 10, and it is preferable that a wide portion 12 is formed in the inside of the metal mold 10 to increase its width.

The reason why the widening portion 12 is formed is that the conductor 11 inside the mold 10 adheres to the first plating layer 30 when the first plating layer 30 to be described later is separated from the mold 10. ) This is to prevent escape from inside.

As a method for forming such a form, a substrate is first prepared, and then a conductive layer such as silver (Ag) is deposited or coated on one side of the substrate by a deposition method such as a sputtering method to form a deposition layer.

Then a photoresist is applied over the deposited layer.

After applying the photoresist, the plating portion and the non-plating portion are formed in the photoresist.

The plated portion refers to a portion where the photoresist has disappeared after development and the non-plated portion refers to a portion where the photoresist remains.

The photoresist coating method may be applied by applying any one of spin coating, roll coating, dipping, shedding, and spraying.

In the method of forming the plated portion and the non-plated portion on the photoresist, a photomask having a predetermined shape is loaded on the photoresist, and then exposed to ultraviolet light or laser light and developed to separate the plated portion and the non-plated portion. .

At this time, the photoresist in a state where the plating portion and the non-plating portion are formed may be printed on the substrate from the beginning.

Here, the plated portion is a portion exposed after development, and the non-plated portion means a portion not exposed after development.

After the plating portion and the non-plating portion are formed in the photoresist, electroplating is performed on the plating portion.

As the metal for electroplating, various metals such as copper, nickel, nickel cobalt alloy, and iron nickel cobalt alloy are applied.

At this time, during electroplating, the electroplated upper portion protrudes from the upper surface of the photoresist so that the widening portion 12 such as a mushroom shape is formed on the upper portion.

After the electroplating is finished, the photoresist is peeled off by chemical treatment or the like, and then the liquid resin is applied to the portion where the photoresist was present, followed by curing.

At this time, transparent acrylic resin is suitable for resin.

After the transparent acrylic resin is cured, the lower deposition layer and the substrate are separated from the resin to complete the mold 10 as shown in the drawing.

The conductor 11 disposed on the completed mold 10 corresponds to a mesh pattern and forms a honeycomb shape shown in the drawing on a plane.

Ii) step

As shown in FIG. 3, the first photoresist layer 20 is formed on an upper surface of the mold 10 in which the conductor 11 is exposed.

As a method of forming the first photoresist layer 20 on the mold 10, spin coating, roll coating, dipping, spilling, spraying, or printing may be applied as described above. .

At this time, the thickness of the first photoresist layer 20 is different depending on the characteristics of the photoresist, but is usually about 0.5 ~ 20㎛.

The choice of photoresist is chosen taking into account conditions such as photoresist composition, resolution and etch thickness.

Iii) step

As shown in FIG. 3, the first pattern composed of the plating portion 21 and the non-plating portion 22 is formed so that the upper portion of the conductor 11 becomes the plating portion 21 and the other portion becomes the non-plating portion 22. One is formed in the photoresist layer 20.

As an example of a method of forming the first pattern, a photomask having a predetermined pattern is mounted on the first photoresist layer 20, and then exposed to ultraviolet light or laser light, and then developed.

Here, the plating part 21 is a part where the mold is exposed after development, and the non-plating part 22 means a part that is not exposed after development.

In addition to the above method, steps ii) and iii) may be performed at a time by printing the photoresist composed of the plating part 21 and the non-plating part 22 on the substrate 10 during the step ii).

When the printing method is applied, manufacturing cost reduction of the metal screen printing plate can be expected due to the reduction of the photoresist and the shortening of the process.

The first pattern of step iii) and the pattern of the conductor 11 formed in the mold 10 will be formed as shown in FIG. 4.

Iii) step

As shown in FIG. 3, the first plating layer 30 is formed by electroplating the plating part 21 of the first photoresist layer 20.

An example of a specific plating method is electroplating silver or copper with a few micros, followed by electroplating using copper, nickel, nickel cobalt alloy, or the like.

After forming the first plating layer 30, as shown in the drawing, the brushing process is performed so that the heights of the non-plating portions 22 and the second plating layer 60 of the first photoresist layer 20 are the same. It is preferable.

Iii) step

A conductive metal is deposited or coated on the entire upper surface of the first photoresist layer 20 on which the first plating layer 30 is formed.

As a specific example, silver (Ag) may be prepared as a deposition metal, and then the entire upper surface of the first photoresist layer 20 may be deposited or coated by a sputtering method.

The figure shows a deposition layer 40 formed by a deposition method.

The reason for forming the deposition layer 40 is to plate the second plating layer 60 to be described later on the first photoresist layer on which the first plating layer 30 is formed, and the second plating layer 60 may be formed of a first plating layer ( Since it has a shape different from that of 30), the deposition layer 40 is formed on the entire surface.

Iii) step

The second photoresist layer 50 is formed on the surface on which the conductive metal is deposited or coated.

3 shows an example in which the second photoresist layer 50 is formed on the deposition layer 40.

What is necessary is just to perform the formation method of the 2nd photoresist layer 50 according to step ii).

Iii) step

A second pattern including the plating part 51 and the non-plating part 52 is formed on the second photoresist layer 50 while having a shape different from that of the first pattern.

3 illustrates that a second pattern including the plating part 51 and the non-plating part 52 is formed on the second photoresist layer 50.

Here, the plating portion 51 becomes a portion where the deposition layer 40 is exposed after development, and the non-plating portion 52 becomes a portion where the deposition layer 40 is not exposed.

As shown in FIG. 5, the second pattern is formed to represent a specific number, letter, or symbol.

That is, the first pattern is for forming a specific shape such as a mesh in numbers, letters, or symbols, and the second pattern is for the shape of numbers, letters, or symbols.

Iii) step

Electroplating treatment is performed on the plating portion 51 of the second photoresist layer 50 to form the second plating layer 60.

In this case, the plating is performed according to the method of forming the first plating layer 30.

3 illustrates a state in which the non-plating portion 52 of the second plating layer 60 and the second photoresist layer 50 are formed together.

Iii) step

After the mold 10 is separated, the first photoresist layer 20 and the second photoresist layer 50 are peeled from the first plating layer 30 and the second plating layer 60.

The method of peeling is performed by chemical treatment.

At this time, the deposition layer 40 between the first plating layer 30 and the second plating layer 60 is removed by the peeling or etching process except for the overlapping portion.

3 illustrates a state in which the first photoresist layer 20 and the second photoresist layer 50 are removed from the mold 10.

After the first photoresist layer 20 and the second photoresist layer 50 are separated, electroplating is performed around the first plating layer 30 and the second plating layer 60 as shown in the final drawing of FIG. 3. The third plating layer 70 is formed.

When the electroplating is performed around the entire periphery, the first plating layer 30 and the second plating layer 60 are completely integrated to improve durability, and a streamlined shape is formed to facilitate ink transfer.

6 and 7 show an example of a screen printing plate manufactured by the above manufacturing method.

FIG. 6 is a view illustrating an entirety of a first pattern formed inside a second pattern, and a portion of the first pattern is illustrated in detail.

As can be seen from the drawings, the screen printing plate manufactured by the manufacturing method of the present invention is formed on the first plating layer 30 and the first plating layer 30 having a shape having a predetermined pattern, and the first plating layer 30. The second plating layer 60 having a shape different from the above) is included. Optionally, the third plating layer 70 is formed around the first plating layer 30 and the second plating layer 60 as a whole.

The characteristic of the manufacturing method as described above is that the printed plate is integrally formed while sequentially forming the first pattern and the second pattern through two platings using the mold 10 in which the conductor 11 is embedded. This prevents the application of the photosensitive resin or the installation of the mesh, which greatly improves the durability of the printing plate.

Furthermore, the use of the mold 10 simplifies and simplifies the manufacturing process of the printing plate.

In addition, the dimensional stability is improved as compared with the conventional printing plate to obtain a result of uniform print quality.

In addition, when clogging occurs in holes or meshes due to the characteristics of screen printing, chemical and physical treatments are performed using a solvent. In the conventional photosensitive resin, the photosensitive resin is affected by swelling and dropping during chemical physical treatment such as a solvent. While receiving the printing plate of the present invention is made integrally is less affected by this.

The screen printing plate of the present invention can be used for all screen printing plates to which ink such as screen ink and conductive ink are transferred. In particular, security printing fields such as banknotes, checks, passports, gift certificates, etc., and RFID, LCD, touch screen, solar cells, It will be applicable to all industries such as electronic materials such as panels, fuel cells, floor plates, wallpaper, decor, and industrial materials such as printing.

1 is a perspective view showing the shape of a conventional photosensitive resin screen printing plate.

2 is a view showing an example of a process for manufacturing a mold in the present invention.

3 is a view showing a screen printing plate manufacturing process of the present invention.

4 is a view showing an example of a first pattern in the present invention.

5 is a view showing an example of a second pattern in the present invention.

6 and 7 show the printing plate produced by the manufacturing method of the present invention.

<Detailed Description of Major Symbols in Drawing>

10: mold 11: conductor

12: widening portion 20: first photoresist layer

21 plating part 22 non-plating part

30: first plating layer 40: deposition layer

50 second photoresist layer 51 plating

52: non-plating part 60: second plating layer

70: third plating layer

Claims (12)

In the manufacturing method of the screen printing plate, Iii) preparing a mold 10 in which a conductor 11 having a shape having a predetermined pattern is inserted therein, wherein the conductor 11 is exposed on one side thereof; Ii) forming a first photoresist layer 20 on an upper surface of the mold 10 to which the conductor 11 is exposed; I) The first photoresist layer is formed of a first pattern composed of the plating portion 21 and the non-plating portion 22 such that the upper portion of the conductor 11 is the plating portion 21 and the other portion is the non-plating portion 22. Forming on 20; Iii) electroplating the plating portion 21 of the first photoresist layer 20 so that the first plating layer 30 is formed; Iii) depositing or coating a conductive metal on the entire upper surface of the first photoresist layer 20 on which the first plating layer 30 is formed; Iii) forming a second photoresist layer 50 on the surface on which the conductive metal is deposited or coated; Iii) forming a second pattern on the second photoresist layer 50 having a different shape from the first pattern, the second pattern consisting of the plating part 51 and the non-plating part 52; Iii) electroplating the plating portion 51 of the second photoresist layer 50 so that the second plating layer 60 is formed; And iii) peeling off the first photoresist layer 20 and the second photoresist layer 50 after separating the mold 10. Method of manufacturing a double layer screen printing plate using a mold. The method of claim 1, After the mold 10 is separated, the step of performing electroplating on the entire circumference of the first plating layer 30 and the second plating layer 60 is further performed. Method of manufacturing a double layer screen printing plate using a mold. The method of claim 1, In the step iii), a photomask having a predetermined shape is loaded on the first photoresist layer 20, and then exposed to ultraviolet light or laser light, and then developed. Method of manufacturing a double layer screen printing plate using a mold. The method of claim 1, After the step (iii), the brushing process is further performed so that the heights of the non-plating part 22 and the second plating layer 60 of the first photoresist layer 20 are the same. Method of manufacturing a double layer screen printing plate using a mold. The method of claim 1, In the step (iii), the conductor 11 inserted into the mold 10 is characterized in that the lower portion having a larger cross-sectional shape is inserted therein. Method of manufacturing a double layer screen printing plate using a mold. The method of claim 1, In the step iii), the mold 10 is characterized in that the synthetic resin material, Method of manufacturing a double layer screen printing plate using a mold. The method of claim 1, In the step iii), a photomask having a predetermined shape is mounted on the second photoresist layer 50, and then exposed to ultraviolet light or laser light, and then developed. Method of manufacturing a double layer screen printing plate using a mold. The method of claim 1, In step ii), the first photoresist layer 20 is coated on the substrate 10 by spin coating, roll coating, dipping, shedding or spraying. Method of manufacturing a double layer screen printing plate using a mold. The method of claim 1, The step iii) is formed by coating the second photoresist layer 50 on the substrate 10 by any one method selected from spin coating, roll coating, dipping, spilling, and spraying. Method of manufacturing a double layer screen printing plate using a mold. The method of claim 1, Step ii) and iii), Characterized in that the first photoresist layer 20 composed of the plating portion 21 and the non-plating portion 22 is formed by printing on the substrate, Method of manufacturing a double layer screen printing plate using a mold. The method of claim 1, The mold preparation step After depositing or coating the conductive metal on the substrate, the photoresist is applied thereon, the plating portion and the non-plating portion are formed on the photoresist, the electroplating is performed on the plating portion, the photoresist is peeled off, and the resin is applied to cure. And peeling the resin from the substrate to form it. Double layer screen printing plate using mold. In the screen printing plate, It is prepared by the manufacturing method of any one of claims 1 to 11, The printing plate is formed of a first plating layer 30 having a shape having a predetermined pattern, and a second plating layer 60 formed on the first plating layer 30 and having a shape different from that of the first plating layer 30. Characterized in that Double layer screen printing plate using mold.

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