CA1269342A - Method of electroforming articles using a photomask mandrel - Google Patents
Method of electroforming articles using a photomask mandrelInfo
- Publication number
- CA1269342A CA1269342A CA000479595A CA479595A CA1269342A CA 1269342 A CA1269342 A CA 1269342A CA 000479595 A CA000479595 A CA 000479595A CA 479595 A CA479595 A CA 479595A CA 1269342 A CA1269342 A CA 1269342A
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- Prior art keywords
- photoresist
- mandrel
- conductive film
- article
- electroforming
- Prior art date
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- Moulds For Moulding Plastics Or The Like (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
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- Inert Electrodes (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
ABSTRACT
A method for making a metallic article by electroforming, in which a mandrel is first prepared by depositing a first continuous layer of a conductive film on a non-conducting substrate and a second continuous layer of photoresist on the conductive film. The photoresist is exposed through a photomask, and developed to produce a pattern on the conductive film corresponding to the configuration of the article to be electroformed. The conductive film is then made the cathode in an electroforming solution with an anode comprising a metal to be deposited, and an electric current is passed until the desired thickness of metal to form the metallic article has been deposited on the mandrel. The photoresist can be removed after the electroforming to facilitate separation of the article from the mandrel, and the removal can be further facilitated by contacting with an adherent polymeric material such as polyvinyl butyral.
A method for making a metallic article by electroforming, in which a mandrel is first prepared by depositing a first continuous layer of a conductive film on a non-conducting substrate and a second continuous layer of photoresist on the conductive film. The photoresist is exposed through a photomask, and developed to produce a pattern on the conductive film corresponding to the configuration of the article to be electroformed. The conductive film is then made the cathode in an electroforming solution with an anode comprising a metal to be deposited, and an electric current is passed until the desired thickness of metal to form the metallic article has been deposited on the mandrel. The photoresist can be removed after the electroforming to facilitate separation of the article from the mandrel, and the removal can be further facilitated by contacting with an adherent polymeric material such as polyvinyl butyral.
Description
~2~93~2 ELECTROFORMING ELE~IENTS
Back~round The present inventlon relates generall~r to the art of electro-forming9 and more particularly to the art oF electroforming a heating grid.
Electroforming of precision patterns, such as those used in -optical systems, has been accomplished by several methods. For example, precision mesh patterns have been produced by electroplating onto a mas-ter pattern of lines formed by etching or ruling lines into a glass sub-strate and depositing a conductive material into the etched or ruled lines to form a conductive master pattern for electroplating. A major disadvantage of this method is the limitation on the fineness and preci-sion of etching glass.
Photolithographic techniques have also been used to produce patterned electroforming mandrels. For example, a conductive substrate, such as a polished stainless steel plate, is coated with a layer of photoresist. A patterned photomask is placed over the photoresist, which is then exposed to actinic radiation through the mask, thereby creating a pattern of exposed and unexposed photoresist which is further developed.
Either the exposed or the unexposed portions of the photoresist are removed, depending on whether a positive or negative pattern is desired, resulting in a conductive pattern on the substrate. An electroplatin~
~2~9342 process i5 then carried out to orm a replica of the conductive pattern which can therea~ter be removed from the substrate. This method is also restrlcted in the uniformity and precision of lines which can be formed, as well as requiring reprocessing of the master pattern after limited usage.
Il.S. Patent ~o. 3,703,450 to Bakewell discloses a method of fabricating precision conductive ~esh patterns on a repetitively reusable master plate comprising a conductive pattern formed on a nonconductive substrate and a non-conductive pattern formed in the interstices of the conductive pattern. A reproduction of the master pattern is formed by plating of a conductive pattern onto the master pattern within a matrix defined by the non-conductive pattern. The conductive metal master pat-tern is typically deposi~ed onto a glass plate by evaporation of a metal such as chromium through a ruled pattern formed on a stencil materlal.
The nonconductive pattern is formed by depositing a layer of photoresist over the conductive pattern coated side of the glass plate. By e~posing the photoresist to actinic radiation through the conductive pattern coated substrate, exact registration of the conductive and nonconductive patterns is achieved. The photoresist layer is developed and the exposed portions are removed, leaving a pattern of photoresist over the conductive pattern. A silicon monoxide layer is then deposlted over the entire surface of the glass plate, covering both the photoresist/conduc-tive pattern coated portions and the exposed glass portions. Finally, the photoresist overlying the conductive pattern and the silicon monoxide overlying the residual photoresist material are removed, leaving the glass plate coated with a conductive metal pattern and an array of silicon monoxide deposits in the interstitial spaces in the ~onductive ~2~
pattern. Replicas of~the cond~lctive pattern are ~hen formed by electro~
plating.
Summary of the Invention The present invention provides an alternative process for pro- -ducing a heater element grid. A substr~te transparent to actinic radia-tion is provided with a desired pattern for the heater element grid to form a photomask. A substrnte to be used as the electroEorming mandrel is coa~ed ~ith:a contin~ous~conductive;~ilm. ~ continùou~ layer of photo-resist is deposited o~er the conduceive film. The photoresist is e~posed to actinic radiation through the photomask, the pattern acting to mask portions of the photoresist from exposure. The photoresist is then developed, and the unexposed portions removed to yield a conductive pattern of the underlying conductive film corresponding to the pattern of the photomask. Alternatively, the exposed portions of the photoresist may be removed to yield a conductive pattern which is a negative image of the pattern of the photomask. The resultant article is employed as a mandrel for the-electroforming of a metallic heater element grid. The mandrel is in~nersed in an electroforming solution, and current is appliæd to effect the electrodeposition of metal onto the conductive pattern area - 20 on the mandrel. -~en~a sufficiently thick deposit is obtained, the remaining photoresist is removed, and the electroformed heating grid is separated from the mandrel.
Detailed Descrlptîon of the Preferred Embodiments .
In a preferred embodiment of the present invention, a glass master plate is provided with a pattern representing the configuration of the heating grid to be produced by electroforming. While the pattern may be formed by a coatin~, a most preferred embodiment of the present 3~
invention utili~es a glass photomask to provide the pattern, preferably a glass photomask having a pattern formed by stain produclng metal infused into the glass. Preferred techniques for producing stained glass photomasks are described in detail in U.S. Patents 4,144,066 and 4,155,735 to Ernsberger.
A continuous conductive film is deposited on the surface of a substrate to be used as the electroforming mandrel. The conductive film may be a metal or an electroconductive metal ox$de such as tin oxide or lndium oxide. The conductive film may be deposited by an conventional coating technique such as vacuum deposition, cathode sputtering, chemical vapor deposition or pyrolytic coating techniques. In a most preferred embodiment of the present invention, a conductive film comprising indium oxide is deposited by magnetron sputtering. The conductive film is preferably deposited on a glass substrate. In a most preferred embodiment of the present invention, a conductive film is sputtered from a cathode comprising 80 to 90 percent indium and 10 to 20 percent tin.
A continuous layer of photoresist is applied over the conduc-tive film. Any conventional photoresist with sufficient resolution is acceptable. In a preferred embodiment of the present invention, photo-resist in sheet form is laminated to the conductive film. Thephotoresist is exposed to actinic radiation through the photomask to cure the exposed portions of the photoresist. The photomask pattern masks portions of the photoresist from exposure, and these portions remain uncured. Following exposure of the photoresist, and a post-curing cycle if necessary, the photoresist is developed. Preferably, the photoresist is contacted with a chemical solution which dissolves and removes the 3L2~à~3~
unexposed, uncured portions of the photoresist, thereby providing a pattern of the underlying conductive film which is a positive image of the pattern in the photomask. The remaining exposed, cured portions of the photoresist surrounding the conductive pattern form walls within which the electroformed heating grid is subsequently depositedO In an alternative embodiment of the present invention a positive working pho~o-resist may be employed to form a conductive film pattern which is a negative image of the photomask pattern.
The resulting article is employed as a mandrel for the electro-forming of a metallic heating grid which is a replication of the pattern on the conductive film. As here described, the substrate bearing a conductive film having a pattern defined by the photomask pattern is contacted with a conventional metal-containing electrodeposition solution.
An electrical circuit is established, using the conductlve Eilm as the cathode and an electrode of the metal to be deposited as the anode. An electrical potential is applied, and metal is deposited on the conductive film in the pattern defined by the nonconductive photoresist. Electro-deposition is continued until the desired thickness is obtained for the electroformed heating grid. The substrate bearing the conductive film, photoresist, and electroformed heating grid is removed from the electro-deposition solution. Separation of the electroformed article from the mandrel may be effected by various means, such as alternately heating and chilling. In certain applications wherein the electroformed article is very thin and/or comprises very fine lines, the remaining photoresist is first removed, preferably by dissolution. Then the electroformed article is lifted off the mandrel. In other applications, the electroformed article may be separated from the mandrel without removing the remaining 3~
photoresist, permitting immedia~e reuse of the mandrel. In most preferred embodiments of the present invention wherein the electroformed article is a heating grid and comprises very fine lines, a preferred method for separating the electroformed heating element from the mandrel is to remove the photoresist, contact the electroformed article with a polymeric material to which the article adheres, and remove the heating element attached to the polymeric material. Preferably, the polymeric material is an interlayer sheet to be laminated to a rigld sheet to form an aircraft transparency. In a most preferred embodiment, the polymeric material is a sheet of poLyvinyl b~ltyral, a surface of which i5 chemically treated to soften the surface. The tacky surface is used to pick the heatlng grid off the mandrel. The polyvinyl butyral sheet ls then laminated to a second polymer sheet with the heating grid between them. Various solvents may be used to soften the polyvinyl butyral; diethylene glycol monobutyl ether is preferred.
The present invention will be further understood from the descriptions of specific examples which follow.
EXAMPLE I
A glass photomask is prepared by coating a glass plate with a photographic emulsion comprising silver halide which is exposed to actinic radiation through a master pattern in the shape of the part to be electroformed. Exposed areas of the photographic emulsion form a latent image which is developed by immersion in developing solutions which con-~ert the silver halide to colloidal silver. The coated glass plate is subjected to an electric field which induces migration of the silver ion into the glass. The silver ions are reduced to elemental silver which agglomerates into colloidal, microcrystalline color centers which form a stained pattern within the glass which corresponds with the master pattern of the article to be electroformed. An electroforming mandrel is prepared by coating a glass substrate surface with a continuous conduc-tive film by magnetron sputtering of a cathode comprising 90 percent in~um and 10 percent tin. The preferred indium oxide film has a surface resistvity less than 20 ohms per square. A continuous layer Gf phDtoresist is applied over the conductive film by laminflting a sheet of photoresist to the indium oxide at a temperature of 235F. (about 113C.). A photoresist layer having a thickness of 0.001 inch (about 0.025 millimeter) is available from Thiokol/Dynachem Corp. of Tustln, California. The photoresist is exposed to actlnic radiation (Colight M-218) through the glass photomask for 20 seconds and cured. The photo-resist is developed with a solvent which removes the unexposed portions of the photoresist thereby providing a pattern of the underlying indium oxide corresponding with the pattern in the photomask which in turn corre- -sponds with the master pattern in the shape of the article to be electro-formed. The resultant article is used as an electroforming mandrel in the following process.
EXAMPLE II
A glass mandrel 3 by 7 inches ~about 7.6 by 17.8 centimeters) is prepared as in Example I having a screen pattern comprising lines 0.0012 inch (about 0.03 millimeter) wide spaced 0.02~ inches (about 0.5 millimeters) apart. The mandrel is prep~red for electroforming by sequent~al dipping into 2 dilute solution of hydrochloric and nitric acids, and isopropanol, each followed by a water rinse to clean and we~ -the electroforming surface. The glass mandrel is dipped into the electroforming solution several times to completely wet the surface and 3~Z
remove air bubbles before the electroforming process co~ences. The electroforming solution comprises nickel sulfamate~ and is maintained at a temperature of 110~F. (about 43C.). A cathode contact is applied to the indtum oxide film of the glass electroforming mandrel. An anode contact is applied to a depolarized nickel plate. Both the mandrel and the plate ~re immersed into the nickel sulfamate solution. At a current denslty o~ 10 amps per square foot, electroforming proceed~s at a rate of 0.001 inch ~0.025 millimeter) per 100 minutes. When the electroformed part reaches the desired thickness~ 0.0005 inches (about 0.013 ~illime~er~3, the mandrel is removed from the solutlon. The remaining photoresist i9 dissolved and removed with sodium hydroxide solution at 150F. (about 66C.). The electroformed heating grid is removed from the mandrel by contacting the surface with a sheet of polyvinyl butyral, the contacting surface of which has been treated with diethylene glycol monobutyl ether to produce an adhesive surface. As the polyvinyl butyral sheet is pulled away from the mandrel, the grid remains attached to the tacky surface of the polyvinyl butyral. To form a heatable interlayer, the polyvinyl butyral sheet bearing the heating grid is laminated to a~other polymeric sheet with the heating grid between the sheets.
EXAU~LE III
An optical grid is produced by electroforming as in Exampla II, ~cep~ that the conductive pattern on the mandrel comprises finer lines more ~osely spaced. An optical grid is produced comprising lines 0.001 i~b (about 0.025 millimeter) wide spaced 0.003 inch ~about 0.076 meter) apart.
The above examples are offered to illustrate the present inven-io~. Va~ious modifications are included within the scope of the present ~Z1~3~%
invention. For e~ample, metallic sub~traees may be used for the e}ectroforming mandrel, and other metals may be deposit~d by electroforming, such as copper, iron, lead, tin and zinc. The electroformed elements of the present invention need not be grid patterns, but may be produced in any shape or configuration, limited only by the artwork. The scope of the present in~ention is defined by the following claims.
Back~round The present inventlon relates generall~r to the art of electro-forming9 and more particularly to the art oF electroforming a heating grid.
Electroforming of precision patterns, such as those used in -optical systems, has been accomplished by several methods. For example, precision mesh patterns have been produced by electroplating onto a mas-ter pattern of lines formed by etching or ruling lines into a glass sub-strate and depositing a conductive material into the etched or ruled lines to form a conductive master pattern for electroplating. A major disadvantage of this method is the limitation on the fineness and preci-sion of etching glass.
Photolithographic techniques have also been used to produce patterned electroforming mandrels. For example, a conductive substrate, such as a polished stainless steel plate, is coated with a layer of photoresist. A patterned photomask is placed over the photoresist, which is then exposed to actinic radiation through the mask, thereby creating a pattern of exposed and unexposed photoresist which is further developed.
Either the exposed or the unexposed portions of the photoresist are removed, depending on whether a positive or negative pattern is desired, resulting in a conductive pattern on the substrate. An electroplatin~
~2~9342 process i5 then carried out to orm a replica of the conductive pattern which can therea~ter be removed from the substrate. This method is also restrlcted in the uniformity and precision of lines which can be formed, as well as requiring reprocessing of the master pattern after limited usage.
Il.S. Patent ~o. 3,703,450 to Bakewell discloses a method of fabricating precision conductive ~esh patterns on a repetitively reusable master plate comprising a conductive pattern formed on a nonconductive substrate and a non-conductive pattern formed in the interstices of the conductive pattern. A reproduction of the master pattern is formed by plating of a conductive pattern onto the master pattern within a matrix defined by the non-conductive pattern. The conductive metal master pat-tern is typically deposi~ed onto a glass plate by evaporation of a metal such as chromium through a ruled pattern formed on a stencil materlal.
The nonconductive pattern is formed by depositing a layer of photoresist over the conductive pattern coated side of the glass plate. By e~posing the photoresist to actinic radiation through the conductive pattern coated substrate, exact registration of the conductive and nonconductive patterns is achieved. The photoresist layer is developed and the exposed portions are removed, leaving a pattern of photoresist over the conductive pattern. A silicon monoxide layer is then deposlted over the entire surface of the glass plate, covering both the photoresist/conduc-tive pattern coated portions and the exposed glass portions. Finally, the photoresist overlying the conductive pattern and the silicon monoxide overlying the residual photoresist material are removed, leaving the glass plate coated with a conductive metal pattern and an array of silicon monoxide deposits in the interstitial spaces in the ~onductive ~2~
pattern. Replicas of~the cond~lctive pattern are ~hen formed by electro~
plating.
Summary of the Invention The present invention provides an alternative process for pro- -ducing a heater element grid. A substr~te transparent to actinic radia-tion is provided with a desired pattern for the heater element grid to form a photomask. A substrnte to be used as the electroEorming mandrel is coa~ed ~ith:a contin~ous~conductive;~ilm. ~ continùou~ layer of photo-resist is deposited o~er the conduceive film. The photoresist is e~posed to actinic radiation through the photomask, the pattern acting to mask portions of the photoresist from exposure. The photoresist is then developed, and the unexposed portions removed to yield a conductive pattern of the underlying conductive film corresponding to the pattern of the photomask. Alternatively, the exposed portions of the photoresist may be removed to yield a conductive pattern which is a negative image of the pattern of the photomask. The resultant article is employed as a mandrel for the-electroforming of a metallic heater element grid. The mandrel is in~nersed in an electroforming solution, and current is appliæd to effect the electrodeposition of metal onto the conductive pattern area - 20 on the mandrel. -~en~a sufficiently thick deposit is obtained, the remaining photoresist is removed, and the electroformed heating grid is separated from the mandrel.
Detailed Descrlptîon of the Preferred Embodiments .
In a preferred embodiment of the present invention, a glass master plate is provided with a pattern representing the configuration of the heating grid to be produced by electroforming. While the pattern may be formed by a coatin~, a most preferred embodiment of the present 3~
invention utili~es a glass photomask to provide the pattern, preferably a glass photomask having a pattern formed by stain produclng metal infused into the glass. Preferred techniques for producing stained glass photomasks are described in detail in U.S. Patents 4,144,066 and 4,155,735 to Ernsberger.
A continuous conductive film is deposited on the surface of a substrate to be used as the electroforming mandrel. The conductive film may be a metal or an electroconductive metal ox$de such as tin oxide or lndium oxide. The conductive film may be deposited by an conventional coating technique such as vacuum deposition, cathode sputtering, chemical vapor deposition or pyrolytic coating techniques. In a most preferred embodiment of the present invention, a conductive film comprising indium oxide is deposited by magnetron sputtering. The conductive film is preferably deposited on a glass substrate. In a most preferred embodiment of the present invention, a conductive film is sputtered from a cathode comprising 80 to 90 percent indium and 10 to 20 percent tin.
A continuous layer of photoresist is applied over the conduc-tive film. Any conventional photoresist with sufficient resolution is acceptable. In a preferred embodiment of the present invention, photo-resist in sheet form is laminated to the conductive film. Thephotoresist is exposed to actinic radiation through the photomask to cure the exposed portions of the photoresist. The photomask pattern masks portions of the photoresist from exposure, and these portions remain uncured. Following exposure of the photoresist, and a post-curing cycle if necessary, the photoresist is developed. Preferably, the photoresist is contacted with a chemical solution which dissolves and removes the 3L2~à~3~
unexposed, uncured portions of the photoresist, thereby providing a pattern of the underlying conductive film which is a positive image of the pattern in the photomask. The remaining exposed, cured portions of the photoresist surrounding the conductive pattern form walls within which the electroformed heating grid is subsequently depositedO In an alternative embodiment of the present invention a positive working pho~o-resist may be employed to form a conductive film pattern which is a negative image of the photomask pattern.
The resulting article is employed as a mandrel for the electro-forming of a metallic heating grid which is a replication of the pattern on the conductive film. As here described, the substrate bearing a conductive film having a pattern defined by the photomask pattern is contacted with a conventional metal-containing electrodeposition solution.
An electrical circuit is established, using the conductlve Eilm as the cathode and an electrode of the metal to be deposited as the anode. An electrical potential is applied, and metal is deposited on the conductive film in the pattern defined by the nonconductive photoresist. Electro-deposition is continued until the desired thickness is obtained for the electroformed heating grid. The substrate bearing the conductive film, photoresist, and electroformed heating grid is removed from the electro-deposition solution. Separation of the electroformed article from the mandrel may be effected by various means, such as alternately heating and chilling. In certain applications wherein the electroformed article is very thin and/or comprises very fine lines, the remaining photoresist is first removed, preferably by dissolution. Then the electroformed article is lifted off the mandrel. In other applications, the electroformed article may be separated from the mandrel without removing the remaining 3~
photoresist, permitting immedia~e reuse of the mandrel. In most preferred embodiments of the present invention wherein the electroformed article is a heating grid and comprises very fine lines, a preferred method for separating the electroformed heating element from the mandrel is to remove the photoresist, contact the electroformed article with a polymeric material to which the article adheres, and remove the heating element attached to the polymeric material. Preferably, the polymeric material is an interlayer sheet to be laminated to a rigld sheet to form an aircraft transparency. In a most preferred embodiment, the polymeric material is a sheet of poLyvinyl b~ltyral, a surface of which i5 chemically treated to soften the surface. The tacky surface is used to pick the heatlng grid off the mandrel. The polyvinyl butyral sheet ls then laminated to a second polymer sheet with the heating grid between them. Various solvents may be used to soften the polyvinyl butyral; diethylene glycol monobutyl ether is preferred.
The present invention will be further understood from the descriptions of specific examples which follow.
EXAMPLE I
A glass photomask is prepared by coating a glass plate with a photographic emulsion comprising silver halide which is exposed to actinic radiation through a master pattern in the shape of the part to be electroformed. Exposed areas of the photographic emulsion form a latent image which is developed by immersion in developing solutions which con-~ert the silver halide to colloidal silver. The coated glass plate is subjected to an electric field which induces migration of the silver ion into the glass. The silver ions are reduced to elemental silver which agglomerates into colloidal, microcrystalline color centers which form a stained pattern within the glass which corresponds with the master pattern of the article to be electroformed. An electroforming mandrel is prepared by coating a glass substrate surface with a continuous conduc-tive film by magnetron sputtering of a cathode comprising 90 percent in~um and 10 percent tin. The preferred indium oxide film has a surface resistvity less than 20 ohms per square. A continuous layer Gf phDtoresist is applied over the conductive film by laminflting a sheet of photoresist to the indium oxide at a temperature of 235F. (about 113C.). A photoresist layer having a thickness of 0.001 inch (about 0.025 millimeter) is available from Thiokol/Dynachem Corp. of Tustln, California. The photoresist is exposed to actlnic radiation (Colight M-218) through the glass photomask for 20 seconds and cured. The photo-resist is developed with a solvent which removes the unexposed portions of the photoresist thereby providing a pattern of the underlying indium oxide corresponding with the pattern in the photomask which in turn corre- -sponds with the master pattern in the shape of the article to be electro-formed. The resultant article is used as an electroforming mandrel in the following process.
EXAMPLE II
A glass mandrel 3 by 7 inches ~about 7.6 by 17.8 centimeters) is prepared as in Example I having a screen pattern comprising lines 0.0012 inch (about 0.03 millimeter) wide spaced 0.02~ inches (about 0.5 millimeters) apart. The mandrel is prep~red for electroforming by sequent~al dipping into 2 dilute solution of hydrochloric and nitric acids, and isopropanol, each followed by a water rinse to clean and we~ -the electroforming surface. The glass mandrel is dipped into the electroforming solution several times to completely wet the surface and 3~Z
remove air bubbles before the electroforming process co~ences. The electroforming solution comprises nickel sulfamate~ and is maintained at a temperature of 110~F. (about 43C.). A cathode contact is applied to the indtum oxide film of the glass electroforming mandrel. An anode contact is applied to a depolarized nickel plate. Both the mandrel and the plate ~re immersed into the nickel sulfamate solution. At a current denslty o~ 10 amps per square foot, electroforming proceed~s at a rate of 0.001 inch ~0.025 millimeter) per 100 minutes. When the electroformed part reaches the desired thickness~ 0.0005 inches (about 0.013 ~illime~er~3, the mandrel is removed from the solutlon. The remaining photoresist i9 dissolved and removed with sodium hydroxide solution at 150F. (about 66C.). The electroformed heating grid is removed from the mandrel by contacting the surface with a sheet of polyvinyl butyral, the contacting surface of which has been treated with diethylene glycol monobutyl ether to produce an adhesive surface. As the polyvinyl butyral sheet is pulled away from the mandrel, the grid remains attached to the tacky surface of the polyvinyl butyral. To form a heatable interlayer, the polyvinyl butyral sheet bearing the heating grid is laminated to a~other polymeric sheet with the heating grid between the sheets.
EXAU~LE III
An optical grid is produced by electroforming as in Exampla II, ~cep~ that the conductive pattern on the mandrel comprises finer lines more ~osely spaced. An optical grid is produced comprising lines 0.001 i~b (about 0.025 millimeter) wide spaced 0.003 inch ~about 0.076 meter) apart.
The above examples are offered to illustrate the present inven-io~. Va~ious modifications are included within the scope of the present ~Z1~3~%
invention. For e~ample, metallic sub~traees may be used for the e}ectroforming mandrel, and other metals may be deposit~d by electroforming, such as copper, iron, lead, tin and zinc. The electroformed elements of the present invention need not be grid patterns, but may be produced in any shape or configuration, limited only by the artwork. The scope of the present in~ention is defined by the following claims.
Claims (8)
IS CLAIMED ARE DEFINED AS FOLLOWS:
1. A method of electroforming a metallic article comprising the steps of:
a. preparing an electroforming mandrel by depositing on a surface of a non-conducting substrate a first continuous layer of a conductive film, and a second continuous layer of photoresist;
b. exposing said photoresist to actinic radiation through a photomask having a pattern corresponding to the configuration of an article to be electroformed;
c. developing the photoresist by removing portions of the photoresist to uncover a pattern of the conductive film corresponding to the configuration of the article to be electroformed;
d. attaching a cathodic connector to the conductive film;
e. attaching an anodic connector to an anode electrode comprising metal to be deposited on the conductive film;
f. immersing the mandrel and the metal electrode into an electroforming solution;
g. establishing an electric current through said connectors and solution in order to deposit metal from the anode onto the cathodic surface of the conductive film; and h. carrying out electrodeposition of the metal to the desired thickness to electroform the metallic article on the mandrel.
a. preparing an electroforming mandrel by depositing on a surface of a non-conducting substrate a first continuous layer of a conductive film, and a second continuous layer of photoresist;
b. exposing said photoresist to actinic radiation through a photomask having a pattern corresponding to the configuration of an article to be electroformed;
c. developing the photoresist by removing portions of the photoresist to uncover a pattern of the conductive film corresponding to the configuration of the article to be electroformed;
d. attaching a cathodic connector to the conductive film;
e. attaching an anodic connector to an anode electrode comprising metal to be deposited on the conductive film;
f. immersing the mandrel and the metal electrode into an electroforming solution;
g. establishing an electric current through said connectors and solution in order to deposit metal from the anode onto the cathodic surface of the conductive film; and h. carrying out electrodeposition of the metal to the desired thickness to electroform the metallic article on the mandrel.
2. A method according to claim 1, wherein the conductive film is selected from the group consisting of indium oxide, tin oxide and mixtures thereof.
3. A method according to claim 1, wherein said conductive film is produced by the process of magnetron sputtering.
4. A method according to claim 1, wherein said electroforming solution comprises nickel sulfamate, and said metal electrode comprises nickel.
5. A method according to claim 1, which further comprises the step of removing the photoresist after the electroforming of the metallic article in order to facilitate separation of the article from the mandrel.
6. A method according to claim 5, wherein the metallic article is removed from the mandrel by contacting the article with a polymeric material to which the article adheres.
7. A method according to claim 6, wherein said polymeric material is a sheet of polyvinyl butyral.
8. A method according to claim 2, 4 or 5, wherein the substrate is glass.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US60550584A | 1984-04-30 | 1984-04-30 | |
| US605,505 | 1984-04-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1269342A true CA1269342A (en) | 1990-05-22 |
Family
ID=24423945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000479595A Expired CA1269342A (en) | 1984-04-30 | 1985-04-19 | Method of electroforming articles using a photomask mandrel |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS619592A (en) |
| CA (1) | CA1269342A (en) |
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|---|---|---|---|---|
| JP5485754B2 (en) * | 2010-03-19 | 2014-05-07 | セイコーインスツル株式会社 | Electroforming mold and manufacturing method thereof |
| JP5646192B2 (en) * | 2010-03-19 | 2014-12-24 | セイコーインスツル株式会社 | Electroforming mold and manufacturing method thereof |
| JP2012122119A (en) * | 2010-12-10 | 2012-06-28 | Seiko Instruments Inc | Method for production of electroformed body |
| JP5597119B2 (en) * | 2010-12-10 | 2014-10-01 | セイコーインスツル株式会社 | Manufacturing method of electroforming mold |
| JP5798351B2 (en) * | 2011-03-28 | 2015-10-21 | セイコーインスツル株式会社 | Electric mold |
| CN103325442B (en) * | 2013-06-27 | 2015-11-11 | 北京印刷学院 | A kind of compound transparent electricity conductive film and preparation method thereof |
| US10541387B2 (en) | 2015-09-30 | 2020-01-21 | Dai Nippon Printing Co., Ltd. | Deposition mask, method of manufacturing deposition mask and metal plate |
| KR102477941B1 (en) * | 2015-09-30 | 2022-12-16 | 다이니폰 인사츠 가부시키가이샤 | Deposition mask, method of manufacturing deposition mask and metal plate |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPS5387849A (en) * | 1977-01-10 | 1978-08-02 | Hamasawa Kogyo:Kk | Preparation of electroforming matrix for use in the production of outerblade of electric razor |
-
1985
- 1985-04-19 CA CA000479595A patent/CA1269342A/en not_active Expired
- 1985-04-24 JP JP8845885A patent/JPS619592A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS619592A (en) | 1986-01-17 |
| JPH0136557B2 (en) | 1989-08-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKLA | Lapsed |