JP2695752B2 - Electrodeposited image forming method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming an image of, for example, a rose letter or a decorative part for a watch by an electrodeposition method, transferring this image (electrodeposited image) to a support such as a film, or the like. The present invention relates to a method for forming an electrodeposited image attached to an adherend such as a display panel.

[0002]

2. Description of the Related Art In recent years, in the case of articles having minute and complicated shapes, such as rose letters and decorative parts for watches, a resist film is formed on the surface of a metal plate except for these image forming portions. By forming, a conductive portion along the shape of these images is formed on the surface of the metal plate, and a metal is deposited on the conductive portion by an electrodeposition method to form an electrodeposited image. Is temporarily transferred to a supporting substrate such as a film via an adhesive and held, and then the electrodeposited image is transferred again to an adherend such as a timepiece display plate while being peeled off from the supporting substrate via the adhesive. That is widely done.

In order to transfer an electrodeposited image to a supporting substrate,
The electrodeposited image has to be peeled off from the metal plate. At this time, it is necessary to deform the supporting substrate, the metal plate, or both. Whichever method is used, stress is applied to the electrodeposited image when the metal plate and the supporting base material are separated. For example, at the point of peeling as shown in FIG. 15, the electrodeposited image tries to maintain rigidity, but since the metal plate or the supporting base material is deformed, stress is added to the electrodeposited image and temporarily Distorted. When the peeling is completed, the electrodeposited image tries to return to the original shape instantly, so that the electrodeposited image itself may resemble a spring and scatter. For this reason, the electrodeposited image was not transferred to the supporting substrate, and the yield was sometimes reduced.

When an excessive stress is applied to an electrodeposited image as described above, the stress remains in the electrodeposited image,
There is also a problem that the electrodeposited image (rose letters) may be deformed after attaching to an adherend.

Further, conventionally, since an electrodeposited image was formed directly on a metal plate, it was difficult to repeatedly use the metal plate. In addition, since the surface roughness of the metal plate has a large effect on the surface roughness of the back side of the electrodeposited image, a step of mirror-finishing the surface of the metal plate was required to obtain a smooth electrodeposited image on the back side. . Similarly, when the surface of the metal plate is rough, the resist film used for forming the electrodeposited image does not adhere to the metal plate, and thus there is a problem that burrs are generated around the obtained electrodeposited image.

[0006]

SUMMARY OF THE INVENTION An object of the present invention is to provide a method for forming an electrodeposited image which can be easily manufactured with a high yield.

Another object of the present invention is to reduce the stress applied to the electrodeposited image when the electrodeposited image is transferred to a supporting substrate, and to prevent the deformation of the electrodeposited image generated after the image is adhered to an adherend. And

Another object of the present invention is to provide a method for forming an electrodeposited image that can use a metal plate semipermanently. Still another object of the present invention is to provide a method for forming a high-quality electrodeposited image having a smooth back surface and no defects such as burrs without mirror-finishing the surface of a metal plate.

[0009]

In order to achieve the above object, a method for forming an electrodeposited image according to the present invention comprises forming a conductive film on the surface of a metal plate, and forming the electrodeposited image on the conductive film surface. The electrodeposited image is peeled and transferred from the metal plate together with the conductive film to the pressure-sensitive adhesive layer of the supporting base material provided with the pressure-sensitive adhesive layer, and the conductive film is peeled from the electrodeposited image. Then, a fixing adhesive layer is formed on the exposed surface of the electrodeposited image, and the electrodeposited image is peeled off from the support substrate, and the electrodeposited image is adhered to the surface of the adherend via the fixing adhesive layer. It is characterized in that it is attached to

Prior to the formation of the conductive film, it is preferable that the surface of the metal plate be subjected to a release treatment. Before the formation of the electrodeposited image, the surface of the conductive film is subjected to a release treatment corresponding to the electrodeposited image. It is preferable to apply it.

[0011]

According to the present invention constructed as described above, when the electrodeposited image is transferred to the pressure-sensitive adhesive layer of the supporting substrate, the metal plate and the conductive film are peeled off. The electrodeposited image formed on the coating is transferred onto the pressure-sensitive adhesive layer of the supporting substrate. Since the conductive film can be separated from the metal plate with a relatively small force, no excessive stress is applied to the electrodeposited image. Therefore, since the internal stress does not remain in the electrodeposited image, the electrodeposited image does not deform after being attached to the adherend. In addition, since the electrodeposited image is peeled between the supporting base material and the conductive film, the electrodeposited image is not scattered even when stress is applied at the time of peeling.

Further, according to this method, the metal plate is hardly deformed and can be used semi-permanently. In addition, a high quality electrodeposited image having a smooth back surface and no defects such as burrs can be manufactured without mirror finishing the metal plate surface.

[0013]

Embodiments of the present invention will be described below with reference to the drawings. In this embodiment, an example is shown in which a rose character for a watch is used as an electrodeposited image and is attached to the surface of a display plate for a watch (an adherend). However, the present invention is not limited to the rose character for a watch. Can be applied to the production of various decorative characters and symbols.

First, as shown in FIG. 1, a conductive film 2 is formed on the surface of a metal plate 1 such as stainless steel. The conductive film 2 is a flexible thin film having conductivity. As such a conductive film 2, a conductive metal thin film, a conductive paint film, a conductive polymer thin film, or the like formed by electrolytic plating (electrodeposition) or electroless plating is used. A metallic thin film is used. Conductive coating 2
Is not particularly limited, but is usually 10 to 50 μm.
m, preferably about 20 to 30 μm.

The conductive film 2 is separated from the surface of the metal plate 1 in a later step. Therefore, the conductive coating 2
It is preferable that the surface of the metal plate 1 be subjected to a release treatment before the formation of the conductive film 2 in order to facilitate the peeling of the conductive film 2. The release treatment is performed, for example, by treating the surface of the metal plate 1 with a surface oxidation by anodic electrolysis, a surfactant or the like.

Next, an electrodeposited image is formed on the surface of the conductive film 2 according to a conventional method. This specific method is disclosed in
No. 9-16989, JP-A-3-107496, and the like. Without any limitation,
Hereinafter, a general method for forming an electrodeposited image will be described.

In this example, a rose character for a watch is used as an electrodeposited image, and the image is attached to the surface of a watch display plate (an adherend). First, as shown in FIG. Negative or positive electrodeposited image photomask film 3
Is created by a photograph, printing, or the like.

FIG. 1 shows a positive film.
The film 3 has a target image FIG. 4 constituting the rose letters 3, 6, 9 and 12 for a clock, and a rectangular frame-shaped guide image 5 surrounding the target image FIG. Are indicated by oblique lines in black ink or the like, and guide marks 6 are drawn in white at predetermined positions inside the guide image FIG.

On the other hand, as shown in FIG. 3, a photoresist 7 such as a liquid resist, a dry film resist or a printing resist ink is applied to the upper surface of the conductive film 2 and baked. .

Then, as shown in FIG. 4, the film 3 is placed on the conductive film 2 with a photoresist 7 interposed therebetween, and in this state, exposure is performed by an exposure machine or the like. The shaded portion in FIG. 3 is a portion that blocks light corresponding to the target image FIG. 4 and the guide image FIG. 5).

After the exposure, development is carried out to remove the unexposed photoresist 7a (see FIG. 4), whereby the target image shown in FIG. A conductive portion 8 (also referred to as an electrodeposited image corresponding surface) having a shape following the shape of the guide image FIG. 5 is formed. Next, if necessary, the surface of the conductive portion 8 (the surface corresponding to the electrodeposited image)
Is subjected to a release treatment. When the release treatment is performed, an electrodeposited image formed later can be easily peeled off from the conductive film 2. This release processing is performed by the same method as described above.

Next, as shown in FIG. 6, a metal is deposited on the conductive portion 8 by an electrodeposition method (electrodeposition image method).
An electrodeposition image 9 having a shape along the shape of the target image FIG.
An electrodeposition image 10 is formed along the shape of the guide image FIG.

The electrodeposited image 9 has numerals 3, 6, 9 or 12 when viewed from a plane, but is illustrated as having these widths in the drawings. Also,
A guide hole (not shown) penetrating along the shape of the guide mark 6 is formed inside the electrodeposited image 10.

Here, when nickel is used as the metal forming the electrodeposited images 9 and 10, for example, nickel sulfate is used as the watt liquid, so that nickel is electrodeposited on the conductive portion 8. The electrodeposition conditions at this time are as follows: for example, a current of 3 A / dm ² is applied to an electrodeposition effective area of 150 mm × 150 mm to obtain an electrodeposition image of 100 μm ± 10 μm in 3 hours. Can be.

In addition to the above nickel, gold, silver, copper,
Of course, any metal such as iron or an alloy may be deposited on the conductive portion 8 to form an electrodeposited image, and by changing the electrodeposition conditions, for example, 20 to 300 μm
Electrodeposited images of any thickness can be obtained within the range of the order.

Next, as shown in FIG. 7, after the photoresist 7 on the conductive film 2 is removed by dipping in a solution,
The surfaces of the electrodeposited images 9 and 10 can be subjected to decoration (coloring) such as metal plating as a surface treatment, electrodeposition coating, spray coating, printing, electrostatic coating, or vacuum deposition as required. .

After forming the electrodeposited images 9 and 10 along the desired shape on the surface of the conductive film 2 by the electrodeposition method in this way, as shown in FIG. Is transferred onto the pressure-sensitive adhesive layer 12 of the supporting substrate 11 such as a film, and at this time, the conductive coating 2 is simultaneously peeled off. That is, peeling is performed at the interface between the conductive coating 2 and the metal plate 1, and the electrodeposited images 9 and 10 are displayed on the conductive coating 2 and the supporting substrate 1.
1. Peeling while sandwiching between 1. As a result, the electrodeposition images 9 and 10 are prevented from being scattered, so that the electrodeposition images can be manufactured with high yield. In addition, since the electrodeposited image and the metal plate can be peeled without being substantially deformed, no stress remains in the electrodeposited image, and no deformation occurs even after being attached to the adherend. Another advantage is that the metal plate can be used repeatedly. Also, when a film having a high surface smoothness, for example, an electrolytic plating film (electrodeposited film) or the like is used as the conductive film 2, the back surface of the electrodeposited image becomes smooth, so that it can be stuck to an adherend without fail. Become. Moreover, since the photoresist also adheres to the conductive film 2 having a high surface smoothness, the occurrence of burrs can be prevented, and a high quality electrodeposited image can be obtained.

The pressure-sensitive adhesive layer 12 can be formed of, for example, a UV-curable, heat-curable, or even time-curable pressure-sensitive adhesive. Here, typical examples of the UV-curable pressure-sensitive adhesive include an addition polymerizable compound having two or more unsaturated bonds and a photopolymerizable compound such as an alkoxysilane having an epoxy group, a carbonyl compound and an organic sulfur compound, Rubber-based pressure-sensitive adhesives and acrylic-based pressure-sensitive adhesives containing a photopolymerization initiator such as a peroxide, an amine, or an onium salt-based compound (JP-A-60-1969).
No. 56). The amount of the photopolymerizable compound and the photopolymerization initiator is 10 to 100 parts by weight of the base polymer.
500 parts by weight and 0.1 to 20 parts by weight are common.

As the acrylic polymer, those which are customary (JP-B-57-54068, JP-B-58-339)
In addition to those having a radical-reactive unsaturated group in the side chain (see JP-B-61-56264).
Alternatively, those having an epoxy group in the molecule can also be used.

Examples of the addition polymerizable compound having two or more unsaturated bonds include, for example, polyhydric alcohol esters and oligoesters of acrylic acid and methacrylic acid, epoxy compounds and urethane compounds.

Further, an epoxy group-functional crosslinking agent having one or more epoxy groups in the molecule, such as ethylene glycol diglycidyl ether, can be added to enhance the crosslinking effect.

When the pressure-sensitive adhesive layer 12 is formed using an ultraviolet-curable adhesive, it is necessary to use a transparent film or the like as the support substrate 11 in order to enable an ultraviolet irradiation treatment.

Representative examples of heat-curable pressure-sensitive adhesives include polyisocyanates, melamine resins, and amine-based pressure-sensitive adhesives.
A rubber compound containing a crosslinking agent such as an epoxy resin, a peroxide, or a metal chelate compound, and a crosslinking regulator comprising a polyfunctional compound such as divinylbenzene, ethylene glycol diacrylate, or trimethylolpropane trimethacrylate, if necessary. Pressure-sensitive adhesives and acrylic pressure-sensitive adhesives are exemplified.

Further, as a time-curable pressure-sensitive adhesive,
One in which the adhesive strength is reduced by evaporating the compounded solvent over time is mentioned. Next, after reducing the adhesive force of the pressure-sensitive adhesive layer 12 as necessary, FIG.
As shown in (1), the fixing adhesive layer 14 is formed on the exposed surface of the electrodeposited image (the surface to be later attached to the adherend) via the mask 13 and the like. Next, the mask 13 is removed, and an electrodeposition image is attached to the adherend 15 as shown in FIG. When not used immediately, the release paper 16 is adhered to the fixing adhesive layer side as shown in FIG.
Peel off and use.

In the present invention, after the adhesive force of the pressure-sensitive adhesive layer 12 is reduced, as shown in FIG.
A fixing adhesive 14 having an adhesive force stronger than the adhesive force of the pressure-sensitive adhesive layer 12 can be applied to the entire surface of the support base 11 on the electrodeposition image holding side. Thereafter, release paper 16 is adhered to the surface to which the fixing adhesive 14 is applied, if necessary.

Here, when the pressure-sensitive adhesive layer 12 is formed of an ultraviolet-curable pressure-sensitive adhesive, the support substrate 11 is formed from the surface side of the electrodeposited images 9, 10, ie, the electrodeposited image 9. , 10
As shown in the figure, the adhesive force of the pressure-sensitive adhesive layer 12 is changed to an extremely weak adhesive force by irradiating ultraviolet rays from the side opposite to the holding side.

When the pressure-sensitive adhesive layer 12 is formed of a heat-curable pressure-sensitive adhesive, the support base material 11 is heated to further form a time-curable pressure-sensitive adhesive. In this case, the adhesive force of the pressure-sensitive adhesive layer 12 is changed to an extremely weak adhesive force by giving a temporal change.

After the fixing adhesive 14 is applied to the supporting substrate 11 on the side where the electrodeposited images 9 and 10 are held, the adhesive force of the pressure-sensitive adhesive layer 12 is reduced in the same manner as described above. May be.

Next, as shown in FIG. 13, the surface of a timepiece display plate 15 ′ as the adherend 15 is fixed via the fixing adhesive 14 applied to the electrodeposited image holding side of the support base material 11. The electrodeposited images 9 and 10 are adhered and fixed while being separated from the support base material 11.

Here, as shown in FIG. 14, guide pins 17 are projected from a holding plate 16 holding a timepiece display plate 15 ', and the guide pins 17 and the electrodeposition image 10 are provided.
Electrodeposited image 9 through a guide hole (not shown) provided in
Can be positioned with respect to the timepiece display plate 15 '.

At this time, as described above, since the adhesive force of the pressure-sensitive adhesive layer 12 has been reduced, the state is the same as holding the electrodeposited images 9 and 10 with a weak adhesive. The electrodeposited image 9 is affixed to the surface of the timepiece display panel (adherend) 15 ′ while peeling off the electrodeposited image 9 from the support substrate 11 via the fixing adhesive 14 applied to the electrodeposited image holding side of the substrate 11. be able to.

The adhesive force at the interface between the pressure-sensitive adhesive layer 12 and the fixing adhesive 14 is better than that of the timepiece display panel 1.
By selecting the two adhesives 12 and 14 so as to be larger than the bonding force at the interface between 5 'and the fixing adhesive 14, the fixing adhesive 14 is prevented from adhering to the timepiece display panel 15'. be able to.

For example, when an acrylic pressure-sensitive adhesive containing a photopolymerizable compound and a photopolymerization initiator is used as the pressure-sensitive adhesive forming the pressure-sensitive adhesive layer 12, the fixing adhesive 14 is used. An adhesive of the same kind as the pressure-sensitive adhesive forming the pressure-sensitive adhesive layer 12, that is, an acrylic pressure-sensitive adhesive is used only for the base polymer not containing the photopolymerizable compound and the photopolymerization initiator. After the application, the mixture is aged for 9 hours in an atmosphere of 40 ° C., so that the adhesive force at the interface between the pressure-sensitive adhesive layer 12 and the fixing adhesive 14 is higher than that of the timepiece display panel 15 ′ and the fixing adhesive. 14 can be made larger than the bonding force at the interface with. Then, it can be peeled and removed without leaving the adhesive other than the fixing portion. As described above, the bonding force at the interface between the pressure-sensitive adhesive layer 12 and the fixing adhesive 14 after the bonding force has decreased is smaller than the bonding force at the interface between the adherend 15 and the fixing adhesive 14. By selecting both adhesives so as to increase the support base material 11
By applying the fixing adhesive 14 to the entire surface of the electrodeposited image holding side, the troublesome operation of applying the adhesive only to the back surface of the electrodeposited image can be eliminated, and the process can be simplified.

[0044]

According to the present invention, when the electrodeposited image is transferred to the pressure-sensitive adhesive layer of the supporting base material, the electrodeposited image is peeled off between the metal plate and the conductive film to form the conductive film together with the electrodeposited image. Transcribed. Since this peeling can be performed with a relatively small force, no excessive stress is applied to the electrodeposited image. Therefore, since no internal stress remains in the electrodeposited image, no deformation occurs after attaching to the adherend. In addition, since the electrodeposited image is peeled between the supporting base material and the conductive film, the electrodeposited image is not scattered even if excessive stress is applied at the time of peeling. Further, according to this method, the metal plate can be used semipermanently. Also, a high quality electrodeposited image having a smooth surface and no defects such as burrs can be produced without mirror-finish processing the metal plate surface.

[Brief description of the drawings]

FIG. 1 is a normal sectional view in which a conductive film is formed on a metal plate.

FIG. 2 is a plan view showing an example of a photomask film for an electrodeposition image.

FIG. 3 is a sectional view showing a state where a photoresist is laminated on a conductive film.

FIG. 4 is a sectional view showing a state at the time of exposure.

FIG. 5 is a cross-sectional view showing a developed state after exposure.

FIG. 6 is a cross-sectional view showing a state after electrodeposition after development.

FIG. 7 is a cross-sectional view showing a state where a photoresist is removed after electrodeposition.

FIG. 8 is a cross-sectional view showing a state in which an electrodeposited image is transferred and held on a supporting substrate together with a conductive film.

FIG. 9 is a cross-sectional view showing a state in which a fixing adhesive is formed on an exposed surface of an electrodeposited image via a mask.

FIG. 10 is a cross-sectional view showing a state where an electrodeposition image is applied to an adherend.

FIG. 11 is a cross-sectional view showing a state in which release paper is attached to the fixing adhesive layer.

FIG. 12 is a cross-sectional view showing a state in which the adhesive force of the pressure-sensitive adhesive layer is reduced, a fixing adhesive is applied to the electrodeposited image holding surface side of the support substrate, and a release paper is attached to the applied surface. .

FIG. 13 is a cross-sectional view showing a state where an electrodeposition image is adhered to an adherend.

FIG. 14 is a perspective view showing an adherend on which an electrodeposition image is adhered.

FIG. 15 is a cross-sectional view illustrating a conventional method of peeling an electrodeposited image.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 metal plate 2 conductive coating 9, 10 electrodeposited image 11 support base material 12 pressure-sensitive adhesive layer 14 fixing adhesive 15, 15 ′ adherend (watch display panel)

Claims (3)

(57) [Claims] A conductive film formed on a surface of a metal plate; an electrodeposited image formed on a surface of the conductive film; and a pressure-sensitive adhesive layer provided on a support substrate provided with a pressure-sensitive adhesive layer. The electrodeposited image is peeled and transferred from the metal plate together with the conductive film, the conductive film is peeled from the electrodeposited image, a fixing adhesive layer is formed on an exposed surface of the electrodeposited image, and A method for forming an electrodeposited image, comprising attaching the electrodeposited image to the surface of an adherend via the fixing adhesive layer while peeling off the electrodeposited image. 2. A method according to claim 1, wherein a conductive film is formed by electrodeposition after the surface of said metal plate is subjected to a release treatment. 3. The method for forming an electrodeposited image according to claim 1, wherein an electrodeposition image is formed after a release treatment is performed on a surface of the conductive film corresponding to the electrodeposited image.