JPH0573226B2 - - Google Patents
Info
- Publication number
- JPH0573226B2 JPH0573226B2 JP61174839A JP17483986A JPH0573226B2 JP H0573226 B2 JPH0573226 B2 JP H0573226B2 JP 61174839 A JP61174839 A JP 61174839A JP 17483986 A JP17483986 A JP 17483986A JP H0573226 B2 JPH0573226 B2 JP H0573226B2
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- adhesive
- base material
- paper
- holding paper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000853 adhesive Substances 0.000 claims description 48
- 230000001070 adhesive effect Effects 0.000 claims description 48
- 239000000463 material Substances 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 17
- 238000007747 plating Methods 0.000 claims description 6
- 238000004070 electrodeposition Methods 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000003755 preservative agent Substances 0.000 description 3
- 230000002335 preservative effect Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 241000779819 Syncarpia glomulifera Species 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000001739 pinus spp. Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 229940036248 turpentine Drugs 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/34—Imagewise removal by selective transfer, e.g. peeling away
- G03F7/346—Imagewise removal by selective transfer, e.g. peeling away using photosensitive materials other than non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明は、文字、模様その他パターンの形成
方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for forming characters, patterns and other patterns.
（従来の技術）
従来この種パターンの形成方法として、エツチ
ング手段によるものは、特公昭56−3432号公報
で、また電鋳手段によるものは特開昭59−16989
号公報で、更に感光性樹脂によるものは、特開昭
54−18732号公報において、それぞれ知られてい
る。(Prior art) As a conventional method for forming this type of pattern, a method using etching means is disclosed in Japanese Patent Publication No. 56-3432, and a method using electroforming method is disclosed in Japanese Patent Application Laid-open No. 59-16989.
In addition, the one made of photosensitive resin is disclosed in Japanese Patent Application Laid-open No.
54-18732, respectively.
（発明が解決しようとする問題点）
ところで以上のごとく形成されるパターンは、
被接合体に接着固定させるべく、その何れも裏面
側に接着剤を塗布する必要があるが、この接着剤
を塗布する場合、該接着剤を前記パターンに正確
に塗布することは極めて困難であり、ややもする
と前記接着剤が前記パターンからはみ出して、該
パターンの前記被接合体への接着固定時に、前記
接着剤のはみ出し部分にゴミ、ホコリなどが付着
して汚れとなり、この汚れを除去することは非常
に厄介であるばかりか、製造コストの増大をもた
らすなどの問題があつた。(Problem to be solved by the invention) By the way, the pattern formed as described above is
It is necessary to apply adhesive to the back side of each of them in order to adhere and fix them to the object to be joined, but when applying this adhesive, it is extremely difficult to apply the adhesive accurately to the pattern. If the adhesive protrudes from the pattern, dirt, dust, etc. will adhere to the protruding portion of the adhesive and become dirty when the pattern is adhered and fixed to the object to be joined, and this dirt will be removed. This was not only very troublesome, but also caused problems such as increased manufacturing costs.
本発明は以上のごとき問題に鑑みて成したもの
で、その目的とする所は、紫外線硬化形の接着剤
を使用することにより、はみ出しを発生したりす
ることなく、前記パターンに接着剤を正確に、し
かも簡単に付着させて得て、製造コストを低廉な
らしめることができるパターンの形成方法を提供
することにある。 The present invention has been made in view of the above problems, and its purpose is to accurately apply the adhesive to the pattern without causing any overflow by using an ultraviolet curing adhesive. Moreover, it is an object of the present invention to provide a method for forming a pattern which can be easily attached and obtained, and which can reduce the manufacturing cost.
（問題点を解決するための手段）
本発明にかかるパターンの形成方法は、図面に
示したごとく、基材１の一側外表面に、文字、模
様などのパターン６を、前記基材１に対し分離可
能にメツキ手段により盛上げ形成し、この後前記
パターン６の外表面に保持紙７を接着させて、該
保持紙７側に前記パターン６を転着すると共に、
外表面に紫外線硬化形の接着剤８が塗布された離
形紙９を用い、該離形紙９の前記接着剤８側に、
前記保持紙７に接着保持された前記パターン６を
当接させて、該パターン６の外方から前記接着剤
８を紫外線照射することにより、この接着剤８の
前記パターン６との非対向部分のみを硬化させ
て、該パターン６の対向部分は硬化させることな
く未硬化状態に保持し、この後前記保持紙７を、
前記パターン６側に未硬化状態の接着剤８を転写
残存させた状態で、前記離形紙９から剥離し、前
記パターン６を被接合体１０に前記未硬化状態の
接着剤８を介して接着させるようにしたことを特
徴とするものである。(Means for Solving the Problems) As shown in the drawings, the pattern forming method according to the present invention is to form a pattern 6 such as letters or patterns on the outer surface of one side of the base material 1. The pattern 6 is formed in a heap by plating means so that it can be separated, and then a holding paper 7 is adhered to the outer surface of the pattern 6, and the pattern 6 is transferred to the holding paper 7 side.
Using a release paper 9 whose outer surface is coated with an ultraviolet curable adhesive 8, on the adhesive 8 side of the release paper 9,
By bringing the pattern 6 adhesively held onto the holding paper 7 into contact and irradiating the adhesive 8 with ultraviolet rays from outside of the pattern 6, only the portion of the adhesive 8 not facing the pattern 6 is removed. is cured, the opposing portion of the pattern 6 is held in an uncured state without being cured, and then the holding paper 7 is
With the uncured adhesive 8 transferred and remaining on the pattern 6 side, it is peeled off from the release paper 9, and the pattern 6 is bonded to the object to be joined 10 via the uncured adhesive 8. This feature is characterized in that it allows the user to
（作用）
しかして以上のごとく、紫外線硬化形の接着剤
８を使用して、紫外線照射で該接着剤８のパター
ン６との非対向部分を硬化させ、かつ対向部分を
未硬化状態として前記パターン６側に転写残存さ
せることにより、このパターン６に前記接着剤８
が、はみ出しを発生したりすることなく、正確か
つ簡単に付着されて、製造コストが低廉となるも
のである。(Function) As described above, by using the ultraviolet curable adhesive 8, the portion of the adhesive 8 not facing the pattern 6 is cured by UV irradiation, and the portion facing the pattern 6 is left in an uncured state. By leaving the adhesive 8 on the pattern 6 side, the adhesive 8 is applied to the pattern 6.
However, it can be attached accurately and easily without causing any protrusion, and the manufacturing cost is low.
（実施例）
以下本発明にかかるパターンの形成方法を図面
の実施例によつて説明する。(Example) The method of forming a pattern according to the present invention will be explained below with reference to the examples of the drawings.
先ず、第１図の工程イ，ロに示すごとく、ステ
ンレス板などから成る基材１を用い、該基材１の
一側外表面に写真感光性樹脂から成るレジスト層
２を塗布する。 First, as shown in steps A and B of FIG. 1, a base material 1 made of a stainless steel plate or the like is used, and a resist layer 2 made of a photosensitive resin is coated on one outer surface of the base material 1.
次に、工程ハに示すごとく、前記基材１のレジ
スト層２側に写真フイルム３を当接させ、該写真
フイルム３の外方から前記レジスト層２を露光さ
せて現像することにより、工程ニに示したごと
く、前記基材１にレジスト層２の一部を残存形成
する。 Next, as shown in step C, a photographic film 3 is brought into contact with the resist layer 2 side of the base material 1, and the resist layer 2 is exposed and developed from the outside of the photographic film 3. As shown in FIG. 2, a portion of the resist layer 2 is formed to remain on the base material 1.
前記レジスト層２は、前記基材１上にマスキン
グ剤を印刷して形成することもでき、また前記レ
ジスト層２は、フオトレジスト剤を用いて形成す
ることも可能であり、更に切紙などで形成するこ
ともできる。 The resist layer 2 can be formed by printing a masking agent on the base material 1, and the resist layer 2 can also be formed by using a photoresist agent, and can also be formed by cutting paper or the like. You can also.
そして、工程ホに示すごとく、前記レジスト層
２の一部が残存された前記基材１をメツキ槽４に
浸漬して、前記基材１を陰極とし、かつ銅、ニツ
ケルなどの金属５を陽極として、これら基材１と
金属５との間でメツキ処理を行うことにより、前
記基材１上で前記残存レジスト層２間に、前記金
属５によるパターン６を盛上げ形成する。 Then, as shown in step E, the base material 1 on which a part of the resist layer 2 remains is immersed in a plating bath 4, and the base material 1 is used as a cathode, and the metal 5 such as copper or nickel is used as an anode. By performing a plating process between the base material 1 and the metal 5, a pattern 6 of the metal 5 is formed on the base material 1 between the remaining resist layers 2 in a raised manner.
更に工程ヘに示すごとく、前記基材１上に盛上
げ形成されたパターン６の外表面に、接着剤７ａ
を塗布した保持紙７を接着し、この後工程トに示
したごとく、前記保持紙７を前記基材１側から剥
離することにより、前記パターン６を前記基材１
側から分離させて、前記保持紙７側に転着させる
のである。 Further, as shown in step 1, an adhesive 7a is applied to the outer surface of the pattern 6 formed on the base material 1.
The pattern 6 is attached to the base material 1 by adhering the retaining paper 7 coated with a
It is separated from the side and transferred to the holding paper 7 side.
この場合、前記基材１として、例えばステンレ
スなどから成る金属板を用い、また前記パターン
６を形成する金属として銅又はニツケルなどを使
用することにより、前記パターン６上に接着した
前記保持紙７の剥離で、該保持紙７側に前記パタ
ーン６を簡単に転着できるものである。 In this case, by using a metal plate made of, for example, stainless steel as the base material 1 and using copper or nickel as the metal forming the pattern 6, the holding paper 7 bonded onto the pattern 6 may be By peeling off, the pattern 6 can be easily transferred to the holding paper 7 side.
尚、本発明では、前記基材１として、前述した
金属板に限らず、例えばプラスチツク板などの使
用も可能であり、この場合には前記プラスチツク
板などの表面を通電可能に処理して使用するので
ある。 In the present invention, the base material 1 is not limited to the metal plate described above, but may also be a plastic plate, for example, and in this case, the surface of the plastic plate is treated to conduct electricity. It is.
次に、工程チに示したごとく、一側外表面に紫
外線硬化形の接着剤８を塗布した離形紙９を形成
して、この離形紙９の前記接着剤８側に前記保持
紙７に転着された前記パターン６を当接させ、し
かる後に前記保持紙７の外方から前記接着剤８に
対し、紫外線ランプＬで紫外線照射を行うことに
より、前記接着剤８の前記パターン６との非対向
部分のみを硬化させ、かつ該パターン６との対向
部分、つまり前記工程チ図の斜線で示す部分は、
未硬化状態に保持する。 Next, as shown in step 1, a release paper 9 coated with an ultraviolet curable adhesive 8 on the outer surface of one side is formed, and the holding paper 7 is placed on the adhesive 8 side of the release paper 9. The pattern 6 of the adhesive 8 is brought into contact with the adhesive 8 by applying ultraviolet light to the adhesive 8 from outside the holding paper 7 using an ultraviolet lamp L. Only the non-opposing portions of the pattern 6 are cured, and the opposing portions of the pattern 6, that is, the hatched portions in the process diagram, are cured.
Keep in uncured state.
前記離形紙９に接着する接着剤８は、粘着性保
存剤（タツキフアイヤ）と、該保存剤の性能を損
なわずに紫外線により重合可能なアクリル系オリ
ゴマーと、紫外線硬化剤とから形成するものであ
り、前記粘着性保存剤としては、例えば天然ロジ
ン及びその誘導体、テレペン樹脂、石油樹脂、キ
シレン樹脂、スチレン樹脂及びその誘導体などを
挙げることができるのであり、また前記アクリル
系オリゴマーと前記紫外線硬化剤は、一般的に広
く用いられているものが採用されるのであり、従
つて詳細を挙げることは省略する。 The adhesive 8 that adheres to the release paper 9 is formed from a tacky preservative, an acrylic oligomer that can be polymerized by ultraviolet light without impairing the performance of the preservative, and an ultraviolet curing agent. Examples of the adhesive preservative include natural rosin and its derivatives, turpentine resin, petroleum resin, xylene resin, styrene resin and its derivatives, and the acrylic oligomer and the ultraviolet curing agent. is generally widely used, and therefore details thereof will be omitted.
そして前記保持紙７を前記離形紙９側から剥離
することにより、工程リに示したごとく、前記紫
外線照射により硬化された接着剤部分は、前記離
形紙９側に残存させ、かつ前記未硬化状態の接着
剤８を前記保持紙７の前記パターン６側に転写残
存させる。 Then, by peeling off the holding paper 7 from the release paper 9 side, the adhesive portion cured by the ultraviolet irradiation remains on the release paper 9 side, and The cured adhesive 8 is transferred and left on the pattern 6 side of the holding paper 7.
次に、工程ヌに示したごとく、前記保持紙７に
保存された前記パターン６側を、複数の取付脚１
０ａをもつた被転写体１０に当接させて、前記パ
ターン６を前記未硬化状態の接着剤８を介し前記
被転写体１０に接着させるのであり、しかる後工
程ルに示したごとく、前記保持紙７を剥離するこ
とにより、前記被転写体１０の外表面に、前記接
着剤８を介して前記パターン６が転写固定され、
第２図に示すごときパターン製品が形成されるの
である。 Next, as shown in step No. 2, the pattern 6 side saved on the holding paper 7 is attached to a plurality of mounting legs 1.
The pattern 6 is brought into contact with the transferred object 10 having the adhesive 0a, and the pattern 6 is adhered to the transferred object 10 via the uncured adhesive 8. By peeling off the paper 7, the pattern 6 is transferred and fixed to the outer surface of the transfer target 10 via the adhesive 8,
A pattern product as shown in FIG. 2 is formed.
前記被転写体１０は、第３図に示したごとく、
前記未硬化状態の接着剤８と対向する部分を凹嵌
形成して、この凹部１０ｂに前記接着剤８を凹入
させて、前記パターン６を前記被接合体１０と面
一状に接着させるようにすることも可能であり、
斯くする場合には、前記接着剤８が外部に露見す
ることがなく、外観に優れたものとなる。 The transferred object 10, as shown in FIG.
A portion facing the uncured adhesive 8 is formed in a recessed manner, and the adhesive 8 is recessed into the recessed portion 10b, so that the pattern 6 is adhered flush with the object to be joined 10. It is also possible to
In this case, the adhesive 8 is not exposed to the outside, resulting in an excellent appearance.
また前記被転写体１０には、複数の取付脚１０
ａを設けて、該取付脚１０ａを介して任意製品な
どに取付けるようにしているが、本発明では前記
パターン６を前記接着剤８を介して任意の製品に
直接接着させるようにしてもよいのである。 Further, the transfer target 10 has a plurality of mounting legs 10.
a, and the pattern 6 is attached to an arbitrary product via the mounting leg 10a, but in the present invention, the pattern 6 may be directly attached to an arbitrary product via the adhesive 8. be.
更に、前述した工程ホにおいて、前記基材１上
に形成されたパターン６の外表面には、電着塗装
を施してもよく、斯くする場合には前記パターン
６の意匠的外観を良好となすことができる。 Furthermore, in the above-mentioned step (e), the outer surface of the pattern 6 formed on the base material 1 may be coated with electrodeposition, and in this case, the design appearance of the pattern 6 can be improved. be able to.
また前記パターン６は、前記電着塗装を施した
後に、該電着塗装面の外表面に着色するようにし
てもよく、斯くする場合には前記パターン６の意
匠的外観を更に高め得るのである。 Further, the pattern 6 may be formed by coloring the outer surface of the electrodeposited surface after the electrodeposition coating is applied, and in this case, the design appearance of the pattern 6 can be further enhanced. .
また前記パターン６の外表面には、前述した工
程ヘにおいて、前記保持紙７が接着されることか
ら、前記パターン６が、例えそれぞれ独立したバ
ラ状のパターンであつても、これらパターンを前
記保持紙７で保持することができるのであり、従
つて本発明では、１つの連続したパターンに限ら
ず、バラ状パターンの形成にも適用できるのであ
る。 In addition, since the holding paper 7 is adhered to the outer surface of the pattern 6 in the step described above, even if the patterns 6 are independent rose-like patterns, these patterns cannot be held in the holding paper 7. Therefore, the present invention is applicable not only to the formation of one continuous pattern but also to the formation of discrete patterns.
（発明の効果）
以上説明したごとく本発明にかかるパターンの
形成方法では、基材１の一側外表面に、文字、模
様などのパターン６を、前記基材１に対し分離可
能にメツキ手段により盛上げ形成し、この後前記
パターン６の外表面に保持紙７を接着させて、該
保持紙７側に前記パターン６を転着すると共に、
外表面に紫外線硬化形接着剤８が塗布された離形
紙９を用い、該離形紙９の前記接着剤８側に、前
記保持紙７に接着保持された前記パターン６を当
接させて、該パターン６の外方から前記接着剤８
を紫外線照射することにより、この接着剤８の前
記パターン６との非対向部分のみを硬化させて、
該パターン６の対向部分は硬化させることなく未
硬化状態に保持し、この後前記保持紙７を、前記
パターン６側に未硬化状態の接着剤８を転写残存
させた状態で、前記離形紙９から剥離し、前記パ
ターン６を被接合体１０に前記未硬化状態の接着
剤８を介して接着させるようにしたから、前記パ
ターン６に前記接着剤８を、はみ出しを発生した
りすることなく、正確かつ簡単に付着させ得るの
であり、従つて従来のごとく、ゴミやホコリなど
による汚れを招いたりすることなく、製造コスト
を低廉ならしめ得るに至つたのである。(Effects of the Invention) As explained above, in the pattern forming method according to the present invention, a pattern 6 such as letters or patterns is formed on the outer surface of one side of the base material 1 by plating means so as to be separable from the base material 1. After forming a heap, a holding paper 7 is adhered to the outer surface of the pattern 6, and the pattern 6 is transferred to the holding paper 7 side.
Using a release paper 9 whose outer surface is coated with an ultraviolet curable adhesive 8, the pattern 6 adhesively held on the holding paper 7 is brought into contact with the adhesive 8 side of the release paper 9. , the adhesive 8 from outside the pattern 6
By irradiating with ultraviolet rays, only the part of the adhesive 8 not facing the pattern 6 is cured,
The opposing portions of the pattern 6 are held in an uncured state without being cured, and then the holding paper 7 is attached to the release paper with the uncured adhesive 8 transferred and remaining on the pattern 6 side. Since the pattern 6 is peeled off from the pattern 6 and the pattern 6 is bonded to the object 10 via the uncured adhesive 8, the adhesive 8 can be applied to the pattern 6 without causing any overflow. , can be applied accurately and easily, and therefore, unlike conventional methods, there is no contamination caused by dirt or dust, and manufacturing costs can be reduced.
第１図は本発明にかかるパターンの形成方法を
説明する工程図、第２図は同形成方法で形成され
た製品の正面図、第３図は他の実施例を示す断面
図である。
１……基材、２……レジスト層、６……パター
ン、７……保持紙、８……紫外線硬化形接着剤、
９……剥離紙、１０……被転写体、１０ｂ……凹
部。
FIG. 1 is a process diagram explaining the pattern forming method according to the present invention, FIG. 2 is a front view of a product formed by the same forming method, and FIG. 3 is a sectional view showing another embodiment. 1... Base material, 2... Resist layer, 6... Pattern, 7... Holding paper, 8... Ultraviolet curable adhesive,
9...Release paper, 10...Transfer object, 10b...Recessed portion.
Claims (1)
ターン６を、前記基材１に対し分離可能にメツキ
手段により盛上げ形成し、この後前記パターン６
の外表面に保持紙７を接着させて、該保持紙７側
に前記パターン６を転着すると共に、外表面に紫
外線硬化形接着剤８が塗布された離形紙９を用
い、該離形紙９の前記接着剤８側に、前記保持紙
７に接着保持された前記パターン６を当接させ
て、該パターン６の外方から前記接着剤８を紫外
線照射することにより、この接着剤８の前記パタ
ーン６との非対向部分のみを硬化させて、該パタ
ーン６の対向部分は硬化させることなく未硬化状
態に保持し、この後前記保持紙７を、前記パター
ン６側に未硬化状態の接着剤８を転写残存させた
状態で、前記離形紙９から剥離し、前記パターン
６を被接合体１０に前記未硬化状態の接着剤８を
介して接着させるようにしたことを特徴とするパ
ターンの形成方法。 ２ 基材１の外表面に形成すべきパターン６に相
当するレジスト層２を設け、前記基材１をメツキ
処理することにより、該基材１に前記パターン６
を分離可能に盛上げ形成したことを特徴とする特
許請求の範囲第１項記載のパターンの形成方法。 ３ パターン６の外表面に電着塗装が施されてい
ることを特徴とする特許請求の範囲第１項記載の
パターンの形成方法。 ４ パターン６の外表面に電着塗装が施され、か
つこの電着塗装面の外表面が着色されていること
をことを特徴とする特許請求の範囲第１項記載の
パターンの形成方法。 ５ 被接合体１０に、パターン６に形成される未
硬化の接着剤８を凹入可能とした凹部１０ｂを形
成し、該凹部１０ｂに前記接着剤８を凹入させ
て、前記パターン６を前記被接合体１０を面一状
に接着させたことを特徴とする特許請求の範囲第
１項記載のパターンの形成方法。[Scope of Claims] 1. A pattern 6 such as letters or a pattern is formed on the outer peripheral surface of one side of the base material 1 by plating means so as to be separable from the base material 1, and then the pattern 6 is
A holding paper 7 is adhered to the outer surface of the holding paper 7, and the pattern 6 is transferred onto the holding paper 7 side. The pattern 6 adhesively held on the holding paper 7 is brought into contact with the adhesive 8 side of the paper 9, and the adhesive 8 is irradiated with ultraviolet rays from outside of the pattern 6. , only the part not facing the pattern 6 is cured, and the part facing the pattern 6 is kept in an unhardened state without being hardened, and then the holding paper 7 is placed on the pattern 6 side in an unhardened state. The pattern 6 is peeled off from the release paper 9 while the adhesive 8 remains transferred, and the pattern 6 is adhered to the object to be joined 10 via the uncured adhesive 8. How to form a pattern. 2. By providing a resist layer 2 corresponding to the pattern 6 to be formed on the outer surface of the base material 1 and plating the base material 1, the pattern 6 is formed on the base material 1.
2. The method of forming a pattern according to claim 1, wherein the pattern is formed in a separable raised pattern. 3. The method for forming a pattern according to claim 1, wherein the outer surface of the pattern 6 is coated with electrodeposition. 4. The pattern forming method according to claim 1, wherein the outer surface of the pattern 6 is electrocoated, and the outer surface of the electrocoated surface is colored. 5 A recess 10b into which the uncured adhesive 8 formed in the pattern 6 can be inserted is formed in the object to be joined 10, and the adhesive 8 is recessed into the recess 10b, so that the pattern 6 can be recessed into the pattern 6. 2. The method of forming a pattern according to claim 1, wherein the objects to be joined are adhered flush.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17483986A JPS6330843A (en) | 1986-07-25 | 1986-07-25 | Pattern forming method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17483986A JPS6330843A (en) | 1986-07-25 | 1986-07-25 | Pattern forming method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6330843A JPS6330843A (en) | 1988-02-09 |
| JPH0573226B2 true JPH0573226B2 (en) | 1993-10-13 |
Family
ID=15985555
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17483986A Granted JPS6330843A (en) | 1986-07-25 | 1986-07-25 | Pattern forming method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6330843A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2727470B2 (en) * | 1989-08-30 | 1998-03-11 | 松下電器産業株式会社 | Manufacturing method of ceramic sheet |
| DE102004004713A1 (en) * | 2004-01-30 | 2005-09-01 | Leonhard Kurz Gmbh & Co. Kg | Security element with partial magnetic layer |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49111619A (en) * | 1973-02-22 | 1974-10-24 | ||
| JPS49119623A (en) * | 1973-03-15 | 1974-11-15 | ||
| JPS50120617A (en) * | 1974-03-07 | 1975-09-22 |
-
1986
- 1986-07-25 JP JP17483986A patent/JPS6330843A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49111619A (en) * | 1973-02-22 | 1974-10-24 | ||
| JPS49119623A (en) * | 1973-03-15 | 1974-11-15 | ||
| JPS50120617A (en) * | 1974-03-07 | 1975-09-22 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6330843A (en) | 1988-02-09 |
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