CN1116663A - Forming of electric deposited picture sample - Google Patents
Forming of electric deposited picture sample Download PDFInfo
- Publication number
- CN1116663A CN1116663A CN94108573A CN94108573A CN1116663A CN 1116663 A CN1116663 A CN 1116663A CN 94108573 A CN94108573 A CN 94108573A CN 94108573 A CN94108573 A CN 94108573A CN 1116663 A CN1116663 A CN 1116663A
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- CN
- China
- Prior art keywords
- electrodeposition pattern
- pattern
- electrodeposition
- mentioned
- conductive film
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/20—Duplicating or marking methods; Sheet materials for use therein using electric current
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
- B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
- B44C1/16—Processes, not specifically provided for elsewhere, for producing decorative surface effects for applying transfer pictures or the like
- B44C1/165—Processes, not specifically provided for elsewhere, for producing decorative surface effects for applying transfer pictures or the like for decalcomanias; sheet material therefor
- B44C1/17—Dry transfer
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/003—3D structures, e.g. superposed patterned layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/22—Electroplating combined with mechanical treatment during the deposition
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Decoration By Transfer Pictures (AREA)
- ing And Chemical Polishing (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The invention relates to a formation method of an electrodeposition chart, which comprises that: a conductive coating and an electrodeposition pattern form on the surface of a metal sheet in sequence; the electrodeposition pattern and the coating are removed from the surface of the metal and transferred on a pressure-sensitive adhesive layer of a material for supporting matrix; and then the conductive coating is removed from the electrodeposition pattern; a binder layer for fixing forms on the exposed surface of the electrodeposition pattern, thus the binder layer is attached on adsorbate while the electrodeposition pattern is removed from the material for supporting matrix. According to the method of the invention, the metal sheet is free from deformation and can be used for a long time. Furthermore, the surface of the metal sheet is not necessary to be mirror-finished and the high-quality electrodeposition pattern with a smooth inner surface can be effectively produced.
Description
The present invention relates to a kind of formation method of electrodeposition pattern, promptly, by electrodip process form display text that clock and watch for example use and decorative element etc. pattern (as), this pattern (electrodeposition pattern) is transferred on the supporting mass such as film after, be attached at clock and watch being attached on the thing with display panel etc.
Recently, have at display text of using as clock and watch and decorative element etc. on the object of trickle, complicated shape, be extensive use of following transfer technique.
Form resist film on parts beyond these patterns on the surface of metal sheet form positions, on the surface of metal sheet, form conductive part thus by those pattern shape, on this conductive part by the electrodip process precipitating metal, form electrodeposition pattern, by binding agent this electrodeposition pattern is transferred to supporting such as film earlier with on the body material, and keep this pattern, then, pass through binding agent again, with this electrodeposition pattern when the body material of supporting strips down, be transferred to clock and watch and attached on the thing with display panel etc.
For electrodeposition pattern is transferred on the supporting substrate material, must strip down electrodeposition pattern from metal sheet, at this moment, be necessary to make the supporting substrate material distortion, or make the metal sheet distortion, or the two is deformed simultaneously.No matter adopt which kind of method, when metal sheet and supporting substrate material are peeled off, on electrodeposition pattern, produce stress.For example, as shown in figure 15, on pick-up point, the electrodeposition pattern desire keeps its rigidity, but because metal sheet or supporting substrate material have produced distortion, produces additional stress on electrodeposition pattern, and temporary strain deformation takes place.After peeling off end,, so fly out like regular meeting of electrodeposition pattern own such as the spring because electrodeposition pattern has the tendency of the original shape of returning in moment.Thereby such result is often arranged, and electrodeposition pattern is not transferred on the supporting substrate material, and its utilising efficiency reduces.
Another problem is, as mentioned above, when producing additional residual stress on electrodeposition pattern, then this stress-retained in electrodeposition pattern, and after this electrodeposition pattern (show and use literal) was attached at and is attached on the thing, generation was out of shape sometimes.
Also have a problem,, therefore want repeated multiple times to use metal sheet very difficult owing to all be directly on metal sheet, to form electrodeposition pattern in the past.And, because the surface smoothness of metal sheet is very big to lateral surface smoothness influence in the electrodeposition pattern, just must make mirror finish to metal sheet surface for obtaining the level and smooth electrodeposition pattern of inboard face.Equally,, then be used to form the resist film and the not driving fit of metal sheet of electrodeposition pattern, therefore, around the gained electrodeposition pattern, easily produce burr as the surface irregularity of metal sheet.
The objective of the invention is to, provide a kind of and can make formation method electrodeposition pattern, electrodeposition pattern easily, efficiently.
The present invention also aims to, a kind of formation method of electrodeposition pattern is provided, this method reduces to be additional to electrodeposition pattern stress when being transferred to electrodeposition pattern on the supporting substrate material, prevents that electrodeposition pattern from deforming after being attached at by the attaching thing.
The present invention also aims to, provide a kind of can be with the formation method metal sheet life-time service, electrodeposition pattern.Purpose of the present invention is again, provides a kind of need not that metal sheet surface is made mirror finish, the formation method of the fine electrodeposition pattern of defectives such as its inboard face is level and smooth, no burr.
For achieving the above object, the formation method of electrodeposition pattern of the present invention is characterised in that: form conductive film covering at metal sheet surface, form electrodeposition pattern on above-mentioned conductive film covering surface, with above-mentioned electrodeposition pattern and above-mentioned conductive film covering together, peel off from metal sheet, and be transferred on this pressure sensitive adhesives layer of the supporting substrate material that does not have the pressure sensitive adhesives layer, peel off down above-mentioned conductive film covering from above-mentioned electrodeposition pattern, form the fixing adhesive layer of using on the face in exposing of electrodeposition pattern, with above-mentioned electrodeposition pattern when above-mentioned supporting substrate material is peeled off, above-mentioned electrodeposition pattern is attached at adhesive layer by said fixing and is attached the thing surface.
Before conductive film covering forms, preferably metal sheet surface precompose demoulding is handled, again, before electrodeposition pattern forms, preferably the electrodeposition pattern precompose demoulding that corresponds on conductive film covering surface is handled.
According to the present invention who constitutes by as above content, in the time of on the pressure sensitive adhesives layer that electrodeposition pattern is transferred to supporting substrate material, make to produce between metal sheet and the conductive film covering and peel off, the electrodeposition pattern that is formed on this conductive film covering is transferred on the pressure sensitive adhesives layer of supporting substrate material, owing to this conductive film covering can be peeled off from metal sheet with less power, therefore, can on electrodeposition pattern, not produce additional residual stress.Thereby again owing to not residual in the electrodeposition pattern internal stress arranged, electrodeposition pattern can not deform being attached at after attaching thing yet.Again, electrodeposition pattern is to be stripped from the state that is sandwiched between supporting substrate material and the conductive film covering, so, additional stress had both just been arranged when peeling off, electrodeposition pattern can be not at random yet.
In addition, the method according to this invention, metal sheet is not yielding, but life-time service; And can do minute surface (polishing) processing to metal sheet surface, produce the fine electrodeposition pattern of defectives such as its inboard face is level and smooth, no burr.
Below, with reference to the description of drawings embodiments of the invention.
Example is shown in this embodiment, and the display text that clock and watch are used is as electrodeposition pattern, and is transferred to the surface of clock and watch with display panel (thing is stuck).But, the invention is not restricted to the clock and watch display text, also can be used for the manufacturing of various ornamental words, mark etc.
At first, as shown in Figure 1, form conductive film covering 2, the fexible film of this conductive film covering 2 for having electroconductibility on the surface of the metal sheet 1 of stainless steel etc.As this conductive film covering 2, can use the conductive metal film that forms by electro deposition (electrolytic deposition) or electroless plating layer, the conductive coating paint film, electroconductive polymer thin films etc. preferably use the conductive metal film that is formed by electrolytic deposition.The thickness of conductive film covering 2 does not have special restriction, generally at 10-50 μ m, better about 20-30 μ m.
Conductive film covering 2 in subsequent handling by sur-face peeling from metal sheet 1.Therefore, be easy to be stripped from, be preferably in before the formation of conductive film covering 2, the surperficial precompose demoulding of metal sheet 1 is handled for making conductive film covering 2.Demoulding handle can by, for example the surface oxidation that carries out with catholyte, with tensio-active agent etc. the surface of metal sheet 1 is dealt with to wait and carries out.
Then, by usual method, form electrodeposition pattern on the surface of conductive film covering 2, its detailed process is recorded in the spy and opens clear 59-No. 16989 communiques, and the spy opens on flat 3-No. 107496 communiques etc.Below do an explanation with regard to the generality formation method of electrodeposition pattern, but be not to do what special qualification.
This example is to use display text as electrodeposition pattern in clock and watch, and it is covered on clock and watch with on the display panel (being attached thing).At first, as shown in Figure 2, make photography negative film or the positive 3 that required electrodeposition pattern is used with technology such as photograph, printings.
Shown in this figure is positive, on this film 1, the formation clock and watch that useful Hei Yinmo describes reach around this target pattern Fig. 4 rectangular box-like location all around with pattern Fig. 5 (representing with oblique line among the figure) with target pattern Fig. 4 of display text 3,6,9 and 12, simultaneously, retouch the blank spot of witness marker 6 with the internal rules position of pattern Fig. 5 in this location.
On the other hand, as shown in Figure 3, on the conductive film covering 2 as stainless steel etc., coating liquid resist, dry film photoresist or printing are prepared printing down with photo-resists 7 such as resist China inks.
Then, as shown in Figure 4, on above-mentioned conductive film covering 2, place above-mentioned film (film) 3, photo-resist 7 is sandwiched in therebetween, expose (again under exposure machine etc. with this state, in the figure, the part of representing with oblique line in the film 3 is equivalent to above-mentioned target pattern Fig. 4 and pattern Fig. 5 is used in the location, for having covered the part of light).
Develop in the exposure back, remove unexposed photo-resist 7a (see figure 4), thus, as shown in Figure 5, on the surface of conductive film covering 2, form by above-mentioned target figure Fig. 4 and locate shape conductive part 8 (also can be described as the electrodeposition pattern corresponding surface) with the shape of pattern Fig. 5.Then, as required, carry out demoulding on the surface of conductive part 8 (electrodeposition pattern corresponding surface) and handle.After demoulding was handled, the electrodeposition pattern that forms later just can easily be peeled off from conductive film covering 2.This film release treatment process is with above-mentioned identical.
Then, as shown in Figure 6, by strike (electrodeposition pattern 12), precipitating metal on above-mentioned conductive part 8 forms electrodeposition pattern 9 and shape, forming shape by above-mentioned target pattern Fig. 4, by the electrodeposition pattern 10 of location with the shape of pattern Fig. 5.
In addition, above-mentioned electrodeposition pattern 9 becomes 3,6,9 and 12 digital shape, but from drawing, can only see the cross-sectional shape of these digital font width from the plane.In the inside of above-mentioned electrodeposition pattern 10, be formed with the pilot hole (not shown) that connects by the shape of above-mentioned witness marker 6 again.
Here, as the metal that forms above-mentioned electrodeposition pattern 9,10, as using nickel, can be with single nickel salt liquid as Watts bath (ワ Star ト liquid), electrolysis nickel deposited on conductive part 8 is as the electrodeposition condition of this moment, can be to the galvanic deposit useful area of for example 150mm * 150mm, the logical 3A/dm that goes up
2 Electric current 3 hours, can obtain the electrodeposition pattern of 100 μ m * 10 μ m.
Certainly, except above-mentioned nickel, also can on conductive part, separate out as metal arbitrarily such as gold and silver, copper, iron or its alloy, to form electrodeposition pattern, in addition, change electrodeposition condition, also can obtain electrodeposition pattern in 20-300 mu m ranges for example, any width.
Below, as shown in Figure 7, conductive film covering 2 be impregnated in the solution, after the photo-resist on having removed conductive film covering 2, can on the surface of above-mentioned electrodeposition pattern 9,10, impose as surface-treated metal plating, electrophoresis plating lacquer, spraying plating, printing, electrostatic spraying or true evaporation etc. and decorate (painted) on demand.
Like this, on the surface of conductive film covering 2, forms after the electrodeposition pattern 9,10 of pressing desired shape formation, more as shown in Figure 8, this electrodeposition pattern 9,10 is transferred on the pressure sensitive adhesives layer 12 of supporting substrate material 11 such as film with electrodip process.At this moment, peel off conductive film covering 2 simultaneously.That is, on the interface between conductive film covering 2 and the metal sheet 1, peel off, electrodeposition pattern 9,10 limits are sandwiched between conductive membrane 2 and the supporting substrate material 11 limit peel off.Its result has prevented the at random of electrodeposition pattern 9,10, can make electrodeposition pattern expeditiously.In addition, owing to can peel off under the situation that electrodeposition pattern and metal sheet are deformed hardly, no residual mechanical stress in the electrodeposition pattern, electrodeposition pattern are attached at after attaching thing and also do not deform.The advantage that also has is that metal sheet can repeat repeatedly to use.Again, with high surface smoothing film, when for example electro deposition film (electrolytic deposition film) etc. used as conductive membrane 2, the inboard face of electrodeposition pattern became smoothly, can very closely be attached at by on the attaching thing.And, because the photo-resist close adhesion on the conductive film covering 2 of high surface smoothing, can prevent the generation of burr, obtain the fine electrodeposition pattern.
Above-mentioned pressure sensitive adhesives layer 12, can by as UV cured type, heat hardening type, and the pressure sensitive adhesives of timeliness sclerotic type form.
Here, representative example as the pressure sensitive adhesives of UV cured type has: fusion have the addition polymerization compound of unsaturated link(age) more than two and have epoxy group(ing), as the optical polymerism compound of organoalkoxysilane and so on, have epoxy group(ing), as the optical polymerism compound of organoalkoxysilane and so on, the rubber of the Photoepolymerizationinitiater initiater of carbonyl compound and organosulfur compound, superoxide, amine, salt based compound and so on is pressure sensitive adhesives; Reach (seeing that the spy opens clear 60-No. 196956 communiques) such as acrylic ester pressure sensitive adhesives.The blended amount of optical polymerism compound, Photoepolymerizationinitiater initiater is respectively 10-500 weight parts and 0.1-20 weight parts with respect to per 100 weight part substrate polymers usually.
Acrylic ester polymer, except common enumerate (seeing special public clear 57-No. 54068 communiques, special public clear 58-No. 33909 communiques etc.), also can use the polymkeric substance (seeing special public clear 61-No. 56264 communiques) that on side chain, has the free radical reaction unsaturated group, and the polymkeric substance that in molecule, has epoxy group(ing).
Again, for example can enumerate as the addition polymerization compound with 2 above unsaturated link(age)s, the polyvalent alcohol of acrylic or methacrylic acid is ester or oligomer ester, epoxy base system or polyurethane series compound etc.
Have again, also can append and mix as epoxy functional linking agent ethylene glycol diglycidylether and so on, that have the epoxy group(ing) more than 1 or 2 in the molecule, to improve cross-linking effect.
When the binding agent that uses UV cured type forms pressure sensitive adhesives layer 11, be treated as possibility for making uviolizing, the films that the needs use is transparent etc. are as supporting substrate material 11.
Again, representative example as the pressure sensitive adhesives of heat hardening type, the linking agent of polyisocyanate salt, melamine resin, amine-Resins, epoxy, superoxide, metallo-chelate and so on of can having enumerated fusion, and in case of necessity, also having the rubber of the cross-linking regulator be made up of multi-functional compounds such as Vinylstyrene, glycol diacrylate, trimethylolpropane trimethacrylates etc. is pressure sensitive adhesives and acrylic ester pressure sensitive adhesives etc.
Have again,, evaporate the pressure sensitive adhesives that causes that cohesive force reduces gradually along with the time thereby can enumerate by the solvent that mixes as the pressure sensitive adhesives of age hardening type.
Then, weaken the cohesive force of above-mentioned pressure sensitive adhesives layer 12 as required after, as shown in Figure 9, by masking film 13 etc., electrodeposition pattern expose face (will be attached at the one side that is attached thing later on) go up form fixing with adhesive layer 14.Then, remove masking film 13, as shown in figure 10, electrodeposition pattern is attached at by on the attaching thing 15.In addition,, as shown in Figure 1, stick release paper 16 with adhesive layer one side, during use, tear these release paper 16 backs of stripping and use fixing in the occasion of not using this electrodeposition pattern at once.
Again, in the present invention, after the cohesive force that weakens above-mentioned pressure sensitive adhesives layer 12, as shown in figure 12, also cohesive force can be kept whole of face than the fixing electrodeposition pattern of coating above-mentioned supporting substrate material 11 with adhesive layer 14 of above-mentioned pressure sensitive adhesives layer the last 12.Then, as required, be coated with fixing at this with attaching release paper 16 on the one side of binding agent 14.
Here, when the pressure sensitive adhesives layer with UV cured type forms above-mentioned pressure sensitive adhesives layer 12, as shown in the drawing, surface one side from electrodeposition pattern 9,10, that is, from a side opposite with the maintenance face of electrodeposition pattern 9,10, irradiation ultraviolet radiation is to supporting substrate material 11, thus, make the cohesive force of pressure sensitive adhesives layer 12 become extremely a little less than.
In addition, when the pressure sensitive adhesives with the heat hardening type forms pressure sensitive adhesives layer 12, by supporting substrate material 11 is heated; When forming the pressure sensitive adhesives of age hardening type, then make it to take place timeliness and change; A little less than making the cohesive force of pressure sensitive adhesives layer 11 become extremely thus.
Have again, also can after face one side that will fix the maintenance electrodeposition pattern 9,10 of coating supporting substrate material 11 with binding agent 14,, weaken the cohesive force of pressure sensitive adhesives layer 12 with above-mentioned same.
Follow again, as shown in figure 13, keep the fixing of face one side by the electrodeposition pattern of coating supporting substrate material 11 with binding agent 14, the clock and watch that peeling off above-mentioned electrodeposition pattern 9,10 down from above-mentioned supporting substrate material 10 when, it adhered to, are fixed in the thing 15 that is stuck with display panel 15 ' the surface on.
Here, as shown in figure 14, fixing clock and watch with display panel 15 ' retaining plate 16 on be provided with the steady brace 17 of projection, by this steady brace 17 be located at pilot hole (not shown) on the above-mentioned electrodeposition pattern 10, can determine 9 pairs of clock and watch of electrodeposition pattern with display panel 15 ' the position.
At this moment, as aforementioned, because the cohesive force of above-mentioned pressure sensitive adhesives layer 12 weakens, be in as the state that keeps electrodeposition pattern by weak binding agent, can keep the fixing of face one side by the electrodeposition pattern of coating supporting substrate material 11 with binding agent 14, can with above-mentioned electrodeposition pattern 9 when above-mentioned supporting substrate material 11 is peeled off, be pasted on clock and watch with display panel (thing is stuck) 15 ' the surface.
Select two binding agents 12,14, make this pressure sensitive adhesives layer 12 and said fixing with the cohesive force on the interface of binding agent 14 greater than clock and watch with display panel 15 ' and fixing with the cohesive force on the interface of binding agent 14, thus, can make fixing with binding agent 14 do not adhere to clock and watch display panel 15 ' on.
For example, at the acrylic ester pressure sensitive adhesives of used fusion optical polymerism compound and Photoepolymerizationinitiater initiater when forming the pressure sensitive adhesives of above-mentioned pressure sensitive adhesives layer 11, as the fixing binding agent 14 of using, can use and the similar binding agent of pressure sensitive adhesives that forms pressure sensitive adhesives agent layer 12, promptly, do not mix optical polymerism compound and Photoepolymerizationinitiater initiater, only the acrylic ester pressure sensitive adhesives of substrate polymer is arranged, after its coating, thermalization is 9 hours in 40 ℃ of mists enclose.Thus, can make pressure sensitive adhesives layer 12 and said fixing with the cohesive force at the interface of binding agent 14 greater than clock and watch with display panel 15 ' and fixing with the cohesive force on the interface of binding agent 14.And, the binding agent beyond the fixed position all can be peeled off removal.Like this, select two kinds of binding agents, make above-mentioned cohesive force weaken pressure sensitive adhesives layer afterwards 12 and fix with the cohesive force on the interface of binding agent 14 greater than thing 15 and the fixing bounding force of using on the interface of binding agent 14 of being stuck, can keep whole of face one side with fixing the electrodeposition pattern of coating supporting substrate material 11 with binding agent 14 thus, and need not with binding agent only coat electrodeposition pattern in lateral trouble operation, reach the simplification of operation.
In the present invention, in the time of on the pressure sensitive adhesives layer that electrodeposition pattern is transferred to supporting substrate material, between metal sheet and conductive film covering, peel off, when shifting electrodeposition pattern, also shifted conductive film covering.Because this is peeled off with very little power and can carry out, and can not add residual stress on electrodeposition pattern.Therefore, owing to not residual in the electrodeposition pattern internal stress arranged, electrodeposition pattern does not deform after being attached at and being attached on the thing yet.And, because electrodeposition pattern is peeled off with the form that is sandwiched between supporting substrate material and the conductive film covering, both having made when peeling off and added residual stress, electrodeposition pattern does not take place at random yet.In addition, according to present method, but the metal sheet life-time service.Can need not metal sheet surface is carried out mirror finish, and 1 makes the fine electrodeposition pattern of defectives such as surface smoothing, no burr.
Fig. 1 is at the sectional view that has formed on the metal sheet under the common state of conductive film covering.
Figure 2 shows that the orthographic plan of electrodeposition pattern with an example of photograph masking film.
Fig. 3 be on conductive film covering lamination the sectional view of state of photoresists.
The sectional view of the state when Figure 4 shows that exposure.
Figure 5 shows that the sectional view of the state that has developed after the exposure.
After Figure 6 shows that development, carry out electrolytic deposition the sectional view of state.
After Figure 7 shows that electrolytic deposition, removed the sectional view of the state of photoresists.
Figure 8 shows that electrodeposition pattern and to shift and to remain in the sectional view of the state on the supporting substrate material with conductive film covering.
Figure 9 shows that by masking film, formed the fixedly sectional view of the state of adhesive layer on the face in exposing of electrodeposition pattern.
Figure 10 shows that electrodeposition pattern is attached at the sectional view that is attached the state on the thing.
Figure 11 shows that release paper is pasted on fixing sectional view with the state on the adhesive layer.
Figure 12 shows that in the cohesive force that weakens the pressure sensitive adhesives layer, the fixing adhesive-coated of using after the electrodeposition pattern of supporting substrate material keeps face one side, has been attached the sectional view of the state of release paper on this coated face.
Figure 13 shows that electrodeposition pattern is attached at the sectional view that is attached the state on the thing.
Figure 14 shows that the oblique drawing that is attached thing that has attached electrodeposition pattern.
Figure 15 shows that the sectional view of the stripping means of existing electrodeposition pattern.
Among the figure, 1 is metal sheet, and 2 is conductive film covering, and 9,10 is electrodeposition pattern, and 11 is supporting substrate material, and 12 is the pressure sensitive adhesives layer, and 14 are the fixing binding agent of using, 15,15 ' attached thing (clock and watch display panel).
Claims (3)
1. the formation method of an electrodeposition pattern is characterized in that: form conductive film covering at metal sheet surface;
Form electrodeposition pattern on above-mentioned conductive film covering surface;
With above-mentioned electrodeposition pattern and above-mentioned conductive film covering together, peel off from metal sheet, and be transferred on this pressure sensitive adhesives layer of the supporting substrate material that is provided with the pressure sensitive adhesives layer;
Peel off down above-mentioned conductive film covering from above-mentioned electrodeposition pattern;
Form the fixing adhesive layer of using on the face in exposing of electrodeposition pattern;
With above-mentioned electrodeposition pattern when above-mentioned supporting substrate material is peeled off, above-mentioned electrodeposition pattern is attached at adhesive layer by said fixing and is attached the thing surface.
2. the formation method of electrodeposition pattern as claimed in claim 1 is characterized in that, after above-mentioned metal sheet surface being done the demoulding processing, forms conductive film covering with strike in the above.
3. the formation method of electrodeposition pattern as claimed in claim 1 or 2 is characterized in that, after the position that corresponds to electrodeposition pattern on above-mentioned conductive film covering surface being done the demoulding processing, forms electrodeposition pattern.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6123789A JP2695752B2 (en) | 1994-06-06 | 1994-06-06 | Electrodeposited image forming method |
| JP123789/94 | 1994-06-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1116663A true CN1116663A (en) | 1996-02-14 |
| CN1092252C CN1092252C (en) | 2002-10-09 |
Family
ID=14869345
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN94108573A Expired - Lifetime CN1092252C (en) | 1994-06-06 | 1994-08-18 | Forming of electric deposited picture sample |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2695752B2 (en) |
| KR (1) | KR0133994B1 (en) |
| CN (1) | CN1092252C (en) |
| TW (1) | TW261673B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4475737B2 (en) * | 2000-05-02 | 2010-06-09 | シチズンホールディングス株式会社 | Three-dimensional electroformed product, manufacturing method thereof, and three-dimensional electroformed product sheet |
| JP4530262B2 (en) * | 2004-03-31 | 2010-08-25 | セイコーインスツル株式会社 | Manufacturing method of electroformed parts using low melting point metal |
| JP2008261982A (en) * | 2007-04-11 | 2008-10-30 | Nagashima Kogei Kk | Inlaid display panel and manufacturing method thereof |
| JP2008044371A (en) * | 2007-08-08 | 2008-02-28 | Tefuko Aomori Kk | Decorative plate |
| EP2767618B1 (en) | 2011-10-14 | 2017-07-19 | Hitachi Chemical Company, Ltd. | Method for producing metal filters |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01225789A (en) * | 1988-03-05 | 1989-09-08 | Hitake Seiko Kk | Formation of metallic pattern |
-
1994
- 1994-06-06 JP JP6123789A patent/JP2695752B2/en not_active Expired - Lifetime
- 1994-07-21 TW TW083106669A patent/TW261673B/en not_active IP Right Cessation
- 1994-08-01 KR KR1019940019048A patent/KR0133994B1/en not_active IP Right Cessation
- 1994-08-18 CN CN94108573A patent/CN1092252C/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07331479A (en) | 1995-12-19 |
| KR960000515A (en) | 1996-01-25 |
| JP2695752B2 (en) | 1998-01-14 |
| CN1092252C (en) | 2002-10-09 |
| TW261673B (en) | 1995-11-01 |
| KR0133994B1 (en) | 1998-04-25 |
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