TWI625215B - Article manufacturing device and manufacturing method - Google Patents
Article manufacturing device and manufacturing method Download PDFInfo
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- TWI625215B TWI625215B TW105113046A TW105113046A TWI625215B TW I625215 B TWI625215 B TW I625215B TW 105113046 A TW105113046 A TW 105113046A TW 105113046 A TW105113046 A TW 105113046A TW I625215 B TWI625215 B TW I625215B
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- replaceable component
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 145
- 238000012545 processing Methods 0.000 claims description 47
- 239000000463 material Substances 0.000 claims description 45
- 230000007246 mechanism Effects 0.000 claims description 41
- 238000000034 method Methods 0.000 claims description 38
- 230000007723 transport mechanism Effects 0.000 claims description 36
- 238000003754 machining Methods 0.000 claims description 15
- 238000005520 cutting process Methods 0.000 claims description 13
- 230000006870 function Effects 0.000 claims description 13
- 239000003550 marker Substances 0.000 claims description 12
- 238000005530 etching Methods 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 230000009471 action Effects 0.000 claims description 2
- 238000005507 spraying Methods 0.000 claims 2
- 238000005422 blasting Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 abstract description 134
- 229920005989 resin Polymers 0.000 abstract description 134
- 238000000465 moulding Methods 0.000 abstract description 109
- 238000007789 sealing Methods 0.000 abstract description 97
- 239000000047 product Substances 0.000 description 87
- 239000000758 substrate Substances 0.000 description 34
- 229910052751 metal Inorganic materials 0.000 description 21
- 239000002184 metal Substances 0.000 description 21
- 238000012423 maintenance Methods 0.000 description 19
- 239000000853 adhesive Substances 0.000 description 15
- 230000001070 adhesive effect Effects 0.000 description 15
- 238000005323 electroforming Methods 0.000 description 15
- 230000008569 process Effects 0.000 description 14
- 238000007689 inspection Methods 0.000 description 12
- 230000000694 effects Effects 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 230000006866 deterioration Effects 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000002829 reductive effect Effects 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
- 239000000470 constituent Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 239000013307 optical fiber Substances 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 230000002411 adverse Effects 0.000 description 3
- 229910010293 ceramic material Inorganic materials 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 238000007726 management method Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000011265 semifinished product Substances 0.000 description 3
- 238000007664 blowing Methods 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- 239000010730 cutting oil Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004070 electrodeposition Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 230000032258 transport Effects 0.000 description 2
- 229910001315 Tool steel Inorganic materials 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000000071 blow moulding Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000002173 cutting fluid Substances 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 238000007666 vacuum forming Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D37/00—Tools as parts of machines covered by this subclass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D37/00—Tools as parts of machines covered by this subclass
- B21D37/04—Movable or exchangeable mountings for tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/30—Mounting, exchanging or centering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/76—Measuring, controlling or regulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
- B30B15/02—Dies; Inserts therefor; Mounting thereof; Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Mounting, Exchange, And Manufacturing Of Dies (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
在裝設於樹脂密封裝置(1)的可換組件之成形模具(6)設置標識(9),在資訊形成面(9a)設置標識(9),在資訊形成面(9a)形成有微細圖案,此微細圖案是表示包含特定此成形模具(6)的資訊之第一資訊。資訊讀取工具(10)讀取微細圖案,解讀部(DE)基於被讀取的微細圖案而取得第一資訊。判別部(J)比較第一資訊、與包含特定此成形模具(6)的資訊且被預先記憶的第二資訊,進行判別。控制部(8)基於各自的判別的結果,控制樹脂密封裝置(1),在成形模具(6)對於第二資訊為適合時,使樹脂密封裝置(1)動作,在成形模具(6)對於第二資訊為不適合時,使製造裝置顯示以下事項:成形模具對於第二資訊為不適合。因此,防止用於樹脂密封裝置(1)的成形模具(6)並非適合品項的情況。 A marking (9) is provided in the forming mold (6) of the replaceable unit mounted on the resin sealing device (1), a mark (9) is provided on the information forming surface (9a), and a fine pattern is formed on the information forming surface (9a). This fine pattern is the first information indicating the information containing the specific molding die (6). The information reading tool (10) reads the fine pattern, and the interpretation unit (DE) acquires the first information based on the read fine pattern. The determination unit (J) compares the first information with the second information including the information specific to the molding die (6) and is memorized in advance. The control unit (8) controls the resin sealing device (1) based on the result of the respective discrimination, and operates the resin sealing device (1) when the molding die (6) is suitable for the second information, in the molding die (6). When the second information is unsuitable, the manufacturing apparatus displays the following: The forming mold is not suitable for the second information. Therefore, it is prevented that the molding die (6) used for the resin sealing device (1) is not suitable for the article.
Description
本發明是關於物品之製造裝置及製造方法,藉由防止按照所製造的物品在製造裝置被替換的可換組件的誤安裝等,保持物品的品質且防止對製造裝置造成不良影響。 The present invention relates to an article manufacturing apparatus and a manufacturing method, which prevent the erroneous mounting of an exchangeable component in which a manufactured article is replaced in accordance with the manufactured article, thereby maintaining the quality of the article and preventing adverse effects on the manufacturing device.
在替換按照在沖壓機等被加工的物品的種類而被替換的金屬模具之作業時,以使製品不良不發生為目的之一,會進行「正確的金屬模具」的判別。例如,對應於附在裝設於沖壓機本體的金屬模具的識別編號的條碼標籤,是被張貼在設於機械安排部的條碼管理面板。安排金屬模具時,藉由條碼讀取器,讀取對應於安裝的金屬模具的識別編號的條碼標籤。有人提出一種金屬模具管理方法,將藉由條碼讀取器被讀取的固有的金屬模具資訊、與設定用於加工的金屬模具時的設定金屬模具資訊予以記憶,在加工時基於設定金屬模具資訊呼叫所需的金屬模具設定,進行金屬模具替換(請參考專利文獻1的第0006、0009、0027段及圖5)。 When the work of the metal mold to be replaced in accordance with the type of the workpiece to be processed by a press or the like is replaced, the "correct metal mold" is determined for the purpose of preventing the product from being defective. For example, a bar code label corresponding to an identification number attached to a metal mold attached to the press body is attached to a bar code management panel provided in the machine arrangement portion. When the metal mold is arranged, the barcode label corresponding to the identification number of the mounted metal mold is read by the barcode reader. A metal mold management method has been proposed, which memorizes the inherent metal mold information read by the barcode reader and the set metal mold information when setting the metal mold for processing, and is based on setting the metal mold information during processing. The mold setting required for the call is performed, and the metal mold is replaced (refer to paragraphs 0006, 0009, 0027 and FIG. 5 of Patent Document 1).
樹脂成形裝置的一種之電子零件用的樹脂密封裝置,是藉由密封樹脂,覆蓋裝設於基板(導線架、印刷基板等)之上的半導體晶片等的片狀元件。藉此,完成成形品之密封後基板。在樹脂密封裝置的樹脂密封用的成形模具,是在變更密 封後基板的機種(產品種類)時、成形模具磨耗時,被替換。因此,成形模具是按照所製造的物品(密封後基板)的種類而被替換的可換組件。 A resin sealing device for an electronic component of a resin molding apparatus is a sheet-like element such as a semiconductor wafer mounted on a substrate (a lead frame, a printed board, or the like) by a sealing resin. Thereby, the sealed substrate of the molded article is completed. The molding die for resin sealing of the resin sealing device is changed in density When the model (product type) of the substrate is sealed and the molding die is worn, it is replaced. Therefore, the molding die is a replaceable component that is replaced in accordance with the type of the article to be manufactured (the substrate after sealing).
在被換上而被新裝設的成形模具並非適用的成形模具時(例如起因於作業員的選擇失誤等的成形模具的誤裝設發生時)、已被裝設異於品質受保證且特性符合的正確的金屬模具(適合品)的模具時等,會有損及成形品的品質之虞。此外,有發生對樹脂密封裝置的本體造成不良影響等的缺點之虞。 When the molding die newly installed and not newly installed is not a suitable molding die (for example, when a erroneous mounting of a molding die due to an operator's selection error or the like occurs), the quality is guaranteed and the characteristics are different. When the mold of the correct metal mold (suitable product) is matched, the quality of the molded product may be impaired. Further, there are disadvantages such as adverse effects on the body of the resin sealing device.
在替換裝配於電子零件的樹脂密封裝置而被使用的成形模具時,作業員是藉由手動進行替換作業。由於這種情況,無法在機械安排部設置條碼標籤。此外,為了識別成形模具,在此成形模具設置條碼標籤時,會有如下的問題。成形模具在被安裝於樹脂成形裝置後,會被加熱至既定的成形溫度(例如約180℃),在此狀態被使用。因此,將條碼標籤作為標識使用時,條碼標籤會因高溫而損傷,而容易損及施作於此標識的顯示功能。因此,即使在條碼標籤顯示主旨為適合品的標識,在此條碼標籤損傷時,會有無法正確地進行被裝設的成形模具的適當與否的判別之問題。因此,有發生用於物品製造時的可換組件的誤裝設的問題。 When replacing a molding die to be used in a resin sealing device mounted on an electronic component, the worker performs the replacement work by hand. Due to this situation, it is not possible to set a bar code label in the mechanical arrangement. Further, in order to identify the forming mold, when the forming mold is provided with a bar code label, there are the following problems. After being attached to the resin molding apparatus, the molding die is heated to a predetermined molding temperature (for example, about 180 ° C), and is used in this state. Therefore, when the barcode label is used as the logo, the barcode label may be damaged due to high temperature, and the display function applied to the logo may be easily damaged. Therefore, even if the barcode label indicates that the subject matter is a suitable product, when the barcode label is damaged, there is a problem that the appropriateness of the mounted mold cannot be accurately determined. Therefore, there has been a problem that misassembly of the replaceable components at the time of manufacture of the article occurs.
作為管理金屬模具的方法,有人提出在構成金屬模具的各金屬模具零件附加無線射頻識別(Radio Frequency Identification;RFID)標籤的方法(請參考專利文獻2的第0013段)。此方法無法適用於被使用於高溫(例如約180℃)的金屬模具。這是因為被附加於金屬模具零件的無線射頻識別標籤會被 熱破壞。 As a method of managing a metal mold, a method of attaching a radio frequency identification (RFID) tag to each of the metal mold parts constituting the metal mold has been proposed (refer to paragraph 0013 of Patent Document 2). This method cannot be applied to a metal mold that is used at a high temperature (for example, about 180 ° C). This is because the RFID tag attached to the metal mold part will be Heat damage.
【專利文獻1】日本特開平07-164073號公報 [Patent Document 1] Japanese Patent Laid-Open No. 07-164073
【專利文獻2】日本特開2003-050614號公報 [Patent Document 2] Japanese Patent Laid-Open Publication No. 2003-050614
本發明所欲解決的問題是:在物品的製造裝置使用於物品的製造的可換組件,有發生不適合本來應使用的可換組件之虞的情況。 The problem to be solved by the present invention is that the replaceable component used in the manufacture of the article for the manufacture of the article may be unsuitable for the replacement of the replaceable component that should be used.
為了解決上述問題,本發明相關的物品之製造裝置,其特徵在於包括:至少一個可換組件,其包含於物品之製造裝置,按照從材料製造的物品的種類而被替換;標識,設在可換組件;圖案,形成於標識;讀取部,光學式地讀取圖案;解讀部,基於被讀取的圖案,取得含有特定可換組件的資訊的第一資訊;控制部,基於已被預先記憶且至少包含特定可換組件的資訊之第二資訊,控制製造裝置的動作;以及判別部,比較第一資訊與第二資訊而進行判別;其中控制部在基於判別的結果,可換組件對於第二資訊為適合時,控制製造裝置而使製造裝置動作;控制部在基於判別的結果,可換組件對於第二資訊為不適合時,控制製造裝置而使製造裝置顯示以下事項:可換組件對於第二資訊為不適合;以及在關於可換組件為適合品與否的判別、與關於可換組件為需維護品與否的判別中的至少 任一個,是使用第二資訊。 In order to solve the above problems, an apparatus for manufacturing an article related to the present invention includes: at least one replaceable component included in a manufacturing apparatus of the article, which is replaced according to the kind of the article manufactured from the material; a replacement unit; a pattern formed on the mark; a reading unit that optically reads the pattern; and an interpretation unit that acquires first information including information of the specific replaceable component based on the read pattern; the control unit is based on Memorizing and controlling at least the second information of the information of the specific replaceable component, controlling the action of the manufacturing device; and the determining unit comparing the first information and the second information for discriminating; wherein the control unit is configured to replace the component based on the result of the discriminating When the second information is suitable, the manufacturing device is controlled to operate the manufacturing device; and when the control unit is unsuitable for the second information based on the result of the determination, the control unit controls the manufacturing device to cause the manufacturing device to display the following items: The second information is not suitable; and the determination as to whether the replaceable component is suitable or not, and the need for the replaceable component Discrimination for goods or not at least Either use the second information.
在上述物品之製造裝置,亦可:控制部在基於判別的結果,可換組件對於第二資訊為不適合時,控制製造裝置而使製造裝置不動作。 In the apparatus for manufacturing the article, the control unit may control the manufacturing device to prevent the manufacturing device from operating when the replaceable component is unsuitable for the second information based on the result of the determination.
在上述物品之製造裝置,亦可:控制部控制製造裝置而使製造裝置不動作後,按照已接收的訊號,控制上述製造裝置而使上述製造裝置動作。 In the apparatus for manufacturing the article, the control unit may control the manufacturing device to prevent the manufacturing device from operating, and then control the manufacturing device in accordance with the received signal to operate the manufacturing device.
在上述物品之製造裝置,亦可:可換組件包含單個可換組件或複數個可換組件;在單個可換組件或複數個可換組件的各自的既定位置設有標識;讀取部具有受光部、導光部與影像取得部;以及至少受光部是分別對應於既定位置而設置。 In the manufacturing apparatus of the above article, the replaceable component may include a single replaceable component or a plurality of replaceable components; a mark may be provided at each of the respective positions of the single replaceable component or the plurality of replaceable components; and the reading portion has the light receiving a portion, a light guiding portion, and a video capturing unit; and at least the light receiving portions are provided corresponding to the predetermined positions.
在上述物品之製造裝置,亦可:可換組件包含單個可換組件或複數個可換組件;在單個可換組件或複數個可換組件的各自的既定位置設有標識;讀取部具有受光部、導光部與影像取得部;以及至少受光部藉由移動,受光部分別對於單個可換組件或複數個可換組件而被共通使用。 In the manufacturing apparatus of the above article, the replaceable component may include a single replaceable component or a plurality of replaceable components; a mark may be provided at each of the respective positions of the single replaceable component or the plurality of replaceable components; and the reading portion has the light receiving The portion, the light guiding portion, and the image capturing portion; and at least the light receiving portion are moved, and the light receiving portion is commonly used for a single replaceable component or a plurality of replaceable components.
在上述物品之製造裝置,亦可:至少受光部是被設置於搬運機構,搬運機構具有將材料供應至可換組件的功能與將物品從可換組件搬出的功能中的至少任一個功能;以及受光部是藉由搬運機構而移動至既定位置。 In the apparatus for manufacturing the article, at least one of the light receiving portions may be provided in the transport mechanism, and the transport mechanism may have at least one of a function of supplying the material to the exchangeable component and a function of moving the article from the exchangeable component; and The light receiving unit is moved to a predetermined position by the transport mechanism.
在上述物品之製造裝置,亦可:影像取得部是被設在遠離單個可換組件或複數個可換組件的位置;以及受光部與影像取得部是藉由導光部而光學性連接。 In the apparatus for manufacturing the article, the image acquisition unit may be provided at a position away from the single interchangeable unit or the plurality of interchangeable units, and the light receiving unit and the image acquisition unit may be optically connected by the light guide unit.
在上述物品之製造裝置,可換組件亦可包含單個 模具或複數個模具。 In the manufacturing apparatus of the above article, the replaceable component may also comprise a single Mold or multiple molds.
在上述物品之製造裝置,亦可:可換組件至少具有第一模具及與第一模具相對向的第二模具;以及包括驅動機構,至少使第一模具與第二模具相對移動。 In the manufacturing apparatus of the above article, the replaceable component may have at least a first mold and a second mold facing the first mold, and a drive mechanism for moving at least the first mold and the second mold relative to each other.
在上述物品之製造裝置,亦可包括:可換組件模組,其設有至少可換組件;以及接收模組,接收材料;其中可換組件模組,相對於接收模組為可裝卸;以及可換組件模組,相對於其他的可換組件模組為可裝卸。 The manufacturing apparatus of the above article may further include: a replaceable component module provided with at least a replaceable component; and a receiving module for receiving material; wherein the replaceable component module is detachable with respect to the receiving module; The replaceable component module is detachable with respect to other replaceable component modules.
在上述物品之製造裝置,形成於標識的圖案,亦可包含藉由電鑄加工形成的圖案。 In the manufacturing apparatus of the above article, the pattern formed on the logo may include a pattern formed by electroforming.
在上述物品之製造裝置,亦可包括由形成有上述圖案的另一個組件構成的上述標識,其中另一個組件是被固定於上述可換組件。 The apparatus for manufacturing the above article may further include the above-described logo formed of another component in which the above-described pattern is formed, wherein the other component is fixed to the replaceable component.
為了解決上述問題,本發明相關的物品之製造方法,是藉由使用製造裝置而從材料製造物品之製造方法,其特徵在於包括:準備至少一個可換組件的步驟,至少一個可換組件包含於製造裝置,按照製造的物品的種類而被替換;準備標識的步驟,標識設在可換組件;使用讀取部而光學式地讀取預先形成在標識的圖案的步驟;基於被讀取的圖案而取得第一資訊的步驟,第一資訊含有特定可換組件的資訊;讀出已被預先記憶且至少包含特定可換組件的資訊之第二資訊的步驟;比較第一資訊與第二資訊而進行判別的步驟;基於判別的結果,可換組件對於第二資訊為適合時,控制製造裝置而使製造裝置動作的步驟;基於判別的結果,可換組件對於第二資訊為不適合 時,控制製造裝置而使製造裝置顯示以下事項的步驟:可換組件對於第二資訊為不適合;以及在進行判別的步驟,在關於可換組件為適合品與否的判別、與關於可換組件為需維護品與否的判別中的至少任一個,使用第二資訊。 In order to solve the above problems, a method of manufacturing an article related to the present invention is a method of manufacturing an article from a material by using a manufacturing apparatus, characterized by comprising the steps of: preparing at least one replaceable component, at least one replaceable component being included in The manufacturing device is replaced according to the type of the article to be manufactured; the step of preparing the marking, the marking is provided in the replaceable component; the step of optically reading the pattern formed in advance on the marking using the reading portion; based on the pattern to be read And the step of obtaining the first information, the first information containing the information of the specific replaceable component; the step of reading the second information that has been pre-memorized and including at least the information of the specific replaceable component; comparing the first information with the second information a step of discriminating; a step of controlling the manufacturing device to operate the manufacturing device when the replaceable component is suitable for the second information based on the result of the discriminating; and the replaceable component is unsuitable for the second information based on the result of the discriminating The step of controlling the manufacturing device to cause the manufacturing device to display the following items: the replaceable component is unsuitable for the second information; and the step of determining, the determination of whether the replaceable component is suitable or not, and the replaceable component The second information is used for at least one of the discrimination of the maintenance product.
在上述製造方法,亦可包含:基於上述判別的結果,可換組件對於第二資訊為不適合時,控制製造裝置而使製造裝置不動作的步驟。 The manufacturing method may include a step of controlling the manufacturing apparatus to prevent the manufacturing apparatus from operating when the replaceable component is unsuitable for the second information based on the result of the discrimination.
在上述製造方法,亦可包含:控制製造裝置而使製造裝置不動作後,按照已接收的訊號,控制製造裝置而使製造裝置動作的步驟。 In the above manufacturing method, the manufacturing apparatus may be controlled to control the manufacturing apparatus to operate the manufacturing apparatus in accordance with the received signal after the manufacturing apparatus is not operated.
在上述製造方法,亦可包含:在讀取部準備受光部、導光部與影像取得部的步驟;其中可換組件包含單個可換組件或複數個可換組件;在單個可換組件或複數個可換組件的各自的既定位置設有標識;以及在光學式地讀取圖案的步驟,是使用分別設於單個可換組件或複數個可換組件的受光部,讀取第一資訊。 The manufacturing method may include: a step of preparing a light receiving unit, a light guiding unit, and an image obtaining unit in the reading unit; wherein the replaceable component includes a single replaceable component or a plurality of replaceable components; in a single replaceable component or plural The respective positions of the replaceable components are provided with an identifier; and the step of optically reading the pattern is to read the first information using light receiving portions respectively provided in a single replaceable component or a plurality of replaceable components.
在上述製造方法,亦可包含:在讀取部準備受光部、導光部與影像取得部的步驟;其中可換組件是單個可換組件或複數個可換組件;在單個可換組件或上述複數個可換組件的各自的既定位置設有標識;以及在光學式地讀取圖案的步驟,是使用共通設於單個可換組件或複數個可換組件的受光部,上述第一資訊。 The manufacturing method may further include: a step of preparing a light receiving unit, a light guiding unit, and an image capturing unit in the reading unit; wherein the replaceable component is a single replaceable component or a plurality of replaceable components; in a single replaceable component or the above The respective positions of the plurality of replaceable components are provided with an identifier; and the step of optically reading the pattern is to use the light receiving portion common to the single replaceable component or the plurality of replaceable components, the first information.
在上述製造方法,亦可:準備受光部、導光部與影像取得部的步驟,具有:在遠離單個可換組件或複數個可換組件的位置,準備影像取得部的步驟;在搬運機構準備受光部的步 驟,搬運機構具有將材料供應至可換組件的功能與將物品從可換組件搬出的功能中的至少任一個功能;以及準備導光部的步驟,導光部光學性連接受光部與影像取得部;其中在光學式地讀取圖案的步驟,是藉由使搬運機構移動而使受光部移動至既定位置。 In the above manufacturing method, the step of preparing the light receiving unit, the light guiding unit, and the image capturing unit may include: preparing the image obtaining unit at a position away from the single exchangeable unit or the plurality of replaceable units; preparing the transport mechanism Step of the light receiving department The transport mechanism has at least one of a function of supplying a material to the replaceable component and a function of moving the article from the replaceable component; and a step of preparing the light guide, the optical guide is optically coupled to the light receiving portion and the image acquisition In the step of optically reading the pattern, the light receiving unit is moved to a predetermined position by moving the transport mechanism.
在上述製造方法,亦可:準備受光部、導光部與影像取得部的步驟,具有:在遠離單個可換組件或複數個可換組件的位置,準備影像取得部的步驟;以及準備導光部的步驟,導光部光學性連接受光部與影像取得部。 In the above manufacturing method, the step of preparing the light receiving unit, the light guiding unit, and the image capturing unit may include: preparing a video acquiring unit at a position away from a single interchangeable component or a plurality of interchangeable components; and preparing a light guide In the step of the unit, the light guiding unit optically connects the light receiving unit and the image capturing unit.
在上述製造方法,亦可包括準備包含於可換組件的單個模具或複數個模具的步驟。 In the above manufacturing method, the step of preparing a single mold or a plurality of molds to be included in the exchangeable assembly may also be included.
在上述製造方法,亦可包括:準備包含於可換組件的第一模具、與包含於可換組件且與第一模具相對向的第二模具的步驟;以及控制驅動機構的步驟,驅動機構至少使第一模具與第二模具相對移動。 The manufacturing method may further include: a step of preparing a first mold included in the replaceable component, a second mold included in the replaceable component and facing the first mold; and a step of controlling the drive mechanism, the drive mechanism being at least The first mold and the second mold are moved relative to each other.
在上述製造方法,亦可包括:準備可換組件模組與接收模組的步驟,可換組件模組設有至少可換組件,接收模組上述材料;其中可換組件模組,相對於接收模組為可裝卸;以及可換組件模組,相對於其他的可換組件模組為可裝卸。 In the above manufacturing method, the method further includes: preparing a replaceable component module and a receiving module, wherein the replaceable component module is provided with at least a replaceable component, and the receiving component is the above material; wherein the replaceable component module is opposite to the receiving component The module is detachable; and the replaceable component module is detachable with respect to other replaceable component modules.
在上述製造方法,亦可:在準備標識的步驟,是準備包含藉由電鑄加工形成的圖案之標識。 In the above manufacturing method, it is also possible to prepare the marking step by preparing a mark including a pattern formed by electroforming.
本發明相關的物品之製造方法是在上述製造方法,亦可:在準備標識的步驟,是準備由被固定於可換組件的另一個組件構成的上述標識。 The manufacturing method of the article according to the present invention is the above manufacturing method, and the step of preparing the marking is to prepare the marking formed by another component fixed to the exchangeable component.
根據本發明,在被裝設於物品之製造裝置的設置標識。在標識形成圖案,此圖案顯示含有特定此可換組件的資訊之第一資訊。讀取部讀取圖案,解讀部基於已被讀取的圖案取得第一資訊。判別部比較第一資訊、與預先記憶且包含特定此可換組件的資訊之第二資訊,進行判別。控制部基於判別的結果,可換組件對於第二資訊為適合時,控制製造裝置而使製造裝置動作。控制部基於判別的結果,可換組件對於第二資訊為不適合時,控制製造裝置而使製造裝置顯示以下事項:可換組件對於第二資訊為不適合。因此,起因於用於物品的製造的可換組件不適合第二資訊之不良之發生被抑制。 According to the present invention, the setting mark is attached to the manufacturing apparatus of the article. A pattern is formed in the logo that displays the first information containing information specific to the interchangeable component. The reading unit reads the pattern, and the interpretation unit acquires the first information based on the pattern that has been read. The determining unit compares the first information with the second information that is pre-memorized and includes information specific to the replaceable component, and performs discrimination. The control unit controls the manufacturing apparatus to operate the manufacturing apparatus when the changeable component is suitable for the second information based on the result of the determination. The control unit controls the manufacturing device when the replaceable component is unsuitable for the second information based on the result of the determination, and causes the manufacturing device to display the following: the replaceable component is not suitable for the second information. Therefore, the occurrence of a defect due to the replacement of the second information by the replaceable component for the manufacture of the article is suppressed.
1‧‧‧樹脂密封裝置(製造裝置) 1‧‧‧Resin sealing device (manufacturing device)
2‧‧‧固定盤 2‧‧‧ Fixed disk
3‧‧‧可動盤 3‧‧‧ movable plate
4‧‧‧固定模具(可換組件) 4‧‧‧Fixed mold (replaceable components)
4a、5c‧‧‧樹脂通路 4a, 5c‧‧‧ resin pathway
4b、5b‧‧‧模穴 4b, 5b‧‧‧ cavity
4d、5d‧‧‧凹處 4d, 5d‧‧‧ recess
5‧‧‧可動模具(可換組件) 5‧‧‧ movable mold (replaceable components)
5a‧‧‧壺 5a‧‧‧ pot
5v‧‧‧通氣孔 5v‧‧‧Ventinel
6‧‧‧成形模具(可換組件) 6‧‧‧Forming mold (replaceable components)
7‧‧‧驅動機構 7‧‧‧ drive mechanism
7a‧‧‧來回驅動機構(模具開閉機構) 7a‧‧‧Return drive mechanism (mold opening and closing mechanism)
7b‧‧‧樹脂加壓機構 7b‧‧‧Resin pressurizing mechanism
8‧‧‧控制部 8‧‧‧Control Department
9‧‧‧標識(另一組件) 9‧‧‧ logo (another component)
9a‧‧‧資訊形成面 9a‧‧‧Information formation
9b‧‧‧黏著劑 9b‧‧‧Adhesive
9c‧‧‧剝離紙 9c‧‧‧ peeling paper
10‧‧‧資訊讀取工具(資訊讀取部) 10‧‧‧Information Reading Tool (Information Reading Department)
10a‧‧‧雷射二極體 10a‧‧‧Laser diode
10b‧‧‧雷射光 10b‧‧‧Laser light
10c‧‧‧來回振動鏡 10c‧‧‧Back and forth vibrating mirror
10d‧‧‧反射光 10d‧‧‧reflected light
10e‧‧‧光學二極體 10e‧‧‧Optical diode
20‧‧‧電鑄加工槽 20‧‧‧Electroforming processing slot
21‧‧‧電解浴 21‧‧‧ Electrolytic bath
22‧‧‧金屬 22‧‧‧Metal
23‧‧‧母模 23‧‧‧Female model
24‧‧‧電鑄品(標識、另一組件) 24‧‧‧Electrical castings (logo, another component)
30‧‧‧滾珠螺桿 30‧‧‧Ball screw
31‧‧‧滾珠螺帽 31‧‧‧Ball nuts
32‧‧‧主搬運機構(搬運機構) 32‧‧‧Main handling mechanism (transportation mechanism)
33‧‧‧X方向導軌 33‧‧‧X direction guide
34‧‧‧Y方向導軌 34‧‧‧Y direction guide
35‧‧‧副搬運機構(搬運機構) 35‧‧‧Sub-transportation mechanism (transportation agency)
36‧‧‧受光部 36‧‧‧Receiving Department
37‧‧‧凸透鏡 37‧‧‧ convex lens
38‧‧‧反射鏡 38‧‧‧Mirror
39‧‧‧照明 39‧‧‧Lighting
40‧‧‧影像感應器 40‧‧‧Image sensor
41‧‧‧影像取得部 41‧‧‧Image Acquisition Department
42‧‧‧纜線 42‧‧‧ cable
43‧‧‧相機控制器 43‧‧‧ Camera Controller
44‧‧‧模穴區塊(可換組件) 44‧‧‧ cavity block (replaceable components)
45、46‧‧‧導光部 45, 46‧‧‧Light Guide
50‧‧‧電源 50‧‧‧Power supply
51‧‧‧基板材料接收部 51‧‧‧Substrate Materials Receiving Department
52‧‧‧樹脂材料接收部 52‧‧‧Resin Materials Receiving Department
53‧‧‧材料移送機構 53‧‧‧Material Transfer Agency
54‧‧‧裝設後基板 54‧‧‧Installing the rear substrate
55‧‧‧密封後基板 55‧‧‧Sealed substrate
56‧‧‧成形品移送機構 56‧‧‧Formed product transfer mechanism
57‧‧‧匣 57‧‧‧匣
58‧‧‧真空泵 58‧‧‧Vacuum pump
A‧‧‧材料接收模組 A‧‧‧ material receiving module
B‧‧‧繳出模組 B‧‧‧Without module
CAV‧‧‧模穴 CAV‧‧‧ cavity
DE‧‧‧解讀部 DE‧‧‧Interpretation Department
J‧‧‧判別部 J‧‧‧Discrimination Department
La‧‧‧導光部(光導) La‧‧‧Light Guide (Light Guide)
Lb‧‧‧凸透鏡 Lb‧‧‧ convex lens
Lc‧‧‧導光部 Lc‧‧‧Light Guide
Ld‧‧‧影像感應器 Ld‧‧‧ image sensor
Le‧‧‧纜線 Le‧‧‧ cable
M‧‧‧成形模組 M‧‧‧ forming module
ME‧‧‧記憶部 ME‧‧‧Memory Department
R‧‧‧樹脂材料 R‧‧‧Resin materials
S1~S11‧‧‧步驟 S1~S11‧‧‧ steps
【第1A圖】是本發明的實施例相關之樹脂密封裝置所具有的成形模組的示意正面圖。 [Fig. 1A] is a schematic front view of a molding module included in a resin sealing device according to an embodiment of the present invention.
【第1B圖】是成形模具所具有的固定模具及可動模具的展開斜視圖。 [Fig. 1B] is a developed perspective view of a fixed mold and a movable mold which are included in a molding die.
【第2A圖】是在第1A圖所示成形模組的示意側面圖。 [Fig. 2A] is a schematic side view of the molding module shown in Fig. 1A.
【第2B圖】是將成形模具的重點部分放大顯示的側面圖。 [Fig. 2B] is a side view showing an enlarged view of a key portion of the molding die.
【第3圖】是光學式地讀取圖案的讀取部的說明圖。 [Fig. 3] is an explanatory diagram of a reading unit that optically reads a pattern.
【第4A圖】是顯示製作標識的步驟之圖,為針對電鑄加工步驟的說明圖。 [Fig. 4A] is a view showing a step of producing a mark, and is an explanatory view for the electroforming process step.
【第4B圖】是顯示製作標識的步驟之圖,為針對電鑄加工步驟的說明圖。 [Fig. 4B] is a view showing a step of producing a mark, and is an explanatory view for the electroforming process step.
【第4C圖】是顯示製作標識的步驟之圖,為針對隔著黏 著劑使剝離紙一體化於標識的背面的步驟的說明圖。 [Fig. 4C] is a diagram showing the steps of making a logo, for the purpose of sticking An illustration of the step of integrating the release paper into the back side of the logo.
【第4D圖】是顯示製作標識的步驟之圖,為針對隔著黏著劑使剝離紙一體化於標識的背面的步驟的說明圖。 [4D] is a view showing a step of producing a mark, and is an explanatory view of a step of integrating the release paper on the back surface of the mark with an adhesive interposed therebetween.
【第5圖】是流程圖,顯示關於成形模具為適合品與否的判別的順序。 [Fig. 5] is a flowchart showing a procedure for determining whether a molding die is suitable or not.
【第6圖】是部分側面圖,顯示讀取部周邊的構成。 Fig. 6 is a partial side view showing the configuration of the periphery of the reading unit.
【第7圖】是平面圖,顯示本發明的實施例相關的製造裝置的概要。 [Fig. 7] is a plan view showing an outline of a manufacturing apparatus according to an embodiment of the present invention.
以下,參照圖式,敘述本發明。關於在本申請文件的所有圖式,均為了容易理解,會作適當地省略或誇張而作示意性地繪示。對相同的元件賦予相同的元件符號,適當地省略說明。 Hereinafter, the present invention will be described with reference to the drawings. All the drawings in the present application are easy to understand and will be schematically omitted if omitted or exaggerated. The same components are denoted by the same reference numerals, and the description is omitted as appropriate.
基於第1A、1B圖及第2A、2B圖,敘述本發明相關的物品之製造裝置及製造方法的實施例1。針對電子零件的樹脂密封裝置,作為物品之製造裝置的例子敘述。電子零件的樹脂密封裝置,是進行藉由密封樹脂覆蓋已裝設於基板(導線架、印刷基板等)之上的半導體晶片等的片狀元件的步驟。在已裝設有片狀元件的基板(裝設後基板),藉由使用成形模具將密封樹脂成形,完成相當於成形品的密封後基板。有些情況,密封後基板是相當於物品(完成品)。有些情況,將密封後基板裁切(分割)後的各個單片是相當於物品(完成品),在此情況,密封後基板是半成品。在本申請文件,「製品」之類的詞彙是包含半成品。 Embodiment 1 of the apparatus and method for manufacturing an article according to the present invention will be described based on Figs. 1A and 1B and Figs. 2A and 2B. A resin sealing device for an electronic component is described as an example of a manufacturing apparatus for an article. The resin sealing device for an electronic component is a step of covering a sheet-like element such as a semiconductor wafer mounted on a substrate (a lead frame, a printed board, or the like) with a sealing resin. The sealing resin is molded by using a molding die on the substrate on which the chip component is mounted (the rear substrate is mounted), and the sealed substrate corresponding to the molded article is completed. In some cases, the sealed substrate is equivalent to the article (finished product). In some cases, each individual piece after cutting (dividing) the sealed substrate is equivalent to an article (finished product), and in this case, the sealed substrate is a semi-finished product. In this document, words such as "products" are semi-finished products.
如第1A、1B圖所示,電子零件的樹脂密封裝置1, 包括一個或複數個成形模組M。包括複數個成形模組M時,可將其沿著X方向排列且相互連結。如後文敘述,複數個成形模組M可相互裝設,並可在事後分離。 As shown in FIGS. 1A and 1B, the resin sealing device 1 for an electronic component, Includes one or more forming modules M. When a plurality of forming modules M are included, they may be arranged in the X direction and connected to each other. As will be described later, a plurality of forming modules M can be mounted to each other and can be separated afterwards.
成形模組M具有固定盤2與可動盤3,固定盤2被固定於本體,可動盤3被對向於固定盤2而配置,並被設置為可對固定盤2接觸、離開。樹脂密封裝置1至少包括固定模具(上模具)4與可動模具(下模具)5,固定模具4是被裝設為對固定盤2可自由裝卸(可替換的樣態),可動模具5是被裝設為對可動盤3可自由裝卸。固定模具4與可動模具5是一起構成成形模具(樹脂密封模具)6。成形模具6是按照所製造的製品而被替換的組件(以下適當地稱為「可換組件」)。樹脂密封裝置1包括用於控制樹脂密封裝置1中的驅動機構7的動作的控制部8,驅動機構7包含例如可動盤3的來回驅動機構(模具開閉機構)7a與樹脂加壓機構7b。 The forming module M has a fixed disc 2 and a movable disc 3, and the fixed disc 2 is fixed to the main body, and the movable disc 3 is disposed opposite to the fixed disc 2, and is provided to be in contact with and away from the fixed disc 2. The resin sealing device 1 includes at least a fixed mold (upper mold) 4 and a movable mold (lower mold) 5, and the fixed mold 4 is mounted to be detachable (replaceable) to the fixed tray 2, and the movable mold 5 is It is installed to be detachable from the movable disk 3. The fixed mold 4 and the movable mold 5 together constitute a forming mold (resin sealing mold) 6. The molding die 6 is a component that is replaced in accordance with the manufactured product (hereinafter referred to as "replaceable component" as appropriate). The resin sealing device 1 includes a control unit 8 for controlling the operation of the drive mechanism 7 in the resin sealing device 1. The drive mechanism 7 includes, for example, a back and forth drive mechanism (mold opening and closing mechanism) 7a and a resin pressurizing mechanism 7b of the movable platen 3.
在成形模具6的既定位置,是被標識9黏貼。在標識9具有的資訊形成面9a,藉由凹凸等形成有微細圖案,微細圖案顯示至少含有特定成形模具6的資訊之第一資訊。微細圖案是藉由例如條碼、二維條碼等構成。 At a predetermined position of the forming mold 6, it is pasted by the mark 9. In the information forming surface 9a of the mark 9, a fine pattern is formed by unevenness or the like, and the fine pattern displays the first information including at least the information of the specific forming die 6. The fine pattern is constituted by, for example, a barcode, a two-dimensional barcode, or the like.
在特定成形模具6的資訊,包含成形模具6的製造者、供應者、勞務的提供者等的資訊、成形模具6的模具號碼及製造編號、藉由此成形模具6成形的成形品(密封後基板)的機種(產品種類)、顯示此成形模具6為適合品的適合品資訊。「適合品」這樣的詞彙,是意指關於此成形模具6為原本應使用的成形模具,具體而言,至少有以下二個意思。「適合 品」這樣的詞彙,第一,是意指:此成形模具6是對於欲製造的製品為適合的成形模具,為品質受到保證的成形模具。「適合品」這樣的詞彙,第二,是意指:此成形模具6是由正當的製造者或供應者提供的成形模具。 The information of the specific molding die 6 includes information on the manufacturer, supplier, and service provider of the molding die 6, the mold number and the manufacturing number of the molding die 6, and the molded article formed by the molding die 6 (after sealing) The type of the substrate (product type), and the molding die 6 is shown as suitable product information. The term "suitable product" means that the molding die 6 is a molding die to be used originally. Specifically, it has at least the following two meanings. "Suitable for The term "product" first means that the molding die 6 is a molding die suitable for a product to be manufactured, and is a molding die whose quality is ensured. The term "suitable product", secondly, means that the forming die 6 is a forming die provided by a legitimate manufacturer or supplier.
如第2A、2B圖所示,在樹脂密封裝置1,在成形模具6中的既定位置的對應位置,設有資訊讀取工具(資訊讀取部)10,資訊讀取工具10用以讀取形成在被黏貼於成形模具6的標識9的資訊形成面9a的微細圖案。 As shown in FIGS. 2A and 2B, in the resin sealing device 1, an information reading tool (information reading unit) 10 is provided at a corresponding position of a predetermined position in the molding die 6, and the information reading tool 10 is used for reading. A fine pattern formed on the information forming surface 9a of the mark 9 of the forming mold 6 is formed.
如第1A圖所示,在控制部8設有解讀部DE與記憶部ME,解讀部DE基於被資訊讀取工具10讀取之形成於資訊形成面9a的微細圖案而取得第一資訊,記憶部ME預先記憶特定成形模具6的資訊(第二資訊)。在控制部8,設有判別部J,判別部J比較已獲得的第一資訊與已預先被記憶的第二資訊,進行關於成形模具6對於第二資訊適合與否的判別。控制部8是基於判別的結果,控制包含驅動機構7的動作之樹脂密封裝置1的動作。 As shown in FIG. 1A, the control unit 8 is provided with an interpreting unit DE and a memory unit ME, and the interpreting unit DE acquires the first information based on the fine pattern formed on the information forming surface 9a read by the information reading tool 10, and memorizes The part ME pre-memorizes information (second information) of the specific forming mold 6. The control unit 8 is provided with a determination unit J that compares the obtained first information with the second information that has been memorized in advance, and determines whether the molding tool 6 is suitable for the second information or not. The control unit 8 controls the operation of the resin sealing device 1 including the operation of the drive mechanism 7 based on the result of the determination.
如第1B圖所示,在構成成形模具6的可動模具5,設置壺5a、可動模具5之側(以下稱為「可動側」)的模穴5b、連接於可動側的模穴5b之可動側的樹脂通路5c、與通氣孔5v,樹脂材料是供應至壺5a。在固定模具4,設置固定模具4之側(以下稱為「固定側」)的樹脂通路4a與固定側的模穴4b。 As shown in Fig. 1B, in the movable mold 5 constituting the molding die 6, the cavity 5a on the side of the pot 5a and the movable mold 5 (hereinafter referred to as "movable side") and the cavity 5b connected to the movable side are movable. The resin passage 5c on the side and the vent hole 5v are supplied to the jug 5a. In the fixed mold 4, a resin passage 4a on the side of the fixed mold 4 (hereinafter referred to as "fixed side") and a cavity 4b on the fixed side are provided.
可動模具5與固定模具4,是藉由模具開閉機構7a而被鎖模。可動模具5與固定模具4在被鎖模的狀態,相對向的可動模具5的模具面(在第1A圖的上表面)與固定模具4的模具面(在第1A圖的下表面)為密接。在此狀態,可動模具5 的壺5a與固定側的樹脂通路(淘汰部)4a連通,而且固定側的樹脂通路4a與可動側的樹脂通路5c連通。此外,可動模具5的壺5a是依序經由樹脂通路4a與樹脂通路5c,連通於固定側的模穴4b與可動側的模穴5b。 The movable mold 5 and the fixed mold 4 are mold-locked by the mold opening and closing mechanism 7a. The movable mold 5 and the fixed mold 4 are in a state of being clamped, and the mold surface (on the upper surface of FIG. 1A) of the movable mold 5 facing the fixed mold 4 is in close contact with the mold surface (the lower surface of FIG. 1A) of the fixed mold 4 . In this state, the movable mold 5 The pot 5a communicates with the resin passage (eliminating portion) 4a on the fixed side, and the resin passage 4a on the fixed side communicates with the resin passage 5c on the movable side. Further, the pot 5a of the movable mold 5 is sequentially connected to the cavity 4b on the fixed side and the cavity 5b on the movable side via the resin passage 4a and the resin passage 5c.
在樹脂成形時,在固定側的模穴4b與可動側的模穴5b的內部,充填熔融樹脂等的流動性樹脂。殘留於模穴4b與模穴5b的內部之氣體,伴隨著流動性樹脂的充填而通過通氣孔5v排出至外部。 At the time of resin molding, a fluid resin such as a molten resin is filled inside the cavity 4b on the fixed side and the cavity 5b on the movable side. The gas remaining in the inside of the cavity 4b and the cavity 5b is discharged to the outside through the vent hole 5v with the filling of the fluid resin.
如第2A圖所示,資訊讀取工具10,是分別配置於樹脂密封裝置1的本體,對應於在固定模具4及可動模具5分別裝設有標識9的位置。因此,各資訊讀取工具10,可以從在被分別裝設於固定盤2及可動盤3的固定模具4及可動模具5所黏貼的各標識9的資訊形成面9a,分別讀取微細圖案。 As shown in FIG. 2A, the information reading tool 10 is disposed on the main body of the resin sealing device 1, and corresponds to a position where the marker 9 is attached to each of the fixed mold 4 and the movable mold 5. Therefore, each information reading tool 10 can read the fine pattern from the information forming surface 9a of each of the marks 9 adhered to the fixed mold 4 and the movable mold 5 which are respectively mounted on the fixed disk 2 and the movable disk 3.
如第2B圖所示,顯示資訊形成面9a的影像的光,經由導光部(光導)La、凸透鏡(集光透鏡)Lb與導光部Lc,進入影像感應器Ld。影像感應器Ld是例如CCD感應器、CMOS感應器等。藉由影像感應器Ld,相當於資訊形成面9a的影像的光,被轉換成電性訊號。由顯示資訊形成面9a的影像的電性訊號構成的影像資料,經由纜線Le而被送到控制部8(請參考第1A圖、第1B圖)。作為資訊讀取工具10,亦可配置具有影像感應器的數位相機,取代凸透鏡Lb、導光部Lc及影像感應器Ld之組合。以此數位相機具有耐熱性為佳。 As shown in FIG. 2B, the light of the image on which the information forming surface 9a is displayed enters the image sensor Ld via the light guiding portion (light guide) La, the convex lens (light collecting lens) Lb, and the light guiding portion Lc. The image sensor Ld is, for example, a CCD sensor, a CMOS sensor, or the like. The light corresponding to the image of the information forming surface 9a is converted into an electrical signal by the image sensor Ld. The image data composed of the electrical signal of the image on which the information forming surface 9a is displayed is sent to the control unit 8 via the cable Le (please refer to FIG. 1A and FIG. 1B). As the information reading tool 10, a digital camera having an image sensor may be disposed instead of the combination of the convex lens Lb, the light guiding portion Lc, and the image sensor Ld. This digital camera is preferably heat resistant.
由固定模具4及可動模具5構成的成形模具6,構成一組模具單元。因此,亦可藉由在固定模具4與可動模具5 的任一者黏貼標識9等方法而固定。在此情況,對應於在成形模具6之黏貼有標識9之側,先將資訊讀取工具10配置於在樹脂密封裝置1的固定模具4與可動模具5的任一者之側即可。在以下的敘述,是以在固定模具4黏貼有標識9的情況為對象。 The molding die 6 composed of the fixed mold 4 and the movable mold 5 constitutes a group of mold units. Therefore, it is also possible to use the fixed mold 4 and the movable mold 5 Either one of them is attached to the logo 9 and fixed. In this case, the information reading tool 10 may be disposed on the side of the fixed mold 4 and the movable mold 5 of the resin sealing device 1 on the side where the marking 9 is adhered to the molding die 6. The following description is for the case where the marker 9 is adhered to the fixed mold 4.
如第3圖所示,在成形模具6(固定模具4與可動模具5中的至少一個)被標識黏貼的面,設置標識黏貼用的凹處4d,使其成為比即將被黏貼於此面而一體化的標識9的厚度還深。因此,如後文所述,藉由將標識9黏貼於凹處4d的內底面而一體化,可以防止此標識9的資訊形成面9a與其他的構成組件等接觸而使資訊形成面9a變形、破損等的缺陷。 As shown in Fig. 3, in the surface on which the forming mold 6 (at least one of the fixed mold 4 and the movable mold 5) is to be attached, a recess 4d for marking adhesion is provided so as to be adhered to the surface. The integrated logo 9 is also deep in thickness. Therefore, as described later, by integrating the mark 9 on the inner bottom surface of the recess 4d, it is possible to prevent the information forming surface 9a of the mark 9 from coming into contact with other constituent components and the like, thereby deforming the information forming surface 9a. Defects such as breakage.
以下,敘述在第一資訊為適合品資訊時,控制部8控制樹脂密封裝置1的內容。如後文所述,控制部8是基於藉由判別部J獲得的「適合品與否」的判別結果,將成為判別的對象之成形模具6為適合品與否的資訊,在樹脂密封裝置1顯示。具體而言,在成形模具6為適合品時,在顯示螢幕顯示其主旨。此外,以包含此成形模具6的成形模組M轉變為可動作的狀態為佳。在成形模具6不是適合品時,在顯示螢幕顯示其主旨之後,藉由警告燈的點燈、熄滅、警告音之產生等的方法,對作業員發布警告。亦可使此成形模組M轉變為:此成形模組M成為不可動作的狀態(例如:電源為ON但無法受理動作開始訊號的狀態、電源成為OFF的狀態等)。 Hereinafter, when the first information is suitable product information, the control unit 8 controls the content of the resin sealing device 1. As will be described later, the control unit 8 determines whether or not the molding die 6 to be determined is suitable for the product based on the determination result of the "suitable product or not" obtained by the determination unit J, and the resin sealing device 1 is used. display. Specifically, when the molding die 6 is a suitable product, the purpose of the display is displayed on the display screen. Further, it is preferable that the forming module M including the forming mold 6 is turned into an operable state. When the molding die 6 is not a suitable product, after displaying the purpose of the screen display, a warning is issued to the worker by a method such as lighting, extinguishing, warning sound generation of the warning lamp. The molding module M can also be changed to a state in which the molding module M is inoperable (for example, a state in which the power source is ON but the operation start signal cannot be accepted, and the power source is turned off).
在將固定模具4及可動模具5各自分割成複數個而構成之所謂的分割模具的情況(未圖示),在例如最重要的部分且可被替換的模穴區塊黏貼標識9。在此情況,可以防止關 於在樹脂成形最重要的組成元件且為可換組件的模穴區塊的誤換裝、不適合品的裝設等。 In the case where the fixed mold 4 and the movable mold 5 are each divided into a plurality of so-called divided molds (not shown), the mark 9 is adhered to, for example, the most important portion and the replaceable cavity block. In this case, it can prevent off It is a misplacement of a cavity block which is the most important component of resin molding and is a replaceable component, and installation of an unsuitable product.
第3圖是例示雷射式之所謂的非接觸式代碼讀取感應器作為資訊讀取工具10。資訊讀取工具10是藉由使來回振動鏡(掃描鏡)10c來回運動,使從雷射二極體10a發光的雷射光10b反射。藉此,藉由在來回振動鏡10c反射後的雷射光10b,掃描形成於標識9的資訊形成面9a。藉由光學二極體10e接收雷射光10b在資訊形成面9a反射而成的反射光10d。藉此,光學式地讀取已被形成於資訊形成面9a的微細圖案。 Fig. 3 is a view showing a laser type so-called non-contact code reading sensor as the information reading tool 10. The information reading tool 10 reflects the laser light 10b that is emitted from the laser diode 10a by moving the back and forth vibrating mirror (scanning mirror) 10c back and forth. Thereby, the information forming surface 9a formed on the marker 9 is scanned by the laser light 10b reflected by the back and forth vibrating mirror 10c. The reflected light 10d reflected by the laser light 10b on the information forming surface 9a is received by the optical diode 10e. Thereby, the fine pattern which has been formed on the information forming surface 9a is optically read.
如第4A~4D圖所示,在標識9的資訊形成面9a之側(正面側),藉由電鑄(電鑄加工)形成高精度的微細圖案。在標識9的背面側隔著黏著劑9b黏貼有剝離紙9c。在將剝離紙9c剝離後的狀態,隔著黏著劑9b將標識9的背面側黏著並一體化於成形模具6的標識黏貼面中的標識黏貼用的凹處4d(5d)的內底面(請參照第3圖)。 As shown in FIGS. 4A to 4D, on the side (front side) of the information forming surface 9a of the mark 9, a highly precise fine pattern is formed by electroforming (electroforming). The release paper 9c is adhered to the back side of the mark 9 via the adhesive 9b. In the state in which the release paper 9c is peeled off, the back side of the mark 9 is adhered via the adhesive 9b and integrated into the inner bottom surface of the recess 4d (5d) for marking adhesion in the marking adhesive surface of the molding die 6 (please Refer to Figure 3).
標識9是藉由電鑄加工,被形成為薄形的片狀。標識9具有以下二個目的。第一目的是避免把不適合品判別為適合品(誤判)。第二目的是將標識9從在成形模具6(固定模具4及可動模具5)的標識黏貼面(標識黏貼用凹處4d‧5d的內底面)剝離,可以避免將已被剝離的標識9黏貼於其他的不適合品等而再使用。因此,標識9的厚度,是被設定為同時滿足以下的二個條件的程度的厚度(換言之,必要且充分的薄度)。第一,在黏貼至適合品時,可以維持標識9的堅實度(firmness)、與讀取被形成於資訊形成面9a的微細圖案(所顯示的資訊)時的高精 度及確實性之厚度。第二,在如將原本黏貼於標識黏貼面4d(5d)的標識9剝離的情況,至少使資訊形成面9a受損的程度之厚度。 The mark 9 is formed into a thin sheet shape by electroforming. The logo 9 has the following two purposes. The first purpose is to avoid identifying unsuitable products as suitable products (false positives). The second object is to peel the mark 9 from the marking surface of the forming mold 6 (the fixed mold 4 and the movable mold 5) (the inner bottom surface of the marking recess 4d‧5d), thereby preventing the label 9 which has been peeled off from being pasted. Use it again for other unsuitable items. Therefore, the thickness of the mark 9 is a thickness (in other words, necessary and sufficient thinness) to the extent that the following two conditions are simultaneously satisfied. First, when adhering to a suitable product, it is possible to maintain the firmness of the mark 9 and the high precision when reading the fine pattern (the displayed information) formed on the information forming face 9a. Degree and the thickness of the authenticity. Second, in the case where the mark 9 originally adhered to the marking adhesive surface 4d (5d) is peeled off, at least the thickness of the information forming surface 9a is damaged.
包括上述二個條件的標識9(電鑄製品)的厚度,例如在電鑄為面轉印的情況,可以是0.05~0.1μm的厚度。在此厚度,可高精度地製作顯示資訊的微細圖案。在製作具有含立體形狀(三維形狀)的資訊形成面9a的標識9的情況,亦是可藉由一般的電鑄加工來製作包括上述二個條件的厚度的電鑄製品。 The thickness of the mark 9 (electroformed product) including the above two conditions, for example, in the case of electroforming as a surface transfer, may be a thickness of 0.05 to 0.1 μm. At this thickness, a fine pattern for displaying information can be produced with high precision. In the case of producing the mark 9 having the information forming surface 9a having a three-dimensional shape (three-dimensional shape), it is also possible to produce an electroformed product having a thickness including the above two conditions by a general electroforming process.
基於第4A~4D圖,針對製作標識9的情況作敘述。第4A圖及第4B圖是簡略地顯示電鑄加工步驟,而第4C圖及第4D圖是簡略地顯示隔著黏著劑使剝離紙一體化於標識9的背面的步驟。 The case of creating the logo 9 will be described based on the 4A to 4D drawings. 4A and 4B are views showing the electroforming process in a simplified manner, and Figs. 4C and 4D are views showing a step of integrally integrating the release paper on the back surface of the mark 9 via an adhesive.
如第4A圖所示,在電鑄加工步驟,在電鑄加工槽20內的電解浴21中,從外部將固定的電壓施加於金屬(鎳陽極)22與母模(陰極)23之間。藉此,在陽極引起金屬的離子化,在母模23發生金屬的還原造成的電沈積。示於第4A~4D圖的電沈積是藉由鎳而成。藉由電沈積後的鎳而構成的電鑄品24是被作為標識9的本體而使用。母模23是以藉由橢圓振動切削加工等的精密加工而製作為佳。 As shown in Fig. 4A, in the electroforming process, a fixed voltage is applied from the outside to the metal (nickel anode) 22 and the master (cathode) 23 in the electrolytic bath 21 in the electroforming processing tank 20. Thereby, ionization of the metal is caused at the anode, and electrodeposition due to reduction of the metal occurs in the master mold 23. The electrodeposition shown in Figures 4A to 4D is made of nickel. The electroformed product 24 composed of the electrodeposited nickel is used as the body of the mark 9. The master mold 23 is preferably produced by precision machining such as elliptical vibration cutting.
接下來,如第4B圖所示,將已電沈積於母模23的電鑄品24從母模23剝離。在電鑄品24,藉由反轉已形成於母模23的高精度的形狀等,形成有微細圖案。由已在電鑄品24形成的高精度的形狀構成的微細圖案,是被作為在標識9的資訊形成面9a表示特定成形模具6的資訊的微細圖案而使用。 Next, as shown in FIG. 4B, the electroformed product 24 which has been electrodeposited on the master mold 23 is peeled off from the master mold 23. In the electroformed product 24, a fine pattern is formed by inverting a high-precision shape or the like which has been formed on the master mold 23. The fine pattern composed of the high-precision shape formed by the electroformed product 24 is used as a fine pattern indicating the information of the specific molding die 6 on the information forming surface 9a of the mark 9.
接下來,如第4C圖所示,在電鑄品24的背面(在 資訊形成面9a的相反側之面)黏貼已附著剝離紙9c的黏著劑9b。藉此,製作附黏著劑9b的標識9。 Next, as shown in Fig. 4C, on the back side of the electroformed product 24 (in Adhesive 9b to which the release paper 9c has adhered is adhered to the surface on the opposite side of the information forming surface 9a. Thereby, the mark 9 with the adhesive 9b is produced.
接下來,如第4D圖所示,從標識9剝下剝離紙9c。將標識9的背面隔著黏著劑9b黏貼於成形模具6的標識黏貼面中的標識黏貼用的凹處4d(5d)的內底面。其結果,可以使成形模具6的凹處4d(5d)的內底面與標識9一體化。 Next, as shown in Fig. 4D, the release paper 9c is peeled off from the mark 9. The back surface of the mark 9 is adhered to the inner bottom surface of the recess 4d (5d) for marking adhesion in the marking adhesive surface of the molding die 6 via the adhesive 9b. As a result, the inner bottom surface of the recess 4d (5d) of the molding die 6 can be integrated with the mark 9.
黏著劑9b及剝離紙9c,是在剝下剝離紙9c的狀態,用於隔著黏著劑9b而將標識9的背面黏貼並使其一體化於成形模具6的標識黏貼面中的標識黏貼用的凹處4d(5d)的內底面。在對於凹處4d(5d)的內底面直接黏貼電鑄品24(標識9的本體)的情況,亦可預先將雙面黏著膠帶黏貼於凹處4d(5d)的內底面,取代黏著劑9b及剝離紙9c。 The adhesive 9b and the release paper 9c are in a state in which the release paper 9c is peeled off, and the back surface of the mark 9 is adhered to the marking adhesive surface of the molding die 6 via the adhesive 9b. The inner bottom surface of the recess 4d (5d). In the case where the electroformed product 24 (the body of the mark 9) is directly adhered to the inner bottom surface of the recess 4d (5d), the double-sided adhesive tape may be adhered to the inner bottom surface of the recess 4d (5d) in advance instead of the adhesive 9b. And release paper 9c.
顯示適合品資訊的微細圖案所形成的標識9,第一,是意指:此成形模具6是對於欲製造的製品為適合的成形模具,為品質受到保證的成形模具。顯示適合品資訊的微細圖案所形成的標識9,第二,是意指:此成形模具6是由例如樹脂密封裝置的正規的製作者、正規的模具製作者或是關於正規的樹脂密封裝置或正規的模具的勞務的供應者等(以下稱為「適合品提供者」)提供的成形模具。在標識9,形成有顯示特定模具的資訊的微細圖案的資訊形成面9a,是被高精度地形成,而可以對於未被附上標識的不適合品、由適合品提供者以外的人作成的標識等作區別。 The mark 9 formed by the fine pattern showing the suitable product information, firstly, means that the forming die 6 is a forming die suitable for the article to be manufactured, and is a forming die whose quality is secured. A mark 9 formed by a fine pattern showing suitable product information, and secondly, means that the forming die 6 is a regular creator such as a resin sealing device, a regular mold maker or a regular resin sealing device or A molding die supplied by a supplier of a labor service such as a regular mold (hereinafter referred to as "appropriate product supplier"). In the mark 9, the information forming surface 9a on which the fine pattern for displaying the information of the specific mold is formed is formed with high precision, and can be made of an unsuitable product not attached with a mark or a person other than the suitable product provider. Wait for the difference.
在資訊形成面9a,是形成例如條碼、二維條碼等。在這些以外或是用以取代這些,在資訊形成面9a亦可形成由 被適合品提供者任意訂定的文字、文字列、記號、形狀、立體的形狀或上述之組合、難以模仿的特殊影像、全像圖(hologram)、其他高精度記號等構成的微細圖案。基於已被形成於資訊形成面9a的微細圖案,讀取特定成形模具6的資訊。已被形成於資訊形成面9a的微細圖案是以難以模仿的圖案為佳。已被形成於資訊形成面9a的微細圖案,亦可包含顯示適合品提供者的微細圖案且具有顯示勞務的出處的功能的記號等的標章、商標(包含註冊商標)、商標標誌(logotype)。 In the information forming surface 9a, for example, a barcode, a two-dimensional barcode, or the like is formed. In addition to or in place of these, the information forming surface 9a may also be formed by A fine pattern composed of a character, a character string, a symbol, a shape, a three-dimensional shape, or a combination thereof, a special image that is difficult to imitate, a hologram, and other high-precision marks, which are arbitrarily set by a suitable product provider. The information of the specific forming mold 6 is read based on the fine pattern that has been formed on the information forming surface 9a. The fine pattern which has been formed on the information forming surface 9a is preferably a pattern which is difficult to imitate. A fine pattern that has been formed on the information forming surface 9a, and may include a mark, a trademark (including a registered trademark), or a logo (logotype) that displays a fine pattern suitable for the product provider and has a function for displaying the origin of the labor service. .
以下,請參考第1A~3圖與示於第5圖的流程圖,敘述特定成形模具6(請參考第1A圖、第1B圖、第2A圖、第2B圖)並判斷此成形模具6為適合品與否的步驟。首先,在第5圖如步驟S1所示,在樹脂密封裝置1的電源已被投入的狀態,對固定盤2裝設固定模具4,對可動盤3裝設可動模具5。在此步驟之固定模具4與可動模具5的裝設,只要可以讀取已被形成於標識9的資訊形成面9a的微細圖案,亦可為暫時設置(暫時固定)。 Hereinafter, the specific molding die 6 (refer to FIG. 1A, FIG. 1B, FIG. 2A, and FIG. 2B) will be described with reference to FIGS. 1A to 3 and the flowchart shown in FIG. 5, and it is judged that the molding die 6 is The steps that suit the product or not. First, as shown in step S1 in Fig. 5, in a state where the power source of the resin sealing device 1 has been charged, the fixed mold 4 is attached to the fixed disk 2, and the movable mold 5 is attached to the movable plate 3. The mounting of the fixed mold 4 and the movable mold 5 in this step may be temporarily set (temporarily fixed) as long as the fine pattern formed on the information forming surface 9a of the marker 9 can be read.
接下來,如步驟S2所示,使用資訊讀取工具10,讀取已被形成於分別被黏貼在已被裝設於固定模具4及可動模具5的標識9的資訊形成面9a的微細圖案。 Next, as shown in step S2, the information reading tool 10 is used to read the fine patterns which have been formed on the information forming faces 9a which are respectively attached to the marks 9 which have been mounted on the fixed mold 4 and the movable mold 5.
接下來,如步驟S3所示,控制部8從已被形成於資訊形成面9a的微細圖案取得第一資訊。例如,在微細圖案為二維條碼時,解讀此二維條碼。 Next, as shown in step S3, the control unit 8 acquires the first information from the fine pattern that has been formed on the information forming surface 9a. For example, when the fine pattern is a two-dimensional barcode, the two-dimensional barcode is interpreted.
接下來,如步驟S4所示,控制部8讀出包含特定成形模具6的資訊的第二資訊(已被預先記憶的資訊)。第二資訊是 被預先記憶於樹脂密封裝置1的控制部8所具有的記憶部ME。 Next, as shown in step S4, the control unit 8 reads out the second information (information that has been previously memorized) including the information of the specific molding die 6. The second message is The memory unit ME included in the control unit 8 of the resin sealing device 1 is stored in advance.
接下來,如步驟S5所示,在控制部8的判別部J,比較從已被形成於標識9的資訊形成面9a的微細圖案獲得的第一資訊、與已被預先記憶的第二資訊所含之特定成形模具6的資訊。判別部J基於比較後的結果,判別「固定模具4是否為「適合品」」的事項與「可動模具5是否為「適合品」」的事項。 Next, as shown in step S5, the determination unit J of the control unit 8 compares the first information obtained from the fine pattern formed on the information forming surface 9a of the marker 9 with the second information that has been previously memorized. Information containing the specific forming die 6. Based on the result of the comparison, the determination unit J determines whether the "fixed mold 4 is a "suitable product"" or the "whether the movable mold 5 is a "suitable product"".
以下,敘述在比較後的結果為「固定模具4及可動模具5各自為適合品」的情況(第一情況)的處理。接著步驟S5,如步驟S6所示,判別部J生成顯示「固定模具4為「適合品」」的適合訊號與顯示「可動模具5為「適合品」」的適合訊號。 Hereinafter, the case where the result of the comparison is "the case where each of the fixed mold 4 and the movable mold 5 is a suitable product" (the first case) will be described. Next, in step S5, as shown in step S6, the determination unit J generates a suitable signal for displaying "the fixed mold 4 is "suitable product"" and a suitable signal for displaying "the movable mold 5 is "suitable product"".
接下來,如步驟S7所示,控制部8基於接收的適合訊號,在樹脂密封裝置1的控制部8的顯示部(觸控面板等;未圖示),顯示「固定模具4為「適合品」」的事項與「可動模具5為「適合品」」的事項。控制部8亦可一並將警告燈以顯示樹脂密封裝置1為可動作的狀態之樣態(例如將綠色的光連續點亮的樣態)點亮。控制部8亦可一並藉由「可動作」等的聲音顯示樹脂密封裝置1為可動作的狀態。 Next, as shown in step S7, the control unit 8 displays "the fixed mold 4 is a suitable product on the display portion (touch panel or the like; not shown) of the control unit 8 of the resin sealing device 1 based on the received suitable signal. The item """ and "The movable mold 5 is a "suitable product"". The control unit 8 may also illuminate the warning lamp in a state in which the resin sealing device 1 is in an operable state (for example, a state in which green light is continuously turned on). The control unit 8 can also display the state in which the resin sealing device 1 is operable by sounds such as "operable".
接下來,如步驟S8所示,控制部8基於接收的適合訊號,使樹脂密封裝置1轉移為可動作的狀態(動作狀態)。在樹脂密封裝置1已經在可動作的狀態時,控制部8繼續將樹脂密封裝置1維持在可動作的狀態。步驟S7與步驟S8的順序亦可互換、亦可以同時進行的方式實施。 Next, as shown in step S8, the control unit 8 shifts the resin sealing device 1 into an operable state (operating state) based on the received appropriate signal. When the resin sealing device 1 is already in an operable state, the control unit 8 continues to maintain the resin sealing device 1 in an operable state. The order of step S7 and step S8 may also be interchanged or may be performed simultaneously.
以下,敘述在比較後的結果為「固定模具4及可動模具5的至少一個不是「適合品」」的情況(第二情況)的處 理。例如,敘述在固定模具4為「適合品」、可動模具5不是「適合品」的情況的處理。接著步驟S5,如步驟S9所示,判別部J生成顯示「可動模具5不是「適合品」」的不適合訊號。 In the following, the case where the result of the comparison is "the case where at least one of the fixed mold 4 and the movable mold 5 is not "suitable"" (the second case) is described. Reason. For example, the case where the fixed mold 4 is "appropriate" and the movable mold 5 is not "suitable" will be described. Next, in step S5, as shown in step S9, the determination unit J generates an unsuitable signal indicating that "the movable mold 5 is not "suitable product"".
接下來,如步驟S10所示,控制部8基於接收的不適合訊號,在樹脂密封裝置1的控制部8的顯示部(未圖示),顯示「可動模具5不是「適合品」」的事項。控制部8亦可一並將警告燈以顯示樹脂密封裝置1為不可動作的狀態之樣態(例如將黃色或紅色的光斷斷續續地點亮的樣態)點亮。控制部8亦可一並藉由「不可動作」等的聲音顯示樹脂密封裝置1為不可動作的狀態。 Then, as shown in step S10, the control unit 8 displays "the movable mold 5 is not a "suitable product"" on the display unit (not shown) of the control unit 8 of the resin sealing device 1 based on the received unsuitable signal. The control unit 8 may also illuminate the warning lamp in a state in which the resin sealing device 1 is in an inoperable state (for example, a state in which yellow or red light is intermittently turned on). The control unit 8 can also display the state in which the resin sealing device 1 is inoperable by sounds such as "non-operable".
接下來,如步驟S11所示,控制部8基於接收的不適合訊號,使樹脂密封裝置1轉移為不可動作的狀態(不動作狀態)。步驟S10與步驟S11的順序亦可互換、亦可以同時進行的方式實施。在固定模具4不是「適合品」的情況以及固定模具4及可動模具5二者均不是「適合品」的情況,亦是進行與上述的第二情況同樣的處理。 Next, as shown in step S11, the control unit 8 shifts the resin sealing device 1 into an inoperable state (non-operating state) based on the received unsuitable signal. The order of step S10 and step S11 may also be interchanged or may be performed simultaneously. When the fixed mold 4 is not "appropriate" and both the fixed mold 4 and the movable mold 5 are not "suitable", the same processing as in the second case described above is performed.
在固定模具4及可動模具5的至少一個不是「適合品」的模具(以下稱「不適合模具」)之情況,作業員從成形模具的庫存之中尋找「適合品」(以下稱「適合模具」)。作業員將不適合模具替換為找到的適合模具。作業員在適合模具已被暫時設置於樹脂密封裝置1的狀態,遵循示於第5圖的流程圖,使樹脂密封裝置1的控制部8動作。在此情況,由於適合模具已被暫時設置於樹脂密封裝置1,藉由進行步驟S1~S5~S8的處理,將樹脂密封裝置1轉換為動作狀態。 When at least one of the fixed mold 4 and the movable mold 5 is not a "suitable product" (hereinafter referred to as "not suitable for the mold"), the worker searches for the "suitable product" from the stock of the mold (hereinafter referred to as "suitable mold"). ). The operator will not be suitable for the mold to be replaced with the suitable mold found. The operator operates the control unit 8 of the resin sealing device 1 in a state in which the mold is temporarily placed in the resin sealing device 1 in accordance with the flowchart shown in FIG. In this case, since the suitable mold is temporarily placed in the resin sealing device 1, the resin sealing device 1 is switched to the operating state by performing the processes of steps S1 to S5 to S8.
至此,已敘述特定成形模具6的資訊至少包含於 第一資訊的事項。此外,至此,已敘述在特定成形模具6的資訊,包含成形模具6的製造者、提供者、勞務的提供者等的資訊、成形模具6的模具號碼及製造編號、藉由此成形模具6成形的成形品(封裝後基板)的產品種類、顯示此成形模具6為適合品的適合品資訊之事項。不限於此,在特定成形模具6的資訊,亦可包含顯示關於此成形模具6的製造年月日、使用開始年月日、使用年月日、已製造的物品(封裝後基板)的批號、使用次數(射注次數)等的歷程的歷程資訊。在歷程資訊,亦可包含顯示成形模具6的清潔、點檢、維護(保養)及替換(以下稱為「點檢、維護等」)的內容及時期等的歷程的歷程資訊。在歷程資訊,亦可包含顯示對於成形模具6在過去的缺陷、改善等的歷程的歷程資訊。藉此,樹脂密封裝置1或成形模具6的使用者(user)或是適合品提供者,進行上述資訊(顯示缺陷、改善等的歷程的資訊)的資料庫化。這些資訊,適用於使樹脂密封裝置1或成形模具6的稼動率提升的目的。 So far, the information describing the specific forming die 6 has been included in at least The first information item. Further, the information on the specific molding die 6 has been described so far, including information on the manufacturer, supplier, and service provider of the molding die 6, the mold number and the manufacturing number of the molding die 6, and the molding die 6 is formed by the molding die 6. The product type of the molded article (packaged substrate) and the fact that the molding die 6 is suitable product information of the suitable product. The present invention is not limited thereto, and the information on the specific molding die 6 may include a batch number indicating the date of manufacture of the molding die 6, the date of use, the date of use, and the manufactured article (substrate after packaging). History information of the course of the number of uses (number of shots). The history information may also include history information showing the contents of the cleaning, inspection, maintenance (maintenance) and replacement (hereinafter referred to as "inspection, maintenance, etc.") of the molding die 6 and the history. The history information may also include information on the history of the defects, improvements, and the like of the forming mold 6 in the past. Thereby, the user of the resin sealing device 1 or the molding die 6 or a suitable product supplier can perform the database of the above information (information showing defects, improvement, and the like). This information is suitable for the purpose of improving the utilization rate of the resin sealing device 1 or the forming mold 6.
敘述判別部J(請參考第1A圖、第1B圖)針對例如可動模具5,基於歷程資訊判別為應進行點檢、維護等的時期來到的情況。在此情況,判別部J產生顯示「可動模具5為需要點檢、維護等等的「需維護品」」的事項的需維護訊號。控制部8基於已接收的需維護訊號,顯示「可動模具5為需維護品」的事項,使樹脂密封裝置1轉移為無法動作的狀態(不動作狀態)。因此,樹脂密封裝置1的使用者(user)、作業員等,可以知道應進行以此可動模具5為對象之點檢、維護等的時期已經來到。此外,可以防止一不注意就徒然過了需要點檢、維 護等的時期而繼續使用含此可動模具5的成形模具6的事態。上述的「需維護品」的詞彙,是意指:從是否需要點檢、維護等的觀點,此成形模具不是原本應使用的成形模具。 The narration determination unit J (refer to FIG. 1A and FIG. 1B ) is a case where, for example, the movable mold 5 is determined to be a period in which inspection or maintenance is to be performed based on the history information. In this case, the determination unit J generates a maintenance-required signal indicating that the movable mold 5 is a "maintenance item to be inspected, maintained, etc.". The control unit 8 displays the item "the movable mold 5 is a maintenance-required item" based on the received maintenance-required signal, and shifts the resin sealing device 1 into an inoperable state (non-operating state). Therefore, the user, the operator, and the like of the resin sealing device 1 can recognize that the period in which the movable mold 5 is to be inspected, maintained, and the like has come. In addition, it can prevent the need for inspection and maintenance in case of inattention. The state in which the molding die 6 including the movable mold 5 is continued is used in the period of protection. The above-mentioned term "maintenance product" means that the molding die is not a molding die to be used from the viewpoint of whether or not inspection or maintenance is required.
在特定成形模具6的資訊,至少含有適合品資訊,並視需求亦可含有歷程資訊。在特定成形模具6的資訊,視需求亦可含有適合品資訊與歷程資訊的任一個。 The information on the specific forming mold 6 contains at least the information of the suitable product, and may also contain the history information as needed. The information on the specific forming mold 6 may also contain any suitable information and history information as needed.
另外,即使是成形模具6不是適合品的情況,仍可能有在使用此成形模具6的方面無問題的情況。例如,在顯示適合品的資訊,包含在成形模具的製造者所具有的特定的工廠製造的成形模具6的情況。在成形模具的製造者所具有的另一個工廠製造的成形模具6的情況,可使用此成形模具6。預設這樣的情況,在作業員確認顯示適合品的資訊而判斷為可以使用此成形模具6的情況,亦可設為:藉由作業員從樹脂密封裝置1的外部輸入的訊號,可以變更在控制部8的判別。具體而言,只要按照作業員已輸入的訊號,設為可以從「不是適合品」的判別轉換為「是適合品」的判別即可。 Further, even in the case where the forming mold 6 is not a suitable product, there is a possibility that there is no problem in the use of the forming mold 6. For example, the information showing the suitable product is included in the case of the molding tool 6 manufactured by a specific factory owned by the manufacturer of the molding die. In the case of the forming mold 6 manufactured by another factory owned by the manufacturer of the forming mold, the forming mold 6 can be used. In the case where the operator confirms that the information of the suitable product is confirmed, it is determined that the molding die 6 can be used, and the signal input from the outside of the resin sealing device 1 by the worker can be changed. The determination by the control unit 8. Specifically, it is only necessary to change the discrimination from the "not suitable product" to the "suitable product" according to the signal that the operator has input.
如第3圖所示,例示雷射式代碼讀取感應器作為資訊讀取工具10。資訊讀取工具10並不限於這樣的工具。例如,亦可藉由影像讀取感應器之CCD元件(電荷耦合裝置;Charge Coupled Device)等的影像感應器的使用,將拍攝標識9的資訊形成面9a所獲得的影像資料送至控制部8。亦可設為比較被傳送的影像資料與已被預先記憶的特定的影像資料(基準資料),進行適合品與否的判別。作為影像讀取感應器,亦可使用CMOS感應器。只要資訊讀取工具10是可以以高精度且正確地讀取已 被形成於標識9的資訊形成面9a的微細圖案的工具即可。 As shown in FIG. 3, a laser code reading sensor is exemplified as the information reading tool 10. The information reading tool 10 is not limited to such a tool. For example, the image data obtained by the information forming surface 9a of the photographing mark 9 can be sent to the control unit 8 by the use of an image sensor such as a CCD element (Charge Coupled Device) of the image reading sensor. . It is also possible to compare the transmitted image data with the specific image data (reference data) that has been memorized in advance, and determine whether the product is suitable or not. As an image reading sensor, a CMOS sensor can also be used. As long as the information reading tool 10 can read the high precision and correctly The tool formed on the fine pattern of the information forming surface 9a of the marker 9 may be used.
本實施例,是達成以下所述的有用且顯著的功效。第一,在關於可換組件的成形模具6為適合品與否的判別,是使用從已被固定於成形模具6的標識9讀取的第一資訊、與已被預先記憶的第二資訊。第一資訊包含特定成形模具6的資訊,第二資訊至少包含特定成形模具6的資訊。在特定成形模具6的資訊,含有適合品資訊與歷程資訊的至少任一個,而以包含其二者為佳。藉由上述事項,第一,可以判別可換組件之成形模具6為適合品與否。第二,可以判別可換組件之成形模具6為需維護品與否。 This embodiment achieves useful and significant effects as described below. First, in the determination as to whether or not the forming mold 6 of the replaceable unit is suitable or not, the first information read from the mark 9 that has been fixed to the forming die 6 and the second information that has been previously memorized are used. The first information contains information of a particular forming die 6, and the second information contains at least information of a particular forming die 6. The information on the specific forming mold 6 contains at least one of suitable product information and history information, and it is preferable to include both of them. With the above matters, first, it is possible to determine whether the mold 6 of the replaceable unit is suitable or not. Second, it can be discriminated whether the forming mold 6 of the replaceable component is a maintenance product or not.
第二,由於標識9是藉由電鑄加工製作,可以在標識9的資訊形成面9a高精度地形成微細圖案。此外,標識9具有耐熱性。藉由這些事項,可以獲得最適合黏貼在裝配於包含電子零件的樹脂密封裝置之樹脂成形裝置的成形模具6的使用目的之標識9。因此,由於可以使用已黏貼標識9的成形模具6,可以防止作業員造成的誤安裝等。 Second, since the mark 9 is produced by electroforming, the fine pattern can be formed with high precision on the information forming surface 9a of the mark 9. Further, the mark 9 has heat resistance. By these matters, the mark 9 for the purpose of use of the molding die 6 which is most suitable for being attached to the resin molding apparatus of the resin sealing device including the electronic component can be obtained. Therefore, since the molding die 6 to which the marker 9 has been attached can be used, it is possible to prevent erroneous mounting or the like caused by the worker.
第三,藉由使用已被標識9黏貼的成形模具6,可以防止損及成形品的品質之類的問題、與對於樹脂密封裝置1造成動作不良、耐久性降低、其他的不良影響等之類的問題。 Third, by using the molding die 6 that has been adhered to the mark 9, it is possible to prevent problems such as damage to the quality of the molded article, malfunction of the resin sealing device 1, deterioration in durability, and other adverse effects. The problem.
第四,由於標識9是被形成為薄形的片狀,標識9會在從成形模具將標識9剝下時破損。起因於此,無法剝下標識9而以原本的狀態再黏貼於其他的成形模具。因此,可以防止例如適合品提供者以外的人所作的標識9的不正當使用、不適合品的成形模具之供應等。 Fourth, since the mark 9 is formed into a thin sheet shape, the mark 9 is broken when the mark 9 is peeled off from the forming mold. As a result, the mark 9 cannot be peeled off and adhered to another molding die in the original state. Therefore, it is possible to prevent, for example, improper use of the logo 9 by a person other than the product provider, supply of a mold for an unsuitable product, and the like.
敘述本發明相關的物品之製造裝置及製造方法的實施例2。在本實施例,第二資訊是被預先記憶在設於樹脂密封裝置1的外部的記憶裝置。作為設於外部的記憶裝置,可舉出以下二個。第一記憶裝置,是用於由樹脂密封裝置1的使用者(user)管理半導體製程的伺服器等所具有的記憶裝置。第二記憶裝置,是用於由關於樹脂密封裝置1或成形模具6的適合品提供者管理自己的製品、勞務等的伺服器等所具有的記憶裝置。 Embodiment 2 of a manufacturing apparatus and a manufacturing method of an article related to the present invention will be described. In the present embodiment, the second information is stored in advance in a memory device provided outside the resin sealing device 1. The following two are mentioned as external memory devices. The first memory device is a memory device provided by a server or the like for managing a semiconductor process by a user of the resin sealing device 1. The second memory device is a memory device for a server or the like that manages its own products, labor, and the like by a suitable product provider for the resin sealing device 1 or the molding die 6.
在本實施例,第一,從用於由樹脂密封裝置1或成形模具6的使用者(user)管理半導體製程全體的伺服器等所具有的記憶裝置,讀出第二資訊。藉此,樹脂密封裝置1或成形模具6的使用者及作業員可以知道成形模具6是否為適合品。此外,樹脂密封裝置1或成形模具6的使用者及作業員可以知道應進行以成形模具6為對象的點檢、維護等的時期是否已經來到。在「點檢、維護等」,是包含以成形模具6為對象的清潔(在洗淨之外,包含使用刷子、雷射光、電漿等的物理性或化學性的清潔)。 In the present embodiment, first, the second information is read from a memory device provided by a server or the like for managing the entire semiconductor process by the user of the resin sealing device 1 or the molding die 6. Thereby, the user of the resin sealing device 1 or the molding die 6 and the operator can know whether or not the molding die 6 is a suitable product. In addition, the user and the worker of the resin sealing device 1 or the molding die 6 can know whether or not the period of inspection, maintenance, and the like to be performed on the molding die 6 has come. The "inspection, maintenance, etc." includes cleaning for the molding die 6 (in addition to washing, physical or chemical cleaning using a brush, laser light, plasma, etc.) is included.
第二,從用於由關於樹脂密封裝置1或成形模具6的適合品提供者管理自己的製品、勞務等的伺服器等所具有的記憶裝置,讀出第二資訊。藉此,關於樹脂密封裝置1或成形模具6的適合品提供者可以知道應進行以成形模具6為對象的點檢、維護等的時期是否已經來到。基於此一事項,適合品提供者會以應進行點檢、維護等的時期已經來到的主旨,對於樹脂密封裝置1或成形模具6的使用者(user)進行聯絡並促使其注意。適合品提供者亦可視需求,對使用者傳達有派遣適合品提 供者的服務工程師之準備、供應替換用的可換組件之準備等。適合品提供者的伺服器,亦可將接近應進行點檢、維護等的時期的情況、有派遣服務工程師之準備的情況、有供應替換用的可換組件之準備的情況等,自動式地傳送訊息給樹脂密封裝置1的控制部8、或是樹脂密封裝置1的使用者所具有的伺服器。藉此,對於關於樹脂密封裝置1或成形模具6的適合品提供者及使用者二者,提供用以確實地進行預防維護、定期維護的資訊。 Second, the second information is read from a memory device provided by a server or the like for managing its own products, labor, and the like by a suitable product provider for the resin sealing device 1 or the molding die 6. By this, the supplier of the suitable product of the resin sealing device 1 or the molding die 6 can know whether or not the period of inspection, maintenance, and the like to be performed on the molding die 6 has come. Based on this, the product provider will contact and draw attention to the user of the resin sealing device 1 or the molding die 6 in the sense that the period of inspection, maintenance, and the like has come. Appropriate product providers can also convey the appropriate products to the users according to their needs. Preparation of the service engineer of the supplier, preparation of replacement parts for replacement, etc. The server that is suitable for the product provider can also be automatically approached to the time when the inspection, maintenance, etc. should be performed, the preparation of the dispatched service engineer, and the preparation of the replaceable component for replacement. The message is transmitted to the control unit 8 of the resin sealing device 1 or the server of the user of the resin sealing device 1. Thereby, information for surely performing preventive maintenance and regular maintenance is provided for both the product supplier and the user of the resin sealing device 1 or the molding die 6.
基於第6圖,敘述本發明相關的物品之製造裝置及製造方法的實施例3。以下,作為製造裝置的樹脂密封裝置1,舉出在下模具5設有一個模穴CAV且使用壓縮成形方式的樹脂密封裝置1作為例子,進行敘述。示於第6圖的成形模具6,是被使用在高溫(例如約180℃)。據此,有必要保護資訊讀取工具10免受高溫危害。本實施例是顯示以被使用於高溫的可換組件為對象的情況中的資訊讀取工具10的較佳例子。 Based on Fig. 6, a third embodiment of the apparatus and method for manufacturing an article according to the present invention will be described. In the resin sealing device 1 of the manufacturing apparatus, a resin sealing device 1 in which a cavity CAV is provided in the lower mold 5 and a compression molding method is used will be described as an example. The forming die 6 shown in Fig. 6 is used at a high temperature (e.g., about 180 ° C). Accordingly, it is necessary to protect the information reading tool 10 from high temperature hazards. This embodiment is a preferred example of the information reading tool 10 in the case where the interchangeable component used for high temperature is targeted.
如第6圖所示,在樹脂密封裝置1,設有滾珠螺桿(ball screw)30與滾珠螺帽(ball nut)31。在滾珠螺帽31,安裝主搬運機構32。為了使主搬運機構32可以沿著X方向移動,設置沿著X方向延伸的X方向導軌33。在主搬運機構32,設置沿著-Y方向延伸的Y方向導軌34。 As shown in Fig. 6, in the resin sealing device 1, a ball screw 30 and a ball nut 31 are provided. In the ball nut 31, the main transport mechanism 32 is mounted. In order to allow the main transport mechanism 32 to move in the X direction, an X-direction guide rail 33 extending in the X direction is provided. In the main conveyance mechanism 32, a Y-direction guide rail 34 extending in the -Y direction is provided.
副搬運機構35,是被設置為可以沿著Y方向導軌34移動的樣態。副搬運機構35是將在基板裝設半導體晶片後的裝設後基板(未圖示)保持於上側,而供應至固定模具4的下表面。在固定模具4的下表面,藉由吸附、夾持等的方法,暫 時性地固定裝設後基板。副搬運機構35將片狀、粉粒狀的固態樹脂、在常溫具有流動性的液狀樹脂等的樹脂材料(未圖示),保持在被設於下側的容器等。副搬運機構35是將已被保持的樹脂材料,供應至被設於可動模具5的模穴CAV的內部。 The sub transport mechanism 35 is provided to be movable along the Y-direction guide rail 34. The sub-transport mechanism 35 is provided on the lower surface of the fixed mold 4 by holding the rear substrate (not shown) on which the semiconductor wafer is mounted on the substrate. On the lower surface of the fixed mold 4, by means of adsorption, clamping, etc. The rear substrate is fixedly mounted. The sub-transport mechanism 35 holds a resin material (not shown) such as a sheet-like or granular solid resin or a liquid resin having fluidity at normal temperature in a container or the like provided on the lower side. The sub-transport mechanism 35 supplies the resin material that has been held to the inside of the cavity CAV provided in the movable mold 5.
在副搬運機構35,例如在下表面或側面,設有包含於資訊讀取工具10的受光部36。在受光部36,設由分別由耐熱玻璃構成的凸透鏡37與反射鏡38。在受光部36,在設有凸透鏡37之側(入光側),設置例如環狀的照明39。 The sub-transport mechanism 35 is provided with a light receiving portion 36 included in the information reading tool 10, for example, on the lower surface or the side surface. The light receiving portion 36 is provided with a convex lens 37 and a reflecting mirror 38 each made of heat-resistant glass. In the light receiving portion 36, for example, an annular illumination 39 is provided on the side (light incident side) where the convex lens 37 is provided.
在位於遠離成形模具6的位置的主搬運機構32,安裝具有CCD感應器、CMOS感應器等的影像感應器40的影像取得部41。藉由影像感應器40獲得的電性訊號構成的影像資料,是例如經由纜線42,被送至包含於控制部8的相機控制器43。作為影像取得部41,亦可在主搬運機構32安裝具有影像感應器40的電子相機。在樹脂密封裝置1具有沿著X方向排列的複數個成形模組M的情況,包含一個副搬運機構35的一個主搬運機構32,是被複數個成形模組M共通使用。 The image acquisition unit 41 having the image sensor 40 such as a CCD sensor or a CMOS sensor is mounted on the main conveyance mechanism 32 located away from the molding die 6. The image data composed of the electrical signals obtained by the image sensor 40 is sent to the camera controller 43 included in the control unit 8 via the cable 42, for example. As the image acquisition unit 41, an electronic camera having the image sensor 40 may be attached to the main transport mechanism 32. In the case where the resin sealing device 1 has a plurality of molding modules M arranged in the X direction, one main conveying mechanism 32 including one sub conveying mechanism 35 is commonly used by a plurality of molding modules M.
在可動模具(下模具)5,安裝有已形成有模穴CAV的模穴區塊44。模穴區塊44是按照所製造的製品(在本實施例為封裝後基板)而被替換的可換組件。在模穴區塊44,是藉由例如黏貼、螺旋旋緊等固定具有資訊形成面9a的標識9。 In the movable mold (lower mold) 5, a cavity block 44 in which the cavity CAV has been formed is mounted. The cavity block 44 is a replaceable component that is replaced in accordance with the manufactured article (in this embodiment, the packaged substrate). In the cavity block 44, the mark 9 having the information forming face 9a is fixed by, for example, pasting, screwing, or the like.
顯示被形成於資訊形成面9a的微細圖案的影像的光,是經由空間構成的導光部45而進入凸透鏡37而被集光。被集光的光在反射鏡38反射。在反射鏡38反射後的光,是經由空間構成的導光部46而進入影像感應器40,被轉換成電性訊號構 成的影像資料。轉換後的影像資料是經由纜線42,被送至包含於控制部8(請參考第1A圖、第1B圖)的相機控制器43。在本實施例,至少,具有凸透鏡37與反射鏡38的受光部36、導光部46與具有影像感應器40的影像取得部41,是具有相當於示於第2A圖、第2B圖的資訊讀取工具10的功能。至少,受光部36、導光部46與影像取得部41,是包含於資訊讀取工具10。 The light that displays the image of the fine pattern formed on the information forming surface 9a enters the convex lens 37 via the light guiding portion 45 formed in the space, and is collected. The collected light is reflected by the mirror 38. The light reflected by the mirror 38 enters the image sensor 40 via the light guiding portion 46 formed in the space, and is converted into an electrical signal structure. Image data. The converted image data is sent to the camera controller 43 included in the control unit 8 (please refer to FIG. 1A and FIG. 1B) via the cable 42. In the present embodiment, at least the light receiving portion 36 having the convex lens 37 and the mirror 38, the light guiding portion 46, and the image capturing portion 41 having the image sensor 40 have information equivalent to those shown in Figs. 2A and 2B. The function of the reading tool 10 is read. At least the light receiving unit 36, the light guiding unit 46, and the image capturing unit 41 are included in the information reading tool 10.
藉由本實施例可獲得以下功效。第一,由於自動式地判別可換組件的成形模具6為適合品與否,可以防止成形模具6的誤安裝。此功效,是藉由以下構成獲得:從已被固定於成形模具6的標識9所具有的資訊形成面9a,自動式地讀取特定此成形模具6的資訊,自動式地判別此成形模具6為適合品與否。 The following effects can be obtained by the present embodiment. First, since it is possible to automatically discriminate whether or not the forming mold 6 of the replaceable unit is suitable or not, erroneous mounting of the forming mold 6 can be prevented. This effect is obtained by automatically reading the information specifying the molding die 6 from the information forming surface 9a which is fixed to the marking 9 of the forming die 6, and automatically discriminating the forming die 6 To suit the product or not.
第二,可防止起因於徒然過了應進行以可換組件的成形模具6為對象的維護點檢的時期等之製品品質的降低、成形模具6的劣化等。此功效,是藉由以下構成獲得:從已被固定於成形模具6的標識9所具有的資訊形成面9a,自動式地判別應進行以此成形模具6為對象的維護點檢的時期已來到與否。 Secondly, it is possible to prevent deterioration of the product quality, deterioration of the molding die 6, and the like, which are caused by the maintenance inspection time for the molding die 6 of the exchangeable module, and the like. This effect is obtained by automatically determining from the information forming surface 9a of the mark 9 that has been fixed to the forming die 6 that the maintenance inspection to be performed on the forming die 6 has been performed. To or not.
第三,防止位於高溫的環境下所具有之含凸透鏡37與反射鏡38的資訊讀取工具10的劣化、與通常位於非在高溫的環境下的場所的影像感應器40的劣化。此功效是藉由以下的構成獲得。凸透鏡37與反射鏡38是攸關於影像資料的取得的光學元件,由耐熱玻璃構成。將影像感應器40配置在遠離成為高溫的成形模具6的位置,從資訊形成面9a依序經由凸透鏡37與反射鏡38而到影像感應器40的導光部45、46,是藉由空間構成。藉由這些構成,防止具有包含凸透鏡37與 反射鏡38的受光部36、由空間構成的導光部46及包含影像感應器40的影像取得部41之資訊讀取工具10的劣化。 Third, deterioration of the information reading tool 10 including the convex lens 37 and the mirror 38, which is located in a high temperature environment, and deterioration of the image sensor 40 which is usually located in a place not in a high temperature environment are prevented. This effect is obtained by the following constitution. The convex lens 37 and the mirror 38 are optical elements for obtaining image data, and are made of heat-resistant glass. The image sensor 40 is disposed at a position away from the molding die 6 that is at a high temperature, and is sequentially formed from the information forming surface 9a via the convex lens 37 and the mirror 38 to the light guiding portions 45 and 46 of the image sensor 40 by space. . With these configurations, it is prevented to have the convex lens 37 and The light-receiving portion 36 of the mirror 38, the light-guiding portion 46 composed of a space, and the information reading tool 10 including the image acquisition unit 41 of the image sensor 40 are deteriorated.
第四,可以抑制樹脂密封裝置1的製造原價的增加。此功效是藉由以下的構成獲得。在資訊讀取工具10中,是採用:在副搬運機構35設置分別由耐熱玻璃構成的凸透鏡37與反射鏡38之構成。在資訊讀取工具10中,是採用:將包含影像感應器40的影像取得部41安裝於主搬運機構32的構成。因此,由於沒有必要新設置用以使資訊讀取工具10移動的工具,可以抑制樹脂密封裝置1的製造原價的增加。此外,在樹脂密封裝置1具有複數個成形模組M的情況,可以共用一組資訊讀取工具10。藉此,可以進一步有效地抑制樹脂密封裝置1的製造原價的增加。 Fourth, an increase in the original price of the resin sealing device 1 can be suppressed. This effect is obtained by the following constitution. In the information reading tool 10, the sub-transport mechanism 35 is provided with a convex lens 37 and a reflecting mirror 38 each made of heat-resistant glass. In the information reading tool 10, the image capturing unit 41 including the image sensor 40 is attached to the main transport mechanism 32. Therefore, since it is not necessary to newly provide a tool for moving the information reading tool 10, an increase in the original price of the resin sealing device 1 can be suppressed. Further, in the case where the resin sealing device 1 has a plurality of forming modules M, a group of information reading tools 10 can be shared. Thereby, the increase in the original price of the resin sealing device 1 can be further effectively suppressed.
在第6圖,是顯示從受光部36到影像取得部41的導光部46是藉由空間構成之例子。亦可取而代之,採用包括導引進入凸透鏡37、被凸透鏡37集光的光之光纖,作為導光部46。以在具有耐熱性的保護管的內部配置光纖為佳。在此情況,光纖是相當於導光部。藉由此構成,藉由適當地布局光纖,可以自由選擇配置影像取得部41的場所。 In the sixth drawing, the light guide unit 46 from the light receiving unit 36 to the image acquisition unit 41 is configured by a space. Alternatively, an optical fiber including light that is guided into the convex lens 37 and collected by the convex lens 37 may be used as the light guiding portion 46. It is preferable to arrange the optical fiber inside the protective tube having heat resistance. In this case, the optical fiber corresponds to the light guiding portion. With this configuration, the position where the image acquisition unit 41 is placed can be freely selected by appropriately arranging the optical fibers.
在第6圖,是顯示將包含影像感應器40的影像取得部41安裝於主搬運機構32的例子。不限於此,亦可採用將包含影像感應器的數位相機安裝於主搬運機構32而作為影像取得部41的構成。在此情況,可將數位相機安裝於主搬運機構32、亦可安裝於副搬運機構35。在將數位相機安裝於副搬運機構35的情況,以在數位相機設置冷卻機構為佳。 In the sixth drawing, an example in which the image acquisition unit 41 including the image sensor 40 is attached to the main transport mechanism 32 is shown. The present invention is not limited thereto, and a digital camera including an image sensor may be attached to the main transport mechanism 32 as the image acquisition unit 41. In this case, the digital camera can be attached to the main transport mechanism 32 or to the sub transport mechanism 35. In the case where the digital camera is attached to the sub transport mechanism 35, it is preferable to provide a cooling mechanism in the digital camera.
基於第6圖與第7圖,敘述本發明相關的物品之製造裝置及製造方法的實施例4。如第7圖所示,樹脂密封裝置1具有一個材料接收模組A、四個成形模組M(請參考第1A圖、第1B圖)與一個繳出模組B。樹脂密封裝置1分別以樹脂密封裝置1全體為對象,具有供應電力的電源50與控制各構成元件的控制部8(請參考第1A圖、第1B圖)與一個繳出模組B。 Based on Fig. 6 and Fig. 7, a fourth embodiment of the apparatus and method for manufacturing an article according to the present invention will be described. As shown in Fig. 7, the resin sealing device 1 has a material receiving module A, four forming modules M (please refer to Figs. 1A and 1B) and a payout module B. Each of the resin sealing devices 1 is provided with a power supply 50 for supplying electric power and a control unit 8 for controlling each component (refer to FIGS. 1A and 1B) and a delivery module B.
可以將材料接收模組A與在第7圖最左側的成形模組M,相互裝設、相互分離。可以將相鄰的成形模組M的彼此,相互裝設、相互分離。可以將在第7圖最右側的成形模組M與繳出模組B,相互裝設、相互分離。裝設上述構成元件時的定位,是藉由定位孔及定位銷等的習知的工具進行。裝設是藉由使用螺栓、螺帽旋緊等構成的習知的工具進行。 The material receiving module A and the forming module M on the leftmost side of the seventh drawing can be installed and separated from each other. The adjacent forming modules M can be mounted to each other and separated from each other. The forming module M and the payout module B on the far right side of Fig. 7 can be mounted and separated from each other. The positioning when the above-described constituent elements are mounted is performed by a conventional tool such as a positioning hole and a positioning pin. The mounting is performed by a conventional tool constructed using bolts, nuts, and the like.
材料接收模組A具有基板材料接收部51、樹脂材料接收部52與材料移送機構53。基板材料接收部51是從樹脂密封裝置1的外部接收裝設後基板54。樹脂材料接收部52是從樹脂密封裝置1的外部接收粉粒狀的固態樹脂構成的樹脂材料R。 The material receiving module A has a substrate material receiving portion 51, a resin material receiving portion 52, and a material transfer mechanism 53. The substrate material receiving portion 51 receives the rear substrate 54 from the outside of the resin sealing device 1. The resin material receiving portion 52 is a resin material R which is formed of a solid resin which receives powder particles from the outside of the resin sealing device 1.
請參考第6圖與第7圖,敘述具有樹脂密封裝置1的搬運系統。在樹脂密封裝置1,在從材料接收模組A經由四個成形模組M到繳出模組B,沿著X方向設置X方向導軌33。在X方向導軌33,設置主搬運機構32使其可以沿著X方向移動。在主搬運機構32,沿著Y方向設置Y方向導軌34。在Y方向導軌34,設置主搬運機構32所具有的副搬運機構35,使其可以沿著Y方向移動。副搬運機構35在上部收容裝設後基板54,在下 部收容樹脂材料R。副搬運機構35,是在接觸於一個成形模組M中的X方向導軌33的待機位置與下模具5中的模穴CAV的上方之間來回。副搬運機構35是將裝設後基板54供應至上模具4的下表面,將樹脂材料R供應至下模具5的模穴CAV。 Referring to Figures 6 and 7, a handling system having a resin sealing device 1 will be described. In the resin sealing device 1, the X-direction guide rail 33 is provided along the X direction from the material receiving module A via the four forming modules M to the payout module B. The main transport mechanism 32 is provided on the X-direction guide rail 33 so as to be movable in the X direction. In the main conveyance mechanism 32, the Y-direction guide rail 34 is provided along the Y direction. The sub-transport mechanism 35 of the main transport mechanism 32 is provided in the Y-direction guide rail 34 so as to be movable in the Y direction. The sub transport mechanism 35 accommodates the rear substrate 54 in the upper portion, and is under The part accommodates the resin material R. The sub transport mechanism 35 is moved back and forth between the standby position of the X-direction guide rail 33 in contact with one of the forming modules M and the upper side of the cavity CAV in the lower mold 5. The sub-transport mechanism 35 is a cavity CAV that supplies the rear substrate 54 to the lower surface of the upper mold 4 and supplies the resin material R to the lower mold 5.
在本實施例,由主搬運機構32與副搬運機構35構成的搬運機構,搬運裝設後基板54、以及以樹脂密封已被裝設於裝設後基板54的半導體晶片(未圖示)而成形後的成形品之密封後基板55二者。藉由此構成,由於由主搬運機構32與副搬運機構35構成的搬運機構兼用於搬入機構與搬出機構,簡化樹脂密封裝置1的構成。 In the present embodiment, the transport mechanism including the main transport mechanism 32 and the sub transport mechanism 35 transports the rear substrate 54 and the semiconductor wafer (not shown) that is mounted on the rear substrate 54 with resin. Both of the formed molded articles are sealed with the substrate 55. According to this configuration, the transport mechanism including the main transport mechanism 32 and the sub transport mechanism 35 also serves as the transport mechanism and the transport mechanism, and the configuration of the resin sealing device 1 is simplified.
繳出模組B具有搬運密封後基板55的成形品移送機構56、收容密封後基板55的匣57。此外,繳出模組B具有真空泵58。真空泵58是用於將包含模穴CAV的空間減壓的減壓源。亦可將真空泵58用來以樹脂密封裝置1全體為對象,作為用於吸附密封後基板54、密封後基板55等的減壓源。亦可將真空泵58設於材料接收模組A,亦可設於各成形模組M。 The delivery module B has a molded product transfer mechanism 56 that transports the sealed substrate 55, and a cassette 57 that houses the sealed substrate 55. Further, the payment module B has a vacuum pump 58. The vacuum pump 58 is a reduced pressure source for decompressing the space including the cavity CAV. The vacuum pump 58 can be used as a decompression source for adsorbing the sealed substrate 54, the sealed substrate 55, and the like, for the entire resin sealing device 1. The vacuum pump 58 may be disposed in the material receiving module A or may be disposed in each forming module M.
根據本實施例,可以將四個成形模組M之中相鄰的成形模組M的彼此,相互裝設、相互分離。藉此,可以按照需求的增大而增加成形模組M,可以按照需求的減低而減少成形模組M。例如,在工廠Fa設立的地區特定的製品的需求增大時,從設立於需求未增大的地區的工廠Fb所具有的樹脂密封裝置1,分離用於此特定的製品的生產的成形模組M(卸下成形模組M)。將分離後的成形模組M運送至工廠Fa,在工廠Fa所具有的樹脂密封裝置1,增設被運送到的成形模組M。藉此,可 以因應在工廠Fa的設立地區增大的需求。因此,根據本實施例,實現可以有彈性地對應於需求的增減之樹脂密封裝置1。 According to the embodiment, the adjacent forming modules M of the four forming modules M can be mounted to each other and separated from each other. Thereby, the forming module M can be increased as the demand increases, and the forming module M can be reduced as the demand is reduced. For example, when the demand for a region-specific product set up in the factory Fa is increased, the molding module for the production of the specific product is separated from the resin sealing device 1 of the factory Fb installed in the region where the demand is not increased. M (remove the forming module M). The separated forming module M is transported to the factory Fa, and the forming module M to be transported is added to the resin sealing device 1 of the factory Fa. By this, In response to the increased demand in the establishment of the factory Fa. Therefore, according to the present embodiment, the resin sealing device 1 which can elastically correspond to the increase or decrease of the demand can be realized.
可採用以下的變形例作為樹脂密封裝置1。在第一變形例,統合材料接收模組A與繳出模組B,將被統合後的一個接收/繳出模組配置於樹脂密封裝置1的其中一端(在第7圖為左端或右端)。在此情況,由於在樹脂密封裝置1的另一端(在第7圖為右端或左端)曝露一個成形模組M,容易進行成形模組M彼此的裝設與分離。 The following modification can be employed as the resin sealing device 1. In the first modification, the integrated material receiving module A and the payout module B are disposed at one end of the resin sealing device 1 (the left end or the right end in FIG. 7). . In this case, since one molding module M is exposed at the other end of the resin sealing device 1 (right end or left end in FIG. 7), it is easy to mount and separate the forming modules M from each other.
在第二變形例,統合材料接收模組A與一個成形模組M,將被統合後的一個接收/成形模組配置於樹脂密封裝置1的其中一端(在第7圖為左端或右端)。在此情況,在接收/成形模組裝設一個成形模組M或依序裝設複數個成形模組M。在位於樹脂密封裝置1的另一端(在第7圖為右端或左端)的成形模組M裝設繳出模組B,構成樹脂密封裝置1。 In the second modification, the integrated material receiving module A and a forming module M are disposed at one end of the resin sealing device 1 (the left end or the right end in FIG. 7). In this case, a forming module M is assembled in the receiving/forming die or a plurality of forming modules M are sequentially installed. The delivery module B is attached to the molding module M located at the other end of the resin sealing device 1 (right end or left end in FIG. 7) to constitute the resin sealing device 1.
藉由第三變形例,在樹脂密封裝置1,合併主搬運機構32與副搬運機構35作為搬入機構,而包括有別於此搬入機構的搬出機構。在此情況,由於搬入機構與搬出機構是獨立動作,在樹脂密封裝置1提升成形動作的效率。 According to the third modification, in the resin sealing device 1, the main transport mechanism 32 and the sub transport mechanism 35 are combined as a carry-in mechanism, and a carry-out mechanism different from the carry-in mechanism is included. In this case, since the loading mechanism and the unloading mechanism operate independently, the efficiency of the molding operation is increased in the resin sealing device 1.
不限於上述的變形例,只要構成為使相鄰的成形模組M的彼此,可以相互裝設、可以相互分離即可。以如此構成的樹脂密封裝置1為對象,可以適用本發明。 The present invention is not limited to the above-described modifications, and may be configured such that adjacent molding modules M can be mounted to each other and separated from each other. The present invention can be applied to the resin sealing device 1 configured as described above.
以下敘述的內容,共通適用於目前為止已敘述的各實施例。作為模具的材料,使用工具鋼等的金屬材料。不限於此,如陶瓷系材料、玻璃系材料等,使用按照模具的用途、 成形品的材料等最適合的材料。此外,作為模具的材料,可以使用在金屬材料、陶瓷系材料、玻璃系材料等的表面形成陶瓷系材料的薄膜後的複合材料。 The contents described below apply in common to the embodiments that have been described so far. As the material of the mold, a metal material such as tool steel is used. Not limited to this, such as ceramic materials, glass materials, etc., according to the use of the mold, The most suitable material such as the material of the molded article. Further, as a material of the mold, a composite material obtained by forming a film of a ceramic material on the surface of a metal material, a ceramic material, or a glass material can be used.
關於模具的種類,不限於樹脂密封用的成形模具,包含在將一般性的塑膠製品成形時所使用的塑膠用的成形模具(樹脂成形模具)。關於樹脂成形的方式,至少包含使用相對向的二個模具的方式。上述方式例如為射出成形、壓縮成形、轉移成形、吹氣成型等。關於樹脂成形的方式,包含使用一個模具的方式。上述方式例如為真空成形(將軟化後的熱塑性塑膠板、熱塑性塑膠片等吸附於一個模具的表面之成形)。 The type of the mold is not limited to a molding die for resin sealing, and includes a molding die (resin molding die) for plastic used for molding a general plastic product. Regarding the manner of resin molding, at least the method of using two opposing molds is included. The above-described methods are, for example, injection molding, compression molding, transfer molding, blow molding, and the like. Regarding the manner in which the resin is molded, a method of using one mold is included. The above-described method is, for example, vacuum forming (forming of a softened thermoplastic plastic sheet, a thermoplastic plastic sheet, or the like to the surface of one mold).
在樹脂成形模具以外,包含沖壓模具、鑄造模具、壓鑄模具、鍛造模具、擠製模具等。關於樹脂成形模具以外的模具,如沖壓模具包含相對向的一對模具,換言之為一組模具構成者。關於樹脂成形模具以外的模具,如例如用於鋁等的擠製加工的擠製模具,是包含一個模具構成者。在此情況,一個模具是相當於一組模具。 In addition to the resin molding die, a stamping die, a casting die, a die-casting die, a forging die, an extrusion die, and the like are included. Regarding a mold other than the resin molding die, for example, the press die includes a pair of opposing molds, in other words, a group of mold builders. Regarding a mold other than the resin molding die, for example, an extrusion die for extrusion processing of aluminum or the like is a mold including one mold. In this case, one mold is equivalent to a set of molds.
在模具以外,在製造裝置使用的治具類、工具類是包含於可換組件。作為這些治具類、工具類的第一例,可列舉被設於在半導體製程使用的裁切裝置(切塊機)之裁切用的工作檯(載台),其為固定被切斷物的固定治具。 In addition to the mold, the jigs and tools used in the manufacturing apparatus are included in the replaceable components. As a first example of these jigs and tools, a table (stage) for cutting a cutting device (dicing machine) used in a semiconductor manufacturing process, which is a fixed object to be cut, is exemplified. Fixed fixture.
作為第二例,可列舉被設於各種加工裝置之檯(載台),其為固定被加工物(包含被裁切物,下同)的固定治具。 As a second example, a table (stage) provided in various processing apparatuses, which is a fixed jig for fixing a workpiece (including a cut object, the same below), is exemplified.
作為第三例,可列舉被設於在機械加工使用的工作機械之固定被加工物的固定治具(夾持器、安裝具等)。根據先前 的技術,由於加工被加工物時噴射的切削油、產生的切削屑等的附著,條碼標籤本身有劣化之虞。另一方面藉由本實施例,藉由將壓縮空氣等的高壓氣體吹送至固定治具所具有的資訊形成面9a,可以縮小資訊形成面9a所受之切削油、切削屑等的影響的程度。藉此,可以穩定地讀取特定固定治具的資訊(第一資訊)。 As a third example, a fixed jig (clamp, mounting tool, etc.) which is fixed to a workpiece to be used in a machine tool used for machining can be cited. According to the previous The technique of the bar code label itself deteriorates due to the adhesion of the cutting oil sprayed during the processing of the workpiece, the generated chips, and the like. On the other hand, in the present embodiment, by blowing a high-pressure gas such as compressed air to the information forming surface 9a of the fixed jig, the degree of influence of cutting oil, chips, and the like on the information forming surface 9a can be reduced. Thereby, the information (first information) of the specific fixture can be stably read.
作為第四例,可列舉為了在各種加工裝置加工被加工物所使用的工具。關於工具,含有切削刀、旋轉刀、研磨片等。 As a fourth example, a tool used for processing a workpiece in various processing apparatuses can be cited. The tool includes a cutter, a rotary knife, an abrasive sheet, and the like.
在上述的四個例子中,藉由先前的技術,由於加工被加工物時噴射的切削水、切削液、產生的切削屑等的附著,條碼標籤本身有劣化之虞。由於切削水等的影響,RFID標籤的可靠度有下降之虞。另一方面藉由本實施例,藉由將壓縮空氣等的高壓氣體吹送至可換組件所具有的資訊形成面9a,可以縮小資訊形成面9a所受之切削水、切削屑等的影響的程度。藉此,可以穩定地讀取特定可換組件的資訊(第一資訊)。 In the above four examples, the bar code label itself has deteriorated due to the adhesion of the cutting water, the cutting fluid, the generated chips, and the like which are ejected when the workpiece is processed by the prior art. Due to the influence of cutting water and the like, the reliability of the RFID tag is degraded. On the other hand, in the present embodiment, by blowing a high-pressure gas such as compressed air to the information forming surface 9a of the exchangeable unit, the degree of influence of cutting water, chips, and the like on the information forming surface 9a can be reduced. Thereby, the information (first information) of the specific exchangeable component can be stably read.
關於藉由物品之製造裝置而製造的物品,包含藉由樹脂成形加工、沖壓加工、機械加工等製造後的完成品。此外,關於所製造的物品,包含如上述實施例中的密封後基板的半成品。 The article manufactured by the article manufacturing apparatus includes a finished product produced by resin molding processing, press working, machining, or the like. Further, regarding the manufactured article, the semi-finished product of the sealed substrate as in the above embodiment is contained.
作為被形成於標識9的資訊形成面9a的微細圖案,在藉由電鑄加工形成的微細圖案以外,可以使用以以下的加工形成的微細圖案。第一加工為機械加工。關於機械加工,在切削加工(包含振動切削加工)以外,包含噴擊(blast)加工、噴水(waterjet)加工等。 As the fine pattern formed on the information forming surface 9a of the marker 9, a fine pattern formed by the following processing can be used in addition to the fine pattern formed by electroforming. The first process is machining. Regarding machining, in addition to cutting (including vibration machining), blast processing, waterjet processing, and the like are included.
第二加工為雷射加工。雷射的種類未特別限定。使用按照被加工的材料(構成標識9的材料)之最適合的雷射。 The second process is laser processing. The type of laser is not particularly limited. The most suitable laser according to the material being processed (the material constituting the marking 9) is used.
第三加工為蝕刻加工。關於蝕刻加工,包含溼蝕刻與乾蝕刻二者。 The third process is an etching process. Regarding the etching process, both wet etching and dry etching are included.
第四加工為使膜附著於標識的表面之加工。關於,使膜附著之加工,包含網版印刷、噴墨印刷、塗裝等。在此情況,作為構成膜的材料,以使用具有高硬度、耐化學品性、耐熱性等的特性的材料為佳。在使用這些材料的情況,難以將膜從標識的表面除去。因此,可以跨越長時間、穩定地從可換組件的標識9取得資訊。 The fourth process is the process of attaching the film to the surface of the mark. The processing for attaching the film includes screen printing, inkjet printing, painting, and the like. In this case, as the material constituting the film, a material having characteristics of high hardness, chemical resistance, heat resistance, and the like is preferably used. In the case of using these materials, it is difficult to remove the film from the surface of the mark. Therefore, information can be obtained from the identification 9 of the replaceable component over a long period of time.
第五加工,是使用以光造形法為代表的積層造形法、切削造形法等的所謂三維印表機之加工。藉由這樣的三維造形法,可以在標識的表面形成微細圖案。 The fifth processing is processing using a so-called three-dimensional printer such as a laminate forming method represented by a light forming method, a cutting forming method, or the like. By such a three-dimensional forming method, a fine pattern can be formed on the surface of the mark.
將使用上述的加工而完成形成的片狀、薄板狀等的標識9黏貼於模具的表面。亦可藉由螺旋旋緊等的機械性手段,將標識9固定於模具的表面。亦可使用上述的加工,在可換組件的表面直接形成微細圖案。 A mark 9 having a sheet shape, a thin plate shape, or the like which is formed by the above-described processing is adhered to the surface of the mold. The marker 9 can also be fixed to the surface of the mold by mechanical means such as screwing. The above-described processing can also be used to form a fine pattern directly on the surface of the replaceable component.
此外,亦可使用上述的加工,製作具有標識9的可換組件本身。亦可使用上述的各種加工,製作包含於可換組件的構成元件、且為具有標識9的構成元件(例如,在樹脂成形模具的模穴區塊、柵片(gate piece)等)。 Further, the replaceable component itself having the mark 9 can also be produced using the above-described processing. It is also possible to use the various processes described above to fabricate the constituent elements included in the replaceable component and to be the constituent elements having the mark 9 (for example, a cavity block, a gate piece, or the like in a resin molding die).
作為微細圖案,可使用條碼、矩陣式二維條碼等既有的編碼。亦可使用製造裝置的製造者、使用者等適當訂定之微細圖案。例如,使微細圖案所具有的凹凸分別對應於「0」及「1」(或是「1」及「0」),可以藉由連續8個凹凸顯示1位元組(8位元)的資訊。使微細圖案所具有的凹凸分別對應於 摩斯密碼的長點及短點(或是短點及長點),可以藉由摩斯密碼顯示資訊。亦可將摩斯密碼本身形成於可換組件。其他例如訂定構成條碼中的一條(bar)的點(dot)的數量、或是構成二維條碼中的一個構成元件的點(dot)的數量作為適當數量的凹或凸,使其帶有這些凹或凸的數量的意思。 As the fine pattern, an existing code such as a bar code or a matrix type two-dimensional bar code can be used. A fine pattern which is appropriately set by a manufacturer, a user, or the like of the manufacturing apparatus can also be used. For example, if the unevenness of the fine pattern corresponds to "0" and "1" (or "1" and "0"), the information of 1 byte (8 bits) can be displayed by 8 consecutive embossments. . Making the unevenness of the fine pattern correspond to The long and short points (or short and long) of the Moss password can be displayed by the Morse code. The Moss code itself can also be formed in a replaceable component. Others, for example, the number of dots constituting one of the bar codes or the number of dots constituting one of the two-dimensional bar codes as an appropriate number of concave or convex The meaning of the number of these concave or convex.
作為微細圖案,在藉由微細加工而加工而成的凹凸以外,亦可使用藉由微細加工而加工而成的圖樣本身、影像本身。例如先對應於複數個種類的圖樣、影像等賦予各種資訊的意思,藉由辨識這些圖樣、影像等,可以讀取對應的資訊。 As the fine pattern, in addition to the irregularities processed by the microfabrication, the sample body and the image itself processed by the microfabrication may be used. For example, the information corresponding to a plurality of types of patterns, images, and the like is given first, and the corresponding information can be read by recognizing the patterns, images, and the like.
關於藉由微細加工而加工而成的圖樣本身、影像本身,包含用於特定可換組件的製造者、販賣者、關於可換組件的勞務的提供者等(以下稱為「關於可換組件的出處」)之圖樣、影像、文字等。作為微細圖案的這些圖樣、影像、文字等,亦可使用具有顯示關於可換組件的出處之功能的標識,例如公司名稱等的商號、商標(包含註冊商標)。具有顯示關於可換組件的出處之功能的標識亦可包含於微細圖案。 The sample body and the image itself processed by the microfabrication include a manufacturer, a vendor, and a provider of labor for the exchangeable component, etc. (hereinafter referred to as "replaceable component" The pattern, image, text, etc. of the source. As the patterns, images, characters, and the like of the fine pattern, a logo having a function for displaying the origin of the replaceable component, such as a trade name of a company name or the like (including a registered trademark) may be used. A label having a function of displaying the origin of the replaceable component may also be included in the fine pattern.
此外,根據本發明,可以是以下的實施例。根據此實施例,從可換組件的標識取得特定可換組件的資訊,作為第一資訊。基於從第一資訊取得的可換組件的歷程資訊(第二資訊)、換言之基於第一資訊取得的可換組件的歷程資訊,可以追蹤已被製造的物品的歷程(例如製造年月日、物品的批號、用於製造的製造裝置及可換組件等)。關於已使用此可換組件而製造的物品的歷程之資訊(物品歷程資訊;第三資訊),是被記憶於例如用於由樹脂密封裝置1或成形模具6的使用者(user)管理半 導體製程全體的伺服器所具有的記憶部、樹脂密封裝置1的控制部8所具有的記憶部ME(請參考第1A圖、第1B圖)等。根據本實施例,例如製造裝置或可換組件的使用者(user),可以將從可換組件所具有的標識取得的歷程資訊(可換組件歷程資訊;第二資訊),作為推導顯示已使用此可換組件製造的物品的可追蹤性(traceability)的物品歷程資訊(第三資訊)之資訊使用。 Further, according to the present invention, the following embodiments may be employed. According to this embodiment, the information of the specific exchangeable component is obtained from the identification of the replaceable component as the first information. Based on the history information (second information) of the exchangeable component obtained from the first information, in other words, the history information of the exchangeable component obtained based on the first information, the history of the manufactured article can be tracked (for example, manufacturing date, item, item) Batch number, manufacturing equipment used for manufacturing, and replaceable components, etc.). Information on the history of articles that have been manufactured using the replaceable component (item history information; third information) is stored in a user, for example, for management by the resin sealing device 1 or the forming die 6 The memory unit ME (see FIG. 1A and FIG. 1B) included in the memory unit of the servo unit of the resin sealing device 1 (see FIG. 1A and FIG. 1B). According to the embodiment, for example, a user who manufactures the device or the replaceable component can use the history information (replaceable component history information; second information) obtained from the identifier of the replaceable component as the derivation display. The information of the item history information (third information) of the traceability of the article manufactured by the interchangeable component is used.
本發明,並未被限定於上述實施例的內容,只要未脫離本發明的要旨的範圍內,可以依需求任意且適當地變更‧選擇而採用。 The present invention is not limited to the contents of the above-described embodiments, and may be arbitrarily and appropriately changed as needed, without departing from the scope of the present invention.
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WO2016175057A1 (en) | 2016-11-03 |
CN107530914A (en) | 2018-01-02 |
TW201707924A (en) | 2017-03-01 |
JP2016210007A (en) | 2016-12-15 |
KR20170141193A (en) | 2017-12-22 |
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