TWM552102U - System for removing defective passive components inspected in batch - Google Patents

Description

Elimination system for defective parts for batch component detection

This creation is a rejection system for defective components of batch component batch detection, and in particular, a rejection system that can automatically perform one or more passive component defect elimination according to the detection result.

At present, most of the defect rejection schemes for electronic component detection are applied to a single-row conveyor belt, mainly by placing the electronic components to be tested on the carrier of the single-row conveyor belt, and in the single row type. The defect detection device and the defect rejection device are respectively arranged in the traveling direction of the conveyor belt, and after the defect detection is performed, the defective product is recorded at the position of the conveyor belt carrier, and the carrier transport carrying the defective product is rejected by the defect. In the case of the device, the electronic components on the carrier are blown away from the single-row conveyor.

However, the defect culling device described above is not applicable to a load-bearing structure having a plurality of electronic components to be tested on the same carrier, because a plurality of electronic components on the carrier may have only a small number of defective products. Defects are excluded and cannot be picked out and excluded. Therefore, after a plurality of electronic components are mounted on a carrier for detection, only the defective product can be manually removed from the carrier, so that it is difficult to obtain improvement in rejection efficiency and rejection accuracy.

The purpose of the present invention is to apply a passive component culling device to read and analyze the defect detection information, convert the position of the passive component defect, and automatically drive the mechanical structure of the passive component culling device. The passive component defect is removed from the tape carrier.

The defect rejection system for passive component batch detection provided by the present invention comprises: a space moving unit for driving a moving mechanism according to a culling command to accurately move within a working range of a 3-dimensional space coordinate a tape carrier positioning unit for positioning a tape carrier that has been subjected to batch detection and having a plurality of passive components, correspondingly positioned within the working range; a component release unit is disposed on the mobile unit and After receiving the transport to the position of the passive component having the defect, the culling instruction is used to remove the passive component defect from the tape carrier; an input unit for reading or receiving the batch detection The passive component generates one of the detection information, the detection information includes a location of at least one defective component defect having a defect; a processing unit electrically connecting the input unit, the spatial mobile unit, and the component separation unit, For analyzing the detection information, and correspondingly converting the position of the defective component with defects into the space movement The culling command is generated after the coordinate position of the working range of the unit, and the culling command includes an instruction to move the component out of the cell to a coordinate position of the corresponding working range and an instruction to cause the component to be detached from the cell.

In one embodiment, the space moving unit is a multi-axis robotic arm or a multi-axis motion platform device.

In an embodiment, the component detaching unit is a thimble mechanism, and after moving to the passive component defect through the space moving unit, the passive component defect is impacted according to the culling command, and the passive component defect is further Remove the tape carrier.

In an embodiment, the component detachment unit is a blow nozzle mechanism, and after moving the mobile unit to the passive component defect, the passive component defect is blown off the tape carrier according to the culling command, or The component detaching unit is an air suction nozzle mechanism, and after moving to the passive component defect through the space moving unit, the passive component defect is sucked away from the tape carrier according to the culling instruction.

In one embodiment, the adhesive layer of the adhesive tape adheres to the passive component is a hot melt adhesive, and the component is detached from the cell to heat the adhesive layer of the adhesive component of the passive component to remove the hot melt. Adhesive electric heating type local heating mechanism. Alternatively, the adhesive layer of the adhesive tape adheres to the passive component is an ultraviolet light-melting adhesive, and the component is separated from the unit by irradiating UV light to the adhesive layer of the adhesive component of the passive component to remove the ultraviolet light fusion. Adhesive UV-illuminated local illumination mechanism.

The feature of the creation is that the system of the creation can automatically analyze the relative position of the defective component defect according to the detection information of the batch passive component defect detection, and then perform the passive component with the mechanical structure of the defect rejection system. Elimination of defective products, the entire passive component defect removal process is fully automated, which can improve the rejection efficiency and eliminate the correct rate.

10‧‧‧ tape carrier

11‧‧‧ glue layer

111‧‧‧Hot melt adhesive

20‧‧‧ Passive components

21‧‧‧ Passive component defects

30‧‧‧Defective reject system

301‧‧‧Space Mobile Unit

3011‧‧‧Mobile agencies

3012‧‧‧Scope of work

302‧‧‧ Tape carrier positioning unit

303‧‧‧Component separation unit

304‧‧‧ input unit

305‧‧‧Processing unit

31‧‧‧ thimble mechanism

32‧‧‧Blowing nozzle mechanism

33‧‧‧ Inhalation nozzle mechanism

34‧‧‧blade

341‧‧‧section shape

35‧‧‧Laser cutting mechanism

36‧‧‧Electrical local heating mechanism

37‧‧‧UV-illuminated local illumination mechanism

38‧‧‧ openings

A‧‧‧Test Information

B‧‧‧ omitting instructions

Steps S10~Step S30‧‧‧Steps for rejecting defective parts of batch components

Step S40‧‧‧Steps to ensure the defective product rejection method for passive component batch detection

1 is a flow chart of steps of an embodiment of a method for applying a defective component rejection detection method for a passive component; FIG. 2 is an embodiment of a defective component rejection system for passive component batch detection. The passive component is irregularly arranged to adhere to the tape carrier and detects a planar schematic view of the defective component defect; FIG. 3 is a schematic plan view showing a passive component regular arrangement of a passive component rejection system for passive component batch detection according to an embodiment of the present invention, which is adhered to a tape carrier and detects a passive component defect; FIG. 4 is a passive component batch of the present invention. A schematic diagram of a system block diagram of an embodiment of a defect detection system for sub-detection; FIG. 5 is a schematic diagram of a ejector mechanism for removing a defective component of a passive component in a passive component rejection detection method of the passive component; FIG. 6 is a schematic diagram of the passive component rejecting system for passive component batch detection according to an embodiment of the present invention, wherein the passive component defect is blown away from the tape carrier by the air blowing nozzle mechanism; FIG. 7 is a passive component batch of the present invention. A schematic diagram of the defect detection system of the sub-detection system, wherein the passive component defect is sucked away from the tape carrier by an inhalation nozzle mechanism; FIG. 8 is a defect rejection system for batch component detection of the passive component. In the embodiment, the electrothermal local heating mechanism is used to remove the passive component defect from the tape carrier; FIG. 9 is a passive component batch inspection of the present invention. A schematic diagram of removing a passive component defect from a tape carrier by a photothermal local heating mechanism according to an embodiment of the defect rejection system; FIG. 10 is a schematic diagram of a defect rejection system for passive component batch detection of the present invention. The blade edge pre-cuts the adhesive position of the tape carrier; FIG. 11 is a bottom view of the adhesive position of the tape carrier of FIG. 10; FIG. 12 is a schematic diagram of the defective component rejection system for the passive component batch detection of the present invention. The cutting and cutting mechanism pre-cuts the adhesive position of the tape carrier.

The present embodiment will be described in detail below with reference to the drawings, and the drawings are all The simplified schematic diagram is only illustrative of the basic structure, and thus only the components related to the present invention are indicated in the drawings, and the components are not drawn in the number, shape, size ratio, etc. of the implementation. The size of the actual implementation is a selective design, and its component layout form may be more complicated.

First, please refer to FIG. 1 to FIG. 5. The method for applying the defect detection system of the passive component batch detection in the present embodiment includes the following steps:

Step S10: providing a tape carrier 10 carrying and adhering a plurality of passive components 20, wherein at least one surface of the tape carrier 10 has a glue layer 11, and the passive components 20 to be detected are arranged in a regular arrangement or irregularly The adhesive layer 11 of the tape carrier 10 is adhered to the film.

Step S20: performing defect detection of the passive components 20 to detect a detection information A including at least one location of the defective passive component 21 having a defect, wherein the defect may be a defective product that does not meet the detection standard. Or, it is impossible to confirm whether the re-confirmation of the detection standard is met. The defect detection of the passive components 20 may be a detection device such as ultrasonic defect detection, appearance image defect detection or electrical connection defect detection, and obtained after the above defect detection. The detection information A can be image type image data or numerical data.

Step S30: performing culling of at least one passive component defect 21, reading and parsing the detection information A by an input unit of the defective reject system 30, and further locating the defective passive component defect 21 (for example, a relative After the coordinate point or coordinate range of a reference datum on the tape carrier corresponds to or is converted to a coordinate position in a range in which the multi-axis robot or multi-axis motion platform of the defect rejection system 30 can move, the drive The defective rejects the multi-axis robotic arm or multi-axis motion platform of system 30 to remove corresponding passive component defects 21 from the tape carrier 10.

It is worth mentioning that, after performing the above step S30, the present invention may further comprise a securing step, that is, step S40: applying a detecting means (for example, the image of the tape carrier 10 after the passive component defect 21 is removed by image detection. Comparing the images of the tape carrier 10 before the rejection of the passive component defect 21 with each other) detecting whether the passive component defect 21 of the position of the passive component defect 21 in the detection information A of the batch is completely rejected, or detecting the batch Whether or not any of the passive components 20 except the position of the passive component defect 21 in the detection information A is rejected, thereby ensuring that the defect rejection system 30 is reliable in rejecting the passive component defect 21 of the batch. Sex.

Specifically, please refer to FIG. 4 again. The defective component rejecting system 30 for passive component batch detection comprises: a space moving unit 301, a tape carrier positioning unit 302, a component detaching unit 303, an input unit 304, and a processing unit 305. The space moving unit 301 is configured to drive a moving mechanism 3011 according to a culling command B to accurately move within a working range 3012 of a 3-dimensional space coordinate; the tape carrier positioning unit is configured to perform batch type The tape carrier 10 that is loaded and adhered to the plurality of passive components 20 is correspondingly positioned within the working range 3012; the component detaching unit 303 is disposed on the moving mechanism 3011 and is transported to the passive component defect having defects After the product 21 is located, according to the culling command B, the passive component defect 21 is removed from the tape carrier 10; the input unit 304 is configured to read or receive the passive components 20 by the batch detection. And one of the output information A, the detection information A includes at least one location of the defective passive component defect 21; the processing unit is electrically connected to the input unit, the spatial mobile unit and the component is separated from the unit, To analyze the detection information A loaded by the input unit 304, and accordingly, the location of the passive component defect 21 having the defect (generally corresponding to the tape carrier 10) One particular point of reference mark) for the conversion corresponds to the empty After the coordinate position of the working range 3012 of the moving unit 301, the culling command B is generated, and the culling command B includes an instruction to move the component escaping unit 303 to the coordinate position of the corresponding working range 3012 and disengage the component from the unit. 303 an instruction to perform the culling action.

In detail, as shown in Figure 5. The defect rejecting system 30 (the component detaching unit 303) is moved by a reciprocating ejector mechanism 31 to the position of the passive component defect 21 and impacted, thereby moving the passive component defect away from the tape carrier. 10.

In an embodiment, as shown in FIG. The defective product rejection system 30 (the component release unit 303) blows the passive component defect 21 away from the tape carrier 10 by a blow nozzle mechanism 32 that moves to the position of the passive component defect 21, or as shown in FIG. As shown, the defect rejection system 30 draws the passive component defect 21 away from the tape carrier 10 by an inhalation nozzle mechanism 33 as moved to the position of the passive component defect 21.

In an embodiment, as shown in FIG. The adhesive layer 10 adheres the adhesive layer 10 of the passive component 20 to a hot melt adhesive (when heated to a specific temperature, the fixed colloid can be liquefied, thereby releasing the adhesive state), and the defective reject system 30 (the component The disengagement unit 303) is heated by the electrothermal local heating mechanism 36 (as shown in FIG. 8) to the adhesive layer 11 of the corresponding passive component defect 21 to remove the adhesiveness of the hot melt adhesive. The passive component defect 21 is detached from the tape carrier 10.

In another embodiment, as shown in FIG. The adhesive layer 10 of the adhesive tape carrier 10 is adhered to the ultraviolet light-melting adhesive (which is irradiated with UV light to release the adhesive state), and the defect rejection system 30 (the component release unit 303) is UV-illuminated. The local illumination mechanism 37 (shown in FIG. 9) irradiates the adhesive layer 11 of the corresponding passive component defect 21 with UV light to remove the adhesion of the ultraviolet melt adhesive, thereby making the passive component defective. 21 off From the tape carrier 10.

In addition, in practice, the adhesive layer 11 of the tape carrier 10 has a certain degree of adhesion, which can increase the removal of the passive component defect 21 to a certain extent, so before the passive component defect 21 is removed. The tape carrier 10 at the position of the passive component defect 21 can be cut open to an opening 38 in advance to moderately reduce the fixing strength of the passive component defect 21, as shown in FIGS. 10 and 11 : the defect rejection system 30 A blade 34 may be further included, and the blade 34 (which may of course be moved by the moving mechanism 3011) will be corresponding to the passive component defect 21 before the passive component defect 21 is removed from the tape carrier 10. The adhesive position of the tape carrier 10 is defined by at least one opening 38. Of course, in FIGS. 10 and 11, the cross-sectional shape 341 of the blade 34 is a cross shape, so that the opening 38 cut out in FIG. 11 has the same shape, and In the present creation, the cross-sectional shape 341 of the blade 34 is not limited to the cross type, and any shape or shape of the opening or the groove which causes the adhesive force of the adhesive position of the adhesive layer 10 of the tape carrier 10 is reduced. Furthermore, as shown in FIG. 12, the manner in which the tape carrier 10 is cut may be as follows: the defect rejecting system 30 further includes a laser cutting mechanism 35 (of course, it may be moved by the moving mechanism 3011). And before the passive component defect 21 is removed from the tape carrier 10, the adhesive position of the tape carrier 10 corresponding to the passive component defect 21 is previously cut out by laser to at least one opening 38.

The embodiments or examples of the technical means used herein are not intended to limit the scope of implementation of the patent. All changes and modifications in accordance with the scope of this patent application, or in accordance with the scope of this patent, are covered by this patent.

30‧‧‧Defective reject system

301‧‧‧Space Mobile Unit

3011‧‧‧Mobile agencies

3012‧‧‧Scope of work

302‧‧‧ Tape carrier positioning unit

303‧‧‧Component separation unit

304‧‧‧ input unit

305‧‧‧Processing unit

A‧‧‧Test Information

B‧‧‧ omitting instructions

Claims (6)

A defective component rejection system for passive component batch detection, comprising: a space moving unit for driving a moving mechanism to accurately move in a working range of a 3-dimensional space coordinate according to a culling command; a tape carrier a positioning unit for positioning a tape carrier that has been subjected to batch detection and having a plurality of passive components adhered thereto, and correspondingly positioned in the working range; a component separation unit is disposed on the moving mechanism and is transported by the same After moving to the location of the defective passive component, the culling instruction is used to remove the passive component defect from the tape carrier; an input unit is configured to read or receive the passive component by the batch detection And generating a detection information, where the detection information includes a location of at least one defective component defect having a defect; and a processing unit electrically connecting the input unit, the space moving unit and the component separation unit, Analyzing the detection information, and correspondingly converting the position of the defective component with the defect to the spatial mobile unit The culling command is generated after the coordinate position of the working range, and the culling command includes an instruction to move the component out of the cell to a coordinate position of the corresponding working range and an instruction to cause the component to be detached from the cell to perform the culling action. The defect rejection system for passive component batch detection according to claim 1, wherein the space movement unit is a multi-axis robot arm or a multi-axis motion platform device. The defect rejection system for batch component detection of the passive component according to claim 1, wherein the component separation unit is a thimble mechanism, and after moving to the passive component defect through the space moving unit, according to the rejection An instruction is made to impact the passive component defect to move the passive component defect away from the tape carrier. A defective product rejection system for batch component detection of a passive component as described in claim 1 The component detaching unit is a blowing air nozzle mechanism, and after moving to the passive component defect through the space moving unit, the passive component defect is blown off the tape carrier according to the culling instruction, or the component detaching unit After the moving unit moves to the passive component defect through the air moving nozzle mechanism, the passive component defect is sucked away from the tape carrier according to the culling instruction. The defect rejection system for batch component detection of the passive component according to claim 1, wherein the adhesive layer of the adhesive tape adheres to the passive component is a hot melt adhesive, and the component is separated from the unit. The electrothermal local heating mechanism for heating the adhesive layer of the passive component defect area to dissipate the adhesion of the hot melt adhesive. The defect rejection system for batch component detection of the passive component according to claim 1, wherein the adhesive layer of the adhesive tape adheres to the passive component is an ultraviolet light-melting glue, and the component is separated from the unit. The adhesive layer of the passive component defect is irradiated with UV light to remove the UV-light localized illumination mechanism of the adhesive of the ultraviolet light-melting adhesive.