CN110234484A - Image capture method and resin sealing apparatus in resin sealing apparatus - Google Patents
Image capture method and resin sealing apparatus in resin sealing apparatus Download PDFInfo
- Publication number
- CN110234484A CN110234484A CN201880009373.1A CN201880009373A CN110234484A CN 110234484 A CN110234484 A CN 110234484A CN 201880009373 A CN201880009373 A CN 201880009373A CN 110234484 A CN110234484 A CN 110234484A
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- formed products
- resin
- sealing apparatus
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- 239000011347 resin Substances 0.000 title claims abstract description 206
- 229920005989 resin Polymers 0.000 title claims abstract description 206
- 238000007789 sealing Methods 0.000 title claims abstract description 104
- 238000000034 method Methods 0.000 title claims abstract description 37
- 239000000758 substrate Substances 0.000 claims abstract description 160
- 230000032258 transport Effects 0.000 claims abstract description 81
- 239000000463 material Substances 0.000 claims abstract description 69
- 239000004065 semiconductor Substances 0.000 claims abstract description 20
- 238000011068 loading method Methods 0.000 claims description 112
- 238000003860 storage Methods 0.000 claims description 50
- 238000010792 warming Methods 0.000 claims description 45
- 238000000465 moulding Methods 0.000 claims description 25
- 230000000694 effects Effects 0.000 claims description 13
- 230000010365 information processing Effects 0.000 claims description 10
- 230000003068 static effect Effects 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000003384 imaging method Methods 0.000 claims description 7
- 238000004140 cleaning Methods 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 14
- 239000000047 product Substances 0.000 description 202
- 239000011265 semifinished product Substances 0.000 description 47
- 238000012544 monitoring process Methods 0.000 description 25
- 230000002159 abnormal effect Effects 0.000 description 18
- 238000010586 diagram Methods 0.000 description 16
- 238000007689 inspection Methods 0.000 description 14
- 238000009740 moulding (composite fabrication) Methods 0.000 description 12
- 238000012790 confirmation Methods 0.000 description 8
- 238000010276 construction Methods 0.000 description 8
- 238000004064 recycling Methods 0.000 description 8
- 230000002950 deficient Effects 0.000 description 6
- 239000000428 dust Substances 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000006227 byproduct Substances 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 230000005856 abnormality Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- 241000222712 Kinetoplastida Species 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
It provides in the production process of resin sealing apparatus, when the bad phenomenon of product occurs, it is possible to easily determine image capture method and resin sealing apparatus in the resin sealing apparatus of its reason.The resin sealing apparatus of semiconductor packages, which has, transports the resinous flat of the lead frame as substrate and the resin material as resin seal to the material supply part (1) of scheduled position.In material supply part (1), as the camera unit imaged to lead frame, it is provided with conveying unit camera (13) and conducting wire is examined with camera (14).In conveying unit in camera (13), about each lead frame transported by conveying unit (111), the camera shooting information of animation is obtained.
Description
Technical field
The present invention relates to the image capture methods and resin sealing apparatus in resin sealing apparatus.
Background technique
In the resin sealing apparatus encapsulated by resin molded manufacturing semiconductor, to the substrate equipped with semiconductor element into
Row resin seal carries out each operation until as product storage via multiple components.
In the component for constituting the resin sealing apparatus, there is the material supply part of supply substrate and resin material, by base
Material etc. transports the resin seal component to the loading machine of resin seal component and the resin seal for carrying out substrate.According to resin
The warming member heated to the substrate before being transported to resin seal component is arranged in the type of sealing device.
In addition, carrying out the component of the formed products of resin seal to substrate as disposition, there are conveying and the mould of the product of being formed
The portion cast gate (degater) is gone in the unwanted parts such as the cleaner component (unloader) of the cleaning of tool, removal defective material, runner
Part and storage remove the product storage member of the formed products behind unwanted part
For the product stored via the operation in these each components, the inspection for the quality for being confirmed whether to meet the requirements is carried out
It looks into.In addition, in order to determine its reason and be corresponded to, carrying out the management of production process when the bad phenomenon of product occurs.
As the countermeasure for managing the production process in such resin sealing apparatus, it is related with production process to propose record
The information of time, molding condition such as resin sealing apparatus described in Patent Document 1.
Resin sealing apparatus described in Patent Document 1 has control unit, storage unit, display unit and input unit.In addition,
Resin sealing apparatus has other states (such as job information) detection in state related with mold, resin sealing apparatus
For the test section of detected value.
In addition, storage unit will be recorded by the value of the detection such as test section, input unit, input in control unit.For example, in the storage
In portion, time needed for recording each process of forming, at the time of carry out the process, when the number that carries out contour forming, each forming
Molding condition etc..
In the resin sealing apparatus, the information for being recorded in storage unit is used for include the mould parts of mold management.
It is exported in addition, molding condition can be mapped with formed products as product information, so as to be easy to carry out forming item
The amendment of part.
Existing technical literature
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2017-87648 bulletin
Summary of the invention
However, about the product for generating bad phenomenon, being able to confirm that in resin sealing apparatus described in Patent Document 1
Historical information related with the time shaped with resin sealing apparatus, indicate include the production unit of the product Mission Number
Information, but be difficult to find out the reason of leading to bad phenomenon.
That is, not becoming about the multiple components for constituting resin sealing apparatus, it is able to confirm that the bad phenomenon for leading to product
Such device put occurs in the operation of which component for abnormal phenomenon.
Therefore, need to confirm the production process of each component in the specific situation of bad phenomenon in the inspection of product.It is tied
Fruit spends a large amount of labour and time in the movement of each component, the confirmation of state sometimes.
In addition, showing for the exception in the operation for leading to the component of bad phenomenon of product can not be reproduced in verifying sometimes
As.Therefore, sometimes up to observing the phenomenon that being abnormal in the operation of component or until operator obtains and do not occur
One judgement answered of abnormal phenomenon, is repeated the processing of confirming operation, substrate in 1 component.
In turn, the operation of substrate or formed products is transported due to jointly carrying out to each component, it is possible that in any portion
Cause the abnormal phenomenon in conveying in part.As a result, the determination for the component being abnormal is more difficult from.
According to such as above point, in the production process using resin sealing apparatus, not for promptly corresponding product
Good phenomenon is strongly required to ensure the trackability of each product.
The present invention is completed in view of above point, and its purpose is to provide a kind of production works in resin sealing apparatus
In sequence, when the bad phenomenon of product occurs, it is possible to easily determine image capture method in the resin sealing apparatus of its reason with
And resin sealing apparatus.
In order to achieve the above objectives, the present invention provides the image capture method in a kind of resin sealing apparatus, resin seal dress
Set and have: material supply part transports the substrate equipped with semiconductor element to predetermined position；And loading machine, it will be by this
The substrate of material supply part conveying is transported to the resin seal component for carrying out resin seal to the substrate, wherein is had
The carrying channel of transport path in the substrate using the material supply part and the substrate using the loading machine
In at least part of diameter, to the substrate substantially common direction, it is right and while with same speed activity
The process that the substrate is imaged.
Here, passing through the conveying of the transport path in the substrate using material supply part and the substrate using loading machine
In at least part in path, substrate is imaged, can obtain capturing the state of the substrate before resin seal, movable
Image information.That is, can be taken the photograph to the appearance transported by material supply part, loading machine about the substrate before resin seal
Picture will be captured as camera shooting information the phenomenon that becoming the reason for damage, the deformation of substrate etc. and confirm.
In addition, by while to substrate substantially common direction and with same speed activity to substrate
It is imaged, the fixation almost not moved as substrate can be obtained in the state that the relative velocity for substrate is close to zero
The camera shooting information of image.As a result, the appearance of conveying substrate becomes prone to confirm.Opposite conveying substrate direction, conveying
When the offset of speed becomes larger, the appearance for becoming substrate is not easy the camera shooting information confirmed.
In addition, referred to herein " to substrate substantially common direction, and it is movable same with same speed
When " refer to, material supply part, loading machine are held including the camera unit to material supply part, loading machine installation substrate
The method for carrying on a shoulder pole the movement of camera unit；With mobile unit that setting independently drives with material supply part, loading machine and to this
The camera unit of mobile unit installation substrate and the method moved it.
In addition, " camera shooting " referred to herein refers to, mean to record with animation mode in principle the state of the substrate of conveying,
Activity, but in addition to this, it can also further include the scheme for recording static image.
In addition, the transport path of the transport path in the substrate using material supply part and the substrate using loading machine
At least part in, in the case that the state static to substrate images, be not only the state of substrate, the activity of conveying,
And it is also easy to obtain the camera shooting information by focus to the thin construction for arriving substrate.As a result, it is possible to confirm in the thin of substrate
Have in construction portion without exception.
In addition, carrying out at least the one of the transport path of the formed products of resin seal to substrate with resin seal component in conveying
In part, to formed products substantially common direction and to be taken the photograph while same speed activity to formed products
As in the case where, be not only substrate, and the formed products after being sealed by resin about substrate, can also obtain capturing its state,
Movable camera shooting information.That is, can image to the appearance of conveying formed products, the damage for formed products, deformation will be become
Deng reason the phenomenon that be captured as camera shooting information and confirm.
In addition, by while to formed products substantially common direction and with same speed activity at
Shape product are imaged, and can obtain almost not moving as formed products in the state that the relative velocity for formed products is close to zero
The camera shooting information of dynamic fixation image.As a result, the appearance of conveying formed products becomes prone to confirm.In opposite conveying formed products
Direction, conveying the offset of speed when becoming larger, become the camera shooting information for the appearance for being difficult to confirm formed products.
In addition, referred to herein " to movable with formed products substantially common direction and with same speed
Refer to simultaneously ", including the side for the movement installed camera unit to the device for transporting formed products and the device is made to undertake camera unit
Method；Camera shooting with from the mobile units that independently drive of device of setting and conveying formed products to mobile unit installation formed products
Unit and the method moved it.
In addition, the transport path of the transport path in the substrate using material supply part and the substrate using loading machine
In respective transport path, in the case where imaging to substrate, the camera shooting information of substrate can be obtained in all parts.Its
As a result, it is possible to more readily determine the component for generating the abnormal phenomenon for the bad phenomenon for leading to product.That is, by being supplied in material
Substrate is imaged in the transport path of component, the exception of the conveying in material supply part can be imaged, also,
It is easy to have in the substrate in the time point confirmation supplied as material without exception.In addition, by the transport path of loading machine
Substrate is imaged, the exception of the conveying of the substrate in loading machine can be imaged, also, be easy to confirm loading machine with
Exception when receiving or handover of the substrate between material supply part, between loading machine and resin seal component etc..
In addition, in order to achieve the above objectives, resin sealing apparatus of the invention has: material supply part, it will be equipped with
The substrate of semiconductor element is transported to predetermined position；And loading machine, the substrate transported by the material supply part is removed
It send to the resin seal component for carrying out resin seal to the substrate, wherein have and be installed on the material supply part and institute
At least one party for stating loading machine, the substrate camera unit that the substrate is imaged.
Here, being installed on material supply part and loading machine extremely by the substrate camera unit imaged to substrate
A few side, can make material supply part, the driving of loading machine undertakes the movement of substrate camera unit, can simplify for being arranged
The construction of substrate camera unit.In addition, state, the movable camera shooting information of the substrate before resin seal can be obtained capturing.
In addition, at least one party of material supply part and loading machine is installed on by substrate camera unit, it can be in needle
To the relative velocity of substrate close in the state of zero, the camera shooting information of fixation image almost not moved as substrate is obtained.Its
As a result, the appearance of conveying substrate becomes prone to confirm.
In addition, in order to achieve the above objectives, resin sealing apparatus of the invention has: material supply part, it will be equipped with
The substrate of semiconductor element is transported to predetermined position；And loading machine, the substrate transported by the material supply part is removed
It send to the resin seal component for carrying out resin seal to the substrate, wherein mobile unit is included, it can be along described in utilization
At least one of the transport path of the substrate of the transport path and utilization loading machine of the substrate of material supply part
Point, with transport the substrate active synchronization while, to mobile with the substrate substantially common direction；And substrate camera shooting is single
Member is installed on the mobile unit, images to the substrate.
Here, can be arranged by that can be filled in the transport path of the substrate along utilization material supply part and utilization
At least part of the transport path of the substrate of carrier aircraft, while active synchronization with conveying substrate, to roughly the same with substrate
The mobile mobile unit in direction, the tectosome of the substrate with material supply part or loading machine conveying can be tracked.In addition,
Mobile unit is configured to move along the transport path of substrate, so mobile unit can kept and the substrate of conveying
Apart from while it is mobile.
It can be along utilization material supply part in addition, being installed on by the substrate camera unit imaged to substrate
Substrate transport path and using loading machine the substrate transport path at least part and transport substrate activity
To the mobile unit mobile with substrate substantially common direction while synchronous, mobile unit and substrate camera unit are being kept
It moves in the state that the relative velocity for substrate is close to zero while at a distance from substrate and photographs to substrate, so
It can obtain the camera shooting information of fixation image almost not moved as substrate.As a result, the appearance of conveying substrate becomes prone to
Confirmation.Relative to conveying substrate direction, transport the movable offset of substrate and become larger when, what the appearance for becoming substrate was not easy to confirm
Image information.In addition, referred to herein synchronizing refers to, make the movable timing of substrate of the movable timing of mobile unit and conveying
Tuning.
In addition, being heated having to substrate, and loading machine receives the warming member for the substrate being heated, and has
In the case where the pre- hot substrate camera unit imaged to the substrate being heated, the state for the substrate that heating can be deformed
It is imaged.When substrate is heated, sometimes due to temperature change and the deformation such as generate substrate camber.Moreover, because substrate is big
Amplitude variation shape can cannot receive loading machine to transport undesirable imaged as the substrate and confirm below.
In addition, unloader is installed on by the formed products camera unit imaged to formed products, go mold gate components and
At least one of product storage member can make the driving of unloader etc. undertake the movement of formed products camera unit, can simplify use
In the construction of setting formed products camera unit.In addition, can obtain capturing the state of the formed products after resin seal, movable take the photograph
As information.
In addition, being installed on unloader by formed products camera unit, going at least the 1 of mold gate components and product storage member
It is a, the fixation figure almost not moved as formed products can be obtained in the state that the relative velocity for formed products is close to zero
The camera shooting information of picture.As a result, the appearance of conveying formed products becomes prone to confirm.
It is transported in addition, being installed in the formed products camera unit imaged to formed products from the receiving of resin seal component
In the case where the unloader for carrying out the formed products of resin seal to substrate with resin seal component, formed products camera unit and unloading
Machine is movable together, it is easier to capture state, the activity of the formed products transported by unloader.That is, can to the formed products of conveying into
Row camera shooting, and confirm resin seal formed products appearance in deformation, damage, resin seal when resin leakage generation
Deng.
It is removed in addition, being installed in the formed products camera unit imaged to formed products from unloader handover formed products
The unwanted resin portion of formed products and transport formed products remove mold gate components in the case where, formed products camera unit with go
Mold gate components are movable together, it is easier to capture state, the activity of the formed products by going mold gate components to transport.That is, can be to conveying
Formed products imaged, and confirm defective material, runner etc. the formed products before and after the removal of unwanted resin portion deformation,
The generation of damage.
In addition, the formed products camera unit that formed products are imaged be installed on from go mold gate components join and transport at
In the case where the product storage member of shape product, formed products camera unit is movable together with product storage member, it is easier to capture by
The state of the formed products of product storage member conveying, activity.That is, being able to confirm that the unwanted resin portions such as removal defective material, runner
The generation of the exceptions of conveying of formed products, the deformation of formed products, damage after point.In addition it is possible to confirm being not required to for formed products
The degree of the removal for the resin portion wanted.
In addition, can be arranged by can along the formed products using unloader transport path, using removing gate part
At least part of the transport path of the formed products of the transport path and utilization product storage member of the formed products of part, with conveying
While the active synchronization of formed products, to the mobile unit mobile with formed products substantially common direction, it can track by unloading
The tectosome of machine, the substrate for going mold gate components or product storage member to transport.In addition, mobile unit be configured to along at
The transport path of shape product is mobile, so mobile unit can be mobile while keeping at a distance from the formed products of conveying.
It can be along utilization unloader in addition, being installed on by the formed products camera unit imaged to formed products
The transport path of formed products, the transport path using the formed products for removing mold gate components and the formed products using product storage member
Transport path at least part and transport formed products active synchronization while to formed products substantially common direction move
Dynamic mobile unit, mobile unit and formed products camera unit are while keeping at a distance from formed products, for forming
The relative velocity of product is moved close in the state of zero and is photographed to formed products, so can not obtain as formed products almost not
The camera shooting information of mobile fixation image.As a result, the appearance of conveying formed products becomes prone to confirm.In opposite conveying formed products
Direction, movable offset when becoming larger that transports formed products, become the camera shooting information for the appearance for being difficult to confirm formed products.
In addition, being imaged and being given birth to substrate or formed products assigning the identification information that can identify substrate to substrate
At camera shooting information be mapped with identification information in the case where, each substrate, formed products can be identified by identification information.
In addition, merging record and common knowledge in camera shooting information processing record portion in the case where imaging information has multiple
In the case where the camera shooting information that other information association is got up, the information collection that can will be additional to same substrate and formed products and image
In be recorded as an information, can make confirmation camera shooting information operation become easy.
In addition, reference information on the basis of imaging information judegment part and being recorded as, and will to substrate or formed products into
The camera shooting information that row is imaged and generated is compared with reference information, the difference in appearance to differentiate substrate or formed products
In the case of, bad phenomenon can occur in substrate or formed products according to differentiating as a result, detecting.That is, can be with each component
Transport the generation of the timing confirmation bad phenomenon of substrate or formed products.
In addition, having the resin seal mould clamped substrate with land area and carry out resin seal in resin seal component
Tool, after unloader has the cleaner portion for cleaning the land area after carrying out resin seal to substrate and cleans to cleaner portion
The dust etc. in die surface in the case where the mold camera unit that the land area is imaged, after being able to confirm that resin seal
Attachment.As a result, in resin seal, when clamping dust and the bad phenomenon of the product of resin seal occurring, it is easy to confirm
Its reason.
Image capture method and resin sealing apparatus in resin sealing apparatus according to the present invention is in resin sealing apparatus
Production process in, occur product bad phenomenon when, it is possible to easily determine its reason.
Detailed description of the invention
Fig. 1 is the schematic top view explanatory diagram for showing an example of resin sealing apparatus for semiconductor packages.
Fig. 2 is the schematic top view explanatory diagram for showing the 1st embodiment of resin sealing apparatus according to the present invention.
Fig. 3 is the block diagram for showing the outline of monitoring terminal.
Fig. 4 is material supply part, the loading shown in the 2nd embodiment of resin sealing apparatus according to the present invention
The schematic top view explanatory diagram of a part of machine and punch components.
Fig. 5 is to show the process until the process of the completion of the camera shooting and inspection operation of the substrate etc. in resin sealing apparatus
Figure.
(symbol description)
1: material supply part；11: lead frame feedway；110: cut-out portion；111: conveying unit；111a: guide portion；
112: rotating part；12: resinous flat feedway；13: conveying unit camera；13B: conveying unit camera；130: track
Portion；130B: moving body；14: camera is used in conducting wire inspection；2: loading machine；21: loading machine camera；21B: loading machine shines
Camera；210: orbit portion；210B: moving body；3: warming member；31: warming member camera；4: unloader；41: unloader
Use camera；42: mold camera；5: removing mold gate components；50: blank head；51: removing mold gate components camera；6: producing
Product storage member；61: pickup section；62: recycling box portion；63: product storage member camera；7: punch components；71: the 1 punchings
Splenium part；710: mold for resin-molding；72: the 2 punch components；720: mold for resin-molding；73: the 3 punch components；
730: mold for resin-molding；8: terminal is used in monitoring；81: camera shooting information processing record portion；82: camera unit control unit；83: different
Normal determination unit.
Specific embodiment
Hereinafter, illustrating specific embodiment (hereinafter referred to as " embodiment ") referring to attached drawing.
In addition, in the present embodiment, on the basis of Fig. 1, the position of 5 opposing product storage member 6 of mold gate components will be gone to
Being set as " rear " perhaps " rear " goes to the position of mold gate components 5 to be set as " preceding " or " front " for product storage member 6 is opposite.Separately
Outside, the position by unloader 4 with respect to loading machine 2 is set as " right side " or " right ", and the position by loading machine 2 with respect to unloader 4 is set
For " left side " or " left ".In addition, on the basis of Fig. 1, by the "upper" being set as in front of paper in vertical direction or " top ",
The inboard of paper is set as to "lower" or " lower section " in vertical direction.
(resin sealing apparatus)
Firstly, referring to Fig.1, illustrating the summary for constituting the various parts of the resin sealing apparatus of semiconductor packages.In addition, ginseng
According to Fig. 2, illustrate the resin seal that camera unit (camera) is provided in the various parts of resin sealing apparatus shown in Fig. 1
The construction of device A.Resin sealing apparatus A shown in Fig. 2 is the 1st embodiment of the invention.
As shown in Figure 1, the resin sealing apparatus of semiconductor packages has: material supply part 1, by the lead as substrate
The resinous flat (all diagram is omitted) of frame and the resin material as resin seal is transported to scheduled position；And it loads
The lead frame and resinous flat that are supplied by material supply part 1 are transported to punch components 7 by machine 2.In addition, resin seal fills
Set and have: punch components 7 carry out resin seal to the lead frame equipped with semiconductor element (diagram is omitted)；And unloading
Machine 4, from punch components 7 take out resin seal after formed products, conveying is to removing mold gate components 5.In addition, punch components 7 are resins
One example of seal member.
In turn, resin sealing apparatus has: removing mold gate components 5, removes the unwanted part as resin from formed products
Defective material, runner etc.；And product storage member 6, it transports and stores from formed products and remove the half of unwanted part into forming
Product (hereinafter referred to as " semi-finished product ").In addition, resin sealing apparatus has the heating of the lead frame before making to be transported to punch components 7
Warming member 3.
(material supply part)
Material supply part 1 has lead frame feedway 11 and resinous flat feedway 12.
In addition, lead frame feedway 11 includes cut-out portion 110, from the lead frame box for loading multiple lead frames
(diagram is omitted) sends out lead frame；Conveying unit 111 rearward transports lead frame towards aftermentioned rotating part 112；And rotation
Transfer part 112 makes the direction of the lead frame transported out from conveying unit 111 from its length direction and the substantially parallel court of front-rear direction
The substantially parallel direction rotation of Xiang Xiangyu left and right directions.
In addition, the length direction of lead frame becomes the rotating part towards in the state of substantially parallel with left and right directions
The lead frame maintaining part (diagram is omitted) that the position of lead frame on 112 becomes aftermentioned loading machine 2 receives lead frame
Position.
In addition, resinous flat feedway 12 is the device for making the resinous flat of supply be arranged.Configured with the resin
The resinous flat maintaining part (diagram is omitted) that the position of the resinous flat of plate feedway 12 becomes aftermentioned loading machine 2 receives tree
The position of rouge plate.
In addition, conveying unit 111 is along the guide portion 111a being arranged substantially in parallel with front-rear direction, cut-out portion 110 with
It is moved between rotating part 112.The end edge portion of 111 clamping lead frame of conveying unit rearward stretches lead frame and transports to rotation
Transfer part 112.
In addition, with arrow Y11Indicate the mobile direction of conveying unit 111.In addition, with arrow R11Indicate that rotating part 112 rotates
Direction.
Here, material supply part 1 is not necessarily to centainly be made of cut-out portion 110, conveying unit 111 and rotating part 112, only
To become the construction that lead frame and resinous flat can be supplied to loading machine 2.
In addition, conveying unit 111 be not necessarily to certain clamping lead frame end edge portion, rearward stretch lead frame and transport to
Rotating part 112.For example, it is also possible to using by the way of being transported to rear with mounting lead frame on conveyer.
(loading machine)
Loading machine 2 has lead frame maintaining part and resinous flat maintaining part (all diagram is omitted).
Lead frame maintaining part can receive and remain in the lead frame of the rotating part 112 of lead frame feedway 11
Frame carries out the handover and receiving of lead frame between warming member 3.In addition, lead frame maintaining part can will be from preheating
The lead frame that component 3 receives is transferred to aftermentioned mold for resin-molding 710,720,730.Lead frame maintaining part is configured to
Enough chuck segments (illustrate and omit) clamping lead frame and keep.
In addition, resinous flat maintaining part can receive and to be maintained at the resin that arranges in resinous flat feedway 12 flat
Plate is transferred to aftermentioned mold for resin-molding 710,720,730.
In addition, with arrow X2(left and right directions) and arrow Y2(front-rear direction) indicates the mobile direction of loading machine 2.
(punch components)
Punch components 7 have the 1st punch components 71, the 2nd punch components 72 and the 3rd punch components 73.In addition, each punching
Splenium part 71,72,73 is respectively provided with mold for resin-molding 710, mold for resin-molding 720 and mold for resin-molding
730。
Lead frame and resinous flat are transported to each mold for resin-molding 710,720,730, is drawn with each mold
The semiconductor packages for being equipped with semiconductor element (diagram is omitted) is formed in the resin seal of wire frame.In addition, pressing part
Part 7 etc. is also possible to a position, additionally it is possible to two positions or four positions or more be arranged.In addition, by each punch components 71,
72, the semiconductor package of 73 formings is in each punch components 71,72,73 either identical type, is also possible to different
Type.
(unloader and warming member)
Unloader 4 has formed products maintaining part and cleaner portion (all diagram is omitted).
Formed products maintaining part can be taken out and keep by the forming of each 710,720,730 resin seal of mold for resin-molding
Product are transferred to aftermentioned blank head 50.In addition, the removal of cleaner portion is attached to each mold for resin-molding after resin seal
710, the foreign matters such as the dust on 720,730 surface.
In addition, being integrally set side by side with warming member 3 in unloader 4.Warming member 3 makes from the handover of loading machine 2
Lead frame heating, and heated preparedly before resin seal.By the heating, lead frame caused by heat when checking forming
The deformation of frame.
In addition, with arrow X4(left and right directions) and arrow Y4(front-rear direction) indicates that unloader 4 and warming member 3 move
Dynamic direction.
Here, resin sealing apparatus is without centainly having warming member 3.For example, if lead frame be not easy due at
Heat when shape and shape, the size, raw material deformed, then can also be not provided with warming member 3.
In addition, being scheduled in unloader 4 without one, warming member 3 is integrally set side by side.It is arranged in resin sealing apparatus
In the case where warming member 3, its position, which is arranged, suitably to change.
(removing mold gate components)
Go mold gate components 5 that there is the cropping from the unwanted part of the resins such as formed products removal defective material, runner, cast gate
(degate) portion 50.In blank head 50, according to the quality required in semi-finished product, the unwanted part of resin is removed.
In addition, going mold gate components 5 mobile along the guide portion (diagram is omitted) being set in parallel with left and right directions.In addition,
With arrow X5Indicate the direction for going mold gate components 5 mobile.
(product storage member)
Product storage member 6 includes pickup section 61, keeps removing unwanted part from formed products by blank head 50
Semi-finished product；And recycling box portion 62, store semi-finished product.
Pickup section 61 from go mold gate components 5 receive and keep semi-finished product, be transported to recycling box portion 62.In recycling box portion 62
In, the semi-finished product of conveying are incorporated in recycling box (diagram is omitted), after the semi-finished product of the number needed for storage, for each recycling
Box is recovered to the outside of resin sealing apparatus.
In addition, pickup section 61 is removing cast gate along the guide portion (diagram is omitted) being arranged substantially in parallel with front-rear direction
It is moved between component 5 and recycling box portion 62.In addition, with arrow Y6Indicate the mobile direction of pickup section 61.
Next, explanation is provided with the construction of the resin sealing apparatus A of camera unit in above-mentioned resin sealing apparatus.
(camera unit in material supply part)
As shown in Fig. 2, as the camera unit imaged to lead frame, being provided with and removing in material supply part 1
Send portion's camera 13 and conducting wire inspection camera 14.
Conveying unit camera 13 is mounted to conveying unit 111, and monitoring by cut-out portion 110 from lead frame box until sent out
Lead frame be transported to rotating part 112 state photographic device.In addition, figure and extraction is represented by dashed line in Fig. 2
The symbol 13 of line indicates the conveying unit camera 13 when conveying unit 111 is located at front.
In conveying unit in camera 13, about each lead frame transported by conveying unit 111, the camera shooting of animation is obtained
Information.Camera shooting information is sent and aftermentioned monitoring terminal 8 is recorded (referring to Fig. 4).
In addition, in conveying unit in camera 13, for example, to being sent out from lead frame box and the sample of static lead frame
Son, the appearance of end edge portion of 111 clamping lead frame of conveying unit, clamping and transport the appearance of lead frame, be transported to rotating part
112 and the appearance etc. of static lead frame imaged.In addition, at this time, appearance, the appearance of bonding lead of lead frame
Also it is imaged.
By imaging to them, when being transported using conveying unit 111, the phenomenon that lead frame can jump, is removed
The phenomenon that sending portion 111 to contact with bonding lead etc. has the abnormal of a possibility that damage for leading to lead frame, bonding lead to show
As obtaining as the camera shooting information of animation related with the lead frame.
In addition, using hacures shown in symbol 13a, illustrating the range imaged by conveying unit camera 13 in Fig. 2
An example.
Conducting wire inspection camera 14 is fixed configurations in the top of the transport path of the lead frame of conveying unit 111, right
The camera shooting dress that the shape of the semiconductor element of the lead frame of conveying and the bonding lead from semiconductor element wiring is imaged
It sets.
In conducting wire inspection in camera 14, about each wire frame transported by conveying unit 111 semiconductor element with
And the shape of bonding lead, obtain the camera shooting information of static image.Camera shooting information, which is sent, is recorded aftermentioned monitoring terminal 8.
In the conducting wire inspection in camera 14, pass through the semiconductor element to the lead frame sent out from lead frame box
It is imaged with the shape of bonding lead, bonding lead can be obtained to the camera shooting information for static image whether there is or not deformation.
Here, being scheduled on setting conducting wire inspection camera 14 in material supply part 1 without one.But according to occurring
When the bad phenomenon of semi-finished product, by conveying unit 111 transport lead frame time point, be easy to confirm in bonding lead whether
It is problematic, conducting wire inspection camera 14 is set preferably in material supply part 1.
In addition, conveying unit camera 13 is installed to the position of conveying unit 111, is not limited by the range that camera images
It is fixed.As long as conveying unit is integrally movable with conveying unit 111 with camera 13, can be by the acquirement of the state of the lead frame of conveying
The camera shooting information of animation.Therefore, these contents can properly set change.In addition, quantity of the conveying unit with camera 13
It is also not necessarily limited to 1, can also be arranged according to the specification of conveying unit 111 multiple.
In addition, without by conveying unit camera 13, to all roads of the conveying lead frame in material supply part 1
Diameter is imaged.As long as being easy to generate the undesirable range of conveying for example, having, it is also possible to be not limited to the range, to conveying
The scheme that the state of lead frame is imaged.
(camera unit in loading machine)
As shown in Fig. 2, as the camera unit imaged to lead frame, being provided with 2 loadings in loading machine 2
Machine camera 21.
Loading machine camera 21 is the lower part for being set to loading machine 2, and monitoring lead frame is transported to pre- from rotating part 112
The state of thermal part 4 and the 1st punch components 71, the 2nd punch components 72 and the 3rd punch components are transported to from warming member 4
The photographic device of 73 each state.
In addition, 2 loading machines are corresponding with 2 lead frames that loading machine maintaining part is kept with camera 21, it is configured to 1
Camera images the appearance of the conveying of 1 lead frame.
In loading machine in camera 21, about 2 lead frames transported by loading machine 2, the camera shooting letter of animation is obtained
Breath.Camera shooting information, which is sent, is recorded aftermentioned monitoring terminal 8.
In addition, remaining in rotating part 112 for example, clamping to loading machine maintaining part in camera 21 in loading machine
The appearance of lead frame, conveying are held in the appearance of the lead frame of loading machine maintaining part, from loading machine maintaining part to preheating part
The appearance etc. that part 4 places lead frame is imaged.
In addition, clamping the lead frame for remaining in warming member 4 to loading machine maintaining part in camera 21 in loading machine
The appearance of frame, the appearance for making lead frame heat up from warming member 3 and deforming, from loading machine maintaining part to each resin seal mould
The appearance etc. of 710,720,730 placement lead frame of tool is imaged.In addition, at this time, the appearance of lead frame, bonding lead
Appearance also imaged.
By being imaged to them, using loading machine 2 transport when, can by the receiving of lead frame, handover when
The phenomenon that mistake, loading machine 2 and bonding lead contact etc. has the exception of a possibility that damage for leading to lead frame, bonding lead
The phenomenon that, it obtains as the camera shooting information of animation related with the lead frame.
In addition, using hacures shown in symbol 21a, illustrating the range imaged by loading machine camera 21 in Fig. 2
An example.
Here, loading machine camera 21 is installed to the position of loading machine 2, is not limited by the range that camera images
It is fixed.As long as loading machine is integrally movable with loading machine 2 with camera 21, the state of the lead frame of conveying can be obtained and be
The camera shooting information of picture.Therefore, these contents can properly set change.In addition, quantity of the loading machine with camera 21
2 are not limited to, the camera of 1 camera or setting 3 or more can also be set according to the specification of loading machine 2.
In addition, being taken the photograph without by loading machine camera 21 to all paths for transporting lead frame by loading machine 2
Picture.As long as being easy to generate the undesirable range of conveying for example, having, it is also possible to be defined in the range, to conveying lead frame
The scheme that state is imaged.
(camera unit in warming member)
As shown in Fig. 2, as the camera unit imaged to lead frame, being provided with 2 in advance in warming member 3
Thermal part camera 31.
Warming member camera 31 is mounted to warming member 3, and monitoring transports from loading machine 2 and by 3 liters of warming member
The photographic device of the state of the lead frame of temperature and heating and the state of the lead frame received by loading machine 2.
In addition, 2 warming members are corresponding with 2 lead frames that warming member 3 heats up with camera 31, it is configured to 1
Camera images the appearance of 1 lead frame.
In warming member in camera 31, about 2 lead frames that warming member 3 heats up, the camera shooting of animation is obtained
Information.Camera shooting information, which is sent, is recorded aftermentioned monitoring terminal.
In addition, in warming member in camera 31, for example, placing lead to from loading machine maintaining part to warming member 4
The appearance of frame, the clamping of loading machine maintaining part remain in appearance of lead frame of warming member 3 etc. and are imaged.In addition,
At this time, appearance, the appearance of bonding lead of lead frame also imaged.
It, can be by receiving between loading machine 2 and warming member 3, lead frame, handover by being imaged to them
When mistake, the lead frame and loading machine 2 that generate big crosswise concaving song etc. and deform the phenomenon that contacting etc. have cause lead frame,
The abnormal phenomenon of a possibility that damage of bonding lead, obtains as the camera shooting information of animation related with the lead frame.
In addition, using hacures shown in symbol 31a, illustrating the model imaged by warming member camera 31 in Fig. 2
The example enclosed.
Here, warming member camera 31 is installed to the position of warming member 3, is not had by the range that camera images
It limits.As long as the state of the lead frame to be heated up by warming member 3 can be obtained to the camera shooting information for animation.Therefore,
These contents can properly set change.It, can also be according in addition, warming member is also not limited to 2 with the quantity of camera 31
The camera of 1 camera or setting 3 or more is set according to the specification of warming member 3.
(camera unit in unloader)
As shown in Fig. 2, in unloader 4, as the camera unit imaged to the formed products after resin seal, setting
There is unloader camera 41.In addition, in unloader 4, as the die surface to mold for resin-molding 710,720,730
The camera unit imaged is provided with mold camera 42.
Unloader camera 41 is mounted to the lower part of unloader 2, monitoring formed products from mold for resin-molding 710,
720,730 be transported to mold gate components 5 state photographic device.
In addition, about the formed products transported by unloader 4, obtaining the camera shooting letter of animation in camera 41 in unloader
Breath.Camera shooting information, which is sent, is recorded aftermentioned monitoring terminal.
In addition, in unloader in camera 41, for example, taking out formed products maintaining part by mold for resin-molding 710
The appearance of the formed products of forming, conveying are held in the appearance of the formed products of formed products maintaining part, from formed products maintaining part to going to pour
The appearance etc. that mouthpiece 5 places formed products is imaged.In addition, the appearance of formed products at this time is also imaged.
By being imaged to them, using unloader 4 transport when, can by the taking-up of formed products, handover when mistake
Accidentally, the phenomenon that unloader 4 and resin formation part contact etc. has the abnormal phenomenon of a possibility that damage for leading to formed products, obtains
For the camera shooting information of animation related with the formed products.In addition it is possible to confirm the appearance of the formed products after resin seal, confirm
In resin seal, whether there is or not resin leakage etc. occurs.
Mold camera 42 is installed on the upper and lower of unloader 4, obtains after resin seal by the cleaner portion of unloader 4
The camera shooting information of the animation of the die surface of the mold for resin-molding 710,720,730 of cleaning.It images information and is sent record
To aftermentioned monitoring terminal.
In mold in camera 42, by the mold for resin-molding 710,720,730 cleaned by cleaner portion
Die surface is imaged, and can will obtain in die surface whether there is or not foreign matters such as adhesive dusts is camera shooting information.
In addition, using hacures shown in symbol 42a, illustrating the range imaged by mold camera 42 in Fig. 2
One example.
Here, being scheduled on setting mold camera 42 in unloader 4 without one.But as described above, according to by by
Whether there is or not the foreign matters such as adhesive dust to be taken the photograph in advance for the die surface for the mold for resin-molding 710,720,730 that cleaner portion cleans
When clamping the bad phenomenon for waiting semi-finished product of dust occurs in resin seal, is easy to determine the point of its reason, is preferably unloading for picture
Mold camera 42 is set in carrier aircraft 4.
In addition, mold camera 42 is installed to the position of unloader 4, is not limited by the range that camera images.
As long as the state of the die surface of mold for resin-molding 710,720,730 can be obtained to the camera shooting information for animation.
Therefore, these contents can properly set change.It, can also be according in addition, mold is also not necessarily limited to 1 with the quantity of camera 42
The specification setting of unloader 4 is multiple.
In addition, unloader camera 41 is installed to the position of unloader 4, is not limited by the range that camera images
It is fixed.As long as unloader is integrally movable with unloader 4 with camera 41, the state of the formed products of conveying can be obtained as animation
Camera shooting information with regard to abundant.Therefore, these contents can properly set change.In addition, quantity of the unloader with camera 41
It is not limited to 1, can also be arranged according to the specification of unloader 4 multiple.
In addition, being taken the photograph without by unloader camera 41 to all paths of the conveying formed products in unloader 4
Picture.As long as being easy to generate the undesirable range of conveying for example, having, it is also possible to be defined in the range, to the shape of conveying formed products
The scheme that state is imaged.
(removing the camera unit in mold gate components)
As shown in Fig. 2, as the camera unit imaged to formed products, being provided with mold gate components in loading machine 2
With camera 51.
Mold gate components camera 51 is gone to be mounted to mold gate components 5, monitoring is by going mold gate components 5 to transport formed products
State, the formed products that are transported from unloader 4 and be transferred to blank head 50 (before the removal of the unwanted part of resin)
State, by blank head 50 remove resin unwanted part semi-finished product state photographic device.
In removing mold gate components camera 51, about the formed products and semi-finished product by going mold gate components 5 to transport, obtain dynamic
The camera shooting information of picture.Camera shooting information, which is sent, is recorded aftermentioned monitoring terminal.
In addition, in removing mold gate components camera 51, for example, to formed products are joined from unloader 4 to blank head 5
Appearance, from the forming before and after the removal of the appearance of unwanted part of formed products removal resin, the unwanted part of resin
The appearance etc. of product is imaged.
It, can be by unloader 4 and when going between mold gate components 5, formed products handover by being imaged to them
Mistake, by going mold gate components 5 to transport formed products, semi-finished product when bad phenomenon etc. have the damage for leading to formed products, semi-finished product
The abnormal phenomenon of possibility, obtains the camera shooting information of the animation for the formed products, semi-finished product.
In addition, using hacures shown in symbol 51a, being illustrated by going mold gate components camera 51 to image in Fig. 2
One example of range.
Here, mold gate components camera 51 will be gone to be installed to the position of mold gate components 5, the range imaged by camera
Do not limit.As long as removing mold gate components camera 51 and going mold gate components 5 integrally movable, can by the formed products of conveying,
The camera shooting information that the state of semi-finished product obtains as animation.Therefore, these contents can properly set change.In addition, going to pour
Mouthpiece is also not necessarily limited to 1 with the quantity of camera 51, can also be multiple according to going the specification of mold gate components 5 to be arranged.
In addition, without by removing mold gate components camera 51, to by removing the conveying of mold gate components 5 formed products, semi-finished product
All paths are imaged.As long as being easy to generate the undesirable range of conveying for example, having, it is also possible to be defined in the range, it is right
Transport formed products, the scheme that the state of semi-finished product is imaged.
(camera unit in product storage member)
As shown in Fig. 2, as the camera unit imaged to semi-finished product, being provided with product in product storage member 6
Storage member camera 63.
Product storage member camera 63 is mounted to product storage member 6, and monitoring transports semi-finished product by pickup section 61
State, the state for the semi-finished product for being transported by pickup section 61 and being transferred to recycling box portion 62 photographic device.
In product storage member in camera 63, about the semi-finished product transported by pickup section 61, the camera shooting of animation is obtained
Information.Camera shooting information, which is sent, is recorded aftermentioned monitoring terminal.
In addition, in product storage member in camera 63, for example, to pickup section 61 from go mold gate components 5 receive half at
Appearance, appearance of semi-finished product of product etc. are imaged.
By being imaged to them, when can be by the handover for going between mold gate components 5 and pickup section 61, semi-finished product
Mistake, the bad phenomenon etc. when transporting semi-finished product by pickup section 61 have the abnormal of a possibility that damage for leading to semi-finished product to show
As obtaining the camera shooting information of the animation for the semi-finished product.In addition it is possible to confirm the appearance of semi-finished product, confirmation defective material, runner,
The residual situation of cast gate etc..
In addition, using hacures shown in symbol 63a, diagram is imaged by product storage member camera 63 in Fig. 2
Range an example.
Here, product storage member camera 63 is installed to the position of product storage member 6, by camera camera shooting
Range does not limit.It, can be by conveying as long as product storage member is integrally movable with product storage member 6 with camera 63
The camera shooting information that the state of semi-finished product obtains as animation.Therefore, these contents can properly set change.In addition, product
Storage member is also not necessarily limited to 1 with the quantity of camera 63, can also be arranged according to the specification of product storage member 6 multiple.
In addition, owning without by product storage member camera 63 to semi-finished product are transported by product storage member 6
Path is imaged.As long as being easy to generate the undesirable range of conveying for example, having, it is also possible to be defined in the range, to conveying
The scheme that the state of semi-finished product is imaged.
Here, being scheduled in resin sealing apparatus A without one, conveying unit camera 13, conducting wire inspection camera are set
14, loading machine camera 21, warming member camera 31, unloader camera 41, mold camera 42, remove cast gate
All cameras of component camera 51 and product storage member camera 63.For example, it can be only setting conveyings
Loading machine is only arranged in scheme that portion's camera 13 and loading machine with camera 21 and only image the conveying of lead frame
The conveying of lead frame and formed products before and after resin seal is taken the photograph with camera 21 and unloader with camera 41
The scheme of picture.That is, the type of the camera of setting can depending on the application, be properly selected.But the bonding before resin seal is led
Line, lead frame have be not sealed by resin and to the part that outside is exposed, compared to formed products, the semi-finished product after resin seal,
Due to the bad phenomenon of conveying, it is easy to generate damage, deformation, it is advantageous to transport by material supply part 1 or loading machine 2
In a part in the path of lead frame, camera unit is set.
In addition, in above-mentioned resin sealing apparatus A, the not set camera unit in punch components 7, but also consider in punching press
Camera unit is set in component, the appearance of resin seal is obtained into the camera shooting information for animation.
Next, illustrating the image capture method in resin sealing apparatus A.In addition, resin sealing apparatus described herein is taken the photograph
Image space method is an example using the image capture method of resin sealing apparatus of the invention.
Firstly, in material supply part 1, the conveying unit of conveying unit 111 is installed on camera 13 to by conveying unit 111
The lead frame of conveying is imaged.Conveying unit is with camera 13 with same speed on direction identical with the lead frame of conveying
While degree is mobile, lead frame is imaged.
By conveying unit camera 13, the animation of the fixation image as the state for being easy to confirm lead frame is obtained
Information.Can be in the animation information, capturing has phenomenon without exception when transporting using conveying unit 111.
In addition, the conducting wire of the top of the transport path of lead frame of the fixed configurations in conveyance member 111 is examined with photograph
Camera 14 images lead frame.Conducting wire inspection camera 14 starts before transporting, static about conveyance member 111
The lead frame of state, images static image.The semiconductor element in lead frame can be confirmed in the static image
The detailed shape of part and bonding lead.
In loading machine 2, it is installed on the loading machine of loading machine 2 and is kept and removed by lead frame maintaining part with 21 pairs of camera
The lead frame sent is imaged.Loading machine is with camera 21 with substantially in the lead frame substantially common direction with conveying
While identical speed is mobile, lead frame is imaged.
By loading machine camera 21, the animation of the fixation image as the state for being easy to confirm lead frame is obtained
Information.By loading machine camera 21, the animation information that can confirm lead frame heating and the state of deformation is obtained.It can
In the animation information, capturing has phenomenon without exception when transporting using loading machine 2.In addition it is possible to capture rotating part
112, the sample of receiving, the handover of the lead frame between warming member 3 and each punch components 71,72,73 and loading machine 2
Son.
In warming member 3, it is installed on the state that the warming member of warming member 3 heats up to lead frame with camera 31
It is imaged.In addition, in warming member camera 31, additionally it is possible to capture the receiving of the lead frame between loading machine 2, hand over
The appearance connect.
In unloader 4, be installed on the unloader of unloader 4 with camera 41 to by each mold for resin-molding 710,
720, it is imaged after 730 resin seals by the formed products that formed products maintaining part keeps and transports.Unloader camera 41
While mobile with same speed in the formed products substantially common direction with conveying, formed products are imaged.
By unloader camera 41, the animation letter of the fixation image as the state for being easy to confirm formed products is obtained
Breath.Can be in the animation information, capturing has phenomenon without exception when transporting using unloader 4.In addition it is possible to capture from
Appearance when each mold for resin-molding 710,720,730 takes out formed products removes lead between mold gate components 5 and unloader 4
The appearance of the handover of frame.
In addition, in unloader 4, be installed on the mold of unloader 4 with camera 42 to after resin seal by unloader 4
The die surface of mold for resin-molding 710,720,730 that cleans of cleaner portion imaged.It can be shone by mold
Camera 42, acquirement can confirm that whether there is or not the animation informations of the foreign matters such as adhesive dust in die surface.
In removing gate part 5, be installed on gate part 5 goes gate part camera 51 to by going gate part 5 to transport
Formed products are imaged.Go gate part camera 51 in the formed products substantially common direction with conveying with roughly the same
While speed is mobile, formed products are imaged.
Gate part camera 51 is removed by this, obtains the animation of the fixation image as the state for being easy to confirm formed products
Information.Can be in the animation information, capturing has phenomenon without exception when using going gate part 5 to transport.In addition it is possible to catch
Catch the appearance with blank head 50 from the unwanted part of formed products removal resin.
In product storage member 6, the product storage member camera 63 of product storage member 6 is installed on to by picking up
The semi-finished product that portion 61 transports are imaged.Product storage member is with camera 63 in the semi-finished product substantially common direction with conveying
On it is mobile with same speed while, semi-finished product are imaged.
By the product storage member camera 63, the fixation image as the state for being easy to confirm semi-finished product is obtained
Animation information.Can be in the animation information, capturing has phenomenon without exception when transporting using pickup section 61.In addition, can also
Enough capture the appearance that pickup section 61 receives semi-finished product.
It, can be to conveying lead frame, formed products and semi-finished product in resin sealing apparatus A by such as above content
Appearance imaged.
Next, explanation structure related with the processing of camera shooting information of above-mentioned each camera unit.
Resin sealing apparatus A, which has, handles the monitoring for imaging information with terminal 8 (referring to Fig. 3).Monitoring terminal 8 is configured to
It can be transmitted and received between each camera for being set to resin sealing apparatus A via based on wired or wireless communication
Information (referring to Fig. 3).
In addition, monitoring terminal 8 has camera shooting information processing record portion 81.Information processing record portion 81 is imaged according to imparting
To the identification information of 1 lead frame, the multiple camera shooting information that will be imaged by each camera, merging is recorded as and specifically identifies
The camera shooting information that information is mapped.That is, it can be recorded about all lead frames by resin sealing apparatus resin seal
Each 1 intrinsic camera shooting information, also, the camera shooting information is managed as 1 data.
In addition, as long as the identification information of lead frame as used herein can be identified by resin sealing apparatus resin seal
Each wire frame (formed products and semi-finished product), then its setting method is not particularly limited.For example, can combine or individually
The number of sequence etc. that the manufacturing batch number of setting lead frame, component names, expression are sent out from lead frame box.In addition,
If the information can also be utilized to lead frame itself additional identification information (Code Number).These identification informations are remembered
Record camera shooting information processing record portion 81.
In addition, the camera shooting information for being recorded in camera shooting information processing record portion 81 is deleted after becoming during keeping certain
Structure.With this configuration, be recorded in camera shooting information processing record portion 81 information capacity be easy to ensure it is a certain amount of hereinafter, energy
Enough easily management camera shooting information.It can be suitable according to the timing of the quality of semi-finished product checked during deleting camera shooting information
Preferably set.
In addition, monitoring terminal 8 has camera unit control unit 82 (referring to Fig. 3).Camera unit control unit 82 is adjustment
The part of the imaging conditions of each camera.For example, operator can set taking the photograph for each camera via camera unit control unit 82
As conditions such as range, the timing of camera shooting, camera time etc..
In addition, monitoring terminal 8 has abnormality determination unit 83 (referring to Fig. 3).Abnormality determination unit 83 compares lead frame etc.
The image data of normal appearance and the camera shooting information of each camera camera shooting, determine in the lead frame for being shown in camera shooting information
In have it is without exception.
For example, according to the image data of the formed products with normal appearance in image pickup scope, about being considered as normal
Appearance formed products shape position coordinates, setting is minimum and maximum range and is set as reference range.Then, it uses
Unloader is imaged with appearance of the camera 41 to the formed products after resin seal, compare from be shown in the camera shooting information at
The information of the position coordinates of the information and reference range for the position coordinates that the image data of shape product obtains is being more than reference range
In the case where, it is determined as exception.If carrying out the judgement in the conveying of formed products, can according to abnormal judgement as a result,
Stop resin sealing apparatus A, carries out the confirmation operation of device immediately.
In addition, camera shooting information processing record portion 81 will be stopped by being provided with when resin sealing apparatus A stops to detect to become
The camera shooting information such as lead frame of component processing of the abnormal sensor mechanism of only the reason of, camera shooting letter when being recorded as stopping
Breath.
The stopping of resin sealing apparatus A refers to, for example, the lead frame as sensor mechanism detects loading machine 2 is kept
Portion's clamping lead frame and the state damaged, and the state that resin sealing apparatus A stops.With this configuration, operator can be true
Information is imaged when recognizing stopping, carrying out the determination and correspondence of reason immediately.
Here, become setting monitoring terminal 8 without certain, and can between each camera sent-received message
Structure.Server is sent by the camera shooting information of each camera for example, it is also possible to become, camera shooting letter can be carried out on the server
The record of breath, processing structure.
Next, in application resin sealing apparatus of the invention, additionally it is possible to use the 2nd embodiment as shown below.
It is that setting is taken the photograph with the difference of the resin sealing apparatus A in the resin sealing apparatus B as the 2nd embodiment
As the construction of unit.In addition, in resin sealing apparatus B, about lead frame feedway 11, resinous flat feedway
12, cut-out portion 110, conveying unit 111, rotating part 112, the 1st punch components 71 have structure identical with component shown in FIG. 1,
So being indicated with common symbol, detail explanation is omitted.
As shown in figure 4, in the material supply part 1B of resin sealing apparatus B, as what is imaged to lead frame
Camera unit is provided with conveying unit camera 13B.Conveying unit is fixed in camera 13B and can be moved along orbit portion 130
Dynamic moving body 130B.In addition, moving body 130B is in material supply part 1B, with can be according to the direction of conveying lead frame
The mobile mode with speed controls its activity.
Conveying unit with camera 13B by being moved together with moving body 130B according to the movement of conveying unit 111, can
Monitoring from the lead frame that lead frame box is sent out until be transported to the state of rotating part 112 by cut-out portion 110.In addition,
In Fig. 4, the mobile direction conveying unit camera 13B is indicated by the arrow Y.
As shown in figure 4, in the loading machine 2B of resin sealing apparatus B, as the camera shooting list imaged to lead frame
Member is provided with loading machine camera 21B.Loading machine is fixed in the shifting that can be moved along orbit portion 210 with camera 21B
Kinetoplast 210B.In addition, moving body 210B is in loading machine 2B, with can be mobile according to the direction of conveying lead frame and speed
Mode controls its activity.In addition, the lead frame maintaining part and resinous flat maintaining part in loading machine 2B become and above-mentioned dress
The same structure of carrier aircraft 2.
Loading machine with camera 21B by being moved together with moving body 210B according to the movement of loading machine 2B, can
The state that monitoring is transported by loading machine maintaining part holding lead frame.In addition, loading machine photograph is indicated by the arrow X in Fig. 4
Camera 21B mobile direction.
As previously discussed, it in application resin sealing apparatus of the invention, is set with to the conveying machine of conveying lead frame
The structure for setting photographic device is different, additionally it is possible to the moving body that setting independently drives, and photographic device is set to the moving body, and it is right
The state of the conveying of lead frame is imaged.In addition, in resin sealing apparatus B, with material supply part 1B and loading machine
2B is illustrated for example, but can also use in warming member, unloader, remove mold gate components and product storage member
In, the moving body independently driven is similarly set, the scheme imaged to formed products, semi-finished product.
Next, illustrating the image capture method in resin sealing apparatus B.In addition, resin sealing apparatus described herein is taken the photograph
Image space method is an example using the image capture method of resin sealing apparatus of the invention.
Firstly, being set to can move along what orbit portion 130 moved in the longitudinal direction in material supply part 1
The conveying unit of body 130B images the lead frame transported by conveying unit 111 with camera 13B.Conveying unit camera
13B is integrally formed with moving body 130B, is moved in the lead frame substantially common direction with conveying with same speed
While dynamic, lead frame is imaged.
By conveying unit camera 13B, the dynamic of the fixation image as the state for being easy to confirm lead frame is obtained
Draw information.Can be in the animation information, capturing has phenomenon without exception when transporting using conveying unit 111.
In loading machine 2B, being set to can be along the dress for the moving body 210B that orbit portion 210 moves in the lateral direction
Carrier aircraft images the lead frame transported by loading machine 2B with camera 21B.Loading machine camera 21B and moving body
210B is integrally formed, right while mobile with same speed in the lead frame substantially common direction with conveying
Lead frame is imaged.
By loading machine camera 21B, the dynamic of the fixation image as the state for being easy to confirm lead frame is obtained
Draw information.Can be in the animation information, capturing has phenomenon without exception when transporting using loading machine 2B.In addition it is possible to
Capture rotating part 112, warming member (being omitted in Fig. 4) and each punch components 71,72,73 (in Fig. 4 punch components 72,
73 omit) and loading machine 2B between lead frame receiving, handover appearance.
By such as above content, the appearance that lead frame is transported in resin sealing apparatus B can be imaged.
Hereinafter, illustrating referring to Fig. 5 until applying the camera shooting of substrate in resin sealing apparatus of the invention etc. and checking work
The process of the completion of sequence.
(step S1)
By being set to the camera of each component of resin sealing apparatus A, resin sealing apparatus A is to lead frame, forming
Product and semi-finished product are imaged.
(step S2)
The detections such as resin sealing apparatus A sensor mechanism are abnormal, are transferred to step S3 if stopping movement.Resin is close
If seal apparatus A does not detect exception, it is transferred to step S4.
(step S3)
Portion about the abnormal sensor mechanism for being provided with the reason of detecting the stopping as resin sealing apparatus A
Camera shooting letter is recorded in the camera shooting information (information is imaged when stopping) for being installed on the camera of the component by part, resin sealing apparatus A
Breath processing record portion 81.
Operator, which confirms, images information when stopping, and observes the running-active status etc. of component, parses abnormal reason.If problem
It is corrected, then resin sealing apparatus A makes that processing returns to between step S1 and step S2.
(step S4)
(such as the resin seal of the manufacture batch of 1 lead frame is completed using the resin seal of resin sealing apparatus A
Completion) after, resin sealing apparatus A believes the camera shooting imaged by each camera according to the identification information for being given to lead frame
Breath merges into 1 data, and camera shooting information processing record portion 81 is recorded.
(step S5)
The quality of resin sealing apparatus A inspection semi-finished product.If there is bad phenomenon in semi-finished product, it is transferred to step
S6.If the process monitored is completed without bad phenomenon in semi-finished product.
(step S6)
About the semi-finished product with bad phenomenon, operator's confirmation merges the camera shooting information of record according to identification information.Root
According to the content of camera shooting information, the component for generating abnormal reason is determined.
The running-active status etc. for observing component, parses abnormal reason.If problem is corrected, resin sealing apparatus A knot
The process of beam monitoring.
By above process, it is able to carry out the prison of lead frame in resin sealing apparatus A, formed products and semi-finished product
Depending on.In resin sealing apparatus A, by being the camera shooting information of animation by the state recording for handling lead frame etc. by each component,
When the bad phenomenon of semi-finished product can occur in the process of inspection below, according to camera shooting information, it is different to be easy to carry out determination
The operation of normal reason.
As previously discussed, in the image capture method in resin sealing apparatus according to the present invention, in resin sealing apparatus
Production process in, when the bad phenomenon of product occurs, it is possible to easily determine its reason.
In addition, in the production process of resin sealing apparatus, product is occurring for resin sealing apparatus according to the present invention
Bad phenomenon when, it is possible to easily determine its reason.
Claims (12)
1. the image capture method in a kind of resin sealing apparatus, which has: material supply part, will be equipped with half
The substrate of conductor element is transported to predetermined position；And loading machine, the substrate transported by the material supply part is transported
To the resin seal component for carrying out resin seal to the substrate, wherein
Have the transport path in the substrate using the material supply part and the substrate using the loading machine
Transport path at least part in, to movable with the substrate substantially common direction and with same speed
The process that the substrate is imaged simultaneously.
2. the image capture method in resin sealing apparatus according to claim 1, wherein have and supplied using the material
It is right at least part of the transport path of the substrate of the transport path and utilization loading machine of the substrate of component
The process that the static state of the substrate is imaged.
3. the image capture method in resin sealing apparatus according to claim 1 or 2, wherein have in conveying by described
Resin seal component to the substrate carry out resin seal formed products transport path at least part in, to it is described
Formed products substantially common direction and process to be imaged while same speed activity to the formed products.
4. the according to claim 1, image capture method in resin sealing apparatus described in 2 or 3, wherein utilizing the material
The respective transport path of transport path of the transport path of the substrate of supply part and the substrate using the loading machine
In, which is imaged.
5. a kind of resin sealing apparatus, has:
Material supply part transports the substrate equipped with semiconductor element to predetermined position；And
Loading machine transports the substrate transported by the material supply part close to the resin for carrying out resin seal to the substrate
Component is sealed,
Wherein, comprising:
Substrate camera unit is installed on at least one party of the material supply part and the loading machine, to the substrate into
Row camera shooting.
6. a kind of resin sealing apparatus, has:
Material supply part transports the substrate equipped with semiconductor element to predetermined position；And
Loading machine transports the substrate transported by the material supply part close to the resin for carrying out resin seal to the substrate
Component is sealed,
Wherein, the resin sealing apparatus includes
It being capable of the transport path along the substrate using the material supply part and the substrate using the loading machine
Transport path at least part, with transport the substrate active synchronization while to the substrate substantially common direction
Mobile mobile unit；And
Substrate camera unit is installed on the mobile unit, images to the substrate.
7. according to resin sealing apparatus described in claim 5 or 6, wherein
Have and the substrate heated, and the loading machine receives the warming member of the substrate being heated,
With the pre- hot substrate camera unit imaged to the substrate of heating.
8. resin sealing apparatus according to claim 5, wherein have:
Unloader receives and transports to carry out resin seal to the substrate by the resin seal component from the resin seal component
Formed products；
Mold gate components are removed, joins the formed products from the unloader, removes the unwanted resin portion of the formed products and remove
Send the formed products；And
Product storage member goes mold gate components to join and transports the formed products from this,
With the unloader, described at least one for removing mold gate components and the product storage member is installed on, to the forming
The formed products camera unit that product are imaged.
9. resin sealing apparatus according to claim 6, wherein have:
Unloader receives and transports to carry out resin seal to the substrate by the resin seal component from the resin seal component
Formed products；
Mold gate components are removed, joins the formed products from the unloader, removes the unwanted resin portion of the formed products and remove
Send the formed products；And
Product storage member goes mold gate components to join and transports the formed products from this,
It includes
Can along the formed products using the unloader transport path, utilize described formed products for removing mold gate components
Transport path and using the product storage member the formed products transport path at least part, with described in conveying
To the mobile unit mobile with the formed products substantially common direction while active synchronization of formed products；And
Formed products camera unit is installed on the mobile unit, images to the formed products.
10. according to resin sealing apparatus described in claim 8 or 9, wherein
The identification information that can identify the substrate is assigned to the substrate,
Has camera shooting information processing record portion, which will carry out the substrate or the formed products
The camera shooting information for imaging and generating is mapped with the identification information, and in the case where the camera shooting information has multiple,
Merge the camera shooting information that record associates with the common identification information.
11. according to resin sealing apparatus described in claim 8,9 or 10, wherein
Have a camera shooting information judegment part, the camera shooting information judegment part be recorded as on the basis of reference information, and will be to the base
Material perhaps the formed products imaged and the camera shooting information that generates be compared with the reference information differentiate the substrate or
Difference in the appearance of the formed products.
12. according to resin sealing apparatus described in claim 8,9,10 or 11, wherein
The resin seal component has the mold for resin-molding clamped the substrate with land area and carry out resin seal,
The unloader includes
Cleaner portion cleans the land area after carrying out resin seal to the substrate；And
Mold camera unit, the land area after cleaning to the cleaner portion image.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-198789 | 2017-10-12 | ||
| JP2017198789A JP6425054B1 (en) | 2017-10-12 | 2017-10-12 | Imaging method and resin sealing apparatus in resin sealing apparatus |
| PCT/JP2018/024876 WO2019073642A1 (en) | 2017-10-12 | 2018-06-29 | Resin sealing device imaging method and resin sealing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110234484A true CN110234484A (en) | 2019-09-13 |
| CN110234484B CN110234484B (en) | 2021-06-01 |
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ID=64379156
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880009373.1A Active CN110234484B (en) | 2017-10-12 | 2018-06-29 | Imaging method in resin sealing device and resin sealing device |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP6425054B1 (en) |
| KR (1) | KR102169193B1 (en) |
| CN (1) | CN110234484B (en) |
| MY (1) | MY184057A (en) |
| TW (1) | TWI671830B (en) |
| WO (1) | WO2019073642A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114378984A (en) * | 2020-10-20 | 2022-04-22 | 山田尖端科技株式会社 | Resin sealing device |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7441511B2 (en) * | 2020-09-02 | 2024-03-01 | アピックヤマダ株式会社 | Resin sealing device and its cleaning method |
| JP7189633B2 (en) * | 2021-01-12 | 2022-12-14 | 株式会社コジマプラスチックス | Mold management system |
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| JP2008118013A (en) * | 2006-11-07 | 2008-05-22 | Apic Yamada Corp | Resin sealed device |
| CN103534582A (en) * | 2011-05-10 | 2014-01-22 | 旭硝子株式会社 | Method for inspecting minute defect of translucent board-like body, and apparatus for inspecting minute defect of translucent board-like body |
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| JP3669775B2 (en) * | 1996-07-18 | 2005-07-13 | 沖電気工業株式会社 | Foreign matter inspection apparatus and foreign matter inspection method |
| JP3699801B2 (en) * | 1997-04-24 | 2005-09-28 | アピックヤマダ株式会社 | Semiconductor manufacturing parts supply mechanism |
| JP4398768B2 (en) * | 2004-03-31 | 2010-01-13 | 第一精工株式会社 | Semiconductor resin sealing device and resin sealing method |
| JP2009105257A (en) * | 2007-10-24 | 2009-05-14 | Sumitomo Heavy Ind Ltd | Resin sealing device |
| JP5320241B2 (en) * | 2009-09-28 | 2013-10-23 | 住友重機械工業株式会社 | Sealing apparatus and sealing method |
| JP2016168732A (en) * | 2015-03-12 | 2016-09-23 | ファナック株式会社 | Injection molding system for performing mold cleaning |
| JP6754562B2 (en) | 2015-11-13 | 2020-09-16 | アピックヤマダ株式会社 | Mold molds, mold equipment, and production support systems |
-
2017
- 2017-10-12 JP JP2017198789A patent/JP6425054B1/en active Active
-
2018
- 2018-06-29 KR KR1020197015176A patent/KR102169193B1/en active IP Right Grant
- 2018-06-29 CN CN201880009373.1A patent/CN110234484B/en active Active
- 2018-06-29 WO PCT/JP2018/024876 patent/WO2019073642A1/en active Application Filing
- 2018-06-29 MY MYPI2019005226A patent/MY184057A/en unknown
- 2018-07-12 TW TW107124004A patent/TWI671830B/en active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008118013A (en) * | 2006-11-07 | 2008-05-22 | Apic Yamada Corp | Resin sealed device |
| CN103534582A (en) * | 2011-05-10 | 2014-01-22 | 旭硝子株式会社 | Method for inspecting minute defect of translucent board-like body, and apparatus for inspecting minute defect of translucent board-like body |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114378984A (en) * | 2020-10-20 | 2022-04-22 | 山田尖端科技株式会社 | Resin sealing device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110234484B (en) | 2021-06-01 |
| TWI671830B (en) | 2019-09-11 |
| JP6425054B1 (en) | 2018-11-21 |
| MY184057A (en) | 2021-03-17 |
| KR20190073496A (en) | 2019-06-26 |
| JP2019072866A (en) | 2019-05-16 |
| WO2019073642A1 (en) | 2019-04-18 |
| KR102169193B1 (en) | 2020-10-22 |
| TW201916185A (en) | 2019-04-16 |
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